Self-adaptive high-precision line repairing method and device

Abstract

A self-adaptive high-precision line repairing method comprises the following steps that S1, a detected sample is irradiated through a light source, and a CCD high-resolution camera collects image data to detect defects existing in a line; s2, analyzing the collected defect image data through an image analysis device to obtain a repair path of the nozzle, and calculating an operation parameter of the self-adaptively changed nozzle by using an empirical formula; s3, ablating the target electrode through an electric spark ablating device to prepare nano metal particles; s4, the flow rate of inert gas is adjusted through a carrier gas flow rate control device, and the nano-metal particles are conveyed into a nano-particle printing and sintering device; s5, printing the metal nanoparticles to the line defect position through a dry aerosol printing nozzle, and realizing the complete repair of the line through the movement of the nozzle and the assistance of a movable platform below the substrate; and S6, a pressurizing pump and a heating assembly are started to pressurize and heat the metal nanoparticles on the substrate in the sintering cavity. According to the scheme, the processing efficiency of line repair is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of line detection and repair, and in particular to an adaptive high-precision line repair method and device. Background Art

[0002] As the requirements for lightweight and flexibility in electronic products continue to increase, the size of chips in the electronic packaging industry continues to shrink. The reliability of chips during the packaging process and the need to repair fine circuits have become an increasingly urgent problem that needs to be solved. Chip circuits may be damaged or worn during the packaging process, which will reduce the service life of the chip and even directly lead to circuit failure. Therefore, many researchers are currently trying to achieve circuit repair for fine circuits on chips in various aspects. However, the current mainstream circuit repair methods either have insufficient accuracy and cannot achieve high-precision circuit repair, or have problems such as long circuit repair time, low efficiency, and the need to manufacture mask templates during circuit repair, which increases the cost of circuit repair. In response to a series of problems in the current mainstream circuit repair methods in chip packaging, a high-precision and high-efficiency circuit repair method has become the research focus of current researchers. Summary of the invention

[0003] The purpose of the present invention is to provide an adaptive high-precision line repair method.

[0004] The purpose of the present invention is to provide an adaptive high-precision line repair device.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] An adaptive high-precision line repair method comprises the following steps:

[0007] S1. The sample to be tested is illuminated by a light source, and a CCD high-resolution camera collects image data to detect defects in the circuit;

[0008] S2, analyzing the collected defect image data through an image analysis device to obtain a repair path for the nozzle, and using an empirical formula to calculate and adaptively change the operating parameters of the nozzle;

[0009] S3, preparing nano-metal particles by ablating the target electrode through an electric spark ablation device;

[0010] S4, using a carrier gas flow rate control device to adjust the inert gas flow rate to deliver the nano metal particles to the nano particle printing and sintering device;

[0011] S5, printing metal nanoparticles to the defective position of the circuit through a dry aerosol printing nozzle, and achieving complete repair of the circuit with the assistance of nozzle movement and a movable platform under the substrate;

[0012] S6, turning on the pressure pump and the heating assembly to achieve pressurized heating and sintering of the metal nanoparticles on the substrate in the chamber.

[0013] Preferably, the optical detection device comprises a CCD high-resolution camera and a light source;

[0014] The light source is used to irradiate light onto the surface of the object to be measured, and the CCD high-resolution camera collects the surface morphology and light changes of the object to be measured under the irradiation of the light source, and transmits the collected image data to the image analysis device.

[0015] Preferably, the image analysis device analyzes the defect morphology parameters of the circuit to establish a relative coordinate system to obtain the running trajectory of the nozzle, and adaptively changes the running parameters of the nozzle by applying empirical formulas to the defect morphology parameters to ensure good efficiency and quality of circuit repair;

[0016] The operating parameters of the nozzle satisfy the following relationship:

[0017] T is the time required to repair the defect, w is the width of the defect, l is the length of the defect, t is the time required for the nozzle to deposit 1um thick nanometal particles, d is the diameter of the nozzle orifice, and ν is the moving speed of the nozzle;

[0018] When repairing the line, the size and depth of the line defect and the time required for line repair can be analyzed and judged to adaptively change the movement speed of the nozzle. When the defect is deep, multiple fillings can be performed to ensure the efficiency and quality of line repair.

[0019] Preferably, the electric spark ablation device comprises two target electrodes, an ablation reaction container, a high-voltage electrostatic output device, and an air pipe connection port;

[0020] The two target electrodes are placed opposite to each other in the ablation reaction container, the two electrodes are respectively connected to the high-voltage electrostatic output device, and the ablation reaction container is connected to the inert gas source and the nanoparticle printing and sintering device for ventilation through the air pipe connection port and the connecting air pipe;

[0021] The voltage adjustment range of the high-voltage electrostatic output device is 0-13.6kV, the current adjustment range is 0-15.6mA, the particle size of the prepared fine-diameter nano-metal particles is 5-10nm, and the nano-metal particles prepared by the two target electrodes can be any one of copper, tin, silver, gold, aluminum, copper-tin alloy, copper-tungsten alloy, copper-titanium alloy or copper-chromium alloy.

[0022] Furthermore, the inert gas in the inert gas is any one of helium, nitrogen and argon, and the gas flow rate controlled by the carrier gas flow rate controller is 0-1.6 m / s.

[0023] Further, the nanoparticle printing device comprises a dry aerosol printing nozzle, a movable platform and a pressurized sintering chamber;

[0024] The movable platform is placed in the pressurized sintering chamber, and the circuit substrate is placed and fixed on the movable platform; the dry aerosol printing nozzle is connected to the connecting air pipe, and the pressurizing pump is connected to the pressurized sintering chamber externally.

[0025] Furthermore, the diameter of the dry aerosol printing nozzle is 0.01um-10um, the width of the repaired line is 0.1um-80um, and the bonding force between the nano-metal particles and the substrate after sintering is 20N / mm 2 -40N / mm 2 .

[0026] Furthermore, the pressurized sintering chamber includes a pressurized chamber, a pressurized pump, and a sensor;

[0027] The pressure pump is connected to the air inlet of the pressure chamber, and the pressure pump introduces inert gas to realize pressurized heating and sintering of the nano metal particles on the circuit; the sensor is used to detect the air pressure inside the pressure chamber; after the sintering work is completed, the gas is discharged through the exhaust port of the pressure chamber, and the operating pressure inside the pressure chamber is 0-20MPa.

[0028] Furthermore, the movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component;

[0029] The substrate fixing assembly is used to fix the circuit substrate on the movable platform so that the substrate can move together with the movable platform to complete the circuit repair; the heating and sintering assembly is used to heat from below to achieve the sintering of nano-metal particles on the circuit; the three-coordinate system moving assembly can realize the free movement of the movable platform to meet the complex movement required during circuit repair.

[0030] An adaptive high-precision circuit repair device, comprising an optical detection device, a collection and analysis device, an electric spark ablation device, a carrier gas flow rate control device, a dry aerosol printing nozzle, a pressurized sintering chamber and a movable platform;

[0031] The pressurized sintering chamber comprises an air pressure sensor, a pressurized chamber and a pressurized pump, wherein the pressurized pump is connected to the air inlet of the pressurized chamber, and the air pressure sensor is installed in the pressurized chamber;

[0032] The optical detection device comprises a CCD high-resolution camera and a light source, wherein the CCD high-resolution camera is installed in the pressurized chamber, the light source is installed around the CCD high-resolution camera, and the CCD high-resolution camera is connected to the collection and analysis device;

[0033] The movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component; the Z axis of the three-coordinate system moving component is installed with the heating and sintering component, the substrate fixing component is installed above the heating and sintering component, and the CCD high-resolution camera of the heating component faces the substrate fixing component;

[0034] The carrier gas flow rate control device comprises a flow rate control device and an inert gas source. The electric spark sintering device is connected to the dry aerosol printing nozzle through an air pipe. The dry aerosol printing nozzle is located in the pressurized sintering chamber and the dry aerosol printing nozzle is located above the movable platform. The inert gas source is connected to the upstream of the air pipe, and a flow rate control device is provided between the inert gas source and the electric spark sintering device.

[0035] One of the above technical solutions includes the following beneficial effects: the adaptive high-precision line repair method and device of the present invention is different from the current mainstream line repair, and can achieve high-precision line repair by using fine-diameter nano-metal particles and fine-caliber nozzles prepared by electric spark ablation. At the same time, in the added detection and analysis device, the empirical formula in this patent is used to realize adaptive change of the operating parameters of the nozzle to ensure the efficiency and quality of line repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Flow chart of the work process of detecting line defects and realizing line repair in the present invention

[0037] Figure 2 It is the overall structure diagram of the device of the present invention. DETAILED DESCRIPTION

[0038] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0039] like Figure 1-2 As shown, an adaptive high-precision line repair method includes the following steps:

[0040] S1. The sample to be tested is illuminated by a light source, and a CCD high-resolution camera collects image data to detect defects in the circuit;

[0041] S2, analyzing the collected defect image data through an image analysis device to obtain a repair path for the nozzle, and using an empirical formula to calculate and adaptively change the operating parameters of the nozzle;

[0042] S3, preparing nano-metal particles by ablating the target electrode through an electric spark ablation device;

[0043] S4, using a carrier gas flow rate control device to adjust the inert gas flow rate to deliver the nano metal particles to the nano particle printing and sintering device;

[0044] S5, printing metal nanoparticles to the defective position of the circuit through a dry aerosol printing nozzle, and achieving complete repair of the circuit with the assistance of nozzle movement and a movable platform under the substrate;

[0045] S6, turning on the pressure pump and the heating assembly to achieve pressurized heating and sintering of the metal nanoparticles on the substrate in the chamber.

[0046] The adaptive high-precision line repair method and device of the present invention are different from the current mainstream line repair. The fine-diameter nano-metal particles prepared by electric spark ablation and the fine-caliber nozzle can achieve high-precision line repair. At the same time, in the added detection and analysis device, the empirical formula in this patent is used to realize adaptive change of the operating parameters of the nozzle to ensure the efficiency and quality of the line repair.

[0047] Wherein, the optical detection device includes a CCD high-resolution camera and a light source;

[0048] The light source is used to irradiate light onto the surface of the object to be measured, and the CCD high-resolution camera collects the surface morphology and light changes of the object to be measured under the irradiation of the light source, and transmits the collected image data to the image analysis device.

[0049] The image analysis device analyzes the defect morphology parameters of the circuit to establish a relative coordinate system to obtain the running trajectory of the nozzle, and adaptively changes the running parameters of the nozzle by applying empirical formulas to the defect morphology parameters to ensure good efficiency and quality of circuit repair;

[0050] The operating parameters of the nozzle satisfy the following relationship:

[0051] T is the time required to repair the defect, w is the width of the defect, l is the length of the defect, t is the time required for the nozzle to deposit 1um thick nanometal particles, d is the diameter of the nozzle orifice, and ν is the moving speed of the nozzle;

[0052] When repairing the line, the size and depth of the line defect and the time required for line repair can be analyzed and judged to adaptively change the movement speed of the nozzle. When the defect is deep, multiple fillings can be performed to ensure the efficiency and quality of line repair.

[0053] The electric spark ablation device includes two target electrodes, an ablation reaction container, a high-voltage electrostatic output device, and an air pipe connection port;

[0054] The two target electrodes are placed opposite to each other in the ablation reaction container, the two electrodes are respectively connected to the high-voltage electrostatic output device, and the ablation reaction container is connected to the inert gas source and the nanoparticle printing and sintering device for ventilation through the air pipe connection port and the connecting air pipe;

[0055] The voltage adjustment range of the high-voltage electrostatic output device is 0-13.6kV, the current adjustment range is 0-15.6mA, the particle size of the prepared fine-diameter nano-metal particles is 5-10nm, and the nano-metal particles prepared by the two target electrodes can be any one of copper, tin, silver, gold, aluminum, copper-tin alloy, copper-tungsten alloy, copper-titanium alloy or copper-chromium alloy.

[0056] The preparation conditions of the nano-metal particles are controlled by adjusting different voltages and currents to control the particle size of the prepared fine-diameter nano-metal particles to be 5-10 nm for high-precision line repair.

[0057] In addition, the inert gas in the inert gas is any one of helium, nitrogen and argon, and the gas flow rate controlled by the carrier gas flow rate controller is 0-1.6 m / s.

[0058] Nano-metal particles of different particle sizes condensed in the preparation of the electrospark device are sent to the printing device by changing the gas flow rate.

[0059] Furthermore, the nanoparticle printing device includes a dry aerosol printing nozzle, a movable platform, and a pressurized sintering chamber;

[0060] The movable platform is placed in the pressurized sintering chamber, and the circuit substrate is placed and fixed on the movable platform; the dry aerosol printing nozzle is connected to the connecting air pipe, and the pressurizing pump is connected to the pressurized sintering chamber externally.

[0061] By increasing the pressure, it is ensured that the nano-metal particles and the circuits are in full contact with each other and formed; the nano-metal particles are directly printed onto the circuits through a dry aerosol nozzle.

[0062] In addition, the diameter of the dry aerosol printing nozzle is 0.01um-10um, the width of the repaired line is 0.1um-80um, and the bonding force between the nano metal particles and the substrate after sintering is 20N / mm 2 -40N / mm 2 .

[0063] In addition, the pressurized sintering chamber includes a pressurized chamber, a pressurized pump, and a sensor;

[0064] The pressure pump is connected to the air inlet of the pressure chamber, and the pressure pump introduces inert gas to realize pressurized heating and sintering of the nano metal particles on the circuit; the sensor is used to detect the air pressure inside the pressure chamber; after the sintering work is completed, the gas is discharged through the exhaust port of the pressure chamber, and the operating pressure inside the pressure chamber is 0-20MPa.

[0065] By changing the different pressing intensities, the required sintering strength can be obtained by changing different conditions.

[0066] In addition, the movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component;

[0067] The substrate fixing assembly is used to fix the circuit substrate on the movable platform so that the substrate can move together with the movable platform to complete the circuit repair; the heating and sintering assembly is used to heat from below to achieve the sintering of nano-metal particles on the circuit; the three-coordinate system moving assembly can realize the free movement of the movable platform to meet the complex movement required during circuit repair.

[0068] An adaptive high-precision circuit repair device, comprising an optical detection device 1, a collection and analysis device 2, an electric spark ablation device 3, a carrier gas flow rate control device 4, a dry aerosol printing nozzle 5, a pressurized sintering chamber 6 and a movable platform 7;

[0069] The pressurized sintering chamber 6 includes an air pressure sensor 61, a pressurized chamber 62 and a pressurized pump 63. The pressurized pump 63 is connected to the air inlet of the pressurized chamber 62. The air pressure sensor 61 is installed in the pressurized chamber 62.

[0070] The optical detection device 1 includes a CCD high-resolution camera 11 and a light source 12. The CCD high-resolution camera 11 is installed in the pressurized chamber 62. The light source 12 is installed around the CCD high-resolution camera 11. The CCD high-resolution camera is connected to the collection and analysis device 2.

[0071] The movable platform includes a substrate fixing component 71, a heating and sintering component 72, and a three-coordinate system moving component 73; the heating and sintering component 72 is installed on the Z axis of the three-coordinate system moving component 73, and the substrate fixing component 71 is installed above the heating and sintering component, and the CCD high-resolution camera 11 of the heating component faces the substrate fixing component 71;

[0072] The carrier gas flow rate control device 4 includes a flow rate control device 41 and an inert gas source 42. The electric spark sintering device 3 is connected to the dry aerosol printing nozzle 5 through an air pipe. The dry aerosol printing nozzle 5 is located in the pressurized sintering chamber 6. The dry aerosol printing nozzle 5 is located above the movable platform 7. The inert gas source 42 is connected to the upstream of the air pipe. A flow rate control device 41 is provided between the inert gas source and the electric spark sintering device 3.

[0073] The device integrates the functions of circuit defect detection, circuit analysis adaptive change, nano-metal particle manufacturing, printing and sintering to achieve repair into a unified system. The preparation of nano-metal particles, nozzle deposition on the substrate to the realization of sintering repair circuits are in a unified whole, without the need for additional post-processing, which greatly improves the processing efficiency of circuit repair and ensures that the sample will not be contaminated; the heating and sintering component 72 is fixedly installed on the Z axis of the three-coordinate system moving component 73 through a heat-insulating mounting seat; the heating and sintering component 72 is an electric heating plate, and the substrate fixing component 71 is made of heat-conducting material. The X-axis and Y-axis of the three-coordinate system moving component 73 constitute the degrees of freedom of planar movement, and the Z-axis is the degree of freedom of lifting and lowering.

[0074] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. An adaptive high-precision line repair method, characterized in that: The following steps are involved: S1. The sample to be tested is illuminated by a light source, and a CCD high-resolution camera collects image data to detect defects in the circuit; S2, analyzing the collected defect image data through an image analysis device to obtain a repair path for the nozzle, and using an empirical formula to calculate and adaptively change the operating parameters of the nozzle; S3, preparing nano-metal particles by ablating the target electrode through an electric spark ablation device; S4, using a carrier gas flow rate control device to adjust the inert gas flow rate to deliver the nano metal particles to the nano particle printing and sintering device; S5, printing metal nanoparticles to the defective position of the circuit through a dry aerosol printing nozzle, and achieving complete repair of the circuit with the assistance of nozzle movement and a movable platform under the substrate; S6, turning on the pressure pump and the heating assembly to achieve pressurized heating and sintering of the metal nanoparticles on the substrate in the chamber.

2. The adaptive high-precision line repair method according to claim 1, characterized in that: The optical detection device includes a CCD high-resolution camera and a light source; The light source is used to irradiate light onto the surface of the object to be measured, and the CCD high-resolution camera collects the surface morphology and light changes of the object to be measured under the irradiation of the light source, and transmits the collected image data to the image analysis device.

3. The adaptive high-precision line repair method according to claim 2, characterized in that: The image analysis device analyzes the defect morphology parameters of the circuit to establish a relative coordinate system to obtain the running trajectory of the nozzle, and adaptively changes the running parameters of the nozzle by applying empirical formulas to the defect morphology parameters to ensure good efficiency and quality of circuit repair; The operating parameters of the nozzle satisfy the following relationship: T is the time required to repair the defect, w is the width of the defect, l is the length of the defect, t is the time required for the nozzle to deposit 1um thick nanometal particles, d is the diameter of the nozzle orifice, and ν is the moving speed of the nozzle; When repairing the line, the size and depth of the line defect and the time required for line repair can be analyzed and judged to adaptively change the movement speed of the nozzle. When the defect is deep, multiple fillings can be performed to ensure the efficiency and quality of line repair.

4. The adaptive high-precision line repair method according to claim 3, characterized in that: The electric spark ablation device comprises two target electrodes, an ablation reaction container, a high-voltage electrostatic output device, and an air pipe connection port; The two target electrodes are placed opposite to each other in the ablation reaction container, the two electrodes are respectively connected to the high-voltage electrostatic output device, and the ablation reaction container is connected to the inert gas source and the nanoparticle printing and sintering device for ventilation through the air pipe connection port and the connecting air pipe; The voltage adjustment range of the high-voltage electrostatic output device is 0-13.6kV, the current adjustment range is 0-15.6mA, the particle size of the prepared fine-diameter nano-metal particles is 5-10nm, and the nano-metal particles prepared by the two target electrodes can be any one of copper, tin, silver, gold, aluminum, copper-tin alloy, copper-tungsten alloy, copper-titanium alloy or copper-chromium alloy.

5. The adaptive high-precision line repair method according to claim 4, characterized in that: The inert gas in the inert gas is any one of helium, nitrogen and argon, and the gas flow rate controlled by the carrier gas flow rate controller is 0-1.6 m / s.

6. The adaptive high-precision line repair method according to claim 5, characterized in that: The nanoparticle printing device comprises a dry aerosol printing nozzle, a movable platform and a pressurized sintering chamber; The movable platform is placed in the pressurized sintering chamber, and the circuit substrate is placed and fixed on the movable platform; the dry aerosol printing nozzle is connected to the connecting air pipe, and the pressurizing pump is connected to the pressurized sintering chamber externally.

7. The adaptive high-precision line repair method according to claim 6, characterized in that: The diameter of the dry aerosol printing nozzle is 0.01um-10um, the width of the repaired line is 0.1um-80um, and the bonding force between the nano metal particles and the substrate after sintering is 20N / mm 2 -40N / mm 2 .

8. The adaptive high-precision line repair method according to claim 7, characterized in that: The pressurized sintering chamber includes a pressurized chamber, a pressurized pump, and a sensor; The pressure pump is connected to the air inlet of the pressure chamber, and the pressure pump introduces inert gas to realize pressurized heating and sintering of the nano metal particles on the circuit; the sensor is used to detect the air pressure inside the pressure chamber; After the sintering work is completed, the gas is exhausted through the exhaust port of the pressurized chamber, and the operating pressure inside the pressurized chamber is 0-20MPa.

9. The adaptive high-precision line repair method according to claim 8, characterized in that: The movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component; The substrate fixing assembly is used to fix the circuit substrate on the movable platform so that the substrate can move together with the movable platform to complete the circuit repair; the heating and sintering assembly is used to heat from below to achieve the sintering of nano-metal particles on the circuit; the three-coordinate system moving assembly can realize the free movement of the movable platform to meet the complex movement required during circuit repair.

10. An adaptive high-precision line repair device, characterized in that: It includes an optical detection device, a collection and analysis device, an electric spark ablation device, a carrier gas flow rate control device, a dry aerosol printing nozzle, a pressurized sintering chamber and a movable platform; The pressurized sintering chamber comprises an air pressure sensor, a pressurized chamber and a pressurized pump, wherein the pressurized pump is connected to the air inlet of the pressurized chamber, and the air pressure sensor is installed in the pressurized chamber; The optical detection device comprises a CCD high-resolution camera and a light source, wherein the CCD high-resolution camera is installed in the pressurized chamber, the light source is installed around the CCD high-resolution camera, and the CCD high-resolution camera is connected to the collection and analysis device; The movable platform includes a substrate fixing component, a heating and sintering component, and a three-coordinate system moving component; the Z axis of the three-coordinate system moving component is installed with the heating and sintering component, the substrate fixing component is installed above the heating and sintering component, and the CCD high-resolution camera of the heating component faces the substrate fixing component; The carrier gas flow rate control device comprises a flow rate control device and an inert gas source. The electric spark sintering device is connected to the dry aerosol printing nozzle through an air pipe. The dry aerosol printing nozzle is located in the pressurized sintering chamber and the dry aerosol printing nozzle is located above the movable platform. The inert gas source is connected to the upstream of the air pipe, and a flow rate control device is provided between the inert gas source and the electric spark sintering device.

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