Laser manufacturing method of diamond cutter wheel

Abstract

The invention discloses a laser manufacturing method of a diamond cutter wheel. The laser manufacturing method comprises the following steps: S1, cutting a diamond sheet from a diamond; s2, a required diamond ring sheet is arranged on the diamond thin sheet; s3, the diamond ring piece is trimmed; and S4, the diamond ring piece is fixed to the cutter base body. On diamonds in the same unit area, a plurality of diamond sheets can be cut, so that a plurality of diamond cutters can be manufactured, and the thickness of the diamond sheets is relatively thin, so that when cutting edges of the diamond sheets need to be trimmed, few diamond wastes are generated in the trimming process, and the trimming efficiency is improved. The production cost can be reduced, meanwhile, diamond waste generated in the machining process is reduced, and the output ratio is increased.

Description

Technical Field

[0001] The invention relates to the technical field of diamond cutting, and in particular to a laser manufacturing method of a diamond cutter wheel. Background Art

[0002] Diamond plays an irreplaceable role in the field of hard and brittle material processing due to its excellent properties such as high hardness, high wear resistance, and high thermal conductivity. With the rise of artificial diamond technology, the widespread application of diamond tools has been further promoted. At present, diamond tools of various shapes and sizes play an important role in many fields, such as aerospace, automobile manufacturing, electronic information, stone processing, etc. The current production of polycrystalline diamond blades / cutting wheels requires cutting materials from diamonds. Since the cutter ring is of a special shape, it is bound to lead to waste of raw materials.

[0003] For example, the publication number "CN110154252A" discloses a "method for manufacturing a diamond cutter wheel", which presets the thickness, cutter wheel diameter, cutter wheel hole diameter, chamfer size and cutter wheel surface size of the diamond cutter wheel; grinds a diamond raw material having two parallel side surfaces to the thickness, and processes a cutter wheel center hole perpendicular to the side surfaces and penetrating the diamond raw material on the diamond raw material; processes the inner wall of the cutter wheel center hole with the central axis of the cutter wheel center hole as the axis to form the cutter wheel hole with the same size as the cutter wheel hole diameter, and processes the diamond raw material along the thickness direction to form a cylindrical cutter wheel. A rough cutter wheel blank, wherein the diameter of the rough cutter wheel blank is larger than the diameter of the cutter wheel, and the cutter wheel hole is located at the center of the rough cutter wheel blank; the edges on both sides of the cutter wheel hole are chamfered to form a chamfered portion, and the size of the chamfered portion is consistent with the chamfered size; the two ends of the rough cutter wheel blank are processed to form two symmetrical protruding surfaces, each of the protruding surfaces includes an annular surface, a conical surface, and a cutter wheel surface arranged in sequence from the inside to the outside along the outer side of the cutter wheel hole, and the edges of the two cutter wheel surfaces of the protruding surface are merged and connected, and each of the cutter wheel surfaces is provided with a cutting edge at the merged edge, and the cutting edges of the two cutter wheel surfaces are combined to form a cutter wheel cutting edge. However, in actual applications, since it adopts the method of taking materials from thick diamond sheets to make diamond cutter wheels, the output of diamonds is relatively low, more waste is generated in the subsequent processing process, and the production cost is high. Summary of the invention

[0004] In view of the problems of low diamond output and high waste in the prior art mentioned in the background technology, the present invention provides a laser production method for a diamond wheel, which can improve the output ratio of diamonds, reduce the proportion of waste generated during the processing, and reduce processing costs.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions.

[0006] A laser manufacturing method for a diamond cutter wheel comprises the following steps: S1, cutting diamond slices from diamond; S2, cutting the required diamond ring slices from the diamond slice; S3, trimming the diamond ring piece; S4. Fix the diamond ring on the tool base.

[0007] In the present application, diamond is first cut into diamond slices, the diamond slices are cut to form diamond ring slices, and then the diamond ring slices are installed and integrated with the tool base. The connection between the tool base and the diamond ring slices includes but is not limited to welding, so that the cutting part of the entire tool is still the diamond material, and the rest is the material of the tool base, wherein the material of the tool base is a high-hardness material, including but not limited to cemented carbide, high-hardness ceramics, etc., so that the composition of the entire diamond tool includes high-hardness material and diamond. Since diamond material is only used in the cutting part, and the cutting part requires a thinner cutting edge, a thinner diamond material can be selected for processing, and the tool base part can be provided with more cemented carbide to improve the overall strength and connection stability. Therefore, in the present application, the diamond can be firstly cut into a plurality of diamond slices, wherein the thickness of the diamond slices is between 0.01 mm and 0.3 mm; whereas in the prior art, due to the direct use of an integral diamond tool, only one diamond block can be cut from the thick diamond slice, and then the diamond block is processed and trimmed as a whole to obtain a diamond tool. Since in the present application, a plurality of diamond slices can be cut from the same unit area of ​​diamond, compared with the cutting method in the prior art, on the same unit area of ​​diamond, on the present application, a plurality of diamond slices can be cut, and therefore a plurality of diamond tools can be manufactured, whereas in the prior art, only one diamond tool can be cut from the same unit area of ​​diamond. Furthermore, since the trimming of the diamond ring piece of the present application is based on the diamond thin slice, the thickness of the diamond thin slice itself is relatively thin, so when the blade of the diamond thin slice needs to be trimmed, the diamond waste generated during the trimming process is also less, while in the prior art, when the entire diamond block needs to be trimmed, since the thickness of the diamond block is relatively thick, the waste generated by cutting during the trimming process is also more, resulting in a waste of diamond material. Therefore, the present application can reduce production costs, while reducing the diamond waste generated during the processing process, and improving the output ratio.

[0008] Preferably, in step S2, a plurality of inner and outer adjacent diamond ring pieces are cut on the diamond sheet. In step S2, the present application further improves the utilization rate of diamond, wherein the diameters of the plurality of inner and outer adjacent diamond ring pieces cut on the diamond sheet are different, that is, in the same circular cutting area, a plurality of diamond ring pieces of different specifications whose diameters increase from the inside to the outside are cut, and the inner diameters and outer diameters of adjacent diamond ring pieces overlap, so that a plurality of diamond ring pieces of different specifications can be obtained in a circular cutting area, thereby improving the utilization rate of the material, and at the same time, since the inner and outer diameters of adjacent diamond ring pieces overlap, the number of cutting times is reduced, and the processing efficiency is improved.

[0009] Preferably, the tool base includes a central portion and an external portion, and the external portion is connected to the diamond ring piece. The tool base includes a central portion and an external portion, wherein since the diamond ring piece is an annular structure, only the external portion contacts the diamond ring piece, and the central portion does not contact the diamond, and the width of the diamond along the radial direction is smaller than that of the prior art, so that on the same unit area, the diamond slice can obtain more diamond ring pieces of different specifications, thereby improving the output ratio.

[0010] Preferably, in step S3, the diamond ring piece is trimmed to form a cutting edge. The diamond ring piece is trimmed to form a cutting edge, so as to improve the cutting quality, wherein the thickness of the cutting edge is preferably 0.01 mm to 0.3 mm, and the cutting edge is trimmed as needed during the actual processing process to control the cutting edge thickness to be less than or equal to the thickness of the diamond ring piece body.

[0011] Preferably, in step S2, several adjacent cutting discs are planned on the same diamond sheet, and diamond ring segments are cut on each cutting disc. In the present application, diamond ring segments are cut on the same cutting disc. Due to the irregularity of the diamond sheet, after cutting a cutting disc, another cutting disc is planned on the rest of the diamond sheet, and each cutting disc is arranged to be adjacent, thereby improving the utilization rate of the same diamond sheet and being able to cut more diamond ring segments of different specifications.

[0012] Preferably, several laser units are used to cut the diamond ring sheet, and the same diamond ring sheet is divided into several cutting areas corresponding to different laser units. The cutting starting positions of the laser units are relatively set, and the feeding directions of the laser units between the corresponding cutting areas are opposite. In the present application, a simultaneous cutting method of multiple laser units is adopted to improve the efficiency and uniformity of cutting, and the cutting trajectories of multiple laser units are staggered in the present application to avoid interference during the cutting process; specifically, since it is necessary to cut a number of adjacent diamond ring pieces inside and outside on the diamond sheet, and since the sizes of each diamond ring piece are different, the laser unit needs to move from one cutting area to another cutting area during the cutting process, and the direction of movement is the radial direction of the diamond ring piece, which is defined as the feed direction in the present application, and the feed directions of each laser unit are set oppositely, that is, including moving from the center of the diamond ring piece toward the outside and moving from the outside of the diamond ring piece toward the center. When the feed directions are opposite, since the cutting starting positions of each laser unit are relatively set, and the same diamond ring piece is divided into multiple cutting areas, and the corresponding laser units of each cutting area are different, each laser unit maintains a reasonable relative distance during the cutting process, thereby avoiding interference during the cutting process. Interference, and due to the different feeding directions, when each laser unit moves from the cutting area of ​​one diamond ring piece to the cutting area of ​​another diamond ring piece, the feeding direction of the laser unit opposite to it is opposite, resulting in a reasonable radial gap between the two. For example, when there are two laser units, the feeding direction of one laser unit is from outside to inside, and the feeding direction of the other laser unit is from inside to outside. Therefore, after both have completed the cutting operation of the cutting area on the corresponding diamond ring piece, they are fed to the cutting area corresponding to the next diamond ring piece, one moving from outside to inside and the other moving from inside to outside. At the same time, since the starting positions are relatively set, the end positions for ending the cutting are also relatively set, thereby ensuring that the two laser units are always at a wider distance. When the laser unit moving from outside to inside is fed to the cutting area corresponding to the smallest diamond ring piece, the laser unit moving from inside to outside is fed to the cutting area corresponding to the largest diamond ring piece, thereby avoiding interference during the cutting process.

[0013] Preferably, a delay area is provided between each adjacent cutting area, and the delay area is cut after the laser unit completes cutting the corresponding cutting area. A delay area is provided between each cutting area, wherein the delay area is not cut when the laser unit cuts the cutting area, but the cutting operation of the delay area is performed after all the cutting units have completed cutting, so as to ensure that the relative positions between each diamond ring piece remain fixedly connected, improve the uniformity of cutting, so that each diamond ring piece on the same cutting disk can be separated from the diamond thin slice only after the delay area is cut, so the separation of each diamond ring piece ensures that each diamond ring piece can maintain a relatively fixed connection, and avoids the position displacement of a diamond ring piece during the cutting process, which leads to deviation in subsequent cutting.

[0014] Preferably, the feeding directions of the laser units are opposite between the corresponding delay regions. The feeding directions of the laser units on the corresponding delay regions are opposite, and the feeding directions include cutting from the outside to the inside and cutting from the inside to the outside. By setting the feeding directions opposite, it is ensured that the gaps between the relative laser units can always maintain a suitable distance.

[0015] Preferably, the cutting directions of the laser units on the cutting area corresponding to the same diamond ring piece are the same. Since the starting positions of the laser units are relatively set, the cutting directions of the laser units on the cutting area corresponding to the same diamond ring piece are set to be the same, so that the relative spacing between the laser units can be continuously maintained during the cutting process, thereby avoiding interference during the cutting process.

[0016] Preferably, the same laser unit has opposite cutting directions on the cutting areas corresponding to adjacent diamond rings. When the same laser unit cuts each cutting area corresponding to itself, the cutting directions on adjacent cutting areas are opposite, so that each laser unit can move within an angle range set by itself, ensuring that the trajectory is controllable and maintains a reasonable distance from the laser unit on the other side; at the same time, when a delay area needs to be reserved, the reverse cutting path can ensure that each delay area is located on the same radial extension line, thereby ensuring uniformity and stability.

[0017] The beneficial effects of the present invention are as follows: (1) It can improve the output ratio of diamonds, reduce the proportion of waste generated during the processing, and reduce processing costs; (2) It can improve cutting efficiency while ensuring the stability and uniformity of the diamond ring during the cutting process, and can avoid mutual interference between the laser units during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the diamond slice in the present invention.

[0019] Figure 2 It is a cross-sectional view of the present invention.

[0020] Figure 3 It is a schematic diagram of the structure of the diamond ring piece in the present invention.

[0021] Figure 4 This is a flow chart of Example 2.

[0022] In the figure: 1 Diamond slice; 2 cutting round cake, 21 cutting area, 22 delay area; 3 diamond ring pieces, 31 cutting edges; 4 tool base, 41 center portion, 42 external portion; 5 laser units; 61 inner track, 62 middle track, 63 outer track; 71 inner ring piece, 72 middle ring piece, 73 outer ring piece. DETAILED DESCRIPTION

[0023] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0024] Embodiment 1: like Figure 1 , 2 As shown in 3, a laser manufacturing method for a diamond cutter wheel comprises the following steps: S1, cutting a diamond slice 1 from a diamond; S2, cutting the required diamond ring piece 3 from the diamond thin sheet 1; S3, trimming the diamond ring piece 3; S4, fixing the diamond ring piece 3 on the tool base 4.

[0025] In step S2 , a plurality of inner and outer adjacent diamond ring segments 3 are cut from the diamond thin slice 1 .

[0026] The tool base 4 includes a central portion 41 and an external portion 42 , and the external portion 42 is connected to the diamond ring piece 3 .

[0027] In step S2 , a plurality of adjacent cutting discs 2 are planned on the same diamond thin slice 1 , and diamond ring segments 3 are cut on each cutting disc 2 .

[0028] In this embodiment, diamond is first cut into diamond slices 1, the diamond slices 1 are cut to form diamond ring slices 3, and then the diamond ring slices 3 are installed and integrated with the tool base 4, so that the cutting part of the entire tool is still the diamond material, and the rest is the material of the tool base 4. The material of the tool base 4 in this embodiment is cemented carbide, so that the composition of the entire diamond tool includes cemented carbide and diamond. Since diamond material is only used in the cutting part, and the cutting part requires a thinner cutting edge, a thinner diamond material can be used for processing, and the tool base 4 can be equipped with more cemented carbide to improve the overall strength and connection stability. Therefore, in this embodiment, the diamond can be firstly cut into a plurality of diamond slices 1, wherein the thickness of the diamond slice 1 is between 0.01 mm and 0.3 mm; whereas in the prior art, due to the direct use of an integral diamond tool, only one diamond block can be cut from the thick diamond slice, and then the diamond block is processed and trimmed as a whole to obtain a diamond tool. Since in this embodiment, a plurality of diamond slices 1 can be cut from the same unit area of ​​diamond, compared with the cutting method in the prior art, in the same unit area of ​​diamond, in this embodiment, a plurality of diamond slices 1 can be cut, and therefore a plurality of diamond tools can be manufactured, whereas in the prior art, only one diamond tool can be cut from the same unit area of ​​diamond. Furthermore, since the trimming of the diamond ring piece 3 of the present embodiment is based on the diamond thin slice 1, the thickness of the diamond thin slice 1 itself is relatively thin, so when the blade of the diamond thin slice 1 needs to be trimmed, the diamond waste generated during the trimming process is also less, while in the prior art, when the entire diamond block needs to be trimmed, since the thickness of the diamond block is relatively thick, the waste generated by cutting during the trimming process is also more, resulting in a waste of diamond material. Therefore, the present embodiment can reduce production costs, while reducing the diamond waste generated during the processing process, and improving the output ratio.

[0029] In step S2, this embodiment further improves the utilization rate of diamonds, wherein the diameters of a plurality of inner and outer adjacent diamond ring segments 3 cut out on the diamond sheet 1 are different, that is, in the same circular cutting area 21, a plurality of diamond ring segments 3 of different specifications are cut out with the diameters increasing successively from the inside to the outside, and the inner diameters and outer diameters of adjacent diamond ring segments 3 overlap, so that a plurality of diamond ring segments 3 of different specifications can be obtained in a circular cutting area 21, thereby improving the utilization rate of materials. At the same time, since the inner and outer diameters of adjacent diamond ring segments 3 overlap, the number of cutting times is reduced and the processing efficiency is improved.

[0030] The tool base 4 includes a central portion 41 and an external portion 42. Since the diamond ring segment 3 is a ring structure, only the external portion 42 contacts the diamond ring segment 3, while the central portion 41 does not contact the diamond. The width of the diamond along the radial direction is smaller than that of the prior art, so that on the same unit area, the diamond sheet 1 can obtain more diamond ring segments 3 of different specifications, thereby improving the output ratio.

[0031] Preferably, in step S3, the diamond ring segment 3 is trimmed to form a cutting edge 31. The diamond ring segment 3 is trimmed to form a cutting edge 31, so as to improve the cutting quality, wherein the thickness of the cutting edge 31 is preferably 0.01 mm to 0.3 mm, and the cutting edge 31 is trimmed as required during the actual processing process, and the thickness of the cutting edge 31 is controlled to be less than or equal to the thickness of the main body of the diamond ring segment 3.

[0032] In this embodiment, the diamond ring segments 3 are cut on the same cutting disc 2. Due to the irregularity of the diamond slice 1, after cutting one cutting disc 2, another cutting disc 2 is planned on the rest of the diamond slice 1. The cutting discs 2 are arranged adjacent to each other, thereby improving the utilization rate of the same diamond slice 1 and being able to cut more diamond ring segments 3 of different specifications.

[0033] The specific processing process in this embodiment is as follows: In this embodiment, the cutting trajectory is controlled by an optical scanner, and the Z-direction cutting is achieved by the Z-direction feeding of the sample stage or the Z-direction movement of the galvanometer, and a diamond slice 1 is cut from the diamond. The subsequent processing processes are all performed on the removed diamond slice 1; first, a cutting disc 2 to be processed is planned on the diamond slice 1. Since the shape of the diamond slice 1 is mostly irregular, after planning a cutting disc 2 with a maximum diameter, there are still unprocessed areas of the diamond slice 1. In this embodiment, three cutting discs 2 can be planned as an example. After determining the largest cutting disc 2, , a relatively small cutting disc 2 is planned in the remaining area, the largest outer rings between the cutting discs 2 are tangent, and the other side is tangent to one side of the diamond slice 1, so that the utilization rate of the entire diamond slice 1 is maximized; and multiple diamond ring segments 3 are cut on each cutting disc 2, and the inner and outer diameters of adjacent diamond ring segments 3 on the same cutting disc 2 overlap, so that multiple diamond ring segments 3 can be cut out on the same cutting disc 2; then the cut diamond ring segments 3 are processed to obtain a knife ring that meets the design size; then the diamond knife ring is welded to the tool base 4 using silver-copper-titanium based solder to form a diamond tool.

[0034] Embodiment 2: like Figure 4As shown, different from Example 1, a laser manufacturing method of a diamond wheel in this embodiment includes the following steps: S1, cutting a diamond slice 1 from a diamond; S2, cutting the required diamond ring piece 3 from the diamond thin sheet 1; S3, trimming the diamond ring piece 3; S4, fixing the diamond ring piece 3 on the tool base 4.

[0035] In step S2 , a plurality of inner and outer adjacent diamond ring segments 3 are cut from the diamond thin slice 1 .

[0036] A plurality of laser units 5 are used to cut the diamond ring segment 3. The same diamond ring segment 3 is divided into a plurality of cutting areas 21 corresponding to different laser units 5. The cutting starting positions of the respective laser units 5 are relatively arranged. The feeding directions of the respective laser units 5 between the corresponding plurality of cutting areas 21 are opposite.

[0037] A delay area 22 is provided between each adjacent cutting area 21 . After the laser unit 5 has finished cutting the corresponding cutting area 21 , it will cut the delay area 22 .

[0038] The feeding directions of the laser units 5 between the corresponding delay areas 22 are opposite.

[0039] The cutting directions of the laser units 5 on the cutting area 21 corresponding to the same diamond ring piece 3 are the same.

[0040] The same laser unit 5 cuts in opposite directions on the cutting areas 21 corresponding to adjacent diamond ring segments 3 .

[0041] In this embodiment, a simultaneous cutting method of multiple laser units 5 is adopted to improve the efficiency and uniformity of cutting, and in this embodiment, the cutting trajectories of the multiple laser units 5 are staggered to avoid interference during the cutting process; specifically, since it is necessary to cut a number of inner and outer adjacent diamond ring pieces 3 on the diamond sheet 1, and since the sizes of the diamond ring pieces 3 are different, the laser unit 5 needs to move from one cutting area 21 to another cutting area 21 during the cutting process, and the moving direction is the radial direction of the diamond ring piece 3, which is defined as the feeding direction in this embodiment, and the feeding directions of the laser units 5 are set oppositely, that is, including moving from the center of the diamond ring piece 3 toward the outside and moving from the outside of the diamond ring piece 3 toward the center. When the feeding directions are opposite, since the cutting starting positions of the laser units 5 are relatively set, and the same diamond ring piece 3 is divided into multiple cutting areas 21, and the corresponding laser units 5 of each cutting area 21 are different, each laser unit 5 maintains a reasonable relative distance during the cutting process, thereby avoiding interference during the cutting process. Involved, and due to the different feeding directions, when each laser unit 5 moves from the cutting area 21 of one diamond ring segment 3 to the cutting area 21 of another diamond ring segment 3, the feeding direction of the laser unit 5 opposite thereto is opposite, resulting in a reasonable radial gap between the two. For example, when there are two laser units 5, the feeding direction of one laser unit 5 is from outside to inside, and the feeding direction of the other laser unit 5 is from inside to outside. Therefore, after both have completed the cutting operation of the cutting area 21 on the corresponding diamond ring segment 3, they are fed to the cutting area 21 corresponding to the next diamond ring segment 3, one moving from outside to inside, and the other moving from inside to outside. At the same time, since the starting positions are relatively set, the end positions for ending the cutting are also relatively set, thereby ensuring that the two laser units 5 are always at a wider distance. When the laser unit 5 moving from outside to inside is fed to the cutting area 21 corresponding to the smallest diamond ring segment 3, the laser unit 5 moving from inside to outside is fed to the cutting area 21 corresponding to the largest diamond ring segment 3, thereby avoiding interference during the cutting process.

[0042] A delay area 22 is arranged between each cutting area 21, wherein the delay area 22 is not cut when the laser unit 5 is cutting the cutting area 21, but the cutting operation of the delay area 22 is performed after all the cutting units have completed cutting, thereby ensuring that the relative positions of the diamond ring segments 3 remain fixedly connected, improving the uniformity of cutting, and allowing the diamond ring segments 3 on the same cutting disk 2 to be separated from the diamond sheet 1 only after the delay area 22 is cut. Therefore, the separation of the diamond ring segments 3 ensures that the diamond ring segments 3 can maintain a relatively fixed connection with each other, thereby avoiding the position displacement of a certain diamond ring segment 3 during the cutting process, which may lead to deviations in subsequent cutting.

[0043] The feeding directions of the laser units 5 on the corresponding delay area 22 are opposite, and the feeding directions include cutting from the outside to the inside and cutting from the inside to the outside. By setting the feeding directions opposite, it is ensured that the gaps between the relative laser units 5 can always maintain an appropriate distance.

[0044] Since the starting positions of the laser units 5 are relatively set, the cutting directions of the laser units 5 on the cutting areas 21 corresponding to the same diamond ring piece 3 are set to be the same, so that the relative spacing between the laser units 5 can be continuously maintained during the cutting process, thereby avoiding interference during the cutting process.

[0045] When the same laser unit 5 cuts the corresponding cutting areas 21, the cutting directions on adjacent cutting areas 21 are opposite, so that each laser unit 5 can move within an angle range set by itself, ensuring that the trajectory is controllable and maintains a reasonable distance from the laser unit 5 on the other side; at the same time, when it is necessary to reserve a delay area 22, the reverse cutting path can ensure that each delay area 22 is located on the same radial extension line, thereby ensuring uniformity and stability.

[0046] The specific operating steps in this embodiment are as follows: In this embodiment, the cutting process in a cutting disk 2 is taken as an example, wherein three diamond ring segments 3 are cut in the cutting disk 2 in this embodiment, which are named inner ring segment 71, middle ring segment 72, and outer ring segment 73 from the inside to the outside. The position without section lines in the diagram in this embodiment is the planned position of the diamond ring segment 3, and the position with section lines is the planned cutting trajectory. The disappearance of the section lines on the planned cutting trajectory indicates that the planned cutting trajectory has been cut, and the center circle of the cutting disk 2 in this embodiment has been ideally cut off. Therefore, in this embodiment, only three circular planned cutting trajectories are set, which are named inner trajectory 61, middle trajectory 62, and outer trajectory 63 from the inside to the outside.

[0047] In this embodiment, two laser units 5 are provided, and the cutting starting points of the two laser units 5 are respectively provided at the top of the inner track 61 and the bottom of the outer track 63. Therefore, the two laser units 5 are provided at relative positions and are located on different planned cutting tracks, thereby avoiding interference between the two laser units 5 due to the smaller diameter of the same planned cutting track. Since the inner track 61 and the outer track 63 in this embodiment are both at the edge, the laser unit 5 on the outer track 63 can only move toward the inner track 61 after cutting the corresponding part on the outer track 63, that is, from the outside to the inside. The laser unit 5 on the inner track 61 can only move toward the outer track 63 after cutting the corresponding part on the inner track 61. The starting positions of the two laser units 5 are in relative positions, and the cutting angular velocities of each laser unit 5 are controlled to be the same, so after the laser unit 5 cuts the cutting area 21 that needs to be cut, the positions of the two laser units 5 are still relatively set; wherein each diamond ring segment 3 in this embodiment is provided with two cutting areas 21 and two delay areas 22, wherein the length of the cutting area 21 is much larger than the length of the delay area 22, and the delay area 22 is arranged between the cutting areas 21, and each laser unit 5 only cuts one of the cutting areas 21 of the same diamond ring segment 3, and when the idealized delay area 22 does not exist, that is, each laser unit 5 only performs half a circle of cutting operation on each diamond ring segment 3, and the other half of the cutting operation is completed by another laser unit 5.

[0048] Therefore, in this embodiment, after the laser unit 5 on the outer track 63 and the laser unit 5 on the inner track 61 have cut the corresponding cutting areas 21 on their respective tracks, the laser unit 5 on the outer track 63 moves toward the inner track 61, and the laser unit 5 on the inner track 61 moves toward the outer track 63, that is, the feeding directions are opposite, and they move to the middle track 62 at the same time and are arranged relative to each other. Since the cutting directions of the two laser units 5 are the same (opposite to the cutting directions of the respective laser units 5 on the inner track 61 and the outer track 63), the two laser units 5 are in the same direction of cutting on the middle track 62, so they always keep relative positions to avoid interference; when the two laser units 5 have cut the middle track 62, there are only two delay areas 22 on the middle track 62 that have not been cut, and the two delay areas 22 ensure that the connection relationship between the inner ring plate 71, the middle ring plate 72 and the outer ring plate 73 is not separated, thereby ensuring the integrity of the diamond sheet 1 and avoiding relative interference.

[0049] The two laser units 5 move in different feeding directions on the middle track 62, that is, one moves toward the outer track 63 and the other moves toward the inner track 61. After moving to the outer track 63 and the inner track 61 respectively, the laser unit 5 changes the cutting direction again. After the cutting is completed, all the cutting areas 21 are cut, leaving only the delay area 22.

[0050] In the cutting process, the cutting direction is changed each time the laser unit 5 switches between the inner track 61, the middle track 62, and the outer track 63. Therefore, the cutting angle range of the same laser unit 5 on each diamond ring segment 3 is the same, so that each delay area 22 is on the same radial extension line of the cutting disk 2, ensuring the connection uniformity of each diamond ring segment 3.

[0051] Then, the two laser units 5 cut the delay areas 22 closest to each other respectively, wherein the feeding directions of the two laser units 5 are controlled to be opposite, thereby avoiding the relative distance between the two laser units 5 being close during the cutting process and reducing the risk of interference.

Claims

1. A laser manufacturing method for a diamond wheel, characterized in that: The following steps are included: S1, cutting a diamond slice (1) from a diamond; S2, cutting the required diamond ring piece (3) from the diamond thin piece (1); S3, trimming the diamond ring piece (3); S4, fixing the diamond ring piece (3) on the tool base (4).

2. The laser manufacturing method of a diamond wheel according to claim 1, characterized in that: In step S2, a plurality of inner and outer adjacent diamond ring pieces (3) are cut from the diamond thin piece (1).

3. The laser manufacturing method of a diamond wheel according to claim 1, characterized in that: The tool base (4) comprises a central portion (41) and an externally connected portion (42), wherein the externally connected portion (42) is connected to the diamond ring piece (3).

4. The laser manufacturing method of a diamond wheel according to claim 1, characterized in that: In step S3, the diamond ring piece (3) is trimmed to form a cutting edge (31).

5. The laser manufacturing method of a diamond wheel according to claim 1, characterized in that: In step S2, a plurality of adjacent cutting discs (2) are planned on the same diamond thin slice (1), and diamond ring slices (3) are cut on each cutting disc (2).

6. The laser manufacturing method of a diamond wheel according to claim 2, characterized in that: A plurality of laser units (5) are used to cut a diamond ring piece (3); the same diamond ring piece (3) is divided into a plurality of cutting areas (21) corresponding to different laser units (5); the cutting starting points of the respective laser units (5) are relatively arranged; and the feeding directions of the respective laser units (5) between the corresponding plurality of cutting areas (21) are opposite.

7. The laser manufacturing method of a diamond wheel according to claim 6, characterized in that: A delay area (22) is provided between each adjacent cutting area (21), and after the laser unit (5) has completed cutting the corresponding cutting area (21), the delay area (22) is cut.

8. The laser manufacturing method of a diamond wheel according to claim 7, characterized in that: The feeding directions of the laser units (5) between the corresponding delay areas (22) are opposite.

9. A method for laser manufacturing a diamond wheel according to any one of claims 6 to 8, characterized in that: The cutting directions of the laser units (5) on the cutting area (21) corresponding to the same diamond ring piece (3) are the same.

10. A laser manufacturing method for a diamond wheel according to any one of claims 6 to 8, characterized in that: The same laser unit (5) has opposite cutting directions on the cutting areas (21) corresponding to adjacent diamond ring pieces (3).

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