Annealing support

Abstract

The utility model relates to an annealing support which comprises a connecting frame and a plurality of supporting rods, the supporting rods are distributed around the connecting frame, supporting cushion blocks are arranged at the ends, away from the connecting frame, of the supporting rods, the connecting frame is arranged, and the supporting rods are connected through the connecting frame; the supporting rods are arranged on the placing plate, then the supporting cushion blocks are arranged on the supporting rods, when the silicon wafer needs to be subjected to annealing treatment, the silicon wafer is placed on the supporting cushion blocks to be supported, and the connecting frame is relatively high in air permeability relative to the placing plate, so that air flow passing is facilitated, and the whole silicon wafer is uniformly cooled. The method has the effect of improving the heat dissipation effect of the silicon wafer.

Description

Technical Field

[0001] The present application relates to the technical field of annealing brackets, and in particular to an annealing bracket. Background Art

[0002] In the existing silicon wafer manufacturing process, there is a process of annealing the silicon wafer. In this process, the silicon wafer needs to be placed on a placement board, and a pad is provided on the placement board. The silicon wafer is placed on the pad to dissipate heat from the silicon wafer. However, since the placement board is a whole plate, the heat dissipation space under the silicon wafer is not transparent enough, which affects the heat dissipation effect of the silicon wafer. Utility Model Content

[0003] In order to improve the heat dissipation effect of silicon wafers, the present application provides an annealing bracket.

[0004] The annealing bracket provided in this application adopts the following technical solution:

[0005] An annealing bracket comprises a connecting frame and supporting rods. A plurality of supporting rods are provided and distributed around the connecting frame. A supporting pad is provided at one end of the supporting rod away from the connecting frame.

[0006] By adopting the above technical solution, a connecting frame is provided, the support rods are connected by the connecting frame, and then support pads are provided on the support rods. When the silicon wafer needs to be annealed, the silicon wafer is placed on a number of support pads for support. The connecting frame has higher air permeability than the placing plate, which is conducive to the passage of airflow, thereby uniformly cooling the entire silicon wafer.

[0007] Optionally, a ejector pin is provided at the upper end of the supporting pad.

[0008] By adopting the above technical solution, a ejector pin is further arranged on the supporting pad, and the ejector pin contacts the silicon wafer. On the one hand, the contact area with the silicon wafer can be reduced, thereby reducing the impact on the silicon wafer. On the other hand, the silicon wafer is further raised, thereby facilitating heat dissipation from the bottom of the silicon wafer.

[0009] Optionally, an end of the support rod away from the connecting frame is provided with an upwardly curved hook section, and the support pad is provided on the curved hook section.

[0010] By adopting the above technical solution, the support rod is provided with an upward hook section, which can increase the height of the support pad and improve the heat dissipation space under the silicon wafer, thereby facilitating the heat dissipation at the bottom of the silicon wafer.

[0011] Optionally, the connecting frame is in a hollow triangular shape.

[0012] By adopting the above technical solution, the connection frame is in the shape of a hollow triangle, which has high stability, thereby reducing the possibility of deformation of the bracket. On the other hand, the connection frame is hollow, which can reduce material waste.

[0013] Optionally, a joystick is provided on one side of the connecting frame.

[0014] By adopting the above technical solution, a joystick is provided on the connecting frame, so that it is convenient for an operator to lift the entire bracket through the joystick.

[0015] Optionally, two joysticks are provided, and the two joysticks are arranged in parallel.

[0016] By adopting the above technical solution, two joysticks are provided, and the two joysticks are arranged in parallel. The operator can hold the two joysticks with two fingers to stably lift the entire bracket, thereby improving the stability of the operation.

[0017] Optionally, a cushion column is provided on the lower surface of the support rod.

[0018] By adopting the above technical solution and providing the pad column, the space height below the silicon wafer can be further increased, thereby improving the ventilation performance of the bracket and further improving the heat dissipation effect.

[0019] In summary, the utility model has the following beneficial effects:

[0020] 1. A connecting frame is provided, through which the support rods are connected, and then support pads are provided on the support rods. When the silicon wafer needs to be annealed, the silicon wafer is placed on several support pads for support, and the air permeability of the connecting frame is higher than that of the placement plate, which is conducive to the passage of airflow, thereby uniformly cooling the entire silicon wafer;

[0021] 2. The support rod is provided with an upward curved hook section, which can increase the height of the support pad and improve the heat dissipation space under the silicon wafer, thereby facilitating the heat dissipation at the bottom of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of this embodiment;

[0023] Figure 2 Schematic diagram of the structure of the support rod in this embodiment.

[0024] In the figure, 1, connecting frame; 2, supporting rod; 21, supporting pad; 22, ejector pin; 23, pad column; 3, joystick. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1-2This application is described in further detail.

[0026] The present application embodiment discloses an annealing bracket, referring to Figure 1 and Figure 2 , including a connection frame 1 and a support rod 2, wherein a plurality of support rods 2 are provided, and the plurality of support rods 2 are distributed around the edge of the connection frame 1. In this embodiment, the number of support rods 2 is three, and one end of the support rod 2 is fixedly connected to the connection frame 1. A support pad 21 is provided at one end of the support rod 2 away from the connection frame 1. A connection frame 1 is provided, and the support rod 2 is connected through the connection frame 1, and then a support pad 21 is provided on the support rod 2. When the silicon wafer needs to be annealed, the silicon wafer is placed on the plurality of support pads 21 for support, and the connection frame 1 has a higher air permeability than the placement plate, which is conducive to the passage of airflow, thereby uniformly cooling the entire silicon wafer.

[0027] Reference Figure 1 and Figure 2 A pin 22 is fixedly connected to the upper end of the support pad 21, and a pin 22 is further arranged on the support pad 21. The pin 22 contacts the silicon wafer. On the one hand, the contact area with the silicon wafer can be reduced, thereby reducing the impact on the silicon wafer. On the other hand, the silicon wafer can be further raised to facilitate heat dissipation at the bottom of the silicon wafer.

[0028] Reference Figure 1 and Figure 2 The end of the support rod 2 away from the connection frame 1 is provided with an upward hook section, and the support pad 21 is fixedly connected to the hook section. The support rod 2 is provided with an upward hook section, which can increase the height of the support pad 21 and increase the heat dissipation space under the silicon wafer, thereby facilitating the heat dissipation at the bottom of the silicon wafer.

[0029] Reference Figure 1 and Figure 2 The connecting frame 1 is in the shape of a hollow triangle. The triangle has high stability, thereby reducing the possibility of deformation of the bracket. On the other hand, the connecting frame 1 is hollow, which can reduce material waste.

[0030] Reference Figure 1 and Figure 2 A joystick 3 is fixedly connected to one side of the connecting frame 1 , and a joystick 3 is arranged on the connecting frame 1 , so that it is convenient for an operator to lift the entire bracket through the joystick 3 .

[0031] Reference Figure 1 and Figure 2There are two joysticks 3, which are arranged in parallel. There are two joysticks 3, which are arranged in parallel. The operator can hold the two joysticks 3 with two fingers to stably lift the entire bracket, thereby improving the stability of the operation.

[0032] Reference Figure 1 and Figure 2 The side of the lower surface of the support rod 2 away from the support pad 21 is fixedly connected with a pad column 23

[0033] The implementation principle of an annealing bracket in an embodiment of the present application is as follows: a connecting frame 1 is provided, a support rod 2 is connected through the connecting frame 1, and then a support pad 21 is provided on the support rod 2. When the silicon wafer needs to be annealed, the silicon wafer is placed on a number of support pads 21 for support, and the connecting frame 1 has a higher air permeability than the placing plate, which is conducive to the passage of airflow, thereby uniformly cooling the entire silicon wafer.

[0034] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An annealed stent, Features: It comprises a connecting frame (1) and a supporting rod (2), wherein a plurality of the supporting rods (2) are provided and the plurality of the supporting rods (2) are distributed around the connecting frame (1), and a supporting pad (21) is provided at one end of the supporting rod (2) away from the connecting frame (1).

2. An annealing stent according to claim 1, Features: An ejector pin (22) is provided at the upper end of the supporting cushion block (21).

3. The annealing bracket according to claim 1, Features: An end of the support rod (2) away from the connection frame (1) is provided with an upward curved hook section, and the support pad (21) is provided on the curved hook section.

4. The annealing bracket according to claim 1, Features: The connecting frame (1) is in a hollow triangular shape.

5. The annealing stent according to claim 1, Features: A joystick (3) is provided on one side of the connection frame (1).

6. An annealing stent according to claim 5, Features: Two joysticks (3) are provided, and the two joysticks (3) are arranged in parallel.

7. The annealing stent according to claim 1, Features: A cushion column (23) is provided on the lower surface of the support rod (2).

Images