Chip packaging device and packaging method thereof

Abstract

The invention provides a chip packaging device and a packaging method thereof, belongs to the technical field of chip packaging, and mainly aims at solving the problem that an existing packaging device is poor in gluing effect, the chip packaging device comprises a base and a mounting table, two sets of glue storage assemblies are arranged at one end of the mounting table, and a relay tank is arranged at the bottom of one set of glue storage tanks; a bubble removing assembly is arranged in the relay tank, bubbles in glue can be removed through the bubble removing assembly, the bonding effect of the glue is improved, a grid laser transmitter is arranged at the bottom of the mounting plate and can conduct grid laser irradiation on a chip substrate, a camera is arranged on one side of the grid laser transmitter, and the camera is arranged on the other side of the grid laser transmitter. Wherein a control module and a visual identification module are arranged on one side of one group of glue storage assembly, through the arrangement of the camera and the visual identification module, the control module can control the glue dispensing assembly to perform glue dispensing on grids at the edge of a chip substrate, glue is flattened through the glue smearing mechanical arm, and the glue smearing effect is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and more specifically, particularly relates to a chip packaging device and a packaging method thereof. Background Art

[0002] With the continuous miniaturization and performance improvement of electronic products, the packaging technology of integrated circuit chips is also facing new challenges. Chip packaging is one of the key links in the manufacture of electronic products. It determines the performance, reliability and cost of the chip. A good packaging process can effectively protect the chip from the influence of the external environment and improve the service life and reliability of the chip. The current packaging process usually glues the chip shell to the chip substrate to protect the internal chip. However, the traditional chip packaging device has poor gluing effect on the chip substrate during the packaging operation, which makes the chip shell easy to fall off from the chip substrate. In addition, during the gluing operation, the glue often contains bubbles, which will cause the adhesion of the glue to decrease. Summary of the invention

[0003] In order to solve the above technical problems, the present invention provides a chip packaging device and a packaging method thereof to solve the technical problems in the prior art that the traditional packaging device has poor gluing effect and the glue often contains bubbles during the gluing operation, resulting in a decrease in the adhesion of the glue.

[0004] The purpose and effect of a chip packaging device and a packaging method thereof of the present invention are achieved by the following specific technical means: A chip packaging device comprises a base and a mounting table, two groups of glue storage components are arranged at one end of the mounting table, the two groups of glue storage components each comprise a glue storage tank, the two groups of glue storage tanks are arranged at one end of the mounting table, a relay tank is arranged at the bottom of one group of the glue storage tanks, a glue delivery pipe is arranged at the bottom of the relay tank, a defoaming component is arranged in the relay tank, a mounting plate is arranged at one side of the relay tank, a grid laser emitter is arranged at the bottom of the mounting plate, a camera is arranged at one side of the grid laser emitter, a control module and a visual recognition module are arranged at one side of one group of the glue storage components, a glue dispensing robot arm and a glue spreading robot arm are arranged at the top of the base, a glue dispensing component is arranged at one end of the glue dispensing robot arm, a packaging table is arranged at the top of the base, and a glue containing groove is opened around the packaging table.

[0005] As a further scheme of the present invention, the glue dispensing component includes a glue dispensing part, multiple groups of glue pushing parts and multiple groups of glue dispensing heads. The glue dispensing part is arranged at one end of the glue dispensing robot arm. Multiple groups of glue outlet cavities are opened in the glue dispensing part. A glue inlet cavity is opened in the glue dispensing part. The bottom of the glue inlet cavity is connected with the glue outlet cavity. Multiple groups of micro electric push rods are arranged in sequence on the inner side of the glue dispensing part. The spindles of the multiple groups of micro electric push rods are connected to the glue pushing part. One end of the multiple groups of glue pushing parts corresponds to the multiple groups of glue outlet cavities respectively. The multiple groups of glue outlet cavities are provided with the glue dispensing heads at their openings. Multiple groups of heating plates are arranged in a ring shape at one end of the glue dispensing part.

[0006] As a further solution of the present invention, a first slide rail is arranged on the top of the base, the first slide rail is semicircular, two groups of limit members are respectively clamped at both ends of the first slide rail, a driving mechanism is arranged on the top of the first slide rail, a first driving plate is arranged on the top of the driving mechanism, the bottom of the dispensing robot arm is connected to the first driving plate by screws, one end of the dispensing component is connected to the dispensing robot arm by screws, a plurality of groups of detachable fixed covers are arranged on the dispensing component in sequence, a sealing ring is arranged at the opening of the glue inlet cavity, and one end of the glue delivery pipe is clamped in the sealing ring.

[0007] As a further solution of the present invention, two groups of solenoid valves are respectively connected to the bottom of the two groups of glue storage tanks, the top of the relay tank is connected to one of the groups of solenoid valves through a lower rubber hose, a relay cover is provided on the top of the relay tank, a defoaming motor is provided on the top of the relay cover, a shaft seal is provided between the main shaft of the defoaming motor and the relay cover, the main shaft of the defoaming motor passes through the relay cover, the defoaming assembly includes a rotating rod, a spiral blade and an impeller blade, the rotating rod is provided on the main shaft of the defoaming motor, the spiral blade and the impeller blade are provided on the rotating rod in sequence, a plurality of serrated defoaming grooves are provided on the edge of the spiral blade, an air release pipe is provided on the top of the relay tank, a lifting piece is provided in the air release pipe, and an air release cover is provided at one end of the air release pipe.

[0008] As a further solution of the present invention, multiple groups of pin grooves are opened on the top of the packaging table, a placing table is arranged on the top of the base, the bottom of the glue-spreading robot arm is connected to the placing table by screws, a glue pressing part is arranged at one end of the glue-spreading robot arm, and one end of the glue-spreading robot arm is connected to the glue pressing part by screws, a connecting part is arranged at one end of the glue pressing part, the connecting part and the glue pressing part are connected by multiple groups of telescopic springs, a glue-blocking part is arranged at one end of the connecting part, a cylinder is arranged on the top of the mounting plate, a pneumatic rod of the cylinder passes through the mounting plate, a connecting plate is arranged on the pneumatic rod of the cylinder, a glue scraper is arranged on the surrounding side of the connecting plate, the bottom of the glue scraper corresponds to the packaging table, the outer side surface of the glue scraper is blade-shaped, two groups of mounting columns are arranged at intervals at the bottom of the mounting plate, the bottoms of the two groups of mounting columns are inclined, the bottom of one group of the mounting columns is provided with the camera, and the bottom of the other group of the mounting columns is provided with the grid laser emitter.

[0009] As a further scheme of the present invention, the tops of the two groups of glue storage tanks are both provided with detachable glue storage covers, the two groups of glue storage components also include temperature sensors and liquid level sensors, the bottoms of the two groups of glue storage covers are both installed with the temperature sensors and the liquid level sensors, the bottoms of the two groups of liquid level sensors are both provided with liquid level probes, one end of the two groups of glue storage tanks are both provided with transparent plates, one end of the two groups of transparent plates are both provided with multiple groups of liquid level scale grooves, the surfaces of the two groups of glue storage tanks are both provided with multiple groups of card slots, and heat conduction plates are provided in the multiple groups of card slots, the tops of the two groups of glue storage tanks are both provided with glue injection parts, one end of the two groups of glue injection parts are both provided with glue injection grooves, and one end of the two groups of glue injection parts are both provided with two groups of sealing plugs.

[0010] As a further solution of the present invention, multiple groups of heating shells are arranged on the circumference of the two groups of glue storage tanks, and semi-circular arc electric heaters are arranged in the multiple groups of heating shells. The multiple groups of semi-circular arc electric heaters respectively correspond to the multiple groups of heat conduction plates, and thermal insulation pads are arranged between the multiple groups of semi-circular arc electric heaters and the multiple groups of heating shells. A connecting seat is arranged at one end of the multiple groups of heating shells, and a connecting hole is opened at one end of the multiple groups of connecting seats. One end of the multiple groups of semi-circular arc electric heaters is clamped in the connecting hole, and the multiple groups of heating shells A fixing block is provided at the other end, and the other ends of multiple groups of semi-circular arc electric heaters are all clamped in the fixing block, and arc-shaped clamps are provided at one end of multiple groups of fixing blocks, and one end of multiple groups of arc-shaped clamps passes through the fixing block and is clamped in the heating shell, and one end of multiple groups of fixing blocks is connected to the heating shell through a double-headed fixing pin, and disassembly parts are provided on multiple groups of arc-shaped clamps and multiple groups of double-headed fixing pins, and multiple groups of connecting columns are provided at one end of the mounting platform, and one end of multiple groups of connecting columns is connected to the heating shell.

[0011] As a further solution of the present invention, a control box is provided at one end of the mounting platform, the control module and the visual recognition module are both arranged in the control box, an industrial operation panel is provided on the top of the base, multiple groups of fixing parts are provided on both sides of the two groups of glue storage tanks and the relay tank, multiple groups of bidirectional screws are passed through both sides of the mounting platform, one end of the multiple groups of bidirectional screws are provided with rotating parts, two groups of opposite fixing parts are sleeved on the multiple groups of bidirectional screws, a fixed shaft is passed through one end of every two groups of fixing parts, a thread is opened at one end of the multiple groups of fixed shafts, and a screwing part is provided at the other end of the multiple groups of fixed shafts.

[0012] As a further solution of the present invention, a second slide rail is arranged on the top of the base, the second slide rail is circular, and two groups of driving mechanisms are arranged on the top of the second slide rail, one group of the driving mechanisms is arranged on the top of a first driving plate, and the other group of the driving mechanisms is arranged on the top of a second driving plate, the first driving plate is arranged on the top of the glue dispensing robot arm, the second driving plate is arranged on the top of the second driving plate, one end of the glue spreading robot arm is clamped with a glue spreading motor, a glue spreading piece is arranged on the main shaft of the glue spreading motor, glue spreading plates are bonded on both sides of the glue spreading piece, a glue scraping column is arranged on one side of the glue containing groove, a cylinder is arranged on the top of the mounting plate, a pressing piece is arranged on the pneumatic rod of the cylinder, a soft anti-overflow piece is arranged at the bottom of the pressing piece, limiting pieces are arranged on both sides of the first driving plate, and two groups of limiting pieces are clamped in the second slide rail.

[0013] A packaging method for a chip packaging device comprises the following steps: Step 1: Preparation for injection; The glue required for packaging is injected into two sets of glue storage tanks through the glue injection part, the chip substrate to be packaged is placed on the packaging table, and the chip pins are inserted into the pin slots. The external power supply is connected, and the grid laser emitter irradiates the chip substrate with a grid-shaped laser, which is captured by the camera; Step 2: defoaming operation; One set of solenoid valves is opened, allowing the glue to flow from the glue storage tank to the relay tank through the lower glue hose. The debubble motor drives the rotating rod to rotate, thereby rotating the spiral blades and the impeller blades, generating shear force, breaking the bubbles in the glue and separating them from the glue. Step 3: Glue dispensing operation; The glue enters the glue inlet cavity through the glue delivery tube, and the edge grid of the grid laser is recognized by the visual recognition module. The control module controls the dispensing robot arm to move, so that the dispensing head is aligned with the edge grid area of ​​the chip substrate in turn during the dispensing process, and is pushed by the micro electric push rod, so that the dispensing component dispenses glue to the edge grid area one by one; Step 4: Glue application; After the glue is dispensed, the glue-pressing part is driven by the glue-spreading robot arm to align with the chip substrate and press down, so that the glue is spread through the glue-pressing part, and the pneumatic rod of the cylinder is started to move downward, driving the glue-scraping part to scrape off the glue overflowing from the edge of the chip substrate, and the glue falls into the glue-containing groove; Step 5: Installation and maintenance; After the glue is applied, the user can glue and install the chip shell, and perform maintenance and cleaning operations.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the setting of the grid laser transmitter, the grid laser transmitter can irradiate the chip substrate with a grid-shaped laser. Through the setting of the camera, the grid-shaped laser can be captured. After capture, the image information is converted into an electrical signal and transmitted to the visual recognition module. The grid-shaped laser is recognized by the visual recognition module, and then the control module controls the dispensing robot arm to move, so that the dispensing head is aligned with the edge grid area of ​​the chip substrate in turn during the dispensing process, and the electric push rod is used to push the dispensing component to dispense glue to the edge grid area one by one. After the dispensing is completed, the glue spreading robot arm drives the glue pressing part to align with the chip substrate and press it down, so as to spread the glue through the glue pressing part. Then, the cylinder is started, and the pneumatic rod moves downward, driving the glue scraping part to scrape off the glue overflowing from the edge of the chip substrate, thereby improving the gluing effect on the chip substrate.

[0015] 2. When the glue flows from the glue storage tank into the relay tank through the lower glue pipe, the rotation of the main shaft of the debubble motor drives the rotating rod to rotate in the same direction, thereby causing the spiral blade and the impeller blade to rotate. A serrated debubble groove is provided on the edge of the spiral blade. The cooperation of the spiral blade and the serrated debubble groove can generate a strong shear force, thereby breaking the bubbles in the glue and making it float. A radial flow can be generated through the impeller blade, accelerating the floating of the gas, improving the removal effect of the glue bubbles, and thus enhancing the adhesion of the glue.

[0016] 3. Through the setting of the liquid level sensor and the liquid level probe, the glue remaining amount in the glue storage tank can be detected. Through the setting of the temperature sensor, the temperature in the glue storage tank can be detected and can be displayed in real time on the industrial operation panel, which is convenient for users to view intuitively. Through the setting of the semi-circular arc electric heater, the glue storage tank can be heated to prevent the glue in the glue storage hook from solidifying. The device is provided with two groups of glue storage tanks, one of which can be used as a spare. When the glue in one group of glue storage tanks is used up, the user can disassemble the fixed shaft by screwing the screw part, and then rotate the rotating part to make the bidirectional screw rotate, driving the fixed part to move in opposite directions, thereby releasing the fixation of the glue storage tank, and the user can replace it, which improves the convenience of user use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of a chip packaging device according to a first embodiment of the present invention; Figure 2 is an exploded view of a first embodiment of a chip packaging device of the present invention; Figure 3 It is a structural schematic diagram of a packaging station in a chip packaging device of the present invention; Figure 4 It is a structural schematic diagram of a dispensing mechanical arm in a chip packaging device of the present invention; Figure 5 It is a schematic diagram of the structure of a disassembled glue dispensing component in a chip packaging device of the present invention; Figure 6 It is a left view of a dispensing part in a chip packaging device of the present invention; Figure 7 yes Figure 6 Cross-sectional view of CC; Figure 8 It is a structural schematic diagram of a glue spreading mechanical arm in a chip packaging device of the present invention; Fig. 9 It is a structural schematic diagram of a rubber scraping member in a chip packaging device of the present invention; Fig.10 It is a structural schematic diagram of a bidirectional screw and a fixing member in a chip packaging device of the present invention; Fig.11 It is a structural schematic diagram of a glue storage tank and a relay tank in a chip packaging device of the present invention; Fig.12 It is a schematic structural diagram of a chip packaging device of the present invention after a glue storage tank and a glue storage cover are separated; Fig.13 yes Fig.12 Enlarged view of area a in the middle; Fig.14 It is a schematic diagram of the structure of a chip packaging device after the defoaming component is disassembled; Fig.15 yes Fig.14 Enlarged view of area b; Fig.16 It is a schematic diagram of the structure of a chip packaging device of the present invention after the semicircular arc electric heater and the heating shell are separated; Fig.17 It is a structural schematic diagram of a second embodiment of a chip packaging device of the present invention; Fig.18 yes Fig.17 Enlarged view of area c; Fig.19 It is a schematic diagram of the structure after the glue spreading plate and the glue spreading member are separated in the second embodiment of a chip packaging device of the present invention; Fig. 20It is a schematic diagram of the structure after the soft anti-overflow component and the lower pressing component are separated in the second embodiment of a chip packaging device of the present invention; Fig.21 It is a principle block diagram of a control module in a chip packaging device of the present invention; Fig. 22 The present invention is a flowchart of the steps of a packaging method for a chip packaging device.

[0018] In the figure, the corresponding relationship between the component names and the figure numbers is as follows: 100, base; 101, mounting table; 102, glue storage tank; 103, glue storage cover; 104, temperature sensor; 105, liquid level sensor; 106, liquid level probe; 107, transparent plate; 108, liquid level scale groove; 109, glue injection part; 110, glue injection groove; 111, sealing plug; 112, heating shell; 113, semicircular arc electric heater; 114, thermal insulation pad; 115, connecting seat; 116, connecting hole; 117, fixing block; 118, arc clamp; 119, double-head fixing pin; 120, disassembly 121, connecting column; 122, control box; 123, control module; 124, visual recognition module; 125, industrial operation panel; 126, bidirectional screw; 127, rotating part; 128, fixing part; 129, fixed shaft; 130, screwing part; 131, mounting plate; 132, mounting column; 133, camera; 134, grid laser transmitter; 135, cylinder; 136, connecting plate; 137, scraping glue part; 138, packaging platform; 139, pin slot; 140, glue tank; 141, electromagnetic valve; 142, lower rubber hose; 143, relay tank; 144, relay cover; 145, defoaming motor; 146, shaft seal; 147, rotating rod; 148, spiral blade; 149, serrated defoaming groove; 150, impeller blade; 151, vent pipe; 152, lifting part; 153, vent cover; 154, placing table; 155, glue spreading mechanical arm; 156, glue pressing part; 157, connecting part; 158, telescopic spring; 159, glue blocking part; 160, first slide rail; 161, limit part; 162, driving mechanism; 1 63. First drive board; 164. Glue dispensing robot arm; 165. Glue dispensing part; 166. Glue inlet chamber; 167. Glue outlet chamber; 168. Micro electric push rod; 169. Glue pushing part; 170. Glue dispensing head; 171. Heating plate; 172. Sealing ring; 173. Fixed cover; 174. Glue delivery pipe; 175. Heat transfer plate; 201. Second slide rail; 202. Second drive board; 203. Glue spreading motor; 204. Glue spreading part; 205. Glue spreading plate; 206. Pressing part; 207. Soft anti-overflow part; 208. Glue scraping column. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the technical solutions of the present invention, but cannot be used to limit the scope of protection of the present invention.

[0020] Embodiment 1: As shown in the attached Figures 1 to 22 As shown: The present invention provides a chip packaging device, including a base 100 and a mounting platform 101. Two groups of glue storage components are arranged at one end of the mounting platform 101. The two groups of glue storage components include glue storage tanks 102. Users can inject glue into the glue storage tanks 102 to store the glue. The two groups of glue storage tanks 102 are arranged at one end of the mounting platform 101. A grid laser emitter 134 is arranged at the bottom of the mounting plate 131. The grid laser emitter 134 can select the JCP6510Z-011 model of Dongguan Lanyu Laser Co., Ltd., which can emit grid-shaped lasers. The grid laser emitter 134 can irradiate the grid-shaped lasers onto the chip substrate. The grid laser emitter 134 A camera 133 is arranged on one side. The camera 133 can be a CV-X series of Keyence. Through the setting of the camera 133, the grid-shaped laser emitted by the grid laser emitter 134 can be captured, and the image information can be converted into an electrical signal and transmitted to the visual recognition module 124. A control box 122 is arranged at one end of the mounting platform 101. The control module 123 and the visual recognition module 124 are both arranged in the control box 122. The visual recognition module 124 can be a K210 model of Abel Intelligence. This model adopts functional modularization, which eliminates the complicated process of model training and visual algorithm deployment, and is convenient for users to use. Through the setting of the visual recognition module 124, when the electrical signal sent from the camera 133 is received, the visual recognition module 124 can be used. When a signal is received, it is processed, the edge grid area of ​​the grid-shaped laser is screened and sent to the control module 123 in the form of an electrical signal, so that the control module 123 can control the glue spreading robot arm 155 and the glue dispensing robot arm 164 to make corresponding actions. The control module 123 can use the SOM-TL3588F model of Guangzhou Chuanglong Electronic Technology Co., Ltd., and the top of the base 100 is provided with a glue dispensing robot arm 164 and a glue spreading robot arm 155. The glue dispensing robot arm 164 and the glue spreading robot arm 155 can both use the UR3e model of Universal Robot Trading (Shanghai) Co., Ltd., which occupies a small area and is more flexible. The glue dispensing robot arm 164 can drive the glue dispensing component to the edge of the grid-shaped laser. The edge grid area can be driven by the glue applying robot arm 155 to move the glue pressing part 156 to the corresponding position. A glue applying component is arranged at one end of the glue applying robot arm 164. Through the arrangement of the glue applying component, the edge grid area of ​​the chip substrate irradiated by the grid-shaped laser can be glued. A packaging platform 138 is arranged on the top of the base 100. A plurality of pin grooves 139 are arranged on the top of the packaging platform 138. The user can place the chip substrate on the packaging platform 138 and insert the pins of the chip substrate into the pin grooves 139. A glue containing groove 140 is arranged on the side of the packaging platform 138. The glue containing groove 140 is used to contain the glue dropped after the glue applying operation. After completing the glue applying operation on the chip substrate, the user can clean the glue containing groove 140.

[0021] Among them, see Figure 2 , Figure 4, Figure 5 , Figure 6 and Figure 7 As shown, the dispensing assembly includes a dispensing member 165, a plurality of groups of dispensing members 169 and a plurality of groups of dispensing heads 170. The dispensing member 165 is arranged at one end of a dispensing mechanical arm 164. The dispensing member 165 is inserted into one end of the dispensing mechanical arm 164 and connected to the dispensing mechanical arm 164 by screws. A plurality of groups of dispensing cavities 167 are provided in the dispensing member 165. A dispensing cavity 166 is provided in the dispensing member 165. The bottom of the dispensing cavity 166 is connected to the dispensing cavity 167. When the glue flows into the dispensing cavity 166 through the glue delivery pipe 174, the glue is then dispensed. The glue dispensing part 165 is provided with a plurality of micro electric push rods 168 on the inner side thereof, and the micro electric push rods 168 can be selected from the LA10-021D model of Beijing Inshi Robot Technology Co., Ltd. The micro electric push rods 168 are electrically connected to the control module 123, and the spindles of the plurality of micro electric push rods 168 are all connected with a pusher 169. Under the push of the spindle of the micro electric push rod 168, the pusher 169 can push the glue out of the glue dispensing cavity 167, and when the pusher 169 is pushed by the micro electric push rod 168, the glue is pushed out of the glue dispensing cavity 167. When the glue inlet cavity 166 and the glue outlet cavity 167 are in motion, the connection between the glue outlet cavity 167 and another group of glue outlet cavities 167 can be blocked to prevent the glue from flowing into the micro electric push rod 168 when the micro electric push rod 168 spindle is pushed, causing damage to the micro electric push rod 168. The user can set the start sequence and start delay of multiple groups of micro electric push rods 168 through the control module 123 to ensure that the glue inlet cavity 166 is filled with glue before the glue is pushed out, thereby reducing the error of the glue amount during each dispensing. One end of the dispensing member 165 corresponds to a plurality of glue outlet cavities 167, and a dispensing head 170 is arranged at the opening of each of the plurality of glue outlet cavities 167. One end of the dispensing head 170 close to the glue outlet cavity 167 is larger than the other end. A plurality of heating plates 171 are arranged in a ring shape at one end of the dispensing member 165. The arrangement of the heating plates 171 can prevent the dispensing head 170 from being blocked by solidified glue when the user does not use the device for a long time or clean it. The heating plates 171 can melt the solidified glue into liquid, thereby unblocking the dispensing head 170.

[0022] Among them, see Figure 2 , Figure 3 and Figure 4As shown, a first slide rail 160 is arranged on the top of the base 100, and the first slide rail 160 is semicircular. The first slide rail 160 is arranged in a semicircular shape to prevent the driving mechanism 162 from falling off from the glue dispensing robot arm 164 due to the insufficient length of the glue delivery tube 174 when the driving mechanism 162 drives the glue dispensing robot arm 164 to move. The first slide rail 160 is arranged in a semicircular shape, which is sufficient to enable the glue dispensing robot arm 164 to drive the glue dispensing component to perform glue dispensing operation on the chip substrate. Two sets of limit members 161 are respectively arranged at both ends of the first slide rail 160, and the limit members 161 can prevent the driving mechanism 162 from sliding out of the first slide rail 160. A driving mechanism 162 is provided on the top of the first slide rail 160. The driving mechanism 162 is electrically connected to the control module 123. The control module 123 can control the driving mechanism 162 to move. A first driving plate 163 is provided on the top of the driving mechanism 162. The first driving plate 163 can be driven to move by the driving mechanism 162. The bottom of the dispensing robot arm 164 is connected to the first driving plate 163 by screws. A plurality of groups of detachable fixed covers 173 are sequentially provided on the dispensing component 165. A sealing ring 172 is provided at the opening of the glue inlet cavity 166. One end of the glue delivery tube 174 is clamped in the sealing ring 172.

[0023] Among them, see Figure 2 , Figure 3 , Figure 8 and Fig. 9As shown, a placing platform 154 is arranged on the top of the base 100, and the placing platform 154 is used to install a glue spreading robot arm 155. The bottom of the glue spreading robot arm 155 is connected to the placing platform 154 by screws. A glue pressing piece 156 is arranged at one end of the glue spreading robot arm 155, and the glue can be pressed and spread by the glue pressing piece 156. One end of the glue pressing piece 156 is clamped at one end of the glue spreading robot arm 155 and connected by screws. A connecting piece 157 is arranged at one end of the glue pressing piece 156. The connecting piece 157 and the glue pressing piece 156 are connected by multiple groups of telescopic springs 158. A glue blocking piece 159 is arranged at one end of the connecting piece 157 to prevent damage to the chip substrate. The glue blocking piece 159 can prevent the glue from flowing into the center of the chip substrate during the pressing process. A cylinder 135 is arranged on the top of the mounting plate 131. The cylinder 135 is electrically connected to the control module 123. The air of the cylinder 135 The movable rod passes through the mounting plate 131, and a connecting plate 136 is arranged on the pneumatic rod of the cylinder 135. A scraper 137 is arranged around the connecting plate 136. The bottom of the scraper 137 corresponds to the packaging platform 138, and the outer side of the scraper 137 is in the shape of a blade. After the dispensing and pressing operation of the chip substrate is completed, the pneumatic rod of the cylinder 135 drives the connecting plate 136 to move downward, and scrapes the overflow glue on the edge of the chip substrate during the pressing process through the scraper 137. The scraper 137 is in the shape of a blade and can scrape the overflow glue into the glue containing groove 140. The glue blocking member 159 and the scraper 137 can be made of soft materials to prevent damage to the chip substrate. Two groups of mounting columns 132 are arranged at intervals at the bottom of the mounting plate 131. The bottoms of the two groups of mounting columns 132 are inclined. A camera 133 is arranged at the bottom of one group of mounting columns 132, and a grid laser transmitter 134 is arranged at the bottom of the other group of mounting columns 132.

[0024] Among them, see Figure 2 and Figures 11 to 15As shown, two groups of solenoid valves 141 are respectively connected to the bottom of the two groups of glue storage tanks 102, the top of the relay tank 143 is connected to one of the groups of solenoid valves 141 through a lower glue pipe 142, a relay cover 144 is arranged on the top of the relay tank 143, a defoaming motor 145 is arranged on the top of the relay cover 144, a shaft seal 146 is arranged between the main shaft of the defoaming motor 145 and the relay cover 144, the shaft seal 146 can prevent the glue in the relay tank 143 from overflowing, the main shaft of the defoaming motor 145 passes through the relay cover 144, the defoaming component includes a rotating rod 147, a spiral piece 148 and an impeller piece 150, the rotating rod 147 is arranged on the main shaft of the defoaming motor 145, the spiral piece 148 and the impeller piece 150 are arranged on the rotating rod 147 in sequence, a plurality of groups of serrated defoaming grooves 149 are arranged on the edge of the spiral piece 148, when the main shaft of the defoaming motor 145 rotates, the rotating rod 147 is driven to rotate The spiral blade 148 and the impeller blade 150 rotate in the same direction, and a serrated defoaming groove 149 is provided on the edge of the spiral blade 148. The cooperation between the spiral blade 148 and the serrated defoaming groove 149 can generate a strong shear force, thereby breaking the bubbles in the glue and making it float up. The impeller blade 150 can generate a radial flow, accelerate the floating of the gas, and improve the removal effect of the glue bubbles, thereby enhancing the adhesion of the glue. A vent pipe 151 is provided on the top of the relay tank 143, and a lifting piece 152 is provided in the vent pipe 151. A vent cover 153 is provided at one end of the vent pipe 151. When there is too much gas inside the relay tank 143, the lifting piece 152 moves downward, so that the gas can flow out through the vent pipe 151 through the gap between the lifting piece 152 and the vent pipe 151, and then be discharged through the holes in the vent cover 153.

[0025] Among them, see Figure 2 , Fig.12 and Fig.13As shown, an industrial operation panel 125 is arranged on the top of the base 100. The industrial operation panel 125 can be selected from the IDP-C170 model of Beilian Display Technology Co., Ltd. The industrial operation panel 125 is electrically connected to the control module 123. A detachable glue storage cover 103 is arranged on the top of the two sets of glue storage tanks 102. The two sets of glue storage components also include a temperature sensor 104 and a liquid level sensor 105. The temperature sensor 104 can be selected from the OS137-1-V1 model of OMEGA, Hangzhou Miko Sensing Technology Co., Ltd. Co., Ltd.'s MIK-RD70 model, the temperature sensor 104 and the liquid level sensor 105 are electrically connected to the control module 123, the temperature sensor 104 and the liquid level sensor 105 are installed at the bottom of the two sets of glue storage covers 103, through the setting of the temperature sensor 104, the temperature in the glue storage tank 102 can be detected, and the temperature value can be converted into an electrical signal and sent to the control module 123, and the liquid level probe 106 is provided at the bottom of the two sets of liquid level sensors 105. 06, the glue remaining in the glue storage tank 102 can be detected, and the liquid level value can be converted into an electrical signal and sent to the control module 123. The control module 123 can send the temperature value and the liquid level value to the industrial operation panel 125 in the form of an electrical signal, so that the industrial operation panel 125 can display the temperature value and the liquid level value, which is convenient for users to view intuitively. A transparent plate 107 is provided at one end of the two sets of glue storage tanks 102, and a plurality of liquid level scale grooves 108 are provided at one end of the two sets of transparent plates 107. Users can also The glue in the glue tank 102 is compared with the liquid level scale groove 108 to obtain the remaining glue. Glue injection parts 109 are provided on the top of the two groups of glue storage tanks 102. Glue injection grooves 110 are opened at one end of the two groups of glue injection parts 109. Two groups of sealing plugs 111 are provided at one end of the two groups of glue injection parts 109. Users can pull the sealing plugs 111 out of the glue injection parts 109 and inject glue into the glue storage tanks 102 through external pipelines. Through the setting of the glue injection grooves 110, the connection between the external pipeline and the glue injection parts 109 can be made tighter.

[0026] Among them, see Figure 2 , Fig.12 , Fig.13 and Fig.16As shown, the surfaces of the two groups of glue storage tanks 102 are provided with multiple groups of card slots, and the multiple groups of card slots are provided with heat conducting plates 175. The sides of the two groups of glue storage tanks 102 are provided with multiple groups of heating shells 112, and the multiple groups of heating shells 112 are provided with semi-circular arc electric heaters 113. The multiple groups of semi-circular arc electric heaters 113 correspond to the multiple groups of heat conducting plates 175 respectively. Through the cooperation of the semi-circular arc electric heaters 113 and the heat conducting plates 175, the glue storage tanks 102 can be heated to prevent the glue inside them from solidifying. A heat insulating pad 114 is provided between the device 113 and the multiple groups of heating shells 112. The heat insulating pad 114 can keep one side of the heating shell 112 at a low temperature to prevent the user from accidentally touching the heating shell 112 and getting burned. A connecting seat 115 is provided at one end of the multiple groups of heating shells 112. A connecting hole 116 is provided at one end of the multiple groups of connecting seats 115. One end of the multiple groups of semi-circular arc electric heaters 113 is clamped in the connecting hole 116. The connecting seat 115 is electrically connected to the control module 123, and the semi-circular arc electric heaters are connected through the connecting hole 116. The multiple sets of semicircular arc electric heaters 113 are powered by the multiple sets of heating shells 112, and the other ends of the multiple sets of semicircular arc electric heaters 113 are all clamped in the fixing blocks 117. The multiple sets of fixing blocks 117 are all provided with arc clamps 118 at one end. The multiple sets of arc clamps 118 pass through the fixing blocks 117 and are clamped in the heating shell 112. The multiple sets of fixing blocks 117 are connected to the heating shell 112 at one end through double-headed fixing pins 119. The multiple sets of arc clamps 118 and the multiple sets of double-headed fixing pins 119 are provided with Disassembly part 120, multiple groups of connecting columns 121 are set at one end of the mounting platform 101, and one end of the multiple groups of connecting columns 121 are connected to the heating shell 112. The user can insert the hole on one side of the fixing block 117 into one end of the semi-circular arc electric heater 113, and then insert the arc clamp 118 into the fixing block 117 and the heating shell 112. The fixing block 117 and the heating shell 112 are fixed by passing the double-headed fixing pin 119 through the fixing block 117 and the heating shell 112 and inserting it into the arc clamp 118.

[0027] Among them, see Figure 2 and Fig.10As shown, multiple sets of fixing members 128 are arranged on both sides of the two sets of glue storage tanks 102 and the relay tank 143, and the glue storage tanks 102 and the relay tank 143 are fixed by the fixing members 128. Multiple sets of bidirectional screws 126 are penetrated on both sides of the mounting platform 101, and a rotating member 127 is arranged at one end of the multiple sets of bidirectional screws 126. Two sets of opposite fixing members 128 are sleeved on the multiple sets of bidirectional screws 126, and a fixing shaft 129 is penetrated at one end of each two sets of fixing members 128, and a thread is opened at one end of the multiple sets of fixing shafts 129. A screw part 130 is provided at the other end of the fixed shaft 129. The user can use one group of glue storage tanks 102 as a spare. When the glue in one group of glue storage tanks 102 is used up, the user can disassemble the fixed shaft 129 by screwing the screw part 130, and then rotate the rotating part 127 to rotate the bidirectional screw 126, driving the fixing part 128 to move in opposite directions, thereby releasing the fixation of the glue storage tank 102, and the user can replace it. When using the device, the convenience of the user is improved.

[0028] A packaging method for a chip packaging device comprises the following steps: Step 1: Preparation for injection; The glue required for packaging is injected into the two sets of glue storage tanks 102 through the glue injection part 109, the chip substrate to be packaged is placed on the packaging platform 138, and the chip pins are inserted into the pin slots 139, and the external power supply is connected. The grid laser emitter 134 irradiates the chip substrate with a grid laser, and the grid laser is captured by the camera 133; Step 2: defoaming operation; One set of solenoid valves 141 is opened, so that the glue flows from the glue storage tank 102 to the relay tank 143 through the lower glue pipe 142, and the debubbling motor 145 drives the rotating rod 147 to rotate, so that the spiral blade 148 and the impeller blade 150 rotate, generating shear force, breaking the bubbles in the glue and making them separate from the glue; Step 3: Glue dispensing operation; The glue enters the glue inlet cavity 166 through the glue delivery tube 174, and the edge grid of the grid laser is identified by the visual recognition module 124, and the result is sent to the control module 123 in the form of an electrical signal. The control module 123 controls the driving mechanism 162 to drive the dispensing robot arm 164 to move, so that the dispensing head 170 is aligned with the edge grid area of ​​the chip substrate in sequence during the dispensing process, and is pushed by the micro electric push rod 168, so that the dispensing component dispenses glue to the edge grid area one by one; Step 4: Glue application; After the glue is dispensed, the glue pressing member 156 is driven by the glue spreading robot arm 155 to align with the chip substrate and press down, so that the glue is spread by the glue pressing member 156. Then, the control module 123 controls the cylinder 135 to start, and the pneumatic rod moves downward, driving the glue scraping member 137 to scrape off the glue overflowing from the edge of the chip substrate, and the glue falls into the glue containing groove 140. Step 5: Installation and maintenance; After the glue is applied, the user can perform bonding and installation of the chip shell. After installation, the user can perform maintenance and cleaning on the device, such as cleaning the overflowed glue in the glue groove 140 to prevent the glue in the glue groove 140 from overflowing from the glue groove 140 and preventing the device from being affected in use due to the solidification of the glue.

[0029] Embodiment 2: Based on the chip packaging device provided in Embodiment 1 of the present application, Embodiment 2 of the present application proposes a chip packaging device. Embodiment 2 is only a preferred embodiment of Embodiment 1, and the implementation of Embodiment 2 will not affect the independent implementation of Embodiment 1. Embodiment 2 of the present invention will be further described below.

[0030] Please refer to Figures 17 to 20 As shown, a second slide rail 201 is arranged on the top of the base 100, and the second slide rail 201 is circular. Two groups of driving mechanisms 162 are arranged on the top of one group of driving mechanisms 162, and a first driving plate 163 is arranged on the top of the other group of driving mechanisms 162, and a second driving plate 202 is arranged on the top of the first driving plate 163. A glue-spraying mechanical arm 164 is arranged on the top of the first driving plate 163, and a glue-spreading mechanical arm 155 is arranged on the top of the second driving plate 202. A glue-spreading motor 203 is clamped at one end of the glue-spreading mechanical arm 155, and a glue-spreading member 204 is arranged on the main shaft of the glue-spreading motor 203. Glue-spreading plates 205 are bonded on both sides of the glue-spreading member 204. The glue for dispensing glue on the chip can be applied through the glue-spreading plate 205. Soft materials can be selected for the glue-spreading plate 205 to prevent damage to the chip substrate. Damage, a scraper column 208 is provided on one side of the glue containing groove 140, and the glue on the glue spreading plate 205 can be scraped by the scraper column 208, and a cylinder 135 is provided on the top of the mounting plate 131, and a pressing piece 206 is provided on the pneumatic rod of the cylinder 135, and a soft anti-overflow component 207 is provided at the bottom of the pressing piece 206. The setting of the soft anti-overflow component 207 can prevent the glue spreading plate 205 from overflowing to the center of the chip substrate during the smearing process, and limiting components 161 are provided on both sides of the first driving plate 163, and two groups of limiting components 161 are both clamped in the second slide rail 201, and the two groups of limiting components 161 are close to the dispensing robot arm 164, which limits the dispensing robot arm 164 and the glue spreading robot arm 155 to prevent the dispensing robot arm 164 from colliding with the glue spreading robot arm 155.

[0031] Compared with the method of pressing and scraping with the glue pressing part 156 and the glue scraping part 137 in the first embodiment, the second embodiment has a glue spreading motor 203 clamped at one end of the glue spreading robot arm 155. Through the cooperation of the glue spreading motor 203 and the glue spreading robot arm 155, the angle of the glue spreading part 204 can be adjusted, so that the glue spreading plate 205 can better spread the glue on the chip substrate. The main difference is that the glue on the chip substrate can be spread more evenly, and after spreading, the glue spreading motor 203 and the glue spreading robot arm 155 can still be used to control the glue spreading plate 205 to scrape off the glue overflowing from the edge of the chip substrate. Therefore, compared with the method of pressing and scraping with the glue pressing part 156 and the glue scraping part 137, the glue spreading plate 205 can be used to spread the glue on the chip substrate more evenly, thereby further improving the gluing effect. The other conditions are consistent with those in the first embodiment, so this embodiment will not be repeated.

[0032] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. A chip packaging device, comprising a base and a mounting platform, characterized in that: Two groups of glue storage components are arranged at one end of the mounting platform (101), and both groups of glue storage components include glue storage tanks (102). Both groups of glue storage tanks (102) are arranged at one end of the mounting platform (101), and a relay tank (143) is arranged at the bottom of one group of glue storage tanks (102), and a glue delivery pipe (174) is arranged at the bottom of the relay tank (143). A defoaming component is arranged in the relay tank (143), and a mounting plate (131) is arranged at one side of the relay tank (143), and a A grid laser emitter (134), a camera (133) is arranged on one side of the grid laser emitter (134), a control module (123) and a visual recognition module (124) are arranged on one side of one group of the glue storage components, a glue dispensing robot arm (164) and a glue spreading robot arm (155) are arranged on the top of the base (100), a glue dispensing component is arranged at one end of the glue dispensing robot arm (164), a packaging platform (138) is arranged on the top of the base (100), and a glue storage groove (140) is opened on the surrounding side of the packaging platform (138).

2. The chip packaging device according to claim 1, characterized in that: The dispensing assembly comprises a dispensing member (165), a plurality of groups of dispensing members (169) and a plurality of groups of dispensing heads (170). The dispensing member (165) is arranged at one end of the dispensing robot arm (164). A plurality of groups of dispensing cavities (167) are provided in the dispensing member (165). A dispensing member (165) is provided with a dispensing inlet cavity (166). The bottom of the dispensing inlet cavity (166) is connected to the dispensing cavity (167). Multiple groups of micro electric push rods (168) are sequentially arranged on the inner side surface of the multiple groups of micro electric push rods (168), the main shafts of the multiple groups of micro electric push rods (168) are connected to the glue pushing parts (169), one end of the multiple groups of glue pushing parts (169) respectively corresponds to the multiple groups of glue outlet cavities (167), and the openings of the multiple groups of glue outlet cavities (167) are each provided with the glue dispensing head (170), and one end of the glue dispensing part (165) is provided with multiple groups of heating plates (171) in a ring shape.

3. The chip packaging device according to claim 2, characterized in that: A first slide rail (160) is arranged on the top of the base (100), the first slide rail (160) is semicircular, two groups of limit members (161) are respectively clamped at both ends of the first slide rail (160), a driving mechanism (162) is arranged on the top of the first slide rail (160), a first driving plate (163) is arranged on the top of the driving mechanism (162), the bottom of the glue dispensing robot arm (164) is connected to the first driving plate (163) by screws, one end of the glue dispensing component (165) is connected to the glue dispensing robot arm (164) by screws, and a plurality of groups of detachable fixed covers (173) are sequentially arranged on the glue dispensing component (165), a sealing ring (172) is arranged at the opening of the glue inlet cavity (166), and one end of the glue delivery pipe (174) is clamped in the sealing ring (172).

4. The chip packaging device according to claim 1, characterized in that: The bottoms of the two groups of glue storage tanks (102) are respectively connected to two groups of solenoid valves (141); the top of the relay tank (143) is connected to one of the groups of solenoid valves (141) via a lower glue pipe (142); a relay cover (144) is provided on the top of the relay tank (143); a defoaming motor (145) is provided on the top of the relay cover (144); a shaft seal (146) is provided between the main shaft of the defoaming motor (145) and the relay cover (144); the main shaft of the defoaming motor (145) passes through the relay cover (144); the defoaming component comprises A rotating rod (147), a spiral blade (148) and an impeller blade (150); the rotating rod (147) is arranged on the main shaft of the defoaming motor (145); the spiral blade (148) and the impeller blade (150) are arranged in sequence on the rotating rod (147); a plurality of groups of sawtooth defoaming grooves (149) are provided on the edge of the spiral blade (148); a degassing pipe (151) is arranged on the top of the relay tank (143); a lifting member (152) is arranged in the degassing pipe (151); and a degassing cover (153) is arranged at one end of the degassing pipe (151).

5. The chip packaging device according to claim 1, characterized in that: The top of the packaging platform (138) is provided with a plurality of pin grooves (139); the top of the base (100) is provided with a placement platform (154); the bottom of the glue-applying mechanical arm (155) is connected to the placement platform (154) by screws; one end of the glue-applying mechanical arm (155) is provided with a glue pressing piece (156); one end of the glue-applying mechanical arm (155) is connected to the glue pressing piece (156) by screws; one end of the glue pressing piece (156) is provided with a connecting piece (157); the connecting piece (157) and the glue pressing piece (156) are connected by a plurality of telescopic springs (158); one end of the connecting piece (157) is provided with a glue blocking piece (159); the top of the mounting plate (131) is provided with a A cylinder (135) is arranged, the pneumatic rod of the cylinder (135) passes through the mounting plate (131), a connecting plate (136) is arranged on the pneumatic rod of the cylinder (135), a rubber scraper (137) is arranged on the peripheral side of the connecting plate (136), the bottom of the rubber scraper (137) corresponds to the packaging platform (138), the outer side of the rubber scraper (137) is in the shape of a blade, two groups of mounting columns (132) are arranged at intervals at the bottom of the mounting plate (131), the bottoms of the two groups of mounting columns (132) are both inclined, the bottom of one group of the mounting columns (132) is provided with the camera (133), and the bottom of the other group of the mounting columns (132) is provided with the grid laser emitter (134).

6. The chip packaging device according to claim 1, characterized in that: The tops of the two groups of glue storage tanks (102) are both provided with detachable glue storage covers (103), the two groups of glue storage components also include a temperature sensor (104) and a liquid level sensor (105), the bottoms of the two groups of glue storage covers (103) are both installed with the temperature sensor (104) and the liquid level sensor (105), the bottoms of the two groups of liquid level sensors (105) are both provided with liquid level probes (106), and one end of the two groups of glue storage tanks (102) is provided with a transparent plate. (107), a plurality of liquid level scale grooves (108) are provided at one end of the two groups of transparent plates (107), a plurality of card slots are provided on the surface of the two groups of glue storage tanks (102), a heat conducting plate (175) is provided in each of the plurality of card slots, a glue injection piece (109) is provided on the top of the two groups of glue storage tanks (102), a glue injection groove (110) is provided at one end of the two groups of glue injection pieces (109), and two groups of sealing plugs (111) are provided at one end of the two groups of glue injection pieces (109).

7. The chip packaging device according to claim 6, characterized in that: Multiple groups of heating shells (112) are arranged on the circumference of the two groups of glue storage tanks (102), and semi-circular arc electric heaters (113) are arranged in the multiple groups of heating shells (112). The multiple groups of semi-circular arc electric heaters (113) correspond to the multiple groups of heat conducting plates (175) respectively. Insulation pads (114) are arranged between the multiple groups of semi-circular arc electric heaters (113) and the multiple groups of heating shells (112). A connecting seat (115) is arranged at one end of the multiple groups of heating shells (112), and a connecting hole (116) is opened at one end of the multiple groups of connecting seats (115). One end of the multiple groups of semi-circular arc electric heaters (113) is clamped in the connecting hole (116), and the other end of the multiple groups of heating shells (112) is provided with a fixing block ( 117), the other ends of multiple groups of the semicircular arc electric heaters (113) are all clamped in the fixing block (117), one ends of multiple groups of the fixing blocks (117) are all provided with arc clamps (118), one ends of multiple groups of the arc clamps (118) pass through the fixing block (117) and are clamped in the heating shell (112), one ends of multiple groups of the fixing blocks (117) are all connected to the heating shell (112) through double-headed fixing pins (119), disassembly parts (120) are provided on multiple groups of the arc clamps (118) and multiple groups of the double-headed fixing pins (119), and one end of the mounting platform (101) is provided with multiple groups of connecting columns (121), and one ends of multiple groups of the connecting columns (121) are all connected to the heating shell (112).

8. The chip packaging device according to claim 1, characterized in that: A control box (122) is arranged at one end of the mounting platform (101), the control module (123) and the visual recognition module (124) are both arranged in the control box (122), an industrial operation panel (125) is arranged on the top of the base (100), a plurality of sets of fixing parts (128) are arranged on both sides of the two sets of glue storage tanks (102) and the relay tank (143), a plurality of sets of bidirectional screws (126) are passed through both sides of the mounting platform (101), a rotating part (127) is arranged at one end of the plurality of sets of bidirectional screws (126), two sets of opposite fixing parts (128) are sleeved on the plurality of sets of bidirectional screws (126), a fixing shaft (129) is passed through one end of each of the two sets of fixing parts (128), a thread is provided at one end of the plurality of sets of fixing shafts (129), and a screwing part (130) is arranged at the other end of the plurality of sets of fixing shafts (129).

9. The chip packaging device according to claim 1, characterized in that: A second slide rail (201) is arranged on the top of the base (100), the second slide rail (201) is circular, two groups of driving mechanisms (162) are arranged on the top of the second slide rail (201), a first driving plate (163) is arranged on the top of one group of driving mechanisms (162), a second driving plate (202) is arranged on the top of the other group of driving mechanisms (162), the glue dispensing robot arm (164) is arranged on the top of the first driving plate (163), the glue spreading robot arm (155) is arranged on the top of the second driving plate (202), and a glue spreading motor (203) is clamped on one end of the glue spreading robot arm (155). 03), a glue spreading piece (204) is arranged on the main shaft of the glue spreading motor (203), glue spreading plates (205) are bonded to both sides of the glue spreading piece (204), a glue scraping column (208) is arranged on one side of the glue containing groove (140), a cylinder (135) is arranged on the top of the mounting plate (131), a pressing piece (206) is arranged on the pneumatic rod of the cylinder (135), a soft anti-overflow piece (207) is arranged at the bottom of the pressing piece (206), and limiting pieces (161) are arranged on both sides of the first driving plate (163), and two groups of limiting pieces (161) are both clamped in the second slide rail (201).

10. A chip packaging method according to any one of claims 1 to 9, characterized in that: The following steps are included: Step 1: Preparation for glue injection; Glue required for encapsulation is injected into two groups of glue storage tanks (102) through a glue injection part (109), a chip substrate to be encapsulated is placed on a packaging platform (138), and chip pins are inserted into pin slots (139), an external power supply is connected, a grid laser emitter (134) irradiates a grid-shaped laser onto the chip substrate, and the grid-shaped laser is captured by a camera (133); Step 2: defoaming operation; One set of solenoid valves (141) is opened, so that glue flows from the glue storage tank (102) through the lower glue pipe (142) into the relay tank (143), and the debubbling motor (145) drives the rotating rod (147) to rotate, thereby causing the spiral blade (148) and the impeller blade (150) to rotate, thereby generating shear force, breaking the bubbles in the glue and causing them to separate from the glue; Step 3: Glue dispensing operation; The glue enters the glue inlet cavity (166) through the glue delivery tube (174), and the edge grid of the grid laser is identified by the visual recognition module (124). The control module (123) controls the glue dispensing robot arm (164) to move, so that the glue dispensing head (170) is aligned with the edge grid area of ​​the chip substrate in sequence during the glue dispensing process, and is pushed by the micro electric push rod (168), so that the glue dispensing component dispenses glue to the edge grid area one by one; Step 4: Glue application; After the glue dispensing is completed, the glue pressing member (156) is driven by the glue spreading mechanical arm (155) to align with the chip substrate and press downward, so that the glue is spread by the glue pressing member (156), and the pneumatic rod of the cylinder (135) is started to move downward, driving the glue scraping member (137) to scrape off the glue overflowing from the edge of the chip substrate, and the glue falls into the glue containing groove (140); Step 5: Installation and maintenance; After the glue is applied, the user can glue and install the chip shell, and perform maintenance and cleaning operations.

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