Alignment method, semiconductor production equipment and computer readable storage medium

Abstract

The invention provides an alignment method, semiconductor production equipment and a computer readable storage medium, and the method comprises the steps: dividing a plurality of alignment marks on a substrate into a plurality of mark groups, each mark group comprises at least one alignment mark, and the alignment marks of each mark group are arranged according to a preset rule; at least part of alignment lenses of the alignment device are controlled to move, so that each alignment mark of any mark group can correspond to one alignment lens; controlling the alignment device and / or a workpiece table for bearing the substrate to move, so that the alignment device aligns the alignment marks of the mark groups in sequence; when alignment is carried out on the alignment marks of any mark group, each alignment mark of the corresponding mark group is located below the corresponding alignment lens, so that the alignment device completes alignment operation of all the alignment marks in one mark group at the same time, and the yield of semiconductor production equipment applying the alignment method is improved.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor technology, and in particular relates to an alignment method, semiconductor production equipment and a computer-readable storage medium. Background Art

[0002] The substrate alignment subsystem is one of the key subsystems of the exposure equipment. It mainly provides substrate mark measurement for the equipment to realize precise exposure function, and converts the pixel coordinate position of the alignment mark on the substrate within the imaging field of view into the whole machine coordinate system of the exposure equipment, so that the upper-level software can solve the posture (i.e. position and attitude) relationship between the substrate and the moving stage that carries it for exposure according to the alignment measurement model, so as to achieve certain exposure overlay accuracy requirements.

[0003] In the prior art, the substrate alignment subsystem generally includes only one alignment lens, and the alignment lens is fixed. When performing the alignment operation, the substrate is adsorbed by the workpiece stage and carried to move, so that the alignment marks on the substrate are successively under the alignment lens, so that the alignment marks can be photographed by the alignment lens. After a series of photoelectric signal conversion and model calculation, the position coordinates of the alignment marks on the substrate are converted into physical coordinates under the workpiece stage, so that a relative coordinate relationship is established between the substrate and the moving stage, so that the moving stage controls the substrate to move accurately, thereby achieving the effect of meeting the required exposure overlay accuracy.

[0004] The size of the substrate material produced by the exposure equipment is relatively large, generally 404mm×515mm, 510mm×515mm, 600mm×600mm, etc., and the distance between the marks arranged on the substrate is relatively far, which results in a long alignment operation time and reduces the productivity of the exposure equipment. Summary of the invention

[0005] The object of the present invention is to provide an alignment method, semiconductor production equipment and computer-readable storage medium, aiming to shorten the duration of the alignment operation and improve the productivity of the semiconductor production equipment.

[0006] To achieve the above object, the present invention provides an alignment method, comprising:

[0007] Dividing the plurality of alignment marks on the substrate into a plurality of mark groups, each of the mark groups comprising at least one alignment mark, and the alignment marks of each of the mark groups are arranged according to a preset rule;

[0008] Controlling the movement of at least part of the alignment lens of the alignment device so that each alignment mark of any one of the mark groups can correspond to one alignment lens; and,

[0009] Control the movement of the alignment device and / or the workpiece stage carrying the substrate so that the alignment device aligns the alignment marks of each mark group in turn; when aligning the alignment marks of any mark group, each alignment mark of the corresponding mark group is located below the corresponding alignment lens.

[0010] Optionally, the substrate includes a plurality of exposure areas, and a plurality of alignment marks are disposed on each of the exposure areas;

[0011] Each of the exposure areas has multiple alignment points; the number and arrangement of the alignment points on different exposure areas are the same; on the same exposure area, the number of the alignment points is greater than or equal to the number of the alignment marks, and each alignment mark is located at one of the alignment points.

[0012] Optionally, the step of dividing the plurality of alignment marks on the substrate into a plurality of mark groups comprises:

[0013] Divide the plurality of alignment marks in the same exposure area into the same mark group; or,

[0014] The alignment marks at the corresponding alignment points of at least two different exposure areas are divided into the same mark group.

[0015] Optionally, the alignment method further comprises:

[0016] Divide all the alignment points into a plurality of alignment point groups, and make each of the marking groups correspond to one of the alignment point groups; the number of the alignment point groups is greater than or equal to the number of the marking groups, each of the alignment point groups includes a plurality of alignment points, and the number and arrangement of the alignment points of different alignment point groups are the same;

[0017] The preset rule is that each alignment mark of the mark group is arranged at an alignment point of the corresponding alignment point group.

[0018] Optionally, the number of the alignment lenses is the same as the number of the alignment points of the alignment point group;

[0019] The step of controlling at least part of the alignment lenses of the alignment device to move so that each alignment mark of any one of the mark groups can correspond to one alignment lens comprises:

[0020] At least part of the alignment lenses of the alignment device are controlled to move so that the plurality of alignment lenses correspond to the plurality of alignment points of the alignment point group one by one.

[0021] Optionally, the step of controlling at least part of the alignment lenses to move so that the plurality of alignment lenses correspond one-to-one to the plurality of alignment points of the alignment point group comprises:

[0022] According to the relative position relationship between the plurality of alignment points of the alignment point group and the coordinates of the preset reference position in the whole machine coordinate system, the coordinates of a plurality of first target positions in the whole machine coordinate system are acquired; the number of the first target positions is less than the number of the alignment points of the alignment point group by 1;

[0023] The reference position, multiple first target positions and multiple alignment lenses are matched one by one, and the coordinates of the reference position and each of the first target positions in the whole machine coordinate system are used as the coordinates of the end points of the corresponding alignment lens movement in the whole machine coordinate system to control the corresponding alignment lens movement.

[0024] Optionally, the alignment method further comprises the following steps performed for each of the marking groups:

[0025] Based on the coordinates of the alignment marks of the mark group in the base coordinate system and the coordinates of the alignment lens corresponding to the alignment marks of the mark group in the whole machine coordinate system, acquiring the coordinates of the second target position in the whole machine coordinate system;

[0026] The coordinates of the alignment lens corresponding to the reference position in the whole machine coordinate system are related to the position of the reference position in the whole machine coordinate system, and the coordinates of the alignment lens corresponding to the first target position in the whole machine coordinate system are related to the coordinates of the corresponding first target position in the whole machine coordinate system;

[0027] The step of controlling the movement of the alignment device and / or the workpiece stage carrying the substrate so that the alignment device sequentially aligns the alignment marks of each of the mark groups comprises:

[0028] The workpiece stage is controlled to move so that the workpiece stage reaches each of the second target positions in sequence.

[0029] Optionally, the reference position, the plurality of the first target positions and the plurality of the alignment points correspond one to one;

[0030] The coordinates of the reference position in the whole machine coordinate system are (WA1.x, WA1.y), and the coordinates of the first target position in the whole machine coordinate system are (WAj.x, WAj.y); the coordinates of the alignment point corresponding to the reference position in the mark group coordinate system are (M1.x, M1.y), and the coordinates of the alignment point corresponding to any of the first target positions in the mark group coordinate system are (Mj.x, Mj.y), where j is an integer greater than or equal to 2; wherein:

[0031] WAj.x=WA1.x-(M1.x-Mj.x),

[0032] WAj.y=WA1.y-(M1.y-Mj.y).

[0033] Optionally, the coordinates of the reference position in the whole machine coordinate system are used as the nominal coordinates of the alignment lens corresponding to the reference position in the whole machine coordinate system, and the coordinates of each of the first target positions in the whole machine coordinate system are used as the nominal coordinates of a corresponding alignment lens in the whole machine coordinate system;

[0034] The alignment method further comprises:

[0035] The nominal coordinates of each alignment lens in the whole machine coordinate system are corrected to obtain the coordinates of each alignment lens in the whole machine coordinate system.

[0036] Optionally, the step of correcting the nominal coordinates of each alignment lens in the whole machine coordinate system includes:

[0037] Based on the nominal coordinates of each alignment lens in the whole machine coordinate system, the coordinates of the reference mark on the workpiece stage in the workpiece stage coordinate system, and the coordinates of the initial position of the workpiece stage in the whole machine coordinate system, the coordinates of multiple nominal positions of the workpiece stage in the whole machine coordinate system are obtained;

[0038] Controlling the movement of the workpiece stage so that the reference mark arrives at the optical axis of each alignment lens in sequence, and obtaining the coordinates of multiple actual positions of the workpiece stage when the reference mark arrives at the optical axis of each alignment lens in the whole machine coordinate system; the multiple actual positions, the multiple nominal positions, and the multiple alignment lenses correspond one to one;

[0039] Based on the coordinates of each actual position and the corresponding nominal position in the whole machine coordinate system, an alignment deviation is obtained, each alignment deviation corresponds to one alignment lens;

[0040] Based on each alignment deviation and the nominal coordinates of the corresponding alignment lens in the whole machine coordinate system, the coordinates of the corresponding alignment lens in the whole machine coordinate system are obtained.

[0041] Optionally, the nominal coordinates of the alignment lens in the whole machine coordinate system are (WAi.x, WAi.y), and the coordinates of the reference mark in the workpiece stage coordinate system are (S fid .x, S fix .y), the nominal position of the workpiece table in the whole machine coordinate system is (Si base-exp .x,Si base-exp .y), i is an integer greater than or equal to 1; where:

[0042] Si base-exp .x=S fid .x-Si -1 WAi.x,

[0043] Sj base-exp .y=S fid .y-Si -1 ·WAi.y;

[0044] In the formula, Si -1 It is the inverse matrix of the rotation matrix of the workpiece stage when the workpiece stage moves from the initial position to the reference mark arriving at the nominal coordinates corresponding to the alignment lens in the whole machine coordinate system. It is obtained according to the coordinates of the initial position of the workpiece stage in the whole machine coordinate system and the nominal coordinates of the alignment lens in the whole machine coordinate system.

[0045] Optionally, the step of acquiring the coordinates of the plurality of second target positions in the whole machine coordinate system based on the coordinates of the plurality of alignment lenses in the whole machine coordinate system and the coordinates of the plurality of alignment marks in the mark group in the base coordinate system comprises:

[0046] Based on the coordinates of the alignment marks in the mark group in the base coordinate system and the coordinates of the alignment lens corresponding to the alignment marks in the mark group in the whole machine coordinate system, the coordinates of at least one nominal second target position in the whole machine coordinate system are obtained; the number of the nominal second target positions is the same as the number of the alignment marks in the mark group;

[0047] When the number of the nominal second target positions is one, the coordinates of the nominal second target position in the whole machine coordinate system are used as the coordinates of the second target position; when the number of the nominal second target positions is multiple, the average value of the coordinates of the multiple nominal second target positions in the whole machine coordinate system is obtained as the coordinates of the second target position in the whole machine coordinate system.

[0048] Optionally, the x-axis of the marking group coordinate system is parallel to the x-axis of the base coordinate system, and the y-axis of the marking group coordinate system is parallel to the y-axis of the base coordinate system;

[0049] The coordinates of the alignment mark in any of the mark groups in the corresponding mark group coordinate system are (Mi.x, Mi.y), the coordinates of the origin of the corresponding mark group coordinate system in the base coordinate system are (Zp.x, Zp.y), p is an integer greater than or equal to 1, and the coordinates of the alignment mark in the base coordinate system are (Mi.x, Mi.y). iorm .x,Mi iorm .y), Mi iorm .x, Mi.x, and Zp.x satisfy the following relationship:

[0050] Mi iorm .x=Mi.x+Zp.x,

[0051] Mi iorm .y, Mi.y, and Zp.y satisfy the following relationship:

[0052] Mi iorm .y=Mi.y+Zp.y;

[0053] The coordinates of the alignment lens in the whole machine coordinate system are (WAi acc .x,WAi acc .y), the corresponding coordinates of the nominal second target position in the whole machine coordinate system are (Si imark-exp .x,Si imark-exp .y), Si imark-exp .x、Mi iorm .x、WAi acc .x satisfies the following relationship:

[0054] Si imark-exp .x=Mi iorm .x-WAi acc .x;

[0055] Si imark-exp .y、Mi iorm .y、Wi acc .y satisfy the following relationship:

[0056] Si imark-exp .y=Mi iorm .y-WAi acc .y.

[0057] To achieve the above object, the present invention further provides a semiconductor production equipment, comprising:

[0058] An alignment device, comprising a plurality of lenses, at least some of the lenses being alignment lenses;

[0059] a workpiece table; and,

[0060] A control unit is communicatively connected with the alignment device and the workpiece stage, and is configured to execute the alignment method as described in any of the preceding items.

[0061] Optionally, the semiconductor production equipment includes exposure equipment or detection equipment.

[0062] To achieve the above-mentioned object, the present invention further provides a computer-readable storage medium having a program stored thereon, and when the program is executed, the alignment method as described in any of the preceding items is executed.

[0063] Compared with the prior art, the alignment method, semiconductor production equipment and computer-readable storage medium of the present invention have the following advantages:

[0064] The aforementioned alignment method comprises: dividing a plurality of alignment marks on a substrate into a plurality of mark groups, each of the mark groups comprising at least one alignment mark, and the alignment marks of each mark group are arranged according to a preset rule; controlling at least part of the alignment lens of the alignment device to move so that each alignment mark of any mark group can correspond to one alignment lens; and controlling the movement of the alignment device and / or the workpiece stage carrying the substrate so that the alignment device aligns the alignment marks of each mark group in turn; when aligning the alignment marks of any mark group, each alignment mark of the corresponding mark group is located below the corresponding alignment lens. That is, the alignment device can simultaneously complete the alignment operation of all the alignment marks in one mark group, thereby effectively shortening the time required to complete all the alignment marks on the substrate, thereby improving the yield of semiconductor production equipment to which the alignment method is applied. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] The accompanying drawings are used to better understand the present invention and shall not constitute improper limitations of the present invention.

[0066] Figure 1 It is a schematic diagram of the structure of a substrate.

[0067] Figure 2 It is a schematic diagram of the structure of another substrate.

[0068] Figure 3 It is a schematic diagram of the structure of another substrate.

[0069] Figure 4 It is a schematic diagram of the structure of another substrate.

[0070] Figure 5It is a schematic diagram of the structure of another substrate.

[0071] Figure 6 It is a schematic structural diagram of an exposure device to which the alignment method provided according to an embodiment of the present invention is applied.

[0072] Figure 7 is a flow chart of an alignment method provided according to an embodiment of the present invention.

[0073] Figure 8 The present invention shows an alignment method according to an embodiment of the present invention. Figure 1 A schematic diagram of base-divided marker groups is shown, in which markers displayed in the same color belong to the same marker group.

[0074] Fig. 9 The present invention shows the alignment method according to one embodiment of the present invention based on the principle of two alignments in the execution process. Figure 1 A schematic diagram of the base partitioning marking group shown, Fig. 9 The alignment marks at the corresponding alignment points of all exposure areas are divided into the same mark group.

[0075] Fig.10 The present invention shows the alignment method according to one embodiment of the present invention based on the principle of two alignments in the execution process. Figure 1 A schematic diagram of the base partitioning marking group shown, Fig.10 The alignment marks at the corresponding alignment points of the two exposure areas are divided into the same mark group;

[0076] Fig.11 The present invention shows the alignment method according to one embodiment of the present invention. Figure 4 A schematic diagram of a substrate partitioning marker group is shown;

[0077] Fig.12 It is a schematic diagram of the distribution of multiple alignment lenses of an alignment device when they move to correspond one-to-one with multiple alignment points of an alignment point group during the execution of an alignment method provided by an embodiment of the present invention.

[0078] Fig.13 is a schematic diagram of the distribution of multiple alignment lenses of an alignment device when they move to correspond one-to-one with multiple alignment points of an alignment point group during the execution of an alignment method provided by an embodiment of the present invention, Fig.13 and Fig.12 The applied substrates are different.

[0079] [The reference numerals are explained as follows]: 01-substrate, 011-exposure area, 0101-alignment mark, 0102-alignment point, 10-objective lens system, 20-workpiece stage, 30-alignment device, 31-mounting plate, 32-lens. DETAILED DESCRIPTION

[0080] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the present embodiment only illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the figure instead of being drawn according to the number, shape and size of the components in the actual implementation. The type, quantity and proportion of each component in the actual implementation can be a random change, and the component layout type may also be more complicated.

[0081] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise that implementation is possible, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present invention and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present invention.

[0082] As used in this specification, the singular forms "one", "an" and "the" include plural objects, and the plural form "multiple" includes more than two objects, unless the content clearly indicates otherwise. As used in this specification, the term "or" is usually used in the sense of including "and / or", unless the content clearly indicates otherwise, and the terms "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] Figures 1 to 6 Schematic diagrams showing the structures of different substrates 01 in the prior art. Figures 1 to 6As shown, a plurality of alignment marks 0101 are dispersedly arranged on the substrate 01. As described in the background art, the size of the substrate 01 is relatively large, resulting in a relatively long distance between the alignment marks 0101. Therefore, in the production process of the exposure equipment, when the prior art is adopted to carry the substrate 01 through the workpiece stage, and drive the substrate 01 to move so that each alignment mark sequentially arrives directly below the fixed alignment lens to complete the alignment operation of the alignment marks 0101 on the substrate 01, there is a problem that the movement stroke of the workpiece stage is long, the movement time is long, and the alignment efficiency is low, which leads to a low production capacity of the exposure equipment.

[0084] In view of this, the present invention provides an alignment method, which can be applied to an exposure device and used to perform alignment operations on the alignment marks 0101 of the substrate 01 carried on the workpiece table, and can effectively shorten the time spent in performing alignment operations on all the alignment marks 0101 of the substrate 01, thereby improving the production capacity of the exposure device.

[0085] In order to make the purpose, advantages and features of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are all in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.

[0086] Figure 6 FIG. 2 is a schematic diagram showing the structure of an exposure device to which the alignment method provided by an embodiment of the present invention is applied. Figure 6 As shown, the exposure equipment comprises an objective lens system 10, a work stage 20 and an alignment device 30. The work stage 20 is movably arranged below the objective lens system 10. The alignment device 30 is movably arranged on one side of the objective lens system 10, and comprises a mounting plate 31 and a plurality of lens assemblies. Each of the lens assemblies comprises a lens 32 and a driving mechanism (not shown in the figure), and the driving mechanism can at least drive the lens 32 to move on a horizontal plane relative to the mounting plate 31. When the exposure equipment is working, the substrate 01 is first carried by the work stage 20, and the alignment device 30 is used to perform alignment operations on all the alignment operations of the substrate 01 carried on the work stage 20 based on the alignment method, and finally the objective lens system 10 is used to guide the light beam to the substrate 01 to complete the exposure operation of the substrate 01. Other exposure equipments that have applied the alignment method provided by the embodiment of the present invention may not have the objective lens system 10.

[0087] Herein, the lens 32 in the alignment device that performs an alignment operation on at least one alignment mark 0101 during the execution of the alignment method is referred to as an alignment lens. It should be understood that at least part of the lens 32 of the alignment device will be used as an alignment lens. Figure 6 All of the lenses 32 are used as the alignment lenses.

[0088] Figure 7 A flow chart of the alignment method is shown. Figure 1 As shown, the alignment method at least includes the following steps S1, S2, and S3.

[0089] The step S1 includes: dividing the plurality of alignment marks 0101 on the substrate 01 into a plurality of mark groups. Each mark group includes at least one alignment mark 0101, and the alignment marks 0101 in each mark group are arranged according to a preset rule.

[0090] Step S2 includes: controlling at least part of the alignment lenses of the alignment device 30 to move so that each alignment mark 0101 of any mark group can correspond to one alignment lens.

[0091] The step S3 includes: controlling the movement of the alignment device 30 and / or the workpiece table 20 carrying the substrate 01, so that the alignment device 30 aligns the alignment marks 0101 of each of the mark groups in turn, and when aligning the alignment mark 0101 of any one of the mark groups, each of the alignment marks 0101 of the corresponding mark group is located below the corresponding alignment lens.

[0092] That is, the alignment device 30 can simultaneously complete the alignment operation of all alignment marks 0101 of the same mark group. In this way, the alignment operation time of all the alignment marks 0101 on the substrate 01 can be greatly shortened, thereby improving the working efficiency and production capacity of the exposure equipment.

[0093] Please refer back to Figures 1 to 5 The substrate 01 includes a plurality of exposure areas 011, each of which is provided with a plurality of alignment marks 0101, and the number of the alignment marks 0101 on different exposure areas 011 is the same or different. Each exposure area 011 also has a plurality of alignment points 0102. The number and arrangement of the alignment points 0102 on different exposure areas 0102 are the same. On the same exposure area 011, the number of the alignment points 0102 is greater than or equal to the number of the alignment marks 0101, and each alignment mark 0101 is located at one alignment point 0102.

[0094] Based on the form of the substrate 01, the principle of dividing the mark group can be one of principle 1 and principle 2. The first principle is: dividing the multiple alignment marks 0101 of the same exposure area 011 into the same mark group. The second principle is: dividing the alignment marks 0101 at the corresponding alignment points 0102 of at least two exposure areas 011 into the same mark group. That is, in step S1, the multiple alignment marks 0101 on the substrate 01 are divided into multiple mark groups based on the first principle or the second principle.

[0095] For ease of understanding, this article Figures 1 to 5 Although each alignment point 0102 is marked with a circle, it should be known that each alignment point 0102 represents a position and will not be displayed on the actual substrate 01, that is, there is no circle marking the alignment point 0102 on the actual substrate 01.

[0096] In addition, the alignment mark 0101 may have any suitable shape, such as a cross, a triangle, a circle, etc. In this article, a cross-shaped mark is used as the alignment mark 0101.

[0097] It is worth noting that the number and arrangement of the alignment points 0102 on the exposure area 011 and the division principle of the mark group are determined by an operator or a control unit according to the distribution pattern of the alignment marks 0101 on each of the exposure areas 011 of the substrate 01.

[0098] For example, in Figure 1 In the embodiment, the substrate 01 includes four exposure areas 011, which are arranged in a 2×2 array, and four alignment marks 0101 are arranged on one of the exposure areas 011, and the four alignment marks 0101 are dispersedly arranged in a rectangular shape (such as Figure 1 On the four vertices of the exposure region 011 (shown by the dotted lines in FIG), three alignment marks 0101 are set on the other three exposure regions 011, and the three alignment marks 0101 on the same exposure region 011 are dispersedly arranged in a rectangular shape (as shown in FIG. Figure 1 The rectangles where the alignment marks 0101 of each exposure area 011 are located are the same, and in the exposure area 011 where three alignment marks 0101 are set, the positions of the vertices of the rectangles where the alignment marks 0101 are not set are the same. Figure 1In the substrate 01 shown, four alignment points 0102 can be determined on each exposure area 011 , and the four alignment points 0102 are dispersedly arranged on the four vertices of the rectangle where the alignment mark 0101 is located.

[0099] For example, in Figure 2 In the embodiment, the substrate 01 includes four exposure areas 011, which are arranged in a 2×2 array. Three alignment marks 0101 are set on each exposure area 011, and the three alignment marks 0101 on the same exposure area 011 are dispersedly arranged at the three vertices of a rectangle. The rectangles where the alignment marks 0101 of the four exposure areas 011 are located are the same, but the vertices of the rectangles where the alignment marks 0101 are not set are different. Figure 2 In the substrate 01 shown, four alignment points 0102 can be determined on each exposure area 011 , and the four alignment points 0102 are dispersedly arranged on the four vertices of the rectangle where the alignment mark 0101 is located.

[0100] For example, in Figure 3 In the embodiment, the substrate 01 includes six exposure areas 011, and the six exposure areas 011 are arranged in a 2×3 array. Four alignment marks 0101 are arranged on each exposure area 011. The four alignment marks 0101 on the same exposure area 011 are dispersedly arranged at the four vertices of a rectangle, and the alignment marks 0101 of each exposure area 011 are located in the same rectangle. Therefore, Figure 3 In the substrate 01 shown, four alignment points 0102 can be determined on each exposure area 011 , and the four alignment points 0102 are dispersedly arranged on the four vertices of the rectangle where the alignment mark 0101 is located.

[0101] Also, in Figure 4 In the figure, the substrate 01 includes two exposure areas 011, and the two exposure areas 011 are arranged along a preset direction, such as the left-right direction. Four alignment marks 0101 are set on one of the exposure areas 011, and the four alignment marks 0101 are arranged at equal intervals along the left-right direction, and the distance between two adjacent alignment marks 0101 is d. Three alignment marks 0101 are set on the other exposure area 011, and the three alignment marks 0101 are arranged at intervals along the left-right direction, and the distance between the first alignment mark 0101 and the second alignment mark 0101 from left to right is d, and the distance between the second alignment mark 0101 and the third alignment mark 0101 is 2d. Therefore, for Figure 4For the substrate 01 shown, four alignment points 0102 can be determined on each exposure area 011, and the four alignment points 0102 are arranged at equal intervals along the extension direction of the connecting line of the plurality of alignment marks 0101, and the distance between two adjacent alignment points 0102 is d.

[0102] Also, in Figure 5 In the embodiment, the substrate 01 includes four exposure areas 011, and the four exposure areas 011 are arranged in a 2×2 array. Four alignment marks 0101 are set on two of the exposure areas 011, and the four alignment marks 0101 on the same exposure area 011 are dispersedly arranged at the four vertices of a trapezoid; three alignment marks 0101 are set on the other two exposure areas 011, and the three alignment marks 0101 on the same exposure area 011 are dispersedly arranged at the three vertices of a trapezoid. The trapezoids where the alignment marks 0101 on each exposure area 011 are located are the same. Therefore, for Figure 5 The substrate 01 shown can determine four alignment points 0102 on each exposure area 011, and the four alignment points 0102 on the same exposure area 011 are dispersedly arranged on the four vertices of the trapezoid where the alignment mark 0101 is located.

[0103] for Figures 1 to 4 For the substrate 01 shown, the division principle of the marking group can be either the first principle or the second principle. Figure 8 Based on the principle, Figure 1 The schematic diagram shows that the multiple alignment marks 0101 of the substrate 01 are divided into multiple mark groups, and the alignment marks 0101 with the same color in the figure belong to the same mark group. Specifically, the alignment marks 0101 located in the exposure area 011 at the upper left corner are divided into one mark group and displayed in red, the alignment marks 0101 located in the exposure area 011 at the lower left corner are divided into another mark group and displayed in blue-gray, the alignment marks 0101 located in the exposure area 011 at the lower right corner are divided into another mark group and displayed in black, and the alignment marks 0101 located in the exposure area 011 at the upper right corner are divided into another mark group and displayed in green. Fig. 9 and Fig.10 The following are respectively shown based on the above principles. Figure 1 The schematic diagram of the plurality of alignment marks 0101 of the substrate 01 being divided into a plurality of mark groups is shown, wherein Fig. 9The alignment marks 0101 at the corresponding alignment points 0102 of all exposure areas 011 are divided into the same mark group, Fig.10 In the figure, the alignment marks 0101 at the corresponding alignment points 0102 of the two exposure areas 011 on the left are divided into the same mark group, and the alignment marks 0101 at the corresponding alignment points 0102 of the two exposure areas 011 on the right are divided into the same mark group. The alignment marks 0101 with the same color in the figure belong to the same mark group. Fig. 9 and Fig.10 To be more specific: Figure 1 The four alignment points 0102 of each exposure area 011 of the substrate 01 are respectively marked as a first alignment point 01021, a second alignment point 01022, a third alignment point 01023 and a fourth alignment point 01024. Figure 1 Taking the orientation shown as an example, the first alignment point 01021 is the alignment point 012 located at the upper left corner of the exposure area 011, the second alignment point 01022 is the alignment point 0102 located at the lower left corner of the exposure area 011, the third alignment point 01023 is the alignment point 0102 located at the lower right corner of the exposure area 011, the fourth alignment point 01024 is the alignment point 0102 located at the upper right corner of the exposure area 011, and the first alignment point 01023 is the alignment point 0102 located at the upper right corner of the exposure area 011. 21. The second alignment point 01022, the third alignment point 01023, and the fourth alignment point 01024 are all provided with the alignment mark 0101, the first alignment point 01021, the second alignment point 01022, and the third alignment point 01023 of the exposure area 011 at the lower right corner, the exposure area 011 at the lower left corner, and the exposure area 011 at the upper left corner are all provided with the alignment mark 0101, and the fourth alignment point 01024 is not provided with the alignment mark 0101. Fig. 9, the alignment marks 0101 located at the first alignment points 01021 of the four exposure areas 011 are divided into the same mark group, represented by red, and recorded as the first mark group; the alignment marks 0101 located at the second alignment points 01022 of the four exposure areas 011 are divided into the same mark group, represented by blue-gray, and recorded as the second mark group; the alignment marks 0101 located at the third alignment points 01023 of the four exposure areas 011 are divided into the same mark group, represented by black, and recorded as the third mark group; the alignment marks 0101 located at the fourth alignment points 01024 of the four exposure areas 011 are divided into the same mark group, represented by green, and recorded as the fourth mark group, the first mark group, the second mark group and the third mark group respectively have four alignment marks 0101, and the fourth mark group has only one alignment mark 0101. Fig.10 , the alignment mark 0101 at the first alignment point 01021 of the exposure area 011 located in the upper left corner and the alignment mark 0101 at the first alignment point 01021 of the exposure area 011 located in the lower left corner are divided into the same mark group and are represented in red; the alignment mark 0101 at the second alignment point 01022 of the exposure area 011 located in the upper left corner and the alignment mark 0101 at the second alignment point 01022 of the exposure area 011 located in the lower left corner are divided into the same mark group and are represented in blue-gray; the alignment mark 0101 at the third alignment point 01023 of the exposure area 011 located in the upper left corner and the alignment mark 0101 at the third alignment point 01023 of the exposure area 011 located in the lower left corner are divided into the same mark group and are represented in black; The alignment mark 0101 at the first alignment point 01021 and the alignment mark 0101 at the first alignment point 01021 of the exposure area 011 located in the lower right corner are divided into the same mark group and represented in yellow; the alignment mark 0101 at the second alignment point 01022 at the upper right corner and the alignment mark 0101 at the second alignment point 01022 of the exposure area 011 located in the lower right corner are divided into the same mark group and represented in purple; the alignment mark 0101 at the third alignment point 01023 at the upper right corner and the alignment mark 0101 at the third alignment point 01023 of the exposure area 011 located in the lower right corner are divided into the same mark group and represented in gray; the alignment mark 0101 at the fourth alignment point 01024 at the upper right corner is divided into one mark group and represented in sky blue. Fig.11 Based on the principle, Figure 4 The schematic diagram shown is a diagram of dividing the plurality of alignment marks 0101 of the substrate 01 into a plurality of mark groups. In the figure, the alignment marks 0101 with the same color belong to the same mark group.

[0104] for Figure 5 For the substrate 01 shown, the division principle of the marking groups is principle one.

[0105] It should be understood that when the marking group division principle is the first principle, the number of the marking groups is equal to the number of the exposure areas 011. When the marking group division principle is the second principle, the number of the marking groups is equal to or greater than the number of the alignment marks 0101 on the exposure area 011 having the most alignment marks 0101. Specifically, when the alignment marks 0101 located at the corresponding alignment points 0102 of all the exposure areas 011 are divided into the same marking group, the number of the marking groups is equal to the number of the alignment marks 0101 on the exposure area 011 having the most alignment marks 0101. When the alignment marks 0101 located at the corresponding alignment points 0102 of some of the exposure areas 011 are divided into the same marking group, the number of the marking groups is greater than the number of the alignment marks 0101 on the exposure area 011 having the most alignment marks 0101. For example, Fig.10 In the illustrated case, the number of the mark groups is 7, and the exposure region 011 having the most alignment marks 0101 has four alignment marks 0101 .

[0106] Preferably, the alignment method further comprises step S4 (not shown in the figure), wherein step S4 comprises: dividing all the alignment points 0102 of the substrate 01 into a plurality of alignment point groups. Step S4 can be performed simultaneously with step S1.

[0107] The division principle of the alignment point group is the same as the division principle of the mark group, that is, if the mark group is divided according to the first principle in step S1, then the plurality of alignment points 0102 located on the same exposure area 011 are divided into the same alignment point group in step S4. If the mark group is divided according to the second principle in step S1, then the alignment points 0102 located at corresponding positions of at least two exposure areas 011 are divided into the same alignment point group in step S4. Figures 8 to 11 The alignment point 0102 of the same alignment point group and the alignment mark 0101 of a corresponding mark group are shown in the same color, Figures 8 to 11It can be seen that the number of alignment point groups is greater than or equal to the number of mark groups, specifically Figure 8 , Fig. 9 , Fig.11 The number of alignment point groups in is equal to the number of marking groups, and Fig.10 The number of the alignment point groups in is 8, and the alignment marks 0101 are not set at all the alignment points 0102 of the alignment point groups in the dotted box, resulting in the number of the mark point groups being 7, which is less than the number of the alignment point groups. Figures 8 to 11 It is also seen that each of the marking groups corresponds to one of the alignment point groups.

[0108] Each alignment point group includes a plurality of alignment points 0102, and the number of alignment points 0102 in each alignment point group is greater than or equal to the number of alignment marks in the corresponding mark group. The number and distribution of the alignment points 0102 in different alignment point groups are the same. Therefore, the preset rule in step S1 is that each alignment mark 0101 in the mark group is set at one alignment point 0102 in the corresponding alignment point group.

[0109] The number of the lenses 32 of the alignment device 30 is the same as the number of the alignment points 0102 of the alignment point group, so that all the lenses 32 of the alignment device 30 are used as the alignment lenses. Alternatively, the number of the lenses 32 of the alignment device 30 is greater than the number of the alignment points 0102 of the alignment point group, so that a part of the lenses 32 are used as the alignment lenses and the other part of the lenses 32 are idle. Regardless of whether the number of the lenses 32 of the alignment device 30 is greater than or equal to the number of the alignment points 0102 of the alignment point group, it is preferred that the number of the alignment lenses is equal to the number of the alignment points 0102 of the alignment point group.

[0110] The step S2 specifically includes: controlling the movement of at least part of the alignment lens so that the plurality of alignment lenses correspond one-to-one with the plurality of alignment points 0102 of the alignment point group, thereby achieving an effect that each alignment mark 0101 of any mark group can correspond to one alignment lens.

[0111] Fig.12 Shown in the principle of adopting a pair Figure 1 When the alignment mark 0101 of the substrate 01 is divided into mark groups, the distribution of the plurality of alignment lenses after the step S2 is completed is combined with Fig.12 and Figure 8 It can be seen that the plurality of alignment lenses correspond one-to-one to the plurality of alignment points 0102 of the alignment point group; Fig.13Shown using the principles of a pair Figure 4 When the alignment mark 0101 on the substrate 01 is divided into mark groups, the distribution of the plurality of alignment lenses after the step S2 is completed is compared with Fig.13 and Fig.11 It can also be seen that the multiple alignment lenses correspond one-to-one to the multiple alignment points 0102 of the alignment point group.

[0112] In the embodiment of the present invention, the step S2 may include the following steps S21 and S22.

[0113] The step S21 includes: obtaining the coordinates of a plurality of first target positions in the whole machine coordinate system according to the relative position relationship between the plurality of alignment points 0102 in the alignment point group and the coordinates of the preset reference position in the whole machine coordinate system. The number of the first target positions is one less than the number of the alignment points 0102 in the alignment point group.

[0114] It can be understood that the sum of the number of the reference positions and the first target positions is equal to the number of the alignment lenses. In this way, one reference position can be made to correspond to one alignment lens, and the reference position can be used as the desired position of the alignment lens corresponding to the reference position. Similarly, multiple first target positions can be made to correspond to the remaining alignment lenses one by one, and each first target position can be used as the desired position of the corresponding alignment lens.

[0115] Thus, the step S22 includes: corresponding the reference position, multiple first target positions and multiple alignment lenses one by one, and using the coordinates of the reference position in the whole machine coordinate system as the coordinates of the end point of the movement of the alignment lens corresponding to the reference position in the whole machine coordinate system, and using the coordinates of each of the first target positions in the whole machine coordinate system as the end point of the movement of the alignment lens corresponding to each of the first target positions to control the movement of each of the alignment lenses.

[0116] It should be understood that, since the number and arrangement of the alignment points 0102 in different alignment point groups are the same, the step S21 can be performed based on any one of the alignment point groups.

[0117] In addition, the whole machine coordinate system refers to the coordinate system of the exposure device, which is constructed by those skilled in the art in a conventional manner.

[0118] The reference position is predetermined, so its coordinates in the whole machine coordinate system are known quantities and are recorded as (WA1.x, WA1.y). The coordinates of any of the first target positions in the whole machine coordinate system are recorded as (WAj.x, WAj.y), where j is a positive integer greater than or equal to 2.

[0119] The reference position corresponds to one of the alignment lenses, and the plurality of the first target positions correspond one-to-one to the remaining plurality of the alignment lenses, and the plurality of the alignment lenses correspond one-to-one to the plurality of the alignment points 0102 of the alignment point group. Therefore, the reference position corresponds to one of the alignment points 0102 in the alignment point group, and the plurality of the first target positions correspond one-to-one to the remaining plurality of the alignment points 0102 of the alignment point group. The alignment point 0102 in the alignment point group corresponding to the reference position is called a reference alignment point, and the alignment point 0102 corresponding to the first target position is called a non-reference alignment point. The coordinates of the reference alignment point in the group coordinate system are recorded as (M1.x, M1.y), and the coordinates of any non-reference alignment point in the mark group coordinate system are recorded as (Mj.x, Mj.y). The mark group coordinate system is constructed by an operator or a control unit, and its origin can be at any suitable position on the substrate 01, for example, at the center point of the figure where the plurality of alignment points 0102 of the alignment point group are located. After constructing the marking group coordinate system, the coordinates (M1.x, M1.y) of the reference alignment point in the group coordinate system and the coordinates (Mj.x, Mj.y) of any non-reference alignment point in the marking group coordinate system can be obtained, that is, (M1.x, M1.y) and (Mj.x, Mj.y) are all known quantities.

[0120] When the reference alignment point coincides with the reference position, the coordinates of the non-reference alignment point in the whole machine coordinate system can be used as the coordinates of the corresponding first target position in the whole machine coordinate system. Therefore, WAj.x, WA1.x, M1.x, Maj.x satisfy the following formula (1):

[0121] WAj.x= WA1.x-M1.x+ Mj.x (1);

[0122] And, WAj.y, WA1.y, M1.y, Maj.y satisfy the following formula (2):

[0123] WAj.y= WA1.y-M1.y+ Mj.y (2).

[0124] Generally, if the alignment mark 0101 is provided at the alignment point 0102, the coordinates of the alignment mark 0101 in the group coordinate system are used as the corresponding coordinates of the reference point 0102 in the group coordinate system, that is, if the alignment mark 0101 is provided at the reference point, the coordinates of the alignment mark 0101 in the group coordinate system are used as the coordinates of the reference alignment point in the group coordinate system. The coordinates of the alignment mark 0101 in the group coordinate system can be obtained by any suitable method, such as measurement.

[0125] It is worth noting that, under the premise of satisfying the aforementioned "the number and arrangement of the alignment points 0102 on different exposure areas 0102 are the same. On the same exposure area 011, the number of the alignment points 0102 is greater than or equal to the number of the alignment marks 0101, and each alignment mark 0101 is located at one alignment point 0102", the number of the alignment points 0102 should be as small as possible. In this way, the number of the alignment lenses can be reduced, and the calculation amount of step S21 described later can also be reduced.

[0126] The alignment lens corresponding to the reference position among the plurality of alignment lenses is called a reference alignment lens, and the other alignment lenses are called non-reference alignment lenses. Therefore, each non-reference alignment lens corresponds to one first target position.

[0127] Therefore, the step S22 specifically includes: using (WA1.x, WA1.y) as the coordinates of the end point of the movement of the reference alignment lens in the coordinate system of the whole machine to control the movement of the reference alignment lens, and using (WAj.x, WAj.y) as the coordinates of the end point of the movement of the non-reference alignment lens in the coordinate system of the whole machine to control the movement of the non-reference alignment lens.

[0128] It should be understood that when any of the aiming lenses is exactly at the corresponding end point before executing step S22, the movement amount of the aiming lens in step S22 is zero, that is, there is no movement.

[0129] After the step S22 is completed, the arrangement of the multiple alignment lenses of the alignment device 30 is the same as the arrangement of the multiple alignment points 0102 of the alignment point group. In this way, the step S3 is actually to align the alignment points 0102 of the alignment point group corresponding to each mark group, and when aligning the alignment points 0102 of any alignment point group, each alignment lens is located above one alignment point 0102 of the corresponding alignment point group, thereby achieving the effect that each alignment mark 0101 of the mark group is located below the corresponding alignment lens.

[0130] Optionally, the step S3 includes: keeping the alignment device 30 stationary, and controlling the workpiece stage 20 to move, so as to align the alignment points 0102 of the alignment point groups corresponding to each of the mark groups, thereby aligning the alignment marks 0101 of each of the mark groups.

[0131] The alignment method may further include step S5, which includes: acquiring the coordinates of the second target position in the whole machine coordinate system based on the coordinates of the alignment mark 0101 of the mark group in the base coordinate system and the coordinates of the alignment lens corresponding to the alignment mark 0101 of the mark group in the whole machine coordinate system.

[0132] The second target position is the desired position of the work stage 20 when the alignment operation is performed on the alignment mark 0101 of each of the mark groups. Therefore, the number of executions of step S5 is the same as the number of the mark groups. Thus, the number of the second target positions finally obtained is the same as the number of the mark groups, and each of the second target positions corresponds to one of the mark groups, and when the work stage 20 moves and reaches one of the second target positions, the alignment device completes the alignment of the alignment mark 0101 of the mark group corresponding to the second target position.

[0133] It can be understood that step S5 is performed after step S2 and before step S3.

[0134] The step S5 may further include step S51, and may include step S52.

[0135] The step S51 includes: based on the coordinates of the alignment mark 0101 in the mark group in the base coordinate system and the coordinates of the alignment lens corresponding to the alignment mark 0101 in the mark group in the whole machine coordinate system, obtaining the coordinates of at least one nominal second target position in the whole machine coordinate system. The nominal second target position refers to the expected position of the workpiece stage 20 when any alignment mark 0101 in the mark group is aligned by the corresponding alignment lens, so for one mark group, the number of the corresponding nominal second target positions is the same as the number of the alignment marks 0101 in the mark group.

[0136] The base coordinate system is also constructed on the base 01 by an operator or a control unit, and its origin can be at any qualified position on the base 01, such as the center point of the base 01. From the perspective of convenient calculation, it is preferred that the x-axis of the base coordinate system is parallel to the x-axis of the marking group coordinate system, and the y-axis of the base coordinate system is parallel to the y-axis of the marking group coordinate system. It can be understood that after completing the marking group coordinate system and the base coordinate system, the coordinates of the origin of each marking group coordinate system in the base coordinate system can be obtained, and the coordinates of the origin of any marking group coordinate system in the base coordinate system are recorded as (Zp.x, Zp.y), and p is an integer greater than or equal to 1.

[0137] It is easy to understand that when the reference alignment point and the non-reference alignment point are not distinguished, the coordinates of the alignment point 0102 in the group coordinate system can be recorded as (Mi.x, Mi.y), where i is an integer greater than or equal to 1. Correspondingly, the coordinates of the alignment mark 0101 in the group coordinate system are (Mi.x, Mi.y). The coordinates of the alignment mark in the base coordinate system are recorded as (Mi.x, Mi.y). iorm .x,Mi iorm .y). In the same tag group, Mi iorm .x, Mi.x, and Zp.x satisfy the following formula (3):

[0138] Mi iorm .x= Mi.x+ Zp.x (3);

[0139] Mi iorm .y, Mi.y, Zp.y satisfy the following formula (4):

[0140] Mi iorm .y= Mi.y+ Zp.y (4).

[0141] It should be noted that the coordinates (Mi iorm .x,Mi iorm .y), the i corresponding to different alignment marks 0101 is different, but p is the same.

[0142] The coordinates of the nominal second target position in the whole machine coordinate system are marked as (Si imark-exp .x,Si imark-exp .y), the coordinates of the alignment lens in the whole machine coordinate system are marked as (WAi acc .x,WAi acc .y), Si imark-exp .x、Mi iorm .x、WAiacc .x satisfies the following formula (5):

[0143] Si imark-exp .x= Mi iorm .x-WAi acc .x (5);

[0144] Si imark-exp .y、Mi iorm .y、WAi acc .y satisfies the following formula (6):

[0145] Si imark-exp .y= Mi iorm .y-WAi acc .y (6).

[0146] When the number of the nominal second target position is one, the coordinate of the nominal second target position in the whole machine coordinate system is directly used as the position of the second target position in the whole machine coordinate system.

[0147] When there are multiple nominal second target positions, step S5 also includes step S52, which includes: obtaining an average value of the coordinates of the multiple nominal second target positions in the whole machine coordinate system as the coordinates of the second target position in the whole machine coordinate system.

[0148] Theoretically, when step S22 is completed, the coordinates of the reference alignment lens in the whole machine coordinate system are (WA1.x, WA1.y), and the coordinates of the non-reference alignment lens in the whole machine coordinate system are (WAj.x, WAj.y).

[0149] (WA1.x, WA1.y) is used as the nominal coordinates of the reference alignment lens in the whole machine coordinate system after the step S22 is completed, and (WAj.x, WAj.y) is used as the nominal coordinates of the non-reference alignment lens in the whole machine coordinate system after the step S22 is completed. It is easy to understand that when it is not distinguished whether the alignment lens is the reference alignment lens or the non-reference alignment lens, the nominal coordinates of the alignment lens in the whole machine coordinate system can be marked as (WAi.x, WAi.y). In this way, if the movement of the alignment lens is error-free, then WAi acc .x equals WAi.x, WAi acc .y is equal to WAi.y. If the movement of the alignment lens has an error, then WAi acc .x is not equal to WAi.x, WAi acc .y is not equal to WAi.y.

[0150] In view of this, the alignment method further includes step S6, which includes: correcting the nominal coordinates of each alignment lens in the whole machine coordinate system to obtain the coordinates of each alignment lens in the whole machine coordinate system. It is easy to understand that step S6 is performed after step S2 and before step S5.

[0151] For a specific example, please refer back to Figure 6 A reference mark 21 is fixedly set on the workpiece table 20, and the step S6 includes the following steps S61, S62, S63, and S64.

[0152] The step S61 includes: based on the nominal coordinates of each alignment lens in the whole machine coordinate system, the coordinates of the reference mark 21 in the workpiece stage coordinate system, and the coordinates of the initial position of the workpiece stage 20 in the whole machine coordinate system, obtaining the coordinates of multiple nominal positions of the workpiece stage 20 in the whole machine coordinate system. The nominal position of the workpiece stage 20 refers to the expected position of the workpiece stage 20 when the workpiece stage 20 moves to the nominal coordinate of one alignment lens in the whole machine coordinate system. Therefore, the number of the nominal positions of the workpiece stage 20 is equal to the number of the alignment lenses, and each nominal position corresponds to one alignment lens.

[0153] The coordinates of the reference mark 21 in the workpiece stage coordinate system are represented by (S fid .x, S fix .y), the coordinates of the nominal position of the workpiece stage 20 in the whole machine coordinate system are marked as (Si base-exp .x,Si base-exp .y), Si base-exp .x, S fid .x, WAi.x satisfy the following formula (7):

[0154] Si base-exp .x=S fid .x-Si -1 WAi.x (7);

[0155] Si base-exp .y、S fid .y, WAi.y satisfy the following formula (8):

[0156] Sj base-exp .y=S fid .y-Si -1 ·WAi.y (8);

[0157] In the formula, Si -1It is the inverse matrix of the rotation matrix of the workpiece stage 20 when the workpiece stage 20 moves from the initial position to the reference mark 21 and arrives at the nominal coordinates (WAi.x, WAi.y) corresponding to the alignment lens in the whole machine coordinate system. It is calculated according to the coordinates of the initial position of the workpiece stage 20 in the whole machine coordinate system and the nominal coordinates (WAi.x, WAi.y) of the alignment lens in the whole machine coordinate system. The specific calculation method is well known to those skilled in the art and will not be repeated here.

[0158] It can be understood that the workpiece stage coordinate system is established by an operator or a control unit according to a conventional method. After the workpiece stage coordinate system is established, the coordinates of the reference mark 21 in the workpiece stage coordinate system can be obtained.

[0159] The step S62 includes: controlling the workpiece stage 20 to move so that the reference mark 21 arrives at the optical axis of each alignment lens in sequence, and measuring the coordinates of the actual position of the workpiece stage 20 in the whole machine coordinate system when the reference mark 21 arrives at the optical axis of each alignment lens. The number of the actual positions is equal to the number of the alignment lenses, and each actual position corresponds to one alignment lens, so that each actual position corresponds to one nominal position.

[0160] The step S63 includes: obtaining an alignment deviation based on the coordinates of each actual position and the corresponding nominal position in the whole machine coordinate system. The number of executions of this step is the same as the number of the alignment lenses, and each execution obtains an alignment deviation, and each alignment deviation corresponds to one alignment lens.

[0161] The coordinates of the actual position of the workpiece stage 20 in the whole machine coordinate system are marked as (Si base-align .x,Si base-align .y). It should be understood that the alignment deviation includes an x-direction deviation in the x direction and a y-direction deviation in the y direction. The x-direction deviation is recorded as offseti.x, and the y-direction deviation is recorded as offseti.y. base-align .x、Si base- exp .x satisfies the following formula (9):

[0162] offseti.x= Si base-align .x-Si base-exp .x (9);

[0163] offseti.y、Si base-align .y、Si base-exp .y satisfies the following formula (10):

[0164] offseti.y= Si base-align .y-Si base-exp .y (10).

[0165] The step S64 includes: obtaining the actual coordinates of the corresponding alignment lens in the whole machine coordinate system based on each alignment deviation and the nominal coordinates of the corresponding alignment lens in the whole machine coordinate system. acc The relationship between .x, WAi.x, and offseti.x satisfies the following formula (11):

[0166] Wl acc .x=WAi.x-offseti.x (11),

[0167] Wl acc The relationship between .x, WAi.x, and offseti.x satisfies the following formula (12):

[0168] Wl acc .y=WAi.y-offseti.y (12).

[0169] After acquiring a plurality of the second target positions, the step S3 includes: controlling the workpiece stage to move and pass through each of the second target positions in sequence. When the workpiece stage 20 passes through any of the second target positions, the alignment device 30 completes the alignment of all the alignment marks 0101 of the mark group corresponding to the second target position.

[0170] Next, the principle is used in step S1 to Figure 1 The alignment method is further described by taking the alignment mark 0101 of the substrate 01 as an example of dividing the alignment mark groups. A person skilled in the art may modify the following description to adapt to the alignment method using the principle 2. Figure 1 The alignment marks 0101 of the substrate 01 shown in the figure are divided into mark groups, or any one of the first principle and the second principle is used to divide the alignment marks 0101 of the substrate 01 into mark groups. Figure 1 The alignment marks 0101 of the substrates 01 other than the substrate 01 shown are divided into mark groups.

[0171] After step S1 is completed, the obtained marker group is as follows Figure 8As shown, there is respectively a mark group one located in the exposure area 011 at the upper right corner of the substrate 01 (marked in green), a mark group two located in the exposure area 011 at the upper left corner of the substrate 01 (marked in red), a mark group three located in the exposure area 011 at the lower left corner of the substrate 01 (marked in bluish gray), and a mark group four located in the exposure area 011 at the lower right corner of the substrate 01 (marked in black).

[0172] Correspondingly, after the step S4 is completed, the obtained alignment point group is also as follows: Figure 8 As shown, there are respectively an alignment point group one located in the exposure area 011 at the upper right corner of the substrate 01 (marked in green), an alignment point group two located in the exposure area 011 at the upper left corner of the substrate 01 (marked in red), an alignment point group three located in the exposure area 011 at the lower left corner of the substrate 01 (marked in bluish gray), and an alignment point group four located in the exposure area 011 at the lower right corner of the substrate 01 (marked in black), and the alignment point group includes four alignment points 0102, one of which is the reference alignment point, and the other three are the non-reference alignment points. In addition, the number of the first target positions in step S21 is three, and the three first target positions are respectively the first target position b, the first target position c and the first target position d, wherein the coordinates of the first target position b in the whole machine coordinate system are (WA2.x, WA2.y), the coordinates of the first target position c in the whole machine coordinate system are (WA3.x, WA3.y), and the coordinates of the first target position d in the whole machine coordinate system are (WA4.x, WA4.y).

[0173] In this embodiment, the three non-reference alignment points are non-reference alignment point one, non-reference alignment point two, and non-reference alignment point three. The coordinates of the non-reference alignment point one in the mark group coordinate system are (M2.x, M2.y), the coordinates of the non-reference alignment point two in the mark group coordinate system are (M3.x, M3.y), and the coordinates of the non-reference alignment point three in the mark group coordinate system are (M4.x, M4.y).

[0174] In this embodiment, the alignment point 0102 located at the upper right corner of each exposure area 011 is called alignment point one, and is used as the reference alignment point. Therefore, the coordinates of the alignment point one in the corresponding group coordinate system are (M1.X, M1.y). The alignment point 0102 located at the upper left corner of each exposure area 011 is called alignment point two, and is used as the non-reference alignment point one. Therefore, the coordinates of the alignment point two in the corresponding group coordinate system are (M2.X, M2.y). The alignment point 0102 located at the lower left corner of each exposure area 011 is called alignment point three, and is used as the non-reference alignment point two. Therefore, the coordinates of the alignment point three in the corresponding group coordinate system are (M3.X, M3.y). The alignment point 0102 located at the lower right corner of each exposure area 011 is called alignment point four, and is used as the non-reference alignment point three. Therefore, the coordinates of the alignment point four in the corresponding group coordinate system are (M4.X, M4.y).

[0175] When the reference position corresponds to the alignment point 1, the first target position a corresponds to the alignment point 2, the first target position b corresponds to the alignment point 3, and the first target position d corresponds to the alignment point 4, the following equations can be obtained by combining equations (1) and (2):

[0176] (WA2.x, WA2.y)=(WA1.x-M1.x+M2.x, WA1.y-M1.y+M2.y),

[0177] (WA3.x, WA3.y)=(WA1.x-M1.x+M3.x, WA1.y-M1.y+M3.y),

[0178] (WA4.x, WA4.y)=(WA1.x-M1.x+M4.x, WA1.y-M1.y+M4.y).

[0179] It should be noted that if step S21 is performed based on the alignment point group one, since the alignment mark 0101 is set at each alignment point 0102 of the alignment point group, the positions of the four alignment marks 0101 in the corresponding mark group coordinate system can be directly used as the positions of the four alignment points 0102 in the mark group coordinate system. If step S21 is performed based on any other alignment point group, the alignment mark 0101 is not set at one of the alignment points, which is not convenient for direct measurement, then the coordinates of the alignment point one in the group coordinate system can be obtained based on the coordinates of the alignment mark 0101 at at least one of the other alignment points 0102 in the group coordinate system, and the relative position relationship between each alignment point. For example, when the origin of the group coordinate system is at the center point of the rectangle where the alignment point group is located, the coordinates of the alignment point one in the group coordinate system can be obtained based on formula (13) and formula (14), and formula (13) is:

[0180] M1.x=-(M2.x+M3.x+M4.x) (13);

[0181] Formula (14) is:

[0182] M1.y=-(M2.y+M3.y+M4.y) (14).

[0183] Of course, the coordinates of the alignment point one in the group coordinate system can also be calculated directly based on the coordinates of any one of the alignment marks 0101 in the group coordinate system and the distance between the alignment point 0102 where the corresponding alignment mark 0101 is located and the alignment point one.

[0184] Easy to understand, for Figure 8 The number of the aiming lenses is also four, namely aiming lens one, aiming lens two, aiming lens three and aiming lens four.

[0185] When the alignment lens 1 corresponds to the reference position, the alignment lens 2 corresponds to the first target position b, the alignment lens 3 corresponds to the first target position c, and the alignment lens 4 corresponds to the first target position d, the step S22 includes: using (WA1.x, WA1.y) as the coordinate of the end point of the movement of the alignment lens 1 in the whole machine coordinate system to control the movement of the alignment lens 1, using (WA2.x, WA2.y) (i.e. (WA1.x-M1.x+M2.x, WA1.y-M1.y+M2.y)) as the coordinate of the end point of the movement of the alignment lens 2 in the whole machine coordinate system to control the movement of the alignment lens 2, and using (WA3.x, WA3.y) (i.e. (WA1.x-M1.x+M3.x, WA1.y-M1.y+

[0186] M3.y)) as the coordinate of the end point of the third movement of the aiming lens in the coordinate system of the whole machine to control the third movement of the aiming lens, and (WA4.x, WA4.y) (i.e. (WA1.x-M1.x+M4.x, WA1.y-M1.y+M4.y)) as the coordinate of the end point of the fourth movement of the aiming lens in the coordinate system of the whole machine to control the fourth movement of the aiming lens.

[0187] After the step S6 is completed, the coordinates of the alignment lens 1 in the whole machine coordinate system are (WA1 acc .x, WA1 acc .y), the coordinate of the second alignment lens in the whole machine coordinate system is (WA2 acc .x, WA2 acc .y), the coordinates of the alignment lens 3 in the whole machine coordinate system are (WA3 acc .x, WA3 acc .y), the coordinates of the alignment lens 4 in the whole machine coordinate system are (WA4 acc .x, WA4 acc .y).

[0188] Combining the above formulas (7) to (12), we can obtain:

[0189] (WA1 acc .x, WA1 acc .y)=(WA1.x-S1 base-align .x+S fid .x-S1 -1 WA1.x, WA1.y-S1 base-

[0190] align .y+S fid .y-S1 -1 WA1.y),

[0191] (WA2 acc .x, WA2 acc .y)=(WA2.x-S2 base-align .x+S fid .x-S2 -1 WA2.x, WA2.y-S2 base-

[0192] align .y+S fid .y-S2 -1 WA2.y),

[0193] (WA3 acc .x, WA3 acc.y)=(WA3.x-S3 base-align .x+S fid .x-S3 -1 WA3.x, WA3.y-S3 base-

[0194] align .y+S fid .y-S3 -1 WA3.y),

[0195] (WA4 acc .x, WA4 acc .y)=(WA4.x-S4 base-align .x+S fid .x-S4 -1 WA4.x, WA4.y-S4 base-

[0196] align .y+S fid .y-S4 -1 ·WA4.y).

[0197] The step S5 is executed four times, that is, the step S5 is executed once for the mark group one, once for the mark group two, once for the mark group three, and once for the mark group four.

[0198] The mark group one includes four alignment marks 0101. When the step S51 is performed on the mark group one, four nominal second target positions are obtained, namely nominal second target position one, nominal second target position two, nominal second target position three and nominal second target position four.

[0199] It is easy to understand that the coordinates of the four alignment marks 0101 of the mark group 1 in the group coordinate system of the mark group 1 are (M1.x, M1.y), (M2.x, M2.y), (M3.x, M3.y), and (M4.x, M4.y). The coordinates of the nominal second target position 1 in the whole machine coordinate system are marked as (S1 imark-exp .x, S1 imark-exp .y), the coordinates of the nominal second target position 2 in the whole machine coordinate system are marked as (S2 imark-exp .x, S2 imark-exp .y), the coordinates of the nominal second target position three in the whole machine coordinate system are marked as (S3 imark-exp .x, S3 imark-exp .y), the coordinates of the nominal second target position four in the whole machine coordinate system are marked as (S4 imark-exp.x, S4 imark-exp .y).

[0200] In step S51, by combining equation (3), equation (4), equation (5) and equation (6), we can obtain:

[0201] (S1 mark-exp .x, S1 mark-exp .y)=(M1.x+Z1.x-WA1 acc .x,M1.y+Z1.y-WA1 acc .y),

[0202] (S2 mark-exp .x, S2 mark-exp .y)=(M2.x+Z1.x-WA2 acc .x,M2.y+Z1.y-WA2 acc .y),

[0203] (S3 mark-exp .x, S3 mark-exp .y)=(M3.x+Z1.x-WA1 acc .x,M3.y+Z1.y-WA3 acc .y),

[0204] (S4 mark-exp .x, S4 mark-exp .y)=(M4.x+Z1.x-WA4 acc .x,M4.y+Z1.y-WA4 acc .y).

[0205] Then take the (WA1 obtained in the previous article as acc .x, WA1 acc .y)、(WA2 acc .x, WA2 acc .y)、(WA3 acc .x, WA3 acc .y)、(WA4 acc .x, WA4 acc .y)、(WA2.x,WA2.y)、(WA3.x,WA3.y)、(WA4.x,WA4.y) to get (S1 mark-exp .x, S1 mark-exp .y)、(S2 mark-exp .x, S2 mark-exp .y)、(S3 mark-exp .x, S3 mark-exp .y)、(S4 mark-exp .x, S4 mark-exp .y).

[0206] The coordinates of the second target position corresponding to the marking group 1 in the whole machine coordinate system are marked as (S01 mark-exp .x,S01 mark-exp .y), executing step S52 can obtain:

[0207] S01 mark-exp .x=(S1 imark-exp .x+S2 imark-exp .x+S3 imark-exp .x+S4 imark-exp .x) / 4,

[0208] S01 mark-exp .y=(S1 imark-exp .y+S2 imark-exp .y+S3 imark-exp .y+S4 imark-exp .y) / 4.

[0209] The mark group two includes three alignment marks 0101 respectively arranged at the alignment point two, the alignment point three, and the alignment point four. Therefore, when the step S5 is executed for the mark group two, three nominal second target positions are obtained, namely, the nominal second target position two, the nominal second target position three, and the nominal second target position four.

[0210] The coordinates of the three alignment marks 0101 of the mark group 2 are (M2.x, M2.y), (M3.x, M3.y), and (M4.x, M4.y). The coordinates of the nominal second target position 2 in the whole machine coordinate system are marked as

[0211] (S2 imark-exp .x, S2 imark-exp .y), the coordinates of the nominal second target position three in the whole machine coordinate system are marked as (S3 imark-exp .x, S3 imark-exp .y), the coordinates of the nominal second target position four in the whole machine coordinate system are marked as (S4 imark-exp .x, S4 imark-exp .y).

[0212] In step S51, firstly, by combining equation (3), equation (4), equation (5) and equation (6), we can obtain:

[0213] (S2 mark-exp .x, S2 mark-exp .y)=(M2.x+Z2.x-WA2 acc .x,M2.y+Z2.y-WA2 acc .y),

[0214] (S3 mark-exp.x, S3 mark-exp .y)=(M3.x+Z2.x-WA1 acc .x, M3.y+Z2.y-WA3 acc .y),

[0215] (S4 mark-exp .x, S4 mark-exp .y)=(M4.x+Z2.x-WA4 acc .x, M4.y+Z2.y-WA4 acc .y).

[0216] Then take the (WA3 acc .x, WA3 acc .y)、(WA3 acc .x, WA3 acc .y)、(WA4 acc .x, WA4 acc .y), (WA2.x, WA2.y), (WA3.x, WA3.y), (WA4.x, WA4.y) can be substituted to obtain (S2 mark-exp .x, S2 mark-exp .y)、(S3 mark-exp .x, S3 mark-exp .y)、(S4 mark-exp .x, S4 mark-exp .y).

[0217] The coordinates of the second target position corresponding to the marking group 2 in the whole machine coordinate system are marked as (S02 mark-exp .x,S02 mark-exp .y), executing step S52 can obtain:

[0218] S02 mark-exp .x=(S2 imark-exp .x+S3 imark-exp .x+S4 imark-exp .x) / 3,

[0219] S02 mark-exp .y=(S2 imark-exp .y+S3 imark-exp .y+S4 imark-exp .y) / 3.

[0220] The mark group three and the mark group four are the same as the mark group two. The operation of executing step S5 for the mark group three and the mark group four to obtain the corresponding second target position is basically the same as the process of executing step S5 for the mark group two. The only difference is that for the mark group three, (Zp.x, Zp.y) is (Z3.x, Z3.y), and for the mark group four, (Zp.x, Zp.y) is (Z4.x, Z4.y).

[0221] The step S3 includes: controlling the workpiece stage 20 to move to the second target position corresponding to the mark group one to complete the alignment of the alignment mark 0101 of the mark group one, controlling the workpiece stage 20 to move to the second target position corresponding to the mark group two to complete the alignment of the alignment mark 0101 of the mark group two, controlling the workpiece stage 20 to move to the second target position corresponding to the mark group three to complete the alignment of the alignment mark 0101 of the mark group three, and controlling the workpiece stage 20 to move to the second target position corresponding to the mark group four to complete the alignment of the alignment mark 0101 of the mark group four.

[0222] It should be noted that, in other examples, the driving mechanism can also drive the lens 32 to move in the vertical direction. In this way, the alignment method also includes step S7 performed as needed, and the step S7 includes: controlling the alignment lens to move in the vertical direction so that the alignment lens can focus on the substrate 01. In this way, the alignment lens can obtain the clearest image of the alignment mark 0101 when aligning the alignment mark 0101 of the mark group. The step S7 can be performed at any appropriate time before the step S3, or can be performed during the step S3, and the embodiment of the present invention does not limit this.

[0223] In addition, the above description is based on the example that the number of the alignment lenses is equal to the number of the alignment points 0102 of the alignment point group, but in practice, the number of the alignment lenses may be less than the number of the alignment points 0102 of the alignment point group. In this way, when executing step S3, when the workpiece stage 20 moves to reach the second target position, the alignment device may simultaneously complete the alignment of all the alignment marks 0101 of the corresponding mark group, or may only complete the alignment of part of the alignment marks 0101 of the corresponding mark group. However, compared with the prior art, this method can still improve the alignment efficiency of all the alignment marks 0101 of the substrate 01 to a certain extent, thereby improving the production capacity of the exposure equipment.

[0224] In addition, although the alignment method is applied to an exposure device as an example in the above description, in practice, the alignment method can also be applied to other semiconductor devices involving alignment operations on the alignment mark 0101 on the substrate 01, such as detection equipment, which can also have the effect of improving production capacity.

[0225] Furthermore, an embodiment of the present invention also provides a semiconductor production equipment, which includes an alignment device, a workpiece stage and a control unit. The alignment device includes a plurality of lenses, and at least some of the lenses are alignment lenses. The workpiece stage is used to carry a substrate. The control unit is communicatively connected to the alignment device and the workpiece stage, and is configured to perform the alignment method as described above.

[0226] An embodiment of the present invention further provides a computer-readable storage medium, on which a program is stored. When the program is executed, the alignment method as described above is executed.

[0227] Although the present invention is disclosed as above, it is not limited thereto. Those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. An alignment method, characterized in that: include: Dividing the plurality of alignment marks on the substrate into a plurality of mark groups, each of the mark groups comprising at least one alignment mark, and the alignment marks of each of the mark groups are arranged according to a preset rule; Controlling at least part of the alignment lenses of the alignment device to move so that each alignment mark of any one of the mark groups can correspond to one alignment lens; as well as, Control the movement of the alignment device and / or the workpiece stage carrying the substrate so that the alignment device aligns the alignment marks of each mark group in turn; when aligning the alignment marks of any mark group, each alignment mark of the corresponding mark group is located below the corresponding alignment lens.

2. The alignment method according to claim 1, characterized in that: The substrate comprises a plurality of exposure areas, and each of the exposure areas is provided with a plurality of alignment marks; Each of the exposure areas has multiple alignment points; the number and arrangement of the alignment points on different exposure areas are the same; on the same exposure area, the number of the alignment points is greater than or equal to the number of the alignment marks, and each alignment mark is located at one of the alignment points.

3. The alignment method according to claim 2, characterized in that: The step of dividing the plurality of alignment marks on the substrate into a plurality of mark groups comprises: Divide the plurality of alignment marks in the same exposure area into the same mark group; or, The alignment marks at the corresponding alignment points of at least two different exposure areas are divided into the same mark group.

4. The alignment method according to claim 2, characterized in that: The alignment method further comprises: Divide all the alignment points into a plurality of alignment point groups, and make each of the marking groups correspond to one of the alignment point groups; the number of the alignment point groups is greater than or equal to the number of the marking groups, each of the alignment point groups includes a plurality of alignment points, and the number and arrangement of the alignment points of different alignment point groups are the same; The preset rule is that each alignment mark of the mark group is arranged at an alignment point of the corresponding alignment point group.

5. The alignment method according to claim 4, characterized in that: The number of the alignment lenses is the same as the number of the alignment points of the alignment point group; The step of controlling at least part of the alignment lenses of the alignment device to move so that each alignment mark of any one of the mark groups can correspond to one alignment lens comprises: At least part of the alignment lenses of the alignment device are controlled to move so that the plurality of alignment lenses correspond one-to-one to the plurality of alignment points of the alignment point group.

6. The alignment method according to claim 5, characterized in that: The step of controlling at least part of the alignment lenses to move so that the plurality of alignment lenses correspond one-to-one to the plurality of alignment points of the alignment point group comprises: According to the relative position relationship between the plurality of alignment points of the alignment point group and the coordinates of the preset reference position in the whole machine coordinate system, the coordinates of a plurality of first target positions in the whole machine coordinate system are acquired; the number of the first target positions is less than the number of the alignment points of the alignment point group by 1; The reference position, multiple first target positions and multiple alignment lenses are matched one by one, and the coordinates of the reference position and each of the first target positions in the whole machine coordinate system are used as the coordinates of the end points of the corresponding alignment lens movement in the whole machine coordinate system to control the corresponding alignment lens movement.

7. The alignment method according to claim 6, characterized in that: The alignment method further comprises the following steps performed for each of the marking groups: Based on the coordinates of the alignment marks of the mark group in the base coordinate system and the coordinates of the alignment lens corresponding to the alignment marks of the mark group in the whole machine coordinate system, acquiring the coordinates of the second target position in the whole machine coordinate system; The coordinates of the alignment lens corresponding to the reference position in the whole machine coordinate system are related to the position of the reference position in the whole machine coordinate system, and the coordinates of the alignment lens corresponding to the first target position in the whole machine coordinate system are related to the coordinates of the corresponding first target position in the whole machine coordinate system; The step of controlling the movement of the alignment device and / or the workpiece stage carrying the substrate so that the alignment device sequentially aligns the alignment marks of each of the mark groups comprises: The workpiece stage is controlled to move so that the workpiece stage reaches each of the second target positions in sequence.

8. The alignment method according to claim 6, characterized in that: The reference position, the plurality of the first target positions and the plurality of the alignment points correspond one to one; The coordinates of the reference position in the whole machine coordinate system are (WA1.x, WA1.y), and the coordinates of the first target position in the whole machine coordinate system are (WAj.x, WAj.y); the coordinates of the alignment point corresponding to the reference position in the mark group coordinate system are (M1.x, M1.y), and the coordinates of the alignment point corresponding to any of the first target positions in the mark group coordinate system are (Mj.x, Mj.y), where j is an integer greater than or equal to 2; wherein: WAj.x=WA1.x-(M1.x-Mj.x), WAj.y=WA1.y-(M1.y-Mj.y).

9. The alignment method according to claim 7, characterized in that: Taking the coordinates of the reference position in the whole machine coordinate system as the nominal coordinates of the alignment lens corresponding to the reference position in the whole machine coordinate system, and taking the coordinates of each of the first target positions in the whole machine coordinate system as the nominal coordinates of a corresponding alignment lens in the whole machine coordinate system; The alignment method further comprises: The nominal coordinates of each alignment lens in the whole machine coordinate system are corrected to obtain the coordinates of each alignment lens in the whole machine coordinate system.

10. The alignment method according to claim 9, characterized in that: The step of correcting the nominal coordinates of each alignment lens in the whole machine coordinate system comprises: Based on the nominal coordinates of each alignment lens in the whole machine coordinate system, the coordinates of the reference mark on the workpiece stage in the workpiece stage coordinate system, and the coordinates of the initial position of the workpiece stage in the whole machine coordinate system, the coordinates of multiple nominal positions of the workpiece stage in the whole machine coordinate system are obtained; Controlling the movement of the workpiece stage so that the reference mark arrives at the optical axis of each alignment lens in sequence, and obtaining the coordinates of multiple actual positions of the workpiece stage when the reference mark arrives at the optical axis of each alignment lens in the whole machine coordinate system; the multiple actual positions, the multiple nominal positions, and the multiple alignment lenses correspond one to one; Based on the coordinates of each actual position and the corresponding nominal position in the whole machine coordinate system, an alignment deviation is obtained, each alignment deviation corresponds to one alignment lens; Based on each alignment deviation and the nominal coordinates of the corresponding alignment lens in the whole machine coordinate system, the coordinates of the corresponding alignment lens in the whole machine coordinate system are obtained.

11. The alignment method according to claim 10, characterized in that: The nominal coordinates of the alignment lens in the whole machine coordinate system are (WAi.x, WAi.y), and the coordinates of the reference mark in the workpiece stage coordinate system are (S fid .x, S fix .y), the nominal position of the workpiece table in the whole machine coordinate system is (Si base-exp .x,Si base-exp .y), i is an integer greater than or equal to 1; where: Si base-exp .x=S fid .x-Si -1 ·WAi.x, Sj base-exp .y=S fid .and if -1 ·WAi.y; Si -1 It is the inverse matrix of the rotation matrix of the workpiece stage when the workpiece stage moves from the initial position to the reference mark arriving at the nominal coordinates corresponding to the alignment lens in the whole machine coordinate system. It is obtained according to the coordinates of the initial position of the workpiece stage in the whole machine coordinate system and the nominal coordinates of the alignment lens in the whole machine coordinate system.

12. The alignment method according to claim 7, characterized in that: The step of acquiring the coordinates of the plurality of second target positions in the whole machine coordinate system based on the coordinates of the plurality of alignment lenses in the whole machine coordinate system and the coordinates of the plurality of alignment marks in the mark group in the base coordinate system comprises: Based on the coordinates of the alignment marks in the mark group in the base coordinate system and the coordinates of the alignment lens corresponding to the alignment marks in the mark group in the whole machine coordinate system, the coordinates of at least one nominal second target position in the whole machine coordinate system are obtained; the number of the nominal second target positions is the same as the number of the alignment marks in the mark group; When the number of the nominal second target positions is one, the coordinates of the nominal second target position in the whole machine coordinate system are used as the coordinates of the second target position; when the number of the nominal second target positions is multiple, the average value of the coordinates of the multiple nominal second target positions in the whole machine coordinate system is obtained as the coordinates of the second target position in the whole machine coordinate system.

13. The alignment method according to claim 12, characterized in that: The x-axis of the marking group coordinate system is parallel to the x-axis of the base coordinate system, and the y-axis of the marking group coordinate system is parallel to the y-axis of the base coordinate system; The coordinates of the alignment mark in any of the mark groups in the corresponding mark group coordinate system are (Mi.x, Mi.y), the coordinates of the origin of the corresponding mark group coordinate system in the base coordinate system are (Zp.x, Zp.y), p is an integer greater than or equal to 1, and the coordinates of the alignment mark in the base coordinate system are (Mi.x, Mi.y). iorm .x,Mi iorm .y), Mi iorm .x, Mi.x, and Zp.x satisfy the following relationship: My iorm .x=Mi.x+Zp.x, Mi iorm .y, Mi.y, and Zp.y satisfy the following relationship: My iorm .y=Mi.y+Zp.y; The coordinates of the alignment lens in the whole machine coordinate system are (WAi acc .x,WAi acc .y), the corresponding coordinates of the nominal second target position in the whole machine coordinate system are (Si imark-exp .x,Si imark-exp .y), Si imark-exp .x、Mi iorm .x、WAi acc .x satisfies: Si imark-exp .x=Mi iorm .x-WAi acc .x; Si imark-exp .y、Mi iorm .y、Wi acc .y satisfies: Yeah imark-exp .and=My iorm .y-WAi acc .and.

14. A semiconductor production equipment, characterized in that: include: An alignment device, comprising a plurality of lenses, at least some of the lenses being alignment lenses; Workpiece table; as well as, A control unit is communicatively connected to the alignment device and the workpiece stage, and is configured to execute the alignment method as described in any one of claims 1-13.

15. The semiconductor production equipment according to claim 14, characterized in that: The semiconductor production equipment includes exposure equipment or testing equipment.

16. A computer-readable storage medium having a program stored thereon, characterized in that: When the program is executed, the alignment method according to any one of claims 1 to 13 is performed.

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