A hole processing system for circuit board manufacturing

Abstract

This invention discloses a hole processing system for circuit board manufacturing, relating to the field of circuit board manufacturing technology. It includes a processing table and a processing hood. Electrostatic electret fiber membranes, positioned by a limiting and pressing mechanism, are embedded in the inner walls of both sides of the processing hood. A dust extraction main pipe with an internal negative pressure fan is fixed to the top of the processing hood. This invention achieves an integrated process design for drilling, grinding, and pre-cleaning by integrating a blowing dust removal mechanism, a laser drilling head, and a grinding motor onto a rotatable plate. Furthermore, a quick-release snap-fit ​​mechanism allows the grinding head to be detachably installed at the output end of the grinding motor, facilitating the replacement of grinding heads with different hole sizes. Additionally, the processing hood creates a relatively enclosed processing environment, and the electrostatic electret fiber membranes on the inner wall of the processing hood, the dust extraction main pipe at the top of the processing hood, and the sorting filter box enable efficient collection of fine processing dust particles.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a hole processing system for circuit board manufacturing. Background Technology

[0002] A printed circuit board (PCB) is a circuit board that provides physical support for the connection and coordinated operation of electronic components by creating conductive lines on an insulating substrate. Hole machining on a PCB refers to drilling holes in the PCB for electrical connections or component mounting. This is a crucial step in ensuring the performance and reliability of the PCB, and includes methods such as mechanical drilling and laser drilling. Hole grinding, on the other hand, involves deburring and cleaning the hole walls to improve their quality, ensuring conductivity and smooth operation of subsequent processes.

[0003] In existing technologies, drilling and grinding of circuit boards are usually independent processes that need to be completed on different equipment. This results in low production efficiency, long material transfer time, and easy secondary deviations in positioning accuracy. In addition, the grinding head is generally fixed by bolts, which is not convenient for quick disassembly and assembly, and it is not easy to switch between grinding processes of different hole diameters. Furthermore, drilling and grinding inevitably generate dust pollution, and traditional open processing is prone to dust diffusion, with low efficiency in collecting fine dust particles. Dust is easily left inside the hole or on the worktable, affecting processing accuracy and equipment life. Therefore, this invention proposes a hole processing system for circuit board manufacturing to solve the problems existing in the prior art. Summary of the Invention

[0004] To address the aforementioned problems, the present invention aims to provide a hole processing system for circuit board manufacturing. This system solves the problems of existing circuit board drilling and grinding equipment, which are usually two independent processes that need to be completed on different equipment, resulting in low production efficiency and an inability to easily switch between grinding processes with different hole diameters. Furthermore, traditional open-type processing is prone to dust diffusion, has low efficiency in collecting fine dust particles, and is not environmentally friendly.

[0005] To achieve the objectives of this invention, the following technical solution is provided: A hole processing system for circuit board manufacturing, comprising a processing table and a processing cover. Electrostatic electret fiber membranes, positioned by a limiting and pressing mechanism, are embedded in the inner walls of both sides of the processing cover. A dust extraction main pipe with an internal negative pressure fan is fixed to the top of the processing cover. A sorting filter box, communicating with the dust extraction main pipe, is symmetrically fixed to the top of the processing cover. A sorting filter assembly is provided inside the sorting filter box. A base is fixed to the top of the processing table. A support platform is fixed to the top of the base. A circuit board positioning mechanism adapted to the support platform is provided on the base. A hydraulic cylinder, driven by a multi-directional translational drive mechanism, is located inside the processing cover. A lifting plate is fixed to the bottom of the hydraulic cylinder. A rotating plate, driven by a rotation adjustment mechanism, is rotatably connected to the bottom of the lifting plate via a support shaft. Air blowing dust removal mechanisms are provided on both the front and rear sides of the bottom of the rotating plate. A laser drilling head and a first cylinder are fixed to the left and right sides of the bottom of the rotating plate, respectively. A grinding motor is fixed to the bottom of the first cylinder. A grinding head is installed at the output end of the grinding motor via a quick-release snap-fit ​​mechanism.

[0006] A further improvement is that the limiting and pressing mechanism includes a fixing plate symmetrically fixed to the inner walls of both sides of the processing cover and a spring telescopic member fixed to the side of the fixing plate near the electrostatic electret fiber membrane. An L-shaped limiting plate is fixed to the end of the spring telescopic member away from the fixing plate.

[0007] A further improvement is that the spring telescopic component includes a sleeve fixedly connected to the fixed plate and a telescopic rod fixedly connected to the L-shaped limiting plate. The end of the telescopic rod away from the L-shaped limiting plate slides through into the sleeve and is fixedly connected to the inner wall of the sleeve near the fixed plate by a limiting spring.

[0008] A further improvement is that the sorting and filtering assembly includes an electrostatic filter plate and a resin powder filter plate that are fitted and inserted into the sorting and filtering box. The top of both the electrostatic filter plate and the resin powder filter plate is fixed with a sealing cover plate that is sealed and attached to the top of the sorting and filtering box. The sealing cover plate is snapped onto the top of the sorting and filtering box by a pressing and snapping mechanism.

[0009] A further improvement is that the pressing and snapping mechanism includes a drive box fixed to the top of the sorting filter box and a bidirectional lead screw rotatably connected inside the drive box and driven to rotate by a knob. Both sides of the bidirectional lead screw are threaded with threaded blocks. On opposite sides of the two sets of threaded blocks, there are slide rods that slide through to the outside of the drive box. At the end of the slide rod located outside the drive box, there is a trapezoidal clamping plate that matches the sealing cover.

[0010] A further improvement is that: a rotating shaft is fixed at the bottom of the knob, and the bottom of the rotating shaft passes through a bearing into the drive box and is fixed with a first bevel gear; a second bevel gear that meshes with the first bevel gear is fixed at the middle position of the bidirectional lead screw.

[0011] A further improvement is that the circuit board positioning mechanism includes a one-way lead screw rotatably connected to the four sides inside the base and driven to rotate by a first motor, and an L-shaped clamping plate threaded onto the one-way lead screw. The top of the L-shaped clamping plate slides through the top of the base and extends to the top of the support platform. A second cylinder is fixed to the top of the L-shaped clamping plate, and a limit pressure plate is fixed to the output end of the second cylinder.

[0012] A further improvement is that the multi-directional translation drive mechanism includes an X-axis linear module fixed inside the processing cover and a Y-axis linear module fixed to the output end of the X-axis linear module. The hydraulic cylinder is fixed to the output end of the Y-axis linear module. Limiting rods are symmetrically fixed at the top of the lifting plate, and a limiting tube fixed to the output end of the Y-axis linear module is slidably sleeved on the limiting rod.

[0013] A further improvement is that the rotation adjustment mechanism includes a servo motor fixed to the bottom end of the lifting plate and a drive gear fixed to the output end of the servo motor, and an annular rack that meshes with the drive gear is fixed to the top of the rotating plate.

[0014] Further improvements include: the quick-release snap-fit ​​mechanism includes a mounting base fixed to the output end of the grinding motor and a T-shaped slider fixed to the top of the grinding head. The bottom end of the mounting base has a T-shaped groove adapted to the T-shaped slider. Both sides of the mounting base have cavities. The top of the cavity is connected to a spring plate by a linear spring. The bottom end of the spring plate is fixed with a locking block that slides through the T-shaped groove. On opposite sides of the two sets of spring plates, there are sliding levers that slide through the outside of the mounting base.

[0015] A further improvement is made in that: the air blowing dust removal mechanism includes an air pump fixed to the rotating plate and an air blowing nozzle fixed to the output end of the air pump, wherein the air blowing direction of the air blowing nozzle is vertically downward.

[0016] The beneficial effects of this invention are as follows: By integrating a blowing dust removal mechanism, a laser drilling head, and a grinding motor onto a rotatable turntable, this invention achieves an integrated process design for drilling, grinding, and pre-cleaning, reducing unnecessary material turnover time, avoiding secondary deviations in positioning accuracy, and improving the processing efficiency of circuit boards to a certain extent. Furthermore, the quick-release snap-fit ​​mechanism allows for the detachable installation of the grinding head at the output end of the grinding motor, facilitating the replacement of grinding heads of different hole sizes and enabling convenient switching between grinding processes of different hole diameters. In addition, the processing hood creates a relatively enclosed processing environment. The electrostatic electret fiber membrane on the inner wall of the processing hood, the main dust suction pipe on the top of the hood, and the sorting filter box enable efficient collection of fine processing dust particles, preventing dust from remaining in the holes and on the processing table and avoiding its escape into the outside environment. This not only ensures processing accuracy and the normal service life of the equipment but is also more environmentally friendly, making it worthy of widespread application. Attached Figure Description

[0017] Figure 1 This is a front view of the present invention;

[0018] Figure 2 This is a front sectional view of the present invention;

[0019] Figure 3 This is a side view of the lifting plate and rotating plate of the present invention;

[0020] Figure 4 This is a front sectional view of the lifting plate and rotating plate of the present invention;

[0021] Figure 5 This is a front sectional view of the mounting base and T-shaped slider of the present invention;

[0022] Figure 6 This is the invention Figure 5 Enlarged view of point A in the image;

[0023] Figure 7 This is a side sectional view of the mounting base of the present invention;

[0024] Figure 8 This is a front sectional view of the sorting filter box of the present invention;

[0025] Figure 9 This is a cross-sectional view of the drive box of the present invention;

[0026] Figure 10 This is a cross-sectional view of the spring telescopic component of the present invention.

[0027] The components include: 1. Processing table; 2. Processing cover; 3. Electrostatic electret fiber membrane; 4. Negative pressure fan; 5. Main dust extraction pipe; 6. Classification filter box; 7. Base; 8. Support platform; 9. Hydraulic cylinder; 10. Lifting plate; 11. Support shaft; 12. Rotating plate; 13. Laser drilling head; 14. First cylinder; 15. Grinding motor; 16. Grinding head; 17. Fixing plate; 18. Spring telescopic component; 19. L-shaped limit plate; 20. Electrostatic filter plate; 21. Resin powder filter plate; 22. Sealing cover plate; 23. Drive box; 24. Knob; 25. Two-way lead screw; 26. Threaded block; 27. Slide rod; 28. Trapezoidal clamping plate; 29. ​​Rotating shaft. 30. First bevel gear; 31. Second bevel gear; 32. First motor; 33. One-way lead screw; 34. L-shaped clamp; 35. Second cylinder; 36. Limiting pressure plate; 37. X-axis linear module; 38. Y-axis linear module; 39. Limiting rod; 40. Limiting tube; 41. Servo motor; 42. Drive gear; 43. Ring rack; 44. Mounting base; 45. T-shaped slider; 46. T-shaped slide groove; 47. Cavity; 48. Linear spring; 49. Spring plate; 50. Locking block; 51. Actuating rod; 52. Air pump; 53. Air nozzle; 1801. Sleeve; 1802. Telescopic rod; 1803. Limiting spring. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] A printed circuit board (PCB) is a fundamental component of electronic devices. It consists of an insulating substrate and conductive lines, connecting electronic components. Its core components are the substrate, conductive layer, pads and vias, and silkscreen layer. The substrate is usually made of glass fiber, ceramic, or flexible material, providing mechanical support and insulation. The conductive layer is usually copper foil etched into specific lines to achieve electrical connections between components. Pads and vias are used to solder component leads and conduct electrical connections between layers. The silkscreen layer is used to mark component positions, polarity, and other information to assist in assembly.

[0030] Circuit boards are widely used in the electronics industry, enabling miniaturization and visualization of circuits. They play a crucial role in the mass production of fixed circuits and the optimization of electrical appliance layout. To mount electronic components on the circuit board and for the board itself to be installed, holes need to be drilled. However, after drilling, the edges of the holes often do not meet the required smoothness and therefore need to be polished.

[0031] In this embodiment, both the X-axis linear module 37 and the Y-axis linear module 38 are synchronous belt type linear modules, mainly made of belts, linear guides, aluminum alloy profiles, couplings, motors, photoelectric switches and other components, which are existing technologies and will not be described in detail in this embodiment.

[0032] according to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 As shown, this embodiment provides a hole processing system for circuit board manufacturing, including a horizontally arranged processing table 1 and a processing cover 2 fixed to the top of the processing table 1 by bolts. The lower part of the outer walls on both sides of the processing table 1 is fixed with fixing blocks that are symmetrically distributed front and back. The fixing blocks are provided with threaded holes to facilitate fixing the processing table 1 in the corresponding position by bolts. The front of the processing cover 2 is hinged with a cover door that is symmetrically distributed left and right, which facilitates the formation of a relatively closed space for the processing cover 2. The inner walls on both sides of the processing cover 2 are provided with fitting grooves, and electrostatic electret fiber membranes 3 are fitted into the fitting grooves to realize electrostatic adsorption of dust escaping from the inside of the processing cover 2. The electrostatic electret fiber membrane 3 is fixed to the inner wall of the processing cover 2 by a limiting and pressing mechanism, so that the electrostatic electret fiber membrane 3 can be easily disassembled and replaced by the user after adsorbing too much dust.

[0033] The top of the processing hood 2 is fixed with a dust suction pipe 5, and a negative pressure fan 4 is fixed to the inside of the dust suction pipe 5 by bolts. The left and right sides of the top of the processing hood 2 are fixed with sorting filter boxes 6 by bolts. Both sets of sorting filter boxes 6 are connected to the dust suction pipe 5 through pipelines. The sorting filter boxes 6 are equipped with sorting filter components for filtering, intercepting and separating dust. By starting the negative pressure fan 4 to draw air into the processing hood 2, the air containing dust can be drawn into the sorting filter boxes 6 for interception and filtration treatment, so that the air meets the emission standards. The electrostatic electret fiber membrane 3 on the inner wall of the processing hood 2, together with the dust suction pipe 5 and the sorting filter boxes 6 at the top of the processing hood 2, can achieve efficient collection of small processing dust particles, so that dust is not easy to remain in the hole and is prevented from escaping to the outside.

[0034] A hollow base 7 is bolted to the top of the processing table 1. A support platform 8 for placing the circuit board to be processed is bolted to the top of the base 7. The base 7 is equipped with a circuit board positioning mechanism adapted to the support platform 8 for clamping and limiting the circuit board to be processed. A hydraulic cylinder 9 is installed inside the processing cover 2. The hydraulic cylinder 9 is driven by a multi-directional translation drive mechanism to perform horizontal displacement. The bottom end of the hydraulic cylinder 9 is the output end and is bolted to a lifting plate 10. The lifting plate 10 is bolted to a support shaft 11. The bottom end of the support shaft 11 is rotatably connected to a rotating plate 12 via a bearing. The rotating plate 12 is driven by a rotation adjustment mechanism to rotate. The bottom end of the rotating plate 12 has two... Both sides are equipped with air blowing dust removal mechanisms to facilitate high-speed blowing and cleaning of the circuit board surface for pre-cleaning. A laser drilling head 13 for laser drilling of the circuit board is fixed to the left side of the bottom of the rotating plate 12 by bolts. The first cylinder 14 is fixed to the right side of the bottom of the rotating plate 12 by bolts. The bottom of the first cylinder 14 is the output end and a grinding motor 15 is fixed to it by bolts. The output end of the grinding motor 15 is equipped with a grinding head 16 for grinding through a quick-release snap-fit ​​mechanism. By integrating the air blowing dust removal mechanism, the laser drilling head 13 and the grinding motor 15 on the rotatable rotating plate 12, the drilling, grinding and pre-cleaning processes in the circuit board processing are integrated into one design.

[0035] The limiting and pressing mechanism includes a fixed plate 17 and a spring telescopic component 18. The fixed plate 17 has four sets of spring telescopic components, which are symmetrically fixed to the inner walls of the left and right sides of the processing cover 2. The spring telescopic component 18 has an elastic telescopic function and is fixed to the side wall of the fixed plate 17 near the electrostatic electret fiber membrane 3 by bolts. An L-shaped limiting plate 19 is fixed to the end of the spring telescopic component 18 away from the fixed plate 17. The spring telescopic component 18 provides an elastic push-out force to the L-shaped limiting plate 19, so that the L-shaped limiting plate 19 covers the electrostatic electret fiber membrane 3, thereby restricting the electrostatic electret fiber membrane 3 to the inner walls of the left and right sides of the processing cover 2.

[0036] The spring telescopic component 18 includes a sleeve 1801 and a telescopic rod 1802. The sleeve 1801 is fixedly connected to the fixing plate 17 by bolts, and the telescopic rod 1802 is fixedly connected to the L-shaped limiting plate 19. The end of the telescopic rod 1802 away from the L-shaped limiting plate 19 slides through the sleeve 1801 and is connected to a limiting spring 1803. The inner wall of the sleeve 1801 near the fixing plate 17 is fixedly connected to the limiting spring 1803. The limiting spring 1803 provides an elastic push force to the telescopic rod 1802, so that the spring telescopic component 18 has an elastic telescopic function.

[0037] The sorting and filtering assembly includes an electrostatic filter plate 20 and a resin powder filter plate 21. Both the electrostatic filter plate 20 and the resin powder filter plate 21 are fitted and inserted into the sorting and filtering box 6. The inner wall of the sorting and filtering box 6 has slots that are adapted to the electrostatic filter plate 20 and the resin powder filter plate 21. The top of the sorting and filtering box 6 has a through groove that is adapted to the electrostatic filter plate 20 and the resin powder filter plate 21, so that the electrostatic filter plate 20 and the resin powder filter plate 21 can be inserted. The filter pore size of the electrostatic filter plate 20 is larger than that of the resin powder filter plate 21. The dust drawn into the sorting and filtering box 6 contains metal powder and resin powder. The metal powder is adsorbed under the electric field of the electrostatic filter plate 20, while the resin powder passes through the electrostatic filter plate 20 and is intercepted by the resin powder filter plate 21, thereby achieving dust filtration and separation for subsequent centralized processing.

[0038] Both the electrostatic filter plate 20 and the resin powder filter plate 21 are fixed with sealing cover plates 22 at their top ends. The sealing cover plates 22 are sealed and fitted to the top end of the sorting filter box 6. The sealing cover plates 22 are snapped into the top end of the sorting filter box 6 by a pressing and snapping mechanism, so that the sealing cover plates 22, along with the electrostatic filter plate 20 and the resin powder filter plate 21, can be easily removed. A sealing ring is fixed at the bottom end of the sealing cover plates 22. A sealing groove that matches the sealing ring is opened at the top end of the sorting filter box 6 to improve the sealing performance.

[0039] The pressing and snapping mechanism includes a drive box 23, a knob 24, and a bidirectional lead screw 25. The drive box 23 is hollow and fixed to the center of the top of the sorting filter box 6 with bolts. The bidirectional lead screw 25 is rotatably connected to the inside of the drive box 23 via bearings and is driven to rotate by the knob 24 at the top of the drive box 23. Threaded blocks 26 are threaded onto both sides of the bidirectional lead screw 25 with opposite thread directions. Slide rods 27 are symmetrically fixed to the opposite sidewalls of the two sets of threaded blocks 26. The end of the slide rod 27 away from the threaded block 26 slides through the drive box 23. A trapezoidal clamping plate 28 is fixed externally and is adapted to the sealing cover plate 22. By rotating the knob 24, the bidirectional screw 25 is driven to rotate, causing the threaded blocks 26 on both sides of the bidirectional screw 25 to move in opposite directions. This causes the trapezoidal clamping plate 28 to move towards the sealing cover plate 22 via the slide rod 27, thus pressing the sealing cover plate 22 and making it fit and clamp onto the top of the sorting filter box 6. By rotating the knob 24 in the opposite direction, the two sets of trapezoidal clamping plates 28 can be driven to move towards each other, thereby releasing the clamping limit on the sealing cover plate 22.

[0040] A rotating shaft 29 is fixed to the bottom of the knob 24. The bottom of the rotating shaft 29 passes through the drive box 23 through a bearing and is fixed with a first bevel gear 30. A second bevel gear 31 is fixed in the middle of the bidirectional lead screw 25, and the second bevel gear 31 meshes with the first bevel gear 30. By rotating the knob 24, the rotating shaft 29 is driven to rotate the first bevel gear 30. The first bevel gear 30 then drives the second bevel gear 31, which meshes with it, to rotate, thereby driving the bidirectional lead screw 25 to rotate.

[0041] The circuit board positioning mechanism includes a first motor 32, a one-way lead screw 33, and an L-shaped clamping plate 34. The first motor 32 has four sets, each fixed to the outer wall of the four sides of the base 7. The output end of the first motor 32 passes through a bearing into the interior of the base 7 and is fixed with a one-way lead screw 33. The L-shaped clamping plate 34 is threaded onto the one-way lead screw 33. Symmetrical through slots adapted to the L-shaped clamping plate 34 are provided on the top of the base 7 and the support platform 8. The top of the L-shaped clamping plate 34 is bent at a 90-degree angle and slides through the top of the base 7, extending to the support platform. Above 8, the top of the L-shaped clamping plate 34 is fixed with a second cylinder 35 by bolts. The output end of the second cylinder 35 is vertically downward and fixed with a limit plate 36 by bolts. First, the circuit board to be processed is placed on the top of the base 7. Then, the four sets of first motors 32 are started simultaneously to drive each one-way screw 33 to rotate, so that the L-shaped clamping plate 34 threaded on the one-way screw 33 is displaced inward to form a clamping limit on the circuit board. Then, the second cylinder 35 is started to drive the limit plate 36 to descend, forming a pressing limit on the edge of the circuit board.

[0042] The multi-directional translation drive mechanism includes an X-axis linear module 37 and a Y-axis linear module 38. The X-axis linear module 37 is fixed inside the processing cover 2, and the Y-axis linear module 38 is fixed to the output end of the X-axis linear module 37. It can be driven by the X-axis linear module 37 to perform left and right lateral displacement. The hydraulic cylinder 9 is fixed to the output end of the Y-axis linear module 38 and can be driven by the Y-axis linear module 38 to perform front and back longitudinal displacement. Two sets of symmetrically distributed limit rods 39 are fixed at the top of the lifting plate 10. Limiting tubes 40 are slidably sleeved on the limit rods 39, and the top end of the limiting tubes 40 is fixed to the output end of the Y-axis linear module 38.

[0043] The rotary adjustment mechanism includes a servo motor 41 and a drive gear 42. The servo motor 41 is fixed to the bottom of the lifting plate 10 by bolts, and the drive gear 42 is fixed to the output end of the servo motor 41 by bolts. The top of the rotating plate 12 is fixed with a ring rack 43 by bolts, and the ring rack 43 meshes with the drive gear 42. The servo motor 41 drives the drive gear 42 to rotate the ring rack 43 that meshes with it. The ring rack 43 then drives the rotating plate 12 to rotate synchronously through the support shaft 11.

[0044] The quick-release snap-fit ​​mechanism includes a mounting base 44 and a T-shaped slider 45. The mounting base 44 is fixed to the output end of the grinding motor 15 by bolts, and the T-shaped slider 45 is welded to the top of the grinding head 16. The bottom end of the mounting base 44 has a T-shaped groove 46 that matches the T-shaped slider 45, allowing the T-shaped slider 45 to be inserted into the mounting base 44. Both sides of the mounting base 44 have cavities 47. A linear spring 48 is fixed to the top of the cavity 47, and a spring plate 49 is fixed to the bottom of the linear spring 48. A clip is fixed to the bottom of the spring plate 49. Block 50, with its bottom end sliding through into the T-shaped groove 46, forms a limiting engagement with the T-shaped slider 45. Two sets of blocks 50 are fixed to opposite sides of the two sets of spring plates 49, and the levers 51 slide through to the outside of the mounting base 44, making it easy to move the spring plates 49 by levers 51. Under the action of the linear spring 48, the spring plates 49 drive the blocks 50 into the T-shaped groove 46, and by pushing the levers 51 upward, the blocks 50 can be raised to release the engagement and limiting of the T-shaped slider 45.

[0045] The air blowing dust removal mechanism includes an air pump 52 and an air nozzle 53. The air pump 52 is fixed to the rotating plate 12 by bolts and its output end is located below the rotating plate 12. The air nozzle 53 is fixed to the output end of the air pump 52. When the air pump 52 is started, the air nozzle 53 drives the circuit board surface to perform high-speed blowing to achieve pre-cleaning.

[0046] When drilling and grinding of circuit board materials are required, the circuit board material to be drilled is first placed on the top of the support platform 8 and fixed by the circuit board positioning mechanism to ensure stability during processing. Then, according to the position to be drilled on the circuit board, the hydraulic cylinder 9 and the lifting plate 10 are driven to move horizontally to the appropriate position by the multi-directional translation drive mechanism until the front air blowing dust removal mechanism moves to directly above the position to be drilled on the circuit board. At the same time, the hydraulic cylinder 9 drives the lifting plate 10 to descend to the appropriate height to meet the subsequent processing requirements. Then, the front air blowing dust removal mechanism is activated to spray air at the position to be drilled to remove large dust particles and impurities at that position by high-speed blowing. Finally, the rotary adjustment mechanism drives the rotating plate 12 to rotate 90 degrees counterclockwise. The laser drilling head 13 is moved to the position directly above the drilling location. The laser drilling head 13 is then activated to perform laser drilling on the circuit board. After drilling, the rotating plate 12 is driven to rotate counterclockwise by the rotary adjustment mechanism to move another set of air blowing dust removal mechanism to the drilling position and spray air at the drilling position to remove residual dust and impurities. Then, the rotating plate 12 is driven to rotate counterclockwise by the rotary adjustment mechanism to move the grinding head 16 to the drilling position. At this time, the first cylinder 14 is activated to drive the grinding motor 15 to lower the grinding head 16 to contact the edge of the hole on the circuit board. The grinding motor 15 is then activated to drive the grinding head 16 to grind the edge of the hole, thus realizing the integrated processing of drilling and grinding.

[0047] During the entire processing process, dust will inevitably be generated. Some of the dust that is released inside the processing hood 2 will be adsorbed by the electrostatic electret fiber membrane 3 on both sides of the inner wall of the processing hood 2, while the other part of the dust will be drawn into the classification filter box 6 by starting the negative pressure fan 4 and filtered and intercepted by the classification filter components, so as to achieve efficient recycling and environmentally friendly emission of fine dust particles.

[0048] When it is necessary to adjust the diameter of the laser-drilled hole, the output parameters of the laser drilling head 13 can be adjusted to process holes of different diameters. When it is necessary to grind holes of different diameters, the grinding head 16 can be quickly removed from the output shaft of the grinding motor 15 using a quick-release snap-fit ​​mechanism. Then, another grinding head 16 of a different specification can be quickly installed on the output shaft of the grinding motor 15 using the quick-release snap-fit ​​mechanism. This allows for grinding of holes of different diameters and flexible switching between different diameter grinding processes.

[0049] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A hole processing system for manufacturing a circuit board, comprising a processing table (1) and a processing cover (2), characterized in that: The processing cover (2) has electrostatic electret fiber membranes (3) positioned by a limiting pressing mechanism embedded in the inner walls of both sides. The top of the processing cover (2) is fixed with a dust extraction main pipe (5) equipped with a negative pressure fan (4). The top of the processing cover (2) is symmetrically fixed with a classification filter box (6) connected to the dust extraction main pipe (5). The classification filter box (6) is equipped with a classification filter assembly inside. The top of the processing table (1) is fixed with a base (7). The top of the base (7) is fixed with a support platform (8). The base (7) is equipped with a circuit board positioning mechanism adapted to the support platform (8). The processing cover (2) is equipped with a circuit board positioning mechanism that is connected to the support platform (8). A hydraulic cylinder (9) is driven by a multi-directional translation drive mechanism. A lifting plate (10) is fixed at the bottom of the hydraulic cylinder (9). A rotating plate (12) driven by a rotation adjustment mechanism is rotatably connected to the bottom of the lifting plate (10) via a support shaft (11). Air blowing dust removal mechanisms are provided on both the front and rear sides of the bottom of the rotating plate (12). A laser drilling head (13) and a first cylinder (14) are fixed on the left and right sides of the bottom of the rotating plate (12), respectively. A grinding motor (15) is fixed at the bottom of the first cylinder (14). A grinding head (16) is installed at the output end of the grinding motor (15) via a quick-release snap-fit ​​mechanism.

2. The hole processing system for manufacturing a circuit board according to claim 1, wherein: The limiting and pressing mechanism includes a fixing plate (17) symmetrically fixed to the inner walls of both sides of the processing cover (2) and a spring telescopic member (18) fixed to the side of the fixing plate (17) near the electrostatic electret fiber membrane (3). An L-shaped limiting plate (19) is fixed to the end of the spring telescopic member (18) away from the fixing plate (17).

3. The hole processing system for manufacturing a circuit board according to claim 2, wherein: The spring telescopic component (18) includes a sleeve (1801) fixedly connected to the fixed plate (17) and a telescopic rod (1802) fixedly connected to the L-shaped limiting plate (19). The end of the telescopic rod (1802) away from the L-shaped limiting plate (19) slides through into the sleeve (1801) and is fixedly connected to the inner wall of the sleeve (1801) near the fixed plate (17) by a limiting spring (1803).

4. The hole processing system for manufacturing a circuit board according to Claim 1, wherein: The sorting filter assembly includes an electrostatic filter plate (20) and a resin powder filter plate (21) that are fitted and inserted inside the sorting filter box (6). The top of the electrostatic filter plate (20) and the resin powder filter plate (21) are both fixed with a sealing cover plate (22) that is sealed and attached to the top of the sorting filter box (6). The sealing cover plate (22) is snapped onto the top of the sorting filter box (6) by a pressing and snapping mechanism.

5. The hole processing system for manufacturing a circuit board according to claim 4, wherein: The pressing and snapping mechanism includes a drive box (23) fixed to the top of the sorting filter box (6) and a bidirectional lead screw (25) rotatably connected inside the drive box (23) and driven to rotate by a knob (24). Both sides of the bidirectional lead screw (25) are threaded with threaded blocks (26). On opposite sides of the two sets of threaded blocks (26), there are slide rods (27) that slide through to the outside of the drive box (23). At the end of the slide rod (27) located outside the drive box (23), there is a trapezoidal clamping plate (28) that is adapted to the sealing cover plate (22).

6. The hole processing system for manufacturing a circuit board according to claim 5, wherein: The bottom of the knob (24) is fixed with a rotating shaft (29), the bottom of the rotating shaft (29) passes through the bearing into the drive box (23) and is fixed with a first bevel gear (30), and the middle position of the bidirectional screw (25) is fixed with a second bevel gear (31) that meshes with the first bevel gear (30).

7. A hole processing system for circuit board manufacturing according to claim 1, characterized in that: The circuit board positioning mechanism includes a one-way lead screw (33) rotatably connected to the four sides inside the base (7) and driven to rotate by a first motor (32) and an L-shaped clamp (34) threaded onto the one-way lead screw (33). The top of the L-shaped clamp (34) slides through the top of the base (7) and extends to the support platform (8). A second cylinder (35) is fixed to the top of the L-shaped clamp (34), and a limit plate (36) is fixed to the output end of the second cylinder (35).

8. The hole processing system for circuit board manufacturing according to claim 1, characterized in that: The multi-directional translation drive mechanism includes an X-axis linear module (37) fixed inside the processing cover (2) and a Y-axis linear module (38) fixed at the output end of the X-axis linear module (37). The hydraulic cylinder (9) is fixed at the output end of the Y-axis linear module (38). The top of the lifting plate (10) is symmetrically fixed with limit rods (39). The limit rods (39) are slidably sleeved with a limit tube (40) fixed at the output end of the Y-axis linear module (38).

9. A hole processing system for circuit board manufacturing according to claim 1, characterized in that: The rotation adjustment mechanism includes a servo motor (41) fixed to the bottom of the lifting plate (10) and a drive gear (42) fixed to the output end of the servo motor (41). The top of the rotating plate (12) is fixed with an annular rack (43) that meshes with the drive gear (42).

10. A hole processing system for circuit board manufacturing according to claim 1, characterized in that: The quick-release snap-fit ​​mechanism includes a mounting base (44) fixed to the output end of the grinding motor (15) and a T-shaped slider (45) fixed to the top of the grinding head (16). The bottom end of the mounting base (44) is provided with a T-shaped groove (46) adapted to the T-shaped slider (45). Both sides of the mounting base (44) are provided with cavities (47). The top end of the cavity (47) is connected to a spring plate (49) by a linear spring (48). The bottom end of the spring plate (49) is fixed with a locking block (50) that slides through into the T-shaped groove (46). On opposite sides of the two sets of spring plates (49), a lever (51) that slides through into the outside of the mounting base (44) is fixed.

11. A hole processing system for circuit board manufacturing according to claim 1, characterized in that: The air blowing dust removal mechanism includes an air pump (52) fixed on the rotating plate (12) and an air blowing nozzle (53) fixed at the output end of the air pump (52). The air blowing direction of the air blowing nozzle (53) is vertically downward.

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