Monitoring method of semiconductor production equipment, electronic equipment and storage medium

Abstract

The invention provides a monitoring method of semiconductor production equipment, electronic equipment and a storage medium, aiming at each piece of semiconductor production equipment, a statistical process control system monitors the semiconductor production equipment in the following mode: responding to a monitoring instruction sent by the semiconductor production equipment; acquiring first operation data on a first acquisition position point on the semiconductor production equipment according to a basic acquisition range indicated by the monitoring instruction; whether the basic acquisition range is associated with an additional acquisition range is determined, and the additional acquisition range is smaller than the basic acquisition range; if yes, screening out second operation data on a second acquisition position point indicated by the additional acquisition range from the first operation data, so as to respectively execute monitoring actions based on the first operation data and the second operation data; and if not, executing a monitoring action based on the first operation data.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a monitoring method, electronic equipment and storage medium for semiconductor production equipment. Background Art

[0002] In the existing SPC system, the chart is generated based on all the data collection locations set by the user, and the user cannot select the data at some of the locations to collect values ​​for a new chart. The only way is to create a new chart model, which requires additional development and configuration on the machine, and it is easy to enter wrong data into the system when collecting values. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a monitoring method, electronic device and storage medium for semiconductor production equipment, which are used to provide a statistical process control system with a configuration function for collecting data, avoid the workload of additional modeling, reduce the error probability of data collection, and the statistical process control system performs data collection and semiconductor production equipment monitoring according to the range set by the user, thereby improving the stability of semiconductor production equipment production.

[0004] In a first aspect, the present invention provides a monitoring method for semiconductor production equipment, which is applicable to a statistical process control system. For each semiconductor production equipment, the statistical process control system monitors the semiconductor production equipment in the following manner: responding to a monitoring instruction issued to the semiconductor production equipment, collecting first operating data at a first collecting position point on the semiconductor production equipment according to a basic collecting range indicated by the monitoring instruction; determining whether the basic collecting range is associated with an additional collecting range, wherein the additional collecting range is smaller than the basic collecting range; if so, filtering out second operating data at a second collecting position point indicated by the additional collecting range from the first operating data, so as to perform monitoring actions based on the first operating data and the second operating data, respectively; if not, performing monitoring actions based on the first operating data.

[0005] In an optional embodiment, the basic acquisition range is used to indicate the wafer number of the data to be collected and the position number of the chip on each wafer from which data is to be collected. The step of collecting the first operating data at the first acquisition position point on the semiconductor production equipment according to the basic acquisition range indicated by the monitoring instruction specifically includes: after the semiconductor production equipment completes production, determining the target wafer number and target position number of the data to be collected; for each wafer corresponding to the target wafer number, collecting the preset parameter value of the chip at the target position number on the wafer.

[0006] In an optional embodiment, the monitoring action is performed in the following manner: for each wafer, an analysis value is calculated based on all preset parameter values ​​corresponding to the wafer; based on all wafers and corresponding analysis values, a wafer analysis chart is formed and displayed.

[0007] In an optional embodiment, the basic acquisition range is used to indicate the wafer number of the data to be collected and the position number of the chip on each wafer from which data is to be collected. The step of collecting the first operating data at the first acquisition position point on the semiconductor production equipment according to the basic acquisition range indicated by the monitoring instruction specifically includes: determining the target wafer number and target position number of the data to be collected; when the semiconductor production equipment is in production, for each wafer corresponding to the target wafer number, real-time collection of preset parameter values ​​of the chip at the target position number on the wafer.

[0008] In an optional embodiment, the monitoring action is performed in the following manner: for each preset parameter value collected, the preset parameter value is compared with the corresponding standard parameter value to determine whether the preset parameter value is abnormal; if so, an alarm message is generated and the semiconductor production equipment is controlled to suspend production.

[0009] In an optional embodiment, the data acquisition configuration interface includes at least an acquisition range list, and an additional acquisition range is set for the basic acquisition range in the following manner: in response to a first touch operation on a target basic acquisition range in the acquisition range list, an additional acquisition range list is displayed in the data acquisition configuration interface, and the additional acquisition range list is used to display the additional acquisition range associated with the target basic acquisition range; in response to a second touch operation on a new control in the additional acquisition range list, a wafer number selection area and a bit number selection area are displayed in the data acquisition configuration interface, the wafer number selection area includes wafer number entries of multiple wafers and corresponding selection controls, and the bit number selection area includes bit number entries of multiple chips and corresponding selection controls; in response to a third touch operation on a selection control corresponding to a specified wafer number and / or in response to a fourth touch operation on a selection control corresponding to a specified bit number, the currently selected target wafer number and target bit number are determined to add an associated additional acquisition range to the target basic acquisition range.

[0010] In a second aspect, the present invention provides a statistical process control system, the statistical process control system at least comprising a controller, the controller monitoring the semiconductor production equipment in the following manner:

[0011] In response to a monitoring instruction issued to a semiconductor production equipment, first operating data at a first collecting position on the semiconductor production equipment is collected according to a basic collecting range indicated by the monitoring instruction; it is determined whether the basic collecting range is associated with an additional collecting range, wherein the additional collecting range is smaller than the basic collecting range; if so, second operating data at a second collecting position indicated by the additional collecting range is filtered out from the first operating data, so as to perform monitoring actions based on the first operating data and the second operating data, respectively; if not, the monitoring action is performed based on the first operating data.

[0012] In a third aspect, the present invention provides a monitoring device for semiconductor production equipment, the device comprising:

[0013] A response module, used to respond to a monitoring instruction issued to the semiconductor production equipment, and collect first operation data at a first collection position point on the semiconductor production equipment according to a basic collection range indicated by the monitoring instruction;

[0014] An execution module, configured to determine whether a basic collection range is associated with an additional collection range, wherein the additional collection range is smaller than the basic collection range;

[0015] If so, filtering out the second operation data at the second collection position point indicated by the additional collection range from the first operation data, so as to perform monitoring actions based on the first operation data and the second operation data, respectively;

[0016] If not, a monitoring action is performed based on the first operating data.

[0017] In a fourth aspect, the present invention provides an electronic device comprising: a processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor. When the electronic device is running, the processor and the memory communicate through the bus, and the processor executes the machine-readable instructions to perform the steps of the monitoring method for semiconductor production equipment in any of the aforementioned embodiments.

[0018] In a fifth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of a method for monitoring semiconductor production equipment in any of the aforementioned embodiments are executed.

[0019] The present application provides a monitoring method, electronic device and storage medium for semiconductor production equipment, wherein a statistical process control system monitors the semiconductor production equipment in the following manner: responding to a monitoring instruction issued to the semiconductor production equipment, collecting first operating data at a first collection position point on the semiconductor production equipment according to a basic collection range indicated by the monitoring instruction; determining whether the basic collection range is associated with an additional collection range, wherein the additional collection range is smaller than the basic collection range; if so, filtering out the second operating data at a second collection position point indicated by the additional collection range from the first operating data, so as to perform monitoring actions based on the first operating data and the second operating data, respectively; if not, performing monitoring actions based on the first operating data. The statistical process control system provides a configuration function for collecting data, avoids the workload of additional modeling, reduces the probability of error in data collection, and the statistical process control system collects data and monitors semiconductor production equipment according to the range set by the user, thereby improving the stability of semiconductor production equipment production. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 A schematic diagram of a flow chart of a monitoring method for semiconductor production equipment provided in an embodiment of the present application;

[0022] Figure 2 A schematic diagram of a data collection configuration interface provided in an embodiment of the present application;

[0023] Figure 3 A schematic diagram of the structure of a monitoring device for semiconductor production equipment provided in an embodiment of the present application;

[0024] Figure 4 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] First, the application scenario of the technical solution of the present application is described. The technical solution of the present application is applicable to the monitoring of production equipment by the SPC system in semiconductor production.

[0026] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0027] Figure 1A flow chart of a method for monitoring semiconductor production equipment provided in an embodiment of the present application. Figure 1 As shown, a monitoring method for semiconductor production equipment provided by an embodiment of the present application is applicable to a statistical process control system (SPC). For each semiconductor production equipment, the statistical process control system monitors the semiconductor production equipment in the following manner:

[0028] S1. Responding to a monitoring instruction issued to a semiconductor production device, collecting first operating data at a first collection position on the semiconductor production device according to a basic collection range indicated by the monitoring instruction.

[0029] The monitoring instructions here are used to indicate the target semiconductor production equipment to be monitored, and the corresponding basic collection range. The basic collection range here is used to indicate the specific location where data is to be collected for the wafers or chips produced by the semiconductor production equipment. For example, the basic collection range can be expressed as "Unit = 2, 4, Site = 1, 3, 5", which means that data collection is required for the 2nd wafer and the 4th wafer on the current semiconductor production equipment, specifically including data collection for the chips at the 1st point, 3rd point, and 5th point on the 2nd wafer and the 4th wafer. The data collected here can be the length value, width value, etc. of the chip, which is used to monitor and adjust the chip cutting quality of the semiconductor production equipment.

[0030] It is understandable that the basic collection range here may be preset by the user in the SPC system before the production of the semiconductor production equipment, or may be a default value pre-provided in the SPC system.

[0031] S2. Determine whether the basic collection range is associated with an additional collection range, wherein the additional collection range is smaller than the basic collection range.

[0032] When monitoring the target semiconductor production equipment, it is necessary to determine whether there is an additional collection range associated with the current basic collection range in the system. Here, the system can provide the user with a configuration function for the additional collection range through a graphical user interface. The additional collection range here needs to be within the basic collection range.

[0033] S3: If yes, then filter out the second operation data at the second collection position indicated by the additional collection range from the first operation data, so as to perform monitoring actions based on the first operation data and the second operation data, respectively.

[0034] When it is determined that the basic collection range is associated with the additional collection range, the system will still collect data according to the basic collection range when collecting values. The difference is that when executing the monitoring action, it is necessary to filter out the second operating data at the second collection position point indicated by the additional collection range from the first operating data corresponding to the basic collection range, and execute the monitoring action based on the first operating data and the second operating data, respectively.

[0035] S4. If not, executing a monitoring action based on the first operation data.

[0036] In this way, the SPC system can perform monitoring actions according to the collection range set by the user, without the need for manual intervention to create additional rules, and also reducing the possibility of errors in data entry.

[0037] In one embodiment of the present application, the monitoring action performed by the system may be statistics and display of a Chart.

[0038] Specifically, the basic collection range can be used to indicate the wafer number of the wafer from which data is to be collected and the bit number of the chip on each wafer from which data is to be collected. The step of collecting the first operation data at the first collection position point on the semiconductor production equipment according to the basic collection range indicated by the monitoring instruction specifically includes:

[0039] After the semiconductor production equipment completes production, the target wafer number and target bit number of the data to be collected are determined. For each wafer corresponding to the target wafer number, the preset parameter value of the chip at the target bit number on the wafer is collected.

[0040] The preset parameter value here may be a length value, a width value, or a surface depth value of the chip, etc.

[0041] Furthermore, monitoring actions can be performed in the following ways:

[0042] For each wafer, an analysis value is calculated based on all preset parameter values ​​corresponding to the wafer. A wafer analysis chart is formed and displayed based on all wafers and the corresponding analysis values.

[0043] The horizontal axis of the wafer analysis chart here can be the number corresponding to each wafer, and the vertical axis can be the average length value corresponding to each wafer. The average length value here is the average value between the length values ​​of all chips on the wafer.

[0044] In this way, after the production is completed, a wafer analysis chart is formed based on the collected data, which can more intuitively show the production quality of the semiconductor production equipment, thereby helping the producer to adjust the control parameters of the semiconductor production equipment.

[0045] In another embodiment of the present application, the basic collection range is used to indicate the wafer number of the wafer from which data is to be collected and the bit number of the chip on each wafer from which data is to be collected, and the step of collecting the first operation data at the first collection position point on the semiconductor production equipment according to the basic collection range indicated by the monitoring instruction specifically includes:

[0046] Determine the target chip number and target bit number of the data to be collected. When the semiconductor production equipment is in production, for each wafer corresponding to the target chip number, the preset parameter value of the chip at the target bit number on the wafer is collected in real time.

[0047] At this point, the system can perform monitoring actions in the following ways:

[0048] For each preset parameter value collected, the preset parameter value is compared with the corresponding standard parameter value to determine whether the preset parameter value is abnormal. If so, an alarm message is generated and the semiconductor production equipment is controlled to suspend production.

[0049] When the semiconductor production equipment is in production, when the chip at the target position is cut out, the preset parameter value of the chip can be collected in real time and compared with the pre-configured standard parameter value. For example, collect the length value of a chip to see if it is less than 1cm. If not, it means that the production equipment is abnormal and an alarm message needs to be generated immediately and sent to maintenance personnel. At the same time, when the length value of the chip exceeds the standard value too much, the semiconductor production equipment can be immediately controlled to suspend production to avoid causing more losses. The maintenance personnel need to adjust the semiconductor production equipment before putting it back into use.

[0050] In one embodiment of the present application, Figure 2 As shown, the SPC system includes a data collection configuration interface for users to configure the collection scope. The data collection configuration interface includes at least a collection scope list, and the system can set additional collection scopes for the basic collection scope in the following ways:

[0051] In response to a first touch operation on a target basic collection range in the collection range list, an additional collection range list is displayed in the data collection configuration interface, where the additional collection range list is used to display additional collection ranges associated with the target basic collection range.

[0052] Exemplarily, the user may select a target basic collection range entry to which an additional collection range is to be added in the collection range list and double-click it, and the additional collection range list will be displayed in the data collection configuration interface.

[0053] In response to a second touch operation on a new control in the additional acquisition range list, a chip number selection area and a bit number selection area are displayed in the data acquisition configuration interface. The chip number selection area includes chip number entries for multiple wafers and corresponding selection controls, and the bit number selection area includes bit number entries for multiple chips and corresponding selection controls.

[0054] The user can click on the new control in the additional acquisition range list, and the slice number selection area and the bit number selection area will be displayed in the data acquisition configuration interface.

[0055] In response to the third touch operation on the selection control corresponding to the specified slice number and / or in response to the fourth touch operation on the selection control corresponding to the specified bit number, the currently selected target slice number and target bit number are determined to add an associated additional acquisition range to the target basic acquisition range.

[0056] The user can set the selection control corresponding to the wafer or chip for which data collection is desired, such as a check box, to a checked state, and then click OK to add the control to complete the saving of the additional collection range and associate it with the corresponding basic collection range.

[0057] In one embodiment of the present application, a statistical process control system is further provided, the statistical process control system at least comprising a controller, and the controller monitors the semiconductor production equipment in the following manner:

[0058] In response to a monitoring instruction issued to a semiconductor production equipment, first operating data at a first collecting position on the semiconductor production equipment is collected according to a basic collecting range indicated by the monitoring instruction; it is determined whether the basic collecting range is associated with an additional collecting range, wherein the additional collecting range is smaller than the basic collecting range; if so, second operating data at a second collecting position indicated by the additional collecting range is filtered out from the first operating data, so as to perform monitoring actions based on the first operating data and the second operating data, respectively; if not, the monitoring action is performed based on the first operating data.

[0059] Figure 3 A schematic diagram of the structure of a monitoring device for semiconductor production equipment provided in an embodiment of the present application. Figure 3 As shown, in one embodiment of the present application, based on the same inventive concept, a monitoring device for semiconductor production equipment is also provided in the embodiment of the present application, and the device 30 includes:

[0060] A response module 310 is used to respond to a monitoring instruction issued to a semiconductor production device and collect first operation data at a first collection position point on the semiconductor production device according to a basic collection range indicated by the monitoring instruction;

[0061] An execution module 320 is used to determine whether the basic acquisition range is associated with an additional acquisition range, wherein the additional acquisition range is smaller than the basic acquisition range;

[0062] If so, filtering out the second operation data at the second collection position point indicated by the additional collection range from the first operation data, so as to perform monitoring actions based on the first operation data and the second operation data, respectively;

[0063] If not, a monitoring action is performed based on the first operating data.

[0064] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 4 As shown in , the electronic device 400 includes a processor 410 , a memory 420 and a bus 430 .

[0065] The memory 420 stores machine-readable instructions executable by the processor 410. When the electronic device 400 is running, the processor 410 communicates with the memory 420 via the bus 430. When the machine-readable instructions are executed by the processor 410, the steps of a method for calculating the output torque of a vehicle in the above-mentioned embodiment can be executed. The specific implementation method can be found in the method embodiment, which will not be repeated here.

[0066] An embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of a method for calculating the output torque of a vehicle in the above-mentioned method embodiment can be executed. The specific implementation method can be found in the method embodiment, which will not be repeated here.

[0067] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0068] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0069] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0070] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0071] It should be noted that if the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can essentially be embodied in the form of a software product, or the part that contributes to the prior art or the part of the technical solution. The computer software product is stored in a storage medium, including a number of instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM) random access memory (RAM), disk or optical disk, and other media that can store program codes.

[0072] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0073] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for monitoring semiconductor production equipment, characterized in that: Applicable to a statistical process control system, for each semiconductor production equipment, the statistical process control system monitors the semiconductor production equipment in the following ways: In response to a monitoring instruction issued to a semiconductor production device, first operation data at a first collection position point on the semiconductor production device is collected according to a basic collection range indicated by the monitoring instruction; Determining whether the basic collection range is associated with an additional collection range, wherein the additional collection range is smaller than the basic collection range; If yes, then filtering out the second operation data at the second collection position point indicated by the additional collection range from the first operation data, so as to perform monitoring actions based on the first operation data and the second operation data, respectively; If not, a monitoring action is performed based on the first operating data.

2. The method according to claim 1, characterized in that The basic collection range is used to indicate the wafer number of the wafer from which data is to be collected and the bit number of the chip on each wafer from which data is to be collected. The step of collecting the first operation data at the first collection position point on the semiconductor production equipment according to the basic collection range indicated by the monitoring instruction specifically includes: After the semiconductor production equipment completes production, determine the target chip number and target bit number for data collection; For each wafer corresponding to the target chip number, the preset parameter values ​​of the chip at the target position number on the wafer are collected.

3. The method according to claim 2, characterized in that Perform monitoring actions in the following ways: For each wafer, an analysis value is calculated based on all preset parameter values ​​corresponding to the wafer; Based on all wafers and their corresponding analysis values, a wafer analysis chart is generated and displayed.

4. The method according to claim 1, characterized in that: The basic collection range is used to indicate the wafer number of the wafer from which data is to be collected and the bit number of the chip on each wafer from which data is to be collected. The step of collecting the first operation data at the first collection position point on the semiconductor production equipment according to the basic collection range indicated by the monitoring instruction specifically includes: Determine the target slice number and target position number of the data to be collected; When the semiconductor production equipment is in production, for each wafer corresponding to the target wafer number, the preset parameter values ​​of the chip at the target position number on the wafer are collected in real time.

5. The method according to claim 4, characterized in that Perform monitoring actions in the following ways: For each preset parameter value collected, compare the preset parameter value with the corresponding standard parameter value to determine whether the preset parameter value is abnormal; If so, an alarm message is generated and the semiconductor production equipment is controlled to suspend production.

6. The method according to claim 1, characterized in that The data collection configuration interface includes at least a collection range list. Additional collection ranges can be set for the basic collection ranges in the following ways: In response to a first touch operation on a target basic collection range in the collection range list, displaying an additional collection range list in the data collection configuration interface, the additional collection range list being used to display additional collection ranges associated with the target basic collection range; In response to a second touch operation on a newly created control in the additional acquisition range list, a wafer number selection area and a bit number selection area are displayed in the data acquisition configuration interface, wherein the wafer number selection area includes wafer number entries of a plurality of wafers and corresponding selection controls, and the bit number selection area includes bit number entries of a plurality of chips and corresponding selection controls; In response to the third touch operation on the selection control corresponding to the specified slice number and / or in response to the fourth touch operation on the selection control corresponding to the specified bit number, the currently selected target slice number and target bit number are determined to add an associated additional acquisition range to the target basic acquisition range.

7. A statistical process control system, characterized in that: The statistical process control system includes at least a controller, and the controller monitors the semiconductor production equipment in the following manner: In response to a monitoring instruction issued to a semiconductor production device, first operation data at a first collection position point on the semiconductor production device is collected according to a basic collection range indicated by the monitoring instruction; Determining whether the basic collection range is associated with an additional collection range, wherein the additional collection range is smaller than the basic collection range; If yes, then filtering out the second operation data at the second collection position point indicated by the additional collection range from the first operation data, so as to perform monitoring actions based on the first operation data and the second operation data, respectively; If not, a monitoring action is performed based on the first operating data.

8. A monitoring device for semiconductor production equipment, characterized in that: The device comprises: A response module, used to respond to a monitoring instruction issued to a semiconductor production device, and collect first operation data at a first collection position point on the semiconductor production device according to a basic collection range indicated by the monitoring instruction; an execution module, configured to determine whether the basic acquisition range is associated with an additional acquisition range, wherein the additional acquisition range is smaller than the basic acquisition range; If yes, then filtering out the second operation data at the second collection position point indicated by the additional collection range from the first operation data, so as to perform monitoring actions based on the first operation data and the second operation data, respectively; If not, a monitoring action is performed based on the first operating data.

9. An electronic device, characterized in that: include: A processor, a memory and a bus, wherein the memory stores machine-readable instructions executable by the processor, and when the electronic device is running, the processor communicates with the memory via the bus, and the processor executes the machine-readable instructions to perform the steps of the monitoring method for semiconductor production equipment as described in any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the semiconductor production equipment monitoring method according to any one of claims 1 to 6 are executed.

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