Ultrasonic molecular beam generating device with wide temperature regulation range
By combining the design of semiconductor cooling chips and heating induction coils, a wide temperature regulation of the ultrasonic molecular beam source was achieved, which solved the problem of limited temperature regulation range in the existing technology, improved heating efficiency and reduced energy waste.
Patent Information
- Application Number
- CN202410625056.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-11-21
AI Technical Summary
Existing ultrasonic molecular beam sources cannot achieve wide-range temperature regulation, resulting in a limited temperature coverage for experimental research, low heating efficiency, and serious energy waste.
By combining a semiconductor cooling chip and a heating induction coil, the semiconductor cooling chip provides cooling, the heat exchange copper block facilitates heat exchange, and the heating induction coil provides heating, thus achieving continuous temperature regulation.
It achieves temperature coverage from sub-zero to high temperatures, improves heating efficiency, reduces energy waste, and broadens the temperature range of molecular beams.
Smart Images
Figure CN121001248A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of vacuum, and particularly relates to an ultrasonic molecular beam generating device with wide temperature regulation. BACKGROUND
[0002] With the continuous development of molecular beam technology, molecular beams are widely applied to industrial and scientific research fields, and in particular in the scientific research field, more and more vacuum experiments require ultrasonic molecular beams with narrow speed distribution and adjustable translational energy to help study the behaviors of molecules at different energies and the interaction between molecules and materials.
[0003] In the existing technology, most of the molecular beam sources are fixed-temperature, or can only be heated or cooled. For example, a common room-temperature molecular beam source can only work at room temperature to generate a single-condition molecular beam. A commonly used heated molecular beam source usually adopts a resistance wire winding method to heat the molecular beam valve head. This method can only obtain a molecular beam higher than room temperature, and since the resistance wire has more thermal light conversion at high temperature, most of the energy is converted into light energy, resulting in energy loss and low heating efficiency. Meanwhile, the heated parts are numerous, and a large amount of cooling water is needed for heat dissipation, resulting in further energy waste. A less used low-temperature beam source usually uses a refrigerant to reduce the temperature. Since there are few types of low-temperature liquids, the operation is difficult, and thus the temperature that can be achieved by the beam source is limited to the temperature at which the low-temperature liquid reaches thermal equilibrium, and it is difficult to adjust.
[0004] In order to conduct molecular experimental research in a wider temperature range, a new ultrasonic molecular beam source capable of wide-range temperature regulation is needed, and the existing ultrasonic molecular beam source cannot solve this problem. SUMMARY
[0005] In view of the above deficiencies in the prior art, the technical problem to be solved by the present application is to provide an ultrasonic molecular beam generating device with wide temperature regulation, so as to realize a single beam source generating a high-temperature to low-temperature coverage.
[0006] In order to achieve the above purpose, the present application adopts the following technical scheme:
[0007] An ultrasonic molecular beam generating device with wide temperature regulation, comprising a molecular beam valve, a mounting base, a semiconductor refrigerating sheet, a heat exchange copper block, an insulating support and a heating induction coil, the molecular beam valve is used to generate a molecular beam, the molecular beam valve is fixed on the mounting base, a heating induction coil is arranged at the valve head of the molecular beam valve, a high-frequency oscillation circuit based on the heating induction coil generates a current to heat the molecular beam, the mounting base is provided with a semiconductor refrigerating sheet, the semiconductor refrigerating sheet is used for refrigeration, and the heat exchange copper block is used for cooling the semiconductor refrigerating sheet.
[0008] Further, the semiconductor refrigerating sheet is fixed by the heat exchange copper block, a circulating water channel is arranged in the heat exchange copper block, and the circulating water channel is connected with external circulating water, and the external circulating water is used for cooling the semiconductor refrigerating sheet.
[0009] Further, the heating induction coil is kept a certain distance from the molecular beam valve, and the two are insulated.
[0010] Further, the heat exchange copper block is provided with corresponding hole positions for mounting the insulating support, and the insulating support comprises an upper insulating support and a lower insulating support, and is used for connecting two ends of the heating induction coil respectively, and the insulating support is used for fixing the heating induction coil.
[0011] Further, the center of the heating induction coil is kept concentric with the center of the molecular beam valve.
[0012] Further, the semiconductor refrigerating sheet is used for cooling the entire molecular beam valve when a high-temperature molecular beam is generated, so that the temperature of positions other than the valve head is stable, or the entire molecular beam valve is cooled without turning on the induction circuit, and an ultrasonic molecular beam lower than room temperature is generated.
[0013] The present application has the following advantages and beneficial effects:
[0014] 1. The temperature adjusting range of the present application is wide, and can realize complete coverage from zero minus to high temperature. In combination of heating and cooling, the temperature range of the molecular beam is widened.
[0015] 2. The molecular beam temperature of the present application is continuously adjustable.
[0016] 3. The entire device of the present application has integrity, and is convenient to use in practice. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0018] Figure 1 It is a front view of the present application;
[0019] Figure 2 It is an axonometric view of the present application;
[0020] In the figure: 1 is a mounting base, 2 is a molecular beam valve, 3 is a semiconductor refrigerating sheet, 4 is a heat exchange copper block, 5 is an insulating support, and 6 is a heating induction coil. DETAILED DESCRIPTION
[0021] It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other in the case of no conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.
[0022] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, but not all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not as any limitation on the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0023] It should be noted that the terms used herein are only intended to describe specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form, unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, there is a presence of the features, steps, operations, devices, components and / or their combinations.
[0024] Unless specifically stated otherwise, the relative arrangement of the components and steps illustrated in these embodiments and the numerical expressions and values set forth herein are not limiting of the scope of the present application. It should be understood that the various parts of the drawings are not necessarily drawn to scale, and that, for the purpose of convenience and clarity, not all components and steps can be shown in the drawings. The techniques, methods, and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the description of the present application. In all examples shown and discussed herein, any specific value should be interpreted as merely an example, and not as a limitation. Thus, other examples of the exemplary embodiments can have different values. It should be noted that similar reference numerals and letters in the following drawings represent similar items, and thus, once an item is defined in one drawing, it need not be discussed further in subsequent drawings.
[0025] In the description of the application, it should be understood that the orientation words such as "front, back, up, down, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is generally based on the orientation or position relationship shown in the drawings, only for the convenience of describing the application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the scope of protection of the application: the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component itself.
[0026] For the convenience of description, spatial relative terms such as "over", "above", "upper surface", "upper" and the like can be used herein to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "under" the other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.
[0027] In addition, it should be noted that the use of "first", "second" and the like to define parts has only the purpose of facilitating the distinction of the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore, it cannot be understood as a limitation on the scope of protection of the application.
[0028] As Figure 1 , 2As shown, the wide temperature regulated ultrasonic molecular beam generating device provided by the present application comprises a molecular beam valve 1, a mounting base 2, semiconductor refrigerating sheets 3, a heating induction coil 6, an insulating support 5 and heat exchange copper blocks 4. The molecular beam valve is fixed in the mounting base and used for generating a molecular beam. The mounting base is used for locking the semiconductor refrigerating sheets and the heat exchange copper blocks. The semiconductor refrigerating sheets and the heat exchange copper blocks are kept at a certain mounting pressure to achieve the best heat exchange effect. The number of the semiconductor refrigerating sheets and the heat exchange copper blocks is several, and they are alternately arranged at both ends of the mounting base. In the embodiment, two groups of semiconductor refrigerating sheets are arranged above the mounting base, and two groups of semiconductor refrigerating sheets are arranged below the mounting base. The heat exchange copper blocks have cooling liquid pipelines. In the embodiment, cooling water is selected as the cooling liquid. Coil fixing bases are left on the outermost heat exchange copper blocks, and the induction heating coil is fixed in the coil fixing bases. The center of the induction coil is kept concentric with the center of the molecular beam valve. The temperature of the molecular beam valve part can be measured.
[0029] The semiconductor refrigerating sheets need to cooperate with an external circuit to generate a low-temperature surface through a set current, so as to reduce the temperature in this way. While generating the low temperature, heat is generated, which is exchanged by the cooling liquid in the heat exchange copper blocks to ensure the normal work of the semiconductor refrigerating sheets.
[0030] As one of the implementation scenarios, the molecular beam valve sprays an initial molecular beam at a preset temperature, the induction coil is controlled by an external circuit, high-frequency current is passed through the coil to generate a high-frequency alternating electromagnetic field, so as to generate an induced current in the molecular beam valve, and the eddy current generated in a short time rapidly heats the molecular beam valve. By changing the frequency and current size of the induced current, the temperature of the induction heating can be adjusted. While the induction coil is heated, in order to improve the generation quality of the molecular beam, the base needs to be cooled at the same time and kept at room temperature, and the semiconductor refrigerating sheets need to work at the same time.
[0031] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A wide-temperature-adjustable ultrasonic molecular beam generating device, characterized in that, The device includes a molecular beam valve (1), a mounting base (2), a semiconductor cooling chip (3), a heat exchange copper block (4), an insulating bracket (5), and a heating induction coil (6). The molecular beam valve (1) is used to generate a molecular beam. The molecular beam valve (1) is fixed on the mounting base (2). The valve head of the molecular beam valve (1) is provided with a heating induction coil (6). The high-frequency oscillation circuit of the heating induction coil (6) generates current to heat the molecular beam. The mounting base (2) is equipped with a semiconductor cooling chip (3). The semiconductor cooling chip (3) is used for cooling. The heat exchange copper block (4) is used to cool the semiconductor cooling chip (3).
2. The wide-temperature-adjustable ultrasonic molecular beam generating device according to claim 1, characterized in that, The semiconductor cooling chip (3) is fixed by the heat exchange copper block (4). A circulating water channel is provided in the heat exchange copper block (4). The circulating water channel is connected to an external circulating water source, and the external circulating water source is used to cool the semiconductor cooling chip (3).
3. The wide-temperature-adjustable ultrasonic molecular beam generating device according to claim 1, characterized in that, The heating induction coil (6) is kept at a certain distance from the molecular beam valve (1), and the two are insulated from each other.
4. The wide-temperature-adjustable ultrasonic molecular beam generating device according to claim 1, characterized in that, The heat exchange copper block (4) has corresponding holes for installing the insulating bracket (5). The insulating bracket (5) includes an upper insulating bracket (5) and a lower insulating bracket (5), which are used to connect the two ends of the heating induction coil (6) respectively. The insulating bracket (5) serves to fix the heating induction coil (6).
5. The wide-temperature-adjustable ultrasonic molecular beam generating device according to claim 1 or 3, characterized in that, The center of the heating induction coil (6) is concentric with the center of the molecular beam valve (1).
6. The wide-temperature-adjustable ultrasonic molecular beam generating device according to claim 1, characterized in that, The semiconductor cooling chip is used to cool the entire molecular beam valve when generating high-temperature molecular beams. Its function is to ensure temperature stability at locations other than the valve head, or to ensure that the sensing circuit is not activated. The entire molecular beam valve is cooled to produce an ultrasonic molecular beam below room temperature.