Preheating system of solid state disk

Abstract

The invention discloses a preheating system of a solid state disk, and relates to the technical field of storage, and the system comprises the solid state disk which is used for sending a first instruction to a power supply device when it is detected that the initial temperature value of each target area in at least one target area is smaller than or equal to the corresponding minimum working temperature value. And the power supply device is used for heating each target area according to a full-power heating mode. The solid state disk is also used for predicting a target temperature value of each target area after a preset time period; and when the difference between the target temperature value of each target area and the corresponding minimum working temperature value is smaller than the preset temperature difference value, a second instruction is sent to the power supply device. And the power supply device is used for heating each target area according to a pulse heating mode and stopping heating until the real-time temperature value of each target area is greater than the corresponding minimum working temperature value. The problems of high power consumption, high time delay, slow response and low working efficiency of the solid state disk caused by the low-temperature problem can be solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of storage, in particular to a preheating system of a solid state disk. BACKGROUND

[0002] The solid state disk (SSD) faces multiple technical challenges in a low temperature environment. The low temperature environment can cause the electron mobility in the flash memory particles to decrease, resulting in a decrease in read-write performance and data errors. The low temperature environment can also cause the master control integrated circuit to fail to initialize due to unstable clock circuit and power management integrated circuit (PMIC) voltage, increase the equivalent series resistance of the capacitor to cause power supply noise, and cause poor contact due to material shrinkage.

[0003] In related technologies, a wide-temperature-level solid state disk is usually used to cope with the low temperature environment, but the wide-temperature-level solid state disk has a high cost. Alternatively, a constant temperature preheating circuit is used to continuously heat the solid state disk, but this method can cause the solid state disk to have high power consumption. Alternatively, the initialization time is prolonged to allow the solid state disk to reach the working temperature before starting to operate, but this method can cause the solid state disk to have high latency and slow response, and thus the working efficiency of the solid state disk is low. SUMMARY

[0004] The present application provides a preheating system of a solid state disk to at least solve the problems of high power consumption, high latency, slow response, and low working efficiency of the solid state disk caused by the low temperature problem in related technologies.

[0005] The present application provides a preheating system of a solid state disk, which includes the solid state disk and a power supply device. The solid state disk is divided into multiple regions.

[0006] The solid state disk is configured to obtain an initial temperature value of each region in the multiple regions when the solid state disk is powered on, detect whether the initial temperature value of each region is less than or equal to a minimum working temperature value corresponding to each region, and send a first instruction to the power supply device when it is detected that the initial temperature value of each target region in at least one target region is less than or equal to the minimum working temperature value corresponding to each target region.

[0007] The power supply device is configured to heat each target region in a full-power heating mode according to the first instruction.

[0008] The solid state disk is also used for monitoring real-time temperature values of each target area in real time; the monitored real-time temperature values are input into a preset prediction model to predict target temperature values of each target area after a preset time period; and a second instruction is sent to the power supply device when a difference between the target temperature value of each target area and the minimum working temperature value corresponding to each target area is less than a preset temperature difference value.

[0009] The power supply device is used for heating each target area in a pulse heating mode according to the second instruction until the real-time temperature value of each target area is greater than the minimum working temperature value corresponding to each target area.

[0010] The application provides a preheating method of a solid state disk, which comprises the following steps: obtaining initial temperature values of each area in a plurality of areas when the solid state disk is powered on; detecting whether the initial temperature value of each area is less than or equal to a minimum working temperature value corresponding to each area; sending a first instruction to a power supply device when it is detected that the initial temperature value of each target area in at least one target area is less than or equal to the minimum working temperature value corresponding to each target area; monitoring real-time temperature values of each target area in real time; inputting the monitored real-time temperature values into a preset prediction model to predict target temperature values of each target area after a preset time period; and sending a second instruction to the power supply device when a difference between the target temperature value of each target area and the minimum working temperature value corresponding to each target area is less than a preset temperature difference value.

[0011] The application also provides another preheating method of a solid state disk, which comprises the following steps: receiving a first instruction when the initial temperature value of each target area in at least one target area is less than or equal to a minimum working temperature value corresponding to each target area; heating each target area in a full-power heating mode; receiving a second instruction when a difference between the target temperature value of each target area and the minimum working temperature value corresponding to each target area is less than a preset temperature difference value; and heating each target area in a pulse heating mode until the real-time temperature value of each target area is greater than the minimum working temperature value corresponding to each target area.

[0012] The application also provides an electronic device, which comprises a memory for storing a computer program and a processor for executing the computer program to implement the steps of the preheating method of the solid state disk.

[0013] The application also provides a computer readable storage medium, which stores a computer program, and the computer program is executed by a processor to implement the steps of the preheating method of the solid state disk.

[0014] The application further provides a computer program product comprising a computer program which, when executed by a processor, implements the steps of any of the above-mentioned solid state disk preheating methods.

[0015] According to the application, the heating temperature of each target region can be accurately controlled by controlling the heating mode during the heating of each target region, so that each target region can quickly and safely reach the corresponding minimum working temperature value. At the same time, the temperature of each region is controlled according to the actual temperature of each region, which can avoid the problem of high power consumption caused by continuous heating of the entire solid state disk. At the same time, this method does not require the use of high-cost solid state disk costs, and has fast response speed and low delay, so that the solid state disk can be started as soon as possible, and the working efficiency of the solid state disk is improved. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the application, the drawings required in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0017] Figure 1 A topology diagram of a solid state disk preheating system provided by an embodiment of the application is provided.

[0018] Figure 2 An array structure diagram of a master control integrated circuit provided by an embodiment of the application is provided.

[0019] Figure 3 An array structure diagram of a flash memory region provided by an embodiment of the application is provided.

[0020] Figure 4 A solid state disk preheating method provided by an embodiment of the application is provided.

[0021] Figure 5 Another solid state disk preheating method provided by an embodiment of the application is provided.

[0022] Figure 6 Another solid state disk preheating method provided by an embodiment of the application is provided.

[0023] Figure 7 An architecture schematic diagram of an electronic device provided by an embodiment of the application is provided. DETAILED DESCRIPTION

[0024] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0025] It should be noted that, in the description of the present application, the terms "comprise", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment comprising a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. The terms "first", "second" and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0026] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0027] The embodiments of the present application are applied to the scene of preheating a solid state disk in a low temperature environment.

[0028] In the related art, a wide temperature level solid state disk is usually used to cope with a low temperature environment, but the wide temperature level solid state disk has high cost; or a constant temperature preheating circuit is used to continuously heat the solid state disk, but this way will cause high power consumption of the solid state disk; or the initialization time is prolonged to make the solid state disk reach the working temperature before starting to run, but this way makes the solid state disk have high delay and slow response, and makes the working efficiency of the solid state disk low.

[0029] To solve the above technical problems, the embodiments of the present application provide a preheating system of a solid state disk, in which the solid state disk can monitor the temperature of the solid state disk in real time, and automatically start the heating function in a low temperature environment to ensure that the solid state disk starts after reaching the normal working temperature; and during the heating process, the real-time temperature of the solid state disk can be combined with a high-precision temperature sensor and an intelligent control algorithm to realize accurate temperature control and preheating management, and the heating mode of the solid state disk can be adjusted, so that the solid state disk can be heated to the normal working temperature in a short time in an extremely low temperature environment, and the response speed of the solid state disk is improved.

[0030] The present application provides a preheating system of a solid state disk, as shown in Figure 1 Figure 1 ​A topology diagram of a preheating system of a solid state disk is provided in the embodiments of the present application. The preheating system of the solid state disk 100 can include a solid state disk 101, a power supply device 102; optionally, the preheating system of the solid state disk 100 further includes a backup power supply 103.

[0031] The solid state disk 101 is connected with the power supply device 102 and the backup power supply 103 respectively.

[0032] The solid state disk 101 can be any type of solid state disk. The solid state disk 101 includes a master control integrated circuit, a plurality of flash memory particles and a microcontroller unit (MCU).

[0033] The master control integrated circuit is connected with the MCU through a double communication interface. The double communication interface includes a serial peripheral interface (SPI) and a redundant controller area network bus interface (CAN). The SPI interface is used for real-time transmission of temperature data, and its transmission rate is greater than or equal to 10 Mbps. The redundant CAN bus is used for transmitting control instructions, and its baud rate is 500 kbps.

[0034] The microcontroller unit has a multi-channel ADC module connected with the analog output end of the temperature sensor array. A digital pulse width modulation (PWM) controller in the microcontroller unit outputs 4 independent PWM signals to the driving circuit of the thin film heating sheet.

[0035] The solid state disk is divided into a plurality of regions. The plurality of regions include a master control region corresponding to the master control integrated circuit, and at least one flash memory region corresponding to the plurality of flash memory particles.

[0036] The back of the master control region and the back of the plurality of flash memory regions are both arranged with thin film heating sheets. The arranged thin film heating sheets are connected to the power management module (PMIC) of the power supply device 102 through copper foil wiring.

[0037] The thin film heating sheet is composed of a polyimide base layer, a nickel-chromium alloy heating wire and a silica gel insulation layer.

[0038] The thickness of the polyimide base layer is 0.1 mm.

[0039] The line width of the nickel-chromium alloy heating wire is 50 μm, and the spacing is 1 mm.

[0040] The thermal response time of the thin film heating sheet is less than 3 seconds.

[0041] The thin film heating sheet is integrated with over-temperature protection function. Each thin film heating sheet is internally provided with positive temperature coefficient material, which automatically cuts off the circuit when the local temperature of the thin film heating sheet exceeds 60℃.

[0042] The nickel-chromium alloy heating wires in the thin film heating sheet arranged on the back of the master control area are arranged in a honeycomb shape; the nickel-chromium alloy heating wires in the thin film heating sheet arranged on the back of each flash memory area are arranged in a serpentine shape.

[0043] The master control area is arranged with at least three temperature sensors to form a triangular monitoring sensor array. The triangular monitoring sensor array is used to monitor the master control integrated circuit. For example, as shown in Figure 2 , Figure 2 is an array structure diagram of the master control integrated circuit, in Figure 2 , the master control integrated circuit is arranged with three temperature sensors. The model of the temperature sensor can be TMP117, and the accuracy is ±0.1℃.

[0044] Each flash memory area is arranged with one temperature sensor, and each flash memory area is an area composed of part or all of a plurality of flash memory particles. For example, as shown in Figure 3 , Figure 3 is an array structure diagram of a flash memory area provided by an embodiment of the present application, in Figure 3 , four flash memory particles constitute a flash memory area, and the four flash memory particles share one temperature sensor.

[0045] The power supply device 102 can be any power supply device with communication function and computing function. The power supply device 102 is provided with a power management module (Power Management Integrated Circuit, PMIC). The PMIC is internally provided with a hardware proportional-integral-derivative (Proportional-Integral-Derivative, PID) controller. The response time of the hardware PID controller can be 10ms level. The hardware PID controller is used to realize fast temperature control. The hardware PID controller is connected with the master control integrated circuit. The power supply device 102 is used to heat the thin film heating sheet of each area and supply power to the solid state disk.

[0046] The backup power supply 103 can be any power supply device, which is used to provide voltage to the solid state disk 101 when the power supply device fails. The backup power supply 103 is additionally provided with a super capacitor group (0.1F / 5.5V), which maintains the operation of the heating circuit for 30 seconds when the power supply device is abnormal.

[0047] Based on the above solid state disk preheating system, the solid state disk 101 is configured to obtain an initial temperature value of each region in a plurality of regions when the solid state disk is powered on; detect whether the initial temperature value of each region is less than or equal to a minimum working temperature value corresponding to each region; and send a first instruction to the power supply device 102 when it is detected that the initial temperature value of each target region in at least one target region is less than or equal to the minimum working temperature value corresponding to each target region.

[0048] The power supply device 102 is configured to heat each target region in a full-power heating mode according to the first instruction.

[0049] The solid state disk 101 is further configured to monitor a real-time temperature value of each target region in real time; input the real-time temperature value monitored in real time into a preset prediction model to predict a target temperature value of each target region after a preset time period; and send a second instruction to the power supply device 102 when a difference between the target temperature value of each target region and the minimum working temperature value corresponding to each target region is less than a preset temperature difference value.

[0050] The power supply device 102 is configured to heat each target region in a pulse heating mode according to the second instruction until the real-time temperature value of each target region is greater than the minimum working temperature value corresponding to each region.

[0051] It can be understood that the minimum working temperature value corresponding to each region can be set according to actual needs. For example, the minimum working temperature value can be 0℃.

[0052] The preset prediction model can be a time series model established based on historical heating data. For example, the time series model can be an AutoRegressive Integrated Moving Average (ARIMA) model.

[0053] The preset time period can be set according to actual needs. For example, the preset time period can be 5 seconds.

[0054] It can be understood that the preset prediction model can predict the temperature change trend of each region in advance by the preset time period.

[0055] The preset temperature difference value can be set according to actual needs. For example, the preset temperature difference can be set to 2℃.

[0056] In the full-power heating mode, the thin film heating sheet continuously works at a rated power, and the energy output is stable and maximized. In the full-power heating mode, the heat of the thin film heating sheet is continuously output, and the rapid temperature rise of the region can be realized.

[0057] In the pulse heating mode, the film heating sheet works through the pulse cycle of "power on-power off", and the average power is adjusted by adjusting the pulse duty cycle (power-on time / total cycle). In the pulse heating mode, the heat of the film heating sheet is intermittently output, and the precise temperature control of the region can be realized.

[0058] Specifically, when the solid state disk is powered on, the MCU in the solid state disk acquires the initial temperature value of each region in the plurality of regions through the temperature sensor arranged in each region, and transmits the temperature value of each region in each region to the master control integrated circuit.

[0059] The master control integrated circuit detects whether the initial temperature value of each region is less than or equal to the minimum working temperature value corresponding to each region; when it is detected that the initial temperature value of each target region in at least one target region is less than or equal to the minimum working temperature value corresponding to each target region, a first instruction is sent to the power supply device 102.

[0060] It can be understood that when the solid state disk is powered on, when it is detected that the initial temperature value of each target region in at least one target region is less than or equal to the minimum working temperature value corresponding to each target region, it indicates that the temperature of each target region is in a low temperature state and cannot meet the minimum working temperature value of each target region, at which time the pre-heating mode is triggered to start. Therefore, the first instruction needs to be sent to the power supply device to heat the target region.

[0061] Further, after the power supply device receives the first instruction, the film heating sheet arranged in each target region is provided with voltage according to the full-power heating mode to heat each target region.

[0062] It can be understood that in the full-power heating mode, the temperature of each target region can be quickly raised when heating each target region, and the start-up time of the solid state disk is shortened.

[0063] Further, the master control integrated circuit monitors the real-time temperature value of each target region in real time; the real-time temperature value monitored in real time is input into a preset prediction model to predict the target temperature value of each target region after a preset time period; when the difference between the target temperature value of each target region and the minimum working temperature value corresponding to each target region is less than a preset temperature difference value, a second instruction is sent to the power supply device.

[0064] It can be understood that when the host integrated circuit predicts that the difference between the target temperature value of each target area and the minimum working temperature value corresponding to each target area is less than the preset temperature difference value, it indicates that the temperature of the target area has risen close to the minimum working temperature value. At this time, if the target area is still heated according to the full-power heating mode, it may cause the temperature of the target area to be too high, resulting in damage to the corresponding components of the target area. Therefore, in order to avoid the occurrence of the foregoing situation, it is necessary to timely send a second instruction to the power supply device to change the heating mode and reduce the heating intensity of the target area.

[0065] After the power supply device receives the second instruction, it heats each target area according to the pulse heating mode until the real-time temperature value of each target area is greater than the minimum working temperature value corresponding to each area.

[0066] It can be understood that by controlling the heating mode during the heating of each target area, the heating temperature of each target area can be accurately controlled, so that each target area can quickly and safely reach the corresponding minimum working temperature value. At the same time, controlling the temperature of each area according to the actual temperature of each area can avoid the problem of high power consumption caused by continuous heating of the entire solid state disk. At the same time, this method does not require the use of high-cost solid state disk, and has fast response speed and low delay, which can make the solid state disk start as soon as possible and improve the working efficiency of the solid state disk.

[0067] In some optional embodiments, the power supply device constructs a double closed-loop control for heating each target area by two ways during the heating of each target area.

[0068] Method one: inner loop closed-loop control of heating each target area.

[0069] The hardware controller in the power supply device is configured to obtain the real-time temperature value of each target area sent by the solid state disk; determine a plurality of internal control parameters corresponding to the hardware controller according to the real-time temperature value of each target area; and control the voltage of the thin film heating sheet arranged on the back of each target area to heat each target area according to the plurality of internal control parameters.

[0070] Method two: outer loop closed-loop control of heating each target area.

[0071] The host integrated circuit of the solid state disk is further configured to run an adaptive algorithm to determine a plurality of external control parameters corresponding to the hardware controller according to the real-time temperature value of each target area; send the plurality of external control parameters to the hardware controller; and the hardware controller is configured to control the voltage of the thin film heating sheet arranged on the back of each target area to heat each target area based on the plurality of external control parameters.

[0072] The above control parameters can be PID parameters required by the hardware PID controller. The PID parameters include a proportional coefficient, an integral coefficient, and a differential coefficient.

[0073] It can be understood that the fast response of the inner loop closed-loop control can timely respond to sudden changes in temperature and ensure the stability of the system. The adaptive adjustment of the outer loop closed-loop control can make the PID parameters adapt to different working conditions and improve the control precision. When the system working condition changes, the outer loop can adjust the PID parameters to enable the inner loop to work better. The parameters of the hardware PID controller are fixed and cannot adapt to all working conditions, while the software algorithm can make up for this deficiency. The hardware PID controller of the inner loop can work independently and does not require real-time intervention of the master control integrated circuit. The master control integrated circuit only needs to run the adaptive algorithm once every 5 seconds, greatly reducing the burden. The inner loop closed-loop control can better respond to moments when the temperature in each region changes frequently and quickly. The outer loop closed-loop control can better adapt to moments when each region has a high requirement for temperature control precision. Therefore, the combination of the two can ensure the fast response capability of the system and improve the adaptability and control precision of the system, which is an efficient control strategy.

[0074] In some optional embodiments, the power supply device is further configured to apply a preset voltage to the plurality of flash memory particles during the heating of each target region by the power supply device.

[0075] The preset voltage can be set according to the actual needs of the flash memory particles. For example, the preset voltage can be 1.8V.

[0076] It can be understood that a stable preset voltage can offset the fluctuations in circuit characteristics caused by heating and avoid problems such as read / write errors of flash memory particles, data verification failures, and the like caused by insufficient or fluctuating voltage, especially in low-temperature heating scenarios (such as when a solid-state disk is woken up from a hibernation state), which can reduce the startup delay caused by unstable voltage.

[0077] In some optional embodiments, the solid-state disk is configured to send a third instruction to the power supply device when it is detected that the temperature difference between two adjacent regions in the plurality of regions is greater than a third threshold value; and the power supply device is configured to receive the third instruction and stop heating the two adjacent regions.

[0078] The third threshold value can be set according to actual needs, for example, the third threshold value can be 3℃.

[0079] It can be understood that, in normal circumstances, the temperature of each of the two adjacent regions should be similar, and there will be no large temperature difference. Therefore, when it is monitored that the temperature difference between two adjacent regions in the plurality of regions is greater than the third threshold value, it indicates that the sensors corresponding to the two adjacent regions fail or the elements of the solid state disk corresponding to the two regions fail, and therefore the self-checking procedure needs to be triggered and the heating is stopped.

[0080] In some optional embodiments, the solid state disk is further configured to monitor whether the voltage of the backup power supply is greater than the first threshold value and whether the temperature of the backup power supply is greater than the second threshold value in real time during the heating of each target region by the power supply device; if it is monitored that the voltage of the backup power supply is greater than the first threshold value or the temperature of the backup power supply is greater than the second threshold value, it is determined that the backup power supply is abnormal, and a heating suspension instruction is sent to the power supply device; the power supply device is configured to receive the heating suspension instruction and stop heating each target region.

[0081] The first threshold value and the second threshold value can be set according to actual needs and are not limited.

[0082] It can be understood that, by double real-time monitoring of the voltage and temperature of the backup power supply, through early warning and rapid interruption, the hardware safety of the power supply device and the solid state disk is protected, and the instability of the performance of the SSD caused by the interruption of the heating process (such as the decrease of the read-write speed of the flash memory at low temperature) is avoided, and finally the heating control logic of safety first is realized.

[0083] Embodiments of the present application provide a pre-heating method of a solid state disk, which can be applied to the pre-heating system of the solid state disk described above, and the pre-heating system of the solid state disk includes a solid state disk and a power supply device, as shown in Figure 4 The specific processing steps of the pre-heating method of the solid state disk can include:

[0084] S401, when the solid state disk is powered on, the solid state disk acquires an initial temperature value of each region in a plurality of regions; it is detected whether the initial temperature value of each region is less than or equal to the minimum working temperature value corresponding to each region; when it is detected that the initial temperature value of each target region in at least one target region is less than or equal to the minimum working temperature value corresponding to each target region, a first instruction is sent to the power supply device.

[0085] S402, the power supply device heats each target region in accordance with the full-power heating mode according to the first instruction.

[0086] S403, the solid state disk monitors the real-time temperature value of each target area in real time; the real-time temperature value monitored in real time is input into a preset prediction model to predict the target temperature value of each target area after a preset time period; when the difference between the target temperature value of each target area and the minimum working temperature value corresponding to each target area is less than a preset temperature difference value, a second instruction is sent to the power supply device.

[0087] S404, the power supply device heats each target area according to the second instruction in a pulse heating mode until the real-time temperature value of each target area is greater than the minimum working temperature value corresponding to each area.

[0088] Embodiments of the present application provide another preheating method of a solid state disk, which can be applied to the solid state disk of the preheating system of the solid state disk as described above, such as Figure 5 As shown, the specific processing steps of the preheating method of the solid state disk can include:

[0089] S501, when the solid state disk is powered on, the initial temperature value of each area in the plurality of areas is obtained.

[0090] S502, detecting whether the initial temperature value of each area is less than or equal to the minimum working temperature value corresponding to each area.

[0091] S503, when it is detected that the initial temperature value of each target area in at least one target area is less than or equal to the minimum working temperature value corresponding to each target area, a first instruction is sent to the power supply device.

[0092] The first instruction instructs the power supply device to heat each target area in a full-power heating mode.

[0093] S504, the real-time temperature value of each target area is monitored in real time; the real-time temperature value monitored in real time is input into a preset prediction model to predict the target temperature value of each target area after a preset time period.

[0094] S505, when the difference between the target temperature value of each target area and the minimum working temperature value corresponding to each target area is less than a preset temperature difference value, a second instruction is sent to the power supply device.

[0095] The second instruction is used to instruct the power supply device to heat each target area in a pulse heating mode until the real-time temperature value of each target area is greater than the minimum working temperature value corresponding to each area.

[0096] In some optional embodiments, the hardware controller determines a plurality of external control parameters corresponding to the hardware controller according to the real-time temperature value of each target region; the plurality of external control parameters are sent to the hardware controller; and the hardware controller controls the voltage of the thin-film heating sheet arranged on the back of each target region based on the plurality of external control parameters, so as to heat each target region.

[0097] In some optional embodiments, during the heating of each target region by the power supply device, it is monitored in real time whether the voltage of the backup power supply is greater than a first threshold value and whether the temperature of the backup power supply is greater than a second threshold value; if it is monitored that the voltage of the backup power supply is greater than the first threshold value or the temperature of the backup power supply is greater than the second threshold value, it is determined that the backup power supply is abnormal, and a heating suspension instruction is sent to the power supply device, so that the power supply device receives the heating suspension instruction and stops heating each target region.

[0098] In some optional embodiments, when it is monitored that the temperature difference between two adjacent regions in the plurality of regions is greater than a third threshold value, a third instruction is sent to the power supply device, so that the power supply device receives the third instruction and stops heating the two adjacent regions.

[0099] Embodiments of the present application provide another preheating method of a solid state disk, which can be applied to the power supply device of the preheating system of the solid state disk as described above. Figure 6 As shown in FIG. 6, the specific processing steps of the preheating method of the solid state disk can include:

[0100] S601, when the initial temperature value of each target region in the at least one target region is less than or equal to the minimum working temperature value corresponding to each target region, a first instruction is received, and each target region is heated in a full-power heating mode.

[0101] S602, when the difference between the target temperature value of each target region and the minimum working temperature value corresponding to each target region is less than a preset temperature difference value, a second instruction is received, and each target region is heated in a pulse heating mode until the real-time temperature value of each target region is greater than the minimum working temperature value corresponding to each region.

[0102] In an example, the power supply device heats the thin-film heating sheet of each target region.

[0103] In some optional embodiments, a hardware controller in the power supply device acquires the real-time temperature value of each target region sent by the solid state disk; the hardware controller determines a plurality of internal control parameters corresponding to the hardware controller according to the real-time temperature value of each target region; and the hardware controller controls the voltage of the thin-film heating sheet arranged on the back of each target region based on the plurality of internal control parameters, so as to heat each target region.

[0104] In some alternative embodiments, the hardware controller in the power supply receives the plurality of external control parameters sent by the solid state disk, and controls the voltage of the thin film heating sheet arranged on the back of each target area based on the plurality of external control parameters, so as to heat each target area.

[0105] In some alternative embodiments, the power supply receives a pause heating instruction, and stops heating each target area.

[0106] In some alternative embodiments, the power supply applies a preset voltage to the plurality of flash memory particles during the heating of each target area by the power supply.

[0107] The features of the above-mentioned embodiments of the preheating method of the solid state disk can be referred to the related descriptions of the embodiments of the preheating system of the solid state disk, which will not be repeated here.

[0108] Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above-mentioned embodiments can be realized by means of software on a general hardware platform as required, of course, it can also be realized by hardware, but in many cases, the former is a better embodiment.

[0109] The embodiments of the present application also provide an electronic device, as shown in the figure, comprising a processor 10 and a memory 20, the memory 20 stores a computer program, the processor 10 is configured to run the computer program to perform the steps performed by the solid state disk, or the processor 10 is configured to run the computer program to perform the steps performed by the power supply. Figure 7 The embodiments of the present application also provide a computer readable storage medium, the computer readable storage medium stores a computer program, wherein the computer program is configured to perform the steps in any of the above-mentioned embodiments of the preheating method of the solid state disk when running.

[0110] In an exemplary embodiment, the above-mentioned computer readable storage medium can include but is not limited to: U disk, read-only memory (Read-Only Memory, ROM for short), random access memory (Random Access Memory, RAM for short), mobile hard disk, magnetic disk or optical disk and various computer program storage media.

[0111] The embodiments of the present application also provide a computer program product, the above-mentioned computer program product comprises a computer program, and the computer program is executed by a processor to realize the steps in any of the above-mentioned embodiments of the preheating method of the solid state disk.

[0112]

[0113] ​The embodiment of the present application further provides another computer program product, comprising a nonvolatile computer readable storage medium, the nonvolatile computer readable storage medium stores a computer program, the computer program is executed by a processor to implement the steps in any of the above-mentioned solid state disk preheating method embodiments.

[0114] Those skilled in the art will further appreciate that the functions implemented by the various example components and algorithm steps described herein can be implemented using electronic hardware, computer software, or any combination thereof. When the functions are implemented in software, the functions can be stored on or transmitted over a computer-readable medium, such as an optical, magnetic or semiconductor storage medium. The methods described herein can be implemented by a processor executing a computer program from a computer-readable medium. The terms "processor" and "computer" should be interpreted broadly to encompass a complete computing device, as well as a computer processor (shared, dedicated, or group) that executes software. Various embodiments of the application can be implemented using different combinations of hardware and software dependent on the implementation requirements and design constraints.

[0115] The above describes in detail the preheating system of the solid state disk provided by the present application. The principles and implementation manners of the present application are described by using specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A preheating system of a solid state drive, characterized by, The preheating system comprises a solid state disk and a power supply device, the solid state disk is divided into multiple areas; The solid state disk is configured to obtain an initial temperature value of each of the multiple areas when the solid state disk is powered on; Detect whether the initial temperature value of each of the multiple areas is less than or equal to a minimum working temperature value corresponding to each of the multiple areas; When it is detected that the initial temperature value of each of at least one target area is less than or equal to a minimum working temperature value corresponding to each of the target area, a first instruction is sent to the power supply device; The power supply device is configured to heat each of the target area in a full-power heating mode according to the first instruction; The solid state disk is further configured to monitor a real-time temperature value of each of the target area in real time; The real-time temperature value monitored in real time is input into a preset prediction model to predict a target temperature value of each of the target area after a preset time period; When a difference between the target temperature value of each of the target area and a minimum working temperature value corresponding to each of the target area is less than a preset temperature difference value, a second instruction is sent to the power supply device; The power supply device is configured to heat each of the target area in a pulse heating mode according to the second instruction until the real-time temperature value of each of the target area is greater than the minimum working temperature value corresponding to each of the target area.

2. The system of claim 1, wherein, The solid state disk comprises a master control integrated circuit and multiple flash memory particles; the multiple areas comprise a master control area corresponding to the master control integrated circuit and at least one flash memory area corresponding to the multiple flash memory particles; the back of the master control area and the back of the multiple flash memory areas are arranged with film heating pieces; The power supply device is specifically configured to heat the film heating pieces of each of the target area.

3. The system of claim 2, wherein, The power supply device is built-in with a hardware controller; the hardware controller is configured to obtain the real-time temperature value of each of the target area sent by the solid state disk; determine multiple internal control parameters corresponding to the hardware controller according to the real-time temperature value of each of the target area; control the voltage of the film heating pieces arranged on the back of each of the target area according to the multiple internal control parameters to heat each of the target area.

4. The system of claim 2, wherein, The power supply device is built-in with a hardware controller; the solid state disk is further configured to determine multiple external control parameters corresponding to the hardware controller according to the real-time temperature value of each of the target area; and send the multiple external control parameters to the hardware controller; The hardware controller is configured to control the voltage of the film heating pieces arranged on the back of each of the target area based on the multiple external control parameters to heat each of the target area.

5. The system of claim 4, wherein, The preheating system further comprises a backup power supply of the solid state disk; The solid state disk is further configured to monitor whether the voltage of the backup power supply is greater than a first threshold value and whether the temperature of the backup power supply is greater than a second threshold value in real time during the heating process of each of the target area by the power supply device. If the voltage of the backup power supply is greater than the first threshold value or the temperature of the backup power supply is greater than the second threshold value, it is determined that the backup power supply is abnormal, and a heating suspension instruction is sent to the power supply device; The power supply device is configured to receive the heating suspension instruction and stop heating each target area.

6. The system of claim 4, wherein, The master control area is arranged with at least three temperature sensors to form a triangular monitoring sensor array for monitoring the master control integrated circuit; each flash memory area is arranged with one temperature sensor, and each flash memory area is an area formed by part or all of the flash memory particles.

7. The system according to any of claims 1-6, characterized in that, The solid state disk is configured to send a third instruction to the power supply device when it is monitored that the temperature difference between two adjacent areas of the plurality of areas is greater than a third threshold value. The power supply device is configured to receive the third instruction and stop heating the two adjacent areas.

8. The system according to any of claims 2-6, characterized in that, The thin film heating sheet is composed of a polyimide base layer, a nichrome heating wire and a silica gel insulation layer.

9. The system according to any of claims 2-6, characterized in that, The nichrome heating wire in the thin film heating sheet arranged on the back of the master control area is arranged in a honeycomb shape; and the nichrome heating wire in the thin film heating sheet arranged on the back of each flash memory area is arranged in a serpentine shape.

10. The system of any of claims 1-6, wherein, The input end of the power supply device is provided with a recoverable polymer positive temperature coefficient device and a mechanical temperature fuse.

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