Cleaning device for aviation monocrystalline silicon material part production

Abstract

The invention provides a cleaning device for aviation monocrystalline silicon material part production, and relates to the technical field of monocrystalline silicon cleaning devices.The cleaning device comprises an ultrasonic cleaning machine and a protective cover, a driving motor is arranged at the bottom of the ultrasonic cleaning machine, and a main driving rod is fixedly installed at the end of an output shaft of the driving motor; the main driving rod is sleeved with a silicon wafer driving disc and a silicon wafer bearing disc in a sliding mode, the silicon wafer bearing disc is located above the silicon wafer driving disc, at least two flow guide spiral pipes are fixedly installed in the silicon wafer driving disc, the lower end of each flow guide spiral pipe protrudes out of the lower portion of the silicon wafer driving disc, and energy is transmitted through cleaning liquid. Liquid molecules are forced to vibrate to generate periodic positive and negative pressure waves, when the negative pressure waves exceed the tensile strength of liquid, cavitation bubbles are formed, the surfaces of parts are scoured through movement of a main body, remaining bubbles are guided through a flow guide groove in a flow guide spiral pipe, the cavitation bubbles flow directionally, scouring on the surfaces of the parts is enhanced, and the cleaning uniformity is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of single crystal silicon cleaning devices, and more specifically, relates to a cleaning device for producing aviation single crystal silicon material parts. Background Art

[0002] In the field of aviation manufacturing, single-crystal silicon materials are widely used in the manufacture of key components such as high-precision sensors, optical components, and semiconductor devices due to their excellent mechanical properties, thermal stability, and chemical inertness. However, single-crystal silicon components are susceptible to contamination by processing residues (such as cutting fluids, metal particles, organic pollutants) and environmental particles during the production process. These pollutants can seriously affect the surface quality, optical performance, and long-term reliability of the components. Therefore, the cleaning process has become a key link in the production of single-crystal silicon components: Traditional devices have the following limitations: Insufficient cleaning uniformity: The movement of cavitation bubbles in the cleaning fluid is highly random, making it difficult to achieve uniform flushing of the silicon wafer surface, resulting in incomplete cleaning of some areas. Aviation single-crystal silicon components often have complex micro-groove structures (such as gyroscope chip grooves). The cavitation bubble movement of existing equipment is highly random, making it difficult to achieve directional flushing, resulting in residual pollutants in the microstructure and affecting the electrical performance of the components.

[0003] Low cleaning efficiency: The cleaning fluid is prone to static stratification, and the cavitation bubbles are unevenly distributed. The cleaning effect on the groove structure on the surface of the silicon wafer is poor, and the cleaning time is long. The cleaning fluid is prone to static stratification on the surface of aviation parts, and the cavitation bubbles are unevenly distributed. The cleaning rate for micro-grooves with a depth-to-width ratio greater than 5:1 is less than 60%, and repeated cleaning is required, which extends the production cycle.

[0004] Insufficient stability and safety of silicon wafers: Existing devices cannot effectively fix silicon wafers. Silicon wafers are prone to shaking or falling off during cleaning, posing a risk of damage. Aviation parts are prone to falling off due to inertia during high-speed rotation cleaning. The existing fixing structure cannot adapt to silicon wafers of different sizes (such as Φ100mm~Φ300mm wafers), posing a risk of collision and breakage.

[0005] High maintenance cost: Impurities generated during the cleaning process are easily attached to the cleaning parts. There is a lack of automatic cleaning mechanism, and frequent manual maintenance is required. Nano-silicon powder generated during cleaning is easily embedded in cleaning parts (such as bristles). The manual cleaning frequency is ≥3 times / day, and downtime for maintenance affects the continuity of aviation device production.

[0006] Risk of rigid damage: Cleaning components are in direct rigid contact with silicon wafers, which can easily cause scratches or micro-damage to the surface of the silicon wafer, affecting product yield. Aviation single-crystal silicon is highly brittle (Mohs hardness 7.0), and rigid contact can easily lead to surface micro-cracks (depth > 0.5μm), reducing the fatigue life of components. Summary of the Invention

[0007] In order to solve the above technical problems, the present invention provides a cleaning device for the production of aviation single crystal silicon material parts to solve the above problems.

[0008] A cleaning device for the production of aviation single crystal silicon material parts includes an ultrasonic cleaning machine and a protective cover. A driving motor is provided at the bottom of the ultrasonic cleaning machine, and a main driving rod is fixedly installed at the end of the output shaft of the driving motor. The outer sliding sleeve of the main driving rod is provided with a silicon wafer driving disk and a silicon wafer supporting tray. The silicon wafer supporting tray is located above the silicon wafer driving disk. At least two guide spiral tubes are fixedly installed inside the silicon wafer driving disk, and the lower end of each guide spiral tube protrudes below the silicon wafer driving disk, and the top of each guide spiral tube is flush with the upper surface of the silicon wafer driving disk. At least two cavitation bubble diffusion holes are opened inside the silicon wafer supporting tray, and each of the cavitation bubble diffusion holes is located directly above the guide spiral tube. The silicon wafer supporting tray is used to support the silicon wafer. When the ultrasonic cleaning machine performs ultrasonic cleaning, the cleaning liquid inside the ultrasonic cleaning machine will generate an upward water flow through the guide spiral tube. At least two silicon wafer side brush racks are provided inside the ultrasonic cleaning machine, and the silicon wafer side brush racks are used to swing and clean the side surfaces of the silicon wafer.

[0009] Preferably, an assembly frame is fixedly installed on the surface of the main driving rod, and the assembly frame is close to the bottom of the cleaning chamber of the ultrasonic cleaning machine. Positioning frames are fixedly installed on the left and right sides of the assembly frame. A micro motor is fixedly installed on the top of each positioning frame. A screw rod is fixedly installed on the end of the output shaft of each micro motor. Each screw rod slides through the silicon wafer drive disk and the silicon wafer support tray. The two micro motors can drive the silicon wafer drive disk and the silicon wafer support tray to move upward or downward inside the ultrasonic cleaning machine through the screw rod.

[0010] Preferably, the side walls of the silicon wafer drive disk and the silicon wafer support tray are equidistantly provided with at least two side grooves, and a scraper is fixedly installed on the side wall of each side groove. When the silicon wafer drive disk and the silicon wafer support tray move up or down, the scraper can assist in cleaning the silicon wafer side brush rack. The inner wall of each guide spiral tube is provided with two guide grooves, the opening of each cavitation bubble diffusion hole is larger than the guide spiral tube, and the spiral direction of the guide groove inside the guide spiral tube is opposite to the rotation direction of the silicon wafer drive disk. At least two anti-slip pads are fixedly installed on the surface of the silicon wafer support tray, and at least two silicon wafer protection baffles are fixedly installed on the surface of the silicon wafer support tray close to the side wall, and each silicon wafer protection baffle is located between the two side grooves.

[0011] Preferably, a vibration frame is movably installed inside each of the silicon wafer side brush holders, a flexible brush is fixedly installed on the side wall of each of the vibration holders, each of the flexible brushes is used to clean the side of the silicon wafer, and a sliding groove is provided on the left and right side walls of each of the silicon wafer side brush holders. A T-shaped limit frame is fixedly installed on the left and right inner walls of each of the silicon wafer side brush holders, and each T-shaped limit frame is located inside the sliding groove, and each T-shaped limit frame is used to limit the movement range of the silicon wafer side brush holder.

[0012] Preferably, a vibrator is fixedly installed at the bottom of the inner wall of each silicon wafer side brush holder, the output end of each vibrator is connected to the bottom of the vibration holder, a spring is fixedly installed between the top of each vibration holder and the top of the silicon wafer side brush holder, and a limiting round rod is fixedly installed near the upper third of each silicon wafer side brush holder. The back of each vibration holder is arc-shaped, and the back of the vibration holder is in fit with the limiting round rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects: Improve cleaning uniformity: The guide groove of the guide spiral tube guides the cavitation bubbles to flow in a directional manner, enhancing the flushing effect on the silicon wafer surface and significantly improving cleaning uniformity.

[0014] Improve cleaning efficiency: The rotation of the silicon wafer breaks the static stratification of the cleaning liquid, making the cavitation bubbles more evenly distributed, effectively improving the cleaning effect of the micro-groove structure on the silicon wafer surface and shortening the cleaning cycle.

[0015] Ensure silicon wafer stability: The coordinated design of the anti-slip pad and the silicon wafer protection baffle ensures that the silicon wafer remains stable during the cleaning process, preventing shaking or falling, and improving operational safety.

[0016] Reduce maintenance costs: The scraper automatically cleans impurities on the surface of the flexible brush of the wafer side brush holder, reducing the frequency of manual maintenance and extending the service life of core components.

[0017] Avoid surface damage: The flexible brush combined with the elastic vibration structure avoids rigid contact with the silicon wafer, protecting the surface integrity and electrical properties of the silicon wafer.

[0018] Enhanced automation: The coordinated lifting design of the silicon wafer drive plate and the silicon wafer tray simplifies the silicon wafer picking and placing process and improves operational convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic structural diagram of the ultrasonic cleaning machine of the present invention; Figure 2 This is a schematic diagram of the structure of the silicon wafer tray of the present invention; Figure 3 This is a schematic diagram of the main drive rod structure of the present invention; Figure 4 This is a schematic diagram of the structure of the silicon wafer drive disk of the present invention; Figure 5 It is a schematic structural diagram of the anti-slip mat of the present invention; Figure 6 This is a schematic diagram of the structure of the guide spiral tube of the present invention; Figure 7 This is a schematic diagram of the silicon wafer side brush holder structure of the present invention; Figure 8 It is a schematic diagram of the structure of the vibration frame of the present invention; Figure 9 This invention Figure 8 A is an enlarged structural diagram of FIG.

[0020] In the figure, the correspondence between the component names and the drawing numbers is: 1. Ultrasonic cleaning machine; 11. Protective cover; 12. Drive motor; 13. Assembly frame; 14. Positioning frame; 15. Micro motor; 16. Screw; 17. Silicon wafer drive disk; 18. Guide spiral tube; 19. Guide groove; 2. Silicon wafer support tray; 21. Anti-slip pad; 22. Side groove; 23. Scraper; 24. Cavitation bubble diffusion hole; 25. Silicon wafer protection baffle; 3. Silicon wafer side brush rack; 31. Vibrator; 32. Limiting round rod; 33. Vibration frame; 34. Flexible brush; 35. Spring; 36. Sliding groove; 37. Main drive rod; 38. T-shaped limit rack. DETAILED DESCRIPTION

[0021] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention but are not intended to limit the scope of the present invention.

[0022] See also Figures 1-9The present invention provides a cleaning device for the production of aviation single crystal silicon material parts, including an ultrasonic cleaning machine 1 and a protective cover 11. A driving motor 12 is provided at the bottom of the ultrasonic cleaning machine 1. A main driving rod 37 is fixedly installed at the end of the output shaft of the driving motor 12. A sliding sleeve outside the main driving rod 37 is provided with a silicon wafer driving disk 17 and a silicon wafer supporting tray 2. The silicon wafer supporting tray 2 is located above the silicon wafer driving disk 17. The silicon wafer to be cleaned is placed on the silicon wafer supporting tray 2, and the protective cover 11 is covered on the ultrasonic cleaning machine 1. The ultrasonic cleaning machine 1 is started, and the silicon wafer is ultrasonically cleaned in the ultrasonic cleaning machine 1. At least two guide spiral tubes 18 are fixedly installed inside the silicon wafer driving disk 17, and the lower end of each guide spiral tube 18 protrudes below the silicon wafer driving disk 17, and the top of each guide spiral tube 18 is fixedly installed. The upper part is flush with the upper surface of the silicon wafer drive disk 17. At least two cavitation bubble diffusion holes 24 are opened inside the silicon wafer support tray 2, and each cavitation bubble diffusion hole 24 is located directly above the guide spiral tube 18. The silicon wafer support tray 2 is used to support the silicon wafer. When the ultrasonic cleaning machine 1 performs ultrasonic cleaning, the cleaning liquid inside the ultrasonic cleaning machine 1 will generate an upward water flow through the guide spiral tube 18. The ultrasonic transducer in the ultrasonic cleaning machine 1 generates high-frequency vibration, and energy is transferred through the cleaning liquid. The liquid molecules are forced to vibrate to generate periodic positive and negative pressure waves. When the negative pressure wave exceeds the tensile strength of the liquid, cavitation bubbles are formed. The main body moves to flush the surface of the parts. The guide groove 19 inside the guide spiral tube 18 guides the remaining bubbles, so that the cavitation bubbles flow in a directional manner, thereby enhancing the flushing of the part surface and improving the uniformity of cleaning. At least two wafer side brush racks 3 are provided inside the ultrasonic cleaning machine 1 . The wafer side brush racks 3 are used to perform swing cleaning on the side surfaces of the silicon wafers.

[0023] In this embodiment, Figures 3 and 4 , an assembly rack 13 is fixedly installed on the surface of the main driving rod 37, and the assembly rack 13 is close to the bottom of the cleaning chamber of the ultrasonic cleaning machine 1, and positioning racks 14 are fixedly installed on the left and right sides of the assembly rack 13, and a micro motor 15 is fixedly installed on the top of each positioning rack 14, and a screw rod 16 is fixedly installed on the end of the output shaft of each micro motor 15, and each screw rod 16 slides through the silicon wafer drive disk 17 and the silicon wafer tray 2. The assembly rack 13, the positioning rack 14 and the micro motor 15 limit the silicon wafer drive disk 17 and the silicon wafer tray 2 as a whole, and the ultrasonic cleaning machine 1 is used to clean the silicon wafer. When the ultrasonic cleaning machine 1 cleans the silicon wafer, the drive motor 12 starts to drive the silicon wafer drive disk 17 and the silicon wafer holding tray 2 to rotate. The rotation of the silicon wafer drive disk 17 and the silicon wafer holding tray 2 will drive the silicon wafer to rotate. The rotation of the silicon wafer breaks the static stratification of the cleaning liquid and enhances the uniformity of the cavitation bubble distribution. The two micro motors 15 can drive the silicon wafer drive disk 17 and the silicon wafer holding tray 2 to move upward or downward inside the ultrasonic cleaning machine 1 through the screw rod 16. The upward movement of the silicon wafer drive disk 17 and the silicon wafer holding tray 2 can facilitate the user to place and take the silicon wafer, thereby improving the convenience of operation.

[0024] In this embodiment, Figures 4 to 6 The side walls of the silicon wafer drive disk 17 and the silicon wafer support tray 2 are equidistantly provided with at least two side grooves 22, and a scraper 23 is fixedly installed on the side wall of each side groove 22. The inner wall of each guide spiral tube 18 is provided with two guide grooves 19, and the opening of each cavitation bubble diffusion hole 24 is larger than the guide spiral tube 18. When the ultrasonic cleaning machine 1 performs ultrasonic cleaning on the silicon wafer, the cavitation bubbles flow through the cavitation bubble diffusion holes 24. The cavitation bubbles can cross the cavitation bubble diffusion holes 24 and impact the silicon wafer surface over a large area. The spiral direction of the guide groove 19 inside the guide spiral tube 18 is opposite to the rotation direction of the silicon wafer drive disk 17. When the silicon wafer drive disk 17 rotates, the guide spiral tube 18 A stable spiral flow is generated by the guide groove 19, and at least two anti-slip pads 21 are fixedly installed on the surface of the silicon wafer supporting tray 2. The anti-slip pads 21 on the upper surface of the silicon wafer supporting tray 2 fit with the silicon wafer. When the silicon wafer supporting tray 2 rotates, multiple anti-slip pads 21 can maintain the stability of the silicon wafer, prevent the silicon wafer from shaking, and improve the safety of cleaning multiple silicon wafers. At least two silicon wafer protection baffles 25 are fixedly installed on the surface of the silicon wafer supporting tray 2 close to the side wall, and each silicon wafer protection baffle 25 is located between the two side grooves 22. Each silicon wafer protection baffle 25 can play a side protection role for the silicon wafer, preventing the silicon wafer from falling when encountering resistance, thereby improving the safety of silicon wafer cleaning.

[0025] In this embodiment, Figure 2 、 3 , 4, 5 and 6. When the silicon wafer driving disk 17 and the silicon wafer supporting tray 2 move upward or downward, the scraper 23 can assist in cleaning the silicon wafer side brush holder 3. A vibration frame 33 is movably installed inside each silicon wafer side brush holder 3, and a flexible brush 34 is fixedly installed on the side wall of each vibration frame 33. When the silicon wafer driving disk 17 and the silicon wafer supporting tray 2 move upward or downward, the multiple scrapers 23 on the side wall of the silicon wafer driving disk 17 and the silicon wafer supporting tray 2 will fit with the flexible brush 34 on the side wall of the vibration frame 33. The multi-layer scraper 23 will scrape the flexible brush 34, effectively cleaning the impurities on the surface of the flexible brush 34, reducing the cost of manual maintenance, and effectively extending the cleaning life of the flexible brush 34.

[0026] In this embodiment, Figures 7 to 9, a vibrator 31 is fixedly installed at the bottom of the inner wall of each silicon wafer side brush rack 3, and each flexible brush 34 is used to clean the side of the silicon wafer. The output end of each vibrator 31 is connected to the bottom of the vibration rack 33. When the silicon wafer is cleaned in the ultrasonic cleaning machine 1, the vibrator 31 is started, and the vibration of the vibrator 31 drives the vibration rack 33 to vibrate. The flexible brush 34 on the side wall of the vibration rack 33 contacts the silicon wafer, and the flexible brush 34 produces a slight swing under the vibration of the vibrator 31. The flexible brush 34 combines the cavitation effect to vibrate and brush the surface of the silicon wafer, effectively improving the cleaning efficiency of the silicon wafer surface. The left and right side walls of each vibration rack 33 are provided with sliding grooves 36, and the left and right inner walls of each silicon wafer side brush rack 3 are fixedly installed with T-shaped limit racks 38, and each T-shaped limit rack 38 is located inside the sliding groove 36, and each T-shaped limit rack 38 is used to limit the movement range of the silicon wafer side brush rack 3 A spring 35 is fixedly installed between the top of each vibration frame 33 and the top of the silicon wafer side brush frame 3. A limiting round rod 32 is fixedly installed on each silicon wafer side brush frame 3 near the upper third. The back of each vibration frame 33 is arc-shaped, and the back of the vibration frame 33 is in contact with the limiting round rod 32. Since the back of the vibration frame 33 is in contact with the limiting round rod 32, the vibration frame 33 moves slightly upward, and the vibration frame 33 is blocked by the limiting round rod 32 to move outward from the silicon wafer side brush frame 3. At this time, the vibration frame 33 drives the flexible brush 34 to contact the silicon wafer. At the same time, the spring 35 at the top of the vibration frame 33 is compressed and deformed. In the vibration gap of the vibrator 31, the spring 35 will drive the vibration frame 33 to reset. The whole is an elastic structure, which avoids damage from rigid contact. When the vibration frame 33 swings, the T-shaped limiting frame 38 will limit the position of the sliding slot 36 to avoid dislocation of the vibration frame 33.

[0027] The embodiments of the present invention are presented for purposes of illustration and description and are not intended to be exhaustive or to limit the invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are chosen and described in order to better illustrate the principles of the invention and its practical application and to enable those skilled in the art to understand the invention and design various embodiments with various modifications as suited for specific applications.

Claims

1. A cleaning device for producing aviation single crystal silicon material parts, comprising an ultrasonic cleaning machine (1) and a protective cover (11), characterized in that: The bottom of the ultrasonic cleaning machine (1) is provided with a driving motor (12), the end of the output shaft of the driving motor (12) is fixedly mounted with a main driving rod (37), the outer sliding sleeve of the main driving rod (37) is provided with a silicon wafer driving disk (17) and a silicon wafer supporting tray (2), the silicon wafer supporting tray (2) is located above the silicon wafer driving disk (17), and at least two guide spiral tubes (18) are fixedly mounted inside the silicon wafer driving disk (17), and the lower end of each guide spiral tube (18) protrudes from the silicon wafer driving disk. The silicon wafer support tray (2) is provided with at least two cavitation bubble diffusion holes (24) below the disk (17), and the top of each guide spiral tube (18) is flush with the upper surface of the silicon wafer drive disk (17), and each of the cavitation bubble diffusion holes (24) is located directly above the guide spiral tube (18). The silicon wafer support tray (2) is used to support the silicon wafer. When the ultrasonic cleaning machine (1) performs ultrasonic cleaning, the cleaning liquid inside the ultrasonic cleaning machine (1) generates an upward water flow through the guide spiral tube (18); At least two silicon wafer side brush racks (3) are provided inside the ultrasonic cleaning machine (1), and the silicon wafer side brush racks (3) are used to perform swing cleaning on the side surfaces of the silicon wafers.

2. A cleaning device for producing aviation single crystal silicon parts according to claim 1, characterized in that: An assembly frame (13) is fixedly mounted on the surface of the main driving rod (37), and the assembly frame (13) is close to the bottom of the cleaning chamber of the ultrasonic cleaning machine (1). Positioning frames (14) are fixedly mounted on the left and right sides of the assembly frame (13), and a micro motor (15) is fixedly mounted on the top of each positioning frame (14). A screw rod (16) is fixedly mounted on the end of the output shaft of each micro motor (15).

3. A cleaning device for producing aviation single crystal silicon parts according to claim 2, characterized in that: Each of the screw rods (16) slides through the silicon wafer drive disk (17) and the silicon wafer support tray (2), and the two micro motors (15) can drive the silicon wafer drive disk (17) and the silicon wafer support tray (2) to move upward or downward inside the ultrasonic cleaning machine (1) through the screw rods (16).

4. A cleaning device for producing aviation single crystal silicon parts according to claim 1, characterized in that: The side walls of the silicon wafer driving disk (17) and the silicon wafer supporting tray (2) are both provided with at least two side grooves (22) at equal intervals, and a scraper (23) is fixedly mounted on the side wall of each side groove (22). When the silicon wafer driving disk (17) and the silicon wafer supporting tray (2) move upward or downward, the scraper (23) can assist in cleaning the silicon wafer side brush holder (3).

5. A cleaning device for producing aviation single crystal silicon parts according to claim 4, characterized in that: The inner wall of each of the guide spiral tubes (18) is provided with two guide grooves (19), the opening of each of the cavitation bubble diffusion holes (24) is larger than the guide spiral tube (18), and the spiral direction of the guide groove (19) inside the guide spiral tube (18) is opposite to the rotation direction of the silicon wafer drive disk (17).

6. A cleaning device for producing aviation single crystal silicon parts according to claim 5, characterized in that: At least two anti-slip pads (21) are fixedly mounted on the surface of the silicon wafer support tray (2), and at least two silicon wafer protection baffles (25) are fixedly mounted on the surface of the silicon wafer support tray (2) close to the side wall, and each silicon wafer protection baffle (25) is located between the two side grooves (22).

7. A cleaning device for producing aviation single crystal silicon parts according to claim 1, characterized in that: A vibration frame (33) is movably mounted inside each of the silicon wafer side brush racks (3), and a flexible brush (34) is fixedly mounted on the side wall of each of the vibration frames (33). Each of the flexible brushes (34) is used to clean the side of the silicon wafer.

8. A cleaning device for producing aviation single crystal silicon parts according to claim 7, characterized in that: The left and right side walls of each vibration frame (33) are provided with a sliding groove (36), and the left and right inner walls of each silicon wafer side brush frame (3) are fixedly installed with a T-shaped limit frame (38), and each T-shaped limit frame (38) is located inside the sliding groove (36), and each T-shaped limit frame (38) is used to limit the movement range of the silicon wafer side brush frame (3).

9. A cleaning device for producing aviation single crystal silicon parts according to claim 8, characterized in that: A vibrator (31) is fixedly mounted on the bottom of the inner wall of each wafer side brush holder (3), an output end of each vibrator (31) is connected to the bottom of the vibration holder (33), and a spring (35) is fixedly mounted between the top of each vibration holder (33) and the top of the wafer side brush holder (3).

10. A cleaning device for producing aviation single crystal silicon parts according to claim 9, characterized in that: A limiting round rod (32) is fixedly installed near the upper third of each wafer side brush rack (3), and the back of each vibration rack (33) is arc-shaped, and the back of the vibration rack (33) fits the limiting round rod (32).

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