Resin multilayer substrate and electronic device

Abstract

Provided are a resin multilayer substrate in which peeling of a protective film that protects the surface of a resin laminate is suppressed, and an electronic device provided with the resin multilayer substrate. The resin multilayer substrate is provided with a resin laminate. The resin laminate has a first region, a second region, and a third region as a layer direction region. The resin multilayer substrate is provided with a first resin material that is bonded from the surface of the first region to the third region, and a second resin material that is formed in the third region. The second resin material covers a portion of the first resin material and covers an end portion of the first resin material present in the third region. When E1 represents the Young's modulus of the first resin member and E2 represents the Young's modulus of the second resin member, the Young's modulus of the first resin member and the Young's modulus of the second resin member are set to E1lt. And E2. When AD1 represents the adhesion force between the first resin member and the resin laminate, and AD2 represents the adhesion force between the second resin member and the resin laminate, AD2 > = AD1.

Description

Technical Field

[0001] The present invention relates to a resin multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer having a conductor pattern formed thereon, and an electronic device including the resin multilayer substrate. Background Art

[0002] Patent Document 1 discloses a multilayer substrate having a first region and a second region having different thicknesses in the stacking direction due to a difference in the number of stacked resin layers.

[0003] In this manner, when the number of stacked resin layers is different between the first region and the second region, a step portion is formed at the boundary between the first region and the second region.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-16743 Summary of the Invention

[0007] Problems to be solved by the invention

[0008] In a resin multilayer substrate including a resin laminate formed by laminating a plurality of resin layers including a resin layer having a conductor pattern, regions having different thicknesses in the lamination direction are required depending on the positional relationship and usage of the conductor patterns.

[0009] On the other hand, in order to protect the circuit formed on the resin multilayer substrate, or to strengthen the resin multilayer substrate itself, a structure can be adopted in which an insulating protective film is adhered to the surface of the resin multilayer substrate via an adhesive layer, thereby covering the surface of the resin laminate with a protective film.

[0010] However, in resin laminates with large thickness differences, it is difficult to form a continuous protective film on these differences, so a continuous protective film is applied to areas with relatively uniform thickness. If the resin multilayer substrate has such a structure, the ends of the protective film are located inward rather than at the outer edges of the resin multilayer substrate, making it easy for the protective film to peel off.

[0011] Therefore, an object of the present invention is to provide a resin multilayer substrate in which peeling of a protective film protecting the surface of a resin laminate is suppressed, and an electronic device including the resin multilayer substrate.

[0012] Technical solutions to solve problems

[0013] (a) A resin multilayer substrate as an example of the present disclosure includes a resin laminate formed by laminating a plurality of resin layers including a resin layer having a conductor pattern formed thereon.

[0014] The resin laminate has a first region, a second region, and a third region as the region between the first region and the second region. As a region in the layer direction,

[0015] When the average thickness of the first region of the resin laminate is represented by T1, the average thickness of the second region of the resin laminate is represented by T2, and the average thickness of the third region of the resin laminate is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.

[0016] The resin multi-layer substrate includes:

[0017] A first resin member that covers from the surface of the first region to the third region; and

[0018] A second resin member formed within the third region,

[0019] The second resin member covers a part of the first resin member and covers the end portion of the first resin member present in the third region.

[0020] When the Young's modulus of the first resin member is represented by E1 and the Young's modulus of the second resin member is represented by E2, they are in the relationship of E1 < E2.

[0021] When the adhesion force between the first resin member and the resin laminate is represented by AD1 and the adhesion force between the second resin member and the resin laminate is represented by AD2, they are in the relationship of AD2 ≥ AD1.

[0022] (b) An electronic device as an example of the present disclosure includes a resin multi-layer substrate and an electronic component mounted on the resin multi-layer substrate, or includes a resin multi-layer substrate and another substrate on which the resin multi-layer substrate is mounted.

[0023] (c) An electronic device as an example of the present disclosure includes a resin multi-layer substrate and a housing in which the resin multi-layer substrate is incorporated.

[0024] Advantageous Effects of the Invention

[0025] According to the present invention, a resin multi-layer substrate in which peeling of a protective film for protecting the surface of a resin laminate is suppressed, and an electronic device including the resin multi-layer substrate can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a cross-sectional view of a resin multi-layer substrate 101A according to the first embodiment.

[0027] Figure 2 It is a partial top view of the resin multi-layer substrate 101A according to the first embodiment.

[0028] Figure 3 It is a cross-sectional view of the resin multilayer substrate 101B according to the first embodiment.

[0029] Figure 4 It is a cross-sectional view of a resin multilayer substrate 102 according to the second embodiment.

[0030] Figure 5 It is a cross-sectional view of a resin multilayer substrate 103A according to the third embodiment.

[0031] Figure 6 It is a cross-sectional view of a resin multilayer substrate 103B according to the third embodiment.

[0032] Figure 7 It is a cross-sectional view of a resin multilayer substrate 104A according to the fourth embodiment.

[0033] Figure 8 It is a cross-sectional view of a resin multilayer substrate 104B according to the fourth embodiment.

[0034] Figure 9 It is a cross-sectional view of a resin multilayer substrate 104C according to the fourth embodiment.

[0035] Figure 10 It is a cross-sectional view of a resin multilayer substrate 105 according to the fifth embodiment.

[0036] Figure 11 It is a cross-sectional view of a resin multilayer substrate 106A according to the sixth embodiment.

[0037] Figure 12 It is a cross-sectional view of a resin multilayer substrate 106B according to the sixth embodiment.

[0038] Figure 13 It is a cross-sectional view of a resin multilayer substrate 106C according to the sixth embodiment.

[0039] Figure 14 It is a cross-sectional view of a resin multilayer substrate 107 according to the seventh embodiment.

[0040] Figure 15 It is a cross-sectional view of a resin multilayer substrate 108 according to the eighth embodiment.

[0041] Figure 16 It is a cross-sectional view of a resin multilayer substrate 109 according to the ninth embodiment.

[0042] Figure 17 It is a cross-sectional view of a resin multilayer substrate 110 according to the tenth embodiment.

[0043] Figure 18It is a cross-sectional view of a resin multilayer substrate 111 according to the eleventh embodiment.

[0044] Figure 19 The upper portion is a cross-sectional view of the resin multilayer substrate 112 according to the twelfth embodiment before bending. Figure 19 The lower part is a cross-sectional view of the resin multilayer substrate 112 according to the twelfth embodiment in a bent state.

[0045] Figure 20 It is a cross-sectional view of a resin multilayer substrate 113 according to the thirteenth embodiment.

[0046] Figure 21 It is a cross-sectional view of a resin multilayer substrate 114 and an electronic device 414 according to the fourteenth embodiment.

[0047] Figure 22 The upper part of FIG. 1 is a diagram showing the position and movement direction of a cutting edge for measuring the adhesion between the first resin member R1 formed on the resin multilayer substrate and the resin laminate 10 . Figure 22 The lower part is an enlarged view showing the detailed movement of the cutting edge.

[0048] Figure 23 The left side is a diagram showing the cutting position of the resin multilayer substrate. Figure 23 The right side is in Figure 23 The diagram shows a state where the left part is cut off by the dotted line.

[0049] Figure 24 The upper portion is a cross-sectional view of the first resin member R1 in a state where the Young's modulus is measured. Figure 24 The lower part is a cross-sectional view of the second resin member R2 in a state where the Young's modulus is measured.

[0050] Description of Reference Numerals

[0051] A1…Area 1

[0052] A2…Area 2

[0053] A3…Area 3

[0054] A31, A32…Area 3

[0055] A4…Area 4

[0056] BM…Connecting conductor

[0057] GL…Ground Conductor Layer

[0058] R1…1st resin part

[0059] R2…Second resin part

[0060] R3…3rd resin part

[0061] RE, RE1, RE2…Radiating electrodes

[0062] RP…Root

[0063] SL…Conductor pattern for signal lines

[0064] SS…side

[0065] TE…Terminal Electrode

[0066] V1, V2...Interlayer connection conductors

[0067] 4…Interlayer connecting conductor

[0068] 5…Conductor layer

[0069] 6…Terminal electrode

[0070] 10…resin laminate

[0071] 10E…carrying part

[0072] 10S…Substrate

[0073] 24…Electronic components

[0074] 27…Other substrates

[0075] 101A, 101B, 102, 103A, 103B, 104A, 104B, 104C, 105, 106A, 106B, 106C, 107, 108, 109, 110, 111, 112, 113, 114...resin multilayer substrate

[0076] 414…Electronic equipment. DETAILED DESCRIPTION

[0077] Below, with reference to the figures, several specific examples are given to illustrate a plurality of ways for implementing the present invention. In each figure, the same figure mark is marked on the same part. Taking into account the ease of description or understanding of the key points, for the convenience of explanation, the way for implementing the invention is divided into a plurality of embodiments and shown, but it is possible to omit, replace or combine parts of the structures shown in different embodiments. After the second embodiment, the description of matters common to the first embodiment is omitted, and only the differences are described. In particular, the same effects brought about by the same structure are not mentioned one by one in each embodiment.

[0078] <First Implementation>

[0079] In the first embodiment, a resin multilayer substrate including a patch antenna is exemplified.

[0080] Figure 1 This is a cross-sectional view of the resin multi-layer substrate 101A according to the first embodiment. Figure 2 This is a partial top view of the resin multi-layer substrate 101A according to the first embodiment. In addition, in the cross-sectional view, the lines that appear (appear by cutting) on the cross-section are depicted, and the lines existing behind the cross-section are omitted from the illustration. This is the same for each of the embodiments shown later. Further, in Figure 1 , Figure 2 , a single resin multi-layer substrate is shown, but in the middle stage of manufacturing such a single resin multi-layer substrate, it is a continuum of multiple resin multi-layer substrates, and the continuum is cut at the final stage of the manufacturing process or at a stage immediately before the final stage, thereby individualizing it. Such a relationship between the continuum and the individualization is the same in other figures.

[0081] The resin multi-layer substrate 101A includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers formed with conductor patterns. The resin laminate 10 has a first region A1, a second region A2, and a third region A3 as the region between the first region A1 and the second region A2, as layer direction regions.

[0082] In Figure 1 , the interfaces of the resin layers adjacent in the layer direction among the plurality of resin layers are not shown. The omission of this layer interface is the same for each of the embodiments shown later.

[0083] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, and the average thickness of the third region A3 of the resin laminate 10 is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.

[0084] Accordingly, a stepped portion is formed at the boundary between the first region A1 and the third region A3, and a stepped portion is formed at the boundary between the second region A2 and the third region A3.

[0085] From the surface of the first region A1 to the third region A3, a first resin member (protective film) R1 is pasted on the resin laminate 10. The first resin member R1 protects the conductor pattern exposed on the outer layer of the resin laminate 10 and provides electrical insulation.

[0086] In the third region A3, a second resin member (reinforcement member) R2 is formed by coating. Accordingly, the second resin member R2 covers a part of the first resin member R1 (not the entire surface). The second resin member R2 covers the first resin member R1 from the end of the first resin member R1 pasted on the third region A3 to the boundary portion between the third region A3 and the second region A2. At least the end of the first resin member R1 pasted on the third region A3 is covered.

[0087] Examples of the materials for each part are as follows.

[0088] [First resin member R1]

[0089] · It is a sheet-like insulating material with an adhesive layer pasted on a polyimide substrate. The thickness of the polyimide substrate and the thickness of the adhesive layer are arbitrary. In addition, the color of the polyimide substrate and the color of the adhesive layer are arbitrary.

[0090] · The Young's modulus E1 of the first resin member R1 is 3 GPa or more and less than 5 GPa.

[0091] [Second resin member R2]

[0092] · It is a material for underfill or side fill applications with epoxy resin or acrylic resin as the main component, and the color is arbitrary.

[0093] · The Young's modulus E2 of the second resin member R2 is 5 GPa or more. For example, it is 7 GPa.

[0094] [Resin laminate 10]

[0095] · Liquid crystal polymer resin or polyimide

[0096] When the Young's modulus of the first resin member R1 is represented by E1 and the Young's modulus of the second resin member R2 is represented by E2, they are in the relationship of E1 < E2.

[0097] In addition, the method for measuring the Young's modulus will be described in detail after exemplifying each embodiment.

[0098] Examples of the adhesion force relationship of each part are as follows.

[0099] The adhesion force AD1 between the first resin member R1 and the resin laminate 10: 0.5 - 2.0 N / mm

[0100] The adhesion force AD2 between the second resin member R2 and the resin laminate 10: 1.0 - 3.0 N / mm

[0101] The adhesion force AD12 between the second resin member R2 and the first resin member R1: 0.5 - 2.0 N / mm

[0102] Regarding the method for measuring the above adhesion force, it will be described in detail after exemplifying each embodiment.

[0103] Here, when the adhesion force between the first resin member R1 and the resin laminate 10 is represented by AD1 and the adhesion force between the second resin member R2 and the resin laminate 10 is represented by AD2, the relationship of AD2 ≥ AD1 is preferred.

[0104] A radiation electrode RE is formed on the upper surface of the second area A2 of the resin laminate 10. A terminal electrode TE is exposed on the upper surface of the first area A1 of the resin laminate 10. A ground conductor layer GL is formed on the lower surface of the resin laminate 10.

[0105] A signal line conductor pattern SL is formed inside the resin laminate 10. The signal line conductor pattern SL is a conductor pattern formed in one resin layer among a plurality of resin layers.

[0106] Furthermore, interlayer connection conductors V1 and V2 are formed within the resin laminate 10. The interlayer connection conductor V1 extends in the stacking direction of the resin layers in the resin laminate 10 and electrically connects one end of the signal line conductor pattern SL to the radiation electrode RE. The interlayer connection conductor V2 extends in the stacking direction and electrically connects the other end of the signal line conductor pattern SL to the terminal electrode TE.

[0107] The signal line conductor pattern SL, the ground conductor layer GL, and the resin layer between the signal line conductor pattern SL and the ground conductor layer GL form a microstrip line. That is, the terminal electrode TE and the radiation electrode RE are connected at high frequency via the microstrip line.

[0108] The radiation electrode RE, the ground conductor layer GL, and the resin laminate 10 constitute a patch antenna.

[0109] Various conductor patterns such as the signal line conductor pattern SL, the ground conductor layer GL, the conductor pattern partially serving as the terminal electrode TE, the interlayer connection conductors V1 and V2 , and the radiation electrode RE are conductors mainly composed of, for example, Cu or Ag.

[0110] During the manufacture of the resin multilayer substrate 101A, the first resin material R1 is attached to the resin laminate 10 and vacuum pressed to achieve close contact between the first resin material R1 and the resin laminate 10. The adhesive material of the first resin material R1 is then cured in an oven. Next, the second resin material R2 is applied and cured.

[0111] exist Figure 2 In the example shown, a plurality of radiating electrodes RE are arranged in an array, forming an array antenna formed by a plurality of patch antennas. The directivity of the antenna is determined by controlling or setting the phase of the transmission signal radiated from each radiating electrode RE or the reception signal received by each radiating electrode RE. Figure 2 In, omitted Figure 1 The terminal electrode TE is shown in FIG.

[0112] exist Figure 1In the example shown, the first region A1, the second region A2, and the third region A3 are shown in an integrated state. However, the resin laminate 10 can also be formed by mounting the substrate constituting the second region A2 on a multilayer substrate having the first region and the third region. The same applies to other embodiments shown later.

[0113] According to this embodiment, since the thickness T3 of the third region A3 between the first region A1 and the second region A2 is smaller than the thickness T1 of the first region A1 and the thickness T2 of the second region A2, the third region A3 functions as a recessed portion. Therefore, the coating amount of the second resin member R2 can be ensured in the third region A3. Accordingly, as the second resin member R2, for example, a resin material with a low viscosity of 40 Pa·s or less can be selected. In this way, by coating the second resin member R2 including the low-viscosity resin material on the end portion of the first resin member R1, the peeling of the end portion of the first resin member R1 can be effectively suppressed.

[0114] In addition, according to this embodiment, as described above, since the end portion of the first resin member R1 pasted from the first region A1 to the third region A3 is covered with the second resin member R2 in the third region and is in the relationship of AD2 ≥ AD1, even if the adhesion force of the first resin member R1 to the resin laminate 10 is relatively weak, the peeling of the first resin member R1 from the resin laminate 10 can be suppressed.

[0115] In addition, in Figure 1 , since the thickness T1 of the first region A1 of the resin laminate 10 is thinner than the thickness T2 of the second region A2, the X-Y plane of the first region A1 is more likely to bend around an axis parallel to the Y axis with respect to the second region A2. Even if such bending stress is intentionally generated, as described above, due to the relationship of E1 < E2, the first resin member R1 is also likely to be deformed by the bending stress of the first region A1. Accordingly, the first resin member R1 is likely to follow the deformation of the first region A1. Therefore, when the bending stress of the first region A1 and the third region A3 with respect to the second region A2 is applied, the offset of the first resin member R1 with respect to the surface of the resin laminate 10 can be suppressed. Accordingly, the peeling of the first resin member R1 can also be effectively suppressed. That is, the bending resistance when the first region A1 and the third region A3 are bent with respect to the second region A2 can be improved.

[0116] Figure 3 is a cross-sectional view of the resin multilayer substrate 101B according to the first embodiment. In this resin multilayer substrate 101B and Figure 1 In the resin multilayer substrate 101A shown, the covering range of the second resin member R2 is different.

[0117] In Figure 3In the resin multi-layer substrate 101B shown, the second resin member R2 covers the first resin member R1 from the end of the first resin member R1 to the first region A1. That is, the second resin member R2 extends to the position of the first region A1 of the resin laminate 10. Other structures are as Figure 1 shown.

[0118] Near the boundary between the first region A1 and the third region A3 of the resin laminate 10, the close adhesion of the first resin member R1 to the resin laminate 10 may sometimes be low. According to Figure 3 the structure shown, since the second resin member R2 exists at the boundary between the first region A1 and the third region A3 of the resin laminate 10, peeling of the first resin member R1 from the resin laminate 10 at this portion can be suppressed. And since the bonding area between the first resin member R1 and the second resin member R2 is large, peeling of the first resin member R1 from the resin laminate 10 can be effectively suppressed.

[0119] 《Second Embodiment》

[0120] In the second embodiment, an example is shown where there is a region other than the third region between the first region and the second region of the resin laminate.

[0121] Figure 4 is a cross-sectional view of the resin multi-layer substrate 102 according to the second embodiment. The resin multi-layer substrate 102 includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers formed with conductor patterns. The resin laminate 10 has a first region A1, a second region A2, and a third region A3 between the first region A1 and the second region A2 as layer direction regions. In addition, there is a fourth region A4 between the first region A1 and the second region A2.

[0122] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, the average thickness of the third region A3 of the resin laminate 10 is represented by T3, and the average thickness of the fourth region A4 of the resin laminate 10 is represented by T4, these thicknesses are in the relationship of T4 < T3 < T1 < T2.

[0123] In Figure 4 the example shown, from the third region A3 to the first region A1, a first resin member (protective film) R1 is pasted on the resin laminate 10. Moreover, the second resin member R2 covers the end of the first resin member R1 located in the third region A3.

[0124] Other structures are as shown in the first embodiment. According to the second embodiment, even in regions where the thickness of the resin laminate 10 is different outside the third region, the coating area of the second resin member R2 can be suppressed, and cost reduction can be achieved. In addition, it also has the same effects as the first embodiment.

[0125] <<Third Embodiment>>

[0126] In the third embodiment, an example is shown in which the third region of the resin laminate is a region where the thickness of the resin laminate is divided into multiple segments. In addition, in the third embodiment, an example is shown in which the structures of the first resin member R1 and the second resin member R2 are different from those of the second embodiment.

[0127] Figure 5 It is a cross-sectional view of the resin multilayer substrate 103A according to the third embodiment. The resin multilayer substrate 103A includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers formed with conductor patterns.

[0128] The resin laminate 10 has a first region A1, a second region A2, and third regions A31, A32 as regions between the first region A1 and the second region A2, as layer direction regions.

[0129] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, the average thickness of one third region A31 of the resin laminate 10 is represented by T31, and the average thickness of the other third region A32 of the resin laminate 10 is represented by T32, these thicknesses are in the relationship of T32 < T31 < T1 < T2. Thus, the third regions A31, A32 are regions where the thickness of the resin laminate 10 is divided into multiple segments.

[0130] In Figure 5 In the example shown, the first resin member (protective film) R1 is pasted on the resin laminate 10 from the third region A32 to the first region A1. Moreover, the second resin member R2 covers the end of the first resin member R1 located in the third region A32.

[0131] Other structures are as shown in the first embodiment and the second embodiment. In Figure 5 In the example shown, the coating area of the second resin member R2 can be suppressed, and cost reduction can be achieved. In Figure 5 The resin multilayer substrate 103A shown also has the same effects as the first embodiment and the second embodiment.

[0132] Figure 6 It is a cross-sectional view of the resin multilayer substrate 103B according to the third embodiment. In this resin multilayer substrate 103B and Figure 5In the resin multilayer substrate 103A shown, the covering range of the second resin member R2 is different.

[0133] exist Figure 6 In the resin multilayer substrate 103B shown, the second resin part R2 covers the first resin part R1 from the third area A32 to the first area A1. In other words, the second resin part R2 extends to the position of the first area A1 of the resin laminate 10. Figure 6 shown.

[0134] Furthermore, the resin multilayer substrate may have a structure in which the second resin member R2 covers the first resin member R1 from the third region A32 to the third region A31.

[0135] That is, in the third embodiment, the second resin part R2 is adhered to the first resin part R1 from the end of the first resin part R1 located in a given segment of the third area A31, A32 to the upper part of the third area that is one segment higher than the given segment, or from the end of the first resin part R1 to the first area A1.

[0136] The other structures are the same as those shown in the first and second embodiments. The third embodiment also has the same functions and effects as those of the first and second embodiments.

[0137] <<Fourth Implementation>>

[0138] In the fourth embodiment, a resin multilayer substrate is exemplified in which the second resin member R2 covers the side surface portion of the second region A2.

[0139] Figure 7 It is a cross-sectional view of a resin multilayer substrate 104A according to the fourth embodiment. Figure 8 The upper portion is a cross-sectional view of a resin multilayer substrate 104B according to the fourth embodiment. Figure 8 The lower part is a photograph of the second resin part R2 and its surroundings. The structure of the resin laminate 10 is similar to that in the first embodiment. Figure 1 、 Figure 3 The same is true for the resin laminate 10 shown.

[0140] exist Figure 7 、 Figure 8 In the example shown, the first resin material R1 is attached to the resin laminate 10 from the third area A3 to the first area A1. Figure 7 In the example shown, the second resin member R2 covers the end of the first resin member R1 by covering the third region, and also covers the side surface of the second region A2. Figure 8In the example shown, the second resin member R2 covers the first resin member R1 in the first and third regions and covers the side surfaces of the second region A2. In both cases, the second resin member R2 covers the side surfaces of the second region A2 to a position greater than the thickness of the first region A1.

[0141] Figure 9 1 is a cross-sectional view of a resin multilayer substrate 104C according to the fourth embodiment. The structure of the resin laminate 10 is similar to that in the first embodiment. Figure 1 、 Figure 3 The same is true for the resin laminate 10 shown.

[0142] exist Figure 9 In the example shown, the first resin member R1 is also attached to the resin laminate 10 from the third region A3 to the first region A1. Figure 9 In the example shown, the second resin member R2 is provided from the first area A1 to the second area A2. That is, the second resin member R2 covers not only the entire side surface of the second area A2 but also a portion of the upper surface of the second area A2. Figure 9 In the example shown, the second resin member R2 also covers the end portion of the radiation electrode RE. This structure also has the effect of suppressing peeling of the Cu foil on the upper surface of the second area A2.

[0143] In any of the resin multilayer substrates 104A, 104B, and 104C, the roughness of the side surface portion of the second region A2 of the resin laminate 10 is greater than the roughness of the top surface of the third region A3.

[0144] According to this embodiment, since the second region A2 of the resin laminate 10 is fixed by the second resin member R2, the bending resistance of the second region A2 can be improved. Furthermore, the bending resistance of the base of the second region A2 can be improved. This suppresses deformation of the second region A2, thereby minimizing, for example, changes in antenna characteristics.

[0145] Furthermore, as described above, the roughness of the side surfaces of the second region A2 is greater than the roughness of the top surface of the third region A3. Therefore, the adhesion between the second resin member R2 and the side surfaces of the second region A2 is greater than the adhesion between the second resin member R2 and the top surface of the third region A3. When the first region A1 of the resin laminate 10 is bent, stress is applied to the joint surface between the second region A2 and the second resin member R2. However, as described above, the strong adhesion between the second resin member R2 and the side surfaces of the second region A2 prevents the second resin member R2 from peeling off when this stress is applied.

[0146] Implementation Method 5

[0147] In the fifth embodiment, a resin multilayer substrate is shown in which the structure of the side surface and the base of the second region A2 is different from the example shown in the fourth embodiment.

[0148] Figure 10 This is a cross-sectional view of a resin multilayer substrate 105 according to the fifth embodiment. The resin multilayer substrate 105 includes a resin laminate 10 formed by laminating a plurality of resin layers, including a resin layer having a conductor pattern formed thereon. The resin laminate 10 has a first region A1, a second region A2, and a third region A3 located between the first region A1 and the second region A2 as layer direction regions.

[0149] The side surface SS of the second area A2 is tapered and becomes narrower toward the top. In addition, the root RP of the second area A2 is curved. Figure 7 The same is true for the resin multilayer substrate 104A shown.

[0150] According to this embodiment, even when the resin laminate 10 is formed by mounting a rigid substrate constituting the second region A2 on a flexible multilayer substrate having the first region A1 and the third region A3, the bonding strength of the second region A2 with respect to the first region A1 and the third region A3 can be improved. In other words, since the second region A2 and the second resin member R2 have high adhesion at the tapered portion, it is possible to suppress the second region A2 from coming off the first region A1 and the third region A3.

[0151] Furthermore, since the root RP of the second region A2 is curved, when bending stress is applied to the third region A3, the stress applied to the root RP of the second region A2 is reduced, thereby suppressing the occurrence of cracks in the root of the second region A2.

[0152] Sixth Implementation Method

[0153] In the sixth embodiment, a resin multilayer substrate is exemplified in which a third region A2 is provided as a region where the thickness of the resin laminate is divided into multiple stages, and the second resin member R2 covers the side surface portion of the second region A2.

[0154] Figure 11 This is a cross-sectional view of a resin multilayer substrate 106A according to the sixth embodiment. The resin multilayer substrate 106A includes a resin laminate 10 formed by laminating a plurality of resin layers, including a resin layer having a conductor pattern formed thereon. The resin laminate 10 has a first region A1, a second region A2, and third regions A31 and A32 located between the first region A1 and the second region A2 as layer direction regions.

[0155] When the average thickness of the first region A1 of the resin laminate 10 is represented by T1, the average thickness of the second region A2 of the resin laminate 10 is represented by T2, the average thickness of one of the third regions A31 of the resin laminate 10 is represented by T31, and the average thickness of the other third region A32 of the resin laminate 10 is represented by T32, these thicknesses are in the relationship of T32 < T31 < T1 < T2. Thus, the third regions A31 and A32 are regions where the thickness of the resin laminate 10 is divided into multiple segments.

[0156] In Figure 11 In the example shown, the first resin member (protective film) R1 is pasted from the third region A32 to the first region A1 of the resin laminate 10. Moreover, the second resin member R2 covers the end portion of the first resin member R1 located in the third region A32 to the side surface portion of the second region A2.

[0157] Figure 12 is a cross-sectional view of the resin multi-layer substrate 106B according to the sixth embodiment. The structure of the resin laminate 10 is the same as Figure 11 shown.

[0158] In Figure 12 In the example shown, the first resin member (protective film) R1 is pasted from the third region A31 to the first region A1 of the resin laminate 10. Moreover, the second resin member R2 covers the end portion of the first resin member R1 located in the third region A31 to the side surface portion of the second region A2.

[0159] <00...​​​​​​​​​​​​​​​​​​

[0162] Like this, in the case where the third region is a region where the thickness of the resin laminate 10 is divided into multiple sections, even if the second resin part R2 covers the surface of the first resin part R1 and the resin laminate 10 from the end of the first resin part R1 to the side of the second region A2, it also has the same effect as the resin multilayer substrate shown in the fourth embodiment.

[0163] Seventh Implementation Method

[0164] In the seventh embodiment, a resin multilayer substrate is described as an example in which the structure of the upper surface of the second region is different from the examples described above.

[0165] Figure 14 This is a cross-sectional view of a resin multilayer substrate 107 according to the seventh embodiment. This resin multilayer substrate 107 includes a third resin member R3 that covers the upper surface of the second area A2, along with the upper surface of the radiation electrode RE formed thereon. The third resin member R3 and the second resin member R2 are positioned so as not to contact each other. That is, a portion of the second area of ​​the resin laminate 10 is exposed between the third resin member R3 and the second resin member R2. Similar to the first resin member R1, the third resin member R3 is a sheet-like insulating material composed, for example, of a polyimide base material with an adhesive layer attached thereto.

[0166] Other structures are the same as those in the fourth embodiment Figure 7 The structure of the resin multilayer substrate 104A shown is the same.

[0167] According to this embodiment, since the third resin R3 and the second resin R2 are discontinuous, the third resin R3 is not affected by the bending of the first area A1 and the third area A3 , and the peeling resistance of the third resin R3 can be improved.

[0168] Implementation Example 8

[0169] In the eighth embodiment, a resin multilayer substrate in which the side surface portion of the second region is covered with a third resin member is exemplified.

[0170] Figure 15 This is a cross-sectional view of a resin multilayer substrate 108 according to the eighth embodiment. In this example, a third resin member R3 is formed from the top surface to the side surfaces of the second region A2. The second resin member R2 is formed on the side surfaces of the second region to a position that covers the ends of the third resin member R3. Furthermore, the rounded corners from the top surface to the side surfaces of the second region A2 improve the ease of attaching the third resin member R3 to the second region A2 of the resin laminate 10.

[0171] Other structures are the same as those in the fourth embodiment Figure 7 The structure of the resin multilayer substrate 104A shown is the same.

[0172] According to the present embodiment, since the second resin member R2 covers the end portion of the third resin member R3 , the bending resistance related to peeling of the third resin member R3 can also be improved.

[0173] Implementation Method 9

[0174] In the ninth embodiment, the relationship between the conductive pattern in the second region of the resin laminate and the second and third resin materials covering the side surfaces of the second region is exemplified.

[0175] Figure 16 This is a cross-sectional view of a resin multilayer substrate 109 according to the ninth embodiment. Within the second region A2 of the resin laminate 10, a stacking direction conductor path is formed by stacking resin layers having interlayer connection conductors V1 and a conductive foil in contact with the interlayer connection conductors V1. A portion of the end of the conductive foil reaches the side surface of the second region A2.

[0176] The third resin material R3 is bonded to the exposed portion of the conductor foil. Furthermore, the second resin material R2 covering the side surface of the second area A2 covers the exposed portion of the conductor foil.

[0177] Other structures are the same as those in the fourth embodiment Figure 7 The structure of the resin multilayer substrate 104A shown is the same.

[0178] According to this embodiment, inappropriate electrical conduction of the conductor pattern on the side surface of the second area A2 can be prevented. In conjunction with this, the size of the second area A2 in the X direction or the XY plane direction can be reduced.

[0179] <10th Implementation Method>

[0180] In the tenth embodiment, the relationship between the conductive pattern in the second region of the resin laminate and the second resin material covering the side surfaces of the second region is exemplified.

[0181] Figure 17 This is a cross-sectional view of a resin multilayer substrate 110 according to the tenth embodiment. Within the second region A2 of the resin laminate 10, a stacking direction conductor path is formed by stacking resin layers having interlayer connection conductors V1 and a conductive foil in contact with the interlayer connection conductors V1. A portion of the end of the conductive foil is exposed on the side surface of the second region A2.

[0182] The second resin material R2 covering the side surface of the second region A2 covers the exposed portion of the conductive foil.

[0183] Other structures are the same as those in the fourth embodiment Figure 7 The structure of the resin multilayer substrate 104A shown is the same.

[0184] According to this embodiment, improper electrical conduction of the conductor pattern on the side surface of the second region A2 can be prevented. In addition, in connection with this, it is possible to reduce the size of the second region A2 in the X direction or the X-Y plane direction.

[0185] <<Embodiment 11>>

[0186] In Embodiment 11, a resin multilayer substrate is exemplified in which the first resin member and the second resin member are present at two (separated) positions in different positions in the stacking direction of the plurality of resin layers in the resin laminate.

[0187] Figure 18 It is a cross-sectional view of the resin multilayer substrate 111 according to Embodiment 11. The resin multilayer substrate 111 includes a resin laminate 10 formed by laminating a plurality of resin layers including a resin layer in which a conductor pattern is formed.

[0188] The resin laminate 10 has a first region A1, a second region A2, and a third region A3 as the layer direction regions of the resin laminate 10. When the thickness of the first region A1 of the resin laminate 10 is represented by T1, the thickness of the second region A2 of the resin laminate 10 is represented by T2, and the thickness of the third region A3 of the resin laminate 10 is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.

[0189] A step portion is formed at the boundary between the first region A1 and the third region A3, and a step portion is formed at the boundary between the second region A2 and the third region A3.

[0190] A first resin member (protective film) R1 is pasted on the resin laminate 10 from the surface of the first region A1 to the third region A3. In addition, within the third region A3, a second resin member (reinforcing member) R2 is coated.

[0191] If compared with the Figure 1 example shown, it can be clearly seen that in the resin multilayer substrate 111 of Embodiment 11, the first resin member R1 and the second resin member R2 are present at two (separated) positions in different positions in the stacking direction of the plurality of resin layers in the resin laminate 10.

[0192] According to this embodiment, when assembled into the housing of an electronic device, the degree of freedom in arrangement is increased, such as being able to be installed in a limited space, etc. In addition, since it has radiation electrodes RE with different directions from each other, it can be used as an antenna with wide directivity or bidirectionality.

[0193] Other structures and the effects brought by them are as shown in Embodiment 1.

[0194] <<Embodiment 12>>

[0195] In the 12th embodiment, a resin multilayer substrate bent in the first region of the resin laminate is illustrated.

[0196] Figure 19 The upper part of [Figure] shows a cross-sectional view of the resin multilayer substrate 112 according to the 12th embodiment before bending (before folding). Figure 19 The lower part of [Figure] shows a cross-sectional view of the resin multilayer substrate 112 according to the 12th embodiment after bending.

[0197] As Figure 19 As shown in the upper part of [Figure], the resin multilayer substrate 112 includes a resin laminate 10 formed by laminating a plurality of resin layers including resin layers formed with conductor patterns. The resin laminate 10 has one first region A1, a second region A2, and a third region A3 as the layer direction regions of the resin laminate 10. When T1 represents the thickness of the first region A1 of the resin laminate 10, T2 represents the thickness of the second region A2 of the resin laminate 10, and T3 represents the thickness of the third region A3 of the resin laminate 10, these thicknesses are in the relationship of T3 < T1 < T2.

[0198] From the surface of the first region A1 to the third region A3, a first resin member (protective film) R1 is pasted to the resin laminate 10. Further, within the third region A3, a second resin member (reinforcing member) R2 is provided.

[0199] If compared with the example shown in Figure 1 It can be clearly seen that in the resin multilayer substrate 112 of the 12th embodiment, the first resin member R1 and the second resin member R2 are present at two (separated) positions in different positions in the layer direction of the resin laminate 10.

[0200] As Figure 19 As shown in the lower part of [Figure], if the resin multilayer substrate 112 is bent 90° around an axis along the Y-axis direction at the center of its first region A1, the directions of the radiation electrodes RE in the two positions become different by 90°.

[0201] According to the present embodiment, when assembled into the housing of an electronic device, the degree of freedom in arrangement is improved, such as being able to be mounted in a limited space or the like. Further, since it includes radiation electrodes RE1 and RE2 having different directions from each other, it can be used as an antenna with a wide directivity.

[0202] <<13th Embodiment>>

[0203] In the 13th embodiment, a resin multilayer substrate in which the structure of the second region is different from the examples shown so far is illustrated. <​​This is a cross-sectional view of a resin multilayer substrate 113 according to a thirteenth embodiment. This resin multilayer substrate 113 includes a substrate portion 10S and a mounting portion 10E mounted on substrate portion 10S. The substrate portion 10S and mounting portion 10E define a second area A2. Furthermore, the substrate portion 10S outside the mounting area of ​​mounting portion 10E defines a first area A1 and a third area A3.

[0205] The substrate portion 10S and the mounting portion 10E include a plurality of resin layers, and a conductor layer and an interlayer connection conductor attached to a predetermined resin layer among the plurality of resin layers. The conductor layer and the interlayer connection conductor are conductors mainly composed of, for example, Cu or Ag.

[0206] A connection conductor BM is formed by coating in the opening of the uppermost resin layer of the substrate 10S. The connection conductor BM is made of a molten metal such as solder. The end of the signal line conductor pattern SL is arranged below the connection conductor BM.

[0207] A radiation electrode RE is formed on the upper portion of the mounting portion 10E. A terminal electrode 6 is formed on the mounting surface (lower surface) of the mounting portion 10E. The terminal electrode 6 and the radiation electrode RE are electrically connected via the interlayer connection conductor 4 and the conductive layer 5.

[0208] The terminal electrode 6 of the mounting portion 10E is electrically connected to one end of the signal line conductor pattern SL formed on the substrate portion 10S. The terminal electrode TE and the other end of the signal line conductor pattern SL are connected in the stacking direction via the conductor layer 5 and the interlayer connection conductor 4.

[0209] In this manner, the substrate portion 10S and the mounting portion 10E may constitute a resin laminate. Other structures are the same as those of the embodiments described so far, such as the first embodiment.

[0210] The resin laminate may comprise the entire first, second, and third regions A1, A2, and A3 of the same resin material. Alternatively, the second region A2 may be formed by bonding a different type of substrate to the resin substrates forming the first and third regions A1 and A3. In other words, the resin portion of the substrate portion 10S and the resin portion of the mounting portion 10E may be made of different types of resin materials. However, if the resin portions of the substrate portion 10S and the mounting portion 10E are made of the same resin material, a high bond strength can be achieved because no interface between the different materials is formed. Whether the resins are made of the same type can be confirmed using a Fourier transform infrared spectrophotometer (FT-IR). Specifically, a spectrum is obtained using a Fourier transform infrared spectrophotometer (FT-IR). If the peaks of the spectrum are the same for the mounting portion 10E and the substrate portion 10S, it can be confirmed that the resins are made of the same type.

[0211] Furthermore, if the resin is a thermoplastic resin, the difference in melting point between the same type of resin material is small. Whether the resin portion of the substrate portion 10S and the resin portion of the mounting portion 10E are made of the same type of resin material can be confirmed by using the endothermic peak of differential scanning calorimetry (DSC). Specifically, using a Rigaku DSC8230, the temperature is raised at a rate of 10°C / minute, the melted material is cooled, and then the temperature is raised again at 10°C / minute. If the difference in melting point between the two resin materials is within 5°C, the materials are considered to be of the same type of resin material.

[0212] Implementation Method 14

[0213] In the fourteenth embodiment, an electronic device including a resin multilayer substrate on which electronic components are mounted and another substrate is exemplified.

[0214] Figure 21 It is a cross-sectional view of a resin multilayer substrate 114 and an electronic device 414 according to the fourteenth embodiment.

[0215] An electronic component 24 is mounted on the first region A1 of the resin laminate 10. The electronic component 24 is not shown with hatching.

[0216] The electronic device 414 includes another substrate 27 and the resin multilayer substrate 114 mounted on the other substrate 27. Hatching is omitted in the illustration of the other substrate 27.

[0217] The structure of the resin multilayer substrate 114 is the same as that in the first embodiment. Figure 1 The same is true for the resin multilayer substrate 101A shown.

[0218] Implementation Method 15

[0219] In the fifteenth embodiment, an electronic device including a housing is exemplified.

[0220] An electronic device according to the present embodiment includes any of the resin multilayer substrates described in the first to thirteenth embodiments, and a housing that houses the resin multilayer substrate.

[0221] The housing for housing the resin multilayer substrate has a size and shape capable of housing (embedding) the resin multilayer substrate.

[0222] Method for measuring close contact strength

[0223] Adhesion strength is generally measured by tensile testing using a tensile strength tester. However, to measure the adhesion strength of each component of a manufactured resin multilayer substrate, the adhesion strength is determined by measuring the horizontal and vertical forces exerted on the cutting edge during ultra-low-speed cutting and peeling from the surface to the interface using a sharp cutting edge. For example, this is done using a device called SAICAS manufactured by DAIPLA WINTES.

[0224] Here, first, a method for measuring the adhesion force (adhesion strength) AD1 between the first resin material R1 and the resin laminate 10 shown in each embodiment will be exemplified.

[0225] Figure 22 The upper part of FIG. 1 is a diagram showing the position and movement direction of a cutting edge for measuring the adhesion between the first resin member R1 formed on the resin multilayer substrate and the resin laminate 10 . Figure 22 The lower part is an enlarged view showing the detailed movement of the cutting edge.

[0226] like Figure 22 As shown in the upper part of , the sharp cutting edge is moved from the surface of the first resin member R1 to the interface with the resin laminate 10 , cutting the first resin member R1 at an ultra-low speed to separate it from the resin laminate 10 .

[0227] exist Figure 22 In the figure shown in the lower part of , first, the cutting edge is moved in two axial directions while applying a force Fv in the -Z direction and a force Fh in the +X direction, thereby obliquely cutting into the first resin part R1. When the first resin part R1 reaches a certain thickness, shear deformation occurs. Thereafter, the first resin part R1 is peeled off from the resin laminate 10. Thereafter, it moves in a uniaxial direction in the +X direction. When such a movement of the cutting edge is performed, the peak value of the force Fh in the +X direction applied to the cutting edge can be processed as the adhesion force between the first resin part R1 and the resin laminate 10.

[0228] An example of a method for measuring the adhesion force (adhesion strength) AD2 between the second resin material R2 and the resin laminate 10 is as follows.

[0229] Figure 23 The left side of FIG is a diagram showing the cutting position of the resin multilayer substrate, and by cutting at its dotted line portion, it becomes Figure 23 In this state, the thickness of the second resin part R2 becomes the same as Figure 22 The first resin member R1 shown has the same thickness.

[0230] exist Figure 23In the figure shown on the right, the cutting edge is moved in the -Z direction, thereby cutting into the second resin member R2. When the force applied to the second resin member R2 reaches a certain value, shear deformation occurs in the second resin member R2. Subsequently, the second resin member R2 is peeled off from the resin laminate 10. During this movement of the cutting edge, the peak value of the -Z direction force applied to the cutting edge can be treated as the adhesion force between the second resin member R2 and the resin laminate 10.

[0231] Determination method of Young's modulus

[0232] The Young's modulus of the first resin member R1 is measured by, for example, performing a nanoindentation test in accordance with JIS Z2255 and ISO 14577. For example, the Young's modulus is determined from load-displacement data using a KLA Micro nanoindenter.

[0233] Figure 24 The upper portion is a cross-sectional view of the first resin part R1 during Young's modulus measurement. A Vickers or Berkovich-type triangular pyramid indenter was used as the indenter. The indenter was placed perpendicularly against the surface of the first resin part R1, and the measurement was performed at an indentation depth of approximately 1 / 10 of the film thickness. For example, for a film thickness of 10 μm, the Young's modulus was approximately 1 μm.

[0234] Figure 24 The lower part is a cross-sectional view of the second resin part R2 under the measurement state of the Young's modulus. Figure 24 The resin multilayer substrate shown above is cut along the dotted line. A Vickers or Berkovich-type triangular pyramid indenter is used as the indenter. This indenter is brought into contact perpendicularly with the surface of the second resin part R2, and the indenter is measured at a depth of approximately 1 / 10 of the film thickness. For example, if the film thickness is 10 μm, the depth is approximately 1 μm.

[0235] So far, various embodiments of the present invention have been described, but these are all examples and are not intended to limit the scope of the present invention. The embodiments of the present invention can be omitted, replaced, or modified in various ways without departing from the gist of the invention. The embodiments in which various omissions, replacements, or modifications have been made are included in the scope of the present invention, the gist of the present invention, and are included in the invention described in the claims of this application and their equivalents.

[0236] For example, in each embodiment, an example is shown in which a radiation electrode is formed in the second area A2 of the resin laminate 10 . However, the electrode formed in the second area A2 is not limited to the radiation electrode.

[0237] In addition, in each embodiment, an example is shown in which the interlayer connection conductors are formed in the first region A1 and the second region A2, but these interlayer connection conductors are not essential.

[0238] In addition, in each embodiment, a conductor pattern SL for signal lines and a ground conductor layer GL are formed to constitute a microstrip line and a tri-plate type strip line, but the transmission line portion is not limited to such.

[0239] The resin multilayer substrate and the electronic device of the present invention can also be provided in the following various manners.

[0240] <1>

[0241] A resin multilayer substrate includes a resin laminate formed by laminating a plurality of resin layers including resin layers formed with conductor patterns.

[0242] The resin laminate has a first region, a second region, and a third region as a region between the first region and the second region, as a layer direction region.

[0243] When the average thickness of the first region of the resin laminate is represented by T1, the average thickness of the second region of the resin laminate is represented by T2, and the average thickness of the third region of the resin laminate is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2.

[0244] The resin multilayer substrate includes:

[0245] A first resin member (protective film) covering from the surface of the first region to the third region; and

[0246] A second resin member (reinforcing member) formed in the third region,

[0247] The second resin member covers a part of the first resin member and covers the end portion of the first resin member present in the third region.

[0248] When the Young's modulus of the first resin member is represented by E1 and the Young's modulus of the second resin member is represented by E2, they are in the relationship of E1 < E2.

[0249] When the adhesion force between the first resin member and the resin laminate is represented by AD1 and the adhesion force between the second resin member and the resin laminate is represented by AD2, they are in the relationship of AD2 ≥ AD1.

[0250] <2>

[0251] In the resin multilayer substrate described in <1>,

[0252] The second resin material covers the first resin material from an end portion of the first resin material to the first region.

[0253] <3>

[0254] exist <1> or <2> In the resin multilayer substrate described,

[0255] The third region is a region where the thickness of the resin laminate is divided into multiple stages.

[0256] The second resin member covers the first resin member from the end of the first resin member located in a given section of the third region to an upper portion of the third region that is one section higher than the given section, or from the end of the first resin member to the first region.

[0257] <4>

[0258] exist <1> to <3> In the resin multilayer substrate described in any one of the items,

[0259] The second resin material covers the side surface of the second region to a position higher than the thickness of the first region.

[0260] <5>

[0261] exist <4> In the resin multilayer substrate described,

[0262] The adhesion force between the second resin member and the side surface of the second region is greater than the adhesion force between the second resin member and the upper surface of the third region.

[0263] <6>

[0264] exist <4> or <5> In the resin multilayer substrate described,

[0265] The second resin material covers the conductive pattern reaching the side surface portion of the second region.

[0266] <7>

[0267] exist <1> to <6> In the resin multilayer substrate described in any one of the items,

[0268] The resin multilayer substrate includes a third resin member covering the upper surface of the second region.

[0269] The end portion of the third resin member and the second resin member are arranged in a non-contact positional relationship with each other.

[0270] <8>

[0271] exist <1> to <6> In the resin multilayer substrate described in any one of the items,

[0272] The resin multilayer substrate includes a third resin member formed on a side surface of the second region.

[0273] The second resin material covers an end portion of the third resin material on a side surface of the second region.

[0274] <9>

[0275] exist <1> to <6> In the resin multilayer substrate described in any one of the items,

[0276] The resin multilayer substrate includes a third resin member covering the upper surface of the second region.

[0277] The second resin material covers an end portion of the third resin material on the upper surface of the second region.

[0278] <10>

[0279] An electronic device having <1> to <9> The resin multilayer substrate and the electronic component mounted on the resin multilayer substrate as described in any one of the above, or <1> to <9> The resin multilayer substrate according to any one of the above and another substrate on which the resin multilayer substrate is mounted.

[0280] <11>

[0281] An electronic device having <1> to <9> A resin multilayer substrate as described in any one of the above and a housing in which the resin multilayer substrate is incorporated.

Claims

1. A resin multi-layer substrate includes a resin laminate formed by laminating a plurality of resin layers including resin layers formed with conductor patterns. The resin laminate has a first region, a second region, and a third region as a region between the first region and the second region. As a layer-direction region, when the average thickness of the first region of the resin laminate is represented by T1, the average thickness of the second region of the resin laminate is represented by T2, and the average thickness of the third region of the resin laminate is represented by T3, these thicknesses are in the relationship of T3 < T1 < T2. The resin multi-layer substrate includes: a first resin member covering from the surface of the first region to the third region; and a second resin member formed in the third region, the second resin member covering a part of the first resin member and covering an end portion of the first resin member present in the third region. When the Young's modulus of the first resin member is represented by E1 and the Young's modulus of the second resin member is represented by E2, they are in the relationship of E1 < E2. When the adhesion force between the first resin member and the resin laminate is represented by AD1 and the adhesion force between the second resin member and the resin laminate is represented by AD2, they are in the relationship of AD2 ≥ AD1.

2. The resin multi-layer substrate according to claim 1, wherein the second resin member covers the first resin member from the end portion of the first resin member to the first region.

3. The resin multi-layer substrate according to claim 1 or 2, wherein the third region is a region where the thickness of the resin laminate is divided into multiple segments, the second resin member covers the first resin member from the end portion of the first resin member located in a given segment of the third region to an upper portion of the third region that is one or more segments higher than the given segment, or from the end portion of the first resin member to the first region.

4. The resin multi-layer substrate according to any one of claims 1 to 3, wherein the second resin member covers the side surface portion of the second region to a position higher than the thickness of the first region.

5. The resin multi-layer substrate according to claim 4, wherein the adhesion force between the second resin member and the side surface of the second region is greater than the adhesion force between the second resin member and the upper surface of the third region.

6. The resin multi-layer substrate according to claim 4 or 5, wherein the second resin member covers the conductor pattern reaching the side surface portion of the second region.

7. The resin multi-layer substrate according to any one of claims 1 to 6, wherein the resin multi-layer substrate includes a third resin member covering the upper surface of the second region, the end portion of the third resin member and the second resin member are respectively arranged in a non-contact positional relationship.

8. The resin multi-layer substrate according to any one of claims 1 to 6, wherein the resin multi-layer substrate includes a third resin member formed on the side surface of the second region, the second resin member covers the end portion of the third resin member on the side surface of the second region. [[ID= The resin multilayer substrate includes a third resin member covering the upper surface of the second region. The second resin material covers an end portion of the third resin material on the upper surface of the second region.

10. An electronic device comprising the resin multilayer substrate according to any one of claims 1 to 9 and an electronic component mounted on the resin multilayer substrate, or comprising the resin multilayer substrate according to any one of claims 1 to 9 and another substrate on which the resin multilayer substrate is mounted. 11 . An electronic device comprising the resin multilayer substrate according to claim 1 and a case in which the resin multilayer substrate is incorporated.

Images