Low-dielectric-loss multilayer ceramic substrate and preparation method thereof
By using alumina composites and other additives of different shapes in the multilayer ceramic substrate, a dense microstructure is formed, which solves the problem of high dielectric loss of the multilayer ceramic substrate, and achieves the effect of reducing dielectric loss and improving signal transmission stability.
Patent Information
- Application Number
- CN202510212856.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2045-02-26
AI Technical Summary
The dielectric loss of existing multi-layer ceramic substrates is high, resulting in increased substrate temperature, signal transmission attenuation and distortion, affecting the normal operation of electronic components and the accuracy of signal transmission.
By combining the first alumina (spherical) and the second alumina (flake) of different shapes, combining plasticizers, binders, sintering aids and dispersants, a multi-layer ceramic substrate is prepared to form a dense and orderly microstructure to reduce dielectric loss.
It effectively reduces the dielectric loss of multi-layer ceramic substrates, reduces the loss of converting electrical energy into thermal energy, reduces the heating of the substrate, and improves the accuracy and stability of signal transmission.