Display panel, tiled display device and preparation method of tiled display device

Abstract

The invention provides a display panel, a tiled display device and a preparation method of the tiled display device. The display panel comprises a substrate, a binding terminal, a driving circuit layer and a miniature light-emitting diode device, the binding terminal is arranged on one side of the substrate, the driving circuit layer is arranged on the side, away from the binding terminal, of the substrate and comprises a signal line, and the miniature light-emitting diode device is arranged on the side, away from the substrate, of the driving circuit layer. The substrate is provided with a via hole, and the signal line passes through the via hole and is connected with the binding terminal. According to the display panel, the binding terminal is arranged on one side of the substrate, the signal line penetrates through the via hole to be connected with the binding terminal, the binding position of the display panel is arranged on the back face, the binding terminal does not need to be arranged in the edge area, binding wires do not need to be arranged on the side face, a frame is reduced, and the yield of the display panel is increased; and the signal is directly input from the bottom of the display panel, and the length of the signal line is small, so that the voltage drop is reduced, and the display uniformity is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel, a spliced ​​display device and a method for manufacturing the same. Background Art

[0002] Micro-LED (micro light-emitting diode) display devices are widely used due to their advantages such as self-luminescence, high brightness, high contrast, high resolution and color saturation, long life, fast response speed, and low power consumption. In order to achieve large-screen display, existing display devices will splice multiple Micro-LED display devices. The existing splicing methods of Micro-LED display devices include front binding, back binding + side wiring, and side binding + side wiring. Among them, the cost of front binding is lower, but the frame is larger; the process of back binding + side wiring is more complicated, which makes the side wiring easy to break and the yield is lower; the process of side binding + side wiring is more complicated, and the contact area between the side circuit and the metal layer is small, and the current is limited, resulting in limited application scenarios of Micro-LED display devices. And the above three methods are to set the wiring in the binding area, resulting in a large voltage drop and inability to achieve flexibility.

[0003] Therefore, existing Micro-LED splicing display devices have technical problems such as being unable to balance the frame and yield, and having poor brightness uniformity. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a spliced ​​display device and a method for manufacturing the same, so as to solve the technical problems that the existing Micro-LED spliced ​​display devices cannot take into account both the frame and the yield and have poor brightness uniformity.

[0005] An embodiment of the present application provides a display panel, the display panel comprising:

[0006] substrate;

[0007] A binding terminal is arranged on one side of the substrate;

[0008] A driving circuit layer, arranged on a side of the substrate away from the binding terminals, the driving circuit layer comprising a signal line;

[0009] A micro light emitting diode device is arranged on a side of the driving circuit layer away from the substrate;

[0010] Wherein, the substrate is provided with a via hole, and the signal line passes through the via hole and is connected with the binding terminal.

[0011] In some embodiments, the signal line includes a data line, a power signal line and a scan line, and the binding terminal includes a first binding terminal, a second binding terminal and a third binding terminal, the first binding terminal is connected to the data line, the second binding terminal is connected to the power signal line, and the third binding terminal is connected to the scan line.

[0012] In some embodiments, the signal line includes a data line and a scan line, the display panel includes a plurality of pixel units, each of the pixel units includes a plurality of sub-pixel units, each of the sub-pixel units is connected to a scan line, and each of the pixel units is connected to a data line.

[0013] In some embodiments, the micro-LED device includes a blue light micro-LED device, and the display panel also includes a color conversion layer, a reflective layer, a color filter layer and a black layer. The color conversion layer is arranged on the side of the blue light micro-LED device away from the driving circuit layer, the reflective layer is arranged on the side of the blue light micro-LED device away from the driving circuit layer, the reflective layer and the color conversion layer are arranged crosswise, the color filter layer is arranged on the side of the color conversion layer away from the driving circuit layer, the black layer is arranged on the side of the color conversion layer away from the driving circuit layer, and the black layer and the color filter layer are arranged crosswise.

[0014] In some embodiments, the substrate includes a first inorganic layer, a flexible layer, and a second inorganic layer, the flexible layer is disposed between the first inorganic layer and the second inorganic layer, and the second inorganic layer is disposed between the flexible layer and the driving circuit layer.

[0015] At the same time, an embodiment of the present application provides a spliced ​​display device, which includes multiple display panels, connectors and flexible circuit boards as described in any of the above embodiments, the binding terminals in the display panels are connected to the connectors, the connectors are connected to the flexible circuit boards, and the adjacent display panels are connected through the flexible circuit boards.

[0016] In some embodiments, the spliced ​​display device further includes a welding layer, which is disposed between the connector and the binding terminal, and the welding layer connects the binding terminal and the connector.

[0017] In some embodiments, the spliced ​​display device also includes a system board and a power board, the system board is arranged on one side of the display panel, and the power board is arranged on a side of the system board away from the display panel, the system board is connected to the display panel through the flexible circuit board, and the power board is connected to the system board through the flexible circuit board.

[0018] In some embodiments, the splicing display device also includes an encapsulation protective layer, a first flexible protective layer and a second flexible protective layer. The encapsulation protective layer is arranged around the display panel, the first flexible protective layer is arranged on a side of the encapsulation protective layer away from the display panel, and the second flexible protective layer is arranged on the other side of the encapsulation protective layer away from the display panel, and the first flexible protective layer and the second flexible protective layer are arranged opposite to each other.

[0019] At the same time, an embodiment of the present application provides a method for preparing a spliced ​​display device, wherein the method for preparing a spliced ​​display device prepares a spliced ​​display device as described in any of the above embodiments, and the method for preparing a spliced ​​display device comprises:

[0020] providing a substrate;

[0021] forming binding terminals, a substrate, a driving circuit layer and a micro light emitting diode device on the substrate in sequence to obtain a display panel;

[0022] Transferring the display panel to a temporary substrate, and removing the base to expose the binding terminals;

[0023] Binding a connector on a side of the binding terminal away from the substrate;

[0024] removing the temporary substrate and forming a packaging protection layer around the display panel;

[0025] Adjacent display panels are connected via a flexible circuit board, and a first flexible protective layer and a second flexible protective layer are respectively provided on both sides of the display panel to obtain a spliced ​​display device.

[0026] In some embodiments, the step of providing a substrate comprises:

[0027] providing a glass substrate;

[0028] A silicon oxide layer and an amorphous silicon layer are sequentially formed on a glass substrate; or a polyimide layer is formed on a glass substrate.

[0029] Beneficial effects: The present application provides a display panel, a spliced ​​display device and a preparation method thereof; the display panel includes a substrate, a binding terminal, a driving circuit layer and a micro-light emitting diode device, wherein the binding terminal is arranged on one side of the substrate, the driving circuit layer is arranged on the side of the substrate away from the binding terminal, the driving circuit layer includes a signal line, and the micro-light emitting diode device is arranged on the side of the driving circuit layer away from the substrate, wherein a via hole is arranged on the substrate, and the signal line passes through the via hole to connect with the binding terminal. The present application arranges the binding terminal on one side of the substrate so that the signal line passes through the via hole to connect with the binding terminal, so that the binding position of the display panel is arranged on the back, and there is no need to arrange the binding terminal in the edge area, and there is no need to arrange the binding wiring on the side, thereby reducing the frame and improving the yield of the display panel, and the signal is directly input from the bottom of the display panel, the length of the signal line is short, the voltage drop is reduced, and the display uniformity is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0031] Figure 1 A first schematic diagram of a display panel provided in an embodiment of the present application.

[0032] Figure 2 A second schematic diagram of a display panel provided in an embodiment of the present application.

[0033] Figure 3 This is a first schematic diagram of a spliced ​​display device provided in an embodiment of the present application.

[0034] Figure 4 This is a second schematic diagram of the spliced ​​display device provided in an embodiment of the present application.

[0035] Figure 5 This is a flow chart of a method for preparing a spliced ​​display device provided in an embodiment of the present application.

[0036] Figure 6 This is a schematic diagram of a first structure of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application.

[0037] Figure 7 A second structural schematic diagram of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application.

[0038] Figure 8 A third structural schematic diagram of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application.

[0039] Fig. 9A fourth structural schematic diagram of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0042] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0044] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0045] In view of the technical problems that existing Micro-LED spliced ​​display devices cannot balance the frame and yield and have poor brightness uniformity, the embodiments of the present application provide a display panel, a spliced ​​display device and a preparation method thereof to solve the above technical problems.

[0046] like Figure 1 As shown, an embodiment of the present application provides a display panel, and the display panel 1 includes:

[0047] substrate 11;

[0048] A binding terminal 19 is provided on one side of the substrate 11;

[0049] A driving circuit layer 12 is disposed on a side of the substrate 11 away from the binding terminal 19 , and the driving circuit layer 12 includes a signal line 128 ;

[0050] A micro light emitting diode device 13 is disposed on a side of the driving circuit layer 12 away from the substrate 11;

[0051] The substrate 11 is provided with a via hole 114 , and the signal line 128 passes through the via hole 114 and is connected to the binding terminal 19 .

[0052] An embodiment of the present application provides a display panel. The display panel 1 sets a binding terminal 19 on one side of a substrate 11, and connects a signal line 128 to the binding terminal 19 through a via 114, so that the binding position of the display panel 1 is set on the back. There is no need to set a binding terminal in the edge area, and there is no need to set a binding line on the side, thereby reducing the frame and improving the yield of the display panel. The signal is directly input from the bottom of the display panel, the length of the signal line is short, the voltage drop is reduced, and the display uniformity is improved.

[0053] In some embodiments, Figure 1 As shown, the signal line 128 includes a data line 125a, a power signal line 125b and a scan line 123a, and the binding terminal 19 includes a first binding terminal 191, a second binding terminal 192 and a third binding terminal 193. The first binding terminal 191 is connected to the data line 125a, the second binding terminal 192 is connected to the power signal line 125b, and the third binding terminal 193 is connected to the scan line 123a. By connecting the data line 125a, the power signal line 125b and the scan line 123a to the first binding terminal 191, the second binding terminal 192 and the third binding terminal 193 respectively, signals can be input to each signal line through the binding terminal, so that the display panel can work normally, and the signal is input from the back of the display panel, so that the length of the signal line can be shortened, the width of the signal line can be increased, the voltage drop can be reduced, the display uniformity of the display panel can be improved, and the power consumption can be reduced.

[0054] Specifically, the above-mentioned embodiment is described by taking the data line 125a, the power signal line 125b and the scan line 123a as an example of being connected to the binding terminal, but the embodiments of the present application are not limited to this. For example, when there are other wirings in the display panel that need to be bound to the binding terminal, the other wirings can also be bound to the binding terminal. For example, if the display panel includes a low-potential signal line, the low-potential signal line can be bound to the binding terminal to input a signal to the low-potential signal line.

[0055] Specifically, the above embodiment is described by taking the example of the scan line being directly connected to the binding terminal, but the embodiment of the present application is not limited thereto. For example, when a gate drive circuit is used, the signal of the scan line can be controlled by the gate drive circuit, so that the clock signal line in the gate drive circuit can be connected to the binding terminal, and the scan line does not need to be connected to the binding terminal. Similarly, for other routings, when other designs are used, the signal line connected to the binding terminal can also be changed accordingly.

[0056] Specifically, Figure 1As shown, the embodiment of the present application is described by taking the example that the data line 125a and the power signal line 125b are set in the source and drain layer 125, and the scan line 123a is set in the gate layer 123, but the embodiment of the present application is not limited to this. The setting position of each signal line can be adjusted accordingly according to the different designs of the driving circuit layer. For example, when the driving circuit layer includes multiple source and drain layers, the data line can be set on one of the source and drain layers.

[0057] Specifically, Figure 1 In the figure, the driving circuit layer 12 uses a top-gate and bottom-contact thin film transistor as an example for explanation, but the embodiments of the present application are not limited to this. The thin film transistor in the driving circuit layer 12 can be a thin film transistor of other structures. For example, the driving circuit layer 12 can use a bottom-gate and top-contact thin film transistor.

[0058] In some embodiments, Figure 1 , Figure 2 As shown, the signal line includes a data line 125a and a scan line 123a, and the display panel 1 includes a plurality of pixel units 21, each of the pixel units 21 includes a plurality of sub-pixel units (for example, a first sub-pixel unit 211, a second sub-pixel unit 212, and a third sub-pixel unit 213), each of the sub-pixel units is connected to a scan line 123a, and each of the pixel units 21 is connected to a data line 125a. By connecting each sub-pixel unit to a scan line 123a and each pixel unit 21 to a data line 125a, the number of data lines 125a can be reduced, the number of binding terminals can be reduced, and the number of binding terminals can be further reduced through a gate driving circuit, so that when multiple display panels are spliced, the number of terminals on the connector is small, so that the long end of the connector can be consistent with the center line of the reel of the spliced ​​display device, so that the spliced ​​display device can be normally rolled.

[0059] Specifically, when the display panel is connected to the connector to input signals, too many binding terminals may cause the long end of the connector to be perpendicular to the center line of the scroll, which may cause the terminals on the connector to break when the spliced ​​display device is rolled up. Therefore, by adopting the Tri-gate (each pixel unit is connected to three scan lines) driving method, the number of data lines can be reduced, and the scan lines can be driven by the gate driving circuit to reduce the number of terminals for inputting scan signals, thereby reducing the number of binding terminals, making the long end of the connector consistent with the center line direction of the scroll, so that the spliced ​​display device can be rolled up normally.

[0060] In some embodiments, Figure 1As shown, the micro-LED device 13 includes a blue micro-LED device, and the display panel 1 further includes a color conversion layer 15, a reflective layer 16, a color filter layer 17 and a black layer 18. The color conversion layer 15 is arranged on the side of the blue micro-LED device away from the driving circuit layer 12, the reflective layer 16 is arranged on the side of the blue micro-LED device away from the driving circuit layer 12, the reflective layer 16 and the color conversion layer 15 are arranged crosswise, the color filter layer 17 is arranged on the side of the color conversion layer 15 away from the driving circuit layer 12, the black layer 18 is arranged on the side of the color conversion layer 15 away from the driving circuit layer 12, and the black layer 18 and the color filter layer 17 are arranged crosswise. By arranging a blue micro-LED device and arranging the color conversion layer 15 on the blue micro-LED device, the light emitted by the blue micro-LED device is converted into white light after passing through the color conversion layer 15, and then by arranging the color filter layer 17 on the color conversion layer 15, the display panel 1 realizes color display. The color conversion layer 15 and the reflective layer 16 are arranged crosswise, so that the light can be reflected, thereby improving the utilization rate of the light. In addition, by arranging a black layer on the reflective layer 16, the reflectivity of the display panel is reduced, thereby improving the contrast of the display panel.

[0061] Specifically, Figure 1 As shown, the color filter layer 17 includes a red color resist 171 , a green color resist 172 and a blue color resist 173 .

[0062] Specifically, Figure 1 As shown, the embodiment of the present application is described by taking the reflective layer 16 disposed between multiple color conversion units of the color conversion layer 15 as an example, but the embodiment of the present application is not limited thereto. For example, the reflective layer 16 can be disposed between adjacent micro-light emitting diode devices.

[0063] Specifically, the color conversion layer 15 may be a red-green color conversion layer, or a yellow color conversion layer, or a yellow+red color conversion layer, so that the light passing through the color conversion layer 15 is converted into white light.

[0064] Specifically, Figure 1 As shown, the substrate 11 includes a first inorganic layer 111, a flexible layer 112 and a second inorganic layer 113. The flexible layer 112 is disposed between the first inorganic layer 111 and the second inorganic layer 113, and the second inorganic layer 113 is disposed between the flexible layer 112 and the driving circuit layer 12. By making the substrate 11 a laminated structure of the first inorganic layer 111, the flexible layer 112 and the second inorganic layer 113, the substrate 11 can block the intrusion of water and oxygen, and the substrate 11 can have good flexibility and support. The substrate 11 can flatten the binding terminal 19, which is convenient for the preparation of subsequent film layers.

[0065] In some embodiments, the thickness of the first inorganic layer 111 is in the range of 0.1 micron to 0.5 micron, and the thickness of the second inorganic layer 113 is in the range of 0.1 micron to 0.5 micron. If the thickness of the first inorganic layer 111 and the second inorganic layer 113 is small, the first inorganic layer 111 and the second inorganic layer 113 can isolate the invasion of water and oxygen, and avoid the poor flexibility of the substrate 11 caused by the excessive thickness of the first inorganic layer 111 and the second inorganic layer 113, thereby improving the flexibility of the display panel 1 and the ability to isolate water and oxygen.

[0066] In some embodiments, the thickness of the flexible layer 112 ranges from 2 microns to 7 microns. By making the thickness of the flexible layer 112 larger, the flexibility of the substrate 11 is improved, and the flexible layer 112 can flatten the binding terminal 19 and the first inorganic layer 111, which is convenient for the preparation of subsequent film layers, and the flexible layer 112 can support the subsequent film layers to prevent other film layers from collapsing, thereby improving the yield of the display panel 1.

[0067] Specifically, Figure 1 As shown, the driving circuit layer 12 includes an active layer 121 , a gate insulating layer 122 , a gate layer 123 , an interlayer insulating layer 124 , a source and drain electrode layer 125 , a planarization layer 126 and an electrode layer 127 .

[0068] Specifically, Figure 1 As shown, the electrode layer 127 includes a pixel electrode 127a and a common electrode 127b.

[0069] Specifically, Figure 1 As shown, a filling layer 14 is provided between adjacent micro-LED devices 13 .

[0070] Specifically, Figure 1 As shown, the display panel 1 further includes an organic upper substrate 20 . By providing the organic upper substrate 20 , the display panel 1 has better flexibility.

[0071] At the same time, an embodiment of the present application provides a spliced ​​display device, which includes a plurality of display panels as described in any of the above embodiments.

[0072] like Figure 3 , Figure 4 As shown, an embodiment of the present application provides a spliced ​​display device, which includes a plurality of display panels 1, a connector 31 and a flexible circuit board 41, wherein the binding terminals 19 in the display panels 1 are connected to the connector 31, the connector 31 is connected to the flexible circuit board 41, and adjacent display panels 1 are connected via the flexible circuit board 41.

[0073] In the embodiment of the present application, a connector 31 is provided so that the connector 31 can input a driving signal to the display panel 1 so that the display panel 1 can display normally, and the flexible circuit board 41 is connected to the connector 31 so that adjacent display panels 1 can be connected through the flexible circuit board 41, and the signals between the display panels 1 can be connected in series, so as to control each display panel 1 so that each display panel 1 can display various parts of a picture, and the connector 31 and the flexible circuit board 41 are both located on the back of the display panel 1 and will not occupy the space in the border area of ​​the display panel 1, thereby realizing a borderless display.

[0074] In some embodiments, the flexible circuit board 41 is disposed on the entire surface, that is, the flexible circuit board 41 covers all the display panels 1, and all the display panels 1 are connected by one flexible circuit board 41, without the need to set up multiple flexible circuit boards 41, thereby reducing the process steps, reducing the difficulty of binding, and improving the yield of the spliced ​​display device 10. In addition, when the thickness of the flexible layer 112 is relatively thin, it cannot provide a good supporting effect, and this defect can be compensated by the flexible circuit board 41 disposed on the entire surface.

[0075] In some embodiments, Figure 3 As shown, the spliced ​​display device 10 further includes a welding layer 32, which is disposed between the connector 31 and the binding terminal 19, and the welding layer 32 connects the binding terminal 19 and the connector 31. By providing the welding layer 32 to connect the binding terminal 19 and the connector 31, the binding effect of the connector 31 and the binding terminal 19 is improved, and the connector 31 and the binding terminal 19 are prevented from falling off and causing poor display, thereby improving the yield of the display panel.

[0076] Specifically, Figure 3 As shown, the connector 31 includes a substrate 311 and a connecting terminal 312 , and the connecting terminal 312 is connected to the binding terminal 19 through a welding layer 32 .

[0077] In some embodiments, Figure 3 , Figure 4As shown, the spliced ​​display device 10 further includes a system board 42 and a power board 43. The system board 42 is arranged on one side of the display panel 1, and the power board 43 is arranged on a side of the system board 42 away from the display panel 1. The system board 42 is connected to the display panel 1 through the flexible circuit board 41, and the power board 43 is connected to the system board 42 through the flexible circuit board 41. By connecting the system board 42 and the display panel 1 with the flexible circuit board 41, and connecting the power board 43 and the system board 42 with the flexible circuit board 41, each display panel 1 can be connected to the power board 43 and the system board 42 through the flexible circuit board 41, so that the display panel 1 can work normally through the control of the system board 42 and the power board 43, and the display panel 1, the system board 42 and the power board 43 are arranged along the rolling direction of the rolling axis, so that the spliced ​​display device 10 can be rolled for display.

[0078] Specifically, Figure 3 As shown, along the direction from the display panel 1 to the power board 43, the spliced ​​display device 10 can be curled along the upper end or the lower end of the spliced ​​display device to store the spliced ​​display device 10, or by unfolding the spliced ​​display device 10, the spliced ​​display device 10 can be displayed in different display areas.

[0079] Specifically, Figure 4 The upper and lower ends of each display panel 1 are connected to a connector 31, and accordingly, the upper and lower ends of the display panel 1 are provided with binding terminals, but it can be understood that the display panel located at the top end of the splicing display device 10 will only be connected to the display panel on the lower side, and therefore, the display panel at the top end can be connected to the connector 31 only at the lower end.

[0080] In some embodiments, Figure 3 As shown, the spliced ​​display device 10 further includes an encapsulation protective layer 33, a first flexible protective layer 34, and a second flexible protective layer 35. The encapsulation protective layer 33 is disposed around the display panel 1, the first flexible protective layer 34 is disposed on a side of the encapsulation protective layer 33 away from the display panel 1, and the second flexible protective layer 35 is disposed on the other side of the encapsulation protective layer 33 away from the display panel 1, and the first flexible protective layer 34 and the second flexible protective layer 35 are disposed opposite to each other. By disposing the encapsulation protective layer 33 around the display panel 1, the water and oxygen barrier capability of the spliced ​​display device 10 is improved, and by disposing the first flexible protective layer 34 and the second flexible protective layer 35 above and below the display panel 1, the splicing effect and the bending performance of the spliced ​​display device 10 can be improved.

[0081] Specifically, the material of the encapsulation protection layer 33 includes parylene.

[0082] At the same time, an embodiment of the present application provides a method for preparing a spliced ​​display device, and the method for preparing a spliced ​​display device prepares a spliced ​​display device as described in any of the above embodiments.

[0083] Figure 6 This is a schematic diagram of a first structure of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application. Figure 7 A second structural schematic diagram of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application. Figure 8 A third structural schematic diagram of a spliced ​​display device corresponding to each step in the method for preparing a spliced ​​display device provided in an embodiment of the present application.

[0084] Specifically, Figure 5 As shown, the preparation method of the spliced ​​display device includes:

[0085] S1, providing a substrate 51; the structure of the spliced ​​display device 10 corresponding to this step is as follows: Figure 6 As shown in (a) or as Fig. 9 The multiple display panels 1 shown are spliced ​​together;

[0086] Specifically, the step of providing the substrate 51 includes: providing a glass substrate 511 ; sequentially forming a silicon oxide layer 513 and an amorphous silicon layer 514 on the glass substrate 511 ; or forming a polyimide layer 512 on the glass substrate 511 .

[0087] Specifically, Figure 6 As shown in (a) , a glass substrate 511 may be provided, and then a polyimide layer 512 may be formed on the glass substrate 511 , so that the polyimide layer 512 supports subsequent materials.

[0088] Specifically, the thickness of the polyimide layer 512 ranges from 2 micrometers to 7 micrometers, so that the thickness of the polyimide layer 512 is relatively large, the polyimide layer 512 can planarize the rough surface of the glass substrate 511, and the polyimide layer 512 can support other film layers.

[0089] Specifically, Fig. 9 As shown, a glass substrate 511 can be provided, and then a silicon oxide layer 513 can be formed on the glass substrate 511, and then an amorphous silicon layer 514 can be formed on the silicon oxide layer 513. The silicon oxide layer 513 and the amorphous silicon layer 514 can be used to replace the polyimide layer 512 to reduce costs.

[0090] Specifically, the thickness of the silicon oxide layer 513 ranges from 0.1 micron to 0.5 micron, and the thickness of the amorphous silicon layer 514 ranges from 0.1 micron to 0.5 micron; this makes the thickness of the silicon oxide layer 513 and the amorphous silicon layer 514 thinner, thereby avoiding the subsequent time-consuming peeling of the silicon oxide layer 513 and the amorphous silicon layer 514, and improving the preparation efficiency.

[0091] S2, forming the binding terminal 19, the substrate 11 and the driving circuit layer 12 on the substrate 51 in sequence; the structure of the spliced ​​display device 10 corresponding to this step is as follows Figure 6 As shown in (a);

[0092] Specifically, after the binding terminal 19 and the substrate 11 are formed in sequence on the base 51, a driving circuit layer 12 will be formed on the substrate 11. After the active layer 121, the gate insulating layer 122, the gate layer 123, and the interlayer insulating layer 124 are formed in sequence, the interlayer insulating layer 124, the second inorganic layer 113, the flexible layer 112 and the first inorganic layer 111 are etched to form a via 114, so that the signal line 128 passes through the via 114 to connect with the binding terminal 19.

[0093] S3, transferring the micro light emitting diode device 13 to the driving circuit layer 12 to obtain the display panel 1; the structure of the spliced ​​display device 10 corresponding to this step is as follows Figure 6 (b) and Figure 6 As shown in (c);

[0094] S4, the display panel 1 is transferred to the temporary substrate 52, and the base 51 is removed to expose the binding terminals 19; the structure of the spliced ​​display device 10 corresponding to this step is as follows: Figure 7 As shown in (a);

[0095] Specifically, Figure 6 (c) and Figure 7 As shown in (a), since it is necessary to bind the connector 31 on the back of the display panel 1, it is necessary to remove the substrate 51 on the back of the display panel 1 to expose the binding terminal 19, and in order to avoid damage to the display panel 1, the display panel 1 will be transferred to a temporary substrate 52.

[0096] Specifically, the temporary substrate 52 can support the display panel 1 to prevent the display panel 1 from being damaged when the substrate 51 is peeled off, thereby facilitating the process of peeling off the substrate 51 .

[0097] S5, binding the connector 31 on the side of the binding terminal 19 away from the substrate; the structure of the splicing display device 10 corresponding to this step is as follows Figure 7 As shown in (b);

[0098] S6, removing the temporary substrate 52, and forming a packaging protection layer 33 on the periphery of the display panel 1; the structure of the spliced ​​display device 10 corresponding to this step is as follows: Figure 8 As shown;

[0099] S7, connecting adjacent display panels 1 through a flexible circuit board 41, and respectively providing a first flexible protective layer 34 and a second flexible protective layer 35 on both sides of the display panel 1, to obtain a spliced ​​display device 10; the structure of the spliced ​​display device 10 corresponding to this step is as follows: Figure 3 , Figure 4 shown.

[0100] An embodiment of the present application provides a method for preparing a spliced ​​display device. The spliced ​​display device prepared by the method for preparing a spliced ​​display device sets a binding terminal 19 on one side of a substrate 11, and allows a signal line 128 to pass through a via 114 and be connected to the binding terminal 19, so that the binding position of a display panel 1 is set on the back. There is no need to set a binding terminal in an edge area, and there is no need to set a binding line on the side, thereby reducing the frame and improving the yield of the display panel. In addition, the signal is directly input from the bottom of the display panel, the length of the signal line is short, the voltage drop is reduced, and the display uniformity is improved.

[0101] According to the above embodiments, it can be seen that:

[0102] Embodiments of the present application The present application provides a display panel, a spliced ​​display device and a preparation method thereof; the display panel includes a substrate, a binding terminal, a driving circuit layer and a micro-light emitting diode device, the binding terminal is arranged on one side of the substrate, the driving circuit layer is arranged on the side of the substrate away from the binding terminal, the driving circuit layer includes a signal line, and the micro-light emitting diode device is arranged on the side of the driving circuit layer away from the substrate, wherein a via hole is arranged on the substrate, and the signal line passes through the via hole to connect with the binding terminal. The present application arranges the binding terminal on one side of the substrate so that the signal line passes through the via hole to connect with the binding terminal, so that the binding position of the display panel is arranged on the back, and there is no need to arrange the binding terminal in the edge area, and there is no need to arrange the binding wiring on the side, thereby reducing the frame and improving the yield of the display panel, and the signal is directly input from the bottom of the display panel, the length of the signal line is small, the voltage drop is reduced, and the display uniformity is improved.

[0103] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0104] The above is a detailed introduction to a display panel, a spliced ​​display device and a preparation method thereof provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A binding terminal is arranged on one side of the substrate; A driving circuit layer, arranged on a side of the substrate away from the binding terminals, the driving circuit layer comprising a signal line; A micro light emitting diode device is arranged on a side of the driving circuit layer away from the substrate; Wherein, the substrate is provided with a via hole, and the signal line passes through the via hole and is connected with the binding terminal.

2. The display panel according to claim 1, wherein: The signal line includes a data line, a power signal line and a scan line, and the binding terminal includes a first binding terminal, a second binding terminal and a third binding terminal, the first binding terminal is connected to the data line, the second binding terminal is connected to the power signal line, and the third binding terminal is connected to the scan line.

3. The display panel according to claim 1, wherein: The signal line includes a data line and a scan line, the display panel includes a plurality of pixel units, each of the pixel units includes a plurality of sub-pixel units, each of the sub-pixel units is connected to one of the scan lines, and each of the pixel units is connected to one of the data lines.

4. The display panel according to claim 1, wherein: The micro-LED device includes a blue micro-LED device, and the display panel also includes a color conversion layer, a reflective layer, a color filter layer and a black layer. The color conversion layer is arranged on a side of the blue micro-LED device away from the driving circuit layer, the reflective layer is arranged on a side of the blue micro-LED device away from the driving circuit layer, the reflective layer and the color conversion layer are arranged crosswise, the color filter layer is arranged on a side of the color conversion layer away from the driving circuit layer, the black layer is arranged on a side of the color conversion layer away from the driving circuit layer, and the black layer and the color filter layer are arranged crosswise.

5. The display panel according to claim 1, wherein: The substrate includes a first inorganic layer, a flexible layer, and a second inorganic layer. The flexible layer is disposed between the first inorganic layer and the second inorganic layer. The second inorganic layer is disposed between the flexible layer and the driving circuit layer.

6. A splicing display device, characterized in that: It comprises a plurality of display panels, connectors and flexible circuit boards as described in any one of claims 1 to 5, wherein the binding terminals in the display panels are connected to the connectors, the connectors are connected to the flexible circuit boards, and adjacent display panels are connected via the flexible circuit boards.

7. The splicing display device according to claim 6, characterized in that: The spliced ​​display device further includes a welding layer, which is disposed between the connector and the binding terminal, and connects the binding terminal and the connector.

8. The splicing display device according to claim 6, characterized in that: The spliced ​​display device also includes a system board and a power board. The system board is arranged on one side of the display panel, and the power board is arranged on a side of the system board away from the display panel. The system board is connected to the display panel through the flexible circuit board, and the power board is connected to the system board through the flexible circuit board.

9. The splicing display device according to claim 6, characterized in that: The splicing display device also includes an encapsulation protective layer, a first flexible protective layer and a second flexible protective layer. The encapsulation protective layer is arranged around the display panel, the first flexible protective layer is arranged on a side of the encapsulation protective layer away from the display panel, and the second flexible protective layer is arranged on the other side of the encapsulation protective layer away from the display panel, and the first flexible protective layer and the second flexible protective layer are arranged opposite to each other.

10. A method for preparing a spliced ​​display device, characterized in that: A spliced ​​display device as claimed in any one of claims 6 to 9 is prepared, wherein the method for preparing the spliced ​​display device comprises: providing a substrate; forming binding terminals, a substrate, a driving circuit layer and a micro light emitting diode device on the substrate in sequence to obtain a display panel; Transferring the display panel to a temporary substrate and removing the base to expose the binding terminals; Binding a connector on a side of the binding terminal away from the substrate; removing the temporary substrate and forming a packaging protection layer around the display panel; Adjacent display panels are connected via a flexible circuit board, and a first flexible protective layer and a second flexible protective layer are respectively provided on both sides of the display panel to obtain a spliced ​​display device.

11. The method for preparing a spliced ​​display device according to claim 10, wherein: The step of providing a substrate comprises: providing a glass substrate; A silicon oxide layer and an amorphous silicon layer are sequentially formed on a glass substrate; or a polyimide layer is formed on a glass substrate.

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