Semiconductor factory cold-heat recycling system

Abstract

A kind of semiconductor factory cold heat recycling system, comprising: clean workshop, the clean workshop includes clean production area and equipment support area, at least one clean room is provided in the clean production area, and at least one equipment room is provided in the equipment support area;General exhaust pipeline, the general exhaust pipeline is connected with the clean room and atmosphere environment;Air supply pipeline, the air supply pipeline is connected with the general exhaust pipeline and the equipment room, for the air in the clean room is sent to the equipment room for recycling.The semiconductor factory cold heat recycling system provided in the embodiment of the utility model introduces the non-toxic harmless general exhaust gas generated in clean room to the equipment room for recycling, which is beneficial to save energy and reduce production cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a system for recycling heat and cold in a semiconductor plant. Background Technology

[0002] During semiconductor manufacturing, some equipment generates significant amounts of heat or produces harmless gases. However, semiconductor production requires a highly clean environment. In such cleanrooms, temperature and humidity must be maintained at constant levels. This heat and these harmless gases can negatively impact the cleanroom environment. Currently, these gases are typically collected through a duct system, then extracted by fans and directly released into the atmosphere.

[0003] In addition to cleanrooms with high environmental requirements, semiconductor factories also have a large number of power or consumable equipment rooms. These equipment rooms also have their own temperature and humidity control standards, requiring corresponding air conditioning equipment to provide cooling and heating for each equipment room, which consumes a lot of energy.

[0004] Therefore, there is an urgent need to provide a heat and cold recycling system for semiconductor plants that can utilize the non-toxic and harmless gases discharged from cleanrooms to provide heat and cold for equipment rooms, thereby saving energy and reducing production costs. Utility Model Content

[0005] The technical problem solved by this utility model is to provide a semiconductor plant heat and cold recycling system that introduces non-toxic and harmless gases discharged from the cleanroom into the equipment room for reuse, which is beneficial to saving energy and reducing production costs.

[0006] To address the aforementioned technical problems, this utility model provides a semiconductor factory heat and cold recycling system, comprising: a cleanroom, the cleanroom including a clean production area and an equipment support area, the clean production area having at least one clean room, and the equipment support area having at least one equipment room; a general exhaust duct connecting the clean room to the atmospheric environment; and an air supply duct connecting the general exhaust duct and the equipment room, used to supply air from the clean room to the equipment room for reuse.

[0007] Optionally, it may also include a control module, which is used to control the air pressure in the general exhaust duct and the supply duct.

[0008] Optionally, a pressure detection module is also included, which is used to detect the air pressure in the general exhaust duct and the air supply duct, and the pressure detection module is electrically connected to the control module.

[0009] Optionally, it also includes a first adjustable switching valve, which is installed on the general exhaust duct. The first adjustable switching valve is electrically connected to the control module, and the control module is used to control the opening degree of the first adjustable switching valve.

[0010] Optionally, a second adjustable switching valve is also included. The second adjustable switching valve is disposed on the air supply duct and is electrically connected to the control module. The control module is used to control the opening degree of the second adjustable switching valve.

[0011] Optionally, the general exhaust duct has at least one air inlet, which is connected to the clean room, and the air inlets are configured in a one-to-one correspondence with the clean room.

[0012] Optionally, the air supply duct has at least one air outlet, the air outlet is connected to the equipment, and the air outlet and the equipment are configured in a one-to-one correspondence.

[0013] Optionally, the air outlet is provided with an air valve, which is used to adjust the opening degree of the air outlet.

[0014] Optionally, it also includes a first fan, which is installed on the general exhaust duct and is electrically connected to the control module.

[0015] Optionally, a second fan is also included, which is installed on the air supply duct and is electrically connected to the control module.

[0016] Optionally, a pressure relief valve is also included, which is installed on the air supply duct and is electrically connected to the control module.

[0017] Compared with the prior art, the technical solution of this utility model embodiment has the following beneficial effects:

[0018] This technical solution provides a semiconductor factory heat and cold recycling system by adding an air supply duct. This duct introduces general exhaust air generated in the cleanroom into the equipment room. Since general exhaust air is non-toxic and harmless and can be directly discharged into the atmosphere, and the cleanroom maintains relatively stable temperature and humidity due to its strict temperature and humidity control, introducing it into the equipment room, where environmental requirements are less stringent, allows for the reuse of heat and cold in the air. This reduces energy consumption in the equipment room and helps save costs. Furthermore, this solution, by adding an air supply duct for air reuse, is simple in its modification method and structure, easy to install, and has low modification costs. Attached Figure Description

[0019] Figure 1This is a schematic diagram of the structure of a semiconductor plant heat and cold recycling system according to one embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the modular connection of the control module in one embodiment of this utility model. Detailed Implementation

[0021] As described in the background section, in the current semiconductor manufacturing process, the non-toxic and harmless gases generated in cleanrooms are usually directly discharged into the atmosphere. Meanwhile, some equipment rooms with lower environmental requirements than cleanrooms also need to consume a lot of energy to maintain suitable temperature and humidity.

[0022] Therefore, in order to solve the above problems, this utility model provides a semiconductor factory heat and cold recycling system, including a clean room, a general exhaust duct and a supply air duct. The clean room is equipped with at least one clean room and at least one equipment room. The general exhaust duct connects the clean room to the atmosphere, and the supply air duct connects the general exhaust duct and the equipment room. The non-toxic and harmless air generated in the clean room that can be discharged through the general exhaust duct is introduced into the equipment room and reused to provide heat and cold for the equipment room, which helps to save energy and reduce production costs.

[0023] To make the above-mentioned objectives, features and beneficial effects of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of the structure of a semiconductor plant heat and cold recycling system according to one embodiment of the present invention; Figure 2 This is a schematic diagram of the modular connection of the control module in one embodiment of this utility model.

[0025] refer to Figure 1 The semiconductor plant's heat and cold recycling system includes: a cleanroom, comprising a clean production area 10 and an equipment support area 20, wherein the clean production area 10 has at least one cleanroom 11 and the equipment support area 20 has at least one equipment room 21; a general exhaust duct 30, which connects the cleanroom 11 to the atmospheric environment; and an air supply duct 40, which connects the general exhaust duct 30 and the equipment room 21, for supplying air from the cleanroom 11 to the equipment room 21 for reuse.

[0026] The clean production area 10 is a semiconductor processing and production area. One or more clean rooms 11 are set up in the clean production area 10. Semiconductor production has strict environmental requirements for the clean room 11. In addition to preventing fine dust or bacteria from entering the clean room 11, the temperature and humidity conditions in the room must be kept constant.

[0027] In this embodiment, the semiconductor plant's heat and cold recycling system also includes an air conditioning unit (not shown), which is used to control the air conditions in the cleanroom 11 and maintain the temperature in the cleanroom 11 at (22±1)℃ and the humidity at (45±5)%.

[0028] The exhaust gas generated in the clean room 11 can be directly discharged into the atmosphere through a general exhaust system. It is usually a treated, non-toxic and harmless gas. Due to the strict temperature and humidity control of the clean room 11, the temperature and humidity of the exhaust gas discharged into the atmosphere are kept within a constant range. Therefore, it can be sent into the equipment room 21 for effective reuse, which is conducive to saving energy and reducing production costs.

[0029] In this embodiment, after testing, the temperature of the gas discharged from the general exhaust duct 30 is between 22°C and 26°C, and the humidity is between 40% and 50%.

[0030] The general exhaust duct 30 has at least one air inlet 31, which is connected to the clean room 11, and the air inlets 31 and the clean room 11 are arranged in a one-to-one correspondence.

[0031] In this embodiment, the number of air inlets 31 in the general exhaust duct 30 is the same as the number of clean rooms 11. Each clean room 11 is provided with one air inlet 31. The heat and exhaust gas generated by the clean room 11 enter the general exhaust duct 30 through its corresponding air inlet 31. After being gathered in the general exhaust duct 30, they are discharged into the atmosphere, or sent to the equipment room 40 for reuse through the air supply duct 40.

[0032] In other embodiments, the number of air inlets 31 may not be the same as the number of cleanrooms 11. The number of air inlets 31 may be greater than the number of cleanrooms 11, and multiple air inlets 31 may be provided in one cleanroom 11.

[0033] In this embodiment, the clean production area 10 is provided with multiple clean rooms 11. Taking two clean rooms 11 as an example, the specific description includes an upper clean room 110 and a lower clean room 120. The corresponding air inlets 31 also include an upper air inlet 310 and a lower air inlet 320. The upper air inlet 310 is located in the upper clean room 110, and the lower air inlet 320 is located in the lower clean room 120.

[0034] In this embodiment, one end of the air supply duct 40 is connected to the general exhaust duct 30, and the other end of the air supply duct 40 is provided with at least one air outlet 41. The air outlet 41 is connected to the equipment room 21, and the air outlet 41 and the equipment room 21 are provided in a one-to-one correspondence.

[0035] In this embodiment, the air outlet 41 is used to send air from the air supply duct 40 into the equipment room 21. The number of air outlets 41 is the same as the number of equipment rooms 21, and each equipment room 21 is provided with one air outlet 41.

[0036] In other embodiments, the number of air outlets 41 and the number of equipment rooms 21 may not be the same. Some equipment rooms 21 do not need to introduce air from the outside, so the number of air outlets 41 can be less than the number of equipment rooms 21; some equipment rooms 21 can be provided with multiple air outlets 41 to improve airflow uniformity, so the number of air outlets 41 can be greater than the number of equipment rooms 21.

[0037] In this embodiment, multiple device rooms 21 are provided within the device support area 20.

[0038] In this embodiment, the air outlet 41 is an adjustable air outlet, and the opening of the air outlet 41 can be adjusted to regulate the air volume entering the equipment room 21, so as to meet the different needs of different equipment rooms 21.

[0039] In this embodiment, the air outlet 41 is provided with an air valve (not shown), which is used to adjust the opening degree of the air outlet 41.

[0040] In this embodiment, the opening of the air outlet 41 can be adjusted manually by adjusting the air valve; in other embodiments, the opening of the air outlet 41 can also be adjusted electrically by controlling the air valve.

[0041] In this embodiment, when there are multiple equipment rooms 21, the heating and cooling requirements of each equipment room 21 may not be the same. Therefore, by setting an air valve to adjust the opening of the air outlet 41, the diverse requirements of different equipment rooms 21 for air temperature and humidity can be met.

[0042] refer to Figure 2 The semiconductor plant's heat and cold recycling system also includes a control module 50, which is used to control the air pressure in the general exhaust duct 30 and the supply duct 40.

[0043] In this embodiment, during the semiconductor manufacturing process, in addition to maintaining constant air temperature and humidity conditions in the cleanroom 11, it is also necessary to ensure that conditions such as the general exhaust pressure of the cleanroom 11 are stable. Therefore, the control module 50 is used to calculate the air pressure of the general exhaust duct 30 and control the air pressure in the general exhaust duct 30 and the air supply duct 40, thereby controlling the general exhaust pressure of the cleanroom 11 to remain stable, and thus ensuring the stability of the semiconductor manufacturing process.

[0044] Continue to refer to Figure 2The semiconductor plant's heat and cold recycling system also includes a pressure detection module 60, which is used to detect the air pressure in the general exhaust duct 30 and the supply duct 40, and the pressure detection module 60 is electrically connected to the control module 50.

[0045] In this embodiment, the pressure detection module 60 detects and monitors the air pressure in the general exhaust duct 30 and the air supply duct 40, and can know the pressure situation in the general exhaust duct 30 and the air supply duct 40 in a timely manner. The control module 50 controls the air pressure in the general exhaust duct 30 and the air supply duct 40 accordingly based on the air pressure detected by the pressure detection module 60.

[0046] In this embodiment, the pressure detection module 60 includes multiple detection terminals (not shown), which are respectively disposed on the general exhaust duct 30 and the supply duct 40.

[0047] In this embodiment, the semiconductor plant's heat and cold recycling system further includes a first fan 32, which is installed on the general exhaust duct 30 and is electrically connected to the control module 50.

[0048] In this embodiment, the first fan 32 draws air from the clean room 11 into the general exhaust duct 30.

[0049] In this embodiment, the control module 50 can control the air pressure in the general exhaust duct 30 by controlling the first fan 32.

[0050] Specifically, the air pressure in the general exhaust duct 30 can be controlled by controlling the rotation speed of the first fan 32.

[0051] In this embodiment, the semiconductor plant's heat and cold recycling system further includes a second fan 42, which is installed on the air supply duct 40 and is electrically connected to the control module 50.

[0052] In this embodiment, the second fan 42 is a booster fan. Typically, in semiconductor factories, cleanrooms are located above the equipment rooms. Therefore, when the air supply duct 40 delivers air from the cleanroom 11 to the equipment room 21, it delivers air from top to bottom. When insufficient air pressure occurs, and the air from the upper floor cannot be delivered smoothly to the equipment room 21 below, the control module 50 can turn on the second fan 42 to increase the air volume in the air supply duct 40 and improve the air pressure.

[0053] It should be noted that in order to ensure the stability of semiconductor production, the general exhaust pressure of cleanroom 11 must be kept stable. Before adjusting the air pressure of supply air duct 40, the air pressure of general exhaust air duct 30 must be kept stable.

[0054] refer to Figure 1 The semiconductor plant's heat and cold recycling system also includes a first adjustable switching valve 33, which is installed on the general exhaust duct 30. The first adjustable switching valve 33 is electrically connected to the control module 50, which is used to control the opening degree of the first adjustable switching valve 33.

[0055] In this embodiment, the amount of air discharged into the atmosphere is controlled by controlling the opening degree of the first adjustable switching valve 33.

[0056] In this embodiment, the semiconductor plant's heat and cold recycling system further includes a second adjustable switching valve 43, which is disposed on the air supply duct 40. The second adjustable switching valve 43 is electrically connected to the control module 50, and the control module 50 is used to control the opening degree of the second adjustable switching valve 43.

[0057] In this embodiment, the air volume supplied to the equipment room 21 is controlled by controlling the opening degree of the second adjustable switching valve 43.

[0058] In this embodiment, the first adjustable switching valve 33 and the second adjustable switching valve 43 are used in conjunction, and the total opening degree of the first adjustable switching valve 33 and the second adjustable switching valve 43 is 100%. The control module 50 adjusts the opening degree of the first adjustable switching valve 33 and the second adjustable switching valve 43 according to the general exhaust air pressure of the clean room 11 and the air pressure required by the equipment room 21. For example, the opening degree of the first adjustable switching valve 33 is set to 20%, and the opening degree of the second adjustable switching valve 33 is set to 80%; or the opening degree of the first adjustable switching valve 33 is set to 30%, and the opening degree of the second adjustable switching valve 33 is set to 70%, etc.

[0059] When the pressure control module 60 detects a large fluctuation in the air pressure of the general exhaust duct 30, it can increase the opening of the second adjustable switching valve 33 to increase the air volume delivered to the equipment room 21, reduce the air pressure fluctuation of the general exhaust duct 30, and thus improve the stability of the production environment in the clean room 11.

[0060] In this embodiment, the semiconductor plant's heat and cold recycling system further includes a pressure relief valve 44, which is installed on the air supply duct 40 and is electrically connected to the control module 40.

[0061] In this embodiment, the pressure relief valve 44 can protect the pipeline safety. When the pressure in the pipeline is high, the control module 50 can open the pressure relief valve 44 to reduce the air pressure in the pipeline and achieve a safe and stable effect.

[0062] In this embodiment, a filter (not shown) may also be installed on the air supply duct 40 to filter dust and other particles in the air, making the air entering the equipment room 21 cleaner.

[0063] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A semiconductor plant heat and cold recycling system, characterized in that, include: A cleanroom, comprising a clean production area and an equipment support area, wherein the clean production area is equipped with at least one clean room and the equipment support area is equipped with at least one equipment room; General exhaust duct, which connects the cleanroom to the atmospheric environment; An air supply duct connects the general exhaust duct and the equipment room, and is used to deliver air from the cleanroom to the equipment room for reuse.

2. The semiconductor plant heat and cold recycling system as described in claim 1, characterized in that, It also includes a control module, which is used to control the air pressure in the general exhaust duct and the supply duct.

3. The semiconductor plant heat and cold recycling system as described in claim 2, characterized in that, It also includes a pressure detection module, which is used to detect the air pressure in the general exhaust duct and the air supply duct, and the pressure detection module is electrically connected to the control module.

4. The semiconductor plant heat and cold recycling system as described in claim 3, characterized in that, It also includes a first adjustable switching valve, which is installed on the general exhaust duct. The first adjustable switching valve is electrically connected to the control module, which is used to control the opening degree of the first adjustable switching valve.

5. The semiconductor plant heat and cold recycling system as described in claim 4, characterized in that, It also includes a second adjustable switching valve, which is installed on the air supply duct and is electrically connected to the control module. The control module is used to control the opening degree of the second adjustable switching valve.

6. The semiconductor plant heat and cold recycling system as described in claim 1, characterized in that, The general exhaust duct has at least one air inlet, which is connected to the clean room, and the air inlets are arranged in a one-to-one correspondence with the clean room.

7. The semiconductor plant heat and cold recycling system as described in claim 1, characterized in that, The air supply duct has at least one air outlet, which is connected to the equipment, and the air outlet and the equipment are arranged in a one-to-one correspondence.

8. The semiconductor plant heat and cold recycling system as described in claim 7, characterized in that, The air outlet is equipped with an air valve, which is used to adjust the opening degree of the air outlet.

9. The semiconductor plant heat and cold recycling system as described in claim 2, characterized in that, It also includes a first fan, which is installed on the general exhaust duct and is electrically connected to the control module.

10. The semiconductor plant heat and cold recycling system as described in claim 2, characterized in that, It also includes a second fan, which is installed on the air supply duct and is electrically connected to the control module.

11. The semiconductor plant heat and cold recycling system as described in claim 2, characterized in that, It also includes a pressure relief valve, which is installed on the air supply duct and is electrically connected to the control module.

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