Lighting device and lamp
By using a molded part to fix the connecting components in LED lighting devices, the problems of deformation and breakage of the connecting components are solved, the electrical reliability and connection stability are improved, and the durability of LED lighting devices is enhanced.
CN121773294APending Publication Date: 2026-03-31LG INNOTEK CO LTD
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Patent Information
- Application Number
- CN202480055850.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-06-27
- Filing Date
- 2024-06-28
- Publication Date
- 2026-03-31
AI Technical Summary
Technical Problem
In existing LED lighting devices, connecting components are prone to deformation and breakage, leading to reduced electrical reliability and unstable connection between the light source and the circuit board.
Method used
At least a portion of the connecting member is covered by a molding part, which fixes the connecting member to prevent deformation and breakage, and provides a stable electrical connection between the light source and the circuit board.
Benefits of technology
It improves the electrical reliability of lighting modules and devices, prevents flow of connecting components and poor electrical contact, and enhances the stability and durability of the connection.
✦ Generated by Eureka AI based on patent content.
Abstract
A lighting device according to an embodiment of the present invention comprises: a support plate; the circuit board is arranged on the supporting plate; the plurality of bonding pads are arranged on one side of the circuit board; a light source portion disposed on the support plate and having a light emitting device and a plurality of bond pads; a plurality of connection members connecting the plurality of pads to the plurality of bond pads, respectively; and a plurality of molded portions covering different regions of at least one of the plurality of connecting members, in which an uppermost end of at least one of the plurality of molded portions may be disposed at a position higher than a highest point of the plurality of connecting members with respect to an upper surface of the circuit board.
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