Thermal fatigue life reliability evaluation method of thermal interface material

Abstract

The embodiment of the invention provides a thermal fatigue life reliability evaluation method for a thermal interface material, and the method comprises the steps: applying a boundary condition and a temperature load to a thermal interface material simulation model, and appointing the physical quantity of the thermal interface material, which needs to be output by the thermal interface material simulation model, so as to enable the thermal interface material simulation model to carry out simulation; and determining the thermal fatigue life reliability of the thermal interface material in the preset temperature change range according to the simulation result. Through the embodiment of the invention, the problems of long time consumption and high cost caused by the fact that the thermal fatigue life reliability evaluation of the thermal interface material depends on the real reliability test after chip packaging in the related technology are solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of thermal interface materials, and more specifically, to a method for evaluating the thermal fatigue life reliability of thermal interface materials. Background Art

[0002] With the increasing complexity of chip packaging and the diversification of working environments, the stability and reliability requirements of chip packaging are becoming increasingly higher. Thermal interface materials (TIM) play a key role in chip packaging. They are located between the heating element and the heat sink and are used to effectively transfer heat to ensure that the chip operates within the normal operating temperature range. However, since the chip is constantly affected by temperature changes during operation, long-term alternation of high and low temperatures will cause thermal fatigue damage, thereby affecting the reliability of the package. Among them, the physical properties of the thermal interface material in the packaging structure may degrade after experiencing multiple temperature cycles, resulting in reduced bonding strength. This degradation is particularly evident under cyclic thermal loads, because the thermal expansion coefficients of different materials are different, which can easily lead to thermal fatigue failure of the thermal interface material.

[0003] Currently, thermal fatigue reliability assessments of thermal interface materials are mostly based on experimental data, employing accelerated temperature cycling tests to simulate the temperature variations experienced in actual operating environments. However, reliability testing requires completion of chip packaging, preventing early identification of risks during the design phase. Furthermore, testing is time-consuming and costly, and the cost of corrective measures after identifying any issues is prohibitive.

[0004] Therefore, developing a more accurate, efficient and comprehensive evaluation method to identify the reliability risks of thermal interface materials in advance during the package design stage is of great significance for improving the reliability of chip packaging, extending its service life and reducing product development costs. Summary of the Invention

[0005] An embodiment of the present application provides a method for evaluating the thermal fatigue life reliability of a thermal interface material, so as to at least solve the problem in the related art that the thermal fatigue life reliability evaluation of the thermal interface material depends on the actual reliability test after the chip packaging is completed, which results in a long time and high cost.

[0006] According to one embodiment of the present application, a method for evaluating the thermal fatigue life reliability of a thermal interface material is provided, comprising: applying boundary conditions and temperature loads to a thermal interface material simulation model, specifying physical quantities of the thermal interface material that the thermal interface material simulation model needs to output, so that the thermal interface material simulation model performs simulation; and determining the thermal fatigue life reliability of the thermal interface material within a preset temperature variation range based on the simulation results.

[0007] According to another embodiment of the present application, a computer-readable storage medium is provided, in which a computer program is stored. The computer program is configured to execute the steps in the above method embodiment when running.

[0008] According to another embodiment of the present application, an electronic device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in the above method embodiment.

[0009] According to another embodiment of the present application, a computer program product is provided, including a computer program, which implements the steps in the above method embodiment when executed by a processor.

[0010] A thermal interface material simulation model is used in the embodiment of the present application, which can significantly reduce costs and testing time compared to the traditional evaluation of the reliability of thermal interface materials through physical experiments. Specifically, by applying boundary conditions and temperature loads to the thermal interface material simulation model, the simulation model can accurately reflect the key physical quantities of the thermal interface material under temperature cycles. Based on the simulation results of the thermal interface material, the thermal fatigue life of the thermal interface material within a preset temperature variation range can be evaluated, that is, the time during which the material can maintain its functional integrity under specific temperature cycle conditions. This makes it possible to evaluate the reliability of the thermal interface material in the packaging design stage, avoiding the risk of failure caused by thermal fatigue after the packaging is completed. It solves the problem in the related art that the reliability evaluation of the thermal fatigue life of the thermal interface material depends on the actual reliability test after the chip packaging is completed, which is time-consuming and costly. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a hardware structure block diagram of a computer terminal according to a method for evaluating the thermal fatigue life reliability of a thermal interface material according to an embodiment of the present application;

[0012] Figure 2 is a flow chart of a method for evaluating the thermal fatigue life reliability of a thermal interface material according to an embodiment of the present application;

[0013] Figure 3 is a finite element three-dimensional structure simulation model according to an embodiment of the present application;

[0014] Figure 4 is a stress-strain curve according to an embodiment of the present application;

[0015] Figure 5 is a structural block diagram of a device for evaluating the thermal fatigue life reliability of a thermal interface material according to an embodiment of the present application;

[0016] Figure 6is a schematic diagram of the chip structure according to an embodiment of the present application;

[0017] Figure 7 This is a flow chart of a method for evaluating the thermal fatigue life reliability of a thermal interface material according to yet another embodiment of the present application. DETAILED DESCRIPTION

[0018] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0019] It should be noted that the terms "first", "second", etc. in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0020] The method embodiments provided in the embodiments of the present application can be executed in a mobile terminal, a computer terminal or a similar computing device. Taking running on a computer terminal as an example, Figure 1 This is a hardware structure block diagram of a computer terminal according to the thermal fatigue life reliability evaluation method of the thermal interface material of the embodiment of the present application. Figure 1 As shown, the computer terminal may include one or more ( Figure 1 Only one is shown) a processor 102 (the processor 102 may include but is not limited to a microprocessor MCU or a programmable logic device FPGA and other processing devices) and a memory 104 for storing data. The computer terminal may also include a transmission device 106 and an input / output device 108 for communication functions. It will be understood by those skilled in the art that Figure 1 The structure shown is only for illustration and does not limit the structure of the above-mentioned computer terminal. For example, the computer terminal may also include Figure 1 More or fewer components than shown, or with Figure 1 Different configurations shown.

[0021] The memory 104 can be used to store computer programs, for example, software programs and modules of application software, such as the computer program corresponding to the thermal fatigue life reliability assessment method of the thermal interface material in the embodiment of the present application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, that is, to implement the above-mentioned method. The memory 104 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include a memory remotely located relative to the processor 102, and these remote memories may be connected to the computer terminal via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0022] The transmission device 106 is used to receive or transmit data via a network. A specific example of the aforementioned network may include a wireless network provided by a communications provider of a computer terminal. In one embodiment, the transmission device 106 includes a network interface controller (NIC), which can be connected to other network devices via a base station to enable communication with the Internet. In another embodiment, the transmission device 106 may be a radio frequency (RF) module, which is used to communicate with the Internet wirelessly.

[0023] In this embodiment, a method for evaluating the thermal fatigue life reliability of a thermal interface material running on the above-mentioned computer terminal is provided. Figure 2 Flowchart of the thermal fatigue life reliability evaluation method of the thermal interface material according to the embodiment of the present application. Figure 2 As shown, the process includes the following steps:

[0024] Step S202 , applying boundary conditions and temperature loads to the thermal interface material simulation model, and specifying physical quantities of the thermal interface material to be output by the thermal interface material simulation model, so that the thermal interface material simulation model performs simulation.

[0025] In one embodiment, the step of simulating the thermal interface material simulation model includes applying certain boundary conditions to the chip on the thermal interface material simulation model, applying a temperature load to the chip under the applied boundary conditions, and specifying the physical quantity of the thermal interface material that the thermal interface material needs to output.

[0026] In an exemplary embodiment of the present application, the boundary conditions include symmetric boundary conditions and clamped boundary conditions, and the temperature load is consistent with the temperature range of the actual reliability test of the product.

[0027] In one embodiment, symmetric boundary conditions are used to simplify computations and improve efficiency in chip package simulations. Specifically, if the package structure exhibits symmetry about a particular axis or plane, the model can be simplified to include symmetrical parts, such as 1 / 4, 1 / 2, or 1 / 8 symmetrical models. Symmetric boundary conditions ensure that physical quantities such as displacement, stress, or temperature on one side or edge of the model correspond to those on the other side of the symmetry plane or axis. This not only reduces computational resource consumption but also ensures the accuracy of simulation results.

[0028] In one embodiment, clamped boundary conditions are defined to prevent any displacement at certain parts of the model. This is typically used to simulate the connection between a package structure and an external frame or substrate. Clamped boundary conditions ensure model stability during simulation and prevent unrealistic results caused by excessive displacement at the boundary.

[0029] In one embodiment, the temperature load setting in the simulation model must closely match the temperature cycle range that the product actually experiences. This includes determining the upper and lower limits of the temperature cycle, the number of cycles, the cycle rate, and any nonlinear or discontinuous temperature changes. Ensuring the consistency of the temperature load with the actual reliability test conditions can make the simulation results closer to the real environment and improve the credibility of the assessment. The traditional static temperature load setting is expanded to dynamic adjustment, that is, the temperature load is optimized in space and time according to the thermal conduction path and heat dissipation characteristics of the packaging structure. For example, considering the uneven heat distribution in different areas of the chip during operation, the temperature load of the local area can be set to be more in line with the actual situation, thereby more accurately predicting the thermal fatigue behavior of the thermal interface material.

[0030] In an exemplary embodiment of the present application, before applying boundary conditions and temperature loads to the thermal interface material simulation model, it also includes: constructing a thermal interface material simulation model based on the chip packaging structure, material parameters of the thermal interface material used by the chip, and packaging reliability test conditions.

[0031] In an exemplary embodiment of the present application, the thermal interface material simulation model is a finite element three-dimensional structure simulation model, including a plurality of discrete units formed by division.

[0032] In one embodiment, in the process of establishing a finite element three-dimensional structural simulation model, the packaging structure is divided into many small discrete units, that is, meshing. These units constitute the "skeleton" of the model, and each unit has its own physical properties, such as material properties, geometric dimensions, and boundary conditions. Through meshing, the complex packaging structure is decomposed into thousands of simple small units, each of which can be independently subjected to heat conduction and thermodynamic analysis. The size and shape of the unit can be optimized based on the accuracy requirements and computational efficiency of the analysis. In areas of high stress or strain, the mesh units can be smaller; in areas where the temperature or stress changes are relatively gentle, the units can be larger to reduce the amount of calculation.

[0033] In one embodiment, the finite element three-dimensional structure simulation model is as follows Figure 3 As shown. Figure 3 In the figure, you can see that the model is divided into multiple small units, or meshes. This meshing is used to accurately calculate physical quantities such as stress and strain in each small area during finite element analysis. The size and shape of the mesh are adjusted based on the required accuracy and computational efficiency. Typically, a finer mesh is used at structural boundaries or areas of stress concentration.

[0034] Step S204 , determining the thermal fatigue life reliability of the thermal interface material within a preset temperature variation range according to the simulation results.

[0035] In an exemplary embodiment of the present application, the thermal fatigue life reliability of the thermal interface material within a preset temperature variation range is determined based on simulation results, including: determining the maximum value of the equivalent plastic strain of the thermal interface material based on the simulation results; determining the coverage degradation value of the thermal interface material after a preset number of temperature cycles based on a coverage degradation calculation formula of the thermal interface material, the maximum value of the equivalent plastic strain and a preset number of temperature cycles of the thermal interface material; and determining the thermal fatigue life reliability of the thermal interface material based on the coverage degradation value.

[0036] It should be noted that the coverage degradation value can directly reflect the degree of degradation of the thermal interface material performance with temperature cycling. A low coverage degradation value means that the thermal interface material maintains good performance after experiencing temperature cycling, and the thermal conduction efficiency and stability of the packaging structure are high, which further indicates that the thermal fatigue life reliability of the thermal interface material is high.

[0037] In an exemplary embodiment of the present application, the maximum value of the equivalent plastic strain of the thermal interface material is determined based on the simulation results, including: determining the equivalent plastic strain distribution cloud map of the thermal interface material based on the simulation results; determining the area with the maximum reliability risk of the thermal interface material based on the equivalent plastic strain distribution cloud map, and determining the maximum value of the equivalent plastic strain based on the area with the maximum reliability risk.

[0038] In one embodiment, the maximum value of the equivalent plastic strain, ΔPEEQ, is substituted into formula (1), where C is the degradation rate, which represents the degradation of the thermal interface material coverage relative to the initial state after the reliability test, expressed in %. K1 and K2 are coefficients. For example, if the reliability test temperature cycle number is specified as 500 cycles, then N = 500. Substituting the ΔPEEQ obtained by simulation, if C = 10 is calculated, this means that after 500 temperature cycles, the TIM coverage of the chip has degraded by 10% relative to the initial state.

[0039]

[0040] In one embodiment, the equivalent plastic strain distribution cloud map is a visualization tool commonly used in finite element analysis to display the plastic strain distribution of a material when it is subjected to stress. The equivalent plastic strain distribution cloud map is a color-coded graphical representation method, in which different colors represent different equivalent plastic strain values. Typically, the colors gradually change from cold colors (such as blue) to hot colors (such as red), indicating a change in strain value from low to high. In the equivalent plastic strain distribution cloud map, the color of each discrete unit (i.e., a small unit in the finite element mesh) represents the equivalent plastic strain value of the unit. By observing the cloud map, it is easy to identify areas in the thermal interface material where strain is concentrated or severely damaged. These areas are usually displayed as darker or brighter areas, indicating that they may become the starting point of thermal fatigue failure. In the thermal fatigue reliability assessment of thermal interface materials, the equivalent plastic strain distribution cloud map is particularly important, and it can intuitively understand the degree of damage and damage distribution of the thermal interface material when it undergoes temperature cycling.

[0041] Equivalent plastic strain refers to the total strain accumulated during the plastic deformation phase of a material. Regardless of the stress state causing this deformation, equivalent plastic strain normalizes the plastic strain in all directions and expresses it as a scalar value. During temperature cycling, thermal interface materials experience plastic strain in different regions due to differences in their thermal expansion coefficients and thermal cycling loads. This accumulated strain can accelerate material aging and damage.

[0042] In an exemplary embodiment of the present application, material parameters of the thermal interface material are determined according to a stress-strain curve of the thermal interface material, wherein the material parameters cover elastic-plastic parameters within a temperature range of a package reliability test.

[0043] Material parameters, including but not limited to elastic modulus, Poisson's ratio, yield strength, and coefficient of thermal expansion, are crucial for constructing finite element models. In particular, elastic-plastic parameters encompass the material's behavior during elastic and plastic deformation stages, which are crucial for understanding damage accumulation and reliability degradation of thermal interface materials during temperature cycling.

[0044] In an exemplary embodiment of the present application, a stress-strain curve is used to indicate the transition of the thermal interface material from the elastic region to the plastic region, the elastic modulus, the yield point, and the stress-strain relationship in the plastic region.

[0045] In one embodiment, the stress-strain curve is as follows Figure 4As shown. The stress-strain curve can be divided into several key stages: the elastic stage, in this stage, there is a linear relationship between stress and strain, which is expressed as a straight line. The elastic modulus of the material can be directly calculated from the slope of the curve. The elastic modulus reflects the material's ability to resist elastic deformation; the yield point, the stress-strain curve begins to deviate from the linear relationship, indicating that the material begins to enter the plastic deformation stage. The yield point is usually defined by a specific stress value, which corresponds to the beginning of permanent deformation of the material; the plastic stage, after this stage, the increase in stress is no longer proportional to the strain, and the material exhibits plastic flow or permanent deformation. Plastic parameters, such as plastic modulus and hardening curve, can be extracted from the shape of the curve in the plastic stage. They describe the behavior of the material after exceeding the elastic limit; final failure, as the strain increases, the material will eventually reach a point beyond which the material will no longer be able to maintain its structural integrity, resulting in fracture or failure. Although this point may not be reached in thermal fatigue assessment, it defines the ultimate performance of the material.

[0046] Because the performance of thermal interface materials varies with temperature, material parameters covering the entire package reliability testing temperature range must be used when building simulation models. This means that the material's elastic modulus, Poisson's ratio, thermal expansion coefficient, and other parameters should be accurately measured or experimentally determined at low, room, and high temperatures and then input into the simulation software. Using these temperature-dependent parameters in the model ensures that the simulation results accurately reflect the behavior of the thermal interface material under actual thermal cycling conditions, thereby providing a more accurate assessment of the thermal fatigue reliability of the thermal interface material.

[0047] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk), and includes a number of instructions for enabling a terminal device (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in each embodiment of the present application.

[0048] This embodiment also provides a device for evaluating the thermal fatigue life reliability of a thermal interface material. This device is used to implement the above-mentioned embodiments and preferred implementations, and details already described will not be repeated. As used below, the term "module" may refer to a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation using hardware, or a combination of software and hardware, is also possible and contemplated.

[0049] Figure 5 is a structural block diagram of a device for evaluating the thermal fatigue life reliability of a thermal interface material according to an embodiment of the present application. Figure 5 As shown, the device includes a simulation module 10 and a determination module 20.

[0050] The simulation module 10 is used to apply boundary conditions and temperature loads to the thermal interface material simulation model, and specify the physical quantities of the thermal interface material to be output by the thermal interface material simulation model, so that the thermal interface material simulation model performs simulation;

[0051] The determination module 20 is used to determine the thermal fatigue life reliability of the thermal interface material within a preset temperature variation range according to the simulation results.

[0052] It should be noted that the above modules can be implemented through software or hardware. For the latter, it can be implemented in the following ways, but not limited to: the above modules are all located in the same processor; or the above modules are located in different processors in any combination.

[0053] In order to facilitate the understanding of the technical solutions provided by the application embodiments, the embodiments are described below in conjunction with specific scenarios.

[0054] The thermal interface material in the embodiment of the present application plays a key role in chip packaging. The thermal interface material is located between the heat-generating element and the heat sink and is used to effectively transfer heat to ensure that the chip operates within the normal operating temperature range. Figure 6 is a schematic diagram of the chip structure according to an embodiment of the present application, such as Figure 6 As shown, 1 is the lid, 2 is the thermal interface material (TIM), 3 is the die, 4 is the underfill, 5 is the bump, 6 is the substrate, 7 is the solder ball, and 8 is the printed circuit board (PCB).

[0055] Figure 7 FIG. 1 is a flow chart of a method for evaluating the thermal fatigue life reliability of a thermal interface material according to another embodiment of the present application. Figure 7 As shown, the process includes the following steps:

[0056] Step S701, determining the chip structure size;

[0057] Step S702, establishing a simulation model according to the actual chip structure and specifications;

[0058] Step S703, determining material parameters;

[0059] Step S704, determining a fixed, symmetrical boundary;

[0060] Step S705 , applying a temperature load according to actual reliability test specifications;

[0061] Step S706, determining whether the simulation calculation is error-free;

[0062] Specifically, if the judgment result is yes, proceed to step S707, and if the judgment result is no, proceed to step S708;

[0063] Step S707, determining the maximum value of the equivalent plastic strain of the thermal interface material;

[0064] Step S708, check whether the network, material parameters, boundaries, and loads are correct;

[0065] Step S709, calculating the thermal interface material degradation rate;

[0066] Step S710, determining whether the chip meets reliability specifications;

[0067] Step S711: design optimization and simulation iterative analysis.

[0068] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above method embodiments when run.

[0069] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0070] An embodiment of the present application further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps in any one of the above method embodiments.

[0071] In an exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor, and the input / output device is connected to the processor.

[0072] For specific examples in this embodiment, reference may be made to the examples described in the above embodiments and exemplary implementation modes, and this embodiment will not be described in detail here.

[0073] The embodiments of the present application can predict and evaluate the reliability of the product during the product design and development stage without the need for a large number of actual physical experiments, thereby significantly shortening the evaluation cycle. Rapid iterative optimization of the design can be achieved. Through simulation technology, potential problems in the product design can be quickly discovered, and iterative optimization can be performed to improve the reliability of the product. The embodiments of the present application use simulation methods to determine the reliability of the thermal interface material, which can make up for the shortcomings of the experimental method with long cycles and high costs. Most existing evaluation methods focus on qualitative descriptions of thermal fatigue damage, and it is difficult to accurately predict the thermal fatigue life and reliability of electronic packaging structures. The embodiments of the present application can obtain the fatigue life of the thermal interface material through simulation.

[0074] Obviously, those skilled in the art should understand that the modules or steps of the present application described above can be implemented using a general-purpose computing device, they can be concentrated on a single computing device, or distributed across a network composed of multiple computing devices, they can be implemented using program code executable by the computing device, and thus, they can be stored in a storage device and executed by the computing device, and in some cases, the steps shown or described can be performed in a different order than herein, or they can be fabricated into separate integrated circuit modules, or multiple modules or steps can be fabricated into a single integrated circuit module for implementation. Thus, the present application is not limited to any specific combination of hardware and software.

[0075] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the principles of the present application shall be included within the scope of protection of the present application.

Claims

1. A method for evaluating the thermal fatigue life reliability of a thermal interface material, characterized in that: include: Applying boundary conditions and temperature loads to the thermal interface material simulation model, and specifying physical quantities of the thermal interface material to be output by the thermal interface material simulation model, so that the thermal interface material simulation model performs simulation; The thermal fatigue life reliability of the thermal interface material within a preset temperature variation range is determined based on the simulation results.

2. The method according to claim 1, characterized in that The boundary conditions include symmetrical boundary conditions and clamped boundary conditions, and the temperature load is consistent with the temperature range of the actual reliability test of the product.

3. The method according to claim 1, characterized in that Determining the thermal fatigue life reliability of the thermal interface material within the preset temperature variation range according to the simulation results includes: Determining the maximum value of the equivalent plastic strain of the thermal interface material according to the simulation results; Determining a coverage degradation value of the thermal interface material after a preset number of temperature cycles according to a coverage degradation calculation formula of the thermal interface material, the maximum value of the equivalent plastic strain, and a preset number of temperature cycles of the thermal interface material; The thermal fatigue life reliability of the thermal interface material is determined according to the coverage degradation value.

4. The method according to claim 3, characterized in that Determining the maximum value of the equivalent plastic strain of the thermal interface material according to the simulation results includes: Determine an equivalent plastic strain distribution cloud diagram of the thermal interface material according to the simulation results; The area with the maximum reliability risk of the thermal interface material is determined according to the equivalent plastic strain distribution cloud map, and the maximum value of the equivalent plastic strain is determined according to the area with the maximum reliability risk.

5. The method according to claim 1, wherein Before applying boundary conditions and temperature loads to the thermal interface material simulation model, the following steps are also included: The thermal interface material simulation model is constructed according to the chip packaging structure, the material parameters of the thermal interface material used in the chip, and the packaging reliability test conditions.

6. The method according to claim 1, characterized in that The method further comprises: The material parameters of the thermal interface material are determined according to the stress-strain curve of the thermal interface material, wherein the material parameters cover elastic-plastic parameters within the temperature range of the packaging reliability test.

7. The method according to claim 6, characterized in that in, The stress-strain curve is used to indicate the transition of the thermal interface material from the elastic region to the plastic region, the elastic modulus, the yield point, and the stress-strain relationship in the plastic region.

8. The method according to claim 1, characterized in that in, The thermal interface material simulation model is a finite element three-dimensional structure simulation model, including a plurality of discrete units formed by division.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 8 are implemented.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 8 are implemented.

11. A computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 8 are implemented.

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