Aluminum-based silicon carbide composite plate strip

Abstract

The invention provides an aluminum-based silicon carbide composite plate strip, and relates to the technical field of plate strips, a high-temperature transition layer is used for realizing gradient transition of high-temperature resistance and thermal stress, can effectively relieve high-temperature temperature difference stress between a zirconium modified pure aluminum anti-cracking main body layer and the high-temperature transition layer of a plate, and avoids deformation and cracking of the whole structure of the plate due to overlarge cold and hot gradient; the low-temperature buffer layer is matched with the boron fiber enrichment transition layer, so that the high-temperature-resistant strength of the transition area can be further improved, the boron fiber enrichment transition layer is prevented from structural instability at high temperature, the low-temperature buffer layer can realize gradient transition of low-temperature resistance and stress, and the low-temperature shrinkage stress of the lower layer of the plate can be effectively relieved; the temperature-resistant composite main body layer can bear the stress of all upper-layer structures and uniformly disperse the stress to the whole region, stable support is provided for all upper-layer functional structures, meanwhile, the temperature resistance of the temperature-resistant composite main body layer is complementary with the temperature-resistant and low-temperature-resistant structures of all the layers, and finally the comprehensive effects of heat resistance, cold resistance, cracking resistance and protection of the plate are achieved.

Description

Technical Field

[0001] This invention belongs to the field of strip technology, and more specifically, relates to an aluminum-based silicon carbide composite strip. Background Technology

[0002] Composite panels are a new type of panel structure with multiple functions. They are formed by compounding multiple structural layers with different properties and are widely applicable to industrial equipment, rail transportation, high and low temperature working conditions, building protection and other fields.

[0003] A search of Chinese patent publication number "CN115257099B" reveals "a flame-retardant composite board." This composite board utilizes flame-retardant sheets bonded to the upper and lower sides of a core layer, isolating the core layer from the outside environment and thus providing a strong flame-retardant effect. The core layer is sandwiched between the flame-retardant layers on both sides, enhancing the strength of the flame-retardant composite board. Due to the crisscrossing arrangement of adjacent shavings in the core layer, tearing of the core layer during use is prevented, strengthening the bending resistance and elastic modulus of the core layer, ensuring that the core layer has the same mechanical properties in different directions.

[0004] Based on the above search and existing technology findings, the aforementioned patent has certain defects: In actual working conditions, composite panels may face alternating high and low temperatures or long-term exposure to high and low temperature environments. The device lacks a gradient transition structure to alleviate the temperature difference stress and shrinkage stress caused by high and low temperatures. It is prone to deformation and cracking of the overall structure of the board due to excessive thermal gradient. Under temperature stress and external impact, it is prone to interlayer delamination. It cannot meet the comprehensive working conditions that require heat resistance, cold resistance, crack prevention, and protection, and its reliability needs to be improved. Summary of the Invention

[0005] To address the aforementioned technical problems, this invention provides an aluminum-based silicon carbide composite plate and strip.

[0006] An aluminum-based silicon carbide composite plate and strip includes a hydrophobic protective surface layer, a zirconium oxide composite protective coating, a zirconium-modified pure aluminum crack-resistant surface layer, a zirconium-modified pure aluminum crack-resistant main body layer, a boron fiber enriched transition layer, a high-temperature transition layer, a high-temperature resistant adhesive layer, a titanium alloy enriched buffer layer, a low-temperature buffer layer, a silicon carbide particle surface layer, and a high-temperature resistant composite main body layer.

[0007] The hydrophobic protective surface layer and the heat-resistant composite main body layer are arranged sequentially from top to bottom, with the hydrophobic protective surface layer being the uppermost layer and the heat-resistant composite main body layer being the lowermost layer. The structures are tightly bonded together, which can be used to achieve heat resistance, cold resistance, crack prevention, and protection of the board.

[0008] Preferably, the hydrophobic protective surface layer is made of modified polytetrafluoroethylene, the upper surface of the hydrophobic protective surface layer is provided with a group of tiny hydrophobic dimples, and the lower surface of the hydrophobic protective surface layer is tightly bonded and fixedly connected to the zirconium oxide composite protective coating.

[0009] Among them, the hydrophobic protective surface layer serves as the first line of protection. It utilizes the inherent hydrophobicity of modified PTFE and the micro-dimpled structure on its surface to effectively repel water vapor and liquid pollutants, prevent their penetration and adhesion, and protect the underlying structure from environmental erosion.

[0010] Preferably, the zirconia composite protective coating has a dense, non-porous structure, the upper surface of the zirconia composite protective coating is tightly bonded and fixedly connected to the lower surface of the hydrophobic protective layer, and the lower surface of the zirconia composite protective coating is tightly bonded and fixedly connected to the zirconium-modified pure aluminum anti-crack layer.

[0011] Among them, the zirconia composite protective coating serves as a second robust barrier. Its dense, non-porous structure effectively blocks the intrusion of high-temperature gases, liquids, and corrosive media, and resists scratches from external hard objects, providing high-temperature and chemical protection for the internal structure.

[0012] Preferably, the upper surface of the zirconium-modified pure aluminum anti-crack surface layer is provided with an array of parallel fine lines, and the lower surface of the zirconium-modified pure aluminum anti-crack surface layer is fixedly connected to the zirconium-modified pure aluminum anti-crack main layer.

[0013] The zirconium-modified pure aluminum crack-resistant main layer and the zirconium-modified pure aluminum crack-resistant surface layer are made of the same material. The upper surface of the zirconium-modified pure aluminum crack-resistant main layer is fixedly connected to the zirconium-modified pure aluminum crack-resistant surface layer, and the lower surface of the zirconium-modified pure aluminum crack-resistant main layer is tightly bonded and fixedly connected to the boron fiber enriched transition layer to enhance the crack resistance of the plate surface.

[0014] Among them, the array of fine textures on the zirconium-modified pure aluminum anti-crack surface can actively disperse the local surface stress caused by thermal expansion and contraction, preventing stress concentration from causing brittle cracking. The zirconium-modified pure aluminum anti-crack main layer bears and evenly transmits these stresses, and releases stress over a large range by utilizing the ductility of the aluminum substrate, significantly improving the overall thermal shock resistance and mechanical stress cracking resistance of the plate.

[0015] Preferably, the upper surface of the boron fiber enriched transition layer is tightly bonded and fixedly connected to the zirconium-modified pure aluminum anti-cracking main body layer, and the lower surface of the boron fiber enriched transition layer is tightly bonded and fixedly connected to the high-temperature transition layer.

[0016] Among them, the boron fiber enriched transition layer provides high rigidity, high strength and high temperature resistance, making up for the deficiencies of aluminum, enhancing the connection strength, and buffering the thermal expansion difference and stress between the ductile aluminum material and the higher rigidity high temperature layer.

[0017] Preferably, the upper surface of the high-temperature transition layer is tightly bonded and fixedly connected to the boron fiber enrichment transition layer, and the lower surface of the high-temperature transition layer is tightly bonded and fixedly connected to the heat-resistant adhesive layer.

[0018] Among them, the high-temperature transition layer can realize the gradient transition of high-temperature stress. It gradually adapts to and alleviates the stress transmitted from the zirconium-modified pure aluminum anti-cracking main layer through the boron fiber enriched transition layer and the temperature difference stress between the lower layer and the higher temperature region, preventing structural deformation or interlayer cracking caused by sudden temperature changes or steep gradients.

[0019] Preferably, the heat-resistant adhesive layer is coated between the high-temperature transition layer and the titanium alloy enriched buffer layer to connect the high-temperature transition layer and the titanium alloy enriched buffer layer to increase strength.

[0020] The heat-resistant adhesive layer is specifically designed for bonding materials with different toughnesses, ensuring a strong interlayer bond at high temperatures and preventing peeling.

[0021] Preferably, the titanium alloy enriched buffer layer has a mesh structure on its surface, the upper surface of the titanium alloy enriched buffer layer is tightly bonded and fixedly connected to the heat-resistant adhesive layer, and the lower surface of the titanium alloy enriched buffer layer is tightly bonded and fixedly connected to the low-temperature buffer layer.

[0022] Among them, the titanium alloy enriched buffer layer has a mesh titanium alloy structure that combines toughness, impact resistance and temperature resistance. It can efficiently disperse and absorb high-temperature stress from the upper layer and external mechanical impact, and prevent these stresses from directly impacting the low-temperature sensitive structure of the lower layer.

[0023] Preferably, the upper surface of the low-temperature buffer layer is tightly bonded and fixedly connected to the titanium alloy enriched buffer layer, the lower surface of the low-temperature buffer layer is tightly bonded to the surface layer of silicon carbide particles, and the lower surface of the surface layer of silicon carbide particles is tightly bonded and fixedly connected to the heat-resistant composite main body layer.

[0024] The low-temperature buffer layer achieves a gradient transition of low-temperature shrinkage stress, alleviates the shrinkage stress of the silicon carbide particle surface layer and the temperature-resistant composite main body layer at low temperatures, reduces the impact of shrinkage tensile force on the titanium alloy enriched buffer layer, and prevents the titanium alloy mesh from cracking due to low-temperature brittleness or uneven shrinkage. The particle structure of the silicon carbide particle surface layer increases the bonding area with the main body layer and enhances adhesion. The temperature-resistant composite main body layer mainly provides the main structural strength and stability, has excellent high-temperature resistance and cold resistance, can withstand the core temperature load of the working environment, and bears and evenly distributes various stresses transmitted from all upper layers, providing stable support for the entire multi-layer functional structure.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] In this invention, a dense, non-porous zirconia composite protective coating is provided. This dense, non-porous structure gives the coating excellent high-temperature resistance, corrosion resistance, and hard scratch resistance. It can serve as a second protective barrier, effectively preventing high-temperature and corrosive media from penetrating into the interior of the board. At the same time, it resists scratches from external hard objects, protecting the lower anti-crack structure from damage. Its upper and lower surfaces are closely bonded to the hydrophobic protective layer and the zirconia-modified pure aluminum anti-crack layer, respectively. This not only inherits the protective effect of the upper hydrophobic protective layer and provides a secondary interception of harmful substances that are not completely blocked, but also provides a high-temperature resistant and smooth interface for the lower anti-crack layer, reducing the risk of cracking caused by high-temperature deformation of the substrate.

[0027] In this invention, the zirconium-modified pure aluminum anti-crack main layer and the zirconium-modified pure aluminum anti-crack surface layer are designed with the same material, which can avoid the interlayer stress caused by the connection of different materials. It is convenient to uniformly transmit the stress dispersed by the fine lines on the surface to the main layer and release it to the whole layer, which significantly enhances the overall crack resistance of the plate from the surface to the middle layer and is suitable for complex working conditions with alternating hot and cold. At the same time, its lower surface is closely bonded to the boron fiber enriched transition layer. By utilizing the ductility of its own aluminum base material, it buffers the performance difference between the anti-crack layer and the hard boron fiber layer, reducing the risk of interlayer cracking and peeling.

[0028] In this invention, boron fiber possesses the characteristics of high modulus and high tensile strength. The boron fiber enrichment structure can effectively compensate for the lack of rigidity of aluminum-based materials, significantly enhance the interlayer connection strength and the overall flexural strength of the plate, and at the same time improve the high temperature resistance of the boron fiber enrichment transition layer, making it suitable for the high temperature working conditions of the middle layer. As a transition between the zirconium-modified pure aluminum anti-cracking main layer and the high temperature transition layer, this layer can buffer the impact of the pure aluminum ductile material and the high temperature rigid material, reduce interlayer thermal stress, provide stable rigid support for the zirconium-modified pure aluminum anti-cracking main layer, and provide a flat and firm connecting base for the high temperature transition layer, ensuring the stability of the middle layer structure.

[0029] In this invention, the titanium alloy enriched buffer layer itself possesses excellent high toughness, impact resistance, and high and low temperature resistance. The mesh structure on its surface combines porosity and rigidity, which can effectively disperse high temperature stress and external mechanical impact stress, achieving stress buffering and stress release, while also ensuring its own structural strength. Its upper and lower surfaces are closely bonded to the high temperature resistant adhesive layer and the low temperature buffer layer, respectively. It not only bears and buffers the high temperature stress transmitted by the upper adhesive layer, preventing the high temperature stress from directly impacting the lower low temperature structure, but also provides a tough base for the lower low temperature buffer layer, realizing a smooth transition from high temperature stress to low temperature stress and reducing stress concentration caused by sudden temperature changes.

[0030] In this invention, the high-temperature transition layer achieves a gradient transition in high-temperature resistance and thermal stress, effectively alleviating the high-temperature stress difference between the zirconium-modified pure aluminum anti-cracking main layer and the high-temperature transition layer, preventing overall structural deformation and cracking of the plate due to excessive thermal gradient. Its combined effect with the boron fiber-enriched transition layer further enhances the high-temperature strength of the transition area, preventing structural instability of the boron fiber-enriched transition layer at high temperatures. The low-temperature buffer layer achieves a gradient transition in low-temperature resistance and stress, effectively alleviating the low-temperature shrinkage stress of the lower layer of the plate, adapting to the cold-resistant conditions of the plate, and reducing the shrinkage impact of the low-temperature environment on the upper titanium alloy buffer layer, preventing the titanium alloy mesh structure from shrinking due to low temperatures. In the event of cracking, the silicon carbide particle surface layer, made of high-hardness, high-temperature-resistant, and wear-resistant silicon carbide material, serves as a rigid protective barrier at the bottom of the board, preventing external wear and high-temperature media from damaging the bottom main layer. The granular structure also increases the contact area with the temperature-resistant composite main layer, enhancing interlayer bonding. The temperature-resistant composite main layer possesses excellent high-temperature resistance, cold resistance, and structural stability, bearing the stress of all upper structures and distributing it evenly throughout the entire area, providing stable support for all upper functional structures. At the same time, its temperature resistance complements the temperature and low-temperature resistance structures of each layer, further strengthening the board's overall temperature resistance, ultimately achieving a comprehensive effect of heat resistance, cold resistance, crack prevention, and protection. Attached Figure Description

[0031] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0032] Figure 2 This is a schematic diagram of the combined structure of the present invention;

[0033] Figure 3 This is a schematic diagram of the planar structure of the present invention;

[0034] Figure 4 This is a schematic diagram of the zirconium-modified pure aluminum crack-resistant surface layer composite structure of the present invention;

[0035] Figure 5 This is a schematic diagram of the low-temperature buffer layer combination structure of the present invention.

[0036] In the figure, the correspondence between the component names and the attached drawing numbers is as follows: 11. Hydrophobic protective surface layer; 12. Zirconia composite protective coating; 13. Zirconia-modified pure aluminum crack-resistant surface layer; 14. Zirconia-modified pure aluminum crack-resistant main body layer; 15. Boron fiber enriched transition layer; 16. High-temperature transition layer; 17. Temperature-resistant adhesive layer; 18. Titanium alloy enriched buffer layer; 19. Low-temperature buffer layer; 21. Silicon carbide particle surface layer; 22. Temperature-resistant composite main body layer. Detailed Implementation

[0037] The embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of the invention.

[0038] Please see Figure 1 - Figure 5 The present invention provides an aluminum-based silicon carbide composite plate and strip, comprising a hydrophobic protective surface layer 11, a zirconium oxide composite protective coating 12, a zirconium-modified pure aluminum crack-resistant surface layer 13, a zirconium-modified pure aluminum crack-resistant main body layer 14, a boron fiber enriched transition layer 15, a high-temperature transition layer 16, a heat-resistant adhesive layer 17, a titanium alloy enriched buffer layer 18, a low-temperature buffer layer 19, a silicon carbide particle surface layer 21, and a heat-resistant composite main body layer 22.

[0039] The hydrophobic protective surface layer 11 to the heat-resistant composite main body layer 22 are arranged sequentially from top to bottom, with the hydrophobic protective surface layer 11 being the uppermost layer and the heat-resistant composite main body layer 22 being the lowermost layer. The structures are tightly bonded together, which can be used to achieve heat resistance, cold resistance, crack prevention, and protection of the board.

[0040] The hydrophobic protective surface layer 11 is made of modified polytetrafluoroethylene. The upper surface of the hydrophobic protective surface layer 11 is provided with a group of tiny hydrophobic pits. The lower surface of the hydrophobic protective surface layer 11 is tightly bonded and fixedly connected to the zirconium oxide composite protective coating 12.

[0041] Modified polytetrafluoroethylene (PTFE) material itself possesses excellent hydrophobicity, antifouling, and weather resistance. Combined with the micro-hydrophobic pits on the upper surface, it can further enhance the surface hydrophobic effect, effectively blocking the adhesion and penetration of external water vapor and liquid impurities, acting as the first line of defense. At the same time, its lower surface is closely bonded to the zirconium oxide composite protective coating 12, which can provide a flat and stable support base for the lower coating, preventing micro-cracks in the coating due to uneven substrate, and also protect the lower coating from external environmental erosion through its own weather resistance, extending the service life of the coating.

[0042] The zirconia composite protective coating 12 has a dense, non-porous structure. The upper surface of the zirconia composite protective coating 12 is tightly bonded and fixedly connected to the lower surface of the hydrophobic protective surface layer 11. The lower surface of the zirconia composite protective coating 12 is tightly bonded and fixedly connected to the zirconium-modified pure aluminum anti-cracking surface layer 13.

[0043] By setting a dense, non-porous zirconia composite protective coating 12, the dense, non-porous structure gives the coating excellent high-temperature resistance, corrosion resistance, and hard scratch resistance. It can serve as a second protective barrier, effectively blocking high-temperature and corrosive media from penetrating into the interior of the board, while resisting scratches from external hard objects and protecting the lower anti-crack structure from damage. Its upper and lower surfaces are closely bonded to the hydrophobic protective surface layer 11 and the zirconia-modified pure aluminum anti-crack surface layer 13, respectively. It not only inherits the protective effect of the upper hydrophobic protective layer and performs secondary interception of harmful substances that are not completely blocked, but also provides a high-temperature resistant and smooth interface for the lower anti-crack surface layer, reducing the risk of cracking caused by high-temperature deformation of the substrate.

[0044] Zirconium-modified pure aluminum anti-crack surface layer 13, the upper surface of which is provided with an array of parallel fine lines, and the lower surface of which is fixedly connected to the zirconium-modified pure aluminum anti-crack main body layer 14.

[0045] The zirconium-modified pure aluminum anti-crack surface layer 13 effectively improves the crack resistance and high-temperature stability of pure aluminum, solving the defects of traditional pure aluminum such as easy cracking and poor high-temperature resistance. The array of parallel fine lines on the upper surface of the zirconium-modified pure aluminum anti-crack surface layer 13 can effectively disperse the local surface stress generated by the plate during thermal expansion and contraction, avoiding stress concentration that leads to brittle cracking of the surface layer. At the same time, the fine lines can increase the contact area with the upper zirconium oxide coating, further improving the interlayer bonding force and preventing interlayer delamination. Its lower surface is fixedly connected to the zirconium-modified pure aluminum anti-crack main layer 14, improving subsequent stress transmission and crack prevention function.

[0046] The zirconium-modified pure aluminum crack-resistant main layer 14 and the zirconium-modified pure aluminum crack-resistant surface layer 13 are made of the same material. The upper surface of the zirconium-modified pure aluminum crack-resistant main layer 14 is fixedly connected to the zirconium-modified pure aluminum crack-resistant surface layer 13, and the lower surface of the zirconium-modified pure aluminum crack-resistant main layer 14 is tightly bonded and fixedly connected to the boron fiber enriched transition layer 15 to enhance the crack resistance of the plate surface.

[0047] The zirconium-modified pure aluminum anti-crack main layer 14 and the zirconium-modified pure aluminum anti-crack surface layer 13 are designed with the same material, which can avoid interlayer stress caused by the connection of different materials. It is convenient to uniformly transmit the stress dispersed by the fine lines on the surface to the main layer and release it to the whole layer, significantly enhancing the overall crack resistance of the plate from the surface to the middle layer. It is suitable for complex working conditions with alternating hot and cold temperatures. At the same time, its lower surface is closely bonded to the boron fiber enriched transition layer 15. By utilizing the ductility of its own aluminum base material, it buffers the performance difference between the anti-crack layer and the hard boron fiber layer, reducing the risk of interlayer cracking and peeling.

[0048] The boron fiber enriched transition layer 15 has its upper surface tightly bonded and fixedly connected to the zirconium-modified pure aluminum anti-cracking main body layer 14, and its lower surface tightly bonded and fixedly connected to the high temperature transition layer 16.

[0049] Boron fiber possesses high modulus and high tensile strength. The boron fiber enrichment structure can effectively compensate for the lack of rigidity in aluminum-based materials, significantly enhance the interlayer bonding strength and the overall flexural strength of the plate, and improve the high-temperature resistance of the boron fiber enrichment transition layer 15, making it suitable for the high-temperature working conditions of the middle layer. As a transition between the zirconium-modified pure aluminum anti-cracking main layer 14 and the high-temperature transition layer 16, this layer can buffer the influence of the pure aluminum ductile material and the high-temperature rigid material, reduce interlayer thermal stress, provide stable rigid support for the zirconium-modified pure aluminum anti-cracking main layer 14, and provide a flat and firm connecting base for the high-temperature transition layer 16, ensuring the stability of the middle layer structure.

[0050] The upper surface of the high-temperature transition layer 16 is tightly bonded and fixedly connected to the boron fiber enriched transition layer 15, and the lower surface of the high-temperature transition layer 16 is tightly bonded and fixedly connected to the heat-resistant adhesive layer 17.

[0051] The high-temperature transition layer 16 achieves a gradient transition in high-temperature resistance and thermal stress, effectively alleviating the high-temperature temperature difference stress between the zirconium-modified pure aluminum anti-cracking main layer 14 and the high-temperature transition layer 16, and preventing the overall structure of the plate from deforming and cracking due to excessive thermal gradient. Its combined effect with the boron fiber enriched transition layer 15 can further improve the high-temperature resistance of the transition area and prevent the boron fiber enriched transition layer 15 from structural instability at high temperatures.

[0052] A heat-resistant adhesive layer 17 is coated between the high-temperature transition layer 16 and the titanium alloy enriched buffer layer 18 to connect the high-temperature transition layer 16 and the titanium alloy enriched buffer layer 18 to increase strength.

[0053] The heat-resistant adhesive layer 17 can effectively solve the bonding problem between the high-temperature transition layer 16 and the titanium alloy enriched buffer layer 18 due to their tough materials, and can significantly improve the interlayer connection strength, preventing separation and peeling between layers under high-temperature conditions.

[0054] The titanium alloy enriched buffer layer 18 has a titanium alloy mesh structure on its surface. The upper surface of the titanium alloy enriched buffer layer 18 is tightly bonded and fixedly connected to the heat-resistant adhesive layer 17, and the lower surface of the titanium alloy enriched buffer layer 18 is tightly bonded and fixedly connected to the low-temperature buffer layer 19.

[0055] The titanium alloy enriched buffer layer 18 itself has excellent high toughness, impact resistance and high and low temperature resistance. The mesh structure on the surface has both porosity and rigidity, which can effectively disperse high temperature stress and external mechanical impact stress, realize stress buffering and stress release, and also ensure its own structural strength. Its upper and lower surfaces are closely attached to the high temperature resistant adhesive layer 17 and the low temperature buffer layer 19, respectively. It not only bears the high temperature stress transmitted by the upper adhesive layer and buffers it, avoiding the direct impact of high temperature stress on the lower low temperature structure, but also provides a tough base for the lower low temperature buffer layer 19, realizes the smooth transition of high temperature stress to low temperature stress, and reduces stress concentration caused by sudden temperature changes.

[0056] The upper surface of the low-temperature buffer layer 19 is tightly bonded and fixedly connected to the titanium alloy enriched buffer layer 18, the lower surface of the low-temperature buffer layer 19 is tightly bonded to the silicon carbide particle surface layer 21, and the lower surface of the silicon carbide particle surface layer 21 is tightly bonded and fixedly connected to the heat-resistant composite main body layer 22.

[0057] The low-temperature buffer layer 19 enables a gradient transition between low-temperature resistance and stress, effectively alleviating the low-temperature shrinkage stress of the lower layer of the board and adapting to the cold-resistant working conditions of the board. At the same time, it reduces the shrinkage impact of the low-temperature environment on the upper titanium alloy buffer layer, preventing the titanium alloy mesh structure from cracking due to low-temperature shrinkage. The silicon carbide particle surface layer 21 is made of high-hardness, high-temperature resistance, and wear-resistant silicon carbide material, which can serve as a hard protective barrier for the lower layer of the board, blocking external wear and high-temperature media from damaging the bottom main layer. The particle structure can also increase the contact area with the temperature-resistant composite main layer 22, improving the interlayer bonding force. The temperature-resistant composite main layer 22 has excellent high-temperature resistance, cold resistance, and structural stability, bearing the stress of all upper structures and distributing it evenly throughout the entire area, providing stable support for all upper functional structures. At the same time, its temperature resistance complements the temperature and low-temperature resistance structures of each layer, further enhancing the overall temperature resistance of the board, and ultimately achieving a comprehensive effect of heat resistance, cold resistance, crack prevention, and protection for the board.

[0058] The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. An aluminum-based silicon carbide composite strip, comprising a hydrophobic protective surface layer (11), a zirconium oxide composite protective coating (12), a zirconium-modified pure aluminum crack-resistant surface layer (13), a zirconium-modified pure aluminum crack-resistant main body layer (14), a boron fiber enriched transition layer (15), a high-temperature transition layer (16), a heat-resistant adhesive layer (17), a titanium alloy enriched buffer layer (18), a low-temperature buffer layer (19), a silicon carbide particle surface layer (21), and a heat-resistant composite main body layer (22), characterized in that: The hydrophobic protective surface layer (11) to the heat-resistant composite main body layer (22) are arranged sequentially from top to bottom, with the hydrophobic protective surface layer (11) being the uppermost layer and the heat-resistant composite main body layer (22) being the lowermost layer. The structures are tightly bonded together, which can be used to achieve heat resistance, cold resistance, crack prevention and protection of the board.

2. The aluminum-based silicon carbide composite strip as described in claim 1, characterized in that, The hydrophobic protective surface layer (11) is made of modified polytetrafluoroethylene. The upper surface of the hydrophobic protective surface layer (11) is provided with a group of tiny hydrophobic dimples. The lower surface of the hydrophobic protective surface layer (11) is tightly bonded and fixedly connected to the zirconium oxide composite protective coating (12).

3. The aluminum-based silicon carbide composite plate and strip as described in claim 1, characterized in that, The zirconia composite protective coating (12) has a dense, non-porous structure. The upper surface of the zirconia composite protective coating (12) is tightly bonded and fixedly connected to the lower surface of the hydrophobic protective surface layer (11). The lower surface of the zirconia composite protective coating (12) is tightly bonded and fixedly connected to the zirconium-modified pure aluminum anti-crack surface layer (13).

4. The aluminum-based silicon carbide composite plate and strip as described in claim 1, characterized in that, The upper surface of the zirconium-modified pure aluminum anti-crack surface layer (13) is provided with an array of parallel fine lines, and the lower surface of the zirconium-modified pure aluminum anti-crack surface layer (13) is fixedly connected to the zirconium-modified pure aluminum anti-crack main body layer (14).

5. The aluminum-based silicon carbide composite plate and strip as described in claim 1, characterized in that, The zirconium-modified pure aluminum crack-resistant main layer (14) is made of the same material as the zirconium-modified pure aluminum crack-resistant surface layer (13). The upper surface of the zirconium-modified pure aluminum crack-resistant main layer (14) is fixedly connected to the zirconium-modified pure aluminum crack-resistant surface layer (13), and the lower surface of the zirconium-modified pure aluminum crack-resistant main layer (14) is tightly bonded and fixedly connected to the boron fiber enriched transition layer (15) to enhance the crack resistance of the plate surface.

6. The aluminum-based silicon carbide composite strip as described in claim 1, characterized in that, The upper surface of the boron fiber enriched transition layer (15) is tightly bonded and fixedly connected to the zirconium-modified pure aluminum anti-cracking main body layer (14), and the lower surface of the boron fiber enriched transition layer (15) is tightly bonded and fixedly connected to the high temperature transition layer (16).

7. The aluminum-based silicon carbide composite strip as described in claim 1, characterized in that, The upper surface of the high-temperature transition layer (16) is tightly bonded and fixedly connected to the boron fiber enriched transition layer (15), and the lower surface of the high-temperature transition layer (16) is tightly bonded and fixedly connected to the heat-resistant adhesive layer (17).

8. The aluminum-based silicon carbide composite strip as described in claim 1, characterized in that, The heat-resistant adhesive layer (17) is coated between the high-temperature transition layer (16) and the titanium alloy enriched buffer layer (18) to connect the high-temperature transition layer (16) and the titanium alloy enriched buffer layer (18) to increase strength.

9. The aluminum-based silicon carbide composite plate and strip as described in claim 1, characterized in that, The titanium alloy enriched buffer layer (18) has a titanium alloy mesh structure on its surface. The upper surface of the titanium alloy enriched buffer layer (18) is tightly bonded and fixedly connected to the heat-resistant adhesive layer (17). The lower surface of the titanium alloy enriched buffer layer (18) is tightly bonded and fixedly connected to the low-temperature buffer layer (19).

10. An aluminum-based silicon carbide composite plate and strip as described in any one of claims 1-9, characterized in that, The upper surface of the low-temperature buffer layer (19) is tightly bonded and fixedly connected to the titanium alloy enriched buffer layer (18), the lower surface of the low-temperature buffer layer (19) is tightly bonded to the silicon carbide particle surface layer (21), and the lower surface of the silicon carbide particle surface layer (21) is tightly bonded and fixedly connected to the heat-resistant composite main body layer (22).

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