Lamp housing soldering improvements for semiconductor rapid thermal processing (RTP) chambers

Abstract

Embodiments of a lamp housing for a processing chamber are provided herein. In some embodiments, a lamp housing for a processing chamber includes: a first plate having a plurality of first openings; the copper plate is provided with a plurality of second openings; a plurality of tubes, the plurality of tubes being welded to the first plate at a first end of the plurality of tubes by a welding alloy, and the plurality of tubes being welded to the copper plate at a second end of the plurality of tubes by the welding alloy, wherein the plurality of tubes have a central opening aligned with the plurality of first openings and the plurality of second openings, and wherein the welding alloy comprises a nickel-containing alloy or a copper-containing alloy wherein the copper-containing alloy does not comprise gold; and an annular sheath surrounding the plurality of tubes and welded to the first plate by the welding alloy.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to substrate processing apparatuses. BACKGROUND

[0002] During rapid thermal processing (RTP) of a substrate, thermal radiation is typically used to rapidly heat the substrate to a maximum temperature of up to about 1350 degrees Celsius in a controlled environment. The maximum temperature is maintained for a certain total amount of time, from less than a second to several minutes, depending on the particular process. The substrate is then cooled to room temperature for further processing.

[0003] Lamps are commonly used as the source of thermal radiation in RTP chambers. Current lamp assembly designs include a lamp body, a bulb, and a base coupled to the lamp body. The lamp assembly is composed of components that are typically welded together. However, conventional welding materials used for the lamp assembly are expensive. In addition, the welded joints in conventional lamp assemblies can be susceptible to voids and cracks.

[0004] Accordingly, the inventors herein provide an improved lamp design that reduces cost and improves the welded joints. SUMMARY

[0005] Embodiments of a lamp enclosure for a processing chamber are provided herein. In some embodiments, a lamp enclosure for a processing chamber includes a first plate having a plurality of first openings, a copper plate having a plurality of second openings, a plurality of tubes welded to the first plate at first ends of the plurality of tubes by a weld alloy and welded to the copper plate at second ends of the plurality of tubes by the weld alloy, wherein the plurality of tubes have central openings aligned with the plurality of first openings and the plurality of second openings, and wherein the weld alloy includes a nickel-containing alloy or a copper-containing alloy, wherein the copper-containing alloy does not include gold, and an annular sheath surrounding the plurality of tubes and welded to the first plate by the weld alloy.

[0006] In some embodiments, a lamp enclosure for a processing chamber includes a first plate made of a first material and having a plurality of first openings, a copper plate having a plurality of second openings, a plurality of tubes welded to the first plate at first ends of the plurality of tubes by a weld alloy and welded to the copper plate at second ends of the plurality of tubes by the weld alloy, wherein the plurality of tubes have central openings aligned with the plurality of first openings and the plurality of second openings, and wherein the weld alloy includes a copper-containing alloy and does not include gold, and an annular sheath made of the first material and surrounding the plurality of tubes and welded to the first plate by the weld alloy and coupled to the copper plate.

[0007] In some embodiments, a method of forming a lamp housing for a processing chamber includes placing a solder alloy at a plurality of first interfaces disposed between a first plate of a lamp housing and a plurality of hollow tubes of the lamp housing, at a plurality of second interfaces disposed between a copper plate of the lamp housing and the plurality of hollow tubes, and at a third interface disposed between a ring-shaped sheath of the lamp housing disposed around the plurality of hollow tubes and the first plate, wherein the solder alloy comprises a copper-containing alloy, wherein the copper-containing alloy does not include gold; and heating the solder alloy to join the plurality of hollow tubes to the first plate, the plurality of hollow tubes to the copper plate, and the ring-shaped sheath to the first plate.

[0008] Other and further embodiments of the present disclosure are described below. BRIEF DESCRIPTION OF DRAWINGS

[0009] Embodiments of the present disclosure, briefly described above, are described in greater detail below with reference to the illustrative embodiments depicted in the appended drawings. However, the appended drawings represent typical embodiments of the present disclosure and therefore should not be considered limiting of its scope, as the present disclosure can admit to other equally effective embodiments.

[0010] Figure 1 A schematic cross-sectional side view of a rapid thermal processing (RTP) chamber is depicted in accordance with at least some embodiments of the present disclosure.

[0011] Figure 2 A partial cross-sectional isometric top view of a lamp housing is depicted in accordance with at least some embodiments of the present disclosure.

[0012] Figure 3 A cross-sectional side view of a portion of a lamp housing is depicted in accordance with at least some embodiments of the present disclosure.

[0013] Figure 4 A cross-sectional side view of a portion of a lamp housing is depicted in accordance with at least some embodiments of the present disclosure.

[0014] Figure 5 A cross-sectional side view of a portion of a lamp housing is depicted in accordance with at least some embodiments of the present disclosure.

[0015] Figure 6 A cross-sectional side view of an interface between a sheath of a lamp housing and a copper plate of the lamp housing is depicted in accordance with at least some embodiments of the present disclosure.

[0016] Figure 7 A flowchart of a method of forming a lamp housing for a processing chamber is depicted in accordance with at least some embodiments of the present disclosure.

[0017] For ease of understanding, the same reference numbers will be used in different figures to designate the same or similar elements shared by the figures. The figures are not drawn to scale and will be simplified for clarity. Elements and features of one embodiment can be beneficially incorporated into other embodiments without further recitation. DETAILED DESCRIPTION

[0018] Embodiments of a lamp enclosure for a processing chamber are provided herein. The processing chamber can be a rapid thermal processing (RTP) chamber. The lamp enclosure generally includes a plurality of tubes welded to one or more plates by a weld alloy, and an annular shroud surrounding the plurality of tubes and welded to the one or more plates by the weld alloy. The one or more plates include copper plates. The plurality of tubes are made of a first material. The weld alloy is generally made of a material that is not prone to corrosion when coupled with copper and has a liquidus temperature less than the melting temperature of copper. The weld alloy is more cost effective when used with the lamp enclosure of the RTP chamber compared to conventional weld alloys. The one or more plates can advantageously include features (e.g., grooves, slots, chamfers, etc.) to improve the integrity of the weld joints. The weld alloy is generally made of a material that is not prone to corrosion when coupled with copper and has a liquidus temperature less than the melting temperature of copper. The weld alloy can be in the form of a wire or a flat shim, or a combination thereof. In some embodiments, the weld alloy is formed using 3D printing or additive manufacturing techniques.

[0019] Figure 1 A schematic cross-sectional side view of an RTP chamber in accordance with at least some embodiments of the present disclosure is depicted. The RTP chamber 100 (as shown in Figure 1 Generally includes a chamber body with a sidewall 14 and a bottom wall 15 to define an interior volume 13 in the chamber body. The sidewall 14 and the bottom wall 15 are made of a metal, such as stainless steel. An upper portion of the sidewall 14 is sealed to a window assembly 17 by an "O" ring 16. A lamp enclosure 18 is positioned above and coupled to the window assembly 17. The lamp enclosure 18 includes a plurality of lamps 19, such as tungsten halogen lamps, each lamp fitted into a plurality of tubes 21 (which can be stainless steel, brass, aluminum, or other metal).

[0020] A substrate 61 (e.g., a wafer) is supported in the interior volume 13 along the edge of the substrate by a substrate support 62 made of a ceramic material (e.g., silicon carbide). The substrate support 62 is fitted on a rotatable quartz cylinder 63. By rotating the quartz cylinder 63, the substrate support 62 and the substrate 61 can be rotated. Additional ceramic adapter rings can be used to allow processing of different diameter substrates (e.g., 150 mm as well as 200 mm). The outer edge of the substrate support 62 preferably extends less than 2 inches from the outer diameter of the substrate 61. In some embodiments, the interior volume 13 has a volume of approximately 2 liters.

[0021] The bottom wall 15 of the RTP chamber 100 includes a reflective surface 11 for reflecting energy onto the backside of the substrate 61. In some embodiments, the reflective surface 11 is a gold plated top surface. In addition, the RTP chamber 100 can include a plurality of fiber optic probes 70 positioned through the bottom wall 15 of the RTP chamber 100 so as to detect the temperature of the substrate 61 at a plurality of locations across the bottom surface of the substrate 61. The reflection between the backside of the substrate 61 and the reflective surface 11 creates a blackbody cavity, making the temperature measurement independent of the emissivity of the substrate backside, thereby providing accurate temperature measurement capabilities.

[0022] The RTP chamber 100 includes a gas inlet 69 formed through the sidewall 14 for injecting process gas into the interior volume 13 to allow various processing steps to be performed in the RTP chamber 100. A gas source (e.g., an oxygen containing gas tank (such as 02) or a hydrogen containing gas tank (such as H2)) is coupled to the gas inlet 69. Opposite the gas inlet 69 in the sidewall 14 is a gas outlet 68. The gas outlet 68 is coupled to a vacuum source (e.g., a pump) to evacuate process gas from the interior volume 13 and reduce the pressure in the interior volume 13. During processing, the vacuum source maintains the desired pressure as process gas is continuously fed into the RTP chamber 100.

[0023] The plurality of lamps 19 can generally include filaments wound as coils, having an axis parallel to the axis of the lamp envelope. Most of the light is emitted normal to the sidewall of the surrounding tube of the plurality of tubes 21. The substrate support 62 can be a support ring. The length of the plurality of tubes 21 is selected to be at least as long as the associated lamp. However, the length of the plurality of tubes 21 can be longer than the associated lamp, provided that the power reaching the substrate 61 is not substantially attenuated by the increased reflection. In some embodiments, the plurality of tubes 21 includes 100 or more tubes. In some embodiments, the plurality of tubes 21 includes 300 or more tubes. In some embodiments, the plurality of tubes 21 are positioned in a hexagonal array or in a "honeycomb" pattern, for example, as illustrated in FIG. 2. Figure 2

[0024] The plurality of lamps 19 are positioned to substantially cover the entire surface area of the substrate 61 and the substrate support 62. In some embodiments, the plurality of tubes 21 are grouped into zones that can be independently controlled to provide extremely uniform heating of the substrate 61. The plurality of tubes 21 can be cooled by flowing a coolant (e.g., water) between the individual tubes. The lamp housing 18 includes the plurality of tubes 21 and the associated plurality of lamps 19 to allow the use of a thin quartz window to provide an optical port for heating the substrate 61 within the RTP chamber 100.

[0025] ​In some embodiments, the lamp housing 18 includes a copper plate 44 having a plurality of second openings 41. In some embodiments, the copper plate 44 is made of oxygen-free copper. The plurality of second openings 41 are generally aligned with and welded to the plurality of tubes 21. In some embodiments, the lamp housing 18 includes one or more quartz plates. For example, the lamp housing 18 can include a quartz plate 48 coupled to the copper plate 44. In some embodiments, the lamp housing 18 includes a quartz plate 47 disposed between the copper plate 44 and the plurality of tubes 21. In some embodiments, the quartz plate 47, 48 can be sealed near the copper plate 44 and / or the sidewall 14 using "O" rings 49 and 51. In some embodiments, a vacuum can be created in the plurality of second openings 41 by pumping through a tube 53.

[0026] The RTP chamber 100 is typically a single substrate reaction chamber capable of ramping the temperature of the substrate 61 at a rate of 25 to 100 degrees Celsius per second. The RTP chamber 100 is referred to as a "cold wall" reaction chamber because the temperature of the substrate 61 is at least 400 degrees Celsius higher than the temperature of the chamber sidewall 14 during an oxidation process. A heating / cooling fluid can be circulated through the sidewall 14 and / or the bottom wall 15 to maintain the walls at a desired temperature. In some embodiments, the RTP chamber 100 is configured as part of a "cluster tool" including load locks and transfer chambers with robotic arms. In some embodiments, the RTP chamber 100 is configured as a stand-alone tool.

[0027] Figure 2 A partial cross-sectional isometric top view of a lamp housing 18 is depicted in accordance with at least some embodiments of the present disclosure. The lamp housing 18 includes a top plate 206 (e.g., a first plate) made of a first material. The top plate 206 includes a plurality of first openings 212. The lamp housing 18 includes a plurality of tubes 21 welded to the top plate 206 at upper ends 216 (e.g., first ends) of the plurality of tubes 21 by a weld alloy. Lower ends 224 (e.g., second ends) of the plurality of tubes 21 are welded to a copper plate 44 by a weld alloy. The copper plate 44 includes a plurality of second openings 41. The plurality of tubes 21 have central openings 210 that are aligned with the plurality of first openings 212 of the top plate 206 and the plurality of second openings 41 of the copper plate 44. In some embodiments, the plurality of tubes 21 are made of the first material. In some embodiments, the first material does not include copper. In some embodiments, the first material is stainless steel.

[0028] The lamp housing 18 includes an annular shroud 220 that surrounds the plurality of tubes 21 and is welded to the top plate 206 by a solder alloy. In some embodiments, the annular shroud 220 is made of a first material. The annular shroud 220 facilitates the flow of coolant into the annular shroud 220 and between the individual tubes of the plurality of tubes 21 to cool the tubes. In some embodiments, the annular shroud 220 includes an annular ring 226 and a bottom flange 228. The bottom flange 228 is disposed about and coupled to the copper plate 44. The bottom flange 228 facilitates coupling the lamp housing 18 to, for example, the sidewall 14. In some embodiments, an upper surface 232 of the bottom flange 228 includes an annular groove 230. A top ring 234 can be disposed in the annular groove 230 to cover any openings in the annular groove 230, configured to enable coupling of the bottom flange 228 to the sidewall 14.

[0029] In use, when heated, the solder alloy liquefies to fill the desired joints between the plurality of parts, and then bonds the plurality of parts as the liquefied solder alloy cools. In some embodiments, the solder alloy includes a nickel-containing alloy or a copper-containing alloy, where the copper-containing alloy does not include gold. In some embodiments, the solder alloy includes one of a titanium-nickel alloy, a silver-copper-tin-titanium alloy, a silver-copper-nickel-titanium alloy, a copper-manganese-nickel alloy, a copper-germanium-nickel alloy, a silver-copper-lead alloy, or a gold-nickel alloy. The gold-nickel alloy, while more expensive than the other solder alloy materials described above, has good wetting and flow characteristics to reduce delamination and voids in the solder joint.

[0030] In some embodiments, the solder alloy includes a copper alloy that does not include gold. In some embodiments, the solder alloy does not include materials that cause corrosion when combined with copper, such as iron, carbon, zinc, lead, or aluminum. In some embodiments, the solder alloy is a copper-germanium alloy. For example, the solder alloy can be a copper-germanium-nickel alloy having about 60 to about 90% copper, about 5 to about 40% germanium, and about 0.1 to about 0.5% nickel by weight. In some embodiments, the solder alloy is a silver-copper-tin-titanium alloy having about 50 to about 70% silver, about 25 to about 45% copper, about 0.5 to about 2% tin, and about 1 to 3% titanium by weight. In some embodiments, the solder alloy is a silver-copper-indium-titanium alloy having about 50 to about 70% silver, about 20 to about 40% copper, about 10 to about 15% indium, and about 0.5 to 3% titanium by weight.

[0031] In some embodiments, the top plate 206 includes an annular groove 238 to accommodate an upper lip 242 of the annular sheath 220. In some embodiments, the upper surface of the copper plate 44 includes an annular groove 214 to accommodate an inner lip 248 of the bottom flange 228. In some embodiments, the top plate 206 includes openings 218 disposed about the top plate 206 to facilitate coupling the top plate 206 to other components of the RTP chamber 100.

[0032] Figure 3 A cross-sectional side view of a portion of the lamp housing 18 according to at least some embodiments of the present disclosure is depicted. In some embodiments, the lower surface 302 of the top plate 206 includes a chamfer 310 adjacent to an interface 312 between the annular sheath 220 and the top plate 206. In some embodiments, a weld alloy 316 is disposed between the annular sheath 220 and the top plate 206. In some embodiments, the weld alloy 316 extends along an outer sidewall 318 of the upper lip 242, a top surface 320 of the upper lip 242, and an inner sidewall 322 of the upper lip 242.

[0033] In use, when heated, the weld alloy 316 liquefies to fill the joint between the upper lip 242 and the annular groove 238 of the top plate 206, and then joins the upper lip 242 to the top plate 206 when the liquefied weld alloy 316 cools. When the weld alloy 316 is heated, the chamfer 310 can advantageously promote capillary action and enhance the integrity of the weld joint and reduce voids. The weld alloy 346 can be disposed around each of the plurality of tubes 21 for coupling the plurality of tubes 21 to the top plate 206. In some embodiments, for each of the plurality of tubes 21, the weld alloy 346 is at least partially disposed in an annular slot 342 formed adjacent to the upper surface 306 of the top plate 206.

[0034] In some embodiments, as Figure 3 As depicted in FIG, the weld alloy 316 may be a 3D printed part based on the actual dimensions of the gap between the upper lip 242 and the annular groove 238. For example, the 3D printed weld alloy 316 may have sidewalls with varying wall thicknesses to accommodate the varying dimensions of the gap between the inner sidewall 322 of the upper lip 242 and the opposing sidewall of the annular groove 238. In some embodiments, as Figure 5 As depicted in , the weld alloy 316 may be in the form of a wire or flat shim, wherein the wire or flat shim has substantially uniform dimensions along the length of the wire or flat shim.

[0035] Figure 4A cross-sectional side view of a portion of the luminaire housing 18 according to at least some embodiments of the present disclosure is depicted. In some embodiments, a solder alloy 410 can be disposed around one or more of the plurality of tubes 21 adjacent to an upper surface 414 of the copper plate 44. In some embodiments, the plurality of tubes 21 can be coupled to the copper plate 44 at a vertically downward position from the upper surface 414. For example, in some embodiments, the copper plate 44 includes an annular groove 426 in the sidewall 406 of each of the plurality of second openings 41 to accommodate a solder alloy 428. In some embodiments, to increase strength, the plurality of tubes 21 are coupled to the copper plate 44 by both the solder alloy 410 and the solder alloy 428.

[0036] In some embodiments, the solder alloy 410 is in the form of a wire. In some embodiments, the solder alloy 410 is 3D printed based on the actual outer diameter of each of the plurality of tubes 21 to advantageously ensure a good solder joint. In some embodiments, the solder alloy 428 is in the form of a wire. In some embodiments, the solder alloy 428 is 3D printed based on the actual dimensions of each of the annular grooves 426 to advantageously ensure a good solder joint. In some embodiments, a solder alloy 432 can be disposed in the annular groove 214 of the copper plate 44 to accommodate coupling of the annular sheath 220 to the copper plate 44. In some embodiments, the solder alloy 432 is disposed on the lower surface 440 of the annular groove. In some embodiments, the solder alloy 432 is in the form of a wire, a flat shim, or a 3D printed part.

[0037] Figure 6 A cross-sectional side view of an interface 610 between the annular sheath 220 of the luminaire housing 18 and the copper plate 44 of the luminaire housing 18 according to at least some embodiments of the present disclosure is depicted. In some embodiments, the annular sheath 220 is soldered to the copper plate 44 by a solder alloy 432 disposed in the annular groove 214. In some embodiments, the solder alloy 432 is disposed along the inner surface 606 of the annular groove 214, the outer surface 612 of the annular groove 214, and the lower surface 440 of the annular groove 214. In some embodiments, the copper plate 44 includes a second annular groove 608 disposed in the annular groove 214, for example, along the inner surface 606 or the outer surface 612 (along the outer surface 612 as shown in FIG. 6B). The solder alloy 432 can be disposed in the second annular groove 608. In some embodiments, the solder alloy 432 is in the form of a wire or a flat shim. In some embodiments, the solder alloy 432 is 3D printed. Figure 6 In some embodiments, the solder alloy 432 is in the form of a wire. In some embodiments, the solder alloy 432 is 3D printed based on the actual dimensions of each of the annular grooves 214 to advantageously ensure a good solder joint.

[0038] Figure 7A flowchart of a method 700 of forming a lamp enclosure (e.g., lamp enclosure 18) for a processing chamber (e.g., RTP chamber 100) in accordance with at least some embodiments of the present disclosure is depicted. At 702, method 700 includes placing a solder alloy (e.g., solder alloy 346) at a plurality of first interfaces disposed between a top plate (e.g., top plate 206) of the lamp enclosure and a plurality of tubes (e.g., plurality of tubes 21) of the lamp enclosure. At 702, method 700 further includes placing a solder alloy (e.g., solder alloy 410, solder alloy 428) at a plurality of second interfaces between a copper plate (e.g., copper plate 44) of the lamp enclosure and the plurality of hollow tubes. At 702, method 700 further includes placing a solder alloy (e.g., solder alloy 432) at a third interface between a ring-shaped sheath (e.g., ring-shaped sheath 220) of the lamp enclosure disposed around the plurality of hollow tubes and the top plate.

[0039] The solder alloy is generally made of a material that is not prone to corrosion when coupled with copper and has a liquidus temperature that is less than the melting temperature of copper. For example, the solder alloy includes a nickel-containing alloy or a copper-containing alloy, where the copper-containing alloy does not include gold. In some embodiments, the solder alloy is a copper-germanium-nickel alloy having about 60 to about 90% copper, about 5 to about 40% germanium, and about 0.1 to about 0.5% nickel by weight.

[0040] In some embodiments, at least some of the solder alloy is in the form of a wire. In some embodiments, method 700 includes forming a plurality of 3D-printed solder parts containing the solder alloy based on dimensions of the plurality of first interfaces, the plurality of second interfaces, and the third interface, and wherein placing the solder alloy includes placing a corresponding 3D-printed solder part of the plurality of 3D-printed solder parts in a corresponding interface of the plurality of first interfaces, the plurality of second interfaces, and the third interface. The dimensions of the plurality of first interfaces, the plurality of second interfaces, and the third interface can be obtained using any suitable technique.

[0041] In some embodiments, the plurality of second interfaces includes a ring-shaped groove (e.g., ring-shaped groove 426) formed individually in the copper plate. In some embodiments, placing the solder alloy (e.g., solder alloy 428) at the plurality of second interfaces includes placing the solder alloy in the ring-shaped groove to form a stronger coupling therebetween. In some embodiments, the third interface includes a ring-shaped groove (e.g., second ring-shaped groove 608 formed in the copper plate). In some embodiments, the solder alloy (e.g., solder alloy 432) is disposed along two or more sides of the ring-shaped sheath or extends around the ring-shaped sheath into a portion of the second ring-shaped groove 608 to form a better solder joint with minimal or reduced voids and cracks formed therein.

[0042] At 704, the method 700 includes heating a solder alloy to a suitable temperature to join the plurality of hollow tubes to the top plate, the plurality of hollow tubes to the copper plate, and the annular sheath to the top plate. For example, the solder alloy is heated to a temperature greater than the liquidus temperature of the solder alloy and less than the melting temperature of the copper.

[0043] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure can be devised without departing from the basic scope thereof.

Claims

1. A lamp enclosure for a processing chamber, the lamp enclosure comprising: a first plate having a plurality of first openings; a copper plate having a plurality of second openings; a plurality of tubes welded to the first plate at a first end of the plurality of tubes by a weld alloy and to the copper plate at a second end of the plurality of tubes by the weld alloy, wherein the plurality of tubes have central openings aligned with the plurality of first openings and the plurality of second openings, and wherein the weld alloy comprises a nickel-containing alloy or a copper-containing alloy, wherein the copper-containing alloy does not include gold; and an annular sheath surrounding the plurality of tubes and welded to the first plate by the weld alloy.

2. The lamp enclosure of claim 1, wherein the weld alloy comprises at least one of a wire form or a flat gasket form.

3. The lamp enclosure of claim 1, wherein the weld alloy comprises: a titanium-nickel alloy; a silver-copper-tin-titanium alloy; a silver-copper-indium-titanium alloy; a copper-manganese-nickel alloy; a copper-germanium-nickel alloy; a silver-copper-lead alloy; or a gold-nickel alloy.

4. The lamp enclosure of claim 1, wherein a lower surface of the first plate comprises a chamfer adjacent to an interface between the annular sheath and the first plate.

5. The lamp enclosure of claim 1, wherein the copper plate comprises an annular groove in a sidewall of each of the plurality of second openings to accommodate the weld alloy.

6. The lamp enclosure of any of claims 1 to 5, wherein the copper plate comprises an annular groove on an upper surface of the copper plate to accommodate the annular sheath.

7. The lamp enclosure of claim 6, wherein the annular sheath is welded to the copper plate by the weld alloy disposed in the annular groove, wherein the weld alloy is disposed along an inner surface of the annular groove, an outer surface of the annular groove, and a lower surface of the annular groove.

8. The lamp enclosure of any of claims 1 to 5, wherein the first plate comprises an annular groove to accommodate an upper lip of the annular sheath, and wherein the weld alloy disposed between the annular sheath and the first plate extends along an outer sidewall of the upper lip, a top surface of the upper lip, and an inner sidewall of the upper lip.

9. The lamp enclosure of any of claims 1 to 5, further comprising a bottom flange disposed about and coupled to the copper plate.

10. The lamp enclosure of any of claims 1 to 5, wherein the first plate is made of a first material, wherein the annular sheath is made of the first material and coupled to the copper plate, and wherein the weld alloy comprises the copper-containing alloy.

11. The lamp enclosure of claim 10, wherein the weld alloy is a copper-germanium-nickel alloy having about 60 to about 90% copper, about 5 to about 40% germanium, and about 0.1 to about 0.5% nickel by weight.

12. The lamp enclosure of claim 10, wherein the first material does not include copper.

13. The lamp housing of claim 10, wherein the first material is stainless steel.

14. A rapid thermal processing chamber, comprising: a chamber body defining an interior volume in the chamber body; the lamp housing of claim 10 disposed in an upper portion of the interior volume; a plurality of lamps disposed in the lamp housing; and a substrate support disposed in the interior volume, wherein a quartz window portion is disposed between the plurality of lamps and the substrate support.

15. A method of forming a lamp housing for a processing chamber, comprising: placing a solder alloy at a plurality of first interfaces disposed between a first plate of a lamp housing and a plurality of hollow tubes of the lamp housing, at a plurality of second interfaces disposed between a copper plate of the lamp housing and the plurality of hollow tubes, and at a third interface disposed between an annular sheath of the lamp housing disposed around the plurality of hollow tubes and the first plate, wherein the solder alloy comprises a nickel-containing alloy or a copper-containing alloy, wherein the copper-containing alloy does not include gold; and heating the solder alloy to join the plurality of hollow tubes to the first plate, the plurality of hollow tubes to the copper plate, and the annular sheath to the first plate. based on dimensions of the plurality of first interfaces, the plurality of second interfaces, and the third interface, forming a plurality of 3D-printed solder parts comprising the solder alloy, and wherein placing the solder alloy comprises placing a corresponding 3D-printed solder part of the plurality of 3D-printed solder parts in a corresponding interface of the plurality of first interfaces, the plurality of second interfaces, and the third interface.

16. The method of claim 15, further comprising:

17. The method of claim 15, wherein at least some of the solder alloy is in the form of wire.

18. The method of any of claims 15-17, wherein the solder alloy is a copper-germanium-nickel alloy having about 60 to about 90 wt% copper, about 5 to about 40 wt% germanium, and about 0.1 to about 0.5 wt% nickel. placing the solder alloy in the annular groove.

19. The method of any of claims 15 to 17, wherein the plurality of second interfaces comprises annular grooves formed in the copper plate, and wherein disposing the solder alloy at the plurality of second interfaces comprises:

20. The method of any of claims 15-17, wherein the solder alloy does not include copper. ​

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