Camera combination structure and manufacturing method of shielding enhanced cover plate

Abstract

The invention discloses a camera combination structure and a manufacturing method of a shielding enhancing cover plate, the camera combination structure comprises a camera module and the shielding enhancing cover plate covering the camera module, the shielding enhancing cover plate comprises a substrate and an antireflection film layer, the antireflection film layer is attached to the surface of the substrate, and the shielding enhancing cover plate is arranged on the substrate. Wherein the antireflection film layer comprises a high-refractive-index material layer and a low-refractive-index material layer which are alternately stacked, and the thicknesses and material types of the high-refractive-index material layer and the low-refractive-index material layer are selected and adjusted, so that the antireflection film layer has an LAB value close to that of the camera module. Compared with a previous anti-reflection film glass scheme in which the color is determined only according to the characteristics of a material for the anti-reflection purpose, the shielding enhancement cover plate disclosed by the invention ensures the high transmittance requirement of the camera, ensures the imaging effect, greatly improves the concealment of the camera, and realizes the perfect combination of the concealment and the functionality.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a camera assembly structure and a method for manufacturing a shielding and enhancing cover plate. Background Art

[0002] Masking sensors on mobile phones, tablets or wearable devices is an important task to improve the aesthetics of the device. For example, ambient light sensors can be hidden by using ink, but this method is only suitable for sensors with low transmittance requirements. For cameras, due to their high transmittance requirements, conventional masking methods are not applicable. Currently, camera masking methods include reducing the size of the camera, printing ink of similar color around the cover, or covering it with a display module.

[0003] In the anti-reflection film industry, the parameters that are usually concerned include transmittance and reflectance. The goal is to improve the imaging effect of the camera by increasing the amount of light transmitted. The anti-reflection film can be a single-layer or multi-layer structure. The single-layer structure can only enhance the transmittance of a specific band, while the multi-layer structure can adjust the anti-reflection effect of the entire visible light band. The average transmittance is usually used as a monitoring method.

[0004] However, since camera lenses are usually coated, the color of the coating will cause a difference in color between the lens and surrounding parts. Using the conventional method of printing ink around the lens, it is difficult for the ink to completely cover all parts outside the lens, and an obvious heterochromatic ring may be left. In addition, the curvature of the lens itself will also cause inconsistencies in color and brightness, making it difficult to achieve a perfect shielding effect. If the display module covering method is used, the amount of light entering the lens will be reduced, affecting the imaging effect and the screen brightness. As for the previous solution of using anti-reflective film glass to cover the camera, since the color of the anti-reflective film itself is only determined by the material properties for the purpose of anti-reflection, it is not possible to produce a good shielding effect on the camera.

[0005] It should be noted that the information disclosed in the above background technology section is only used for understanding the background of the present application, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the invention

[0006] The main purpose of the present invention is to overcome the defects existing in the above-mentioned background technology and to provide a camera assembly structure and a method for manufacturing a shielding and enhancing cover plate.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] A camera assembly structure, comprising:

[0009] -Camera module;

[0010] - a shielding enhancement cover plate covering the camera module, the shielding enhancement cover plate comprising:

[0011] -Substrate;

[0012] - an anti-reflection film layer, the anti-reflection film layer is attached to the surface of the substrate, wherein the anti-reflection film layer comprises alternating high refractive index material layers and low refractive index material layers, the thickness and material type of the high refractive index material layers and the low refractive index material layers are selected and adjusted so that the anti-reflection film layer has a LAB value close to that of the camera module, so that the color difference value △E 2000 Not more than 3.

[0013] Furthermore, the high refractive index material is selected from LaTiO3 (lanthanum titanate) and / or TiO2 (titanium dioxide), and the low refractive index material is SiO2 (silicon dioxide).

[0014] Furthermore, the anti-reflection film layer is an electroplated film layer.

[0015] Furthermore, the average transmittance of the antireflection film layer in the 400-750 nanometer band is above 94%.

[0016] Furthermore, the substrate is made of glass, sapphire or plastic.

[0017] A method for manufacturing a shielding and reinforcing cover plate comprises the following steps:

[0018] - Obtaining the LAB value of the camera module to be assembled with the shielding enhancement cover plate;

[0019] -Prepare the substrate;

[0020] -Alternately stacking high refractive index material layers and low refractive index material layers on the surface of the substrate to form an anti-reflection film layer; wherein the thickness and material type of the high refractive index material layer and the low refractive index material layer are selected and adjusted so that the anti-reflection film layer has a LAB value close to that of the camera module.

[0021] Furthermore, the LAB of the camera module is obtained by measurement.

[0022] Furthermore, the high refractive index material is selected from LaTiO3 (lanthanum titanate) and TiO2 (titanium dioxide), and the low refractive index material is SiO2 (silicon dioxide).

[0023] Furthermore, in a vacuum environment, an anti-reflection film layer is formed on the surface of the substrate by an electroplating process.

[0024] Furthermore, the average transmittance of the antireflection film layer in the 400-750 nanometer band is above 94%.

[0025] The present invention has the following beneficial effects:

[0026] The present invention provides a camera assembly structure, which has a shielding and enhancing cover plate that can significantly improve the concealment of the camera, while ensuring that the imaging effect is not affected. This cover plate is made of a carefully designed anti-reflection film layer, which is composed of alternating high-refractive index material layers and low-refractive index material layers. The thickness and type of these material layers are accurately selected and adjusted to match the LAB value of the camera module, thereby visually achieving consistency with the color of the camera module, and effectively solving the color difference problem existing in the traditional shielding method. This design not only avoids the visible heterochromatic ring caused by the color difference of the lens coating, but also overcomes the problem of inconsistent brightness and color caused by the curvature of the lens. In addition, compared with the display module covering method, the present invention does not reduce the amount of light entering the lens, so it does not affect the imaging effect and screen brightness. Compared with the previous anti-reflection film glass solution that only determines the color based on the material properties for the purpose of anti-reflection, the shielding and enhancing cover plate of the present invention greatly improves the concealment of the camera while ensuring the high transmittance requirements of the camera and the imaging effect, achieving a perfect combination of concealment and functionality.

[0027] Other beneficial effects of the embodiments of the present invention will be further described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 Schematic diagram of the stacked structure of the anti-reflection film layer of Example 1 of the present invention.

[0029] Figure 2 This is a comparison diagram of the cover color and the camera color in Example 1 of the present invention.

[0030] Figure 3 This is a transmittance diagram of the cover plate in the visible light band according to Example 1 of the present invention.

[0031] Figure 4 Schematic diagram of the stacked structure of the anti-reflection film layer of Example 2 of the present invention.

[0032] Figure 5 This is a comparison diagram of the cover color and the camera color in Example 2 of the present invention.

[0033] Figure 6 This is a transmittance diagram of the cover plate in the visible light band according to Example 2 of the present invention.

[0034] Figure 7 Graph showing the difference in transmittance between Example 1 and Example 2 of the present invention.

[0035] Figure 8 This is an example diagram comparing the shielding effects of the cover plates of the present invention and the prior art. DETAILED DESCRIPTION

[0036] The following is a detailed description of the embodiments of the present invention. It should be emphasized that the following description is only exemplary and is not intended to limit the scope and application of the present invention.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, connection can be used for fixing as well as for coupling or communication.

[0038] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] An embodiment of the present invention provides a camera assembly structure, comprising: a camera module and a shielding and enhancing cover plate covering the camera module, wherein the shielding and enhancing cover plate comprises: a substrate and an anti-reflection film layer, wherein the anti-reflection film layer is attached to the surface of the substrate, wherein the anti-reflection film layer comprises alternating high-refractive index material layers and low-refractive index material layers, wherein the thickness and material type of the high-refractive index material layers and the low-refractive index material layers are selected and adjusted so that the anti-reflection film layer has a LAB value close to that of the camera module, so that the color difference value △E 2000 Not more than 3.

[0041] In a preferred embodiment, the high refractive index material is selected from LaTiO3 (lanthanum titanate) and / or TiO2 (titanium dioxide), and the low refractive index material is SiO2 (silicon dioxide). Figure 1 and Figure 4Two specific laminated structures of anti-reflection film layers are shown respectively. In some embodiments, the anti-reflection film layer is an electroplated film layer. In some embodiments, the substrate can be made of glass, sapphire or plastic. In a preferred embodiment, the average transmittance of the anti-reflection film layer in the 400-750 nanometer band is above 94%.

[0042] The embodiment of the present invention also provides a method for manufacturing a shielding enhancement cover plate, comprising the following steps: obtaining the LAB value of a camera module to be assembled with the shielding enhancement cover plate by measurement or other means; preparing a substrate; alternately stacking high refractive index material layers and low refractive index material layers on the surface of the substrate to form an anti-reflection film layer; wherein the thickness and material type of the high refractive index material layer and the low refractive index material layer are selected and adjusted so that the anti-reflection film layer has a LAB value close to that of the camera module. In some embodiments, the anti-reflection film layer is formed on the surface of the substrate by an electroplating process under a vacuum environment.

[0043] The specific embodiments of the present invention are further described below.

[0044] The cover plate of a specific embodiment of the present invention includes a substrate and an anti-reflection film layer. The substrate can be made of glass, sapphire or plastic, and the anti-reflection film layer is attached to the surface of the substrate by an electroplating process. The LAB value of the anti-reflection film layer can be accurately adjusted according to the LAB value of the camera module to ensure the best concealment effect. The anti-reflection film layer is a stacked structure and can be formed by an electroplating process. The method for adjusting the LAB value of the anti-reflection film layer may include using coating materials of different types or thicknesses, changing electroplating parameters, etc. The alternatingly stacked coating materials include high refractive index materials and low refractive index materials, wherein the high refractive index material may include TIO2, LaTiO3, etc., and the low refractive index material may include SiO2, etc.

[0045] LAB detection can be performed by using a colorimeter or other equipment to measure the module or a dedicated test piece / standard plate to obtain the LAB value. The manufacturing process includes cleaning of the substrate and electroplating of the anti-reflection film layer. The specific steps are as follows:

[0046] Substrate cleaning: Use ultrasonic cleaning equipment to thoroughly clean the substrate to ensure that the surface is dust-free and oil-free.

[0047] Electroplating anti-reflection film layer: In a vacuum environment, an anti-reflection film layer is formed on the surface of the substrate through an electroplating process. The film structure is composed of alternating high and low refractive index layers. The thickness of each layer is increased or decreased through the LAB value of the camera module, and the LAB value is adjusted to be close to the LAB of the camera module. Increasing or decreasing the thickness of each layer can make specific adjustments to a certain band, thereby achieving control of the LAB effect. For example, controlling the long-wave band can adjust red, the short-wave band can adjust blue, and the longer and shorter waves can adjust yellow and green respectively. If the color of the camera module is blue, adjusting the color of the cover plate to blue can enhance the shielding effect, and blue light is a short-wave band. Each color has its corresponding band. By adjusting different bands, the color can naturally be adjusted. In a specific embodiment, according to the color target and transmittance requirements, the required structural configuration can be obtained through the existing film system design software, and then the anti-reflection film layer is electroplated according to the configuration.

[0048] Embodiment 1:

[0049] A preliminary visual observation of the camera revealed that the camera was blue. Further measurement of the LAB value yielded data of L: 26.11, a: -0.27, b: -1.6. An anti-reflection film was designed for this color. The film was composed of 5 layers of LaTiO3 (lanthanum titanate) and SiO2 (silicon dioxide) alternately stacked, with a film thickness of 228um. Figure 1 As shown, the stacked structure of the antireflection film layer includes from bottom to top: the first layer is a SiO2 (silicon dioxide) layer; the second layer is a LaTiO3 (lanthanum titanate) layer; the third layer is a SiO2 (silicon dioxide) layer; the fourth layer is a LaTiO3 (lanthanum titanate) layer; the fifth layer is a SiO2 (silicon dioxide) layer. According to the designed stacked structure, the antireflection film is electroplated on the substrate to obtain a shielding enhancement cover plate. The average transmittance of the 400-750 band is measured to be above 94%, and the measured LAB values ​​are L: 26.56, a: -0.22, b: -1.43. Figure 2 The comparison diagram of the cover color and the camera color in Example 1 shows that the cover color is close to the camera color, and the color difference value △E 2000 No more than 3, which meets the expected effect. Figure 3 This is the visible light band transmittance diagram of the cover plate of Example 1, which shows that the visible light transmittance of the cover plate is in compliance with the regulations and meets the high transmittance requirements of the camera for the cover plate. The camera assembly structure obtained by assembling the shielding enhancement cover plate and the camera module meets the high transmittance requirements while significantly improving the concealment of the lens compared to ordinary AR films.

[0050] Embodiment 2:

[0051] A preliminary visual observation of the camera revealed that the camera was blue. Further measurement of the LAB value yielded data of L: 26.11, a: -0.27, b: -1.6. An anti-reflection film was designed for this color. The film was composed of 5 layers of TiO2 and SiO2 alternately stacked, with a film thickness of 218um. Figure 4 As shown, the stacked structure of the antireflection film layer includes from bottom to top: the first layer is a SiO2 (silicon dioxide) layer; the second layer is a TiO2 (titanium dioxide) layer; the third layer is a SiO2 (silicon dioxide) layer; the fourth layer is a TiO2 (titanium dioxide) layer; the fifth layer is a SiO2 (silicon dioxide) layer. According to the designed stacked structure, the antireflection film is electroplated on the substrate to obtain a shielding enhancement cover plate. The average transmittance of the 400-750 band is measured to be above 94%, and the measured LAB values ​​are L: 25.61, a: -0.49, b: -1.3. Figure 5 The comparison diagram of the cover color and the camera color in Example 2 shows that the cover color is close to the camera color, and the color difference value △E 2000 No more than 3, which meets the expected effect. Figure 6 This is the visible light band transmittance diagram of the cover plate of Example 2, which shows that the visible light transmittance of the cover plate is in compliance with the regulations and meets the high transmittance requirements of the camera for the cover plate. The camera assembly structure obtained by assembling the shielding enhancement cover plate and the camera module meets the high transmittance requirements while significantly improving the concealment of the lens compared to ordinary AR films.

[0052] Figure 7 Graph showing the difference in transmittance between Example 1 and Example 2. Figure 7 It is shown that the transmittance of embodiment 1 is higher in the short wave band, and the transmittance of embodiment 2 is higher in the long wave band. Different shielding enhancement cover plates can be selected and adapted according to the specific preferences of the camera module.

[0053] Figure 8 This is an example diagram comparing the shielding effects of the cover plate of the present invention and the prior art. The left side shows the shielding effect of the shielding-enhanced cover plate of the present invention, and the right side shows the shielding effect of the cover plate using a conventional anti-reflection film.

[0054] The above content is a further detailed description of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, it can also make several substitutions or modifications to these described embodiments, and these substitutions or modifications should be regarded as belonging to the protection scope of the present invention. In the description of this specification, the description of the reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In the absence of mutual contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and modifications can be made herein without departing from the scope of protection of the patent application.

Claims

1. A camera assembly structure, characterized in that: include: -Camera module; - a shielding enhancement cover plate covering the camera module, the shielding enhancement cover plate comprising: -Substrate; - an anti-reflection film layer, the anti-reflection film layer is attached to the surface of the substrate, wherein the anti-reflection film layer comprises alternating high refractive index material layers and low refractive index material layers, the thickness and material type of the high refractive index material layers and the low refractive index material layers are selected and adjusted so that the anti-reflection film layer has a LAB value close to that of the camera module, so that the color difference value △E 2000 Not more than 3.

2. The camera assembly structure according to claim 1, characterized in that: The high refractive index material is LaTiO3 (lanthanum titanate) and / or TiO2 (titanium dioxide), and the low refractive index material is SiO2 (silicon dioxide).

3. The camera assembly structure according to claim 1 or 2, characterized in that: The anti-reflection film layer is an electroplated film layer.

4. The camera assembly structure according to any one of claims 1 to 3, characterized in that: The average transmittance of the antireflection film layer in the 400-750 nanometer band is above 94%.

5. The camera assembly structure according to any one of claims 1 to 4, characterized in that: The substrate is made of glass, sapphire or plastic.

6. A method for manufacturing a shielding and reinforcing cover plate, characterized in that: The following steps are involved: - Obtaining the LAB value of the camera module to be assembled with the shielding enhancement cover plate; -Prepare the substrate; -Alternately stacking high refractive index material layers and low refractive index material layers on the surface of the substrate to form an anti-reflection film layer; wherein the thickness and material type of the high refractive index material layer and the low refractive index material layer are selected and adjusted so that the anti-reflection film layer has a LAB value close to that of the camera module.

7. The method for manufacturing the shielding and reinforcing cover plate according to claim 6, characterized in that: The LAB of the camera module is obtained by measurement.

8. The method for manufacturing the shielding and reinforcing cover plate according to claim 6 or 7, characterized in that: The high refractive index material is selected from LaTiO3 (lanthanum titanate) and TiO2 (titanium dioxide), and the low refractive index material is SiO2 (silicon dioxide).

9. The method for manufacturing a shielding and reinforcing cover plate according to any one of claims 6 to 8, characterized in that: In a vacuum environment, an anti-reflection film layer is formed on the surface of the substrate by an electroplating process.

10. The method for manufacturing a shielding and reinforcing cover plate according to any one of claims 6 to 9, characterized in that: The average transmittance of the antireflection film layer in the 400-750 nanometer band is above 94%.

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