Preparation method of packaged lamp bead, packaged lamp bead and display module

Abstract

The invention relates to the technical field of light-emitting chip packaging, in particular to a preparation method of a packaged lamp bead, the packaged lamp bead and a display module, and the preparation method of the packaged lamp bead comprises the following steps: providing a reflector plate, a color changing plate and a flip chip, cutting the reflector plate to form array cup holes, and attaching the array cup holes to the color changing plate; the flip chip comprises a substrate and an LED chip arranged on the substrate in an inverted mode. According to the array cup holes, alignment cutting is carried out on the color changing sheet pasted with the cut reflection sheet, and a plurality of light-blocking color changing structures are obtained; each light blocking and color changing structure is provided with a cup hole; and attaching the light-blocking and color-changing structure to the LED chip, so that the cup hole is buckled with the LED chip to obtain the packaged lamp bead. The packaging cost of the white light LED is broken through downwards under the existing condition, so that the packaging cost of the white light LED is lower.

Description

[Technical field]

[0001] The present invention relates to the technical field of light-emitting chip packaging, and in particular to a method for preparing a packaged lamp bead, a packaged lamp bead and a display module. [Background technology]

[0002] As the application scope of display electronic devices becomes wider and wider, people's requirements for display electronic devices are also getting higher and higher, which also promotes the continuous improvement of LED technology in terms of brightness, color uniformity and visual effects.

[0003] There are currently two types of white light LED packaging technologies: one is the traditional SMD (Surface Mounted Devices) packaging technology, which is to first package the LED chip into a lamp bead and then weld the lamp bead to the substrate. The other is COB (Chip on Board) packaging technology. COB packaging is to directly integrate multiple blue light LED chips on a substrate, and realize the conversion of blue light to white light by packaging the fluorescent layer and quantum dot layer on the blue light LED chip. This packaging method does not weld the packaged lamp beads one by one on the substrate. Compared with SMD packaging, COB packaging is more suitable for high-density assembly. Therefore, COB technology requires a higher level of process and equipment, and strict requirements for production process control, which also leads to higher costs for COB packaging. Although the SMD packaging industry is mature, with the wider application of display electronic equipment, the cost of SMD packaging also needs to be further broken down under existing conditions.

[0004] Therefore, it is necessary to provide a packaging method for LED chips with lower cost to solve the above problems. [Summary of the invention]

[0005] In order to solve the problem that the packaging cost of the existing LED packaging method cannot be reduced under the current conditions, the present invention provides a method for preparing a packaged lamp bead, a packaged lamp bead and a display module.

[0006] The solution to the technical problem of the present invention is to provide a method for preparing a packaged lamp bead, comprising the following steps:

[0007] A reflector, a color-changing sheet and a flip chip are provided, and the reflector is cut into array cup holes and attached to the color-changing sheet; the flip chip comprises a substrate and an LED chip flipped on the substrate;

[0008] The color-changing sheet to which the cut reflective sheet is attached is aligned and cut according to the array cup holes to obtain a plurality of light-blocking and color-changing structures; each of the light-blocking and color-changing structures has a cup hole;

[0009] The light-blocking and color-changing structure is attached to the LED chip, and the cup hole is buckled with the LED chip to obtain a packaged lamp bead.

[0010] Preferably, the color-changing film is a fluorescent film or a quantum dot film.

[0011] Preferably, the fluorescent film is a single-layer fluorescent dispersion layer or a three-layer sandwich structure in which the fluorescent dispersion layer is sandwiched between two layers of first protective films; the quantum dot film is a three-layer sandwich structure in which the quantum dot dispersion layer is sandwiched between two layers of second protective films or a three-layer groove structure filled in the groove between two layers of second protective films.

[0012] Preferably, a reflective sheet, a color-changing sheet and a flip chip are provided, and the reflective sheet is cut into array cup holes and attached to the color-changing sheet, specifically comprising:

[0013] Providing the reflective sheet, the color-changing sheet and the flip chip; the reflective sheet is provided with a first adhesive;

[0014] Cutting the reflective sheet according to the LED chip parameters of the flip chip to obtain a cut reflective sheet with array cup holes; the parameters of the cup holes in the array cup holes correspond to the LED chip parameters of the flip chip;

[0015] The cut reflective sheet is directly attached to the color-changing sheet by means of a first adhesive.

[0016] Preferably, the light-blocking and color-changing structure is attached to the LED chip so that the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes:

[0017] Applying packaging glue on the LED chip;

[0018] Aligning the cup hole on the light-blocking and color-changing structure with the LED chip;

[0019] The aligned cup hole is buckled with the LED chip, so that the packaging glue fills the packaging space formed between the cup hole and the LED chip, and the reflective layer in the light-blocking and color-changing structure is attached to the periphery of the LED chip through the packaging glue to obtain a packaged lamp bead.

[0020] Preferably, the light-blocking and color-changing structure is attached to the LED chip so that the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes:

[0021] Applying packaging glue on the LED chip to form a glue layer;

[0022] Apply a second adhesive glue on the periphery of the adhesive layer;

[0023] The cup hole aligned with the LED chip is buckled onto the LED chip with the adhesive layer formed thereon, so that the reflective layer in the light-blocking and color-changing structure is attached to the periphery of the LED chip through the second adhesive to obtain a packaged lamp bead.

[0024] Preferably, before attaching the light-blocking color-changing structure to the LED chip so that the cup hole fits the LED chip and obtaining the packaged lamp bead, the method further comprises:

[0025] Performing spectral processing on the plurality of light-blocking and color-changing structures to obtain spectral results corresponding to the plurality of light-blocking and color-changing structures;

[0026] According to the spectroscopic result and after binning the multiple light-blocking color-changing structures and the corresponding multiple LED chips, a classification result is obtained.

[0027] In order to solve the above technical problems, the present invention further provides a packaged lamp bead, comprising a flip chip, a packaging glue layer and a light blocking and color-changing structure, wherein the flip chip comprises a substrate and an LED chip flipped on the substrate;

[0028] The light-blocking and color-changing structure includes a reflective layer and a color-changing layer, a cup hole is opened on the reflective layer, a side of the reflective layer facing away from the color-changing layer is attached to a side of the substrate on which the LED chip is arranged, and the color-changing layer is arranged on a side of the reflective layer facing away from the substrate and covers the cup hole; the LED chip is located in the cup hole, and the encapsulation glue layer is arranged on the LED chip.

[0029] Preferably, the light-blocking and color-changing structure in the packaged lamp bead is in a bracket shape.

[0030] In order to solve the above technical problems, the present invention further provides a display module, comprising the packaged lamp beads as described in any one of the above items.

[0031] Compared with the prior art, the method for preparing encapsulated lamp beads, encapsulated lamp beads and display module provided by the present invention have the following advantages:

[0032] 1. The preparation method of the packaged lamp bead provided by the embodiment of the present invention comprises the following steps: providing a reflector, a color-changing sheet and a flip chip, cutting an array of cup holes from the reflector and attaching it to the color-changing sheet; the flip chip comprises a substrate and an LED chip flipped on the substrate; the color-changing sheet with the cut reflector attached thereto is aligned and cut according to the array of cup holes to obtain a plurality of light-blocking and color-changing structures; each light-blocking and color-changing structure has a cup hole; the light-blocking and color-changing structure is attached to the LED chip so that the cup hole is buckled with the LED chip to obtain the packaged lamp bead. By cutting the array of cup holes from the reflector, each cup hole in the array of cup holes can correspond to one LED chip, so after the color-changing sheet with the cut reflector attached thereto is aligned and cut, a light-blocking and color-changing structure corresponding to each LED chip can be cut, that is, one light-blocking and color-changing structure corresponds to one LED chip, so that when the light-blocking and color-changing structure is attached to the LED chip, the cup hole in a single light-blocking and color-changing structure can be buckled with the LED chip to obtain the packaged lamp bead. Therefore, compared with the existing COB+QD packaging, the packaged lamp beads obtained in this embodiment can directly change color without the need to use large-area quantum dot films / fluorescent films for color change, thereby saving the cost of large-area quantum dot films / fluorescent films; in addition, the packaging of a single packaged lamp bead is simpler, and the technical requirements for packaging are lower than those for COB packaging; and compared with traditional SMD packaging, the reflective sheet made of low-cost reflective paper, silicone sheets and other light-blocking and high-reflectivity materials directly replaces the complex bracket that needs injection molding and electroplating in the SMD packaging, thereby saving the SMD packaging cost and the bracket cost, and thus achieving a downward breakthrough in the packaging cost of white light LEDs under existing conditions, achieving a lower packaging cost for white light LEDs.

[0033] 2. The color-changing sheet provided in the embodiment of the present invention is a fluorescent film or a quantum dot film, that is, in this embodiment, a fluorescent film or a quantum dot film can be used as a color-changing sheet to complete the color change of the obtained packaged lamp beads. Therefore, compared with the existing COB+QD packaged white light solution, the packaged lamp bead module in this embodiment does not require quantum dots / fluorescent films for color change, saving the cost of quantum dot films / fluorescent films with a larger area, and further reducing costs.

[0034] 3. In the embodiment of the present invention, a reflector, a color-changing sheet and a flip chip are provided, and an array of cup holes is cut out of the reflector and attached to the color-changing sheet. Specifically, the reflector, a color-changing sheet and a flip chip are provided; a first adhesive is provided on the reflector; the reflector is cut according to the LED chip parameters of the flip chip to obtain a reflector with an array of cup holes after cutting; the parameters of the cup holes in the array of cup holes correspond to the LED chip parameters of the flip chip; the cut reflector is directly attached to the color-changing sheet through the first adhesive. By directly using a reflector with the first adhesive, the step of coating the first adhesive on the reflector or the color-changing sheet is omitted, which makes it easier for the reflector to be directly attached to the color-changing sheet; and the cutting parameters of the reflector are determined according to the actual LED chip parameters, so that the parameters of the cup holes after cutting can directly correspond to the LED chip parameters, so as to be more in line with the specifications of the actual chip, so that the parameters of the produced packaged lamp beads can be more accurate and more in line with the requirements.

[0035] 4. In the embodiment of the present invention, the light-blocking color-changing structure is attached to the LED chip, so that the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes: applying packaging glue on the LED chip; aligning the cup hole on the light-blocking color-changing structure with the LED chip; buckling the aligned cup hole with the LED chip, so that the packaging glue fills the packaging space formed between the cup hole and the LED chip, and the reflective layer in the light-blocking color-changing structure is attached to the periphery of the LED chip through the packaging glue to obtain a packaged lamp bead. By applying packaging glue on the LED chip, it can be avoided that when the packaging glue is first applied to the cup hole, the packaging glue flows out due to the alignment of the cup hole and the chip, which affects the packaging of the chip; so that when the cup hole is buckled with the LED chip, the packaging glue can fill the packaging space formed between the cup hole and the LED chip and the substrate, and at the same time, part of the packaging glue overflows from the packaging space, so that the reflective layer is attached to the substrate through the overflowed part of the packaging glue, thereby realizing a fixed light-blocking color-changing structure. This avoids the need to apply adhesive between the reflective layer and the substrate in the light-blocking and color-changing structure, simplifies the packaging steps, and facilitates direct molding of the production of a single packaged lamp bead.

[0036] 5. In the embodiment of the present invention, the light-blocking color-changing structure is attached to the LED chip, and the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes: applying packaging glue on the LED chip to form a glue layer; applying a second adhesive glue on the periphery of the glue layer; and buckling the cup hole aligned with the LED chip on the LED chip with the glue layer, so that the reflective layer in the light-blocking color-changing structure is attached to the periphery of the LED chip through the second adhesive glue to obtain a packaged lamp bead. By applying packaging glue on the LED chip to form a glue layer before the cup hole is buckled with the LED chip, the packaging glue can first form a glue layer on the LED chip to protect the LED chip and increase the brightness, avoiding the problem that the unformed glue liquid first applied on the LED chip flows in the closed space formed between the reflective layer and the color-changing layer in the light-blocking color-changing structure and the substrate after the light-blocking color-changing structure is buckled with the LED chip, resulting in bubbles and voids, which affects the luminous effect of the packaged lamp bead.

[0037] 6. In the embodiment of the present invention, the light-blocking color-changing structure is attached to the LED chip so that the cup hole engages with the LED chip to obtain the packaged lamp bead. The method also includes: performing spectroscopic processing on the multiple light-blocking color-changing structures to obtain spectroscopic results corresponding to the multiple light-blocking color-changing structures; and obtaining a classification result after binning the multiple light-blocking color-changing structures and the corresponding multiple LED chips according to the spectroscopic results. By cutting the color-changing sheet with the reflective sheet attached, individual light-blocking color-changing structures can be obtained. Compared with the existing COB+QD packaging solution, individual light-blocking color-changing structures can realize the spectral processing of multiple light-blocking color-changing structures, so that the light-blocking color-changing structures and multiple LED chips on the substrate can be binned according to the spectral results, and the light-blocking color-changing structures that can achieve different luminous effects are adopted in different bin areas on multiple LED chips; thereby, the matching between different bin areas on multiple LED chips and the light-blocking color-changing structures is achieved to ensure that the expected luminous effect can be achieved, so that the color difference of each lamp on the finished module formed by multiple packaged lamp beads can be guaranteed, thereby solving the problem of serious color difference of lamp beads after different COB packages in the existing COB fluorescent glue dispensing solution due to poor uniformity of fluorescent powder dispersion in the dispensing process and the influence of time and glue viscosity.

[0038] 7. The present invention also provides a packaged lamp bead, which has the same beneficial effects as the manufacturing method of the above-mentioned packaged lamp bead, and will not be described in detail here.

[0039] 8. The present invention also provides a display module having the same beneficial effects as the above-mentioned packaged lamp beads, which will not be described in detail here.

Brief Description of the Drawings

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0041] Figure 1 It is a flow chart of the steps of the method for preparing packaged lamp beads provided in the first embodiment of the present invention.

[0042] Figure 2 It is a schematic diagram of the three-layer sandwich structure of the fluorescent film provided in the method for preparing the packaged lamp bead provided in the first embodiment of the present invention.

[0043] Figure 3 It is a schematic diagram of the single-layer structure of the fluorescent film provided in the method for preparing the packaged lamp bead provided in the first embodiment of the present invention.

[0044] Figure 4 It is a schematic diagram of the three-layer sandwich structure of the quantum dot film provided in the method for preparing the packaged lamp beads provided in the first embodiment of the present invention.

[0045] Figure 5 It is a schematic diagram of the three-layer groove structure of the quantum dot film provided in the method for preparing the packaged lamp beads provided in the first embodiment of the present invention.

[0046] Figure 6 It is a specific step flow chart of step S10 of the method for preparing packaged lamp beads provided in the first embodiment of the present invention.

[0047] Figure 7 It is a schematic diagram of a reflective sheet after cutting in the method for preparing packaged lamp beads provided in the first embodiment of the present invention.

[0048] Figure 8 It is a top view of the light-blocking and color-changing structure of the method for preparing packaged lamp beads provided in the first embodiment of the present invention.

[0049] Fig. 9 It is a cross-sectional view of the light-blocking and color-changing structure of the method for preparing a packaged lamp bead provided in the first embodiment of the present invention.

[0050] Fig.10 4 is a flowchart of the specific steps of step S30 of the method for preparing a packaged lamp bead provided in the first embodiment of the present invention.

[0051] Fig.11 It is a cross-sectional view of a packaged lamp bead provided in the second embodiment of the present invention.

[0052] Fig.12 It is a cross-sectional view of a packaged lamp bead provided in the third embodiment of the present invention.

[0053] Fig.13 is a block diagram of a display module provided by a fourth embodiment of the present invention.

[0054] Description of the accompanying drawings:

[0055] 1. Encapsulate lamp beads; 2. Display module;

[0056] 11. Flip chip; 12. Reflector; 14. Light blocking and color changing structure; 15. Second adhesive; 16. Packaging glue; 17. Packaging space;

[0057] 111, substrate; 112, LED chip; 121, cup hole; 131, fluorescent film; 132, quantum dot film; 141, reflective layer; 142, color transfer layer; 143, first adhesive; 161, adhesive layer;

[0058] 1311, single-layer fluorescent dispersion layer; 1312, first protective film; 1321, quantum dot dispersion layer; 1322, second protective film. [Specific implementation method]

[0059] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and implementation examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0060] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0061] See also Figure 1 The first embodiment of the present invention provides a method for preparing a packaged lamp bead 1, comprising the following steps:

[0062] S10: providing a reflective sheet 12, a color-changing sheet and a flip chip 11, cutting an array of cup holes from the reflective sheet 12, and attaching the array of cup holes to the color-changing sheet; the flip chip 11 comprises a substrate 111 and an LED chip 112 flipped on the substrate 111;

[0063] Specifically, the flip chip 11 is a chip structure in which the LED chip 112 is flipped on the substrate 111. Specifically, the LED chip 112 is soldered and fixed on the substrate 111 through a solder paste layer, and the LED chip 112 is electrically connected to the substrate 111 through the solder paste layer. The substrate 111 is a PCB board, and the PCB board can be an FPC / BT substrate / aluminum substrate / FR4, etc. In this embodiment, a PCB board of corresponding materials can be selected according to the actual electronic equipment. The reflective sheet 12 can be made of light-blocking and high-reflectivity materials such as reflective paper and silicone sheets, and can block and reflect the light emitted by the LED chip 112 on the flip chip 11. This embodiment does not limit this and can be selected according to actual production needs. The color change sheet is used to change the color of the light emitted by the LED chip 112 on the flip chip 11.

[0064] It should be noted that in this embodiment, if the final packaged lamp bead 1 is required to form a white light source, the LED chip 112 used in this embodiment is an LED blue light chip, and the color conversion film should be a color conversion film that can convert blue light into white light. Thus, the blue light emitted by the LED blue light chip is converted into white light by the color conversion film, thereby forming a white light source.

[0065] More specifically, after obtaining the reflector 12 and the flip chip 11, the size of the cup hole 121 to be cut on the reflector 12 can be determined according to the flip chip 11. Specifically, the size of each cup hole 121 is larger than the size of the LED chip 112, so that the LED chip 112 can pass through the cup hole 121. And due to the arrangement of the multiple LED chips 112 on the flip chip 11, the arrangement mode and arrangement parameters of the multiple cup holes 121 cut on the reflector 12 also need to be consistent with the arrangement mode and arrangement parameters of the multiple LED chips 112 on the flip chip 11. Therefore, the multiple cup holes 121 cut on the reflector 12 are arranged to form an array of cup holes, which directly correspond to the multiple LED chips 112 of the flip chip 11. In addition, it can also facilitate the cutting of the attached cut color-changing sheet in the subsequent steps. After the array cup holes are cut, the reflective sheet 12 can be attached to the color-changing sheet so that the color-changing sheet covers one side of the array cup holes to close one end of the cup hole 121 on the reflective sheet 12 and keep the closed end connected to the outside.

[0066] It should be noted that the cup hole 121 may be in the shape of a circular hole. The array of cup holes is an array of circular holes. After the LED chip 112 is packaged, the circular hole shape can increase the light-emitting area of ​​the LED chip 112 and make the emitted light more uniform.

[0067] S20: Align and cut the color-changing sheet to which the cut reflective sheet 12 is attached according to the array cup holes to obtain a plurality of light-blocking and color-changing structures 14; each of the light-blocking and color-changing structures 14 has a cup hole 121;

[0068] Specifically, see Figure 8 and Fig. 9 The alignment cutting is to cut the color-changing sheet and the reflective sheet 12 on the color-changing sheet at corresponding positions according to the position of each cup hole 121 in the array cup holes on the reflective sheet 12, so that the color-changing sheet attached with the reflective sheet 12 is cut to form a plurality of light-blocking color-changing structures 14, each of which has a color-changing layer 142 formed by the cut color-changing sheet covering the cup hole 121 formed by the reflective layer 141 formed by the second-cut reflective sheet 12 at one end, thereby making the light-blocking color-changing structure 14 present a bracket shape composed of the cup hole 121 and the color-changing layer 142.

[0069] It should be noted that, in this embodiment, the cutting of the reflective sheet 12 to form the array cup holes and the cutting of the color-changing sheet attached with the cut reflective sheet 12 can be performed by laser cutting or mechanical cutting.

[0070] S30: attaching the light-blocking color-changing structure 14 to the LED chip 112 so that the cup hole 121 is buckled with the LED chip 112 to obtain a packaged lamp bead 1.

[0071] Specifically, when packaging each LED chip 112 on the flip chip 11, a light-blocking color-changing structure 14 in the form of a bracket can be directly attached to an LED chip 112, that is, the cup hole 121 is buckled with the LED chip 112, so that the side of the reflective sheet 12 in the light-blocking color-changing structure 14 that is away from the color-changing sheet is attached to the substrate 111 around the LED chip 112, thereby completing the packaging of the LED chip 112 and obtaining a packaged lamp bead 1, so that the front light emission of the LED chip 112 in the packaged lamp bead 1 can directly face the color-changing layer 142 in the light-blocking color-changing structure 14, and the side light emission of the LED chip 112 directly corresponds to the reflective layer 141 forming the cup hole 121 in the light-blocking color-changing structure 14, that is, the side of the LED chip 112 enclosed by the reflective layer 141. Among them, the side of the LED chip 112 that is away from the substrate 111 is defined as the front light-emitting surface, and the enclosing surface that encloses the front is defined as the side light-emitting surface.

[0072] It can be understood that by cutting array cup holes into the reflective sheet 12 made of light-blocking and high-reflectivity materials such as low-cost reflective paper and silicone sheet, each cup hole 121 in the array of cup holes can correspond to an LED chip 112. Therefore, after the color-changing sheet with the cut reflective sheet 12 affixed is aligned and cut, a light-blocking and color-changing structure 14 corresponding to each LED chip 112 can be cut to form, that is, one light-blocking and color-changing structure 14 corresponds to one cup hole 121, and one cup hole 121 corresponds to one LED chip 112. Therefore, when the light-blocking and color-changing structure 14 is attached to the LED chip 112, the cup hole 121 in the single light-blocking and color-changing structure 14 can be snapped onto the LED chip 112 to obtain a packaged lamp bead 1. Compared with the existing COB+QD packaging, the packaged lamp bead 1 obtained in the present embodiment can directly change color without the need to use a large piece of quantum dot film 132 / fluorescent film 131 for color change, thereby saving the cost of a large quantum dot film 132 / fluorescent film 131; in addition, the packaging of a single packaged lamp bead 1 is simpler, and the technical requirements for packaging are lower than those for COB packaging; and compared with traditional SMD packaging, the present embodiment uses a reflective sheet 12 made of light-blocking and high-reflectivity materials such as low-cost reflective paper and silicone sheets to directly replace the complex bracket that requires injection molding and electroplating in the SMD package, thereby saving the SMD packaging cost and the bracket cost, and thus achieving a downward breakthrough in the packaging cost of white light LEDs under existing conditions, achieving a lower packaging cost for white light LEDs.

[0073] Furthermore, the color-changing film is a fluorescent film 131 or a quantum dot film 132 .

[0074] It can be understood that the color changing piece is one of the fluorescent film 131 or the quantum dot film 132. That is, in this embodiment, if one fluorescent film 131 or quantum dot film 132 can be used as the color changing piece for the LED chip 112 to change color, the LED chip 112 can complete the color change. Therefore, compared with the existing COB+QD package white light solution that requires the use of both fluorescent film 131 and quantum dot film 132 for color change, the packaged lamp bead 1 module in this embodiment does not require two types, that is, no quantum dot or fluorescent film 131 is required for color change, saving the cost of the larger area of ​​quantum dot film 132 / fluorescent film 131, further reducing the cost.

[0075] See also Figure 2-Figure 5 Furthermore, the fluorescent film 131 is a single-layer fluorescent dispersion layer 1311 or a three-layer sandwich structure in which the fluorescent dispersion layer is sandwiched between two layers of the first protective film 1312; the quantum dot film 132 is a three-layer sandwich structure in which the quantum dot dispersion layer 1321 is sandwiched between two layers of the second protective film 1322 or a three-layer groove structure filled in the groove between the two layers of the second protective film 1322.

[0076] It can be understood that the structure of the appropriate fluorescent film 131 or the structure of the quantum dot film 132 can be selected according to the actual display requirements of the display device. The fluorescent film 131 is a three-layer sandwich structure, and the materials of the two first protective films 1312 can be transparent materials such as PET / PI / PEN. The fluorescent powder dispersion material is the same in the single-layer fluorescent dispersion layer 1311 structure and the three-layer sandwich structure, and can be a glue system such as PMMA / silicone. The corresponding material combination can be selected according to different application temperature conditions, and the fluorescent powder material is selected according to application requirements such as color gamut. When the quantum dot film 132 is a three-layer sandwich structure or a three-layer groove structure, the material of the second protective film 1322 includes but is not limited to PET / PI / glass and other materials, the dispersion material is silica gel and other materials, and the color change factor is a quantum dot color change material, which is selected according to different applications and temperature requirements.

[0077] See also Figure 6 and Figure 7 Further, step S10 specifically includes:

[0078] S101: providing the reflective sheet 12, the color-changing sheet and the flip chip 11; and providing a first adhesive 143 on the reflective sheet 12;

[0079] S102: cutting the reflective sheet 12 according to the parameters of the LED chip 112 of the flip chip 11 to obtain the cut reflective sheet 12 with array cup holes; the parameters of the cup holes 121 in the array cup holes correspond to the parameters of the LED chip 112 of the flip chip 11;

[0080] Specifically, the parameters of the cup hole 121 include the diameter and the row spacing between two adjacent rows and the column spacing between two adjacent columns of the cup holes in the array. The parameters of the LED chip 112 include the length and width of the chip and the row spacing between two adjacent rows of chips and the column spacing between two adjacent columns of chips. The diameter of each cup hole 121 needs to be greater than the length and width of a single LED chip 112 at the same time, so that the cup hole 121 can snap into the LED chip 112. The row spacing between two adjacent rows of cup holes 121 and the column spacing between two adjacent columns of cup holes 121 need to be the same as the row spacing between two adjacent rows of chips and the column spacing between two adjacent columns of chips on the flip chip 11, so that after multiple LED chips 112 are packaged on the substrate 111, a seamless transition can be made between any two adjacent packaged lamp beads 1, avoiding the influence of the overall light uniformity due to the different sizes of the reflector 12.

[0081] S103: directly attaching the cut reflective sheet 12 to the color transfer sheet through the first adhesive 143 .

[0082] It can be understood that by directly using a reflective sheet 12 with a first adhesive 143, the step of coating the first adhesive 143 on the reflective sheet 12 or the color-changing sheet is omitted, making it easier for the reflective sheet 12 to be directly attached to the color-changing sheet; and the cutting parameters of the reflective sheet 12 are determined according to the actual parameters of the LED chip 112, so that the parameters of the cup hole 121 after cutting can directly correspond to the parameters of the LED chip 112, so as to be more in line with the specifications of the actual chip, thereby making the parameters of the produced packaged lamp beads 1 more accurate and more in line with the requirements.

[0083] See also Fig.10 Further, as an optional implementation method of dispensing glue on the LED chip 112, step S30 specifically includes:

[0084] S311: Apply packaging glue 16 on the LED chip 112;

[0085] Specifically, when packaging the LED chip 112, packaging glue 16 can be first applied to the LED chip 112 so that the packaging glue 16 covers and wraps all parts of the LED chip 112 except the part connected to the LED substrate 111. At this time, the packaging glue 16 on the LED chip 112 is uncured packaging glue 16.

[0086] S312: Align the cup hole 121 on the light-blocking and color-changing structure 14 with the LED chip 112;

[0087] Specifically, the alignment is to align the center of the cup hole 121 on the light-blocking and color-changing structure 14 with the center of the LED chip 112 in a direction where the LED chip 112 is away from the substrate 111 .

[0088] S313: The aligned cup hole 121 is buckled into the LED chip 112, so that the packaging glue 16 fills the packaging space 17 formed between the cup hole 121 and the LED chip 112, and the reflective layer 141 in the light-blocking and color-changing structure 14 is attached to the periphery of the LED chip 112 through the packaging glue 16, to obtain a packaged lamp bead 1.

[0089] Specifically, after alignment, the light-blocking and color-changing structure 14 can be moved in the direction close to the LED, so that the cup hole 121 is buckled onto the LED chip 112, and the unformed packaging glue 16 covering the LED chip 112 fills the packaging space 17 formed between the cup hole 121 and the substrate 111 and the LED chip 112. When the packaging glue 16 overflows the packaging space 17, the light-blocking and color-changing structure 14 can be attached to the substrate 111 outside the LED chip 112 through the overflowed part of the packaging glue 16, thereby realizing the packaging of the LED chip 112 and obtaining the packaged lamp bead 1.

[0090] It can be understood that by applying the encapsulation glue 16 on the LED chip 112, it can be avoided that when the encapsulation glue 16 is applied to the cup hole 121 first, the encapsulation glue 16 flows out due to the alignment between the cup hole 121 and the chip, thereby affecting the chip packaging; thus, when the cup hole 121 is buckled on the LED chip 112, the encapsulation glue 16 can fill the packaging space 17 formed between the cup hole 121 and the LED chip 112 and the substrate 111, and at the same time, part of the encapsulation glue 16 overflows from the packaging space 17, so that the reflective sheet 12 is attached to the substrate 111 through the overflowed part of the encapsulation glue 16, thereby fixing the light-blocking color-changing structure 14. This avoids the need to apply adhesive between the reflective sheet 12 and the substrate 111 in the light-blocking color-changing structure 14 under the premise that the cup hole 121 has buckled the LED chip 112, simplifies the packaging steps, and is conducive to the direct molding of the production of a single packaged lamp bead 1.

[0091] Optionally, when the packaging glue 16 is applied to the LED chip 112, a second adhesive glue 15 can also be coated on the substrate 111 around the LED chip 112, so as to achieve the bonding of the reflective layer 141 in the light-blocking color-changing structure 14 with the substrate 111 through the second adhesive glue 15, so as to avoid the situation where the unformed packaging glue 16 fills the packaging space 17 formed between the cup hole 121 and the substrate 111 and the LED chip 112, and the overflow amount is insufficient, and the reflective layer 141 in the light-blocking color-changing structure 14 cannot be firmly bonded to the substrate 111, thereby making the light-blocking color-changing structure 14 and the substrate 111 more firmly bonded, thereby improving the overall stability of the packaged LED chip 112.

[0092] It should be noted that the packaging glue 16 may be PKG packaging silicone, and the material of the second adhesive glue 15 and the first adhesive glue 143 may be the same as the material of the packaging glue 16 .

[0093] Further, as another optional implementation of dispensing glue on the LED chip 112, step S30 specifically includes:

[0094] S321: Apply packaging glue 16 on the LED chip 112 to form a glue layer 161;

[0095] Specifically, the encapsulation glue 16 is first applied on the LED chip 112 to form an adhesive layer 161 to cover the entire LED chip 112, thereby protecting the LED chip 112. The parameters of the adhesive layer 161 are smaller than the parameters of the encapsulation space 17 formed between the cup hole 121 in the light-blocking and color-changing structure 14 and the LED chip 112 and the substrate 111. The parameters of the adhesive layer 161 include the diameter and the height. The total thickness of the adhesive layer 161 and the LED chip 112 is smaller than the thickness of the cup hole 121. The diameter of the boundary of the adhesive layer 161 is smaller than the diameter of the cup hole 121. In this way, after the encapsulation glue 16 is formed on the LED chip 112 to form the adhesive layer 161, the cup hole 121 can still be buckled to form the LED chip 112 with the adhesive layer 161.

[0096] S322: applying a second adhesive 15 on the outer periphery of the adhesive layer 161;

[0097] S323: snap the cup hole 121 aligned with the LED chip 112 onto the LED chip 112 formed with the adhesive layer 161, so that the reflective sheet 12 in the light-blocking and color-changing structure 14 is attached to the periphery of the LED chip 112 through the second adhesive 15, and obtain the packaged lamp bead 1.

[0098] Specifically, since the LED chip 112 has a molded glue layer 161, and the parameters of the glue layer 161 are smaller than the parameters of the cup hole 121, after the light-blocking and color-changing structure 14 is buckled with the LED chip 112 molded with the glue layer 161, the packaging glue 16 will not overflow. Therefore, it is necessary to apply a second adhesive 15 around the glue layer 161 to complete the light-blocking and color-changing structure 14 being attached to the substrate 111 through the second adhesive 15, thereby completing the packaging of the LED chip 112 and obtaining the packaged lamp bead 1.

[0099] It can be understood that by first applying packaging glue 16 on the LED chip 112 to form a glue layer 161 before the cup hole 121 is buckled with the LED chip 112, the packaging glue 16 can first form the glue layer 161 on the LED chip 112 to protect the LED chip 112 and increase the brightness, thereby avoiding the problem of bubbles and voids caused by the unformed glue first applied on the LED chip 112 flowing in the closed space formed between the reflective layer 141 and the color-changing layer 142 in the light-blocking and color-changing structure 14 and the substrate 111 after the LED chip 112 is buckled with the light-blocking and color-changing structure 14, thereby affecting the luminous effect of the packaged lamp bead 1.

[0100] Furthermore, before step S30, the method further includes:

[0101] S28: performing spectroscopic processing on the plurality of light-blocking color-changing structures 14 to obtain spectroscopic results corresponding to the plurality of light-blocking color-changing structures 14;

[0102] Specifically, since there may be uneven distribution of phosphors in different parts of the color-changing sheet, after cutting, the fluorescence wavelength of the color-changing layer 142 in each light-blocking color-changing structure 14 can be detected and determined, and the light-blocking color-changing structures 14 with the same fluorescence wavelength or wavelength range can be divided to obtain the spectroscopic results.

[0103] S29: After binning the plurality of light-blocking color-converting structures 14 and the corresponding plurality of LED chips 112 according to the light-splitting result, a classification result is obtained.

[0104] Specifically, since the color-changing effects of color-changing films with different fluorescent wavelengths on the LED chip 112 are different, the multiple LED chips 112 on the substrate 111 need to be divided into multiple bin areas. The LED chip 112 on each bin area adopts a light-blocking and color-changing structure 14 with a corresponding fluorescent wavelength or wavelength range, thereby solving the color difference problem of the lamp beads in the existing COB fluorescent glue dispensing solution, and making the final display module 2 composed of multiple packaged lamp beads 1 emit light more uniformly.

[0105] Understandably, the existing COB fluorescent glue dispensing solution has poor uniformity in phosphor dispersion during the dispensing process and is affected by time and glue viscosity, resulting in serious color differences between different COB lamp beads, and single-bead light separation cannot be performed when directly applied to the PCB. In this embodiment, by cutting the color-changing sheet to which the reflective sheet 12 is attached, individual light-blocking color-changing structures 14 can be obtained. Compared with the existing COB packaging solution, individual light-blocking color-changing structures 14 can realize the spectroscopic processing of multiple light-blocking color-changing structures 14, so that the light-blocking color-changing structures 14 and the multiple LED chips 112 on the substrate 111 can be binned according to the spectroscopic results, so that different bin areas on the multiple LED chips 112 can use light-blocking color-changing structures 14 that can achieve different luminous effects; thereby, matching between different bin areas on the multiple LED chips 112 and the light-blocking color-changing structures 14 is achieved to ensure that the expected luminous effect can be achieved, thereby ensuring the color difference of each lamp on the finished module formed by multiple packaged lamp beads 1, thereby solving the problem of serious color difference of lamp beads after different COB packages in the existing COB fluorescent glue dispensing solution due to poor uniformity of fluorescent powder dispersion in the dispensing process and the influence of time and glue viscosity.

[0106] See also Fig.11The second embodiment of the present invention provides a packaged lamp bead 1, including a flip chip 11, a packaging glue 16 layer and a light-blocking color-changing structure 14, the flip chip 11 includes a substrate 111 and an LED chip 112 flipped on the substrate 111; the light-blocking color-changing structure 14 includes a reflective layer 141 and a color-changing layer 142, a cup hole 121 is opened on the reflective layer 141, a side of the reflective layer 141 away from the color-changing layer 142 is attached to a side of the substrate 111 where the LED chip 112 is arranged, the color-changing layer 142 is arranged on a side of the reflective layer 141 away from the substrate 111, and covers the cup hole 121; the LED chip 112 is located in the cup hole 121, and the packaging glue 16 is arranged on the LED chip 112.

[0107] It can be understood that a light-blocking and color-changing structure 14 can be set to cover an LED chip 112, so that the reflective layer 141 with the cup hole 121 surrounds the side light-emitting surface of the LED chip 112, and the color-changing layer 142 is directly opposite to the front light-emitting surface of the LED chip 112. Therefore, after the LED chip 112 is packaged using the light-blocking and color-changing structure 14, the side light emitted by the LED chip 112 will be reflected by the reflective layer 141 until the reflected light and the light emitted from the front light-emitting surface are both changed color by the color-changing layer 142 to form white light, thereby achieving the cup hole 121 in a single light-blocking and color-changing structure 14 that is snapped onto the LED chip 112 to obtain a packaged lamp bead 1. Compared with the existing COB+QD packaging, the packaged lamp bead 1 obtained in this embodiment can directly change color without using a large piece of quantum dot film 132 / fluorescent film 131 with a large area for color change, thereby saving the cost of the quantum dot film 132 / fluorescent film 131 with a large area; in addition, the packaging of a single packaged lamp bead 1 is simpler, and the technical requirements for packaging are lower than those for COB packaging; and compared with the traditional SMD packaging, the reflective layer 141 formed by the reflective sheet 12 made of light-blocking and high-reflectivity materials such as low-cost reflective paper and silicone sheets in this embodiment directly replaces the complex bracket that needs injection molding and electroplating in the traditional SMD packaging, thereby saving the SMD packaging cost and the bracket cost, and then achieving a downward breakthrough in the packaging cost of white light LEDs under existing conditions, and achieving a lower packaging cost for white light LEDs. In addition, the bracket directly formed by the reflective sheet 12 can also effectively prevent the blue leakage phenomenon of the light emitted by the LED chip 112, and can effectively convert the light emitted by the LED chip 112 into white light, so that the color change of the entire packaged lamp bead 1 is more complete.

[0108] More specifically, the substrate 111 is a PCB board, and the PCB board can be an FPC / BT substrate 111 / aluminum substrate 111 / FR4, etc. In this embodiment, a PCB board of corresponding materials can be selected according to the actual electronic device, and this embodiment does not limit this. The thickness of the PCB board can be 0.2mm-1.6mm according to the application requirements, such as TV backlight generally uses 0.8 / 1.0mm thick aluminum-based PCB or 0.6mm thick FR4PCB. The thickness of the solder paste layer used to flip the LED chip 112 on the PCB board varies from 0.01 to 0.2mm, which can be specifically determined according to the parameters of the LED chip 112, and this embodiment does not limit this. When the LED chip 112 is used as a blue light source, different specifications need to be selected according to the application requirements. The thickness of the LED chip 112 commonly used in TV backlight is 0.1-0.3mm. The encapsulation glue 16 filled in the encapsulation space 17 is used to protect the LED chip 112 and increase the brightness. Its thickness is determined according to the thickness of the LED chip 112 and the reflective layer 141, and the thickness is in the range of 0.2-0.5mm. The thickness of the reflective layer 141 in the light-blocking color-changing structure 14 is in the range of 0.1-0.5 mm. The thickness of the first adhesive 143 on the reflective layer 141 is 5-50 um, so that the first adhesive 143 can be bonded to the reflective layer 141 and the color-changing layer 142 while avoiding the first adhesive 143 being too thick and affecting the reflective effect of the reflective layer 141. The thickness of the second adhesive 15 is within 5-50 um, and it can also be bonded to the reflective layer 141 and the substrate while avoiding the second adhesive 15 being too thick and affecting the reflective effect of the reflective layer 141. The thickness of the color-changing layer 142 in the light-blocking color-changing structure 14 is 0.2-0.4 mm. The color-changing layer 142 within this range can effectively change the color of the blue light emitted by the LED chip 112.

[0109] Optionally, the packaged lamp bead 1 in the second embodiment can be manufactured by using any preparation method of the packaged lamp bead 1 described in the first embodiment, and has the same technical effect as the first embodiment, which will not be elaborated in this embodiment.

[0110] Furthermore, the light-blocking and color-changing structure 14 in the packaged lamp bead 1 is in a bracket shape.

[0111] It can be understood that the cup hole 121 is opened on the reflective layer 141 in the light-blocking color-changing structure 14 so as to enclose the side of the LED chip 112 , thereby presenting a bracket shape to support the color-changing layer 142 while enclosing the side of the LED chip 112 .

[0112] See also Fig.12The third embodiment of the present invention further provides a packaged lamp bead 1, which is different from the second embodiment only in the filling degree of the packaging glue 16 on the LED chip 112, and the other structures remain the same. In the second embodiment, the packaging glue 16 fills the entire packaging space 17 formed between the color-changing layer 142, the reflective layer 141, the substrate 111 and the chip. In the third embodiment, the packaging glue 16 forms a glue layer 161 on the LED chip 112, and does not completely fill the entire packaging space 17.

[0113] Optionally, the packaging method of the third embodiment may be the same as that of the second embodiment, and both may be produced by the preparation method of the packaged lamp bead 1 described in any one of the first embodiments. The difference lies in that in the second embodiment, the packaging glue 16 adopts steps S311-S313 to fill the entire packaging space 17 formed between the color-changing layer 142, the reflective layer 141, the substrate 111 and the chip, while in the third embodiment, the packaging glue 16 adopts steps S321-S323 to form a glue layer 161 on the LED chip 112, and does not completely fill the entire packaging space 17.

[0114] See also Fig.13 A fourth embodiment of the present invention provides a display module 2, comprising a packaged lamp bead 1 as described in any one of the second embodiment or the third embodiment.

[0115] It can be understood that the display module 2 prepared by the packaged lamp beads 1 in the second embodiment or the third embodiment adopted in this embodiment has lower cost and higher efficiency. And the display module 2 in this embodiment can be made after S28 and step S29, and then processed by spectral processing and binning, so that the color difference of each lamp on the finished module formed by multiple packaged lamp beads 1 can be guaranteed, thereby solving the problem of serious color difference of lamp beads after different COB packages in the existing COB fluorescent glue dispensing solution due to the poor uniformity of fluorescent powder dispersion in the dispensing process and the influence of time and glue viscosity.

[0116] Compared with the prior art, the method for preparing encapsulated lamp beads, encapsulated lamp beads and display module provided by the present invention have the following advantages:

[0117] 1. The preparation method of the packaged lamp bead provided by the embodiment of the present invention comprises the following steps: providing a reflector, a color-changing sheet and a flip chip, cutting an array of cup holes from the reflector and attaching it to the color-changing sheet; the flip chip comprises a substrate and an LED chip flipped on the substrate; the color-changing sheet with the cut reflector attached thereto is aligned and cut according to the array of cup holes to obtain a plurality of light-blocking and color-changing structures; each light-blocking and color-changing structure has a cup hole; the light-blocking and color-changing structure is attached to the LED chip so that the cup hole is buckled with the LED chip to obtain the packaged lamp bead. By cutting the array of cup holes from the reflector, each cup hole in the array of cup holes can correspond to one LED chip, so after the color-changing sheet with the cut reflector attached thereto is aligned and cut, a light-blocking and color-changing structure corresponding to each LED chip can be cut, that is, one light-blocking and color-changing structure corresponds to one LED chip, so that when the light-blocking and color-changing structure is attached to the LED chip, the cup hole in a single light-blocking and color-changing structure can be buckled with the LED chip to obtain the packaged lamp bead. Therefore, compared with the existing COB+QD packaging, the packaged lamp beads obtained in this embodiment can directly change color without the need to use large-area quantum dot films / fluorescent films for color change, thereby saving the cost of large-area quantum dot films / fluorescent films; in addition, the packaging of a single packaged lamp bead is simpler, and the technical requirements for packaging are lower than those for COB packaging; and compared with traditional SMD packaging, the reflective sheet made of low-cost reflective paper, silicone sheets and other light-blocking and high-reflectivity materials directly replaces the complex bracket that needs injection molding and electroplating in the SMD packaging, thereby saving the SMD packaging cost and the bracket cost, and thus achieving a downward breakthrough in the packaging cost of white light LEDs under existing conditions, achieving a lower packaging cost for white light LEDs.

[0118] 2. The color-changing sheet provided in the embodiment of the present invention is a fluorescent film or a quantum dot film, that is, in this embodiment, a fluorescent film or a quantum dot film can be used as a color-changing sheet to complete the color change of the obtained packaged lamp beads. Therefore, compared with the existing COB+QD packaged white light solution, the packaged lamp bead module in this embodiment does not require quantum dots / fluorescent films for color change, saving the cost of quantum dot films / fluorescent films with a larger area, and further reducing costs.

[0119] 3. In the embodiment of the present invention, a reflector, a color-changing sheet and a flip chip are provided, and an array of cup holes is cut out of the reflector and attached to the color-changing sheet. Specifically, the reflector, a color-changing sheet and a flip chip are provided; a first adhesive is provided on the reflector; the reflector is cut according to the LED chip parameters of the flip chip to obtain a reflector with an array of cup holes after cutting; the parameters of the cup holes in the array of cup holes correspond to the LED chip parameters of the flip chip; the cut reflector is directly attached to the color-changing sheet through the first adhesive. By directly using a reflector with the first adhesive, the step of coating the first adhesive on the reflector or the color-changing sheet is omitted, which makes it easier for the reflector to be directly attached to the color-changing sheet; and the cutting parameters of the reflector are determined according to the actual LED chip parameters, so that the parameters of the cup holes after cutting can directly correspond to the LED chip parameters, so as to be more in line with the specifications of the actual chip, so that the parameters of the produced packaged lamp beads can be more accurate and more in line with the requirements.

[0120] 4. In the embodiment of the present invention, the light-blocking color-changing structure is attached to the LED chip, so that the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes: applying packaging glue on the LED chip; aligning the cup hole on the light-blocking color-changing structure with the LED chip; buckling the aligned cup hole with the LED chip, so that the packaging glue fills the packaging space formed between the cup hole and the LED chip, and the reflective layer in the light-blocking color-changing structure is attached to the periphery of the LED chip through the packaging glue to obtain a packaged lamp bead. By applying packaging glue on the LED chip, it can be avoided that when the packaging glue is first applied to the cup hole, the packaging glue flows out due to the alignment of the cup hole and the chip, which affects the packaging of the chip; so that when the cup hole is buckled with the LED chip, the packaging glue can fill the packaging space formed between the cup hole and the LED chip and the substrate, and at the same time, part of the packaging glue overflows from the packaging space, so that the reflective layer is attached to the substrate through the overflowed part of the packaging glue, thereby realizing a fixed light-blocking color-changing structure. This avoids the need to apply adhesive between the reflective layer and the substrate in the light-blocking and color-changing structure, simplifies the packaging steps, and facilitates direct molding of the production of a single packaged lamp bead.

[0121] 5. In the embodiment of the present invention, the light-blocking color-changing structure is attached to the LED chip, and the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes: applying packaging glue on the LED chip to form a glue layer; applying a second adhesive glue on the periphery of the glue layer; and buckling the cup hole aligned with the LED chip on the LED chip with the glue layer, so that the reflective layer in the light-blocking color-changing structure is attached to the periphery of the LED chip through the second adhesive glue to obtain a packaged lamp bead. By applying packaging glue on the LED chip to form a glue layer before the cup hole is buckled with the LED chip, the packaging glue can first form a glue layer on the LED chip to protect the LED chip and increase the brightness, avoiding the problem that the unformed glue liquid first applied on the LED chip flows in the closed space formed between the reflective layer and the color-changing layer in the light-blocking color-changing structure and the substrate after the light-blocking color-changing structure is buckled with the LED chip, resulting in bubbles and voids, which affects the luminous effect of the packaged lamp bead.

[0122] 6. In the embodiment of the present invention, the light-blocking color-changing structure is attached to the LED chip so that the cup hole engages with the LED chip to obtain the packaged lamp bead. The method also includes: performing spectroscopic processing on the multiple light-blocking color-changing structures to obtain spectroscopic results corresponding to the multiple light-blocking color-changing structures; and obtaining a classification result after binning the multiple light-blocking color-changing structures and the corresponding multiple LED chips according to the spectroscopic results. By cutting the color-changing sheet with the reflective sheet attached, individual light-blocking color-changing structures can be obtained. Compared with the existing COB+QD packaging solution, individual light-blocking color-changing structures can realize the spectral processing of multiple light-blocking color-changing structures, so that the light-blocking color-changing structures and multiple LED chips on the substrate can be binned according to the spectral results, and the light-blocking color-changing structures that can achieve different luminous effects are adopted in different bin areas on multiple LED chips; thereby, the matching between different bin areas on multiple LED chips and the light-blocking color-changing structures is achieved to ensure that the expected luminous effect can be achieved, so that the color difference of each lamp on the finished module formed by multiple packaged lamp beads can be guaranteed, thereby solving the problem of serious color difference of lamp beads after different COB packages in the existing COB fluorescent glue dispensing solution due to poor uniformity of fluorescent powder dispersion in the dispensing process and the influence of time and glue viscosity.

[0123] 7. The present invention also provides a packaged lamp bead, which has the same beneficial effects as the manufacturing method of the above-mentioned packaged lamp bead, and will not be described in detail here.

[0124] 8. The present invention also provides a display module having the same beneficial effects as the above-mentioned packaged lamp beads, which will not be described in detail here.

[0125] The above is a detailed introduction to a method for preparing a packaged lamp bead, a packaged lamp bead and a display module disclosed in an embodiment of the present invention. Specific examples are used in this article to illustrate the principle and implementation mode of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in the field, according to the idea of ​​the present invention, there will be changes in the specific implementation mode and the scope of application. In summary, the content of this specification should not be understood as a limitation on the present invention, and any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for preparing a packaged lamp bead, characterized in that: The following steps are involved: A reflector, a color-changing sheet and a flip chip are provided, and the reflector is cut into array cup holes and attached to the color-changing sheet; the flip chip comprises a substrate and an LED chip flipped on the substrate; The color-changing sheet to which the cut reflective sheet is attached is aligned and cut according to the array cup holes to obtain a plurality of light-blocking and color-changing structures; each of the light-blocking and color-changing structures has a cup hole; The light-blocking and color-changing structure is attached to the LED chip, and the cup hole is buckled with the LED chip to obtain a packaged lamp bead.

2. The method for preparing a packaged lamp bead according to claim 1, characterized in that: The color-changing film is a fluorescent film or a quantum dot film.

3. The method for preparing a packaged lamp bead according to claim 2, characterized in that: The fluorescent film is a single-layer fluorescent dispersion layer or a three-layer sandwich structure in which the fluorescent dispersion layer is sandwiched between two layers of first protective films; the quantum dot film is a three-layer sandwich structure in which the quantum dot dispersion layer is sandwiched between two layers of second protective films or a three-layer groove structure filled in the groove between two layers of second protective films.

4. The method for preparing a packaged lamp bead according to claim 1, characterized in that: Provide reflective sheet, color-changing sheet and flip chip, cut the reflective sheet into array cup holes, and attach it to the color-changing sheet, including: Providing the reflective sheet, the color-changing sheet and the flip chip; the reflective sheet is provided with a first adhesive; Cutting the reflective sheet according to the LED chip parameters of the flip chip to obtain a cut reflective sheet with array cup holes; the parameters of the cup holes in the array cup holes correspond to the LED chip parameters of the flip chip; The cut reflective sheet is directly attached to the color-changing sheet by means of a first adhesive.

5. The method for preparing a packaged lamp bead according to claim 1, characterized in that: The light-blocking and color-changing structure is attached to the LED chip so that the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes: Applying packaging glue on the LED chip; Aligning the cup hole on the light-blocking and color-changing structure with the LED chip; The aligned cup hole is buckled with the LED chip, so that the packaging glue fills the packaging space formed between the cup hole and the LED chip, and the reflective layer in the light-blocking and color-changing structure is attached to the periphery of the LED chip through the packaging glue to obtain a packaged lamp bead.

6. The method for preparing a packaged lamp bead according to claim 1, characterized in that: The light-blocking and color-changing structure is attached to the LED chip so that the cup hole is buckled with the LED chip to obtain a packaged lamp bead, which specifically includes: Applying packaging glue on the LED chip to form a glue layer; Apply a second adhesive glue on the periphery of the adhesive layer; The cup hole aligned with the LED chip is buckled onto the LED chip with the adhesive layer formed thereon, so that the reflective layer in the light-blocking and color-changing structure is attached to the periphery of the LED chip through the second adhesive to obtain a packaged lamp bead.

7. The method for preparing a packaged lamp bead according to claim 1, characterized in that: Before attaching the light-blocking color-changing structure to the LED chip so that the cup hole fits the LED chip and the packaged lamp bead is obtained, the method further includes: Performing spectral processing on the plurality of light-blocking and color-changing structures to obtain spectral results corresponding to the plurality of light-blocking and color-changing structures; According to the spectroscopic result and after binning the multiple light-blocking color-changing structures and the corresponding multiple LED chips, a classification result is obtained.

8. A packaged lamp bead, characterized in that: It includes a flip chip, a packaging glue layer and a light-blocking and color-changing structure, wherein the flip chip includes a substrate and an LED chip flipped on the substrate; The light-blocking and color-changing structure includes a reflective layer and a color-changing layer, a cup hole is opened on the reflective layer, a side of the reflective layer facing away from the color-changing layer is attached to a side of the substrate on which the LED chip is arranged, and the color-changing layer is arranged on a side of the reflective layer facing away from the substrate and covers the cup hole; the LED chip is located in the cup hole, and the encapsulation glue layer is arranged on the LED chip.

9. The packaged lamp bead as claimed in claim 8, characterized in that: The light-blocking and color-changing structure in the packaged lamp bead is in a bracket shape.

10. A display module, characterized in that: Comprising the packaged lamp bead as described in any one of claims 8 or 9.

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