QSFP-DD packaging 400G optical module structure

Abstract

The invention relates to a QSFP-DD packaging 400G optical module structure, and belongs to the technical field of optical modules. Comprising a module upper cover, a module base and a pull ring, the module upper cover and the module base form a containing cavity, an MPO optical fiber adapter and a module circuit board assembly are arranged in the containing cavity, and first cooling fins and second cooling fins are arranged on the module upper cover and the module base respectively; the module circuit board assembly comprises a PCB, a heat dissipation block is arranged on the PCB, and a heat dissipation table is arranged on the module upper cover. A module upper cover and a rubber coating area are arranged on the inner side of the pull ring, a pull ring handle is arranged at one end of the pull ring, and the pull ring handle is flush with the bottom of the module base. According to the QSFP-DD packaging 400G optical module structure provided by the invention, the heat dissipation efficiency is remarkably improved, the MPO jumper wire insertion space is optimized, more internal space of the PCB is provided, the signal loss is reduced, the connection stability of the light-transmitting assembly and the silicon optical assembly is enhanced, and the optical signal loss is reduced.

Description

Technical Field

[0001] The invention relates to a QSFP-DD package 400G optical module structure, belonging to the technical field of optical modules. Background Art

[0002] The optical module is composed of optoelectronic devices, functional circuits and optical interfaces. The optoelectronic devices include two parts: transmitting and receiving. Simply put, the function of the optical module is to convert electrical signals into optical signals at the transmitting end. After being transmitted through optical fibers, the receiving end converts the optical signals into electrical signals.

[0003] The current development of optical modules is mainly reflected in the speed. From the old 1.25G to the later 10G, 25G, 100G, and now 400G, the optical modules have developed rapidly from low-end to high-end. Especially in the field of 400G and higher-speed optical transmission, the QSFP-DD (Quad Small Form Factor Pluggable-Double Density) packaging is favored for its high density, high bandwidth and good thermal management characteristics. However, the power consumption of such a module reaches more than 15W, and the appearance of the QSFP-DD module is much smaller than that of the OSFP module. At the same time, after the module is inserted into the switch, only a small area can be used for heat dissipation. The effective heat dissipation structure or heat dissipation area is insufficient, resulting in the large amount of heat generated by the optical module during operation cannot be dissipated in time, affecting the performance and life of the optical module. Summary of the invention

[0004] The present invention provides a QSFP-DD packaged 400G optical module structure to solve the problems of insufficient heat dissipation efficiency, poor heat dissipation path, and limited MPO jumper insertion space in the prior art.

[0005] The present invention provides a QSFP-DD package 400G optical module structure, which includes a module upper cover, a module base, and a pull ring. The module upper cover and the module base form a receiving cavity, and an MPO optical fiber adapter and a module circuit board assembly are arranged in the receiving cavity. The module upper cover and the module base are respectively provided with a first heat dissipation fin and a second heat dissipation fin. The first heat dissipation fin is located on the module upper cover in a small segment design and is staggered on the module upper cover. The second heat dissipation fin is located on the module base in a straight rib shape. The module circuit board assembly comprises a PCB board, a heat sink block corresponding to the first heat sink fin is arranged on the PCB board, a heat sink platform corresponding to the heat sink block is arranged on the inner side of the top of the module upper cover, the heat sink platform is connected to the first heat sink fin, and the heat sink block is in close contact with the heat sink platform; The pull ring is located at one end of the module cover and the module base. The inner side of the pull ring is provided with a rubber-coated area corresponding to the module cover and the module base. A pull ring handle is provided at one end of the pull ring, and the pull ring handle is flush with the bottom of the module base.

[0006] Preferably, there are a plurality of the first heat dissipation fins and a plurality of the second heat dissipation fins, and the plurality of the first heat dissipation fins are linearly staggered and distributed.

[0007] Preferably, the pull ring is assembled and fixed to the module base by a spring, and the pull ring handle is located at one end of the pull ring away from the module upper cover and the module base.

[0008] Preferably, the module upper cover and the module base are fixed at one end close to the first heat dissipation fin by means of screws, and the module upper cover and the module base are connected at one end away from the screws by means of a snap assembly.

[0009] Preferably, there are two screws, and the screws are located on the top of one end of the module cover close to the first heat dissipation fin.

[0010] Preferably, a light-transmitting component and a silicon photonic component are provided on the PCB board, a first groove corresponding to the silicon photonic component is provided on the PCB board, a second groove corresponding to the first groove is provided at the bottom of the silicon photonic component, and a sealed cavity is formed between the first groove and the second groove.

[0011] Preferably, the module base is located inside the first groove, the light-transmitting component is connected to the MPO optical fiber adapter, and the light-transmitting component is fixed on the module cover by means of a limiting component.

[0012] Preferably, the limiting components are located on both sides of one end of the first groove, the first groove is provided with an opening corresponding to the limiting components, and the limiting components are located inside the opening.

[0013] Preferably, the limit assembly includes a limit plate and a limit spring, the limit plates are symmetrically arranged inside the opening, the limit plates on both sides are connected to the inner wall of the opening through a limit spring, the light-transmitting assembly is provided with a limit rod corresponding to the limit assembly, the limit plate is provided with a limit point, and the limit rod is provided with an annular groove corresponding to the limit point.

[0014] Preferably, the limiting rods are located at both sides of the light-transmitting component and are fixedly connected to the light-transmitting component, the limiting plates on both sides are trumpet-shaped openings near one end of the limiting rods, and the top of the limiting rods is semicircular.

[0015] Beneficial effects of the present invention: The present invention provides a QSFP-DD packaged 400G optical module structure, which respectively designs a first heat dissipation fin and a second heat dissipation fin on a module upper cover and a module base, and in particular, the first heat dissipation fin is staggered in small sections, which not only increases the heat dissipation area, but also enables air to more fully exchange heat with the heat dissipation fin during the heat dissipation process, thereby significantly improving the heat dissipation efficiency. The heat dissipation block is designed with copper plating, which forms a good contact with the heating surface of the optical chip, and forms an effective heat dissipation path by closely contacting the heat dissipation platform, further enhancing the heat dissipation effect. The pull ring is assembled and fixed to the module base through a spring, and the bottom of the pull ring handle is flush with the bottom of the module base. Such a design is not only convenient for operating the pull ring, but also maximizes the insertion space of the MPO jumper, making the jumper insertion operation more convenient. The rubber-coated area on the inner side of the pull ring is rubber-coated, which not only increases the aesthetics, but also has The interference problem is effectively avoided and the spatial layout is further optimized. By optimizing the screw layout, only two screws and a snap assembly are used to achieve fixation, thereby removing the screw at the tail, significantly increasing the internal space of the PCB board, and providing more layout options for high-frequency wiring. By increasing the internal space of the PCB board, the electromagnetic interference between high-frequency wiring is effectively reduced, thereby reducing signal loss and improving the quality and stability of signal transmission. The light-transmitting component is fixed to the module cover through the limit assembly. The cooperation of the limit rod, the limit point and the annular groove realizes the firm fixation of the light-transmitting component. When the limit rod is inserted between the limit plates, the limit point is snapped into the annular groove to form a stable mechanical connection, which effectively prevents the light-transmitting component from loosening or displacement. The sealed cavity design reduces the deviation or loss of the optical signal during the transmission and reception process, ensuring the accurate transmission of the optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a structural schematic diagram of a QSFP-DD packaged 400G optical module structure of the present invention.

[0017] Figure 2 This is a schematic structural diagram of a QSFP-DD packaged 400G optical module structure from another angle of the present invention.

[0018] Figure 3 This is a front view structural schematic diagram of a QSFP-DD packaged 400G optical module structure of the present invention.

[0019] Figure 4 This is a schematic diagram of the exploded structure of a QSFP-DD packaged 400G optical module structure of the present invention.

[0020] Figure 5 This is a schematic diagram of a module cover structure of a QSFP-DD packaged 400G optical module structure of the present invention.

[0021] Figure 6This is a schematic diagram of the PCB board structure of a QSFP-DD packaged 400G optical module of the present invention.

[0022] Figure 7 This is a schematic diagram of the exploded structure of a PCB board of a QSFP-DD packaged 400G optical module structure of the present invention.

[0023] Figure 8 This is a schematic cross-sectional structure diagram of a limiting component of a QSFP-DD packaged 400G optical module structure of the present invention.

[0024] Fig. 9 This is a schematic diagram of the limiting component structure of a QSFP-DD packaged 400G optical module of the present invention.

[0025] In the figure: 1. module cover, 11. first heat dissipation fin, 12. heat dissipation platform, 2. module base, 21. second heat dissipation fin, 3. pull ring, 31. pull ring handle, 32. rubber coating area, 4. PCB board, 41. heat dissipation block, 42. light-transmitting component, 421. limit rod, 4211. annular groove, 43. silicon photonic component, 5. screw, 6. buckle component, 7. limit component, 71. limit plate, 711. limit point, 72. limit spring. DETAILED DESCRIPTION

[0026] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] Example 1 The present invention provides a QSFP-DD package 400G optical module structure, which includes a module upper cover 1, a module base 2, and a pull ring 3. The module upper cover 1 and the module base 2 form a receiving cavity, in which an MPO optical fiber adapter and a module circuit board assembly are arranged. The module upper cover 1 and the module base 2 are respectively provided with a first heat dissipation fin 11 and a second heat dissipation fin 21. The first heat dissipation fin 11 and the second heat dissipation fin 21 are both multiple. The multiple first heat dissipation fins 11 are located on the module upper cover 1 and are designed in small sections and are linearly staggered. The multiple second heat dissipation fins 21 are located on the module base 2 and are linearly distributed. The second heat dissipation fins 21 are in the shape of straight ribs. The module circuit board assembly includes a PCB board 4, which is mounted on the module base 2. A heat sink 41 corresponding to the first heat sink fin 11 is provided on the PCB board 4. The heat sink 41 is a plurality of heat sinks linearly distributed on the PCB board 4. The heat sink 41 is designed to be copper-plated. A heat sink 12 corresponding to the heat sink 41 is provided on the inner side of the top of the module upper cover 1. The heat sink 12 is connected to the first heat sink fin 11. The heat sink 41 is in close contact with the heat sink 12 to form a heat dissipation channel. The pull ring 3 is located at one end of the module cover 1 and the module base 2. The pull ring 3 and the module base 2 are assembled and fixed by a spring. A pull ring handle 31 is provided at the end of the pull ring 3 away from the module cover 1 and the module base 2. The pull ring handle 31 is flush with the bottom of the module base 2, and a rubber-coated area 32 corresponding to the module cover 1 and the module base 2 is provided on the inner side of the pull ring 3, thereby performing a rubber-coated treatment to maximize the space for the MPO jumper, facilitate the jumper insertion operation, and avoid interference.

[0028] When in use, the pull ring 3 and the module base 2 are assembled and fixed by a spring, the PCB board 4 is fixed above the module base 2, and the module cover 1 is fixed on the module base 2 to complete the assembly, wherein the heat sink 12 is located above the heat sink 41, and the heat sink 41 is designed with copper plating, so that the heating surface of the optical chip forms a good contact with the heat sink 41, and the heat sink 41 is in close contact with the heat sink 12 to form a good heat dissipation path, so that efficient heat dissipation is carried out through the first heat dissipation fins 11. The first heat dissipation fins 11 are staggered in small sections, and can effectively allow the air to fully exchange heat with the first heat dissipation fins 11 during the heat dissipation process, thereby enhancing the heat dissipation, the rubber-coated areas 32 on both sides of the pull ring 3 are located on both sides of the module cover 1 and the module base 2, and the bottom of the pull ring handle 31 is flush with the bottom of the module base 2, which increases the insertion space of the MPO jumper and facilitates the jumper insertion operation.

[0029] Compared with the prior art, the first heat dissipation fin 11 and the second heat dissipation fin 21 are designed on the module cover 1 and the module base 2 respectively. In particular, the first heat dissipation fin 11 adopts a small segment staggered distribution, which not only increases the heat dissipation area, but also allows the air to exchange heat with the heat dissipation fin more fully during the heat dissipation process, thereby improving the heat dissipation efficiency. At the same time, the heat dissipation block 41 on the PCB board 4 is a copper-plated design, which forms a good contact with the heating surface of the optical chip, and forms an effective heat dissipation path by closely contacting the heat dissipation platform 12, further enhancing the heat dissipation effect. The pull ring 3 is assembled and fixed with the module base 2 by a spring, and the bottom of the pull ring handle 31 is flush with the bottom of the module base 2, which is not only easy to operate, but also maximizes the insertion space of the MPO jumper, making the jumper insertion operation more convenient. In addition, the rubber-coated area 32 on the inner side of the pull ring 3 is rubber-coated, which not only increases the aesthetics, but also avoids interference, and further optimizes the spatial layout.

[0030] Example 2 In the existing design, the module cover 1 and the module base 2 are fixed by four screws. Space needs to be reserved for these four screws inside the module, especially around the PCB board, which affects the internal space of the PCB board 4. Therefore, the embodiment of the present application optimizes the module cover 1 and the module base 2 based on the above embodiment.

[0031] In this embodiment, the module cover 1 and the module base 2 are fixed by screws 5. There are two screws 5, and the screws 5 are located at the top of the module cover 1 close to the first heat dissipation fin 11. The end of the module cover 1 away from the first heat dissipation fin 11 is connected to the module base 2 through a snap assembly 6.

[0032] When in use, the routing of high-frequency signals has high requirements for space. Insufficient space will increase electromagnetic interference between high-frequency routing, thereby increasing signal loss. The existing design of the module cover 1 and the module base 2 has four screws. The present application fixes the module base 2 by cooperating with two bolts on the top of one end of the module cover 1 near the first heat dissipation fin 11 and a snap assembly 6 at the other end of the first heat dissipation fin 11. The tail screw can be removed to increase the internal space of the corresponding PCB board 4, freeing up more space for the PCB board 4, increasing space for high-frequency routing, and providing more layout options for high-frequency routing, thereby reducing high-frequency routing losses caused by insufficient space. At the same time, the screws 5 are located on the top surface of the module cover 1. During the assembly process, the screw tightening process can be performed without flipping the module, reducing unnecessary processes.

[0033] Compared with the prior art, by optimizing the screw layout, only two screws 5 and a snap assembly are used to achieve fixation, thereby removing the tail screw, significantly increasing the internal space of the PCB board 4, and providing more layout options for high-frequency wiring. By increasing the internal space of the PCB board 4, the electromagnetic interference between high-frequency wiring is effectively reduced, thereby reducing signal loss and improving the quality and stability of signal transmission. In the existing design, if the screw is located at the bottom or side of the module, it may be necessary to flip the module or adjust the angle during assembly to tighten the screw, which increases the complexity and time cost of assembly. In the present embodiment, the screw 5 is located on the top surface of the module cover 1, so that the screw tightening process can be easily performed without flipping the module during the assembly process.

[0034] Example 3 In the existing design, the connection between the light-transmitting component 42 and the silicon photonic component 43 is not stable enough, and there is a gap at the connection, which causes deviation or loss of the optical signal during the transmission and reception process. Therefore, the embodiment of the present application optimizes the light-transmitting component 42 and the silicon photonic component 43 based on the above embodiment.

[0035] In this embodiment, a light-transmitting component 42 and a silicon optical component 43 corresponding to the light-transmitting component 42 are provided on the PCB board 4, a first groove corresponding to the silicon optical component 43 is provided on the PCB board 4, the module base 2 is located inside the first groove, a second groove corresponding to the first groove is provided at the bottom of the silicon optical component 43, a sealed cavity is formed between the first groove and the second groove, the light-transmitting component 42 is fixed on the module upper cover 1 by a limit component 7, and the MPO optical fiber adapter is connected to the light-transmitting component 42; The limiting components 7 are located at both sides of one end of the first groove, and the first groove is provided with an opening corresponding to the limiting components 7, and the limiting components 7 are located inside the opening; The limiting assembly 7 includes a limiting plate 71 and a limiting spring 72. The limiting plates 71 are symmetrically arranged on both sides of the opening. The limiting plates 71 on both sides are connected to the inner wall of the opening through the limiting spring 72. The light-transmitting assembly 42 is provided with a limiting rod 421 corresponding to the limiting assembly 7. The limiting rod 421 is located on both sides of the light-transmitting assembly 42 and is fixedly connected to the light-transmitting assembly 42. The limiting plate 71 is provided with a limiting point 711. The limiting point 711 is inwardly convex and smoothly transitions with the limiting plate 71. The limiting rod 421 is provided with an annular groove 4211 corresponding to the limiting point 711. The annular groove 4211 smoothly transitions with the outer surface of the limiting rod 421. The limiting plates 71 on both sides have trumpet-shaped openings at one end close to the limiting rod 421 , and the top of the limiting rod 421 is semicircular in design.

[0036] When in use, the light-transmitting component 42 is placed on the PCB board 4, and the limiting rod 421 is inserted between the limiting plates 71 on both sides, so that the limiting plates 71 on both sides begin to expand outward, and the limiting spring 72 begins to be stressed, and the second heat dissipating fin 21 moves to the bottom of the limiting plate 71, and the limiting point 711 is stuck in the annular groove 4211 on the limiting rod 421, and the limiting rod 421 is limited and fixed, so as to achieve the purpose of limiting the light-transmitting component 42. After being fixed, the light-transmitting component 42 corresponds to the silicon optical component 43, and a sealed cavity is formed between the first groove and the second groove. While ensuring the transmission and reception of optical signals, the hidden setting of the silicon optical component 43 is realized, and the volume of the optical module is reduced. The limiting plates 71 on both sides are trumpet-shaped and cooperate with the semicircular design on the top of the limiting rod 421, which makes it easy to squeeze the limiting rod 421 to both sides during the fixing process, effectively dispersing the stress and reducing the risk of damage.

[0037] Compared with the prior art, the light-transmitting component 42 is firmly fixed by the cooperation between the limit rod 421, the limit point 711 and the annular groove 4211. When the limit rod 421 is inserted between the limit plates 71, the limit point 711 is inserted into the annular groove 4211 to form a stable mechanical connection, which effectively prevents the light-transmitting component 42 from loosening or displacement. Since the connection between the light-transmitting component 42 and the silicon optical component 43 is more stable, and a sealed cavity is formed between the first groove and the second groove, the deviation or loss of the optical signal during the transmission and reception process is reduced. The sealed cavity effectively isolates the influence of the external environment on the optical signal and ensures the accurate transmission of the optical signal. The limit plates 71 on both sides are designed with a trumpet-shaped opening, which cooperates with the semicircular design at the top of the limit rod 421. In the process of fixing the light-transmitting component 42, it is convenient to squeeze the limit rod 421 to both sides, which effectively disperses the stress and reduces the risk of damage caused by stress concentration.

[0038] The present invention and its embodiments are described above, which is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it and do not deviate from the purpose of the invention, they can creatively design a structure and embodiment similar to the technical solution, which should fall within the protection scope of the present invention.

Claims

1. A QSFP-DD packaged 400G optical module structure, comprising a module cover (1), a module base (2), and a pull ring (3), wherein the module cover (1) and the module base (2) form a receiving cavity, wherein an MPO optical fiber adapter and a module circuit board assembly are arranged in the receiving cavity, and wherein: The module upper cover (1) and the module base (2) are respectively provided with a first heat dissipation fin (11) and a second heat dissipation fin (21); the first heat dissipation fin (11) is located on the module upper cover (1) and is designed in small sections and is staggered on the module upper cover (1); the second heat dissipation fin (21) is located on the module base (2) and is in the shape of a straight rib; The module circuit board assembly comprises a PCB board (4), a heat sink (41) corresponding to the first heat sink fin (11) being provided on the PCB board (4), a heat sink (12) corresponding to the heat sink (41) being provided on the inner side of the top of the module upper cover (1), the heat sink (12) being connected to the first heat sink fin (11), and the heat sink (41) being in close contact with the heat sink (12); The pull ring (3) is located at one end of the module upper cover (1) and the module base (2); a rubber-coated area (32) corresponding to the module upper cover (1) and the module base (2) is provided on the inner side of the pull ring (3); a pull ring handle (31) is provided at one end of the pull ring (3); and the pull ring handle (31) is flush with the bottom of the module base (2).

2. A QSFP-DD packaged 400G optical module structure according to claim 1, characterized in that: There are a plurality of the first heat dissipation fins (11) and a plurality of the second heat dissipation fins (21), and the plurality of the first heat dissipation fins (11) are linearly staggered and distributed.

3. The QSFP-DD package 400G optical module structure according to claim 1, characterized in that: The pull ring (3) and the module base (2) are assembled and fixed by means of a spring, and the pull ring handle (31) is located at an end of the pull ring (3) away from the module upper cover (1) and the module base (2).

4. The QSFP-DD package 400G optical module structure according to claim 1, characterized in that: The module upper cover (1) and the module base (2) are fixed together at one end close to the first heat dissipation fin (11) by means of screws (5), and the module upper cover (1) and the module base (2) are connected at one end away from the screws (5) by means of a buckle assembly (6).

5. The QSFP-DD package 400G optical module structure according to claim 4, characterized in that: There are two screws (5), and the screws (5) are located at the top of one end of the module upper cover (1) close to the first heat dissipation fin (11).

6. The QSFP-DD package 400G optical module structure according to claim 1, characterized in that: The PCB board (4) is provided with a light-transmitting component (42) and a silicon optical component (43); the PCB board (4) is provided with a first groove corresponding to the silicon optical component (43); a second groove corresponding to the first groove is provided at the bottom of the silicon optical component (43); a sealed cavity is formed between the first groove and the second groove.

7. The QSFP-DD packaged 400G optical module structure according to claim 6, characterized in that: The module base (2) is located inside the first groove, the light-transmitting component (42) is connected to the MPO optical fiber adapter, and the light-transmitting component (42) is fixed on the module upper cover (1) by means of a limiting component (7).

8. The QSFP-DD packaged 400G optical module structure according to claim 7, characterized in that: The limiting components (7) are located on both sides of one end of the first groove, the first groove is provided with an opening corresponding to the limiting components (7), and the limiting components (7) are located inside the opening.

9. The QSFP-DD packaged 400G optical module structure according to claim 8, characterized in that: The limit assembly (7) comprises a limit plate (71) and a limit spring (72); the limit plates (71) are symmetrically arranged inside the opening; the limit plates (71) on both sides are connected to the inner wall of the opening via the limit springs (72); a limit rod (421) corresponding to the limit assembly (7) is provided on the light-transmitting assembly (42); a limit point (711) is provided on the limit plate (71); and an annular groove (4211) corresponding to the limit point (711) is provided on the limit rod (421).

10. The QSFP-DD packaged 400G optical module structure according to claim 9, characterized in that: The limiting rods (421) are located on both sides of the light-transmitting component (42) and are fixedly connected to the light-transmitting component (42); the limiting plates (71) on both sides have trumpet-shaped openings at one end close to the limiting rods (421); and the top of the limiting rods (421) is semicircular.

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