Resistance paste and preparation method thereof

Abstract

The invention relates to the technical field of resistance paste, and provides resistance paste and a preparation method thereof. Wherein the resistance paste comprises 75-105 parts of a conductive filler, 0.5-5 parts of a high-temperature heat-resistant agent, 5-15 parts of glass powder and 15-33 parts of an organic carrier; the conductive filler contains nano silver powder. According to the resistance paste provided by the invention, the added conductive filler serves as a core component of the resistance paste and is used for forming a continuous and compact conductive network, and the contained nano silver powder can remarkably reduce the sintering temperature of the resistance paste, promote the sintering compactness and enhance the adhesive force, so that the stability and reliability of a resistor are improved; the high-temperature heat-resistant agent has an extremely high heat-resistant temperature, so that the heat stability, the service life and the reliability of the resistor can be remarkably improved; the glass powder can improve the compatibility of the slurry and a base material, effectively prevents cracking and layering caused by sintering, and can form a more compact protection layer, thereby inhibiting silver oxidation and improving the corrosion resistance of the resistor.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of resistance paste, and particularly relates to a resistance paste and a preparation method thereof. BACKGROUND

[0002] As an indispensable electronic component in modern electronic devices, chip resistors bear key functions such as voltage division, current limiting and signal processing. With the rapid development of electronic technology, chip resistors are gradually developing towards high precision, miniaturization and high reliability to meet the increasingly complex needs of electronic systems. Resistance paste, as one of the key materials of chip resistors, directly affects the electrical performance, durability and consistency of resistors, so it is particularly important.

[0003] Ruthenium-based resistance paste, with its excellent electrical conductivity, outstanding chemical stability and excellent high-temperature resistance, plays a crucial role in the manufacture of chip resistors. Currently, the conductive component of ruthenium-based resistance paste is mainly ruthenium dioxide (RuO2), but it has the problem of poor sintering performance at a sintering temperature lower than 850℃. In the preparation process of electronic components such as chip resistors, it is easy to cause insufficient sintering of ruthenium-based resistance paste, resulting in a discontinuous and dense conductive network, which affects the resistance stability, electrical conductivity and reliability of the resistor. In addition, the existing ruthenium-based resistance paste has poor matching with the thermal expansion coefficient of the substrate material, which leads to insufficient adhesion between the ruthenium paste and the substrate, and is prone to problems such as peeling and cracking during use, thereby deteriorating the service life and reliability of electronic components.

[0004] Therefore, there is an urgent need to develop a resistance paste with good sintering performance, stable resistance and strong adhesion. SUMMARY

[0005] The purpose of the present application is to provide a resistance paste and a preparation method thereof, aiming to solve the problems of poor low-temperature sintering performance, unstable resistance and weak adhesion of the existing ruthenium-based resistance paste.

[0006] To achieve the above application purposes, the technical solutions adopted by the present application are as follows: In a first aspect, the present application provides a resistance paste, comprising the following components by weight: conductive filler 75-105 parts, high-temperature heat-resistant agent 0.5-5 parts, glass powder 5-15 parts, and organic carrier 15-33 parts.

[0007] In a second aspect, the present application provides a preparation method of a resistance paste, comprising the following steps: adding the high-temperature heat-resistant agent into the organic carrier and mixing to obtain a dispersion liquid; The conductive filler and glass powder are added into the dispersion liquid for dispersion treatment, and then three-roll ball milling treatment is carried out, and the resistance paste is obtained by filtration.

[0008] Compared with the prior art, the present application has the following beneficial effects: The electric resistance paste provided by the first aspect of the present application adds the conductive filler as the core component of the electric resistance paste, which is used to form a continuous and dense conductive network, and the nano silver powder contained in the conductive filler can significantly reduce the sintering temperature of the electric resistance paste, promote the sintering density, enhance the adhesion, and improve the electric conductivity, so as to improve the stability and reliability of the electric resistance; the high-temperature heat-resistant agent added has a very high heat-resistant temperature, which can significantly improve the thermal stability, service life and reliability of the electric resistance; the glass powder added can improve the compatibility of the paste and the substrate, effectively prevent the sintering from cracking and delamination, and form a more dense protective layer, so as to inhibit the oxidation of silver and improve the corrosion resistance of the electric resistance. Therefore, the electric resistance paste of the present application has excellent sintering performance and stronger adhesion under the synergistic effect of the nano silver powder, the high-temperature heat-resistant agent and the glass powder, so that the resistance value of the electric resistance is stable, the reliability is good, and the service life is long. In addition, the electric resistance paste does not contain lead, and meets the RoHS standard.

[0009] The preparation method of the electric resistance paste provided by the second aspect of the present application first uniformly disperses the high-temperature heat-resistant agent in the organic carrier, and then uniformly disperses the conductive filler and the glass powder, which can ensure that the components are fully and uniformly dispersed, solve the problems of easy agglomeration of nano powder and difficult uniform dispersion of multiple components, and thus form a uniform and stable electric resistance paste. DETAILED DESCRIPTION

[0010] In order to make the technical problems to be solved by the present application, the technical solutions and beneficial effects more clear and explicit, the present application will be further described in detail in combination with embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0011] The first aspect of the present application provides an electric resistance paste, which comprises the following components in weight percentage: conductive filler 75-105 parts, high-temperature heat-resistant agent 0.5-5 parts, glass powder 5-15 parts, and organic carrier 15-33 parts. The conductive filler contains nano silver powder.

[0012] The resistance paste provided by the embodiments of the present application adds conductive fillers as the core component of the resistance paste, which is used to form a continuous and dense conductive network, and the nano-silver powder contained therein can significantly reduce the sintering temperature of the resistance paste, promote sintering density, enhance adhesion, and at the same time improve the conductive performance, thereby improving the stability and reliability of the resistance; the high-temperature heat-resistant agent added has a very high heat-resistant temperature, which can significantly improve the thermal stability, service life and reliability of the resistance; the glass powder added can improve the compatibility of the paste and the substrate, effectively prevent sintering from cracking and delamination, and can form a more dense protective layer, thereby inhibiting silver oxidation and improving the corrosion resistance of the resistance. Therefore, the resistance paste of the present application has excellent sintering performance and stronger adhesion under the synergistic action of nano-silver powder, high-temperature heat-resistant agent and glass powder, so that the resistance has stable resistance, good reliability and long service life. In addition, the resistance paste does not contain lead and meets the RoHS standard.

[0013] In the embodiments, the conductive filler includes 65-85 parts of ruthenium dioxide powder and 10-20 parts of nano-silver powder. Since the nano-silver powder has high surface activity and low melting point, it can be used as a high-efficiency sintering activator, which preferentially melts in the sintering process, effectively bridges and welds the ruthenium dioxide particles, thereby enabling sintering densification at a temperature lower than 850°C, forming a continuous and dense conductive network, and solving the problems of poor low-temperature sintering and unstable resistance of ruthenium-based paste. Moreover, the nano-silver powder can better penetrate into the substrate material during sintering and be more tightly combined with the substrate, which helps to enhance the adhesion of the resistance to the substrate and improve the reliability of the resistance. In the addition range of nano-silver powder in the embodiments, the optimal sintering promotion effect can be achieved, and if the content is too low, the promotion effect is insufficient, and if the content is too high, an excessive amount of independent silver conductive path may be formed, which changes the resistance characteristics of the paste and leads to high cost.

[0014] In the embodiment, the glass powder comprises silver-cerium composite oxide, bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid and zinc oxide in a mass ratio of (30-45):(25-40):(1-5):(1-5):(5-15):(1-5):(1-5). The silver and cerium in the silver-cerium composite oxide form a synergistic reaction to provide an additional electron transport path, and can reduce the grain boundary resistance to improve the electron transport efficiency, while the material has good compatibility, high-temperature sintering forms a dense protective layer of glass phase, inhibits silver oxidation, and improves the corrosion resistance; the bismuth oxide and silicon dioxide constitute a low-melting glass phase to realize low-temperature flow; the aluminum oxide and zinc oxide adjust the thermal expansion and chemical durability; the decomposition of barium carbonate produces gas to help form a more dense structure; the phosphoric acid can enhance the chemical bonding with the substrate. Therefore, under the synergistic effect of the specific proportions of the components, the glass powder helps to infiltrate the substrate and the conductive filler during the sintering process, enhances the bonding force between the sintered body and the substrate, adjusts the thermal expansion coefficient, and forms a more stable and dense sintered body, thereby greatly improving the adhesion, resistance stability and reliability of the sintered body.

[0015] In the embodiment, the particle size of the ruthenium dioxide powder is 0.1-5 μm.

[0016] In the embodiment, the particle size of the nano-silver powder is 10-300 nm. This particle size range has the best sintering activity and surface effect, and can maximize the low-temperature sintering promotion effect.

[0017] In the embodiment, the particle size of the glass powder is 0.5-3 μm.

[0018] In the embodiment, the mass ratio of silver and cerium in the silver-cerium composite oxide is (85-95):(5-15).

[0019] In the embodiment, the fineness of the resistive paste is ≤10 μm, and the viscosity is 50-300 Pa·s.

[0020] In the embodiments, the high-temperature heat-resistant agent includes at least one of metal oxide solid solution powder, inorganic whiskers, and rare earth oxide powder. The metal oxide solid solution powder is formed by calcining Al2O3 powder, MgO powder, and ZrO2 powder in a mass ratio of (65~75):(15~25):(1~5). This metal oxide solid solution powder combines the advantages of Al2O3 powder, MgO powder, and ZrO2 powder, significantly improving the thermal stability of the resistivity of the sintered body, while also enhancing the hardness and toughness of the sintered body, making it wear-resistant and crack-resistant, and improving the service life and reliability of the resistivity. The inorganic whiskers are selected from Si3N4 whiskers with a diameter of 0.1~1µm, a length of 5~20µm, and an aspect ratio of 5~20. These Si3N4 whiskers play a role in reinforcing the framework during sintering, effectively suppressing excessive flow of the glass phase at high temperatures, and enhancing the mechanical strength and adhesion of the sintered body to the substrate. The rare earth oxide powder is selected from Y2O3 powder, which has good high-temperature stability and chemical inertness, and can stabilize the valence state of RuO2, thereby further stabilizing the resistivity of the sintered body.

[0021] In some embodiments, the high-temperature heat-resistant agent comprises metal oxide solid solution powder, inorganic whiskers, and rare earth oxide powder in a mass ratio of (3~6):(2~3):(0.5~1.5). These high-temperature heat-resistant agents can play a synergistic reinforcing role, which can significantly improve the thermal stability, adhesion, and service life of the sintered body.

[0022] In this embodiment, the high-temperature heat-resistant agent further includes an organic solvent comprising ethylene glycol, polyvinyl butyral, and diethylene glycol monobutyl ether in a mass ratio of (1-10):(1-5):(20-40). Ethylene glycol serves as a dispersion medium; polyvinyl butyral acts as a binder, forming a flexible coating layer on the surface of metal oxide solid solution powder, inorganic whiskers, or rare earth oxide powder, enhancing compatibility with the organic carrier; and diethylene glycol monobutyl ether, as a high-boiling-point solvent, ensures processing stability. Therefore, with a specific ratio of these three components, the thermal stability, service life, and reliability of the resistor can be significantly improved.

[0023] In the embodiments, the organic solvent accounts for 70-90% of the total mass of the high-temperature heat-resistant agent.

[0024] In the embodiments, the organic carrier comprises 5-10 parts ethyl cellulose, 3-6 parts ethylene glycol, 6-12 parts diethylene glycol monobutyl ether, and 1-5 parts terpineol. Ethyl cellulose, as the main binder and rheology modifier, provides good film-forming properties and printability; the compound solvent system of ethylene glycol and diethylene glycol monobutyl ether balances the dissolution and dispersion capabilities of each component, suitable evaporation rates, and process stability; terpineol, as a high-boiling-point solvent and leveling agent, prevents surface defects caused by excessive solvent evaporation during drying. Therefore, these organic carriers not only effectively disperse and support functional solid particles but also decompose and volatilize smoothly and completely during sintering, avoiding residual carbon from affecting the sintered body.

[0025] The second aspect of this application provides a method for preparing the resistive paste as described above.

[0026] The method for preparing the resistive paste according to the embodiments of this application includes the following steps: S1: The high-temperature heat-resistant agent is added to the organic carrier and mixed to obtain a dispersion; S2: The conductive filler and glass powder are added to the dispersion liquid for dispersion treatment, and then subjected to three-roll ball milling and filtration to obtain the resistive slurry.

[0027] The method for preparing resistive slurry provided in this application embodiment first uniformly disperses a high-temperature heat-resistant agent in an organic carrier, and then adds conductive filler and glass powder and disperses them evenly. This ensures that each component is fully and evenly dispersed, solves the problem of easy agglomeration of nanoparticles and difficulty in uniform dispersion of multiple components, thereby forming a uniform and stable resistive slurry.

[0028] The specific components and contents of the conductive filler, high-temperature heat-resistant agent, glass powder and organic carrier in steps S1 to S2 above are the same as those of the conductive filler, high-temperature heat-resistant agent, glass powder and organic carrier contained in the resistive paste described in the embodiments of the above application, and will not be repeated here.

[0029] In the above-mentioned step S2, the step of adding conductive filler and glass powder to the dispersion liquid for dispersion treatment includes: adding conductive filler to the dispersion liquid, using an ultrasonic-assisted ball milling device to fully disperse the mixture, and then adding glass powder for full dispersion.

[0030] In this embodiment, the steps for preparing the glass powder include: mixing a composite oxide of silver and cerium, bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid, and zinc oxide, followed by melting, cooling, crushing, and sieving to obtain glass powder. The melting temperature is 1000–1200°C, and the melting time is 10–60 min. The particle size of the glass powder is 0.5–2.5 μm.

[0031] In the embodiments, the steps for preparing the silver-cerium composite oxide include: dissolving silver salt and cerium salt in a solvent, then co-precipitating them with a precipitant, followed by solid-liquid separation, purification, and drying to obtain a silver-cerium composite hydroxide; and calcining the silver-cerium composite hydroxide to obtain the silver-cerium composite oxide. The silver salt is selected from silver nitrate or silver chloride, the cerium salt is selected from cerium nitrate or cerium chloride, and the precipitant is selected from ammonia and / or sodium hydroxide. The coprecipitation reaction is carried out at a temperature of 50–65°C for 6–8 hours, and the pH of the reaction system is 8.5–9.5. The calcination treatment is carried out at a temperature of 500–700°C.

[0032] In the embodiments, the steps for preparing the high-temperature heat-resistant agent include: adding at least one of metal oxide solid solution powder, inorganic whiskers, and rare earth oxide powder to an organic solvent and mixing them to obtain the high-temperature heat-resistant agent.

[0033] The following description is based on specific embodiments.

[0034] Example 1 This embodiment provides a resistive paste and its preparation method.

[0035] The resistive paste comprises the following components in parts by weight: 75 parts ruthenium dioxide powder, 15 parts nano silver powder, 3 parts high-temperature heat resistant agent, 10 parts glass powder, and 25 parts organic carrier; The average particle size of ruthenium dioxide powder is 2.5 μm, and the average particle size of silver nanoparticles is 120 nm. The high-temperature heat-resistant agent is composed of metal oxide solid solution powder, Si3N4 whiskers (average diameter 0.5µm, average length 12µm, average aspect ratio 15), Y2O3 powder, and organic solvent in a mass ratio of 4.4:2.4:1.2:32. The metal oxide solid solution powder is formed by calcining Al2O3 powder, MgO powder, and ZrO2 powder in a mass ratio of 70:25:5. The organic solvent includes ethylene glycol, polyvinyl butyral, and diethylene glycol monobutyl ether in a mass ratio of 6:3:30. The glass powder has an average particle size of 1.5 μm and is composed of a silver-cerium composite oxide, bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid, and zinc oxide in a mass ratio of 40:30:3:2:10:2:3; in the silver-cerium composite oxide, the mass ratio of silver oxide to cerium oxide is 90:10. The organic carrier consists of 8 parts ethyl cellulose, 4 parts ethylene glycol, 9 parts diethylene glycol monobutyl ether, and 3 parts terpineol.

[0036] The method for preparing resistive paste includes the following steps: (1) Preparation of glass powder: According to the mass ratio of silver oxide and cerium oxide of 90:10, weigh appropriate amounts of silver nitrate and cerium chloride and add them to pure water and stir evenly to form a mixed solution; add the mixed solution, sodium hydroxide solution and ammonia solution to the reaction vessel and mix them. Control the temperature of the reaction vessel to 60℃ and the pH value of the reaction system to 9. Perform co-precipitation reaction for 7h. After filtration, washing and drying, silver-cerium composite hydroxide is obtained; calcine the silver-cerium composite hydroxide at 600℃ for 4h to obtain silver-cerium composite oxide. Weigh out appropriate amounts of silver-cerium composite oxide, bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid, and zinc oxide in a mass ratio of 40:30:3:2:10:2:3, mix them, then melt them at 1100℃ for 30 minutes, pour them into deionized water for water quenching, and then dry, crush, and sieve them to obtain glass powder.

[0037] (3) Preparation of high temperature heat resistant agent: Add metal oxide solid solution powder, Si3N4 whiskers and Y2O3 powder to a mixed organic solvent of ethylene glycol, polyvinyl butyral and diethylene glycol monobutyl ether, and mix to obtain high temperature heat resistant agent.

[0038] (4) Preparation of resistive slurry: Add the high-temperature heat-resistant agent to the organic carrier and stir evenly to obtain a dispersion; Ruthenium dioxide powder and nano silver powder are added to the dispersion liquid, and the mixture is fully dispersed using an ultrasonic-assisted ball mill. Then glass powder is added and fully dispersed. The mixture is then subjected to a three-roll ball milling process, grinding 12 times, and filtered to obtain a resistive slurry.

[0039] Example 2 This embodiment provides a resistive paste and its preparation method.

[0040] The difference between the resistive paste and Example 1 is that the glass powder does not contain a composite oxide of silver and cerium.

[0041] The difference between the preparation method of the resistive slurry and Example 1 is: (1) Preparation of glass powder: weigh appropriate amounts of bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid and zinc oxide in a mass ratio of 30:3:2:10:2:3 and mix them. Then melt them at 1100℃ for 30 minutes, pour them into deionized water for water quenching, and then dry, crush and sieve them to obtain glass powder.

[0042] Example 3 This embodiment provides a resistive paste and its preparation method.

[0043] The difference between the resistive paste and Example 1 is that the high-temperature heat resistant agent does not contain Si3N4 whiskers, but is composed of metal oxide solid solution powder, Y2O3 powder and organic solvent in a mass ratio of 1.7:0.3:8.

[0044] The difference between the preparation method of the resistive paste and Example 1 is: (3) Preparation of high temperature heat resistant agent: add metal oxide solid solution powder and Y2O3 powder to a mixed organic solvent of ethylene glycol, polyvinyl butyral and diethylene glycol monobutyl ether, and perform mixing treatment to obtain high temperature heat resistant agent.

[0045] Example 4 This embodiment provides a resistive paste and its preparation method.

[0046] The difference between the resistive paste and Example 1 is that the high-temperature heat resistant agent does not contain metal oxide solid solution powder, that is, it is composed of Si3N4 whiskers (average diameter of 0.5µm, average length of 12µm, average aspect ratio of 15), Y2O3 powder and organic solvent in a mass ratio of 1:1:8.

[0047] Example 5 This embodiment provides a resistive paste and its preparation method.

[0048] The difference between the resistive paste and Example 1 is that "metal oxide solid solution powder" is replaced by "metal oxide mixed powder formed by simply mixing Al2O3 powder, MgO powder and ZrO2 powder in a mass ratio of 70:25:5".

[0049] Comparative Example 1 This embodiment provides a resistive paste and its preparation method, which differs from Embodiment 1 in that it does not contain nano silver powder.

[0050] Comparative Example 2 This embodiment provides a resistive slurry and its preparation method. The difference from Embodiment 1 is that the glass powder is ordinary glass powder formed by melting, water quenching, drying, crushing and sieving of PbO, B2O3, SiO2 and ZnO in a mass ratio of 50:25:15:10.

[0051] Comparative Example 3 This embodiment provides a resistive paste and its preparation method. The difference from Embodiment 1 is that the high-temperature heat resistant agent is Al2O3 powder with an average particle size of 3μm.

[0052] Relevant performance test analysis: 1. The fineness of the resistive slurry provided in Examples 1-5 and Comparative Examples 1-3 was tested using the scraper fineness method.

[0053] 2. The viscosity of the resistive slurry provided in Examples 1-5 and Comparative Examples 1-3 was tested using a rotational viscometer.

[0054] 3. The resistive pastes provided in Examples 1-5 and Comparative Examples 1-3 were printed onto glass substrates to form 1mm × 1mm sheet resistance patterns, and then sintered in an air sintering furnace at 800℃ to form resistive bodies. The sheet resistance of the resistive body was tested using a four-probe tester; the temperature coefficient of resistance (TCR) of the resistive body was tested using a resistance measuring instrument; and the adhesion of the resistive body was tested using an adhesion tester.

[0055] The test results are shown in Table 1: Table 1 As can be seen from Table 1, the temperature coefficient of the resistive body prepared in Example 1 is smaller than that in Comparative Example 1, and the adhesion of the resistive body prepared in Example 1 is greater than that in Comparative Example 1. The main reason is that the nano silver powder added in the examples of this application can help the slurry to sinter and densify at a lower temperature, forming a continuous and dense conductive network, thereby improving the adhesion and temperature stability of the resistive body.

[0056] The temperature coefficient of the resistive body prepared in Example 1 is less than that in Comparative Example 2, and the adhesion of the resistive body prepared in Example 1 is greater than that in Comparative Example 2. The main reason is that the glass powder with special components added in this application example can wet the matrix and conductive filler during sintering, enhance the bonding strength between the sintered body and the matrix, adjust the coefficient of thermal expansion, and thus greatly improve the adhesion and resistance stability of the resistive body.

[0057] The temperature coefficient of the resistive element prepared in Example 1 is less than that in Comparative Example 3, and the adhesion of the resistive element prepared in Example 1 is greater than that in Comparative Example 3. The main reason is that the embodiments of this application added a high-temperature heat-resistant agent with special components. The metal oxide solid solution powder with extremely high heat resistance temperature can improve the resistance stability of the resistive element; Si3N4 whiskers serve as a reinforcing skeleton to suppress excessive flow of the glass phase at high temperatures, thereby enhancing the bonding strength between the resistive element and the substrate; rare earth oxide powder can stabilize the valence state of RuO2, thereby further improving the resistance stability of the resistive element.

[0058] The temperature coefficient of the resistive body prepared in Example 1 is less than that in Example 5, and the adhesion of the resistive body prepared in Example 1 is greater than that in Example 5. The main reason is that the resistive body added in Example 5 is a mixed powder formed by simply mixing Al2O3 powder, MgO powder and ZrO2 powder. During sintering, they need to be sintered and densified independently, which requires a higher sintering temperature. Moreover, they have different shrinkage behaviors, which easily form pores at the interface, thereby affecting the bonding strength between the resistive body and the substrate and the stability of the resistance value.

[0059] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electrically resistive paste, characterized in that, The composition comprises the following components in parts by weight: conductive filler 75-105 parts, high-temperature resistant agent 0.5-5 parts, glass powder 5-15 parts, organic carrier 15-33 parts. The conductive filler contains nano-silver powder.

2. The resistive paste of claim 1, wherein, The conductive filler comprises ruthenium dioxide powder 65-85 parts and nano-silver powder 10-20 parts. And / or, the glass powder comprises silver-cerium composite oxide, bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid and zinc oxide in a mass ratio of (30-45):(25-40):(1-5):(1-5):(5-15):(1-5):(1-5).

3. The resistive paste of claim 2, wherein, At least one of the following conditions is met: The particle size of the ruthenium dioxide powder is 0.1-5 μm; The particle size of the nano-silver powder is 10-300 nm; The particle size of the glass powder is 0.5-3 μm; In the silver-cerium composite oxide, the mass ratio of silver oxide to cerium oxide is (85-95):(5-15); The fineness of the resistive paste is ≤10 μm, and the viscosity is 50-300 Pa·s.

4. The resistive paste of claim 1, wherein, The high-temperature resistant agent comprises at least one of metal oxide solid solution powder, inorganic whisker and rare earth oxide powder; The metal oxide solid solution powder is formed by calcination of Al2O3 powder, MgO powder and ZrO2 powder in a mass ratio of (65-75):(15-25):(1-5); The inorganic whisker is selected from Si3N4 whisker with a diameter of 0.1-1 μm, a length of 5-20 μm and an aspect ratio of 5-20; The rare earth oxide powder is selected from Y2O3 powder.

5. The resistive paste of claim 4, wherein, The high-temperature resistant agent further comprises an organic solvent, and the organic solvent comprises ethylene glycol, polyvinyl butyral and diethylene glycol monobutyl ether in a mass ratio of (1-10):(1-5):(20-40).

6. The resistive paste of claim 5, wherein, The organic solvent accounts for 70-90% of the total mass of the high-temperature resistant agent.

7. The resistive paste of claim 1, wherein, The organic carrier comprises ethyl cellulose 5-10 parts, ethylene glycol 3-6 parts, diethylene glycol monobutyl ether 6-12 parts and terpineol 1-5 parts.

8. A method of preparing the resistive paste according to any one of claims 5 to 7, characterized in that, The method comprises the following steps: The high-temperature resistant agent is added to the organic carrier for mixing treatment to obtain a dispersion liquid; The conductive filler and the glass powder are added to the dispersion liquid for dispersion treatment, and then three-roll ball milling treatment is performed to obtain a resistive paste.

9. The production method according to claim 8, wherein The step of preparing the glass powder comprises: mixing silver-cerium composite oxide, bismuth oxide, aluminum oxide, silicon dioxide, barium carbonate, phosphoric acid and zinc oxide, then performing melting treatment, and then cooling, crushing and sieving to obtain the glass powder; And / or, the step of preparing the high-temperature resistant agent comprises: adding at least one of the metal oxide solid solution powder, the inorganic whisker and the rare earth oxide powder to the organic solvent for mixing treatment to obtain the high-temperature resistant agent.

10. The production method according to claim 9, wherein The step of preparing the silver-cerium composite oxide comprises: dissolving silver salt and cerium salt in a solvent, then performing coprecipitation reaction with a precipitant, and then performing solid-liquid separation, purification and drying to obtain silver-cerium composite hydroxide; performing calcination treatment on the silver-cerium composite hydroxide to obtain silver-cerium composite oxide; the temperature of the calcination treatment is 500-700 ℃. And / or, the temperature of the smelting treatment is 1000-1200℃, and the time is 10-60 min.

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