Temperature control method and device, electronic device, and storage medium

Abstract

This disclosure relates to a temperature control method, apparatus, electronic device, and storage medium. The method includes: performing frame interpolation on an image displayed by a target application; obtaining the current power consumption and current temperature of a target component; calculating a predicted temperature of the target component after a preset time period based on the current temperature and current power consumption; and adjusting application parameters of the target application to reduce the power consumption of the target component when the predicted temperature is detected to have reached a temperature threshold.

Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and more particularly to a temperature control method and apparatus, electronic devices, and storage media. Background Technology

[0002] When a device runs an application, it places a load on its hardware. The higher the load, the higher the power consumption and the more heat generated. To prevent overheating from affecting device operation, it's necessary to control the device's operation.

[0003] In related technologies, the temperature of the equipment hardware is usually monitored, and the operating status of the equipment is adjusted when the temperature reaches a certain threshold in order to prevent the equipment from entering a high-temperature operating state and affecting the hardware performance. Summary of the Invention

[0004] This disclosure provides a temperature control method, apparatus, electronic device, and storage medium that can adjust the application parameters of the application program in advance to prevent the device from quickly entering a high-temperature operating state.

[0005] According to a first aspect of this disclosure, a temperature control method is provided, comprising:

[0006] Perform frame interpolation on the image displayed by the target application;

[0007] Obtain the current power consumption and current temperature of the target component;

[0008] Calculate the predicted temperature of the target component after a preset time based on the current temperature and the current power consumption;

[0009] Upon detecting that the predicted temperature has reached a temperature threshold, the application parameters of the target application are adjusted to reduce the power consumption of the target component. According to a second aspect of this disclosure, a temperature control device is provided, comprising:

[0010] The processing unit performs frame interpolation processing on the image displayed by the target application;

[0011] The acquisition unit acquires the current power consumption and current temperature of the target component;

[0012] The prediction unit calculates the predicted temperature of the target component after a preset time period based on the current temperature and the current power consumption;

[0013] The adjustment unit adjusts the application parameters of the target application to reduce the power consumption of the target component when it detects that the predicted temperature has reached a temperature threshold.

[0014] According to a third aspect of this disclosure, an electronic device is provided, comprising:

[0015] processor;

[0016] Memory used to store processor-executable instructions;

[0017] The processor implements the method as described in the first aspect by running the executable instructions.

[0018] According to a fourth aspect of this disclosure, a computer-readable storage medium is provided that stores computer instructions thereon, which, when executed by a processor, implement the steps of the method as described in the first aspect.

[0019] In the technical solution disclosed herein, when performing frame interpolation processing on the image displayed by the target application, the current temperature and current power consumption of the target component are obtained, and the predicted temperature of the target component after a preset time is calculated based on the current temperature and current power consumption. If the predicted temperature reaches a temperature threshold, the application parameters of the target application can be adjusted to reduce the power consumption of the target component.

[0020] It should be understood that this disclosure is equivalent to predicting the temperature of the target component at a future point in time based on its current temperature and power consumption, and adjusting the currently running application based on that future temperature. It is readily apparent that, compared to related technologies that adjust devices based on real-time temperature data, this disclosure significantly advances the timing of parameter adjustments to reduce power consumption, enabling timely control of hardware temperature and thus preventing or delaying the hardware from entering a high-temperature operating state, maintaining high performance over a longer period. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0022] Figure 1 This is a flowchart illustrating a temperature control method in an exemplary embodiment of this disclosure;

[0023] Figure 2 This is a flowchart illustrating a temperature control method in a frame interpolation scenario, as shown in an exemplary embodiment of this disclosure;

[0024] Figure 3 This is a schematic diagram illustrating the execution process of a temperature prediction model according to an exemplary embodiment of this disclosure;

[0025] Figure 4 This is a flowchart illustrating an application parameter adjustment process according to an exemplary embodiment of this disclosure;

[0026] Figure 5This is a block diagram illustrating a temperature control device according to an exemplary embodiment of the present disclosure;

[0027] Figure 6 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0029] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The singular forms “a,” “the,” and “the” as used in this disclosure and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0030] It should be understood that although the terms first, second, third, etc., may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are used only to distinguish information of the same type from one another. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."

[0031] To meet daily needs, users typically install various applications on their electronic devices. The operation of these applications relies on various hardware components, such as the CPU (Central Processing Unit), GPU (Graphics Processing Unit), DPU (Data Processing Unit), and memory.

[0032] Various applications exert a certain load on the hardware during operation. Generally, the higher the hardware load, the higher the power consumption and the more heat generated. Therefore, as the hardware load increases and the running time lengthens, the hardware temperature will rise accordingly. Hardware operating at high temperatures not only affects performance, causing some application functions to fail, but also shortens the hardware's lifespan and may even burn out. Therefore, how to control the temperature of hardware has always been a research topic for engineers.

[0033] In related technologies, to avoid hardware operating at high temperatures for extended periods, the hardware temperature is typically monitored in real time, and device parameters are adjusted when a specific temperature is reached. However, in practical applications, it has been found that while this method avoids prolonged high temperatures to some extent, it still exhibits a certain degree of lag, especially under high-load scenarios. When temperature control begins, the hardware temperature may already be approaching its performance limit. In such cases, despite temperature control, the application may fail to maintain optimal performance within a very short time due to the reduced hardware performance, resulting in a poor user experience.

[0034] For example, when frame interpolation is enabled in a video playback program, if the interpolation is implemented through the DPU, the DPU will be under extremely high load due to the large amount of processing resources required, causing its temperature to rise rapidly. Once a certain temperature is reached, the relevant technology will start adjusting device parameters, such as reducing image resolution, to reduce DPU power consumption. However, since the frame interpolation function is still enabled, the DPU temperature will continue to rise, reaching its temperature limit in a short time. At this point, due to the reduced DPU performance, it will be unable to support the maintenance of the frame interpolation function, and the interpolation function will be disabled, affecting the user's viewing experience.

[0035] It is evident that when performing frame interpolation on images in applications, the relevant technologies suffer from problems such as untimely parameter adjustments, leading to a rapid temperature rise and making it impossible to perform frame interpolation for extended periods.

[0036] In view of this, this disclosure proposes a temperature control method to avoid the problem that related technologies cannot control the hardware temperature in a timely manner, resulting in the frame interpolation function being unable to maintain a high temperature state for a long time.

[0037] Figure 1 This embodiment of the present disclosure illustrates a temperature control method. For example... Figure 1 As shown, the method may include the following steps:

[0038] Step 102: Perform frame interpolation on the image displayed by the target application;

[0039] It is not difficult to see that the reason why the relevant technology cannot control the hardware temperature in time and causes the hardware to enter a high temperature state is because the relevant technology determines whether to adjust the device parameters based on the real-time temperature monitoring.

[0040] In view of this, when performing frame interpolation on the image displayed by the target application, this disclosure no longer adjusts parameters based on real-time monitored temperature, but instead prioritizes obtaining the current temperature of the hardware and the current power consumption of the hardware, and calculates the predicted temperature of the hardware after a preset time based on the two. On this basis, if the predicted temperature reaches the temperature threshold, the parameters of the application are adjusted to reduce the power consumption of the target component.

[0041] In other words, this disclosure prioritizes predicting the hardware temperature at a specific future moment and determines whether to adjust the currently running application based on that future temperature. It is clear that, compared to temperature control methods in related technologies, this disclosure significantly advances the timing of temperature control, enabling timely control of the hardware temperature.

[0042] It should be understood that since the technical solution disclosed herein adjusts the parameters of the currently running application based on the temperature that may be reached in the future, it can inevitably reduce the impact of high-temperature hardware on the frame interpolation function. For example, if it is not in a high-load scenario, the temperature of the hardware may not rise after adjustment, thus avoiding the hardware entering a high-temperature state and preventing the frame interpolation function from failing due to excessive temperature. If it is in a high-load scenario, the temperature of the hardware may still rise after adjustment, but because temperature control has been implemented in advance, the moment when the hardware enters a high-temperature state can be delayed, extending the time the hardware is in a high-performance state, and thus extending the duration of the frame interpolation function.

[0043] Step 104: Obtain the current power consumption and current temperature of the target component.

[0044] In this disclosure, the target application refers to an application that is running and puts a load on specific hardware; the target component is the component used to run the target application, that is, the specific hardware that bears the load of the target application. It is worth noting that the same application can run on a single piece of hardware or can be run jointly by multiple pieces of hardware. Therefore, the target application in this disclosure can be a single application or multiple applications. Similarly, the target component can be a single component or multiple components. How to set it up can be set by those skilled in the art according to actual needs, and this disclosure does not limit it.

[0045] In this disclosure, when obtaining the temperature of a target component, if the target component is a single component, the temperature of that single component can be directly obtained; if the target component consists of multiple components, the temperatures of each component can be obtained separately, and the obtained temperatures can be integrated and calculated based on a preset algorithm to obtain the current temperature of the target component. Of course, this example is merely illustrative. How to obtain the current temperature of the target component, and what algorithm to use when there are multiple target components, can be determined by those skilled in the art based on the actual situation. For example, various algorithms such as weighted average or median can be used, and this disclosure does not limit this.

[0046] Step 106: Calculate the predicted temperature of the target component after a preset time period based on the current temperature and the current power consumption.

[0047] In this disclosure, the current power consumption of the target component can be calculated based on the application parameters of the target application. Therefore, when calculating the current power consumption of the target component, the application parameters of the target application can be obtained first. When obtaining the application parameters of the target application, the obtained application parameters can be any one or more "application parameters related to the power consumption of the target component caused by the target application during runtime," which can be determined by those skilled in the art based on the actual situation, and this disclosure does not impose any restrictions. For example, when the target application is a video application, the obtained application parameters may include: video frame rate, screen brightness, screen clarity, etc.; when the target application is a game application, the obtained application parameters may include: screen brightness, game frame rate, game type, game settings information, etc. Of course, this example is only illustrative. How to specifically calculate the power consumption of the target component can be determined by those skilled in the art based on actual needs. For example, the component parameters of the target component can also be obtained to calculate the power consumption, and this disclosure does not impose any restrictions on this.

[0048] In calculating the current power consumption of a target component based on application parameters of the target application, a mapping relationship between various parameters of the target application and the power consumption of the target component can be maintained in advance. Under this premise, after obtaining the application parameters of the target application, the power consumption corresponding to each parameter included in the obtained application parameters can be determined according to the mapping relationship. Based on this, the power consumption of each parameter included in the obtained application parameters can be accumulated to obtain the current power consumption of the target component. Of course, this example is also illustrative. How to calculate the current power consumption of the target component based on application parameters can be determined by those skilled in the art according to actual needs, and this disclosure does not impose any restrictions on it.

[0049] In this disclosure, the predicted temperature of the target component after a preset time period can be calculated based on various methods.

[0050] In one embodiment, a temperature prediction algorithm can be pre-deployed to calculate the predicted temperature. Specifically, when calculating the current power consumption of a target component based on application parameters, the acquired application parameters and the current temperature can be input into the temperature prediction algorithm to calculate the predicted temperature of the target component after a preset time. In this case, the temperature prediction algorithm may include two parts: one for calculating the current power consumption of the target component based on the application parameters, and the other for calculating the predicted temperature based on the calculated current power consumption and the acquired current temperature. Of course, this example is merely illustrative. How the temperature prediction algorithm is set up and how many parts it includes can be determined by those skilled in the art according to actual needs. For example, the algorithm can also be obtained by technicians through experiments, or it can be written by technicians based on their knowledge and experience. This disclosure does not impose any limitations on this.

[0051] In another embodiment, a temperature prediction model can be pre-deployed to calculate the predicted temperature of the target component after a preset time period. For example, when calculating the current temperature of the target component based on application parameters, the obtained current temperature and application parameters can be provided to the pre-deployed temperature prediction model, which can then output the predicted temperature of the target component after a preset time period based on the received current temperature and application parameters. Alternatively, if the current power consumption of the target component is already obtained, the current power consumption and current temperature can be used as model inputs to calculate the predicted temperature of the target component after a preset time period. In this embodiment, the temperature prediction model can be constructed in various ways. For example, a technician can write a model algorithm based on knowledge and experience to create the temperature prediction model. Another example is acquiring a large amount of sample data and training a temperature prediction model that outputs the predicted temperature based on the current temperature and application parameters using machine learning methods. Of course, these examples are merely illustrative; the specific model creation method can be determined by those skilled in the art based on actual needs, and this disclosure does not impose any limitations on this.

[0052] It is worth noting that when calculating the predicted temperature using a temperature prediction model, the deployed temperature prediction model can also include multiple modules. For example, if only application parameters are available but the current power consumption is not obtained, it can include a power consumption calculation module for calculating the power consumption of the target component based on the application parameters, and it can also include a module for calculating the predicted temperature based on the calculated power consumption and the received current temperature. Of course, this example is merely illustrative, and the specific number of modules included in the temperature prediction model can be determined by those skilled in the art according to actual needs; this disclosure does not impose any limitations on this.

[0053] It should be understood that power consumption is the most critical parameter affecting component temperature changes. Therefore, calculating and predicting the temperature based on the current power consumption and current temperature is equivalent to predicting the future temperature based on the current temperature and current power consumption of the target component, which can yield a relatively accurate predicted temperature of the target component.

[0054] It should also be noted that, in addition to the current temperature and power consumption, other parameters affecting the temperature can be introduced when calculating the predicted temperature to improve the accuracy of the predicted temperature. For example, the ambient temperature, the temperature or parameters of other related components connected to or in contact with the target component can also be obtained, and this disclosure does not limit this.

[0055] In addition, when predicting temperature, the aforementioned preset duration can also be determined by those skilled in the art according to actual needs. For example, the preset duration can be tens of seconds, minutes, or even hours, and this disclosure does not limit it.

[0056] In this disclosure, the calculation of predicted temperature can be performed by different entities. For example, in one case, the current temperature and current power consumption can be uploaded to the cloud, so that the cloud can calculate the predicted temperature of the target component after a preset time period based on the received current power consumption and current temperature, and return the calculated predicted temperature. The entity executing this disclosure only needs to receive the returned predicted temperature. In another case, as described above, the current power consumption and current temperature can be input into a locally deployed temperature prediction algorithm to calculate the predicted temperature of the target component after a preset time period. It should be noted that when calculating the current temperature based on application parameters, what is uploaded to the cloud can be the current temperature and application parameters, and the cloud also needs to perform the operation of calculating the current power consumption based on the application parameters. Of course, the examples here are merely illustrative, and which entity specifically performs the calculation of predicted temperature can be determined by those skilled in the art according to actual needs; this disclosure does not limit this.

[0057] Step 108: If the predicted temperature is detected to have reached the temperature threshold, adjust the application parameters of the target application to reduce the power consumption of the target component.

[0058] In this disclosure, after obtaining the predicted temperature of the target component after a preset time, the predicted temperature can be compared with a preset temperature threshold. If the comparison result shows that the predicted temperature reaches the temperature threshold, the application parameters of the target application are adjusted to reduce the power consumption of the target component.

[0059] In this disclosure, when performing frame interpolation on an image displayed by a target application, application parameters can be adjusted around the frame interpolation process to reduce the power consumption of the target component.

[0060] In one embodiment, parameters not used for frame interpolation in the target application can be adjusted to reduce power consumption. In other words, a parameter independent of frame interpolation can be defined as a first parameter, and when the predicted temperature reaches a temperature threshold, this first parameter is adjusted to reduce the power consumption of the target component. In this embodiment, since the parameters used for frame interpolation are not adjusted, the normal operation of the frame interpolation function is guaranteed. In this scenario, if the temperature of the target component continues to rise after adjustment, the reduced power consumption will slow the temperature rise, thus extending the duration of the frame interpolation function.

[0061] In another embodiment, conventional parameters not used for frame interpolation in the target application can be adjusted first, followed by adjustments to the functional parameters used for frame interpolation, thereby reducing the effectiveness of frame interpolation. In other words, in this case, besides the first parameter independent of the frame interpolation process, the parameter used to implement or perform frame interpolation can be defined as a second parameter. Based on this, when the predicted temperature reaches a temperature threshold, the first parameter in the target application can be adjusted first, followed by adjustments to the second parameter. For example, a lower limit threshold can be set for the first parameter. Then, when the predicted temperature reaches the temperature threshold, the first parameter is adjusted first, and once the first parameter is adjusted to the lower limit threshold, the second parameter is adjusted to reduce the power consumption of the target component. It is easy to see that this embodiment is equivalent to prioritizing the adjustment of application parameters of the target application based on the frame interpolation function. On the one hand, in order to ensure the effect of the frame interpolation function as much as possible, the adjustment priority of the regular parameters that are not used to implement the frame interpolation function is set to a relatively high level, while the adjustment priority of the function parameters used to implement the frame interpolation function is set to a relatively low level. On the other hand, since the regular parameters that are not used to implement the frame interpolation function will seriously affect the operation of the target application or its presentation effect when they are too low, it is necessary to set a lower threshold for the regular parameters and use this lower threshold as the basis for changing the adjustment parameters.

[0062] In this embodiment, it is easy to understand that, compared with the adjustment methods in related technologies, this embodiment does not adopt a "one-size-fits-all" temperature control method such as directly disabling the frame interpolation function. Instead, it uses a gradual adjustment method to ensure the implementation of the frame interpolation function as much as possible, thereby improving the user's viewing experience.

[0063] Of course, the above embodiments are all illustrative. When the frame interpolation function is enabled, how to adjust the application parameters around the frame interpolation function can be determined by those skilled in the art based on the actual situation. For example, only the application parameters used to implement the frame interpolation function can be adjusted to reduce power consumption. Alternatively, the priority of the above embodiments can be changed, that is, the application parameters used to implement the frame interpolation function can be adjusted first, and the conventional parameters not used to implement the frame interpolation function can be adjusted only when the parameter is adjusted to the lower limit threshold or until the frame interpolation function is turned off. This disclosure does not limit this.

[0064] In this disclosure, when the frame interpolation function is enabled, both the functional parameters used to implement the function and the conventional parameters not used to implement the frame interpolation function can include multiple parameters, which can be determined by those skilled in the art according to actual needs. This disclosure does not impose any restrictions on this.

[0065] In this disclosure, adjusting the functional parameters used to implement the frame interpolation function may include at least one of the following: reducing the number of interpolated frames; reducing the image quality of the image frames generated based on the frame interpolation process; and switching the frame interpolation mode used in the frame interpolation process so that the load on the target component is relatively lower after the frame interpolation process is switched. For example, when reducing the number of interpolated frames, the specific parameters to be adjusted may include: the interpolation factor and the target frame rate after interpolation; when reducing the image quality of the image frames, the specific parameters to be adjusted may include: the resolution, color depth, and contrast of the interpolated image; and when switching the frame interpolation mode, since the algorithm complexity of the four frame interpolation modes—linear frame interpolation, bicubic frame interpolation, optical flow, and deep learning frame interpolation—increases sequentially, the load on the component also increases sequentially. Therefore, if the original frame interpolation mode used is optical flow, it can be switched to linear frame interpolation or bicubic frame interpolation. Of course, the examples here are only illustrative. When adjusting the functional parameters used to implement the frame interpolation function, the specific parameters to be adjusted can be determined by those skilled in the art according to actual needs, and this disclosure does not impose any restrictions on this.

[0066] In this disclosure, when adjusting conventional parameters that are not used to implement frame interpolation, the adjustment operation may include at least one of the following: reducing the brightness of the image displayed by the target application; reducing the image processing effect of the image displayed by the target application; or reducing the original frame rate of the image displayed by the target application. The aforementioned image processing effect may include various effects, such as SDR (Standard Dynamic Range) effect, HDR (High Dynamic Range) effect, contrast, sharpness, etc. Of course, the examples here are illustrative only. When adjusting conventional parameters that are not used to implement frame interpolation, the specific parameters to be adjusted can be determined by those skilled in the art based on actual needs, and this disclosure does not impose any limitations on this.

[0067] In this disclosure, multiple adjustable parameters with different priorities can also be set for the target application. Under this premise, when the predicted temperature is detected to have reached a temperature threshold, the adjusted parameters in the target application can be prioritized, and from the multiple adjustable parameters set, the adjustable parameter with the highest priority that has not yet been adjusted can be selected, and then the selected adjustable parameter can be adjusted to reduce the power consumption of the target component. In other words, this disclosure can pre-prioritize application parameters and adjust the adjustable parameters step by step when the predicted temperature reaches the temperature threshold.

[0068] In a step-by-step adjustment scenario, several pre-set adjustable parameters can include: a first-priority image processing effect, a second-priority image brightness, and a third-priority frame interpolation factor. The first priority is higher than the second, and the second is higher than the third. Based on this, when a preset temperature threshold is reached, it can be determined which of the above image processing effect, image brightness, and frame interpolation factor has been adjusted. Specifically, if it is determined that the image processing effect, image brightness, and frame interpolation factor have not been adjusted, the image processing effect is turned off; if it is determined that the image processing effect is turned off, the image brightness is reduced; if it is determined that the image processing effect is turned off and the image brightness has been reduced, the frame interpolation factor is reduced. This method achieves step-by-step parameter adjustment, avoiding the situation described above where directly disabling the frame interpolation function could lead to a poor user experience.

[0069] Of course, this example is merely illustrative. When setting priorities for application parameters, the specific adjustable parameters to be set, and how to set the priority of each adjustable parameter, can be determined by those skilled in the art based on actual needs. This disclosure does not impose any restrictions on this.

[0070] It should be noted that the first and second parameters mentioned above, or the parameters used to implement the frame interpolation function and the parameters not used to implement the frame interpolation function, are usually parameters that affect the power consumption of the target component.

[0071] In this disclosure, in order to adapt to the needs of different applications, different temperature thresholds can be set in advance for different applications. Based on this, when the target application is running and the predicted temperature of the target component after a preset time is obtained, the predicted temperature can be compared with the temperature threshold corresponding to the target application. If the predicted temperature reaches the temperature threshold, the application parameters of the target application are adjusted.

[0072] It is worth noting that when setting temperature thresholds for different applications, the thresholds can be configured for each application based on various criteria. For example, a higher temperature threshold can be set for applications with relatively higher importance. It should be understood that the higher the temperature threshold, the later the parameter adjustments to reduce power consumption are made, and the longer the application maintains high performance. In other words, this is equivalent to taking on a higher risk for applications with higher importance in exchange for the longer the application's performance can be maintained. Another example is that different temperature thresholds can be set for different applications based on their type. For instance, different temperature thresholds can be set for video applications, game applications, and camera applications. Of course, these examples are merely illustrative. How to set different temperature thresholds for different applications to determine the timing of parameter adjustments can be determined by those skilled in the art based on actual needs, and this disclosure does not impose any limitations on this.

[0073] For example, different temperature thresholds can be set for the first application and the second application. Where the first application is more important than the second application, the first temperature threshold set for the first application can be higher than the second temperature threshold set for the second application. Under this premise, if the target application is the first application, the preset temperature can be compared with the first temperature threshold; if the threshold is reached, the application parameters of the target application are adjusted. If the target application is the second application, the preset temperature can be compared with the second temperature threshold; if the threshold is reached, the application parameters of the target application are adjusted.

[0074] In this disclosure, when setting temperature thresholds for a target application, a tiered setting can be implemented, with corresponding adjustment parameters set for each level. For example, during the setting process, application parameters related to the target application can be obtained and divided into multiple gradients based on their importance. Furthermore, temperature thresholds can be set for application parameters at different gradients, with higher-importance gradients corresponding to higher temperature thresholds. Based on this, the application parameters at each gradient can be adjusted as the predicted temperature sequentially reaches the temperature thresholds corresponding to each gradient. In this case, it is equivalent to setting corresponding temperature thresholds for application parameters of different importance, prioritizing adjustments to application parameters with relatively lower importance to ensure the effectiveness of application parameters with relatively higher importance. Of course, this example is merely illustrative. When setting multi-level temperature thresholds, the application parameters corresponding to each temperature threshold can also be determined without being based on the importance of the application parameters. For example, they can be customized by technical personnel based on knowledge and experience, or the application parameters corresponding to each temperature threshold can be randomly assigned. The specific setting method can be determined by those skilled in the art based on actual needs, and this disclosure does not impose any restrictions on this.

[0075] For ease of understanding, a video application is used as an example. Suppose the application parameters involved include "frame rate, clarity, and filter". Then, three temperature thresholds A, B, and C can be set for it, and A < B < C. Since it is a video application, the sorting of the above three application parameters according to the degree of importance can be: clarity is the most important, frame rate is the second, and filter is the lowest. At this time, the corresponding relationship between the set temperature thresholds and the application parameters can be "temperature threshold A corresponds to the filter", "temperature threshold B corresponds to the frame rate", and "temperature threshold C corresponds to the clarity". On this basis, after obtaining the predicted temperature, if the predicted temperature reaches temperature threshold A, the filter parameters are adjusted. For example, the filter can be weakened or a filter with lower load can be switched to reduce power consumption; if the predicted temperature continues to rise and reaches temperature threshold B, the video frame rate is reduced; if the predicted temperature continues to rise and reaches temperature threshold C, the video clarity is reduced. Of course, only a video application is used as an example here. When the application is of other types, it is similar and will not be elaborated here. Specifically how to set and how to adjust the parameters according to the settings can be determined by those skilled in the art according to actual needs, and the present disclosure does not limit this.

[0076] It should be noted that the execution subject of the technical solution of the present disclosure can be any type of electronic device. For example, the electronic device can be a mobile terminal such as a smart phone or a tablet computer, or a fixed terminal such as a smart TV or a PC (personal computer, Personal Computer). It should be understood that as long as an electronic device equipped with various hardware for running application programs can be used as the electronic device in the present disclosure. Specifically, which type of electronic device is used as the execution subject of the technical solution of the present disclosure can be determined by those skilled in the art according to actual needs, and the present disclosure does not limit this.

[0077] It should also be noted that the target component in the present disclosure can be only an internal component included in the electronic device as the execution subject, such as a CPU or a memory, or only an external component plugged into the electronic device as the execution subject, such as an external graphics card or an external DPU chip. It can also include both the internal components of the electronic device and the plugged external components. The present disclosure does not limit this. It should be noted that regardless of whether the relationship between the target component and the electronic device is external or included, as long as the target component includes multiple components, when obtaining the current temperature of the target component, the temperatures of each component need to be obtained, and the obtained temperatures of each component are integrated and calculated based on a preset algorithm to use the calculated integrated temperature as the current temperature of the target component. It should be stated that algorithms such as weighted average and median can be used for the integrated calculation. Specifically which algorithm to use can be determined by those skilled in the art according to the actual situation, and the present disclosure does not limit this.

[0078] As can be seen from the above technical solution, when performing frame interpolation processing on the image displayed by the target application, this disclosure obtains the current temperature and current power consumption of the target component, and calculates the predicted temperature of the target component after a preset time based on the current temperature and current power consumption. When the predicted temperature reaches the temperature threshold, the application parameters of the target application can be adjusted to reduce the power consumption of the target component.

[0079] It should be understood that this disclosure is equivalent to predicting the temperature of the target component at a future point in time based on its current temperature and current power consumption, and adjusting the currently running application based on that future temperature. It is readily apparent that, compared to related technologies that adjust devices based on real-time temperature data, this disclosure significantly advances the timing of parameter adjustments to reduce power consumption, enabling timely control of hardware temperature. This avoids or delays the hardware from entering a high-temperature operating state, allowing for sustained high performance over a longer period.

[0080] Taking the DPU frame interpolation scenario mentioned earlier as an example, when using the temperature control method in related technologies, parameters are only adjusted to reduce the load on the DPU when the temperature reaches a threshold. At the start of this adjustment, the temperature is very likely already close to the upper temperature limit that would automatically disable the frame interpolation function. Therefore, even if parameter adjustments are made, the frame interpolation function will be shut down very quickly because the temperature will rapidly reach this upper limit, thus affecting the user's visual experience. However, the technical solution disclosed in this paper compares the predicted temperature with the temperature threshold, allowing application parameters to be adjusted to reduce power consumption before the temperature reaches the threshold. In this case, even if the parameter adjustment method is the same, the earlier adjustment timing significantly extends the duration of the frame interpolation function, thereby ensuring the user's visual experience.

[0081] The following section will use "implementing frame interpolation through an external DPU chip" as an example to introduce the technical solution disclosed herein.

[0082] Figure 2 This is a flowchart illustrating a temperature control method in a frame interpolation scenario, as shown in an exemplary embodiment of this disclosure. Figure 2 As shown, the method may include the following steps:

[0083] Step 201: Obtain temperature threshold information for various applications stored in the cloud.

[0084] In this embodiment, technicians can set different temperature thresholds for different applications based on their characteristics for temperature control. For example, different temperature thresholds can be set for video applications, game applications, and camera applications to form a temperature threshold information table. Based on this, the terminal can obtain the temperature threshold information table from the cloud and determine the temperature threshold used for temperature control of any application based on its category when running any application.

[0085] Step 202: Determine the target application currently running.

[0086] For example, suppose a user launches a video player application X on their smartphone. Then, the video player application X can be used as the currently running target application. Since the video player application X is a video application, the temperature threshold M corresponding to the video application can be determined from the temperature threshold information table and used as the target temperature threshold for the video player application X.

[0087] Step 203: Determine the target temperature threshold corresponding to the target application from the temperature threshold information.

[0088] Step 204: Obtain the current temperature of the DPU chip.

[0089] In this embodiment, after determining the target temperature threshold for temperature control, temperature prediction can be performed. This requires obtaining both the current temperature of the DPU chip and the application parameters of the target application to calculate the power consumption of the DPU chip during program execution.

[0090] Step 205: Read the application parameters of the target application.

[0091] Following the example above, after obtaining the temperature of the DPU chip, the application parameters of the video playback program X can be obtained. For example, the video source frame rate, interpolation factor, screen brightness, and the effect parameters implemented by the DPU chip can be obtained. The effects implemented by the DPU chip may include filter intensity, HDR intensity, etc., but this embodiment does not limit these.

[0092] Step 205: Input the current temperature and application parameters into the temperature prediction model to obtain the predicted temperature.

[0093] Continuing with the example above, if the temperature is to be predicted in one minute, the temperature prediction model can perform temperature predictions based on the various parameters in the following order: Figure 3 As shown.

[0094] Step 206: Determine whether the predicted temperature has reached the target temperature threshold; if yes, proceed to step 207; if no, proceed to step 204.

[0095] In this embodiment, after obtaining the predicted temperature through the temperature prediction model, the predicted temperature can be compared with the target temperature threshold. If the predicted temperature reaches the target temperature threshold, the application parameters are adjusted to reduce DPU power consumption. Otherwise, the target application is still run based on the current parameters, and the future temperature is predicted again through the temperature prediction model.

[0096] Step 207: Adjust the application parameters to reduce power consumption.

[0097] Continuing with the example above, when the predicted temperature reaches the target temperature threshold, it means that if the parameters are not adjusted, the DPU chip's temperature will reach the target temperature threshold after one minute, thus affecting the frame interpolation effect. Therefore, when the predicted temperature reaches the target temperature threshold, the application parameters of the video playback program X can be adjusted to reduce power consumption.

[0098] In one scenario, if the application parameters do not have a priority, any of the application parameters in the examples above can be adjusted to reduce the power consumption of the DPU chip.

[0099] In another scenario, the priority of various application parameters can be set based on their impact on user experience. For example, they can be prioritized according to... Figure 4 Adjust the steps shown.

[0100] Figure 4 This is a flowchart illustrating an application parameter adjustment process as an exemplary embodiment of the present disclosure. Figure 4 As shown, the process may include the following steps:

[0101] Step 401: Adjust the DPU's effect parameters to achieve specific visual effects.

[0102] Continuing with the example above, if the predicted temperature reaches the target temperature threshold, the additional effects implemented based on the DPU chip can be adjusted first. If the HDR effect is only implemented through the DPU chip, the HDR intensity can be reduced or the HDR effect can be turned off to reduce power consumption.

[0103] Step 402: Input the adjusted application parameters into the temperature prediction model to obtain the predicted temperature.

[0104] Following the examples above, after reducing the HDR intensity or turning off the HDR effect, the adjusted application parameters can be input into the temperature prediction model. For instance, with the HDR effect turned off, the video source frame rate, interpolation factor, and screen brightness mentioned earlier can be input into the temperature prediction model for temperature prediction.

[0105] Step 403: Determine whether the predicted temperature has reached the target temperature threshold; if yes, proceed to step 404; otherwise, maintain the current application parameters for temperature monitoring.

[0106] Following the example above, if the predicted temperature output by the temperature prediction model still reaches the target temperature threshold after adjusting the effect parameters, it proves that the power consumption reduction achieved by adjusting the effect parameters is insufficient to make the DPU chip's temperature drop below the target temperature threshold after 1 minute. Therefore, further adjustments to other parameters are needed.

[0107] Conversely, if the predicted temperature does not reach the target temperature threshold after adjusting the effect parameters, it proves that the adjustment of the effect parameters is sufficient to make the DPU chip's temperature fall below the target temperature threshold after 1 minute, and temperature monitoring can continue while maintaining the current parameters. In other words, with HDR effects turned off, temperature monitoring can continue according to the current video source frame rate, interpolation factor, and screen brightness.

[0108] Step 404: Reduce screen brightness and input the adjusted application parameters into the temperature prediction model.

[0109] Continuing with the example above, after disabling HDR, the screen brightness can be further reduced. The application parameters after disabling HDR and reducing screen brightness can then be input into the temperature prediction model for further temperature prediction. For instance, the reduced screen brightness, the video source frame rate (as mentioned earlier), and the interpolation factor can be input into the temperature prediction model for further temperature prediction.

[0110] Step 405: Determine whether the predicted temperature has reached the target temperature threshold; if yes, proceed to step 406; otherwise, maintain the current application parameters for temperature monitoring.

[0111] Following the example above, if the predicted temperature output by the temperature prediction model still reaches the target temperature threshold after adjusting the effect parameters and reducing the screen brightness, it proves that the power consumption reduction achieved by adjusting the effect parameters and reducing the screen brightness is still insufficient to make the DPU chip's temperature drop below the target temperature threshold after 1 minute. Therefore, further adjustments to other parameters are needed.

[0112] Conversely, if the predicted temperature does not reach the target temperature threshold after adjusting the effect parameters and reducing the screen brightness, it proves that the two adjustments were sufficient to make the DPU chip's temperature fall below the target temperature threshold after one minute. In this case, temperature monitoring can continue while maintaining the current parameters. In other words, with HDR effects disabled, temperature monitoring can continue based on the current video source frame rate, interpolation factor, and reduced screen brightness.

[0113] Step 406: Adjust the frame interpolation factor.

[0114] Following the example above, if the predicted temperature output by the temperature prediction model still reaches the target temperature threshold, other parameters that can be further adjusted can be the frame interpolation factor of the frame interpolation function.

[0115] It's worth noting that since frame interpolation is the core function implemented by the DPU chip, reducing the interpolation factor can be used as a last resort to reduce power consumption. In this case, after reducing the interpolation factor, regardless of whether the predicted temperature will reach the target temperature threshold, the application parameters will no longer be adjusted. At this point, simply continue running the video playback program X according to the current application parameters until its performance automatically shuts down the frame interpolation function due to overheating.

[0116] Of course, this example only uses "frame interpolation as the highest priority effect to be guaranteed". It should be emphasized that if other dimensions of the effect need to be guaranteed, "adjusting the frame interpolation parameters" can be left as a last resort. This embodiment does not impose any restrictions on this.

[0117] As can be seen from the above technical solution, when implementing the frame interpolation function through an external DPU chip, this disclosure can determine whether the application parameters need to be adjusted based on the potential temperature of the DPU chip to reduce the power consumption of the DPU chip. In other words, the basis for adjusting parameters to reduce power consumption in this embodiment is the predicted temperature. Based on this, this embodiment can begin adjusting parameters to reduce the power consumption of the DPU chip before the temperature reaches the temperature threshold, thus delaying the moment when the DPU chip reaches its temperature limit and affects performance, and extending the duration of the frame interpolation function.

[0118] Figure 5 This is a block diagram illustrating a temperature control device according to an exemplary embodiment of this disclosure. (Refer to...) Figure 5 The device includes a processing unit 501, an acquisition unit 502, a prediction unit 503, and an adjustment unit 504.

[0119] Processing unit 501 performs frame interpolation processing on the image displayed by the target application;

[0120] The acquisition unit 502 acquires the current power consumption and current temperature of the target component;

[0121] Prediction unit 503 calculates the predicted temperature of the target component after a preset time based on the current temperature and the current power consumption;

[0122] The adjustment unit 504 adjusts the application parameters of the target application to reduce the power consumption of the target component when it detects that the predicted temperature has reached the temperature threshold.

[0123] Optionally, the adjustment unit 504 is further used for:

[0124] The first parameter in the target application is adjusted; the first parameter is independent of the frame interpolation process; or...

[0125] After adjusting the first parameter in the target application, the second parameter is adjusted, and the frame interpolation process is performed based on the second parameter.

[0126] Optionally, the adjustment unit 504 is further used for:

[0127] Reduce the number of frames interpolated in the interpolation process; and / or,

[0128] Reduce the image quality of the image frames generated based on the frame interpolation process; and / or,

[0129] The frame interpolation mode used in the frame interpolation process is switched so that the load on the target component is relatively lower after the frame interpolation process is switched.

[0130] Optionally, the adjustment unit 504 is further used for:

[0131] Reduce the brightness of the image displayed by the target application; and / or,

[0132] Reduce the image processing effect of the image displayed by the target application; the image processing effect includes at least one of the following: SDR effect, HDR effect, contrast, sharpness; and / or,

[0133] Reduce the original frame rate of the image displayed by the target application.

[0134] Optionally, the target application includes multiple adjustable parameters with inconsistent priorities; the adjustment unit 504 is further used to:

[0135] If the predicted temperature is detected to have reached the temperature threshold, the adjusted parameters in the target application are determined, and the adjustable parameter with the highest priority is selected from the adjustable parameters that have not yet been adjusted from the plurality of adjustable parameters.

[0136] The selected adjustable parameters are adjusted to reduce the power consumption of the target component.

[0137] Optionally, the plurality of adjustable parameters include: a first priority image processing effect, a second priority image brightness, and a third priority frame interpolation factor; the first priority is higher than the second priority, and the second priority is higher than the third priority; the adjustment unit 504 is further used for:

[0138] If it is determined that the image processing effect, the image brightness, and the frame interpolation factor have not been adjusted, then turn off the image processing effect.

[0139] If it is determined that the image processing effect has been turned off, reduce the image brightness;

[0140] If it is determined that the image processing effect has been turned off and the image brightness has been reduced, the frame interpolation factor is reduced.

[0141] Optionally, different temperature thresholds are set for the first application and the second application; wherein, the first application is of higher importance than the second application, and the first temperature threshold set for the first application is higher than the second temperature threshold set for the second application; the adjustment unit 504 is further used to:

[0142] If the target application is the first application, and the predicted temperature reaches the first temperature threshold, adjust the application parameters of the target application.

[0143] If the target application is the second application, and the predicted temperature reaches the second temperature threshold, the application parameters of the target application are adjusted.

[0144] Optionally, prediction unit 503 is further used for:

[0145] The acquired current temperature and current power consumption are uploaded to the cloud, so that the cloud can calculate the predicted temperature of the target component after a preset time period based on the current power consumption and current temperature; and the predicted temperature is received from the cloud; or...

[0146] The current power consumption and the current temperature are input into a locally deployed temperature prediction algorithm to calculate the predicted temperature of the target component after a preset time.

[0147] Optionally, prediction unit 503 is further used for:

[0148] The application parameters of the target application are obtained, and the power consumption corresponding to each parameter in the obtained application parameters is determined according to the mapping relationship between the parameters of the target application and the power consumption of the target component.

[0149] The power consumption of each parameter included in the accumulated application parameters is used to obtain the current power consumption of the target component.

[0150] Optional,

[0151] The target component is an internal component contained in an electronic device; or,

[0152] The target component is an external component plugged into the electronic device; or...

[0153] The target component includes: the internal components and the external components of the electronic device;

[0154] Wherein, when the target component comprises multiple components, obtaining the current temperature of the target component includes: obtaining the temperature of each component, and performing an integrated calculation on the obtained temperatures based on a preset algorithm, so as to use the calculated integrated temperature as the current temperature of the target component.

[0155] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to in the description of the method embodiments. The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this disclosure according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0156] Accordingly, this disclosure also provides a temperature control device, including: a processor; a memory for storing processor-executable instructions; wherein the processor is configured to implement a temperature control method as described in any of the above embodiments, for example, the method may include: performing frame interpolation processing on an image displayed by a target application; obtaining the current power consumption and current temperature of a target component; calculating a predicted temperature of the target component after a preset time based on the current temperature and the current power consumption; and adjusting the application parameters of the target application to reduce the power consumption of the target component when the predicted temperature is detected to reach a temperature threshold.

[0157] Accordingly, this disclosure also provides an electronic device, which includes a memory and one or more programs, wherein one or more programs are stored in the memory and configured to be executed by one or more processors. The one or more programs include instructions for implementing the temperature control method as described in any of the above embodiments. For example, the method may include: performing frame interpolation processing on an image displayed by a target application; obtaining the current power consumption and current temperature of a target component; calculating the predicted temperature of the target component after a preset time based on the current temperature and the current power consumption; and adjusting the application parameters of the target application to reduce the power consumption of the target component when the predicted temperature is detected to reach a temperature threshold.

[0158] Figure 6This is a block diagram illustrating an apparatus 600 for implementing a temperature control method according to an exemplary embodiment. For example, apparatus 600 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0159] Reference Figure 6 The device 600 may include one or more of the following components: a processing component 602, a memory 604, a power supply component 606, a multimedia component 608, an audio component 610, an input / output (I / O) interface 612, a sensor component 614, and a communication component 616.

[0160] Processing component 602 typically controls the overall operation of device 600, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 602 may include one or more modules to facilitate interaction between processing component 602 and other components. For example, processing component 602 may include a multimedia module to facilitate interaction between multimedia component 608 and processing component 602.

[0161] Memory 604 is configured to store various types of data to support the operation of device 600. Examples of such data include instructions for any application or method operating on device 600, contact data, phonebook data, messages, pictures, videos, etc. Memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0162] Power supply component 606 provides power to the various components of device 600. Power supply component 606 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to device 600.

[0163] Multimedia component 608 includes a screen that provides an output interface between the device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 608 includes a front-facing camera and / or a rear-facing camera. When the device 600 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0164] Audio component 610 is configured to output and / or input audio signals. For example, audio component 610 includes a microphone (MIC) configured to receive external audio signals when device 600 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 604 or transmitted via communication component 616. In some embodiments, audio component 610 also includes a speaker for outputting audio signals.

[0165] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0166] Sensor assembly 614 includes one or more sensors for providing status assessments of various aspects of device 600. For example, sensor assembly 614 may detect the on / off state of device 600, the relative positioning of components such as the display and keypad of device 600, changes in the position of device 600 or a component of device 600, the presence or absence of user contact with device 600, the orientation or acceleration / deceleration of device 600, and temperature changes of device 600. Sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 614 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 614 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0167] Communication component 616 is configured to facilitate wired or wireless communication between device 600 and other devices. Device 600 can access wireless networks based on communication standards, such as WiFi, 2G or 3G, 4G LTE, 5G NR (New Radio), or combinations thereof. In one exemplary embodiment, communication component 616 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 616 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0168] In an exemplary embodiment, the apparatus 600 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0169] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 604 including instructions, which can be executed by a processor 620 of the device 600 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0170] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0171] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

[0172] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A temperature control method, characterized in that, include: Perform frame interpolation on the image displayed by the target application; Obtain the current power consumption and current temperature of the target component; Calculate the predicted temperature of the target component after a preset time based on the current temperature and the current power consumption; If the predicted temperature is detected to have reached a temperature threshold, the application parameters of the target application are adjusted to reduce the power consumption of the target component.

2. The method according to claim 1, characterized in that, The adjustment of the application parameters of the target application includes: The first parameter in the target application is adjusted; the first parameter is independent of the frame interpolation process; or... After adjusting the first parameter in the target application, the second parameter is adjusted, and the frame interpolation process is performed based on the second parameter.

3. The method according to claim 2, characterized in that, The adjustment of the second parameter includes: Reduce the number of frames interpolated in the interpolation process; and / or, Reduce the image quality of the image frames generated based on the frame interpolation process; and / or, The frame interpolation mode used in the frame interpolation process is switched so that the load on the target component is relatively lower after the frame interpolation process is switched.

4. The method according to claim 2, characterized in that, The adjustment of the first parameter in the target application includes: Reduce the brightness of the image displayed by the target application; and / or, Reduce the image processing effect of the image displayed by the target application; the image processing effect includes at least one of the following: SDR effect, HDR effect, contrast, sharpness; and / or, Reduce the original frame rate of the image displayed by the target application.

5. The method according to claim 1, characterized in that, The target application includes multiple adjustable parameters with inconsistent priorities; adjusting the application parameters of the target application when the predicted temperature is detected to have reached a temperature threshold includes: If the predicted temperature is detected to have reached the temperature threshold, the adjusted parameters in the target application are determined, and the adjustable parameter with the highest priority is selected from the adjustable parameters that have not yet been adjusted from the plurality of adjustable parameters. The selected adjustable parameters are adjusted to reduce the power consumption of the target component.

6. The method according to claim 5, characterized in that, The plurality of adjustable parameters includes: a first priority image processing effect, a second priority image brightness, and a third priority frame interpolation factor; the first priority is higher than the second priority, and the second priority is higher than the third priority; determining the adjusted parameters in the target application and selecting the highest priority adjustable parameter from the plurality of adjustable parameters that have not yet been adjusted includes: If it is determined that the image processing effect, the image brightness, and the frame interpolation factor have not been adjusted, then turn off the image processing effect. If it is determined that the image processing effect has been turned off, reduce the image brightness; If it is determined that the image processing effect has been turned off and the image brightness has been reduced, the frame interpolation factor is reduced.

7. The method according to claim 1, characterized in that, Different temperature thresholds are set for the first application and the second application; the first temperature threshold set for the first application is higher than the second temperature threshold set for the second application. When the predicted temperature reaches a temperature threshold, adjusting the application parameters of the target application includes: If the target application is the first application, and the predicted temperature reaches the first temperature threshold, adjust the application parameters of the target application. If the target application is the second application, and the predicted temperature reaches the second temperature threshold, the application parameters of the target application are adjusted.

8. The method according to claim 1, characterized in that, The step of calculating the predicted temperature of the target component after a preset time period based on the current temperature and the current power consumption includes: The acquired current temperature and current power consumption are uploaded to the cloud, so that the cloud can calculate the predicted temperature of the target component after a preset time period based on the current power consumption and current temperature; and the predicted temperature is received from the cloud; or... The current power consumption and the current temperature are input into a locally deployed temperature prediction algorithm to calculate the predicted temperature of the target component after a preset time.

9. The method according to claim 1, characterized in that, Obtaining the current power consumption of the target component includes: The application parameters of the target application are obtained, and the power consumption corresponding to each parameter in the obtained application parameters is determined according to the mapping relationship between the parameters of the target application and the power consumption of the target component. The power consumption of each parameter included in the accumulated application parameters is used to obtain the current power consumption of the target component.

10. The method according to claim 1, characterized in that, The target component is an internal component contained in an electronic device; or, The target component is an external component plugged into the electronic device; or... The target component includes: the internal components and the external components of the electronic device; Wherein, when the target component comprises multiple components, obtaining the current temperature of the target component includes: obtaining the temperature of each component, and performing an integrated calculation on the obtained temperatures based on a preset algorithm, so as to use the calculated integrated temperature as the current temperature of the target component.

11. An electronic device, characterized in that, include: processor; Memory used to store processor-executable instructions; The processor implements the method as described in any one of claims 1-10 by executing the executable instructions.

12. A computer-readable storage medium storing computer instructions thereon, characterized in that, When executed by the processor, this instruction implements the steps of the method as described in any one of claims 1-10.

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