Crystal amplification module radiator based on phase change material

Abstract

The invention discloses a crystal amplification module radiator based on a phase change material. The crystal amplification module radiator comprises an upper cover plate, an upper micro-channel cold plate, an upper crystal vapor chamber, a lower crystal vapor chamber, a lower micro-channel cold plate and a lower cover plate which are sequentially arranged from top to bottom, the crystal is arranged between the upper crystal vapor chamber and the lower crystal vapor chamber, the upper surface of the upper micro-channel cold plate and the lower surface of the lower micro-channel cold plate are both provided with water inlet grooves and water outlet grooves, and communicated micro-channel arrays are arranged between the water inlet grooves and the water outlet grooves; a water inlet and a water outlet are formed in the upper cover plate and the lower cover plate, the water inlet is communicated with the water inlet groove, and the water outlet is communicated with the water outlet groove; phase-change materials are filled between the crystal and the upper crystal vapor chamber and between the crystal and the lower crystal vapor chamber, between the upper crystal vapor chamber and the upper micro-channel cold plate and between the lower crystal vapor chamber and the lower micro-channel cold plate. The crystal amplification module can be effectively cooled, the performance and the stability of the crystal amplification module are improved, and the output capacity and the light beam quality of the crystal amplification module are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and in particular to a crystal amplifier module radiator based on phase change material, which is suitable for a high-power and high-energy crystal amplifier system. Background Art

[0002] The crystal amplifier module is an optical amplifier that uses crystal as a gain medium. It has the advantages of high efficiency, high power, high energy, and high beam quality, and is widely used in laser communications, laser radar, and other fields. However, when the crystal works at high power, it will generate a lot of heat, causing the temperature of the crystal block to rise, thereby causing the accumulation of thermal stress, affecting the optical performance and stability of the crystal, and limiting the output capacity of the crystal amplifier module.

[0003] The increase in temperature will lead to a decrease in amplification efficiency, and effective heat dissipation is required. Heat dissipation on the crystal surface will produce temperature gradients and corresponding mechanical stresses inside, resulting in harmful thermal effects such as thermal distortion, thermal lenses, and thermal birefringence, and may even cause damage to the gain medium. Therefore, how to effectively dissipate heat from the crystal amplifier module is a key technical issue that needs to be solved urgently. Summary of the invention

[0004] In order to solve the problems of poor beam quality and low output energy caused by thermal stress accumulation in existing high-power and high-energy crystal amplifier modules under high-power femtosecond output, the present invention provides a crystal amplifier module heat sink based on phase change material, which can effectively dissipate heat for the crystal amplifier module, improve the performance and stability of the crystal amplifier module, and thus improve the output capacity and beam quality of the crystal amplifier module.

[0005] The present invention discloses a crystal amplification module heat sink based on phase change material, comprising: an upper cover plate, an upper microchannel cold plate, an upper crystal soaking plate, a lower crystal soaking plate, a lower microchannel cold plate and a lower cover plate, which are arranged in sequence from top to bottom;

[0006] The upper crystal vapor chamber and the lower crystal vapor chamber are provided with grooves on the opposite surfaces thereof for accommodating the crystal;

[0007] A water inlet groove and a water outlet groove are provided on the upper surface of the upper microchannel cold plate and the lower surface of the lower microchannel cold plate, and a microchannel array connected to each other is provided between the water inlet groove and the water outlet groove;

[0008] The upper cover plate and the lower cover plate are provided with a water inlet and a water outlet, the water inlet on the corresponding side is connected to the water inlet groove on the corresponding side, and the water outlet on the corresponding side is connected to the water outlet groove on the corresponding side, so as to form a water flow channel of the water inlet, the water inlet groove, the microchannel array, the water outlet groove and the water outlet;

[0009] Phase change material is filled between the crystal and the upper crystal vapor chamber and the lower crystal vapor chamber, between the upper crystal vapor chamber and the upper microchannel cold plate, and between the lower crystal vapor chamber and the lower microchannel cold plate.

[0010] As a further improvement of the present invention, the lower surface of the upper crystal heat sink and the upper surface of the lower crystal heat sink are both provided with corresponding semicircular grooves so that the crystal can be clamped in the formed circular groove when the upper crystal heat sink and the lower crystal heat sink are in contact with each other.

[0011] As a further improvement of the present invention, the lower cover plate has the same structure as the upper cover plate, the lower microchannel cold plate has the same structure as the upper microchannel cold plate, and the lower crystal heat sink has the same structure as the upper crystal heat sink; the depth of the water inlet trough and the water outlet trough is less than the thickness of the upper crystal heat sink or the lower crystal heat sink, the number of channels of the microchannel array is 40 to 50, and the multiple channels are arranged in parallel and connected to the water inlet trough and the water outlet trough; further, the cross-sectional size of a single channel is 0.5×1.0mm, the spacing between adjacent channels is 0.5mm, the channel length is 10mm, and the number of channels is 45.

[0012] As a further improvement of the present invention, the materials of the upper cover plate, upper microchannel cold plate, upper crystal heat spreader, lower crystal heat spreader, lower microchannel cold plate and lower cover plate are selected to have high thermal conductivity, which can effectively transfer the heat released by the phase change material layer to the external environment, thereby reducing the temperature of the phase change material layer and restoring it to a solid state to prepare for the next phase change.

[0013] As a further improvement of the present invention, the upper crystal heat spreader and the lower crystal heat spreader are copper plates, the upper microchannel cold plate and the lower microchannel cold plate are made of copper plates, and the upper cover plate and the lower cover plate are made of copper plates.

[0014] As a further improvement of the present invention, the phase change material is a material with phase change energy storage characteristics, which can undergo solid-liquid phase change within a certain temperature range, thereby absorbing or releasing a large amount of latent heat to achieve temperature regulation.

[0015] As a further improvement of the present invention, the phase change material includes one of high temperature wax, thermal conductive phase change material PCM and silica gel.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The heat sink of the present invention utilizes the phase change energy storage characteristics of the phase change material to effectively absorb and release the heat generated by the crystal amplification module, thereby lowering the temperature of the crystal, reducing the accumulation of thermal stress, and improving the optical performance and stability of the crystal;

[0018] The radiator of the present invention has a simple structure, small size, light weight, high heat dissipation efficiency, uniform heat dissipation, no noise, and is easy to install and maintain;

[0019] The heat sink of the present invention can ensure high beam quality and high output energy of the crystal amplification module under the condition of high-power femtosecond output;

[0020] The thermal interface material of the heat sink of the present invention is soft and can release thermal stress that cannot be resolved by other heat dissipation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a crystal amplifier module heat sink based on phase change material disclosed in an embodiment of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the structure of the middle and upper microchannel cold plate;

[0023] Figure 3 A cross-sectional view of a crystal amplifier module heat sink based on phase change material disclosed in an embodiment of the present invention.

[0024] In the figure:

[0025] 1. Upper cover plate; 2. Upper microchannel cold plate; 3. Upper crystal heat spreader; 4. Lower crystal heat spreader; 5. Lower microchannel cold plate; 6. Lower cover plate; 7. Groove; 8. Water inlet; 9. Water outlet; 10. Water inlet trough; 11. Water outlet trough; 12. Microchannel array. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings:

[0028] like Figures 1 to 3 As shown, the present invention provides a crystal amplification module heat sink based on phase change material, comprising: an upper cover plate 1, an upper microchannel cold plate 2, an upper crystal soaking plate 3, a lower crystal soaking plate 4, a lower microchannel cold plate 5 and a lower cover plate 6 arranged in sequence from top to bottom, the lower cover plate 6 has the same structure as the upper cover plate 1, the lower microchannel cold plate 5 has the same structure as the upper microchannel cold plate 2, and the lower crystal soaking plate 4 has the same structure as the upper crystal soaking plate 3; wherein,

[0029] The lower surface of the upper crystal vapor chamber 3 and the upper surface of the lower crystal vapor chamber 4 of the present invention are both provided with corresponding grooves 7, which can be semicircular grooves or grooves of other shapes matching the shape of the crystal; so that when the upper crystal vapor chamber 3 and the lower crystal vapor chamber 4 are attached, the crystal can be clamped in the formed circular groove. Furthermore, the present invention can choose to place multiple crystals between the upper crystal vapor chamber 3 and the lower crystal vapor chamber 4, as long as they can achieve the amplification of the laser signal and the heat generated by them can be absorbed and released by the phase change material layer.

[0030] The upper surface of the upper microchannel cold plate 2 and the lower surface of the lower microchannel cold plate 5 of the present invention are both provided with a water inlet 10 and a water outlet 11, and a connected microchannel array 12 is provided between the water inlet 10 and the water outlet 11. Specifically, the depth of the water inlet 10 and the water outlet 11 is less than the thickness of the upper crystal heat plate 2 or the lower crystal heat plate 5, the number of channels of the microchannel array 12 is 40 to 50, and the multiple channels are arranged in parallel and connected to the water inlet and the water outlet; further, the cross-sectional size of a single channel is 0.5×1.0mm, the spacing between adjacent channels is 0.5mm, the channel length is 10mm, and the number of channels is 45.

[0031] The upper cover plate 1 and the lower cover plate 6 of the present invention are provided with a water inlet 8 and a water outlet 9, the water inlet 8 on the corresponding side is connected with the water inlet groove 10 on the corresponding side, that is, the water inlet 8 of the upper cover plate 1 is connected with the water inlet groove 10 of the upper microchannel cold plate 2, and the water inlet 8 of the lower cover plate 6 is connected with the water inlet groove 10 of the lower microchannel cold plate 5; the water outlet 9 on the corresponding side is connected with the water outlet groove 11 on the corresponding side, that is, the water outlet 9 of the upper cover plate 1 is connected with the water outlet groove 11 of the upper microchannel cold plate 2, and the water outlet 9 of the lower cover plate 6 is connected with the water outlet groove 11 of the lower microchannel cold plate 5; so as to form a water flow channel of the water inlet 8, the water inlet groove 10, the microchannel array 12, the water outlet groove 11 and the water outlet 9. Furthermore, the above-mentioned structural design of the present invention can replace the heat spreader of different sizes and groove sizes as needed, so as to realize the flexible replacement of the laser crystal.

[0032] Phase change material is filled between the crystal and the upper crystal vapor chamber 3 and the lower crystal vapor chamber 4, between the upper crystal vapor chamber 3 and the upper microchannel cold plate 2, and between the lower crystal vapor chamber 4 and the lower microchannel cold plate 5. Phase change material is a material with phase change energy storage characteristics, which can undergo solid-liquid phase change within a certain temperature range, thereby absorbing or releasing a large amount of latent heat to achieve temperature regulation; preferably, the phase change material includes one of high-temperature wax, thermal conductive phase change material PCM and silica gel.

[0033] The materials of the upper cover plate 1, the upper microchannel cold plate 2, the upper crystal heat spreader 3, the lower crystal heat spreader 4, the lower microchannel cold plate 5 and the lower cover plate 6 of the present invention are selected to have high thermal conductivity, which can effectively transfer the heat released by the phase change material layer to the external environment, thereby reducing the temperature of the phase change material layer and restoring it to a solid state to prepare for the next phase change; preferably, the upper cover plate 1, the upper microchannel cold plate 2, the upper crystal heat spreader 3, the lower crystal heat spreader 4, the lower microchannel cold plate 5 and the lower cover plate 6 are copper plates.

[0034] Furthermore, the heat sink of the present invention can be used in combination with other heat sinks, as long as it can improve the heat dissipation effect of the crystal amplifier and does not affect the performance and stability of the amplifier.

[0035] When the present invention is used, after the cooling water enters the water inlet of the microchannel, it will first impact the bottom surface of the channel, then take away the heat transferred by the crystal heat sink through the microchannel array, and leave through the water outlet. When the phase change material in the microchannel cold plate is completely liquid, the heat is transferred to the external environment through the cooling water, thereby reducing the temperature of the phase change material and restoring it to a solid state to prepare for the next phase change. In this way, the phase change material can achieve temperature regulation and achieve the purpose of heat dissipation.

[0036] The advantages of the present invention are:

[0037] The heat sink of the present invention utilizes the phase change energy storage characteristics of the phase change material to effectively absorb and release the heat generated by the crystal amplification module, thereby lowering the temperature of the crystal, reducing the accumulation of thermal stress, and improving the optical performance and stability of the crystal;

[0038] The radiator of the present invention has a simple structure, small size, light weight, high heat dissipation efficiency, uniform heat dissipation, no noise, and is easy to install and maintain;

[0039] The heat sink of the present invention can ensure high beam quality and high output energy of the crystal amplification module under the condition of high-power femtosecond output;

[0040] The thermal interface material of the heat sink of the present invention is soft and can release thermal stress that cannot be resolved by other heat dissipation methods.

[0041] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A crystal amplifier module heat sink based on phase change material, characterized in that: include: An upper cover plate, an upper microchannel cold plate, an upper crystal soaking plate, a lower crystal soaking plate, a lower microchannel cold plate and a lower cover plate are sequentially arranged from top to bottom; The upper crystal vapor chamber and the lower crystal vapor chamber are provided with grooves on the opposite surfaces thereof for accommodating the crystal; A water inlet groove and a water outlet groove are provided on the upper surface of the upper microchannel cold plate and the lower surface of the lower microchannel cold plate, and a microchannel array connected to each other is provided between the water inlet groove and the water outlet groove; The upper cover plate and the lower cover plate are provided with a water inlet and a water outlet, the water inlet on the corresponding side is connected to the water inlet groove on the corresponding side, and the water outlet on the corresponding side is connected to the water outlet groove on the corresponding side, so as to form a water flow channel of the water inlet, the water inlet groove, the microchannel array, the water outlet groove and the water outlet; Phase change material is filled between the crystal and the upper crystal vapor chamber and the lower crystal vapor chamber, between the upper crystal vapor chamber and the upper microchannel cold plate, and between the lower crystal vapor chamber and the lower microchannel cold plate.

2. The crystal amplifier module heat sink based on phase change material according to claim 1, characterized in that: The lower surface of the upper crystal vapor chamber and the upper surface of the lower crystal vapor chamber are both provided with corresponding semicircular grooves, so that when the upper crystal vapor chamber and the lower crystal vapor chamber are attached to each other, the crystal is clamped in the formed circular groove.

3. The crystal amplifier module heat sink based on phase change material according to claim 1, characterized in that: The lower cover plate has the same structure as the upper cover plate, the lower microchannel cold plate has the same structure as the upper microchannel cold plate, and the lower crystal heat sink has the same structure as the upper crystal heat sink; the depth of the water inlet and outlet grooves is less than the thickness of the upper crystal heat sink or the lower crystal heat sink, the number of channels of the microchannel array is 40 to 50, and the multiple channels are arranged in parallel and connected to the water inlet and outlet grooves.

4. The crystal amplifier module heat sink based on phase change material according to claim 1, characterized in that: The materials of the upper cover plate, the upper microchannel cold plate, the upper crystal vapor chamber, the lower crystal vapor chamber, the lower microchannel cold plate and the lower cover plate are selected to have high thermal conductivity.

5. The crystal amplifier module heat sink based on phase change material according to claim 1, characterized in that: The upper crystal soaking plate and the lower crystal soaking plate are made of copper plates, the upper microchannel cold plate and the lower microchannel cold plate are made of copper plates, and the upper cover plate and the lower cover plate are made of copper plates.

6. The crystal amplification module heat sink based on phase change material according to claim 1, characterized in that: The phase change material is a material with phase change energy storage characteristics, which can undergo solid-liquid phase change within a certain temperature range, thereby absorbing or releasing a large amount of latent heat to achieve temperature regulation.

7. The crystal amplification module heat sink based on phase change material according to claim 6, characterized in that: The phase change material includes one of high temperature wax, thermal conductive phase change material PCM and silica gel.

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