Thin film deposition device and method

By introducing a steady flow module into the thin film deposition device, and using magnetic force to drive the spiral blade rotor to rotate to compensate for the gas pressure, the problem of unstable gas pressure in the semiconductor coating equipment is solved and the film deposition quality is improved.

CN119663237AActive Publication Date: 2025-03-21PIOTECH (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202411863022.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-03-21
Estimated Expiration
2044-12-16

AI Technical Summary

Technical Problem

In semiconductor coating equipment, when the atomic layer deposition valve is opened or closed, the gas pressure flowing into the process chamber cannot be maintained stable, affecting the film deposition quality.

Method used

A thin film deposition device is designed, including a gas source, a process chamber and a flow stabilization module. The steady flow module consists of a gas chamber, a magnet stator and a spiral blade rotor. The spiral blade rotor is driven by magnetic force to rotate, pushing the remaining gas in the air chamber towards the outlet, compensating the output air pressure, and ensuring the constant gas flow rate and pressure.

Benefits of technology

Through the design of the steady flow module, the gas pressure can be effectively maintained, the film deposition quality can be improved, and the reaction gas flow rate and pressure can be constant.

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Abstract

The invention provides a thin film deposition device and method. A thin film deposition apparatus includes: a gas source for providing at least one gas required by a thin film deposition process; the process chamber is used for accommodating a semiconductor device to be processed and depositing a thin film on the surface of the semiconductor device through the at least one gas; and the flow stabilizing module is positioned between the air source and the process chamber and comprises an air chamber, a magnet stator and a spiral blade rotor. By adopting the flow stabilizing module, the pressure of the output end of the valve can be controlled to be constant, so that the flow rate and / or the pressure of reaction gas flowing into the process chamber are / is kept constant, and the film deposition quality is improved.
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