Semiconductor refrigeration device and operation method thereof

Abstract

The invention relates to the technical field of semiconductor air conditioners, in particular to a semiconductor refrigeration device and an operation method thereof. The semiconductor refrigeration device comprises a semiconductor assembly which comprises a single-stage semiconductor and a multi-stage semiconductor, and the single-stage semiconductor and the multi-stage semiconductor are arranged in parallel; the cold storage assembly is used for containing a cold storage piece, and the cold end of the semiconductor assembly is connected with the cold storage assembly in a matched mode; when the user side does not need to use cold, the semiconductor assembly operates so that the cold energy generated by the cold end of the semiconductor assembly can be stored in the cold storage assembly; when the user side needs to use cold, the cold storage assembly is used for outputting cold energy to the outside so as to cool the user side. In the cold accumulation period of the semiconductor refrigeration device, the single-stage semiconductor is made to work firstly, after the refrigeration effect of the single-stage semiconductor is weakened, the multi-stage semiconductor starts to work, the defect that the refrigeration capacity of the single-stage semiconductor is insufficient is overcome, the refrigeration capacity of the semiconductor assembly within a certain time can be improved, and the cold capacity stored in the cold accumulation assembly within a certain time is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor air conditioners, and in particular to a semiconductor refrigeration device and an operating method thereof. Background Art

[0002] Semiconductor coolers are devices that use the thermal-electric effect of semiconductors to generate cooling energy, also known as thermoelectric coolers. When two different metals are connected by a conductor and direct current is applied, the temperature at one junction decreases and the temperature at the other junction increases.

[0003] When the semiconductor thermoelectric element is powered on, electron-hole pairs are generated near the upper contact, the internal energy decreases, the temperature drops, and heat is absorbed from the outside, which is called the cold end. The other end increases the internal energy and temperature due to the recombination of the electron-hole pairs, and releases heat to the environment, which is called the hot end. The temperature difference and cooling capacity generated by a pair of semiconductor thermoelectric elements are very small, so the semiconductor refrigeration technology in the prior art is mainly used in occasions with small cooling capacity and small space, such as cooling of certain components in electronic equipment and radio communication equipment.

[0004] In the prior art, in order to apply semiconductor refrigeration technology to household products to cool the room, it is necessary to connect many pairs of semiconductor thermoelectric elements in parallel or in series to form a semiconductor refrigerator, also known as a semiconductor thermopile, to increase the temperature difference between the cold end and the hot end. However, due to the small cooling coefficient of semiconductors and relatively large power consumption, when the number of semiconductor thermoelectric elements increases, the energy consumption of the refrigerator will increase rapidly, resulting in extremely high energy consumption of household products related to semiconductor refrigeration technology, and extremely high operating costs, making it difficult to promote and apply them in the market. Summary of the invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect of extremely high energy consumption of household products related to semiconductor refrigeration technology in the prior art, thereby providing a semiconductor refrigeration device and an operating method thereof.

[0006] In order to solve the above technical problems, the present invention provides a semiconductor refrigeration device, comprising:

[0007] A semiconductor component, comprising a single-stage semiconductor and a multi-stage semiconductor, wherein the single-stage semiconductor and the multi-stage semiconductor are arranged in parallel;

[0008] A cold storage component is used to accommodate the cold storage component, and the cold end of the semiconductor component is cooperatively connected to the cold storage component;

[0009] When the user end does not need to use cold, the semiconductor component operates so that the cold energy generated by the cold end of the semiconductor component is stored in the cold storage component; when the user end needs to use cold, the cold storage component is used to output cold energy to the outside to cool the user end.

[0010] Optionally, a temperature detection component is installed in the cold storage component.

[0011] Optionally, a cooling member is installed in the cold storage assembly, one end of the cooling member is fixedly connected to the cold end of the semiconductor assembly, and the other end extends into the inner cavity of the cold storage assembly.

[0012] Optionally, the cold conduction member includes a fixed portion and a temperature transmission portion, the fixed portion is fixedly mounted on the cold storage assembly, a plurality of temperature transmission portions are spaced apart on the fixed portion, and the plurality of temperature transmission portions all extend toward the inner cavity of the cold storage assembly.

[0013] Optionally, a heat dissipation component is installed at the hot end of the semiconductor component.

[0014] The present invention also provides an operating method of a semiconductor refrigeration device, using the semiconductor refrigeration device of the present invention, the operating method comprises the following steps:

[0015] Start the single-stage semiconductor to reduce the temperature of the cold storage component in the cold storage assembly;

[0016] It is determined whether the temperature of the cold storage component reaches a first preset value. If so, the multi-stage semiconductor operation is started to continue to reduce the temperature of the cold storage component in the cold storage assembly.

[0017] Optionally, the step of determining whether the temperature of the cooling element reaches a first preset value includes:

[0018] The temperature detection component detects and obtains a first temperature value of the cold storage component;

[0019] After a predetermined time interval, the temperature detection component detects and obtains a second temperature value of the cold storage component;

[0020] It is determined whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference.

[0021] Optionally, the step of determining whether the temperature of the cooling element reaches a first preset value includes:

[0022] The temperature detection component detects and obtains a first temperature difference of the cooling component after the single-stage semiconductor starts to work and the first predetermined time interval;

[0023] The temperature detection component detects and obtains a second temperature difference of the cold storage component at any subsequent predetermined time intervals;

[0024] It is determined whether a ratio of the first temperature difference to the second temperature difference is greater than a preset ratio.

[0025] Optionally, the method further includes determining whether the temperature of the cold storage component reaches a second preset value. If so, the single-stage semiconductor is turned off and the multi-stage semiconductor works alone.

[0026] Optionally, judging whether the temperature of the cooling element reaches a second preset value includes judging whether the temperature difference between the cold end and the hot end of the single-stage semiconductor is greater than a preset temperature span value.

[0027] The technical solution of the present invention has the following advantages:

[0028] 1. The semiconductor refrigeration device provided by the present invention comprises: a semiconductor component, which comprises a single-stage semiconductor and a multi-stage semiconductor, and the single-stage semiconductor and the multi-stage semiconductor are arranged in parallel; a cold storage component, which is used to accommodate the cold storage component, and the cold end of the semiconductor component is cooperatively connected with the cold storage component; when the user end does not need to use cold, the semiconductor component is operated so that the cold energy generated by the cold end of the semiconductor component is stored in the cold storage component; when the user end needs to use cold, the cold storage component is used to output cold energy to the outside to cool the user end.

[0029] When the semiconductor refrigeration device is working, it first uses the semiconductor components to store cold during idle time, and stores the cold in the cold storage component and keeps it warm. When the client needs cold, the semiconductor components do not work, and the cold components are used to take out the cold from the cold storage component to provide cold for the user. By using the longer idle time of the refrigeration device to store cold, the power requirements of the cold storage process can be reduced, and the energy consumption of the semiconductor refrigeration device can be greatly reduced. During the cold storage period of the semiconductor refrigeration device, the single-stage semiconductor is first operated. At the initial operation, the temperature difference between the cold side and the hot side of the single-stage semiconductor is small. As the single-stage semiconductor continues to work, the temperature difference between its cold side and the hot side gradually increases, the working efficiency of the single-stage semiconductor gradually decreases, and the cooling effect becomes weaker. At this time, the multi-stage semiconductor starts to work. Since the cooling capacity of the multi-stage semiconductor decays at a slower rate with the increase of the temperature difference, under the temperature difference conditions at this time, the multi-stage semiconductor can still perform cooling with a higher working efficiency to make up for the insufficient cooling capacity of the single-stage semiconductor. By cooling the single-stage semiconductor and the multi-stage semiconductor in stages, the cooling capacity of the semiconductor component within a certain period of time can be improved, and the cold amount stored in the cold storage component within a certain period of time can be increased. During the cooling stage, the cold capacity in the cold storage component can meet higher cooling needs, allowing the semiconductor refrigeration device to meet the needs of family rooms such as kitchens and bathrooms.

[0030] 2. The operation method of the semiconductor refrigeration device provided by the present invention is applied to the semiconductor refrigeration device described in the present invention, and the operation method includes the following steps: starting the single-stage semiconductor to reduce the temperature of the cold storage part in the cold storage component; judging whether the temperature of the cold storage part reaches the first preset value, and if so, starting the multi-stage semiconductor to continue to reduce the temperature of the cold storage part in the cold storage component. By using the single-stage semiconductor and the multi-stage semiconductor to work together, the time for the semiconductor component to stop cooling when reaching the maximum temperature difference is extended, so that the semiconductor refrigeration device can store more cold during the cold storage period, so that more cold can be provided when the user needs to use cold, so that the semiconductor refrigeration device can meet more refrigeration needs.

[0031] 3. The operating method of the semiconductor refrigeration device provided by the present invention, the step of judging whether the temperature of the cold storage part reaches the first preset value comprises: the temperature detection part detects the first temperature value of the cold storage part; after a predetermined time interval, the temperature detection part detects the second temperature value of the cold storage part; and judges whether the difference between the first temperature value and the second temperature value is less than the preset temperature difference. By detecting the temperature change of the cold storage part, the intervention timing of the multi-stage semiconductor is controlled to ensure that the cold storage part maintains a high cooling rate during the cold storage period, and the cold storage capacity of the cold storage part within a certain period of time is increased.

[0032] 4. The operating method of the semiconductor refrigeration device provided by the present invention also includes judging whether the temperature of the cold storage part reaches a second preset value. If so, the single-stage semiconductor is turned off and the multi-stage semiconductor works alone. When the temperature of the cold storage part drops to the second preset value, the temperature difference between the cold end and the hot end of the single-stage semiconductor is large, which will cause the single-stage semiconductor to have a low refrigeration capacity. At this time, stopping the single-stage semiconductor from working can reduce the functional energy consumption of the semiconductor component. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 It is a schematic structural diagram of a semiconductor refrigeration device provided in an embodiment of the present invention.

[0035] Explanation of the reference numerals: 1. Cold storage component; 2. Single-stage semiconductor; 3. Multi-stage semiconductor; 4. Fixing part; 5. Temperature transmission part; 6. Heat dissipation component. DETAILED DESCRIPTION

[0036] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] Example 1

[0041] Figure 1 The semiconductor refrigeration device provided in this embodiment includes a cold storage component 1 and a semiconductor component.

[0042] In this embodiment, the cold storage component 1 uses a sealed cold storage insulation box, which contains water as a cold storage component when working. In other embodiments, the cold storage component 1 can also be a sealed insulation tube, insulation box, etc. The cold storage component can also be a mixture of water and blue ice cold storage agent or water and other cold storage agents, which is used to reduce the difficulty of phase change and freezing during the cooling process of the cold storage component and accelerate the freezing speed of the cold storage component.

[0043] The semiconductor assembly includes a single-stage semiconductor 2 and a multi-stage semiconductor 3, the single-stage semiconductor 2 and the multi-stage semiconductor 3 are arranged in parallel, and the cold end of the semiconductor assembly is connected with the cold storage assembly 1. The single-stage semiconductor 2 is a semiconductor including a PN junction, and the multi-stage semiconductor 3 is a semiconductor including multiple PN junctions connected in series. In this embodiment, the single-stage semiconductor 2 uses a single-layer semiconductor refrigeration sheet, and the multi-stage semiconductor 3 uses a stacked double-layer semiconductor refrigeration sheet. In other embodiments, the number of stages of the multi-stage semiconductor 3 can be adjusted according to actual needs.

[0044] When the user end does not need to use cold, the semiconductor component operates so that the cold energy generated by the cold end of the semiconductor component is stored in the cold storage component 1; when the user end needs to use cold, the cold storage component 1 is used to output cold energy to the outside to cool the user end. When taking cold from the cold storage component 1, a liquid-cooled heat exchanger or an air-cooled heat exchanger is used to take cold from the cold storage component 1 through a circulating heat exchanger or to transfer the cold energy in the cold storage component 1 to the air by blowing and blowing the cold air out to cool the user end.

[0045] A temperature sensor as a temperature detection component is installed in the inner cavity of the cold storage insulation box serving as the cold storage component 1. A cooling fin serving as a cooling component is also installed in the cold storage component 1, one end of which is fixedly connected to the cold end of the semiconductor component, and the other end extends into the inner cavity of the cold storage component 1. Specifically, the cooling fin includes a fixed mounting plate serving as a fixing portion 4 and a fin body serving as a temperature transmission portion 5, the fixed mounting plate is fixedly mounted on the cold storage component 1, the fin body is vertically arranged on the bottom surface of the fixed mounting plate, and a plurality of fin bodies are arranged at intervals, and the plurality of fin bodies all extend toward the inner cavity of the cold storage component 1.

[0046] In order to dissipate heat from the hot end of the semiconductor component and prevent the heat generated from the hot end of the semiconductor component when it is working from affecting the cold storage component 1, a water cooling head as a heat dissipation component 6 is installed at the hot end of the semiconductor component to dissipate heat from the hot end of the semiconductor component. In other embodiments, the heat dissipation component 6 can also be a heat dissipation fan that blows air to the hot end of the semiconductor component to dissipate heat.

[0047] Since the single-layer semiconductor cooling sheet is characterized by high efficiency and a small temperature span, while the double-layer semiconductor cooling sheet is characterized by low efficiency and a high temperature span, the present embodiment adopts a combination of a single-layer semiconductor cooling sheet and a double-layer semiconductor cooling sheet to cool the water in the cold storage and insulation box. Since the thickness of the single-layer semiconductor cooling sheet and the double-layer semiconductor cooling sheet is different, the structural shape of the upper water cooling head or the lower aluminum heat sink as a fixed mounting plate at the contact point must be changed accordingly. In the present embodiment, the shape of the lower aluminum heat sink remains unchanged, and the shape of the upper water cooling head is adapted to the shapes of the two cooling sheets and changed accordingly. The water cooling head is thickened at the single-layer semiconductor cooling sheet, and the water cooling channel is tilted downward close to the single-layer semiconductor cooling sheet.

[0048] When the semiconductor refrigeration device is working, it first uses the semiconductor components to store cold during idle time, and stores the cold in the cold storage component 1 and keeps it warm. When the client needs to use cold, the semiconductor components do not work, and the cold components are used to take out the cold from the cold storage component 1 to provide cold for the user. By using the longer idle time of the refrigeration device to store cold, the power requirements of the cold storage process can be reduced, and the energy consumption of the semiconductor refrigeration device can be greatly reduced. During the cold storage period of the semiconductor refrigeration device, the single-stage semiconductor 2 is first operated. During the initial operation, the temperature difference between the cold side and the hot side of the single-stage semiconductor 2 is small. As the single-stage semiconductor 2 continues to work, the temperature difference between its cold side and the hot side gradually increases, the working efficiency of the single-stage semiconductor 2 gradually decreases, and the refrigeration effect becomes weaker. At this time, the multi-stage semiconductor 3 starts to work. Since the refrigeration capacity of the multi-stage semiconductor 3 decays at a slower rate as the temperature difference increases, under the temperature difference conditions at this time, the multi-stage semiconductor 3 can still perform refrigeration with a higher working efficiency to make up for the insufficient refrigeration capacity of the single-stage semiconductor 2. By cooling the single-stage semiconductor 2 and the multi-stage semiconductor 3 in stages, the cooling capacity of the semiconductor component within a certain period of time can be improved, and the amount of cold stored in the cold storage component 1 within a certain period of time can be increased. In the cold use stage, the cold in the cold storage component 1 can meet higher cooling needs, so that the semiconductor refrigeration device can meet the use needs of family rooms such as kitchens and bathrooms.

[0049] Example 2

[0050] This embodiment provides an operating method of a semiconductor refrigeration device, using the semiconductor refrigeration device described in Embodiment 1, and the operating method includes the following steps:

[0051] The single-stage semiconductor operation is started to reduce the temperature of the cold storage component in the cold storage assembly. It is determined whether the temperature of the cold storage component reaches a first preset value. If so, the multi-stage semiconductor operation is started to continue to reduce the temperature of the cold storage component in the cold storage assembly.

[0052] The step of judging whether the temperature of the cold storage component reaches a first preset value comprises: the temperature detection component detects a first temperature value of the cold storage component. After a predetermined time interval, the temperature detection component detects a second temperature value of the cold storage component. It is judged whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference.

[0053] In other embodiments, the step of determining whether the temperature of the cooling member reaches a first preset value includes: the temperature detection member detects a first temperature difference of the cooling member from the start of the single-stage semiconductor to the first predetermined time interval. The temperature detection member detects a second temperature difference of the cooling member at any subsequent predetermined time intervals. Determine whether the ratio of the first temperature difference to the second temperature difference is greater than a preset ratio.

[0054] Starting the multi-stage semiconductor operation includes determining whether the temperature of the cooling element reaches a second preset value, and if so, shutting down the single-stage semiconductor and allowing the multi-stage semiconductor to operate independently. Determining whether the temperature of the cooling element reaches the second preset value includes determining whether the temperature difference between the cold end and the hot end of the single-stage semiconductor is greater than a preset temperature span value.

[0055] Specifically, when the water temperature in the cold storage box is at room temperature, in order to lower its temperature, the single-layer semiconductor refrigeration sheet starts to work. At this time, the temperature difference between the cold end and the hot end of the single-layer semiconductor refrigeration sheet is small, and the single-layer semiconductor refrigeration sheet can achieve high refrigeration efficiency and rapid refrigeration. When the temperature drops to a certain temperature, it is detected that the temperature difference of the water temperature at a specific time difference is less than the preset temperature difference value, or the temperature difference at a specific time is compared with the temperature difference at the beginning of a specific time difference. When it reaches a preset ratio value, the double-layer semiconductor starts to work.

[0056] After the double-layer semiconductor works, the single-stage semiconductor can be turned off and stop working. In order to achieve the frequency conversion of the semiconductor chip, the total power of the semiconductor refrigeration chip will change under different voltages. However, the cooling efficiency of the semiconductor refrigeration chip has little to do with the working voltage, but is more related to the temperature difference between the cold end and the hot end of the semiconductor refrigeration chip. When the semiconductor refrigeration device starts to work and store cold, the single-layer semiconductor refrigeration chip operates at the rated power, the water temperature in the cold storage box gradually decreases, and the temperature difference between the two ends of the single-layer semiconductor refrigeration chip gradually increases. When the critical point is reached and the double-layer semiconductor refrigeration body starts to work, the single-layer semiconductor chip does not stop working. At this time, the double-layer semiconductor refrigeration chip starts from the minimum power. As the temperature difference between the two ends of the double-layer semiconductor chip increases, the power of the double-layer semiconductor chip gradually increases, while the power of the single semiconductor chip decreases step by step. As the temperature span continues to increase, the power of the single-layer semiconductor gradually drops to zero, while the double-layer semiconductor chip gradually increases to the rated power. The input power remains basically unchanged during the whole process, and although the efficiency decreases, the rate of decrease is relatively gentle, so that efficiency and speed can be better taken into account.

[0057] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A semiconductor refrigeration device, characterized in that: include: A semiconductor component, comprising a single-stage semiconductor (2) and a multi-stage semiconductor (3), wherein the single-stage semiconductor (2) and the multi-stage semiconductor (3) are arranged in parallel; A cold storage component (1) is used to accommodate a cold storage component, and the cold end of the semiconductor component is cooperatively connected to the cold storage component (1); When the user end does not need to use cold, the semiconductor component operates so that the cold energy generated by the cold end of the semiconductor component is stored in the cold storage component (1); when the user end needs to use cold, the cold storage component (1) is used to output cold energy to the outside to cool the user end.

2. The semiconductor refrigeration device according to claim 1, characterized in that: A temperature detection component is installed in the cold storage component (1).

3. The semiconductor refrigeration device according to claim 1 or 2, characterized in that: A cooling element is installed in the cold storage component (1); one end of the cooling element is fixedly connected to the cold end of the semiconductor component, and the other end extends into the inner cavity of the cold storage component (1).

4. The semiconductor refrigeration device according to claim 3, characterized in that: The cold conduction component comprises a fixing portion (4) and a temperature transmission portion (5); the fixing portion (4) is fixedly mounted on the cold storage component (1); a plurality of the temperature transmission portions (5) are arranged at intervals on the fixing portion (4); and the plurality of the temperature transmission portions (5) all extend toward the inner cavity of the cold storage component (1).

5. The semiconductor refrigeration device according to claim 1 or 2, characterized in that: A heat dissipation component (6) is installed at the hot end of the semiconductor component.

6. A method for operating a semiconductor refrigeration device, characterized in that: The semiconductor refrigeration device according to any one of claims 1 to 5 is applied, and the operating method comprises the following steps: Starting the single-stage semiconductor (2) to work so as to reduce the temperature of the cold storage component in the cold storage assembly (1); It is determined whether the temperature of the cold storage component has reached a first preset value, and if so, the multi-stage semiconductor (3) is started to operate so that the temperature of the cold storage component in the cold storage assembly (1) continues to decrease.

7. The operating method of the semiconductor refrigeration device according to claim 6, characterized in that: The step of judging whether the temperature of the cooling element reaches a first preset value comprises: The temperature detection component detects and obtains a first temperature value of the cold storage component; After a predetermined time interval, the temperature detection component detects and obtains a second temperature value of the cold storage component; It is determined whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference.

8. The operating method of the semiconductor refrigeration device according to claim 6, characterized in that: The step of judging whether the temperature of the cooling element reaches a first preset value comprises: The temperature detection component detects and obtains a first temperature difference of the cold storage component after the single-stage semiconductor (2) starts to work and after a first predetermined time interval; The temperature detection component detects and obtains a second temperature difference of the cold storage component at any subsequent predetermined time intervals; It is determined whether a ratio of the first temperature difference to the second temperature difference is greater than a preset ratio.

9. The operating method of the semiconductor refrigeration device according to any one of claims 6 to 8, characterized in that: It also includes judging whether the temperature of the cold storage component reaches a second preset value, and if so, shutting down the single-stage semiconductor (2) and allowing the multi-stage semiconductor (3) to work alone.

10. The operating method of the semiconductor refrigeration device according to claim 9, characterized in that: Judging whether the temperature of the cold storage component reaches a second preset value comprises: judging whether the temperature difference between the cold end and the hot end of the single-stage semiconductor (2) is greater than a preset temperature span value.

Images