Ink jet chip packaging structure

Abstract

An ink jet chip packaging structure is arranged on a flexible circuit board, and comprises a circuit board contact; the ink jet chip further comprises a signal control module, an ink jet control module, a jet hole, a current input end, a grounding end and a current output end; wherein the signal control module receives a printing control signal; the ink-jet control module is coupled with the signal control module and drives the spray hole to print through the printing control signal; the current input end receives a first current input by the circuit board contact, and the current output end is coupled with the circuit board contact and outputs a second current; wherein the grounding end is not connected with the circuit board contact, the ink jet control module further comprises a control unit, and the control unit is a metal-oxide-semiconductor field effect transistor.

Description

Technical Field

[0001] The present invention relates to an inkjet chip packaging structure. More specifically, the present invention provides a new chip packaging structure to improve the low power utilization efficiency of a traditional inkjet chip due to circuit leakage current. Background Art

[0002] Inkjet printing technology, commonly known as "Inkjet Printing", is a widely used printing technology. Its history can be traced back to the 1950s when the British company Hewlett-Packard invented inkjet printing technology. Since then, inkjet printing technology has developed rapidly, making inkjet printers the mainstream technology for home and commercial printing. Inkjet printers have many advantages, including: low cost, especially economic advantages for home and small business use; high printing quality, which can provide high-resolution and high-quality images, especially in photos or pictures; convenient to use, inkjet printers are easy to install, and most inkjet printers can print through computers or mobile devices. When combined with the emerging multi-in-one functions (including fax, photocopying, scanning) of business machines in recent years, it can quickly expand the flexibility of paperwork in the office.

[0003] See also Figure 1A , which describes the matching and control method between the ink cartridge 10 and the printer in the previously known technology: the ink cartridge 10 includes an inkjet chip 120, and the inkjet chip 120 stores the above-mentioned ink cartridge serial number, ink type, inkjet head-printer matching information and other information. Among them, after receiving the ejection signal sent by the printer, the above-mentioned inkjet chip 120 will activate the corresponding nozzle 122 to eject ink droplets. The inkjet chip 120 has a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) as a core component. By operating the opening and closing of the MOSFET, the purpose of controlling whether the nozzle ejects ink droplets is achieved.

[0004] Please continue reading Figure 1B ,exist Figure 1B In the example of an N-Type MOSFET, the working conditions in the currently known technology are described. Figure 1BIn the N-Type MOSFET, when a positive voltage is applied to the gate G, negatively charged electrons are attracted to the surface to form a channel, so that most carriers (electrons) can flow from the source S to the drain D. If the positive voltage is removed or a negative voltage is applied, the channel cannot be formed, and theoretically, the carriers cannot flow between the source S and the drain D. In other words, the MOSFET can control the switching of the current channel through the voltage of the gate G. However, it is well known that MOSFET generally has leakage current. This phenomenon was discussed and measured by Daniel Johannesson et al. in IEEE Transactions on Power Electronics (Volume: 33, Issue: 6, June 2018) under different operating conditions, such as temperature, or the voltage applied to the gate G. According to currently known concepts, leakage current can be roughly divided into several types, such as leakage current of PN junction when reverse bias is applied, leakage current through the oxide layer on the gate G by tunneling effect, and leakage current of hot carriers flowing from the substrate through the oxide layer of the gate G.

[0005] As mentioned above, at the current application level, if you want to reduce the impact of leakage current, you must use a higher-level process, that is, through the adjustment of impurity doping concentration, semiconductor structure such as oxide layer thickness, or the selection of manufacturing materials, to minimize the leakage current. Figure 1B In the figure, the second current I2 flowing normally in the MOSFET and the third current I3 flowing in the leakage path are shown. Figure 1C , let's go back to the application of the inkjet printing technology. Generally speaking, in low-level processes, for cost considerations, the MOSFET produced will have a large leakage current. Therefore, in the inkjet chip 120 having MOSFET as the core element for controlling the inkjet action, generally all current output terminals G n It will be electrically connected to the ground terminal GND, so that the third current I3 will return from the ground terminal GND to the printer end. As a result, the heating resistor in the inkjet chip 120 will have poor efficiency in utilizing electricity and poor printing effect. In addition, the third current I3, which is a leakage current, will also have leakage when the MOSFET is not operating. As a result, in the current market, the inkjet printing technology has the disadvantage of poor ink heating, which urgently needs to be improved. Summary of the invention

[0006] Based on the above reasons, the present invention proposes an inkjet chip packaging structure. By improving the circuit contacts in the aforementioned inkjet chip packaging structure, the leakage current of the metal oxide semiconductor field effect transistor (MOSFET) in the inkjet chip, which is used to control the inkjet printing technology, can be reduced to zero, so that the original leakage current can return to the normal current flow path, thereby increasing the power utilization efficiency of the MOSFET, and achieving the purpose of the present invention to improve the efficiency of the inkjet chip in heating the ink during printing, so as to serve as a technical means to improve the quality of inkjet printing. At the same time, the improved inkjet chip packaging structure can also have a certain gain effect on MOSFETs of different high and low-level process sources in the inkjet chip. The detailed technical solution will be described in detail as follows.

[0007] The present invention proposes an inkjet chip packaging structure, which is arranged on a flexible circuit board and includes the following elements: circuit board contacts; an inkjet chip, further including a signal control module, an inkjet control module, a nozzle, a current input terminal, a ground terminal, and a current output terminal; wherein the signal control module receives a printing control signal transmitted from a printer to the circuit board contacts; the inkjet control module is coupled to the signal control module, and drives the nozzle to spray the ink required for printing by the printing control signal; the current input terminal receives a first current input from the circuit board contacts to provide the power required for the operation of the inkjet control module; the current output terminal is coupled to the circuit board contacts to output a second current, so that the inkjet chip packaging structure and the printer form a power circuit; the ground terminal is not connected to the circuit board contacts; wherein the inkjet control module includes a control unit, and the control unit is a MOSFET.

[0008] According to the present invention, the MOSFET can be selected from an N-type metal oxide semiconductor field effect transistor (NMOS) or a P-type metal oxide semiconductor field effect transistor (PMOS) according to application requirements.

[0009] According to the present invention, the inkjet control module further comprises a heating resistor unit for heating the ink required for printing. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The detailed description of the present invention and the schematic diagram of the embodiments described below should enable a more complete understanding of the present invention; however, it should be understood that this is only a reference for understanding the application of the present invention, rather than limiting the present invention to a specific embodiment.

[0011] Figure 1A The structure of the ink cartridge and the setting method of the inkjet chip are explained.

[0012] Figure 1B The leakage current phenomenon existing in the operation of MOSFET in the prior art is described.

[0013] Figure 1CThe invention describes the connection structure between the inkjet chip package and the flexible circuit board in the known technology.

[0014] Figure 2A The wiring structure between the inkjet chip package and the flexible circuit board in the present invention is described.

[0015] Figure 2B The detailed structure of the inkjet control module in the inkjet chip packaging structure is further described.

[0016] Figure 2C The circuit structure of the inkjet control module is further explained.

[0017] Figure 3 The invention illustrates the improvement of leakage current through the inkjet chip packaging structure during MOSFET operation. DETAILED DESCRIPTION

[0018] The present invention will be described in detail with preferred embodiments and viewpoints. The following description provides specific implementation details of the present invention so that the reader can thoroughly understand the implementation methods of the multiple embodiments. However, those skilled in the art in this field must understand that the present invention can also be implemented without the multiple details. In addition, the present invention can also be used and implemented by other specific embodiments. The various details described in this specification can also be applied based on different needs, and various modifications or changes can be made without departing from the spirit of the present invention. Therefore, the present invention will be described with preferred embodiments and viewpoints. Such descriptions are to explain the structure of the present invention and are only used for illustration rather than to limit the scope of the patent application of the present invention. The terms used in the following description will be interpreted in the broadest reasonable way so that they can be used together with the detailed description of a specific embodiment of the present invention. Those skilled in the art can adjust the structure of the present invention according to the needs of manufacturing or application to meet the needs of the actual industry.

[0019] See also Figure 2A , Figure 2B , Figure 2C and Figure 3 The present invention provides an inkjet chip packaging structure, which is arranged on a flexible circuit board 100 and includes the following components: a circuit board contact 110; and an inkjet chip 120, wherein the inkjet chip 120 further includes a signal control module 123, an inkjet control module 121, a nozzle 122, a current input terminal F n , ground terminal GND, and current output terminal G n ; The signal control module 123 receives the printing control signal transmitted from the printer to the circuit board contact 110; the inkjet control module 121 is coupled to the signal control module 123, and drives the nozzle 122 to eject the ink required for printing by the printing control signal; the current input terminal F nThe first current I1 is received from the circuit board contact 110 to provide the power required for the inkjet control module 121 to operate; the current output terminal G n The circuit board contact 110 is coupled to output a second current I2, so that the inkjet chip packaging structure and the printer form a power circuit; wherein the ground terminal GND is not connected to the circuit board contact 110, and the inkjet control module 121 includes a control unit 121B, which is a metal oxide semi-conductor field effect transistor (MOSFET).

[0020] According to an embodiment of the present invention, the MOSFET mentioned above can be selected from N-type metal oxide semiconductor field effect transistor (NMOS) or P-type metal oxide semiconductor field effect transistor (PMOS) according to the needs of the application. In addition, according to the content of the present invention, the inkjet control module 121 further includes a heating resistor unit 121A for heating the ink required for printing, wherein the number of the heating resistor unit 121A and the control unit 121B in the inkjet control module 121 can be arbitrarily set to at least one according to the needs of the application.

[0021] In accordance with the above, please refer to Figure 1B , Figure 2C ,as well as Figure 3 According to one aspect of the present invention, in the circuit architecture of the prior art using a low-level inkjet chip process, generally all ground terminals GND are electrically connected. Therefore, when the control unit 121B uses MOSFET, all current output terminals G n The ground terminal GND is electrically connected, so the leakage current I3 at this time will return to the printer from the ground terminal GND through the circuit board contact 110, thereby causing poor ink heating effect. At the same time, when the MOSFET is not in operation, leakage current will also occur. In other words, according to the description of the above-mentioned figures, in the prior art, the current input terminal F n The first input current I1 will be consumed to a considerable extent in the third current I3 (i.e., leakage current), and will not follow the normal second current I2 from the drain D to the source S. However, in the present invention, since the ground terminal GND is not connected to the circuit board contact 110, this circuit architecture can make the current input terminal F n When the input first current I1 passes through the heating resistor unit 121A and the gate G of the MOSFET serving as the control unit 121B is given a high voltage, making the inkjet control module 121 electrically conductive, the magnitude of the third current I3 can approach zero, thereby ultimately improving the power utilization efficiency of the heating resistor unit 121A. In the present invention, in the inkjet chip 120, whether it contains a high-level or low-level process source MOSFET, a certain gain effect can be achieved.

[0022] According to the embodiment of the present invention, the inkjet chip package structure after the above circuit architecture improvement can correspond to a resolution DPI (Dots Per Inch, number of dots per inch) ranging from 150 to 48000 DPI, and a printing swath ranging from 0.25 inches to 12 inches.

[0023] According to an embodiment of the present invention, the material of the heating resistor unit 121A is selected from one of polysilicon (Poly silicon), tantalum aluminide (TaAl), tantalum (Ta), tantalum nitride (TaN), tantalum disilicide (Si2Ta), carbon (C), silicon carbide (SiC), indium tin oxide (ITO), zinc oxide (ZnO), cadmium sulfide (CdS), hafnium diboride (HfB2), titanium tungsten alloy (TiW), and titanium nitride (TiN).

[0024] According to an embodiment of the present invention, when the inkjet chip packaging structure is applied to the structure of the ink cartridge 10, one to six colors of ink can be provided. If it is one color, the one color ink can be cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), and black (K: Black) ink. If it is six colors, black (K: Black), cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), light cyan (LC: Light Cyan) and light magenta (LM: Light Megenta) six colors of ink can be provided respectively. Of course, in another embodiment, the ink cartridge 10 can also be four colors, respectively providing cyan (C: Cyan), magenta (M: Megenta), yellow (Y: Yellow), and black (K: Black) four colors of ink. The quantity of the above-mentioned ink supply or the colors provided can be replaced or modified according to the actual application requirements.

[0025] In summary, the present invention proposes an inkjet chip packaging structure for application in inkjet printing technology, so that the packaging structure can improve MOSFET components from high- and low-level processes, increase the efficiency of ink heating and improve the quality of inkjet printing. It is characterized in that the technical proposal can be modified in various ways by people familiar with this technology, but all of them do not deviate from the rights to be protected as stated in the attached patent application scope.

[0026]

Explanation of symbols

[0027] 10: Ink cartridge

[0028] 100: Flexible printed circuit board

[0029] 110: Circuit board contacts

[0030] 120: Inkjet chip

[0031] 121: Inkjet control module

[0032] 122: Spray hole

[0033] 123: Signal control module

[0034] 121A: Heating resistor unit

[0035] 121B: Control unit

[0036] D: Drain

[0037] F n : Current input terminal

[0038] G: Gate

[0039] G n : Current output terminal

[0040] GND: Ground terminal

[0041] I1: First current

[0042] I2: Second current

[0043] I3: The third current

[0044] S: Source

Claims

1. An inkjet chip packaging structure is disposed on a flexible circuit board, and the inkjet chip packaging structure comprises: at least one circuit board contact; An inkjet chip further comprises at least one signal control module, at least one inkjet control module, a nozzle, at least one current input terminal, at least one ground terminal, and at least one current output terminal; in, The at least one signal control module receives a printing control signal from at least one circuit board contact; The at least one inkjet control module is coupled to the at least one signal control module, and drives the nozzle to perform printing through the printing control signal; The at least one current input terminal receives a first current inputted from the at least one circuit board contact, and the at least one current output terminal is coupled to the at least one circuit board contact to output a second current; Wherein, the at least one ground terminal is not connected to the at least one circuit board contact; The at least one inkjet control module includes at least one control unit, and the control unit is a metal oxide semiconductor field effect transistor (MOSFET).

2. In the inkjet chip packaging structure as described in claim 1, the metal oxide semiconductor field effect transistor of at least one control unit is selected from an N-type metal oxide semiconductor field effect transistor (NMOS) or a P-type metal oxide semiconductor field effect transistor (PMOS).

3. The inkjet chip packaging structure as claimed in claim 1, wherein the resolution DPI (Dots Per Inch) corresponding to the inkjet chip packaging structure ranges from 150 to 48000 DPI. 4 . The inkjet chip packaging structure as claimed in claim 1 , wherein the printing swath corresponding to the inkjet chip packaging structure is between 0.25 inches and 12 inches. 5 . The inkjet chip packaging structure as claimed in claim 1 , wherein the at least one inkjet control module further comprises at least one heating resistor unit for heating the ink required for printing.

6. The inkjet chip packaging structure as described in claim 5, wherein the material of the at least one heating resistor unit is selected from polysilicon, tantalum aluminide, tantalum, tantalum nitride, tantalum disilicide, carbon, silicon carbide, indium tin oxide, zinc oxide, cadmium sulfide, hafnium diboride, titanium tungsten alloy, titanium nitride, or any combination thereof.

7. The inkjet chip package structure as described in claim 1, when applied to an ink cartridge, can provide one to six colors of ink, and the six colors of ink are selected from black, cyan, magenta, yellow, light cyan, or light magenta.

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