Wafer adsorption equipment and method

Abstract

The invention relates to the field of wafer manufacturing, in particular to wafer adsorption equipment. The wafer suction device is used for sucking a wafer below a rotating tower and rotating the wafer to a next station, and is characterized by comprising the rotating tower, the rotating tower is provided with a rotating axis which is horizontally arranged, and a plurality of suction nozzles are installed around the rotating axis; an adsorption mechanism is arranged corresponding to any suction nozzle and comprises an adsorption hole formed in the end part of any suction nozzle, and an air ring and an air shaft which are communicated with the adsorption hole and are coaxial with the rotating axis; the multiple gas rings are arranged corresponding to the suction nozzles, the multiple gas rings are arranged on the outer wall of the gas shaft in a sleeving mode in the axial direction and can rotate relative to the gas shaft, the outer wall of any gas ring is provided with a first adsorption connector in the radial direction and used for being connected with external vacuum equipment, and the inner wall of each gas ring is provided with a gas groove of an annular structure communicated with the first adsorption connector; the suction nozzle is installed at one end of the air shaft, an air channel is formed in the air shaft, and the two ends of the air channel communicate with the air groove and the adsorption hole correspondingly. Any first adsorption connector is correspondingly communicated with the only air groove, the only air channel and the only adsorption hole.

Description

Technical Field

[0001] The present invention relates to the field of wafer manufacturing, and in particular to a wafer adsorption device and method. Background Art

[0002] In the field of semiconductor manufacturing, wafer suction equipment is the core device for achieving precise transfer of wafers between processes. In existing technologies, wafer suction equipment usually adopts a turret structure, using multiple suction nozzles to suck the wafers in turn and transfer them to the next station. However, traditional equipment has the following technical defects: 1. Multiple suction nozzles share the same air circuit system, and the vacuum suction is controlled by only a single solenoid valve, resulting in poor synchronization of the suction actions of each suction nozzle, prone to vacuum leakage or unstable suction force, which directly affects the reliability of wafer transfer.

[0003] 2. During product handover, the ejector pins, the lower nozzle of the turret, the upper nozzle of the turret, and the turret nozzle must all be aligned. However, in actual production, the ejector pins must be directly below the product. Even with visual correction, the wafer platform struggles to position the product directly above the ejector pins, resulting in the wafer and turret nozzles not being aligned.

[0004] 3. There is a lack of a buffer mechanism during the downward pressure of the suction nozzle, and the impact force generated by the rigid contact can easily cause damage to the wafer surface, especially significantly affecting the yield of thinner wafers. Summary of the Invention

[0005] The purpose of the present invention is to provide a wafer adsorption device and method to solve the problems existing in the prior art.

[0006] The technical solution of the present invention is: a wafer adsorption device, comprising a turret, the turret having a horizontally arranged rotation axis, and a plurality of suction nozzles installed around the rotation axis; A suction mechanism is provided corresponding to any suction nozzle, and the suction mechanism includes a suction hole opened at the end of any suction nozzle, an air ring and an air shaft connected to the suction hole and coaxial with the rotation axis; The air ring is provided with a plurality of corresponding suction nozzles, and the plurality of air rings are axially sleeved on the outer wall of the air shaft and can rotate relative to the air shaft. The outer wall of any air ring is provided with a first adsorption interface in the radial direction for connecting to an external vacuum device, and the inner wall of the air ring is provided with an air groove of an annular structure connected to the first adsorption interface; The suction nozzle is installed at one end of the air shaft, and an air channel is opened on the air shaft, and the two ends of the air channel are connected to the air groove and the adsorption hole respectively; Any of the first adsorption interfaces is connected to a unique air groove, an air channel and an adsorption hole.

[0007] Preferably, the air duct consists of two parts, including a first air duct opened radially, and a second air duct opened axially at the end connected to the first air duct, and a diverter disk is coaxially arranged at one end of the second air duct away from the first air duct, and the diverter disk is fixed to the air shaft, and the diverter disk has a diameter larger than the end face of the air shaft, and the suction nozzle is installed on the diverter disk.

[0008] Preferably, the outer wall of the air shaft is sleeved with a driver, the execution end of the driver is fixed to the diverter disk, and can drive the diverter disk to rotate around the rotation axis; the suction nozzle is radially installed at the end of the diverter disk away from the driver, and a third air duct is provided on the diverter disk, one end of the third air duct is connected to the second air duct, and the other end is connected to the second adsorption interface provided on the outer wall of the diverter disk, and the second adsorption interface is connected to the suction nozzle through a hose.

[0009] Preferably, the plurality of air rings are arranged in close contact along the length direction of the air shaft, a first sealing groove is provided on the end face of any air ring abutting against the adjacent air ring, and a second sealing groove is provided on the inner wall of any air ring parallel to the air groove.

[0010] Preferably, the turret is arranged on a mobile platform, and the mobile platform includes a first moving mechanism capable of moving along a first direction, and a second moving mechanism capable of moving along a second direction perpendicular to the first direction.

[0011] Preferably, the first moving mechanism includes a first guide rail arranged along a first direction and a first slider arranged to cooperate with the first guide rail, and the second moving mechanism is installed on the first slider; The second moving mechanism includes a second guide rail arranged along the second direction and a second slider matched with the second guide rail. The second guide rail is arranged on the first slider, and the turret is arranged on the second slider.

[0012] Preferably, the suction nozzle is connected to the diverter plate through a buffer assembly, and the buffer assembly includes a first buffer mechanism, and the first buffer mechanism includes a first buffer base, a first buffer member and a first linear motion member; the first buffer base is slidingly connected to the suction nozzle through the first linear motion member, and the two ends of the first buffer member are respectively abutted against the first buffer base and the suction nozzle.

[0013] Preferably, the buffer assembly includes a second buffer mechanism, the second buffer mechanism includes a second buffer base, a second buffer member and a second linear motion member, the second buffer base is fixed on the diversion plate, the first buffer base is slidingly connected to the second linear motion member, and the two ends of the second buffer member are respectively abutted against the first buffer base and the second buffer base.

[0014] Preferably, the first linear motion member and the second linear motion member both use ball splines.

[0015] A wafer adsorption method comprises the following steps: Step 1: The turret drives the suction nozzle to move to the adsorption station. The first moving mechanism and the second moving mechanism drive the turret to move under the guidance of the visual device so that the wafer to be adsorbed is directly below the suction nozzle; Step 2: The suction nozzle moves downward under the drive of the suction nozzle pressing mechanism, and at the same time, the external vacuum equipment transmits negative pressure to the suction hole through the first suction interface corresponding to the suction nozzle via the air groove and the air channel; Step 3: When the suction hole of the suction nozzle contacts the wafer, the first buffer mechanism and the second buffer mechanism are activated, and the first buffer member and the second buffer member are compressed, so that the pressure of the suction nozzle on the wafer remains stable; Step 4: After the wafer is firmly adsorbed, the nozzle is reset upward, and then the turret drives the nozzle to carry the wafer to the next workstation.

[0016] Compared with the prior art, the advantages of the present invention are: (1) This application adopts an independent vacuum control system. By setting up an independent negative pressure channel composed of a dedicated air ring, air channel, and adsorption interface for each suction nozzle, and realizing the separate control of each first adsorption interface, the problem of mutual interference caused by multiple suction nozzles sharing the same air path in the prior art is solved.

[0017] (2) The turret is mounted on a two-dimensional mobile platform, enabling it to move in the first and second directions and accurately position itself in the horizontal plane. This allows the nozzle to be precisely adjusted in the horizontal direction, ensuring it is positioned directly above the wafer to be adsorbed. This solves the problem of poor adsorption due to initial position deviation and improves compatibility with wafers in different positions and the success rate of adsorption.

[0018] (3) The suction nozzle is connected to the diverter plate through a buffer assembly comprising a first buffer mechanism and a second buffer mechanism. When the suction nozzle is pressed down to contact the wafer and continues its stroke, the first buffer member and the second buffer member are compressed in sequence, converting the rigid impact force of the suction nozzle on the wafer into a controllable elastic force. This effectively absorbs the impact and maintains a stable and uniform pressure on the wafer from the suction nozzle, greatly reducing the risk of wafer damage or poor adsorption due to excessive or uneven pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments: Figure 1 This is a structural diagram of a wafer adsorption device according to the present invention from a first perspective; Figure 2 This is a structural diagram of a wafer adsorption device according to the present invention from a second perspective; Figure 3 This is a diagram of the gas ring installation structure of the present invention; Figure 4 For the present invention Figure 3 Cross-sectional view; Figure 5 For the present invention Figure 4 Partial enlarged view; Figure 6 This is a cross-sectional view of the gas ring of the present invention; Figure 7 This is a cross-sectional view of the gas shaft of the present invention; Figure 8 This is a first-perspective structural diagram of the mobile platform of the present invention; Figure 9 This is a structural diagram of the mobile platform according to the present invention from a second perspective; Figure 10 This is a structural diagram of the buffer assembly of the present invention; Among them: 1. suction nozzle, 2. air ring, 21. first adsorption interface, 22. air groove, 23. first sealing groove, 24. second sealing groove, 3. air shaft, 31. first air channel, 32. second air channel, 4. driver, 5. diverter plate, 51. second adsorption interface, 6. moving platform, 61. first moving mechanism, 611. first guide rail, 612. first slider, 62. second moving mechanism, 621. second guide rail, 622. second slider, 7. buffer assembly, 71. first buffer mechanism, 711. first buffer base, 712. first buffer member, 713. first linear motion member, 72. second buffer mechanism, 721. second buffer base, 722. second buffer member, 723. second linear motion member. DETAILED DESCRIPTION

[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more, unless otherwise explicitly specified.

[0022] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood broadly. For example, they can refer to fixed connection, detachable connection, or integral connection; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0023] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0024] The present invention will be described in further detail below with reference to specific embodiments: like Figure 1 and Figure 2 As shown, a wafer suction device is provided in conjunction with a mold expansion mechanism, and is used to suction wafers located on the mold expansion mechanism below and rotate them to the next station. The device includes a turret with a horizontally arranged rotation axis. Multiple suction nozzles 1 are evenly mounted radially around the rotation axis. The turret drives the suction nozzles 1 to rotate about the rotation axis, allowing different suction nozzles 1 to sequentially enter the corresponding suction stations of the mold expansion mechanism. Driven by a nozzle-pressing mechanism, the suction nozzles 1 move downward, abutting and suctioning the wafers located on the mold expansion mechanism.

[0025] An adsorption mechanism is provided corresponding to any suction nozzle 1 , and the adsorption mechanism is used to construct an adsorption channel, so that the suction nozzle 1 generates negative pressure after an external vacuum device is connected.

[0026] In the prior art, multiple suction nozzles 1 are connected to the same air circuit and driven by a single solenoid valve, which can easily lead to unstable suction. Therefore, in this application, the suction mechanism includes a suction hole opened at the end of any suction nozzle 1, an air ring 2 and an air shaft 3 that are connected to the suction hole and coaxial with the rotation axis.

[0027] Combine Figure 3 and Figure 4As shown, the air shaft 3 can rotate around the rotation axis under the drive 4, and the suction nozzle 1 is installed at one end of the air shaft 3. The number of air rings 2 corresponding to the suction nozzles 1 is set to multiple, and multiple air rings 2 are axially sleeved on the outer wall of the air shaft 3. The air ring 2 is used to connect to external vacuum equipment, so a first adsorption interface 21 is radially provided on the outer wall of any air ring 2 for plugging in the external vacuum equipment. Figure 6 As shown, an air groove 22 connected to the first adsorption interface 21 is provided on the inner wall of the air ring 2. An air channel is provided on the air shaft 3, and multiple air channels are provided corresponding to any air ring 2. The two ends of any air channel are respectively connected to the corresponding air groove 22 and the adsorption hole of the suction nozzle 1. The first adsorption interface 21, the air groove 22, the air channel, and the adsorption hole form a negative pressure channel for adsorbing wafers. In this way, any first adsorption interface 21 is connected to a unique air groove 22, a unique air channel, and a unique adsorption hole. By controlling the on and off of any first adsorption interface 21, the vacuum suction of the corresponding single suction nozzle 1 can be achieved.

[0028] Because air shaft 3 rotates with driver 4 and air ring 2 requires connection to external vacuum equipment, the connection between air ring 2 and air shaft 3 is a rotational connection via bearings. Furthermore, after suction nozzle 1 absorbs the wafer, it must be driven by driver 4 to rotate to the subsequent workstation. During this period, a continuous negative pressure is required. Therefore, air groove 22 is designed as an annular structure to ensure that air groove 22 remains connected to the airway during air shaft 3's rotation.

[0029] In this embodiment, for ease of processing, the airway consists of two parts, such as Figure 7 The figure shows a first air channel 31 radially opened along the air shaft 3, and a second air channel 32 axially opened from one end of the air shaft 3 close to the suction nozzle 1 and connected to the end of the first air channel 31. A diverter disk 5 is coaxially arranged at one end of the second air channel 32 away from the first air channel 31. The diverter disk 5 is fixed to the end of the air shaft 3. The diverter disk 5 has a diameter larger than the end of the air shaft 3, so that the end surface of the diverter disk 5 away from the air shaft 3 is constructed as a mounting surface for the suction nozzle 1. A plurality of suction nozzles 1 are evenly mounted on the mounting surface of the diverter disk 5 radially around the rotation axis. A third air channel is radially opened inside the diverter disk 5. One end of the third air channel is connected to the second air channel 32, and the other end is connected to a second adsorption interface 51 arranged on the outer wall of the diverter disk 5. The second adsorption interface 51 is connected to the suction nozzle 1 through a hose.

[0030] like Figure 5As shown, in order to ensure airtightness between the air rings 2 and between the air rings 2 and the air shaft 3, and to prevent the negative pressure of one first adsorption interface 21 from communicating with other non-corresponding adsorption holes, multiple air rings 2 are arranged in a close-fitting manner along the length of the air shaft 3. A first sealing groove 23 is formed on the end face where any air ring 2 abuts against the adjacent air ring 2. A second sealing groove 24 is formed on the inner wall of the air ring 2 near the air shaft 3, parallel to the air groove 22. Sealing rings are embedded in both the first sealing groove 23 and the second sealing groove 24, thereby achieving independent sealing between the air rings 2 and between the air ring 2 and the air shaft 3.

[0031] When the suction nozzle 1 is driven to the adsorption station by the driver 4, there may be a vertical deviation between it and the wafer below, resulting in poor adsorption effect. Therefore, the present application sets the turret on the mobile platform 6, which can drive the turret to move along the horizontal plane, so that the suction nozzle 1 moves to the top of the wafer to be adsorbed. Figure 8 and Figure 9 As shown, the mobile platform 6 includes a first moving mechanism 61 capable of moving along a first direction, and a second moving mechanism 62 capable of moving along a second direction perpendicular to the first direction.

[0032] Specifically, the first moving mechanism 61 includes a first guide rail 611 arranged along a first direction and a first slider 612 arranged to cooperate with the first guide rail 611. The second moving mechanism 62 is mounted on the first slider 612. The second moving mechanism 62 includes a second guide rail 621 arranged along a second direction and a second slider 622 arranged to cooperate with the second guide rail 621. The second guide rail 621 is arranged on the first slider 612, and the turret is arranged on the second slider 622.

[0033] In addition, in order to buffer the pressure on the wafer when the suction nozzle 1 moves downward to absorb the wafer, Figure 10As shown, in this embodiment, the suction nozzle 1 is connected to the diverter plate 5 via a buffer assembly 7. After the suction nozzle 1 abuts the wafer, the buffer assembly 7 cushions the wafer by deforming itself. The buffer assembly 7 includes a first buffer mechanism 71, which includes a first buffer base 711, a first buffer member 712, and a first linear motion member 713. The first buffer base 711 can be set on the diverter plate 5 and is slidably connected to the suction nozzle 1 via the first linear motion member 713. The two ends of the first buffer member 712 abut the first buffer base 711 and the suction nozzle 1 respectively. To further enhance the buffering effect, in a preferred embodiment of the present application, the buffer assembly 7 further includes a second buffer mechanism 72, which includes a second buffer base 721, a second buffer member 722, and a second linear motion member 723. The second buffer base 721 is fixed to the diverter plate 5, the first buffer base 711 is slidably mounted on the second linear motion member 723, and the two ends of the second buffer member 722 respectively abut against the first buffer base 711 and the second buffer base 721. Furthermore, in the present application, both the first linear motion member 713 and the second linear motion member 723 utilize ball splines, and both the first buffer member 712 and the second buffer member 722 utilize springs.

[0034] The work includes the following steps: Step 1: The turret drives the suction nozzle 1 to move to the adsorption station. The first moving mechanism 61 and the second moving mechanism 62 drive the turret to move horizontally under the guidance of the visual device, so that the wafer to be adsorbed is located directly below the suction nozzle 1.

[0035] Step 2: The nozzle pressing mechanism drives the nozzle 1 located at the adsorption station to move downward, and at the same time starts the external vacuum equipment to generate negative pressure. The generated negative pressure passes through the first adsorption interface 21, air groove 22, second adsorption interface 51 and hose corresponding to the nozzle 1 in turn, and then transmits the negative pressure to the adsorption hole on the nozzle 1.

[0036] Step 3. When the suction hole of the suction nozzle 1 abuts against the wafer, the suction nozzle pressing mechanism will continue to drive the suction nozzle 1 to press down a certain stroke. During this stroke, the first buffer 712 and the second buffer 722 will be compressed so that the pressure of the suction nozzle 1 on the wafer is converted into the elastic force of the first buffer 712 and the second buffer 722, so that the pressure of the suction nozzle 1 on the wafer remains stable.

[0037] Step 4: After the wafer is firmly adsorbed, the suction nozzle 1 is reset upward, and then the driver 4 drives the suction nozzle 1 to carry the wafer to the next station.

[0038] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they are not intended to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A wafer adsorption turret, used to adsorb the wafer under the turret and rotate it to the next station, characterized in that: The turret comprises a turret having a horizontally arranged rotation axis, and a plurality of suction nozzles (1) are mounted around the rotation axis; A suction mechanism is provided corresponding to any suction nozzle (1), the suction mechanism comprising a suction hole opened at the end of any suction nozzle (1), an air ring (2) and an air shaft (3) connected to the suction hole and coaxial with the rotation axis; The air ring (2) is provided with a plurality of corresponding suction nozzles (1), and the plurality of air rings (2) are axially sleeved on the outer wall of the air shaft (3) and can rotate relative to the air shaft (3). The outer wall of any air ring (2) is provided with a first adsorption interface (21) in the radial direction for connecting to an external vacuum device, and the inner wall of the air ring (2) is provided with an air groove (22) of an annular structure communicating with the first adsorption interface (21); The suction nozzle (1) is mounted on one end of the air shaft (3), and an air passage is provided on the air shaft (3), with both ends of the air passage being connected to the air groove (22) and the adsorption hole respectively; Any of the first adsorption interfaces (21) is in corresponding communication with a unique air groove (22), an air channel, and an adsorption hole.

2. The wafer adsorption turret according to claim 1, characterized in that: The air channel is composed of two parts, including a first air channel (31) opened in the radial direction, and a second air channel (32) opened in the axial direction at the end thereof connected to the first air channel (31). A diverter disc (5) is coaxially arranged at one end of the second air channel (32) away from the first air channel (31). The diverter disc (5) is fixed to the air shaft (3). The diverter disc (5) has a diameter larger than the end face of the air shaft (3). The suction nozzle (1) is mounted on the diverter disc (5).

3. The wafer adsorption turret according to claim 2, characterized in that: The outer wall of the air shaft (3) is provided with a driver (4), the execution end of the driver (4) is fixed to the diverter disc (5), and can drive the diverter disc (5) to rotate around the rotation axis; the suction nozzle (1) is radially mounted on the end of the diverter disc (5) away from the driver (4), and the diverter disc (5) is provided with a third air channel, one end of the third air channel is connected to the second air channel (32), and the other end is connected to a second adsorption interface (51) provided on the outer wall of the diverter disc (5), and the second adsorption interface (51) is connected to the suction nozzle (1) through a hose.

4. The wafer adsorption turret according to claim 3, characterized in that: The plurality of air rings (2) are arranged in a close-fitting manner along the length direction of the air shaft (3); a first sealing groove (23) is provided on the end face where any air ring (2) contacts an adjacent air ring (2); and a second sealing groove (24) is provided on the inner wall of any air ring (2) parallel to the air groove (22).

5. The wafer adsorption turret according to claim 4, characterized in that: The turret is arranged on a mobile platform (6), and the mobile platform (6) comprises a first moving mechanism (61) capable of moving along a first direction, and a second moving mechanism (62) capable of moving along a second direction perpendicular to the first direction.

6. The wafer adsorption turret according to claim 5, characterized in that: The first moving mechanism (61) comprises a first guide rail (611) arranged along a first direction and a first slider arranged to cooperate with the first guide rail (611), and the second moving mechanism (62) is mounted on the first slider; The second moving mechanism (62) comprises a second guide rail (621) arranged along a second direction and a second slider arranged to match the second guide rail (621); the second guide rail (621) is arranged on the first slider, and the turret is arranged on the second slider.

7. The wafer adsorption turret according to claim 6, characterized in that: The suction nozzle (1) is connected to the diverter plate (5) via a buffer assembly (7), wherein the buffer assembly (7) comprises a first buffer mechanism (71), wherein the first buffer mechanism (71) comprises a first buffer base (711), a first buffer member (712), and a first linear motion member (713); the first buffer base (711) is slidably connected to the suction nozzle (1) via the first linear motion member (713), and the two ends of the first buffer member (712) are respectively in contact with the first buffer base (711) and the suction nozzle (1).

8. The wafer adsorption turret according to claim 7, characterized in that: The buffer assembly (7) includes a second buffer mechanism (72), the second buffer mechanism (72) includes a second buffer base (721), a second buffer member (722) and a second linear motion member (723), the second buffer base (721) is fixed on the diverter plate (5), the first buffer base (711) is slidably connected to the second linear motion member (723), and the two ends of the second buffer member (722) are respectively in contact with the first buffer base (711) and the second buffer base (721).

9. The wafer adsorption turret according to claim 7, characterized in that: The first linear motion member (713) and the second linear motion member (723) both use ball splines.

10. A wafer adsorption method, using the wafer adsorption turret according to claim 8, characterized in that: The steps include: Step 1: The turret drives the suction nozzle (1) to move to the adsorption station, and the first moving mechanism (61) and the second moving mechanism (62) drive the turret to move under the guidance of the visual device so that the wafer to be adsorbed is located directly below the suction nozzle (1); Step 2: The suction nozzle (1) moves downward under the drive of the suction nozzle pressing mechanism, and at the same time, the external vacuum equipment transmits the negative pressure to the suction hole through the first suction interface (21) corresponding to the suction nozzle (1) via the air groove (22) and the air channel; Step 3: When the suction hole of the suction nozzle (1) contacts the wafer, the first buffer mechanism (71) and the second buffer mechanism (72) are activated, and the first buffer member (712) and the second buffer member (722) are compressed, so that the pressure of the suction nozzle (1) on the wafer remains stable; Step 4: After the wafer is firmly adsorbed, the suction nozzle (1) is reset upward, and then the turret drives the suction nozzle (1) to carry the wafer to the next station.

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