BIM (Building Information Modeling) and digital twinning fused semiconductor plant collaborative construction and delivery method

Abstract

The invention discloses a semiconductor plant collaborative construction and delivery method integrating BIM and digital twinning, and belongs to the technical field of plant construction. The invention discloses a semiconductor plant collaborative construction and delivery method fusing BIM and digital twinning. The method comprises the following steps: acquiring related data of a semiconductor plant; carrying out BIM (Building Information Modeling) and digital twin base construction; monitoring the construction progress of the semiconductor plant; carrying out visual acceptance check; and generating a delivery result. According to the invention, the problems of equipment installation coordinate deviation, pipeline gradient abnormity and the like in the prior art are difficult to find in time are solved, the dynamic precision verification of the construction process can be realized, the construction progress and the quality acceptance result can be obtained in real time, the communication cost caused by information asymmetry is avoided, and the construction efficiency is improved. The whole life cycle tracing of each component is realized through the component ID, detailed information can be quickly obtained without on-site investigation during subsequent asset checking and transformation, and the efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of factory construction technology, specifically to a collaborative construction and delivery method for semiconductor factories that integrates BIM and digital twins. Background Technology

[0002] Semiconductor plants are the core infrastructure for chip manufacturing, and their design, construction, and operation involve complex technical requirements and extremely high costs.

[0003] Chinese Patent CN112431416A discloses a method for effectively shortening the construction period of a factory building and a factory building constructed using this method. By first constructing the roof, which requires the laying of a large number of pipelines, and then constructing the floors, the time-consuming pipeline laying work can be started in advance, greatly shortening the construction period and thus meeting the needs of factories with strict requirements on the construction period of factory buildings.

[0004] The existing factory construction methods described above involve direct construction of the factory in practice, with construction progress and quality monitoring mostly relying on phased manual inspections. If problems such as equipment installation coordinate deviations or abnormal pipeline slopes occur, they are difficult to detect in a timely manner. When these issues are exposed during the acceptance phase, the rectification costs are extremely high. Therefore, these methods do not meet current needs. In response, we propose a collaborative construction and delivery method for semiconductor factories that integrates BIM and digital twins. Summary of the Invention

[0005] The purpose of this invention is to provide a collaborative construction and delivery method for semiconductor plants that integrates BIM and digital twins. By using parametric design of the semiconductor plant's BIM model and real-time data feedback from the digital twin, dynamic accuracy verification of the construction process can be achieved. By integrating BIM and digital twins, construction progress and quality acceptance results can be obtained in real time, avoiding communication costs caused by information asymmetry. Each component can be traced throughout its entire lifecycle through its component ID. During subsequent asset inventory and renovation, detailed information can be quickly obtained without on-site inspection, significantly improving efficiency and solving the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins, comprising:

[0007] Obtain data on the geometric parameters, material properties, and equipment specifications of the semiconductor plant, and determine the construction requirements for the semiconductor plant.

[0008] The acquired data was used to create a BIM model of the semiconductor factory, and a digital twin foundation for the semiconductor factory was constructed.

[0009] The construction progress of the semiconductor plant is monitored using the BIM model of the semiconductor plant, and the differences between the on-site panorama and the semiconductor plant BIM model are compared by combining digital twin technology.

[0010] After the semiconductor plant is constructed, a digital twin platform is used for visual acceptance. By comparing the semiconductor plant BIM model with the actual site conditions through split-screen comparison, the quality of delivery is ensured.

[0011] Upon completion of acceptance testing, a digital delivery result of the semiconductor plant is generated in the digital twin platform and linked to the platform's real-time monitoring functions.

[0012] Preferably, the step of using the acquired data to perform BIM modeling of the semiconductor factory and constructing a digital twin foundation for the semiconductor factory specifically includes:

[0013] Collect specifications, operating parameters, and fault codes of semiconductor factory equipment;

[0014] Collect the overall floor plan dimensions, wall thickness, door and window locations and dimensions, floor slab thickness and load zoning of the semiconductor factory;

[0015] Data was collected on the main building materials, pipeline and equipment materials, temperature, humidity, cleanliness, and vibration levels of the semiconductor factory.

[0016] Outliers in the collected data are removed, missing data is filled in, and the data is stored after processing.

[0017] Preferably, the step of using the acquired data to perform BIM modeling of the semiconductor factory and constructing a digital twin foundation for the semiconductor factory specifically includes:

[0018] The collected data is categorized according to site, building, structure, electromechanical, process, and equipment, and a correlation table is established.

[0019] By assigning a unique component ID to each data entry in the associated table using a digital master line, and binding the component ID to the physical spatial coordinates of the semiconductor plant, a BIM model of the semiconductor plant is obtained.

[0020] Cameras, vibration sensors, and progress tracking terminals are deployed in the construction area of ​​the semiconductor factory to connect construction progress, environmental data, and equipment installation accuracy to a digital twin platform.

[0021] Link the digital twin platform with the semiconductor plant BIM model to supplement the internal structure of equipment and pipeline routing in the semiconductor plant BIM model.

[0022] Preferably, the step of assigning a unique component ID to each data entry in the association table via a digital master line, and binding the component ID to the physical spatial coordinates of the semiconductor plant, specifically includes:

[0023] Determine the coding rules for semiconductor plant data component IDs, assign a unique component ID to each data entry in the associated table through the digital mainline platform, and bind the component ID to the core data parameters and associated data component IDs;

[0024] Obtain the coordinate system of the semiconductor plant building and input the coordinate system parameters into the BIM modeling software and digital master platform;

[0025] In the BIM model, find the entity component corresponding to each data point, enter the assigned unique component ID into the unique identifier field in the component attributes, and input the physical space coordinates of the component.

[0026] After the binding is completed, the accuracy of the correspondence between the component ID and the coordinates is verified. After the verification is completed, the semiconductor factory BIM model is obtained, and the binding results are synchronized to the construction management platform and the operation and maintenance system.

[0027] Preferably, the association between the digital twin platform and the semiconductor plant BIM model specifically includes:

[0028] In the digital twin platform, create corresponding scene levels based on the factory, workshop, professional, and component levels of the semiconductor factory BIM model;

[0029] Export the component ID list from the semiconductor factory BIM model, and assign a unique platform node component ID to each scene node of the corresponding semiconductor factory BIM model in the digital twin platform, and establish a mapping table between BIM component ID and platform node ID.

[0030] Upload the mapping table through the digital twin platform, and bind the component ID to the platform node ID in batches according to the mapping table.

[0031] Preferably, the method of monitoring the construction progress of the semiconductor plant using a BIM model specifically includes:

[0032] Create a progress database in the digital twin platform to synchronously store component IDs, associated progress plans, responsible persons, and schedule requirements.

[0033] The semiconductor factory BIM model is divided into three monitoring levels: overall layer, zone layer, and component layer, based on the overall factory building, professional zones, and individual components.

[0034] In the BIM model of the semiconductor plant, critical path components are marked with different colors, and early warning thresholds for critical nodes are set on the digital twin platform.

[0035] Real-time data collection of on-site construction progress and panoramic data is performed according to the defined monitoring levels, and the real-time data collection of on-site construction progress and panoramic data is synchronized to the semiconductor plant BIM model.

[0036] Compare the geometric differences between the on-site panoramic view and the semiconductor plant BIM model, as well as the differences between the on-site progress and the planned progress;

[0037] If the difference exceeds the set critical node warning threshold, a warning message will be triggered, and the deviation will be adjusted according to the cause of the difference.

[0038] Preferably, the step of synchronizing the real-time collected on-site construction progress data and on-site panoramic data to the semiconductor plant BIM model specifically includes:

[0039] The real-time collected on-site construction progress data is synchronized to the progress database of the digital twin platform, and the progress status of the corresponding components in the semiconductor plant BIM model is automatically updated.

[0040] Import the real-time collected panoramic data of the site into the digital twin platform, and align the site data with the semiconductor plant BIM model based on an independent construction coordinate system;

[0041] The digital twin platform links progress data, on-site panorama, and component IDs.

[0042] Preferably, the comparison of geometric differences between the panoramic view of the site and the BIM model of the semiconductor plant, as well as the differences between the on-site progress and the planned progress, specifically includes:

[0043] Select the area to be compared on the digital twin platform, and import the aligned on-site point cloud model and the semiconductor plant BIM model;

[0044] The digital twin platform calculates the geometric deviation between the on-site point cloud model and the semiconductor plant BIM model, generates a difference heat map, and statistically analyzes the difference data according to component type and the cause of deviation.

[0045] The digital twin platform automatically compares the actual progress of each component with the planned progress. If there are delays, it automatically analyzes the reasons for the delays by combining on-site data and links them with relevant evidence.

[0046] Based on the on-site point cloud model and the semiconductor plant BIM model, the actual progress and planned progress delays of each component, and the reasons for the delays, a difference report between the on-site and semiconductor plant BIM models is generated.

[0047] Preferably, the use of a digital twin platform for visual acceptance, through split-screen comparison of the semiconductor factory BIM model and the actual site conditions, specifically includes:

[0048] Import the semiconductor plant BIM model, which has already been bound to component IDs and coordinates, into the digital twin platform and synchronize all data updated during the construction phase.

[0049] The acceptance area is divided and the comparison dimensions are determined. The comparison dimensions include architectural, structural, electromechanical, equipment, and process dimensions. At the same time, the acceptance tolerance standards for each dimension are preset within the platform.

[0050] In the digital twin platform, enable split-screen mode. Set the left side as the BIM model view of the semiconductor factory and display the unique ID and core parameters of the corresponding components. Set the right side as the on-site live view.

[0051] The semiconductor plant BIM model view and the actual site view are compared in a split-screen manner according to the comparison dimensions, and the results are analyzed and rectified accordingly.

[0052] After all acceptance areas and dimensions are compared and verified, a visual acceptance report is generated in the digital twin platform.

[0053] Preferably, the analysis and rectification based on the comparison results specifically includes:

[0054] During the split-screen comparison process, if inconsistencies are found, the deviation type and deviation value are marked at the corresponding positions in the two side views through the digital twin platform, and the unique component ID of the corresponding component is associated with it.

[0055] By combining the design, construction, and equipment manufacturer teams, we traced the associated data based on component IDs and analyzed the reasons for deviations.

[0056] If any deviations exceeding the standard are found, a rectification plan will be formulated, and after the rectification is completed, on-site data will be collected again.

[0057] Repeat the split-screen comparison process in the digital twin platform to confirm that the deviation has been corrected to within the acceptance standard. For minor deviations that do not require rectification, make a note of "qualified" in the digital twin platform and retain the comparison record.

[0058] Compared with the prior art, the beneficial effects of the present invention are:

[0059] This invention enables dynamic accuracy verification of the construction process through parametric design of semiconductor factory BIM models and real-time data feedback from digital twins. By integrating BIM and digital twins, construction progress and quality acceptance results can be obtained in real time, avoiding communication costs caused by information asymmetry. Each component can be traced throughout its entire lifecycle through its component ID. Detailed information can be quickly obtained without on-site inspections during subsequent asset inventory and renovations, significantly improving efficiency. Attached Figure Description

[0060] Figure 1 This is a schematic diagram of the semiconductor plant collaborative construction and delivery method integrating BIM and digital twins according to the present invention;

[0061] Figure 2The process of BIM modeling and digital twin foundation construction for the semiconductor plant of this invention. Detailed Implementation

[0062] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0063] To address the issue that existing technologies often fail to detect problems like equipment installation coordinate deviations or abnormal pipeline slopes in a timely manner, leading to extremely high rectification costs when these issues only surface during the acceptance phase, please refer to [link to relevant documentation]. Figures 1-2 This embodiment provides the following technical solution:

[0064] A collaborative construction and delivery method for semiconductor fabs integrating BIM and digital twins includes the following steps:

[0065] S1: Obtain data on the geometric parameters, material properties, and equipment specifications of the semiconductor plant, and determine the construction requirements of the semiconductor plant, including cleanliness, vibration resistance, and temperature control parameters.

[0066] S2: Use the acquired data to create a BIM model of the semiconductor factory and construct a digital twin foundation for the semiconductor factory;

[0067] S3: Use the semiconductor plant BIM model to monitor the construction progress of the semiconductor plant, and combine digital twin technology to compare the differences between the on-site panorama and the semiconductor plant BIM model;

[0068] S4: After the semiconductor plant is constructed, a digital twin platform is used for visual acceptance. By comparing the semiconductor plant BIM model with the actual site conditions through split-screen comparison, the quality of delivery is ensured.

[0069] S5: Upon completion of acceptance, generate a digital delivery result of the semiconductor factory in the digital twin platform and link it to the platform's real-time monitoring function to provide guidance for subsequent operation and maintenance.

[0070] The acquired data is used to create a BIM model of the semiconductor factory and to construct a digital twin foundation for the semiconductor factory, specifically including:

[0071] Collect specifications, operating parameters, and fault codes of semiconductor factory equipment;

[0072] Collect the overall floor plan dimensions, wall thickness, door and window locations and dimensions, floor slab thickness and load zoning of the semiconductor factory;

[0073] Data was collected on the main building materials, pipeline and equipment materials, temperature, humidity, cleanliness, and vibration levels of the semiconductor factory.

[0074] Outliers in the collected data are removed, missing data is filled in, and the data is stored after processing.

[0075] The acquired data is used to create a BIM model of the semiconductor factory and to construct a digital twin foundation for the semiconductor factory, specifically including:

[0076] The collected data is categorized according to site, building, structure, electromechanical, process, and equipment, and a correlation table is established.

[0077] By assigning a unique component ID to each data entry in the associated table using a digital master line, and binding the component ID to the physical spatial coordinates of the semiconductor plant, a BIM model of the semiconductor plant is obtained.

[0078] Cameras, vibration sensors, and progress tracking terminals are deployed in the construction area of ​​the semiconductor factory to connect construction progress, environmental data, and equipment installation accuracy to a digital twin platform.

[0079] Link the digital twin platform with the semiconductor plant BIM model to supplement the internal structure of equipment and pipeline routing in the semiconductor plant BIM model.

[0080] A unique component ID is assigned to each data entry in the associated table using a digital master line. This component ID is then bound to the physical spatial coordinates of the semiconductor plant. Specifically, this includes:

[0081] The coding rules for semiconductor plant data component IDs are determined. A unique component ID is assigned to each data entry in the associated table through the digital mainline platform. The component ID is then bound to the core data parameters and associated data component IDs to ensure that all associated data can be directly retrieved through the component ID. The coding rules adopt the format of category abbreviation, serial number, year, and data type. For example, the site data component ID is CD-001-2024-ZB, where CD represents the site, 001 is the serial number, 2024 is the year of data collection, and ZB represents the overall planar coordinates.

[0082] Obtain the coordinate system of the semiconductor plant building and input the coordinate system parameters into the BIM modeling software and digital master platform to ensure that the coordinate systems of the two are consistent;

[0083] In the BIM model, find the entity component (such as equipment, pipeline, beam and column) corresponding to each data point, enter the assigned unique component ID into the unique identifier field in the component attribute, and at the same time enter the physical space coordinates of the component;

[0084] After the binding is completed, the accuracy of the correspondence between the component ID and the coordinates is verified. After the verification is completed, the semiconductor factory BIM model is obtained. At the same time, the binding results are synchronized to the construction management platform and the operation and maintenance system to achieve consistency between the data and physical space coordinates of the entire platform.

[0085] Linking the digital twin platform with the BIM model of the semiconductor plant specifically includes:

[0086] In the digital twin platform, according to the factory, workshop, professional and component levels of the semiconductor factory BIM model, corresponding scene levels are created to ensure that the platform level corresponds one-to-one with the model level, which facilitates accurate positioning of components in the future.

[0087] Export a list of component IDs from the semiconductor plant BIM model. The list of component IDs includes component name, type and attributes. Assign a unique platform node component ID to each scene node of the corresponding semiconductor plant BIM model in the digital twin platform and establish a mapping table between BIM component IDs and platform node IDs.

[0088] Upload the mapping table through the digital twin platform, and bind the component ID to the platform node ID in batches according to the mapping table.

[0089] Monitoring the construction progress of a semiconductor plant using a BIM model includes:

[0090] Create a progress database in the digital twin platform to synchronously store component IDs, associated progress plans, responsible persons, and schedule requirements, laying the foundation for subsequent progress tracking;

[0091] The semiconductor factory BIM model is divided into three monitoring levels: overall level, zone level, and component level, based on the overall factory building, professional zones, and individual components.

[0092] Overall layer: Monitors the overall progress milestones such as the topping-out of the factory building and the completion of the clean area; Zone layer: Monitors the pipeline installation and equipment arrival progress of zones such as Class 100 and Class 1000 zones; Component layer: Monitors the construction progress of key components;

[0093] In the BIM model of the semiconductor plant, critical path components are marked with different colors, and early warning thresholds for critical nodes are set on the digital twin platform.

[0094] Real-time data collection of on-site construction progress and panoramic data is performed according to the defined monitoring levels, and the real-time data collection of on-site construction progress and panoramic data is synchronized to the semiconductor plant BIM model.

[0095] Compare the geometric differences between the on-site panoramic view and the semiconductor plant BIM model, as well as the differences between the on-site progress and the planned progress;

[0096] If the difference exceeds the set critical node warning threshold, a warning message will be triggered, and the deviation will be adjusted according to the cause of the difference.

[0097] Develop rectification plans for components with deviations exceeding the standard, simulate the rectification effect in the semiconductor plant BIM model, such as the model after adjusting the bolt positions, and synchronize it with the on-site construction team.

[0098] For delayed components, coordinate with relevant parties to develop a expedited work plan, adjust the schedule, and update the semiconductor plant BIM model and progress dashboard on the digital twin platform simultaneously.

[0099] After rectification is completed, on-site data is re-collected, and the differences before and after rectification are compared on the digital twin platform. Once the rectification is confirmed to meet the standards, the rectification record is archived to the full lifecycle file associated with the component ID to support subsequent operation and maintenance traceability.

[0100] The real-time collected on-site construction progress data and panoramic on-site data will be synchronized to the semiconductor plant BIM model, specifically including:

[0101] The real-time collected on-site construction progress data is synchronized to the progress database of the digital twin platform, and the progress status of the corresponding components in the semiconductor plant BIM model is automatically updated.

[0102] Import the real-time collected panoramic data of the site into the digital twin platform, and align the site data with the semiconductor plant BIM model based on an independent construction coordinate system;

[0103] The digital twin platform links progress data, on-site panoramas, and component IDs. For example, clicking on a delayed component ID will automatically display a panoramic photo of the on-site construction of that component and its progress record.

[0104] The geometric differences between the on-site panoramic view and the semiconductor plant BIM model, as well as the differences between the on-site progress and the planned progress, were compared, specifically including:

[0105] Select the area to be compared on the digital twin platform, and import the aligned on-site point cloud model and the semiconductor plant BIM model;

[0106] The digital twin platform calculates the geometric deviation between the on-site point cloud model and the semiconductor plant BIM model. For example, if the pipeline coordinates X=10.000m in the semiconductor plant BIM model and the corresponding pipeline coordinates X=10.003m in the on-site point cloud, the deviation is 0.003m. A difference heatmap is generated, with red indicating deviations exceeding the threshold (e.g., >5mm) and blue indicating normal deviations. The platform also statistically analyzes the difference data according to component type and the cause of the deviation.

[0107] The digital twin platform automatically compares the actual progress of each component with the planned progress. For example, the lithography machine was planned to be completed in the 4th week, but was actually completed in the 5th week, a delay of 1 week. If there is a delay, the platform automatically analyzes the reasons for the delay by combining on-site data and links them with relevant evidence, such as delivery delay notices and cleanliness test reports.

[0108] Based on the on-site point cloud model and the semiconductor plant BIM model, the actual progress and planned progress delays of each component, and the reasons for the delays, a difference report between the on-site and semiconductor plant BIM models is generated.

[0109] Visualized acceptance testing is conducted using a digital twin platform, comparing the semiconductor factory's BIM model with the actual site conditions via split-screen comparison. Specifically, this includes:

[0110] Import the semiconductor plant BIM model with completed component ID and coordinate binding into the digital twin platform, and synchronize all data updated during the construction phase to ensure that the semiconductor plant BIM model in the platform is completely consistent with the as-built version data.

[0111] The acceptance area is divided and the comparison dimensions are determined. The comparison dimensions include architectural, structural, electromechanical, equipment, and process dimensions. At the same time, the acceptance tolerance standards for each dimension are preset in the platform, such as the allowable value of equipment coordinate deviation ≤ ±0.5mm.

[0112] In the digital twin platform, enable split-screen mode. Set the left side as the BIM model view of the semiconductor factory and display the unique ID and core parameters of the corresponding components. Set the right side as the on-site live view. It can access the on-site point cloud model generated by laser scanning, the real-time image captured by the panoramic camera, or the panoramic view of the factory area taken by the drone. Ensure that the scale, coordinate origin, and viewing direction of the two views are completely consistent. For example, both take the southeast corner of the factory area as the origin and the viewing angle is 45° downward.

[0113] The semiconductor plant BIM model view and the actual site view are compared in a split-screen manner according to the comparison dimensions, and the results are analyzed and rectified accordingly.

[0114] After all acceptance areas and dimensions are compared and verified, a visual acceptance report is generated in the digital twin platform. The report includes split-screen comparison screenshots and deviation handling records. The deviation handling records include before and after rectification comparisons and the acceptance results corresponding to the unique IDs of each component. Subsequently, the acceptance report is bound and archived with the BIM model and on-site real-time data, and linked to the plant operation and maintenance system through the digital main line to provide acceptance benchmark data for subsequent operation and maintenance, ensuring the continuity of data throughout the entire life cycle.

[0115] Based on the comparison results, analysis and rectification will be carried out, specifically including:

[0116] During the split-screen comparison process, if inconsistencies are found, the deviation type and deviation value are marked at the corresponding positions in the two side views through the digital twin platform, and the unique component ID of the corresponding component is associated with it.

[0117] By combining the design, construction, and equipment manufacturer teams, data related to component IDs, such as construction records and equipment calibration reports, is traced and analyzed to identify the causes of deviations, such as construction layout errors and equipment deformation during transportation.

[0118] If any deviations exceeding the standard are found, a rectification plan will be formulated, and after the rectification is completed, on-site data will be collected again.

[0119] Repeat the split-screen comparison process in the digital twin platform to confirm that the deviation has been corrected to within the acceptance criteria, such as reducing the pipeline interface deviation to ±2mm and ensuring that the equipment level meets the standards.

[0120] For minor deviations that do not require rectification, such as a 2mm deviation in wall flatness, mark them as qualified in the digital twin platform and retain the comparison record.

[0121] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0122] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention.

Claims

1. A collaborative construction and delivery method for semiconductor plants integrating BIM and digital twins, characterized in that, include: Obtain data on the geometric parameters, material properties, and equipment specifications of the semiconductor plant, and determine the construction requirements for the semiconductor plant. The acquired data was used to create a BIM model of the semiconductor factory, and a digital twin foundation for the semiconductor factory was constructed. The construction progress of the semiconductor plant is monitored using the BIM model of the semiconductor plant, and the differences between the on-site panorama and the semiconductor plant BIM model are compared by combining digital twin technology. After the semiconductor plant is constructed, a digital twin platform is used for visual acceptance. By comparing the semiconductor plant BIM model with the actual site conditions through split-screen comparison, the quality of delivery is ensured. Upon completion of acceptance, a digital delivery result of the semiconductor plant is generated in the digital twin platform and linked to the real-time monitoring function of the digital twin platform.

2. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 1, characterized in that, The process of using the acquired data to create a BIM model of the semiconductor factory and constructing a digital twin foundation for the semiconductor factory specifically includes: Collect specifications, operating parameters, and fault codes of semiconductor factory equipment; Collect the overall floor plan dimensions, wall thickness, door and window locations and dimensions, floor slab thickness and load zoning of the semiconductor factory; Data was collected on the main building materials, pipeline and equipment materials, temperature, humidity, cleanliness, and vibration levels of the semiconductor factory. Outliers in the collected data are removed, missing data is filled in, and the data is stored after processing.

3. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 1, characterized in that, The process of using the acquired data to create a BIM model of the semiconductor factory and constructing a digital twin foundation for the semiconductor factory specifically includes: The collected data is categorized according to site, building, structure, electromechanical, process, and equipment, and a correlation table is established. By assigning a unique component ID to each data entry in the associated table using a digital master line, and binding the component ID to the physical spatial coordinates of the semiconductor plant, a BIM model of the semiconductor plant is obtained. Cameras, vibration sensors, and progress tracking terminals are deployed in the construction area of ​​the semiconductor factory to connect construction progress, environmental data, and equipment installation accuracy to a digital twin platform. Link the digital twin platform with the semiconductor plant BIM model to supplement the internal structure of equipment and pipeline routing in the semiconductor plant BIM model.

4. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 3, characterized in that, The process of assigning a unique component ID to each data entry in the associated table via a digital master line and binding the component ID to the physical spatial coordinates of the semiconductor factory specifically includes: Determine the coding rules for semiconductor plant data component IDs, assign a unique component ID to each data entry in the associated table through the digital mainline platform, and bind the component ID to the core data parameters and associated data component IDs; Obtain the coordinate system of the semiconductor plant building and input the coordinate system parameters into the BIM modeling software and digital master platform; In the BIM model, find the entity component corresponding to each data point, enter the assigned unique component ID into the unique identifier field in the component attributes, and input the physical space coordinates of the component. After the binding is completed, the accuracy of the correspondence between the component ID and the coordinates is verified. After the verification is completed, the semiconductor factory BIM model is obtained, and the binding results are synchronized to the construction management platform and the operation and maintenance system.

5. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 3, characterized in that, The linking of the digital twin platform with the semiconductor plant BIM model specifically includes: In the digital twin platform, create corresponding scene levels based on the factory, workshop, professional, and component levels of the semiconductor factory BIM model; Export the component ID list from the semiconductor factory BIM model, and assign a unique platform node component ID to each scene node of the corresponding semiconductor factory BIM model in the digital twin platform, and establish a mapping table between BIM component ID and platform node ID; Upload the mapping table through the digital twin platform, and bind the component ID to the platform node ID in batches according to the mapping table.

6. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 1, characterized in that, The method of monitoring the construction progress of a semiconductor plant using a BIM model specifically includes: Create a progress database in the digital twin platform to synchronously store component IDs, associated progress plans, responsible persons, and schedule requirements. The semiconductor factory BIM model is divided into three monitoring levels: overall layer, zone layer, and component layer, based on the overall factory building, professional zones, and individual components. In the BIM model of the semiconductor plant, critical path components are marked with different colors, and early warning thresholds for critical nodes are set on the digital twin platform. Real-time data collection of on-site construction progress and panoramic data is performed according to the defined monitoring levels, and the real-time data collection of on-site construction progress and panoramic data is synchronized to the semiconductor plant BIM model. Compare the geometric differences between the on-site panoramic view and the semiconductor plant BIM model, as well as the differences between the on-site progress and the planned progress; If the difference exceeds the set critical node warning threshold, a warning message will be triggered, and the deviation will be adjusted according to the cause of the difference.

7. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 6, characterized in that, The process of synchronizing real-time collected on-site construction progress data and panoramic on-site data to the semiconductor plant BIM model specifically includes: The real-time collected on-site construction progress data is synchronized to the progress database of the digital twin platform, and the progress status of the corresponding components in the semiconductor plant BIM model is automatically updated. Import the real-time collected panoramic data of the site into the digital twin platform, and align the site data with the semiconductor plant BIM model based on an independent construction coordinate system; The digital twin platform links progress data, on-site panorama, and component IDs.

8. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 6, characterized in that, The comparison of geometric differences between the on-site panoramic view and the semiconductor plant BIM model, as well as the differences between on-site progress and planned progress, specifically includes: Select the area to be compared on the digital twin platform, and import the aligned on-site point cloud model and the semiconductor plant BIM model; The digital twin platform calculates the geometric deviation between the on-site point cloud model and the semiconductor plant BIM model, generates a difference heat map, and statistically analyzes the difference data according to component type and the cause of deviation. The digital twin platform automatically compares the actual progress of each component with the planned progress. If there are delays, it automatically analyzes the reasons for the delays by combining on-site data and links them with relevant evidence. Based on the on-site point cloud model and the semiconductor plant BIM model, the actual progress and planned progress delays of each component, and the reasons for the delays, a difference report between the on-site and semiconductor plant BIM models is generated.

9. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 1, characterized in that, The aforementioned use of a digital twin platform for visualized acceptance, through split-screen comparison of the semiconductor factory's BIM model and the actual site conditions, specifically includes: Import the semiconductor plant BIM model, which has already been bound to component IDs and coordinates, into the digital twin platform and synchronize all data updated during the construction phase. The acceptance area is divided and the comparison dimensions are determined. The comparison dimensions include architectural, structural, electromechanical, equipment, and process dimensions. At the same time, the acceptance tolerance standards for each dimension are preset within the platform. In the digital twin platform, enable split-screen mode. Set the left side as the BIM model view of the semiconductor factory and display the unique ID and core parameters of the corresponding components. Set the right side as the on-site live view. The semiconductor plant BIM model view and the actual site view are compared in a split-screen manner according to the comparison dimensions, and the results are analyzed and rectified accordingly. After all acceptance areas and dimensions are compared and verified, a visual acceptance report is generated in the digital twin platform.

10. The method for collaborative construction and delivery of semiconductor plants integrating BIM and digital twins according to claim 9, characterized in that, The analysis and rectification based on the comparison results specifically include: During the split-screen comparison process, if inconsistencies are found, the deviation type and deviation value are marked at the corresponding positions in the two side views through the digital twin platform, and the unique component ID of the corresponding component is associated with it. By combining the design, construction, and equipment manufacturer teams, we traced the associated data based on component IDs and analyzed the reasons for deviations. If any deviations exceeding the standard are found, a rectification plan will be formulated, and after the rectification is completed, on-site data will be collected again. Repeat the split-screen comparison process in the digital twin platform to confirm that the deviation has been corrected to within the acceptance standard. For minor deviations that do not require rectification, make a note of "qualified" in the digital twin platform and retain the comparison record.

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