Surface type in-situ measurement method and thinning machine

Abstract

The invention provides a surface type in-situ measurement method and a thinning machine, and the method comprises the steps: obtaining and collecting a plurality of point data of a flat part located on a rotary table of the thinning machine, each point data comprises a point position and height information corresponding to the flat part, and the plurality of point data are collected on M ring layers with the center of the flat part as the center, n pieces of point data are collected in each circle layer; among all the point data in any two adjacent circle layers, on the basis of the point position contained in each point data and other adjacent point data, carrying out line connection so as to divide a plurality of independent areas which are not affiliated to each other between the two adjacent circle layers; determining an area surface type corresponding to each independent area based on height information contained in the point data, and further determining a surface type of the flat piece; and identifying the surface type of the flat part, and determining the surface type of the flat part. According to the invention, the problems of inaccurate surface type measurement of the flat part and low offline measurement efficiency in the prior art are solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor measurement technology, specifically to an in-situ surface measurement method and a thinning machine. Background Technology

[0002] The wafer manufacturing process in the semiconductor manufacturing field is affected by various factors, including material properties, processing technology, and equipment precision. These factors can lead to minute deformations or irregular shapes on the wafer surface. At the same time, with the continuous advancement of semiconductor technology, the requirements for wafer surface quality are becoming increasingly stringent.

[0003] In current wafer thinning processes, to ensure precision and uniformity and avoid unnecessary damage to the wafer, multiple processing steps are typically required to complete the wafer processing and ultimately achieve the desired wafer shape. After each step, relevant wafer parameters must be obtained before processing can proceed. Wafer shape is a crucial parameter within this wafer data set.

[0004] In the process of implementing this application, the inventors discovered that the related technology has at least the following technical problems:

[0005] Currently, surface profile measurement during the processing of flat components such as wafers, TGV glass substrates, sapphire, and quartz requires transferring the flat component to other measuring equipment after processing to obtain surface profile data. Surface profile measurement often requires a full scan of the flat component, which is time-consuming and significantly reduces the efficiency of flat component processing. Taking wafer thinning as an example, after completing the thinning stage, current wafer surface profile measurement requires removing the wafer from the thinning equipment, transferring it to a measuring environment, performing intensive scanning of the wafer surface to obtain the corresponding surface profile information, determining the surface profile category, and then placing the wafer back into the thinning equipment. Based on this surface profile category, it is determined whether to adjust the processing technology. Therefore, the existing offline wafer surface profile inspection method leads to a decrease in processing efficiency. Summary of the Invention

[0006] In view of this, this application provides a surface shape in-situ measurement method and a thinning machine.

[0007] In a first aspect, embodiments of this application propose an in-situ surface shape measurement method, including:

[0008] Multiple point data points are acquired from the flat part located on the turntable of the thinning machine. Each point data point includes the point position on the flat part and the height information corresponding to the point position. The multiple point data points are acquired from M concentric circles centered on the center of the flat part, and N point data points are acquired from each concentric circle, where M and N are both integers greater than 2.

[0009] Between all the point data in any two adjacent concentric circles, lines are drawn based on the point positions contained in each point data and the other adjacent point data to divide multiple independent regions that do not belong to each other between the two adjacent concentric circles.

[0010] Based on the height information contained in the point data, the area shape corresponding to each independent region is determined.

[0011] Based on the surface profile of each independent region, the surface profile of the flat component is determined;

[0012] The surface shape of the flat part is identified to determine the surface shape category of the flat part.

[0013] Optionally, the distance between any two adjacent concentric circles is the same.

[0014] Optionally, the point data in each of the concentric circles is evenly distributed.

[0015] Optionally, the step of connecting all the point data in any two adjacent concentric layers with other adjacent point data based on the point positions contained in each point data to divide the two adjacent concentric layers into multiple independent regions that do not belong to each other includes:

[0016] The point is located on the mapping of the flat component based on the point position contained in each of the point data;

[0017] For each point data, two adjacent point data in the same concentric circle are connected based on the point location contained in the point data, and point data corresponding to the point data in the adjacent concentric circle are determined based on the concentric circle in which the point data is located, and the point data is connected to the corresponding point data, thereby dividing multiple independent regions that do not belong to each other between two adjacent concentric circles.

[0018] Optionally, the point data between any two adjacent concentric circles correspond one-to-one.

[0019] Optionally, determining the area shape corresponding to each independent area based on the height information contained in the point data includes:

[0020] For each independent region, determine the point data corresponding to each vertex position in that independent region;

[0021] The surface shape of the independent region is generated based on the height information contained in the point data corresponding to each vertex position of the independent region.

[0022] Optionally, generating the surface shape of the independent region based on the height information contained in the point data corresponding to each vertex position of the independent region includes:

[0023] The surface shape of the independent region is fitted based on the height information contained in the point data corresponding to each vertex position of the independent region.

[0024] Optionally, the identification of the surface shape of the flat component includes:

[0025] A cross-section passing through the center of the flat component is taken radially from the flat component.

[0026] The surface type of the flat part is determined based on the shape of the cross-section.

[0027] Optionally, the identification of the surface shape of the flat component includes:

[0028] Select one independent region within each lap of independent regions;

[0029] The surface type of the flat component is determined based on the surface type of each selected independent region.

[0030] Secondly, embodiments of this application also propose a thinning machine, comprising:

[0031] A turntable is used to rotate flat parts;

[0032] Both the transverse movement mechanism and the thickness measurement probe are mounted above the turntable. The transverse movement mechanism is used to adjust the distance between the thickness measurement probe and the flat part in the radial direction of the flat part, so that the thickness measurement probe can collect point data of the flat part at different distances when the turntable rotates the flat part.

[0033] A memory, a processor, and a computer program stored in the memory and executable on the processor, for the processor to implement the above-described surface profile in-situ measurement method when the processor executes the computer program.

[0034] Thirdly, embodiments of this application also provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described in-situ surface measurement method.

[0035] The surface shape in-situ measurement method and thinning machine provided in this application acquire multiple point data of a flat part located on the turntable of the thinning machine. Each point data includes the point position on the flat part and the height information corresponding to that point position. The multiple point data are collected from M concentric circles centered on the center of the flat part, and N point data are collected from each concentric circle. Between all the point data in any two adjacent concentric circles, lines are drawn between the point positions contained in each point data and other adjacent point data to divide multiple independent regions that are not subordinate to each other between the two adjacent concentric circles. The surface shape of each independent region is determined based on the height information contained in the point data. The surface shape of the flat part is determined based on the surface shape of each independent region. The surface shape of the flat part is identified to determine the surface shape category of the flat part. By collecting height information from the same number of points in concentric circles on the turntable of the thinning machine, and then connecting different points in different concentric circles, the overall area of ​​the flat part is divided into multiple complementary and subordinate independent areas. The surface shape of each independent area is then determined, thereby determining the surface shape of the entire flat part and its surface shape category. This solves the problems of inaccurate surface shape measurement and low efficiency of offline measurement in existing technologies, and achieves the goal of accurately obtaining the surface shape category of flat parts in situ, thereby improving the efficiency and safety of flat part processing.

[0036] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0038] Figure 1 A flowchart illustrating an in-situ surface shape measurement method provided in this application embodiment;

[0039] Figure 2 A schematic diagram of the surface profile of a flat component provided in an embodiment of this application;

[0040] Figure 3 A flowchart of step 200 provided in an embodiment of this application;

[0041] Figure 4 A flowchart of step 300 provided in an embodiment of this application;

[0042] Figure 5 A contour map of a separate, independent region provided in an embodiment of this application;

[0043] Figure 6 A 3D surface topography image of a separate, independent region provided in this application embodiment;

[0044] Figure 7 A 3D surface topography diagram of a flat part formed by bilinear interpolation is provided for an embodiment of this application;

[0045] Figure 8 A flowchart of step 500 provided in an embodiment of this application;

[0046] Figure 9 A schematic cross-sectional view of the flat part taken along its diameter direction, as provided in an embodiment of this application;

[0047] Figure 10 A flowchart of another step 500 provided in an embodiment of this application;

[0048] Figure 11 This is a schematic diagram of a thinning machine provided in an embodiment of this application. Detailed Implementation

[0049] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0050] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0052] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0053] Please refer to Figure 1 , Figure 1 A flowchart illustrating an in-situ surface measurement method provided in this application embodiment, wherein the in-situ surface measurement method provided in this application embodiment includes the following steps 100 to 400:

[0054] Step 100: Acquire multiple point data of the flat part located on the turntable of the thinning machine. Each point data includes the point position on the flat part and the height information corresponding to the point position. The multiple point data are collected from M concentric circles centered on the center of the flat part, and N point data are collected from each concentric circle, where M and N are both integers greater than 2.

[0055] The flat component includes, but is not limited to, wafers, glass substrates, and semiconductor devices awaiting thinning. The height information can be the thickness value of the flat component or the height value of a point on the upper surface of the flat component. However, when the thickness value of the flat component is used as the height information, the flat component must be made of a transparent material and the lower end face of the flat component must be flat. Only in this way can the thickness measurement probe collect the thickness value of the flat component as the height information of the flat component.

[0056] In this embodiment, a thickness measuring probe can be aligned with the flat part and its height information can be collected. The thickness measuring probe can be a spectral confocal probe. In addition, the point positions included in the point data can be represented by positions in a Cartesian coordinate system based on the flat part. The thickness measuring probe can be a spectral confocal thickness measuring sensor. This spectral confocal thickness measuring sensor can not only be used to measure thickness, but also to measure vertical displacement (i.e., the height value of the upper surface of the flat part).

[0057] It should be noted that the number of point data collected can be greater than the number of point data obtained in the embodiment, and the number of collection layers can also be greater than the number of obtained layers. Those skilled in the art can obtain the desired amount of data as needed.

[0058] Among them, the M concentric circles can be M circles centered on the center of the flat part and defined by different radii of the flat part.

[0059] In an optional embodiment, the distance between any two adjacent concentric circles is the same.

[0060] When the distance between any two adjacent concentric rings is the same, it can be ensured that the M concentric rings can be more evenly distributed on the flat part.

[0061] It should be noted that the value of M can be set according to the size of the flat part, and ensure that the M rings fill the entire upper surface of the flat part as quickly as possible.

[0062] In some alternative embodiments, the point data in each of the concentric circles is uniformly distributed.

[0063] In the following embodiments, a wafer will be used as a representative of a flat component for illustration. In the embodiments, the step of collecting multiple point data of the wafer located on the turntable of the thinning machine is to first adjust the distance from the thickness measurement probe to the center of the wafer, and then drive the turntable used to support the wafer to rotate, so that the thickness measurement probe can collect point data of the wafer in layers.

[0064] Furthermore, the process of collecting data from multiple points on the wafer located on the thinning machine turntable can be illustrated with an example. The process may include:

[0065] (1) First, restore the wafer to its original position according to the positioning edge. This original position can be used as the starting point of the Cartesian coordinate system.

[0066] (2) Data collection points

[0067] ① Set the wafer diameter, such as 6 wafers, enter a diameter of 150mm.

[0068] ② Set the maximum measurement radius, which is specified to be 5mm from the edge, i.e., set it to 70mm.

[0069] ③ Set the measurement radius interval (i.e., the distance between two adjacent layers), which determines the number of layers, i.e., the value of M. For example, if the radius interval is set to 10mm, then starting from the center position, every 10mm is used as the step interval for the radial movement of the thickness measurement probe; that is, the thickness measurement probe position is 10mm, 20mm, 30mm...70mm from the center, then the value of M is 7.

[0070] ④ Set the fixed number of points to be collected for each layer, which is the value of N. For example, if the value of N is 50, then 50 points will be collected for each layer. Then, the angle distribution corresponding to the point data in each layer will be calculated based on the set number of points.

[0071] Taking the setting of collecting 50 data points per concentric circle as an example, with the angle distribution using radians at equal intervals of 0-2π, the corresponding relationship is shown in the table below:

[0072] Midpoint data sequence number of the concentric circle Angle 1 0.1257 2 0.2513 3 0.3770 4 0.5027 5 0.6283 ... ... 50 6.1575

[0073] ⑤ Based on the measurement radius, angle distribution, and other information, determine the position of the point data in the Cartesian coordinate system; taking 50 points in each layer as an example, the angles and corresponding x and y coordinates can be shown in the table below:

[0074] Step Radius_mm Angle_deg X_mm Y_mm 1 0 0 0 0 2 10 0 10 0 3 10 7.2 9.92113 1.2533 4 10 14.4 9.6858 2.4868 5 10 21.6 9.2977 3.6812 6 10 28.8 8.7630 4.8175 7 10 36 8.0901 5.8778 8 10 43.2 7.2896 6.8454 9 10 50.4 6.374 7.7051 10 10 57.6 5.3582 8.4432

[0075] Optionally, the number of times the same data point is collected and the height information from multiple measurements can be averaged to increase the reliability of the data. This can be achieved by setting the data point to collect data 100 times.

[0076] ⑥ This drives the turntable to rotate the wafer, and the thickness measurement probe cyclically performs displacement and data acquisition. Finally, the point data is recorded in the form of (x, y, z), as shown in the table below, thus completing the point data acquisition:

[0077]

[0078]

[0079] It should be noted that the above methods for collecting point data are merely illustrative examples. Those skilled in the art can acquire point data using other methods based on actual circumstances.

[0080] Step 200: In any two adjacent concentric circles, connect all the point data based on the point positions contained in each point data with other adjacent point data to divide multiple independent regions that do not belong to each other between the two adjacent concentric circles.

[0081] Since the point data are all collected from the flat component and arranged in concentric circles, when the point positions contained in the point data of any two adjacent concentric circles are connected to divide the two adjacent concentric circles into multiple independent regions that are not affiliated to each other, the flat component can be divided into multiple independent regions similar to the shape of a dartboard. That is to say, each individual independent region is formed by connecting at least 3 point data.

[0082] For example, three-dimensional data (x, y, z) with coordinates can be created, and point data can be placed into this three-dimensional data to simulate a wafer. Connecting adjacent point data in the same layer and connecting point data in adjacent layers radially can generate independent regions corresponding to the height information distribution of the wafer.

[0083] In addition, in some optional embodiments, for the center of the flat component, when point data of the center of the flat component can be collected, the point positions contained in the point data are connected with the point positions contained in the point data of the nearest ring to generate an independent region. In this way, the independent region can cover the central region of the flat component.

[0084] Step 300: Determine the area shape corresponding to each independent area based on the height information contained in the point data.

[0085] The region surface shape is determined by the height information of all points in an independent region, or it can be a visualization result of the height information of all points in an independent region.

[0086] In addition, since each independent region is enclosed by at least 3 point data as vertices of the independent region, the region shape of each independent region is determined based on the thickness corresponding to the point data enclosing each independent region. The region shape can be determined by uniformization processing or by numerical fitting of the height information contained in the point data corresponding to each independent region.

[0087] Step 400: Determine the surface shape of the flat component based on the surface shape of each independent region.

[0088] Since the point data is distributed in concentric circles, and these concentric circles are distributed on flat components with different radii, the independent areas enclosed by the point data cover most of the flat component. Please refer to [reference needed]. Figure 2 , Figure 2 This is a schematic diagram of the surface shape of a flat part provided in an embodiment of this application. The surface shape of the flat part can be obtained by splicing together the surface shapes of each independent region.

[0089] Step 500: Identify the surface shape of the flat part and determine the surface shape category of the flat part.

[0090] The surface types of flat parts include, but are not limited to, planar, concave, convex, double-convex, and double-concave types. The surface type of a flat part can be identified by methods such as cross-sectional analysis or scanning to determine its characteristics. These characteristics are then compared with the corresponding morphologies for each surface type to determine the surface type of the flat part. This provides a theoretical basis for adjusting the thinning process of the flat part in the next stage.

[0091] Please refer to Figure 3 , Figure 3The flowchart of step 200 provided in the embodiments of this application, in some optional embodiments, step 200, in any two adjacent concentric layers, connects all the point data based on the point position contained in each point data with other adjacent point data to divide multiple independent regions that do not belong to each other between the two adjacent concentric layers, including the following steps 210 to 220:

[0092] Step 210: Locate the points on the mapping of the flat component based on the point positions contained in each of the point data;

[0093] Step 220: For each point data, connect two adjacent point data in the same concentric circle based on the point location contained in the point data, and determine the point data corresponding to the point data in the adjacent concentric circle based on the concentric circle in which the point data is located, and connect the point data with the corresponding point data, thereby dividing multiple independent regions that do not belong to each other between two adjacent concentric circles.

[0094] In an embodiment, the mapping of the flat component can be three-dimensional data (x, y, z) with coordinates, where x and y correspond to the point positions of the point data, and z corresponds to the height information of the point data. For each point data, the point positions contained in the point data are located in the three-dimensional data. Each point data is connected to the adjacent point data of the same layer, and then connected to the point data of two adjacent layers, thereby dividing multiple independent regions that do not belong to each other between two adjacent layers, completing the division of the entire region between two adjacent layers.

[0095] In some optional embodiments, in step 220, the point data between any two adjacent concentric layers correspond one-to-one.

[0096] In this embodiment, each point data in the same concentric circle is connected to the adjacent point data, and the point data between any two adjacent concentric circles correspond one-to-one. In this way, by connecting the point data with the corresponding point data in the adjacent concentric circles, each independent region is enclosed by two point data from each of the two adjacent concentric circles.

[0097] In some alternative embodiments, for each point data, there are other point data radially distributed in the adjacent concentric layers of the flat member, and the point data is connected to the other point data radially distributed in the adjacent concentric layers of the flat member to form an independent region similar to a fan shape.

[0098] In this context, there are other point data distributed radially along the flat component in the adjacent concentric layers of the point data. This can be understood as the adjacent point data between different concentric layers being distributed along the radius of the flat component, and the point data included in different concentric layers being connected by a line through this radius. In other words, the adjacent point data distributed radially along the flat component correspond to each other.

[0099] It should be noted that each individual independent area can also be surrounded by 3 or other numbers of point data, and those skilled in the art can set it up specifically according to actual needs.

[0100] Please refer to Figure 4 , Figure 4 A flowchart of step 300 provided in an embodiment of this application is provided. In some optional embodiments, step 300, which determines the area shape corresponding to each independent area based on the height information contained in the point data, includes the following steps:

[0101] Step 310: For each independent region, determine the point data corresponding to each vertex position in that independent region;

[0102] Step 320: Generate the surface shape of the independent region based on the height information contained in the point data corresponding to each vertex position of the independent region.

[0103] In this embodiment, for each independent region, all point data included in that independent region are first determined. Then, the surface shape of the independent region is calculated based on the height information included in each point data. Alternatively, the surface shape of the independent region can be calculated based on both the height information included in each point data and the point position of the point data. For example, when the data is collected using a uniformization process, only the height information included in each point data needs to be determined; if the data is collected using a numerical fitting method, the point position of each point data is also required in addition to determining the height information included in each point data.

[0104] In some optional embodiments, step 320, generating the surface shape of the independent region based on the height information contained in the point data corresponding to each vertex position of the independent region, includes:

[0105] The thickness value of the surface shape of the independent region is determined by the average height information contained in the point data corresponding to each vertex position of the independent region.

[0106] Specifically, the average height information contained in the point data corresponding to each vertex position of the independent region is used as the thickness value of the surface of the independent region. That is, first determine the point data of each independent region, determine the total number of point data in the independent region, and use the total number as the denominator. Then, weight the height information corresponding to each point data, use the weighted value as the numerator, calculate the average value, and then use the average value as the thickness value of the surface of the independent region. Thus, the height information of any point in the independent region is considered to be the average value.

[0107] In some optional embodiments, step 320, generating the surface shape of the independent region based on the height information contained in the point data corresponding to each vertex position of the independent region, includes:

[0108] The surface shape of the independent region is fitted based on the height information contained in the point data corresponding to each vertex position of the independent region.

[0109] Specifically, for each independent region, all point data included in the independent region are first determined, and then numerical fitting is performed based on the height information and point position included in each point data to fit the surface shape of each independent region, that is, to fit the height information of any point in the independent region.

[0110] Numerical fitting methods for the region surface shape can include various approaches, such as polynomial fitting, spline interpolation fitting, convolutional neural network fitting, or a combination of these methods.

[0111] In some optional embodiments, fitting the surface shape of the independent region based on the height information contained in the point data corresponding to each vertex position of the independent region can be achieved by fitting the surface shape of the independent region through bilinear interpolation based on the point data corresponding to each vertex position of the independent region.

[0112] Step 320 is illustrated with an example. Specifically, in this application environment, the wafer rotates at any angle on a turntable, and the thickness measurement probe can move horizontally radially. By controlling the turntable and the thickness measurement probe, the same number of points can be collected from any radius concentric circles, such as 50 points per circle, for a total of 10 circles. Because the outer circle radius is large, the rotation angle between each point is also larger. Therefore, based on this, starting from the outermost circle collection points, points in the same circle and radially can be connected to form independent regions of four points each, which are then fitted and modeled. Adjacent independent regions should be interconnected. Optionally, the average value of the data corresponding to the four vertices can be used to represent the average level of each independent region.

[0113] Alternatively, bilinear interpolation can be used to construct multiple virtual point data within each independent region. Specifically, using the thickness value h of the four vertices of the independent region, linear interpolation is performed first in the x-direction and then in the y-direction.

[0114] h(x,y)=h 00 (1-u)(1-v)+h 10 u(1-v)+h 01 v(1-u)+h 11 UV

[0115] in

[0116]

[0117] For each independent region, the specific workflow includes: ① inputting the point locations and thickness values ​​of four points; ② generating a dense network of points for the target region; ③ performing bilinear interpolation on each network, optionally using bicubic spline interpolation; ④ visualizing the results, completing contour maps or 3D surface topography maps for arbitrary coordinates (inputting x and y information and providing predicted thickness points).

[0118] For example, you can first construct a vertices matrix to store the point data of each independent region in sequence. Taking an independent region as an example, generate dense independent regions of 100*100 (can be changed) in the x / y direction. Calculate the height of each point in the independent region using bilinear interpolation, and normalize the u and v coordinates to ensure the reasonableness of the interpolation weights. The height can be represented by a contour map. Please refer to [reference needed]. Figure 5 , Figure 5 For a separate contour map of an independent region provided in the embodiments of this application, or for characterizing the morphology through a 3D curved surface topography map, please refer to... Figure 6 , Figure 6 This application provides a 3D surface topography image of a single, independent region. The positions of the original vertices are marked in red, and the average height of the four vertices is output. This average value represents the average level of this region, and the bilinear interpolation result shows a smooth gradient change based on the average value. These independent regions are then stitched together to form the wafer surface. For the wafer surface formed using the average value method, please refer to... Figure 2 For wafer surface profiles formed using bilinear interpolation, please refer to [reference needed]. Figure 7 .

[0119] In this embodiment, averaging the independent regions results in a fast response and greatly simplifies the inversion process, using the mean to represent the overall level within the same region. Bilinear interpolation of the independent regions provides a more detailed and smoother reproduction of gradient changes, closely approximating real data. Setting radial and angular resolutions, such as 100*100, within the independent regions allows for the addition of more virtual point data, improving accuracy. Theoretically, the more point data collected in each layer, the higher the density of the independent regions, and the closer it is to the actual flat part's surface features. However, in practical engineering applications, large amounts of data collection are not necessary. The surface shape in-situ measurement method provided in this application is applied to online in-situ detection. Compared with offline morphology scanning methods that characterize surface TTV, warpage, and other parameters, it offers advantages such as integrability, fast response, and the ability to automatically adjust the turntable tilt angle based on the processed surface shape.

[0120] Please refer to Figure 8 , Figure 8A flowchart of step 500 provided for an embodiment of this application is shown. In some optional embodiments, step 500 provided for an embodiment of this application includes the following steps:

[0121] Step 510: Take a cross-section of the flat part through the center of the flat part from the radial direction of the flat part.

[0122] Step 520: Determine the surface type of the flat part based on the shape of the cross-section.

[0123] For example, a cross-section of the wafer passing through the center of the wafer can be taken radially from the wafer, or a cross-section of the wafer can be taken along the wafer's diameter. For example, in... Figure 2 The section marked by the red line (in the direction of wafer diameter) is a cross-section formed by cutting the wafer. See [link to cross-section]. Figure 9 , Figure 9 This is a schematic diagram of a cross-section of a wafer taken along its diameter, provided as an embodiment of this application. Alternatively, two half-sections of the wafer can be taken along two different wafer radius directions, forming a single cross-section. By obtaining the wafer cross-section, and comparing its shape with the morphology corresponding to various surface types, the surface type of the wafer can be determined. For example... Figure 9 The corresponding surface type is biconcave.

[0124] It should be noted that when two half-sections of a wafer are cut from two different wafer radius directions, considering that if the two half-sections are too close together, it may affect the accuracy, the included angle between the two half-sections can be limited, for example, the included angle should not be less than 120 degrees.

[0125] Please refer to Figure 10 , Figure 10 A flowchart of another step 500 provided for an embodiment of this application. In some optional embodiments, another step 500 provided for an embodiment of this application includes the following steps:

[0126] Step 530: Select an independent region from each of the independent regions in each ring;

[0127] Step 540: Determine the surface type of the flat part based on the surface type of each selected independent region.

[0128] Specifically, since each independent region is enclosed by the midpoint data of two adjacent concentric circles, all independent regions between two adjacent concentric circles are in the same ring. Thus, by selecting one independent region from all the independent regions in each ring and then splicing all the selected independent regions together, the cross-sectional shape of the flat part can be formed, thereby determining the surface type of the flat part.

[0129] In this embodiment, a Cartesian coordinate system can be constructed with the positioning edge as the origin. By controlling the rotation angle of the turntable supporting the wafer and collecting point data from the thickness measurement probe, thickness information can be collected at a fixed number of collection points per layer at different radii from the center. This allows the creation of three-dimensional data (x, y, z) with coordinates. Connecting the layers and radial collection points forms an independent region for height information distribution. By averaging or fitting the data within this independent region, the height information distribution of the wafer surface can be formed, thus obtaining the wafer's surface profile. This embodiment solves the problems of inaccurate measurement of flat part surface profiles and low measurement efficiency in the prior art, achieving the goal of accurately acquiring flat part surface profile features in situ, thereby improving the efficiency and safety of flat part processing.

[0130] See Figure 11 , Figure 11 This is a schematic diagram of a thinning machine provided in an embodiment of this application. This application also proposes a thinning machine comprising:

[0131] Turntable 1 is used to rotate the flat part D;

[0132] The transverse mechanism 2 and the thickness measuring probe 3 are both set above the turntable 1. The transverse mechanism 2 is used to adjust the distance between the thickness measuring probe 3 and the flat part D in the radial direction of the flat part D, so that the thickness measuring probe 3 can collect point data of the flat part D at different distances when the turntable rotates the flat part D.

[0133] A memory, a processor, and a computer program stored in the memory and executable on the processor, for the processor to implement the above-described surface profile in-situ measurement method when the processor executes the computer program.

[0134] Specifically, the distance between the thickness measuring probe 3 and the center of the flat part D is first adjusted by the transverse mechanism 2, and then the turntable 1 used to support the flat part D is driven to rotate, so that the thickness measuring probe 3 can collect point data of the flat part D in layers. Then, the distance between the thickness measuring probe 3 and the center of the flat part D is continuously adjusted, and the point data on the flat part D is measured repeatedly to complete the collection of point data. Then, the above-mentioned in-situ surface measurement method is realized through the memory, the processor, and the computer program stored in the memory and run on the processor.

[0135] According to an embodiment of this application, another embodiment of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described in-situ surface measurement method.

[0136] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0137] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart... Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0138] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0139] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0140] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this application.

Claims

1. A method for in-situ measurement of surface features, characterized in that, The method includes: Multiple point data points are acquired from the flat part located on the turntable of the thinning machine. Each point data point includes the point position on the flat part and the height information corresponding to the point position. The multiple point data points are acquired from M concentric circles centered on the center of the flat part, and N point data points are acquired from each concentric circle, where M and N are both integers greater than 2. Between all the point data in any two adjacent concentric circles, lines are drawn based on the point positions contained in each point data and the other adjacent point data to divide multiple independent regions that do not belong to each other between the two adjacent concentric circles. Based on the height information contained in the point data, the area shape corresponding to each independent region is determined. Based on the surface profile of each independent region, the surface profile of the flat component is determined; The surface shape of the flat part is identified to determine the surface shape category of the flat part.

2. The method according to claim 1, characterized in that, The distance between any two adjacent concentric circles is the same.

3. The method according to claim 1, characterized in that, The point data in each of the concentric circles are evenly distributed.

4. The method according to claim 1, characterized in that, The step of connecting all the point data in any two adjacent concentric layers with the point positions contained in each point data and other adjacent point data to divide the two adjacent concentric layers into multiple independent regions that do not belong to each other, includes: The point is located on the mapping of the flat component based on the point position contained in each of the point data; For each point data, two adjacent point data in the same concentric circle are connected based on the point location contained in the point data, and point data corresponding to the point data in the adjacent concentric circle are determined based on the concentric circle in which the point data is located, and the point data is connected to the corresponding point data, thereby dividing multiple independent regions that do not belong to each other between two adjacent concentric circles.

5. The method according to claim 4, characterized in that, The point data between any two adjacent concentric circles are in one-to-one correspondence.

6. The method according to claim 1, characterized in that, The process of determining the area shape corresponding to each independent region based on the height information contained in the point data includes: For each independent region, determine the point data corresponding to each vertex position in that independent region; The surface shape of the independent region is generated based on the height information contained in the point data corresponding to each vertex position of the independent region.

7. The method according to claim 6, characterized in that, The step of generating the surface shape of the independent region based on the height information contained in the point data corresponding to each vertex position of the independent region includes: The surface shape of the independent region is fitted based on the height information contained in the point data corresponding to each vertex position of the independent region.

8. The method according to claim 1, characterized in that, The identification of the surface shape of the flat component includes: A cross-section passing through the center of the flat component is taken radially from the flat component. The surface type of the flat part is determined based on the shape of the cross-section.

9. The method according to claim 1, characterized in that, The identification of the surface shape of the flat component includes: Select one independent region within each lap of independent regions; The surface type of the flat part is determined based on the surface type of each selected independent region.

10. A thinning machine, characterized in that, include: A turntable is used to rotate flat parts; Both the transverse movement mechanism and the thickness measurement probe are mounted above the turntable. The transverse movement mechanism is used to adjust the distance between the thickness measurement probe and the flat part in the radial direction of the flat part, so that the thickness measurement probe can collect point data of the flat part at different distances when the turntable rotates the flat part. A memory, a processor, and a computer program stored in the memory and executable on the processor, for the processor to implement the in-situ surface measurement method as described in any one of claims 1-9 when the processor executes the computer program.

11. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the in-situ surface measurement method as described in any one of claims 1-9.

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