Surface attaching type constant-temperature heat management method and system

Abstract

The invention discloses a surface attaching type constant-temperature heat management method and system, and relates to the technical field of temperature control. The surface attaching type constant-temperature heat management method comprises the following steps that at least one heat conduction film is arranged on the outer side of a workpiece, the at least one heat conduction film is attached to the uneven surface of the workpiece for heat transfer, and a cavity of the heat conduction film is filled with heat conduction liquid or a phase change heat conduction material; one end of the heat conduction piece extends into the cavity of the heat conduction film and is in contact with the heat conduction liquid or the phase change heat conduction material for heat transfer; and the other end of the heat conduction piece is cooled or heated according to the cooling requirement or the heating requirement of the workpiece. The fitting degree between heat transfer surfaces can be improved, the heat transfer effect is improved, the heat transfer device is suitable for fitting heat transfer work of uneven surfaces of different workpieces, and the problem that in the prior art, the fitting degree between a heat conduction device and the uneven surfaces of the workpieces such as a cylindrical lithium battery is poor, and consequently the heat conduction effect is reduced is solved.

Description

Technical Field

[0001] The present invention relates to the field of temperature control technology, and in particular to a surface-mounted constant temperature thermal management method and system. Background Art

[0002] Lithium battery packs are widely used in various fields such as mobile devices, electric vehicles, and energy storage systems. However, the safety and performance of lithium batteries are significantly affected by temperature control. Too high or too low temperatures may cause the performance of lithium batteries to deteriorate, shorten their lifespan, and even cause fires or explosions. In addition, when lithium batteries are used at low temperatures (i.e., below 0°C), they have problems such as low capacity, severe attenuation, poor cycle rate performance, obvious lithium ion precipitation, and unbalanced lithium insertion and extraction. At -20°C, the capacity of lithium batteries is only about 31.55% of the capacity at 25°C. Therefore, the operating temperature of lithium batteries is between -20°C and 55°C, and the optimal operating temperature is between 20°C and 30°C.

[0003] In order for lithium battery packs to operate safely and efficiently in various temperature environments, constant temperature thermal management technology for lithium battery packs is crucial. At present, the thermal management system of lithium battery packs usually adopts heat transfer methods such as air cooling, liquid cooling, and heat pipes. However, the air cooling method has the disadvantage of weak thermal conductivity of air. The liquid cooling method and the heat pipe method generally conduct heat by bonding aluminum blocks or copper tubes to the surface of the lithium battery. The above two methods have good heat conduction effects and have a good fit for square batteries with flat surfaces, but have poor fit for cylindrical batteries, resulting in a significant reduction in heat transfer efficiency, causing the constant temperature thermal management effect of the lithium battery pack to deteriorate, seriously affecting the safety and performance of the lithium battery pack. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a surface-bonded constant temperature thermal management method and system, which can improve the bonding between heat transfer surfaces, improve the heat transfer effect, adapt to the work of bonding and heat transfer of non-flat surfaces of different workpieces, and effectively solve the problem in the prior art that the poor bonding between the heat conductor and the non-flat surface of the workpiece, such as a cylindrical lithium battery, leads to a decrease in the heat transfer effect.

[0005] The first embodiment of the present invention provides a surface-mounted constant temperature thermal management method, which includes the following steps: At least one heat-conducting film is arranged on the outside of the workpiece, so that at least one heat-conducting film is attached to the uneven surface of the workpiece for heat transfer, wherein a heat-conducting liquid or a phase-change heat-conducting material is loaded in the cavity of the heat-conducting film; Extending one end of the heat-conducting element into the cavity of the heat-conducting film and contacting with the heat-conducting liquid or the phase-change heat-conducting material for heat transfer; The other end of the heat conducting member is cooled or heated according to the temperature reduction requirement or temperature increase requirement of the workpiece.

[0006] The surface-bonded constant temperature thermal management method according to the first aspect of the embodiment of the present invention has at least the following beneficial effects: a thermally conductive liquid or a phase-change thermally conductive material is injected into the cavity of a soft thermally conductive film, and the surface tension characteristics of the liquid are fully utilized to enable the thermally conductive film to be tightly bonded to the uneven surface of the workpiece, thereby ensuring a high degree of fit between the thermally conductive film and the workpiece, and improving the heat transfer effect between the workpiece and the thermally conductive film, thereby effectively avoiding the reduction in heat transfer efficiency due to the gap between the workpiece and the heat conductor in the prior art.

[0007] When the temperature of the workpiece is too high and needs to be cooled, the other end of the heat-conducting part is cooled so that the heat on the workpiece can be transferred to the heat-conducting part through the heat-conducting film, heat-conducting liquid or phase-change heat-conducting material in sequence, thereby achieving heat dissipation and cooling of the workpiece; when the temperature of the workpiece is too low and needs to be heated, the other end of the heat-conducting part is heated so that the heat on the heat-conducting part can be transferred to the workpiece through the heat-conducting liquid or phase-change heat-conducting material or heat-conducting film in sequence, thereby achieving heating of the workpiece.

[0008] The above-mentioned surface-bonded constant temperature thermal management method can realize constant temperature control of workpieces with uneven surfaces, thereby solving the problem of low temperature control efficiency caused by poor surface bonding of workpieces with uneven surfaces.

[0009] In some embodiments of the present invention, the surface-mounted constant temperature thermal management method further includes the following steps: Collecting real-time temperature data of the workpiece; According to the comparison result between the real-time temperature data and the set temperature data, it is determined whether the workpiece needs to be cooled or heated.

[0010] In some embodiments of the present invention, at least one thermally conductive film is arranged on the outer side of the workpiece, and the at least one thermally conductive film is made to fit and transfer heat to the uneven surface of the workpiece, comprising the following steps: Arrange multiple workpieces in an array arrangement at intervals; A heat-conducting film is provided in the gaps between the workpieces, so that the heat-conducting film is in contact with the uneven surfaces of the workpieces for heat transfer.

[0011] In some embodiments of the present invention, cooling or heating the other end of the heat conducting member according to the temperature reduction requirement or temperature increase requirement of the workpiece comprises the following steps: A semiconductor cooling and heating plate is arranged at the other end of the heat conducting member, and a heat dissipation fin is arranged on the semiconductor cooling and heating plate; According to the cooling or heating requirements of the workpiece, the other end of the heat conducting element is cooled or heated by changing the current direction of the semiconductor cooling and heating plate.

[0012] In some embodiments of the present invention, cooling or heating the other end of the heat conductor according to the cooling or heating demand of the workpiece further includes the following step: accelerating the air flow rate on the surface of the heat sink fins by running a fan.

[0013] In some embodiments of the present invention, cooling or heating the other end of the heat conducting member according to the temperature reduction requirement or temperature increase requirement of the workpiece further includes the following steps: When the workpiece is in a temperature reduction requirement, if the real-time temperature data of the workpiece is greater than the first set temperature data and less than or equal to the second set temperature data, the fan is operated to cool the other end of the heat conducting member; If the real-time temperature data of the workpiece is greater than the second set temperature data, the other end of the heat conducting member is cooled by operating the fan and the semiconductor heating and cooling plate.

[0014] In some embodiments of the present invention, the surface-mounted constant temperature thermal management method further includes the following steps: When the workpiece is a battery and the battery is in a discharging state or a charging state, if the real-time temperature data of the battery is less than a third set temperature data, the battery is controlled to stop supplying power or charging, wherein the third set temperature data is less than the first set temperature data; The fan and the semiconductor heating and cooling sheet are operated to heat the other end of the heat conducting member; If the real-time temperature data of the battery rises to a value greater than or equal to the third set temperature data and lasts for a time greater than or equal to a set time, control the battery to supply power or charge; and / or, When the workpiece is a battery and the battery is in a discharging state or a charging state, if the real-time temperature data of the battery is greater than a fourth set temperature data, the battery is controlled to stop supplying power or charging, wherein the fourth set temperature data is greater than the second set temperature data.

[0015] A second aspect of the present invention provides a surface-mounted constant temperature thermal management system, which includes: A heat-conducting film, wherein at least one heat-conducting film has a cavity, in which a heat-conducting liquid or a phase-change heat-conducting material is placed, and at least one heat-conducting film has a heat-conducting surface for bonding with a non-flat surface of a workpiece for heat transfer; A heat conducting member, one end of which extends into the cavity and contacts with the heat conducting liquid or the phase change heat conducting material for heat transfer; A temperature control device is used to cool or heat the other end of the heat conducting member.

[0016] According to the surface-bonded constant temperature thermal management system of the second aspect of the present invention, there are at least the following beneficial effects: adding a heat-conducting liquid or a phase-change heat-conducting material into the cavity of the heat-conducting film, and utilizing the liquid tension of the heat-conducting liquid or the phase-change heat-conducting material to allow the heat-conducting surface of the heat-conducting film to be tightly bonded to the uneven surface of the workpiece, thereby ensuring a high degree of surface bonding between the heat-conducting film and the workpiece, thereby improving the heat transfer effect between the heat-conducting film and the workpiece, and preventing the problem of reduced heat transfer efficiency due to the inability of the heat conductor to effectively bond to the uneven surface of the workpiece; and inserting one end of the heat-conducting part into the cavity of the heat-conducting film, so that heat can be transferred between one end of the heat-conducting part and the heat-conducting liquid or the phase-change heat-conducting material, then, by operating the temperature control device, the other end of the heat-conducting part is cooled or heated, so that heat can pass through the heat-conducting part, the heat-conducting film and the heat-conducting liquid or the phase-change heat-conducting material, thereby cooling or heating the workpiece, and thereby achieving the purpose of temperature control of the workpiece with an uneven surface.

[0017] In some embodiments of the present invention, the temperature control device includes a semiconductor cooling and heating plate and a heat sink fin, at least one semiconductor cooling and heating plate is provided at the other end of the heat conductive member, and the heat sink fin is provided on the semiconductor cooling and heating plate.

[0018] In some embodiments of the present invention, the temperature control device further includes a fan, and the fan is used to increase the air flow rate on the surface of the heat dissipation fins.

[0019] In some embodiments of the present invention, the surface-mounted constant temperature thermal management system further includes a temperature sensor, the temperature sensor is used to collect real-time temperature data of the workpiece, and the temperature control device is used to cool or heat the other end of the heat conductor according to the comparison between the real-time temperature data and the set temperature data; and / or, The thermally conductive films are provided in plurality and arranged in an array and spaced apart from each other, and a workpiece placement area is defined between adjacent thermally conductive films; and / or, The thermally conductive film is a hexagonal boron nitride film.

[0020] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1is a schematic flow chart of a surface-mounted constant temperature thermal management method provided according to an embodiment of the present invention; Figure 2 is a specific flow chart of step S1 in the surface-mounted constant temperature thermal management method provided according to an embodiment of the present invention; Figure 3 is a specific flow chart of step S3 in the surface-mounted constant temperature thermal management method provided according to an embodiment of the present invention; Figure 4 is a schematic diagram of a specific flow chart of step S3 in a surface-mounted constant temperature thermal management method provided according to another embodiment of the present invention; Figure 5 is a specific flow chart of step S4 in the surface-mounted constant temperature thermal management method provided according to an embodiment of the present invention; Figure 6 is a specific flow chart of step S3 in the surface-mounted constant temperature thermal management method provided according to another embodiment of the present invention; Figure 7 is a specific flow chart of step S5 in the surface-mounted constant temperature thermal management method provided according to an embodiment of the present invention; Figure 8 is a schematic flow chart of step S6 in the surface-mounted constant temperature thermal management method provided according to an embodiment of the present invention; Fig. 9 is a schematic structural diagram of a surface-mounted constant temperature thermal management system provided according to an embodiment of the present invention; Fig.10 yes Fig. 9 Schematic cross-sectional view of section AA; Fig.11 yes Fig. 9 Schematic diagram of the cross-section BB.

[0022] Figure numerals: 110, bracket; 111, cavity; 120, cylindrical lithium battery; 210, thermally conductive film; 211, cavity; 220, thermally conductive liquid; 230, thermally conductive part; 240, sealing sleeve; 310, semiconductor cooling and heating plate; 320, cooling fins. DETAILED DESCRIPTION

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0024] In the description of the present invention, it is to be understood that a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] Reference below Figures 1 to 11 A surface-mounted constant temperature thermal management method and system according to an embodiment of the present invention are described.

[0027] like Figures 1 to 11 As shown, the first aspect of the embodiment of the present invention provides a surface-fitting constant temperature thermal management method, which can improve the fit between heat transfer surfaces, increase the heat transfer area, and improve the heat transfer effect. It can adapt to the work of fitting and heat transfer on the uneven surfaces of different workpieces, and effectively solve the problem in the prior art that the large gap between the heat conductor and the uneven surface of the workpiece leads to poor surface fit, thereby causing a decrease in the thermal conduction effect.

[0028] The surface-bonded constant temperature thermal management method of this embodiment can be applied to the temperature control of cylindrical batteries or other non-planar batteries, and can also be applied to the temperature control scenarios of devices with other irregular surfaces or workpieces with surfaces that are difficult to bond with rigid materials.

[0029] like Figure 1 As shown, the surface-mounted constant temperature thermal management method includes the following steps: Step S1: at least one thermally conductive film 210 is arranged outside the workpiece, and the at least one thermally conductive film 210 is bonded to the uneven surface of the workpiece for heat transfer, wherein the cavity 211 of the thermally conductive film 210 is loaded with thermally conductive liquid 220 or phase change thermally conductive material.

[0030] Step S2: Extend one end of the heat-conducting member 230 into the cavity 211 of the heat-conducting film 210 and make contact with the heat-conducting liquid 220 or the phase-change heat-conducting material for heat transfer.

[0031] Step S3: cooling or heating the other end of the heat conducting member 230 according to the temperature reduction or temperature increase requirement of the workpiece.

[0032] It can be understood that in step S1, a soft thermally conductive film 210 can be arranged on the outside of the workpiece, and a thermally conductive liquid 220 or a phase-change thermally conductive material can be arranged in the cavity 211 of the thermally conductive film 210. Through the tension of the liquid, the outer surface of the thermally conductive film 210 can be completely attached to the uneven surface of the workpiece, so that heat can be transferred between the thermally conductive film 210 and the workpiece. In this way, the surface fit between the thermally conductive film 210 and the workpiece can be improved, and a large gap between the thermally conductive film 210 and the uneven surface of the workpiece, which may adversely affect the heat transfer effect, can be avoided, and the contact area between the thermally conductive film 210 and the workpiece can be increased, thereby improving the thermal conductivity efficiency.

[0033] In step S1, a plurality of thermally conductive films 210 may be arranged around the circumference of the workpiece, and a thermally conductive liquid 220 or a phase-change thermally conductive material may be injected into the cavity 211 of each thermally conductive film 210, so that each thermally conductive film 210 can fit tightly to the outer surface of the workpiece, thereby increasing the thermal conductive area of ​​the workpiece and allowing the workpiece to heat up or cool down quickly.

[0034] The cavity 211 of the thermally conductive film 210 may be cylindrical, square prism-shaped or in other shapes. The thermally conductive film 210 may be made of hexagonal boron nitride (h-BN). Hexagonal boron nitride is a crystal composed of nitrogen atoms and boron atoms, and its chemical composition is 43.6% boron and 56.4% nitrogen. High-quality hexagonal boron nitride film is prepared by physical vapor deposition and radio frequency magnetron sputtering technology.

[0035] The hexagonal boron nitride film has good thermal conductivity (thermal conductivity is 34W / m·k), high temperature resistance (melting point is 3000℃), excellent insulation (resistivity is 1016Ωm to 1018Ωm, and can still maintain 104Ωm to 106Ωm at 1000℃), good corrosion resistance (high resistance to acid, alkali, molten metal and glass, good chemical inertness) and low friction coefficient (friction coefficient is 0.16). When the workpiece is a lithium battery, the thermal conductive film 210 can not only serve as a carrier for the thermal conductor, but also serve as a separator between the thermal conductor and the lithium battery.

[0036] As a heat conductor, the heat-conducting liquid 220 can be a safe liquid material with high thermal conductivity, low electrical conductivity and good flame retardancy, such as silicone oil, perfluoroalkane, gallium-tin-indium alloy (Galinstan, a liquid metal alloy composed of gallium, tin and indium), etc.; the phase-change heat-conducting material can be decahydrate sulfuric acid or decahydrate sodium carbonate, etc. The heat-conducting liquid 220 or the phase-change heat-conducting material can be used as a heat-conducting medium between the lithium battery and the heat-conducting member 230.

[0037] The thermal conductive agent and the thermal conductive film 210 are made of flame retardant, high insulation coefficient, and safe and reliable materials with good thermal conductivity, which can effectively protect the lithium battery pack and prevent safety accidents such as fire, short circuit, and leakage of the lithium battery pack.

[0038] Of course, it is not excluded that in other embodiments, the soft thermally conductive film 210 is set to an annular structure, so that the cavity 211 of the thermally conductive film 210 is in a circular ring or square ring shape, and the workpiece can be inserted into the inner peripheral area of ​​the thermally conductive film 210, and the tension characteristics of the thermally conductive liquid 220 or the phase-change thermally conductive material placed in the cavity 211 are used to make the inner peripheral surface of the thermally conductive film 210 fit closely with the outer peripheral surface of the workpiece, so that the area of ​​the heat transfer surface between the thermally conductive film 210 and the workpiece is increased, and there is no gap, which effectively improves the heat conduction effect of the workpiece. In this case, one or more heat-conducting parts 230 can be set in the cavity 211 of the annular structure.

[0039] In step S2, one end of the heat conductive member 230 is inserted into the cavity 211 of the heat conductive film 210, so that one end of the heat conductive member 230 can be immersed in a heat conductive agent such as a heat conductive liquid 220 or a phase change heat conductive material, and at this time, the other end of the heat conductive member 230 is located outside the cavity 211. In this way, the surface temperature of the workpiece can be efficiently transferred to the heat conductive member 230 through the heat conductive film 210 and the heat conductive agent, thereby achieving temperature control of the workpiece with a non-flat surface.

[0040] In addition, the cavity 211 of the thermally conductive film 210 is sealed to prevent the thermally conductive liquid 220 or the phase-change thermally conductive material from leaking from the cavity 211. Specifically, the opening of the cavity 211 is opened upward, and the lower end of the thermally conductive member 230 extends downward into the cavity 211 of the thermally conductive film 210, and then the opening of the cavity 211 is sealed by a sealing member such as a sealing sleeve 240. The thermally conductive member 230 can be a heat pipe, a copper column, or a long strip made of other highly thermally conductive materials.

[0041] When the other end of the heat conductor 230 is in a low temperature environment, the cold can be transferred from the other end of the heat conductor 230 to one end of the heat conductor 230, and in turn transferred to the workpiece through a heat conductor such as a heat-conducting liquid 220 or a phase-change heat-conducting material and a heat-conducting film 210, so that the workpiece can be cooled and the temperature of the workpiece drops to the set temperature requirement.

[0042] When the other end of the heat conductor 230 is in a high temperature environment, heat can be transferred from the other end of the heat conductor 230 to one end of the heat conductor 230, and in turn transferred to the workpiece through a heat conductor such as a phase change heat conductive material or a heat conductive liquid 220 and a heat conductive film 210, so that the workpiece can be heated and the temperature of the workpiece rises to the set temperature requirement.

[0043] In step S3, if the temperature of the workpiece is too high and needs to be cooled, the other end of the heat conductive member 230 (i.e., the end of the heat conductive member 230 located outside the cavity 211) can be cooled by a thermostatic appliance to place the other end of the heat conductive member 230 in a low-temperature environment, thereby allowing the workpiece to dissipate heat under the heat transfer effect of the heat conductive film 210, the heat conductive agent and the heat conductive member 230, thereby reducing the temperature of the workpiece.

[0044] If the temperature of the workpiece is too low and needs to be heated, the other end of the heat conductor 230 can be heated by a constant temperature appliance to place the other end of the heat conductor 230 in a high temperature environment, so that the workpiece absorbs heat under the heat transfer of the heat conductor 230, the thermal conductive agent and the thermal conductive film 210, thereby increasing the temperature of the workpiece.

[0045] The thermostatic appliance may be, but is not limited to, a semiconductor cooling and heating plate 310. In addition, a heat dissipation fin 320 made of metal such as copper or aluminum may be added to the semiconductor cooling and heating plate 310.

[0046] The above-mentioned surface-bonded constant temperature thermal management method can realize constant temperature control of workpieces with uneven surfaces, thereby solving the problem of low temperature control efficiency caused by poor surface bonding of workpieces with uneven surfaces.

[0047] For example, since there is a large tolerance (±0.3mm) in the roundness and size of cylindrical batteries, the rigid surface of the existing heat conductor cannot fit well on the surface of the cylindrical battery, resulting in a large gap between the rigid surface of the heat conductor and the surface of the cylindrical battery, which reduces the heat transfer efficiency between the cylindrical battery and the heat conductor. Therefore, for the temperature control of cylindrical batteries, the surface-fitting constant temperature thermal management method provided in this embodiment can be used to achieve surface-fitting heat conduction of cylindrical batteries, and the thermal conduction effect is good.

[0048] Specifically, a thermal conductor such as a thermally conductive liquid 220 or a phase-change thermally conductive material is added to the cavity 211 of the soft thermally conductive film 210, and the tension effect of the thermally conductive agent is fully utilized to allow the thermally conductive film 210 to completely fit the surface of the cylindrical battery. The thermally conductive member 230 is then inserted into the cavity 211 of the thermally conductive film 210, so that an efficient heat conduction bridge is established between the cylindrical battery and the thermally conductive member 230 through the heat transfer effect of the thermally conductive agent and the thermally conductive film 210. In this way, the problem of poor fit between the thermally conductive member 230 and the uneven surface of the cylindrical battery can be solved, thereby improving the heat transfer effect of the cylindrical battery and ensuring that the temperature of the cylindrical battery can be accurately and quickly controlled.

[0049] Compared with the commonly used air cooling method, the surface-bonded constant temperature thermal management method provided in the embodiment of the present invention can solve the problems of low thermal conductivity and slow heat conduction speed of air. At the same time, it also solves the problem of reduced thermal conductivity efficiency caused by water cooling and heat pipe methods because the metal surface cannot be completely and effectively bonded with the surface of the cylindrical battery.

[0050] In some embodiments, Figure 1 and Figure 2 As shown, step S1, i.e., arranging at least one thermally conductive film 210 on the outside of the workpiece so that the at least one thermally conductive film 210 is in contact with the uneven surface of the workpiece for heat transfer, specifically includes the following steps: Step S11: Arrange a plurality of workpieces in an array arrangement at intervals.

[0051] Step S12: a heat-conducting film 210 is disposed in the gaps between the workpieces, and the heat-conducting film 210 is made to fit the uneven surfaces of the workpieces for heat transfer.

[0052] It is understandable that in step S11, the multiple workpieces can be arranged in a rectangular array, a circular array, a triangular array, a V-shaped array, etc., and there is a certain spacing between the workpieces, so that the thermally conductive film 210 can be arranged in the gap between the workpieces. In step S12, the thermally conductive film 210 is placed in the gap between the workpieces, so that each thermally conductive film 210 can be well fitted and contacted with two or more workpieces at the same time, thereby improving the heat transfer efficiency, and the area of ​​the thermally conductive film 210 can be fully utilized, reducing the number of thermally conductive films 210, thermally conductive agents, and thermally conductive members 230, thereby reducing the temperature control cost of the workpieces.

[0053] For example, Figures 9 to 11 As shown, when the workpiece is a cylindrical lithium battery, multiple lithium batteries are arranged in a rectangular array, and a placement area is defined between any four lithium batteries. A heat-conducting film 210 can be set in the placement area. At this time, the surface of the heat-conducting film 210 can be closely attached to the arc surface of the four lithium batteries at the same time through the tension of the heat-conducting agent in the cavity 211. If sixteen lithium batteries are arranged in a matrix, then only nine heat-conducting films 210 are needed to control the temperature of all lithium batteries.

[0054] In some embodiments, Figure 1 and Figure 3 As shown, step S3, i.e., cooling or heating the other end of the heat conducting member 230 according to the temperature reduction requirement or temperature increase requirement of the workpiece, specifically includes the following steps: Step S31 : a semiconductor cooling and heating plate 310 is arranged at the other end of the heat conducting member 230 , and a heat dissipation fin 320 is arranged on the semiconductor cooling and heating plate 310 .

[0055] Step S32: According to the cooling or heating requirements of the workpiece, the other end of the heat conducting member 230 is cooled or heated by changing the current direction of the semiconductor cooling and heating plate 310 .

[0056] It is understandable that in step S31, the semiconductor cooling and heating plate 310 is installed at the other end of the heat conductive member 230, so that one surface of the semiconductor cooling and heating plate 310 is attached to the other end of the heat conductive member 230, and the heat sink 320 is installed on the semiconductor cooling and heating plate 310, so that the other surface of the semiconductor cooling and heating plate 310 is attached to the heat sink fin 320. By changing the principle of the cooling and heating surface by connecting the direct current of the semiconductor cooling and heating plate 310 positively and negatively, the semiconductor cooling and heating plate 310 can apply a cooling effect or a heating effect to the other end of the heat conductive member 230 according to the temperature requirement of the workpiece, thereby realizing the cooling or heating of the workpiece, so as to control the temperature of the workpiece within a certain range.

[0057] The provision of the heat sink fins 320 can increase the heat exchange area between the semiconductor cooling and heating plate 310 and the ambient air, improve the heat exchange effect between the semiconductor cooling and heating plate 310 and the air, and facilitate efficient cooling or heating of the workpiece.

[0058] In step S32, if the workpiece is in a cooling demand, the direction of the direct current flowing through the semiconductor cooling and heating plate 310 is adjusted so that the workpiece can be cooled down under the cooling effect of the semiconductor cooling and heating plate 310; if the workpiece is in a heating demand, the direction of the current flowing in the semiconductor cooling and heating plate 310 is changed so that the workpiece can be heated up under the heating effect of the semiconductor cooling and heating plate 310. A dual-path relay or transistor can be used to realize the positive and negative pole conversion of the semiconductor cooling and heating plate 310, so as to arbitrarily change the flow direction of the direct current in the semiconductor cooling and heating plate 310.

[0059] Further, such as Figure 1 and Figure 4 As shown, step S3, i.e., the step of cooling or heating the other end of the heat conducting member 230 according to the temperature reduction requirement or temperature increase requirement of the workpiece, further includes the following steps: Step S33: The fan is operated to increase the air flow rate on the surface of the heat dissipation fins 320 .

[0060] It is understandable that when executing step S32, step S33 can be executed at the same time to enhance the heat exchange effect between the heat sink fins 320 and the air. Specifically, when the semiconductor cooling and heating plate 310 is powered on and the other end of the heat conductor 230 is cooled, the fan is started to speed up the air flow on the surface of the heat sink fins 320, so that the air can take away the heat of the heat sink fins 320 more quickly, avoiding the heat accumulation of the heat sink fins 320; through the forced convection heat exchange method, the semiconductor cooling and heating plate 310 can operate better, so that the warm surface of the semiconductor cooling and heating plate 310 can better release heat, and the cold surface of the semiconductor cooling and heating plate 310 can better absorb the heat on the heat conductor 230.

[0061] When the semiconductor cooling and heating plate 310 is powered on and the other end of the heat conductor 230 is heated, the fan is activated to make the air on the surface of the heat sink fins 320 flow faster, thereby promoting better heat exchange between the air and the heat sink fins 320 and preventing the heat sink fins 320 from frosting, thereby ensuring that the semiconductor cooling and heating plate 310 and the heat sink fins 320 can work stably and have good heat exchange efficiency.

[0062] In some embodiments, Figure 1 and Figure 5 As shown, the surface-mounted constant temperature thermal management method further includes step S4. Step S4 specifically includes the following steps: Step S41: Collecting real-time temperature data of the workpiece.

[0063] Step S42: Based on the comparison result between the real-time temperature data and the set temperature data, determine whether the workpiece needs to be cooled down or heated up.

[0064] It is understandable that step S4 is executed before step S3 to determine whether the current demand of the workpiece requires cooling or heating, so as to facilitate the subsequent cooling or heating of the other end of the heat conductor 230 according to the demand of the workpiece. The temperature sensor is set to detect the real-time temperature data of the workpiece, and the real-time temperature data is transmitted to the controller. After receiving the real-time temperature data, the controller will compare the real-time temperature data with the previously input set temperature data. The controller determines whether the workpiece needs to be cooled or heated, or does not need to be cooled or heated, based on the comparison result, and then controls the working state of the semiconductor heating and cooling plate 310.

[0065] The controller may be a host computer, a PLC controller or a 51 single chip microcomputer, etc. The set temperature data may be a specific value or a specific value range, which may be set according to actual conditions and is not specifically limited here.

[0066] If the real-time temperature data is greater than the set temperature data, it indicates that the temperature of the workpiece is too high and needs to be cooled; then, the other end of the heat conductor 230 is cooled by the semiconductor cooling and heating plate 310. If the real-time temperature data is less than the set temperature data, it indicates that the temperature of the workpiece is too low and needs to be heated; then, the other end of the heat conductor 230 is heated by the semiconductor cooling and heating plate 310. If the real-time temperature data does not exceed the set temperature data, it indicates that the temperature of the workpiece is appropriate and does not need to be cooled or heated; then, the semiconductor cooling and heating plate 310 is in a stopped state.

[0067] When the workpiece is a cylindrical lithium battery 120 and arranged in an array, a plurality of high-precision temperature sensors can be placed inside the lithium battery pack to detect the temperature of each point inside the lithium battery pack in real time. The temperature sensor can be set in the gap between the cylindrical lithium batteries 120, and the temperature sensor and the thermal conductive film 210 can be non-contacting, that is, the temperature sensor is located outside the placement area.

[0068] Real-time temperature data of different areas in the lithium battery pack are obtained through multiple temperature sensors and transmitted to the controller, so that the controller can control the working state of the corresponding semiconductor cooling and heating plate 310 by comparing the results, and heat or cool the other end of the corresponding heat conductor 230 by adjusting the current direction and voltage of the corresponding semiconductor cooling and heating plate 310, thereby controlling the local cooling and heating temperature adjustment function in the lithium battery pack, realizing local temperature control at different positions in the lithium battery pack, and enabling the lithium battery pack to operate more efficiently and safely.

[0069] In some embodiments, Figure 1 and Figure 6 As shown, step S3, i.e., the step of cooling or heating the other end of the heat conducting member 230 according to the temperature reduction requirement or temperature increase requirement of the workpiece, further includes the following steps: Step S34: When the workpiece is in need of cooling, if the real-time temperature data of the workpiece is greater than the first set temperature data and less than or equal to the second set temperature data, the other end of the heat-conducting member 230 is cooled by running the fan.

[0070] Step S35: If the real-time temperature data of the workpiece is greater than the second set temperature data, the other end of the heat-conducting member 230 is cooled by operating the fan and the semiconductor cooling and heating plate 310 .

[0071] It is understandable that after determining that the workpiece needs to be cooled, the high temperature degree of the workpiece must also be determined, and by comparing the real-time temperature data of the workpiece with the first set temperature data and the second set temperature data, it is determined whether the high temperature degree of the workpiece is low or high. Among them, the first set temperature data is less than the second set temperature data, and the first set temperature data and the second set temperature data can be set according to actual conditions, and no specific limitation is made here.

[0072] When the real-time temperature data of the workpiece is greater than the first set temperature data and less than or equal to the second set temperature data, it indicates that the high temperature degree of the workpiece is at a low level. The fan can be started to cool the other end of the heat conductor 230 by air cooling, so that the heat of the workpiece can be dissipated outwards, ensuring that the temperature of the workpiece meets the working requirements. In this way, there is no need to activate the semiconductor heating and cooling plate 310, which can save electricity.

[0073] When the real-time temperature data of the workpiece is greater than the second set temperature data, it indicates that the high temperature degree of the workpiece is at a high level, and the heat dissipation of the workpiece cannot be completed by the operation of the fan alone. Therefore, it is necessary to start the semiconductor heating and cooling plate 310 to cool the other end of the heat conductor 230. At the same time, the fan is enabled to enhance the heat exchange effect between the heat sink 320 and the air, so as to cool the workpiece more efficiently and make the temperature of the workpiece meet the standard.

[0074] For example, when the workpiece is a cylindrical lithium battery 120, when the temperature of the lithium battery pack is within the temperature range of 5°C to 35°C, the semiconductor cooling and heating plate 310 and the fan do not work, and there is no need to cool or heat the other end of the heat conductor 230. If the temperature of the lithium battery pack is within the temperature range of 35°C to 45°C, start the fan to enhance the air flow at the surface of the heat sink fin 320 to improve the heat exchange effect between the heat sink fin 320 and the air. At this time, the first set temperature data is 35°C and the second set temperature data is 45°C. If the temperature of the lithium battery pack is higher than 45°C, while the fan is running, the semiconductor cooling and heating plate 310 is powered on and the other end of the heat conductor 230 is cooled, so that the lithium battery pack can be quickly cooled down. With such a design, overheating protection of the lithium battery pack can be achieved.

[0075] In some embodiments, when the workpiece is a cylindrical lithium battery 120, when the temperature of the lithium battery pack is lower than the fifth set temperature data, such as 10°C, the flow direction of the direct current of the semiconductor cooling and heating plate 310 is adjusted so that the semiconductor cooling and heating plate 310 can heat the other end of the heat conducting member 230, so that the lithium battery pack can be heated quickly. At the same time, the fan is running to strengthen the air flow on the surface of the heat dissipation fin 320 to prevent the heat dissipation fin 320 from frosting and causing the heat exchange effect of the semiconductor cooling and heating plate 310 to decrease. Such a design can achieve overcooling protection for the lithium battery pack.

[0076] In some embodiments, Figure 1 and Figure 7 As shown, the surface-mounted constant temperature thermal management method further includes step S5. Step S5 specifically includes the following steps: Step S51: When the workpiece is a battery and the battery is in a discharging state or a charging state, if the real-time temperature data of the battery is less than the third set temperature data, the battery is controlled to stop supplying power or charging, wherein the third set temperature data is less than the first set temperature data.

[0077] Step S52: The other end of the heat conducting member 230 is heated by operating the fan and the semiconductor cooling and heating plate 310 .

[0078] Step S53: If the real-time temperature data of the battery rises to a value greater than or equal to the third set temperature data, and the duration is greater than or equal to the set time, the battery is controlled to supply power or charge.

[0079] It can be understood that when the surface-mounted constant temperature thermal management method is applied to the temperature control of a lithium battery pack, a safety protection mechanism is implemented for a lithium battery pack in a discharge state or a charge state through the execution of step S5. The specific value of the third set temperature data and the specific value of the set time can be set according to actual conditions. In this embodiment, it is assumed that the third set temperature data is 0°C and the set time is 1 minute.

[0080] Specifically, when the temperature of the lithium battery pack is lower than 0°C, the lithium battery pack is controlled to stop outputting current. At this time, the lithium battery pack can drive the semiconductor cooling and heating plate 310 and the fan to work at the same time with very low power, so that the temperature of the lithium battery pack can rise under the heating effect of the semiconductor cooling and heating plate 310. When the temperature of the lithium battery pack rises to above 0°C and lasts for 1 minute, the lithium battery pack will resume outputting current.

[0081] In addition, if the lithium battery pack needs to be charged, if the temperature of the lithium battery pack is below 0°C, the lithium battery pack will not be charged first, that is, the input current to the lithium battery pack will be stopped. At this time, an external power supply is used to drive the semiconductor cooling and heating plate 310 and the fan to run simultaneously, and the heating effect of the semiconductor cooling and heating plate 310 is used to increase the temperature of the lithium battery pack. When the temperature of the lithium battery pack is higher than 0°C and the duration reaches 1 minute, the lithium battery pack will be charged.

[0082] The above-mentioned method can help solve the problems of low capacity, severe attenuation, poor cycle rate performance, obvious lithium ion precipitation, and unbalanced lithium insertion and extraction when lithium batteries are used at low temperatures below 0°C.

[0083] In a specific embodiment, when the temperature of the lithium battery pack is lower than 0°C, each semiconductor cooling and heating plate 310 operates at a power of 6W to 8W and performs heating to increase the temperature of the lithium battery pack. If the temperature of the lithium battery pack is higher than 45°C, similarly, each semiconductor cooling and heating plate 310 operates at a power of 6W to 8W and performs cooling to reduce the temperature of the lithium battery pack. While the semiconductor cooling and heating plate 310 is running, the 12V fan is started to increase the air flow speed on the surface of the heat sink fin 320, thereby preventing the heat sink fin 320 from accumulating heat or frosting and affecting the normal operation of the semiconductor cooling and heating plate 310. In addition, if the lithium battery pack is in a charging state, the power of the semiconductor cooling and heating plate 310 can be increased to 20W.

[0084] In some embodiments, Figure 1 and Figure 8 As shown, the surface-mounted constant temperature thermal management method also includes step S6. In step S6: when the workpiece is a battery and the battery is in a discharging state or a charging state, if the real-time temperature data of the battery is greater than the fourth set temperature data, the battery is controlled to stop supplying power or charging, wherein the fourth set temperature data is greater than the second set temperature data.

[0085] It is understandable that the fourth set temperature data can be set according to actual conditions. In this embodiment, the fourth set temperature data is 70°C. When the temperature of the lithium battery pack is higher than 70°C during the use of the lithium battery pack (discharging process or charging process), the power supply is forcibly cut off, and the charging of the lithium battery pack or the power supply of the lithium battery pack is stopped to prevent the lithium battery pack from overheating and runaway, thereby achieving safety protection for the lithium battery pack. When the temperature of the lithium battery pack drops to the sixth set temperature data, such as 55°C, the power supply or charging of the lithium battery pack is resumed.

[0086] The surface-fitting constant temperature thermal management method provided by the embodiment of the first aspect of the present invention can solve the problem of poor surface fit of the cylindrical lithium battery 120 that is currently widely used. The thermal conductive film 210 is made of soft, highly thermally conductive, flame-retardant, lowly conductive (insulating), low friction coefficient and corrosion-resistant materials, and a highly thermally conductive, lowly conductive, flame-retardant phase-change thermal conductive material (such as decahydrate sulfuric acid, decahydrate sodium carbonate, etc.) or a thermal conductive liquid 220 of equivalent properties (such as silicone oil, perfluoroalkane, etc.) is provided in the cavity 211 of the thermal conductive film 210 as a thermal conductive medium, and the tension characteristics of the thermal conductive medium in the cavity 211 are fully utilized to enable the thermal conductive film 210 to be well fitted to the surface of the cylindrical lithium battery 120 or other non-planar batteries, thereby ensuring good fit of the heat transfer surface and improving the heat transfer efficiency.

[0087] When the thermally conductive film 210 is provided, the phase change thermally conductive material or the thermally conductive liquid 220 is used, which can not only more efficiently interact the heat of the battery with the thermally conductive component 230, realize rapid and accurate temperature control of the battery, and make the operation of the battery more efficient and safe, but also prevent the battery from short-circuiting due to leakage of the thermally conductive medium. In addition, in the event of combustion of the battery, if the thermally conductive medium leaks, the thermally conductive medium will not have a combustion-supporting effect, but can have a certain flame retardant effect.

[0088] Based on the same inventive concept, Figures 1 to 11 As shown, the second embodiment of the present invention provides a surface-bonded constant temperature thermal management system, which can be applied to the temperature control of cylindrical lithium batteries 120 or other non-planar batteries to ensure that the battery pack operates more efficiently and safely. It can also be applied to the temperature control scenarios of other devices with irregular surfaces or workpieces with rigid materials that are difficult to bond to the surface.

[0089] The structure of the surface-mounted constant temperature thermal management system includes a thermally conductive film 210 , a thermally conductive element 230 and a temperature control device.

[0090] At least one thermally conductive film 210 is provided, and at least one thermally conductive film 210 has a cavity 211. The cavity 211 of each thermally conductive film 210 is filled with a thermally conductive medium such as a thermally conductive liquid 220 or a phase-change thermally conductive material. Moreover, at least one thermally conductive film 210 has a thermally conductive surface, and the function of the thermally conductive surface is to fit and transfer heat with the uneven surface of the workpiece.

[0091] It is understandable that the workpiece may be a cylindrical battery, other non-planar batteries, other devices with irregular surfaces, or workpieces with surfaces that are difficult for rigid materials to adhere to. The thermally conductive film 210 is a hexagonal boron nitride film. The thermally conductive liquid 220 may be silicone oil, perfluoroalkane, or gallium-tin-indium alloy (Galinstan, a liquid metal alloy composed of gallium, tin, and indium), and the phase-change thermally conductive material may be decahydrate sulfuric acid or decahydrate sodium carbonate.

[0092] In some examples, each workpiece is provided with a heat-conducting film 210, and the heat-conducting surface of the heat-conducting film 210 can be closely attached to the uneven surface of the workpiece under the tension of the above-mentioned heat-conducting medium. In other examples, each workpiece is provided with two or more heat-conducting films 210, and all the heat-conducting films 210 are arranged around the periphery of the workpiece, so that the outer peripheral surface of the workpiece is in contact with the heat-conducting surfaces of multiple heat-conducting films 210 at the same time. In some other examples, each workpiece heat-conducting film 210 is annular in structure, the cavity 211 is annular, and the workpiece is arranged in the inner peripheral area of ​​the heat-conducting film 210, so that the inner peripheral surface of the heat-conducting film 210 is closely attached to the outer peripheral surface of the workpiece. In this case, the inner peripheral surface of the heat-conducting film 210 is a heat-conducting surface.

[0093] In some embodiments, a plurality of thermally conductive films 210 are provided, and the plurality of thermally conductive films 210 are arranged in an array and spaced apart, so that adjacent thermally conductive films 210 define a workpiece placement area. Fig.10 As shown, there are nine thermally conductive films 210, which are arranged in a matrix manner, and any four adjacent thermally conductive films 210 together form a placement area, which can allow a workpiece such as a cylindrical lithium battery 120 to be placed. At this time, the thermally conductive surfaces of the four thermally conductive films 210 can fit the uneven surface of the same workpiece for heat transfer.

[0094] Each thermally conductive film 210 is provided with a thermally conductive member 230. One end of the thermally conductive member 230 extends into the cavity 211 of the thermally conductive film 210, and one end of the thermally conductive member 230 is in contact with the thermally conductive liquid 220 or the phase-change thermally conductive material for heat transfer. It is understandable that the thermally conductive member 230 can be a heat pipe, a copper column or other high-efficiency heat conductor. Heat can be transferred between the opposite ends of the thermally conductive member 230. If the thermally conductive film 210 is annular, two or more thermally conductive members 230 can be arranged for the thermally conductive film 210, and all the thermally conductive members 230 can be evenly arranged along the circumference of the annular cavity 211.

[0095] The function of the temperature control device is to cool or heat the other end of the heat conducting member 230. In this embodiment, the temperature control device includes a semiconductor cooling and heating plate 310 and a heat sink fin 320. Among them, one end of the heat conducting member 230 is located in the cavity 211 of the heat conducting film 210, and the other end of the heat conducting member 230 is located outside the cavity 211. Moreover, at least one semiconductor cooling and heating plate 310 is provided at the other end of the heat conducting member 230, and the heat sink fin 320 is provided on the semiconductor cooling and heating plate 310. It can be understood that by adjusting the flow direction of the direct current in the semiconductor cooling and heating plate 310, the position of the cooling and heating surface of the semiconductor cooling and heating plate 310 can be changed, thereby realizing the cooling or heating treatment of the other end of the heat conducting member 230.

[0096] In a specific embodiment, Figures 9 to 11 As shown, the lithium battery pack includes a bracket 110 and a cylindrical lithium battery 120, wherein a plurality of cylindrical lithium batteries 120 are arranged in a cavity 111 of the bracket 110 with an opening facing upward, the length of each cylindrical lithium battery 120 extends in the up-down direction, and the plurality of cylindrical lithium batteries 120 are evenly arranged on the bracket 110 in a matrix manner, so that the cylindrical lithium batteries 120 are supported and fixed by the bracket 110. There is a certain interval between any four adjacent cylindrical lithium batteries 120, and the interval can allow the installation of the thermal conductive film 210.

[0097] At this time, the heat-conducting film 210 is made into a container of heat-conducting medium and placed between the gaps of the cylindrical lithium battery 120; then, a heat-conducting medium such as a heat-conducting liquid 220 or a phase-change heat-conducting material is loaded into the cavity 211 of the heat-conducting film 210 with the opening facing upward; then, the lower end of the heat-conducting member 230 such as a heat pipe is inserted into the cavity 211 of the heat-conducting film 210, so that the lower end of the heat-conducting member 230 is immersed in the heat-conducting medium, and the opening of the cavity 211 is sealed. Specifically, a sealing sleeve 240 is sleeved at the opening of the heat-conducting film 210, and the sealing sleeve 240 seals the opening of the heat-conducting film 210, so that the opening of the heat-conducting film 210 is tightly attached to the heat-conducting member 230, which can prevent the heat-conducting medium from leaking from the cavity 211. In addition, the bracket 110 is provided with a fixing hole, and the sealing sleeve 240 is arranged in the fixing hole to prevent the sealing sleeve 240 from being easily displaced.

[0098] The upper end of the heat conducting member 230 is exposed to the cavity 211 of the heat conducting film 210, and the semiconductor cooling and heating plate 310 is closely attached to the upper end of the heat conducting member 230, and the heat dissipation fin 320 is attached to the other side of the semiconductor cooling and heating plate 310. In addition, the heat dissipation fin 320 can be fixed to the upper end of the heat conducting member 230 by a snap-fit ​​structure to enhance the fixing stability of the heat dissipation fin 320. For each heat conducting member 230, two semiconductor cooling and heating plates 310 are provided, and the two semiconductor cooling and heating plates 310 are symmetrically arranged in the horizontal direction, and each semiconductor cooling and heating plate 310 is provided with a heat dissipation fin 320.

[0099] By utilizing the principle that the semiconductor cooling and heating plate 310 changes the position of the cooling and heating surfaces by connecting the positive and negative connections of direct current, when the temperature of the cylindrical lithium battery 120 exceeds a certain temperature, the semiconductor cooling and heating plate 310 is energized and the upper end of the heat conductive member 230 is cooled and cooled, thereby reducing the temperature of the cylindrical lithium battery 120; when the temperature of the cylindrical lithium battery 120 is lower than a certain temperature, the semiconductor cooling and heating plate 310 is energized and the upper end of the heat conductive member 230 is heated and heated, thereby increasing the temperature of the cylindrical lithium battery 120; therefore, the semiconductor cooling and heating plate 310 can cooperate with the heat conductive member 230, the heat conductive medium and the heat conductive film 210, and can control the temperature of the cylindrical lithium battery 120 within a certain range according to the ambient temperature and the temperature of the cylindrical lithium battery 120, so as to enable the cylindrical lithium battery 120 to work within a safe and efficient temperature range, thereby improving the service life, stability and safety of the cylindrical lithium battery 120.

[0100] In the surface-bonded constant temperature thermal management system provided by the second embodiment of the present invention, the thermally conductive film 210 and the thermally conductive medium such as the thermally conductive liquid 220 or the phase-change thermally conductive material both have high thermal conductivity and electrical insulation performance. The surface tension of the thermally conductive medium can make the thermally conductive film 210 fit tightly to the curved surface of the cylindrical lithium battery 120, increase the heat transfer area, and help improve the heat transfer efficiency, so that the cylindrical lithium battery 120 and the thermally conductive member 230 can efficiently transfer heat. The surface temperature of the cylindrical lithium battery 120 is effectively and quickly transferred to the thermally conductive member 230 through the thermally conductive film 210 and the thermally conductive medium, and then dissipated outward by the thermally conductive member 230, effectively solving the problem of low heat transfer efficiency caused by poor surface bonding between the current cylindrical lithium battery 120 and the thermal conductor. In addition, it can also prevent the cylindrical lithium batteries 120 from being prone to short circuits.

[0101] Compared with the existing cooling method of increasing the air flow rate on the surface of the cylindrical lithium battery 120 , the surface-bonded constant temperature thermal management method can more efficiently remove the heat of the cylindrical lithium battery 120 .

[0102] Moreover, according to the preset temperature threshold, the semiconductor cooling and heating sheet 310 attached to the other end of the heat conductive member 230 is used to cool or heat the heat conductive member 230, so as to quickly change the internal temperature of the lithium battery pack. In addition to cooling the lithium battery pack, the semiconductor cooling and heating sheet 310 can also heat the lithium battery pack with too low temperature, thereby effectively solving the problems of low capacity, severe attenuation, poor cycle rate performance, obvious lithium ion precipitation, and unbalanced lithium insertion and extraction when the cylindrical lithium battery 120 is used in a low temperature state.

[0103] Furthermore, the temperature control device also includes a fan. The function of the fan is to speed up the air flow rate on the surface of the heat sink fins 320. It is understandable that the fan can be installed on the bracket 110, and the operation of the fan can increase the air flow rate on the surface of the heat sink fins 320, thereby preventing the heat sink fins 320 from accumulating heat or frosting.

[0104] In some embodiments, the structure of the surface-mounted constant temperature thermal management system also includes a temperature sensor.

[0105] The temperature sensor is used to collect the real-time temperature data of the workpiece, and the temperature control device is used to cool or heat the other end of the heat conductor 230 according to the comparison between the real-time temperature data and the set temperature data. The temperature sensor and the temperature control device can be electrically connected to the controller respectively.

[0106] It is understandable that when the surface-mounted constant temperature thermal management system is applied to the temperature control of the lithium battery pack, multiple temperature sensors are arranged inside the lithium battery pack to collect real-time temperature data at different positions of the lithium battery pack. Real-time monitoring of the temperature sensor and precise control of the controller can realize intelligent constant temperature management of the lithium battery pack.

[0107] Specifically, if the real-time temperature data collected by the temperature sensor is greater than the set temperature data, the temperature control device can operate under the control instruction sent by the controller and cool the other end of the heat conductor 230, thereby achieving cooling of the lithium battery pack; if the real-time temperature data collected by the temperature sensor is less than the set temperature data, the temperature control device can operate under the control command sent by the controller and heat the other end of the heat conductor 230, thereby achieving heating and raising the temperature of the lithium battery pack.

[0108] When multiple temperature sensors and multiple thermally conductive films 210 are provided, the corresponding semiconductor cooling and heating plates 310 can be controlled to operate, so as to control the temperature of different positions of the lithium battery pack, thereby achieving rapid and accurate temperature control of the lithium battery pack.

[0109] Since the surface-mounted constant temperature thermal management system in the embodiment of the second aspect of the present invention and the surface-mounted constant temperature thermal management method in the embodiment of the first aspect of the present invention belong to the same inventive concept, the specific steps and beneficial effects of the surface-mounted constant temperature thermal management system in this embodiment can be found in the description of the surface-mounted constant temperature thermal management method in the above-mentioned first aspect embodiment, and this embodiment will not be repeated here.

[0110] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0111] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A surface-mounted constant temperature thermal management method, characterized in that: The steps include: At least one heat-conducting film is arranged on the outside of the workpiece, so that at least one heat-conducting film is attached to the uneven surface of the workpiece for heat transfer, wherein a heat-conducting liquid or a phase-change heat-conducting material is loaded in the cavity of the heat-conducting film; Extending one end of the heat-conducting element into the cavity of the heat-conducting film and contacting with the heat-conducting liquid or the phase-change heat-conducting material for heat transfer; The other end of the heat conducting member is cooled or heated according to the temperature reduction requirement or temperature increase requirement of the workpiece.

2. The surface-mounted constant temperature thermal management method according to claim 1, characterized in that: It also includes the following steps: Collecting real-time temperature data of the workpiece; According to the comparison result between the real-time temperature data and the set temperature data, it is determined whether the workpiece needs to be cooled down or heated up.

3. The surface-mounted constant temperature thermal management method according to claim 1, characterized in that: At least one heat-conducting film is arranged on the outer side of the workpiece, and at least one heat-conducting film is made to fit and transfer heat with the uneven surface of the workpiece, including the following steps: Arrange multiple workpieces in an array arrangement at intervals; A heat-conducting film is provided in the gaps between the workpieces, so that the heat-conducting film is in contact with the uneven surfaces of the workpieces for heat transfer.

4. The surface-mounted constant temperature thermal management method according to claim 1, characterized in that: The step of cooling or heating the other end of the heat conducting member according to the temperature reduction requirement or temperature increase requirement of the workpiece comprises the following steps: A semiconductor cooling and heating plate is arranged at the other end of the heat conducting member, and a heat dissipation fin is arranged on the semiconductor cooling and heating plate; According to the cooling or heating requirements of the workpiece, the other end of the heat conducting element is cooled or heated by changing the current direction of the semiconductor cooling and heating plate.

5. The surface-mounted constant temperature thermal management method according to claim 4, characterized in that: The cooling or heating of the other end of the heat conducting member according to the cooling or heating requirement of the workpiece also includes the following step: accelerating the air flow rate on the surface of the heat dissipation fins by running a fan.

6. The surface-mounted constant temperature thermal management method according to claim 5, characterized in that: The cooling or heating of the other end of the heat conducting member according to the cooling or heating requirement of the workpiece further includes the following steps: When the workpiece is in a temperature reduction requirement, if the real-time temperature data of the workpiece is greater than the first set temperature data and less than or equal to the second set temperature data, the fan is operated to cool the other end of the heat conducting member; If the real-time temperature data of the workpiece is greater than the second set temperature data, the fan and the semiconductor cooling and heating plate are operated to cool the other end of the heat conducting member.

7. The surface-mounted constant temperature thermal management method according to claim 6, characterized in that: It also includes the following steps: When the workpiece is a battery and the battery is in a discharging state or a charging state, if the real-time temperature data of the battery is less than a third set temperature data, the battery is controlled to stop supplying power or charging, wherein the third set temperature data is less than the first set temperature data; The fan and the semiconductor heating and cooling sheet are operated to heat the other end of the heat conducting member; If the real-time temperature data of the battery rises to a value greater than or equal to the third set temperature data and lasts for a time greater than or equal to a set time, control the battery to supply power or charge; and / or, When the workpiece is a battery and the battery is in a discharging state or a charging state, if the real-time temperature data of the battery is greater than a fourth set temperature data, the battery is controlled to stop supplying power or charging, wherein the fourth set temperature data is greater than the second set temperature data.

8. Surface-mounted constant temperature thermal management system, characterized in that: include: A heat-conducting film, wherein at least one heat-conducting film has a cavity, in which a heat-conducting liquid or a phase-change heat-conducting material is placed, and at least one heat-conducting film has a heat-conducting surface for bonding with a non-flat surface of a workpiece for heat transfer; A heat conducting member, one end of which extends into the cavity and contacts with the heat conducting liquid or the phase change heat conducting material for heat transfer; A temperature control device is used to cool or heat the other end of the heat conducting member.

9. The surface-mounted constant temperature thermal management system according to claim 8, characterized in that: The temperature control device comprises a semiconductor cooling and heating plate and a heat sink fin. The other end of the heat conducting member is provided with at least one semiconductor cooling and heating plate, and the heat sink fin is provided on the semiconductor cooling and heating plate.

10. The surface-mounted constant temperature thermal management system according to claim 9, characterized in that: The temperature control device also includes a fan, which is used to increase the air flow rate on the surface of the heat dissipation fins.

11. The surface-mounted constant temperature thermal management system according to claim 8, characterized in that: It also includes a temperature sensor, the temperature sensor is used to collect real-time temperature data of the workpiece, and the temperature control device is used to cool or heat the other end of the heat conducting member according to the comparison between the real-time temperature data and the set temperature data; and / or, The thermally conductive films are provided in plurality and arranged in an array and spaced apart from each other, and a workpiece placement area is defined between adjacent thermally conductive films; and / or, The thermally conductive film is a hexagonal boron nitride film.

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