Electroplating bath structure for manufacturing integrated circuit

Abstract

The utility model provides an electroplating bath structure for manufacturing an integrated circuit, which belongs to the field of manufacturing of integrated circuits and comprises a multifunctional circulating assembly capable of realizing circulating flow and mixing of electroplating liquid in an electroplating box; the multifunctional circulating assembly comprises a guide cylinder which can be detachably mounted in the electroplating box, a coaxial rotating rod which is driven to rotate is arranged in the guide cylinder, a mounting block is fixed to the upper end of the rotating rod, and a spiral blade used for circulating flow of electroplating liquid is fixed to the mounting block; a heating pipe located above the spiral blade is installed in the guide cylinder, and a filter screen located below the spiral blade is installed in the guide cylinder. The spiral blade rotates to convey electroplating liquid upwards through the guide cylinder, so that the electroplating liquid can circularly flow in the electroplating box and is uniformly mixed, impurities in the electroplating liquid can be filtered through the filter screen, and electroplating products are prevented from being influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to an electroplating tank structure for integrated circuit manufacturing. Background Art

[0002] The electroplating tank is the most basic equipment in the electroplating equipment, and its main function is to install the solution. The use of the plating tank can be arranged in a straight line according to the manual process production line, or arranged according to the on-site space according to local conditions. If it is a mechanical automatic production line, it is basically arranged according to the process flow. In the electroplating process, in order to improve the quality of electroplating, avoid concentration polarization of the solution, and prevent pinholes, pitting and other undesirable phenomena on the surface of the plated parts, the electroplating solution needs to be continuously stirred.

[0003] However, the plating solution needs to be stirred during use to ensure uniform concentration and thus the quality of electroplating. However, the current stirring and mixing components have a complex structure and it is difficult to ensure uniform mixing, such as a plating tank structure for integrated circuit manufacturing with publication number CN26736191U.

[0004] To address this, the present application proposes an electroplating tank structure for integrated circuit manufacturing. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides an electroplating tank structure for manufacturing integrated circuits.

[0006] The embodiment of the utility model provides an electroplating tank structure for integrated circuit manufacturing, comprising:

[0007] A plating box for containing plating solution;

[0008] A multifunctional circulation component capable of achieving circulating flow and mixing of electroplating liquid in an electroplating box; the multifunctional circulation component comprises a guide tube which can be detachably installed in the electroplating box, a coaxial rotating rod driven to rotate is provided in the guide tube, a mounting block is fixed to the upper end of the rotating rod, spiral blades for circulating the electroplating liquid are fixed to the mounting block, a heating tube located above the spiral blades is installed in the guide tube, and a filter screen located below the spiral blades is installed in the guide tube.

[0009] Furthermore, a motor is installed at the bottom of the electroplating box, the rotating rod passes through the electroplating box and is rotatably connected thereto, and the rotating rod is fixedly connected to the output end of the motor.

[0010] Furthermore, two screw rods and two support rods distributed in a ring are installed at the bottom of the electroplating box, and two slots and two thread grooves are provided at the bottom of the guide tube. The screw rods are meshed and connected with the thread grooves, and the support rods are slidably connected in the slots.

[0011] Furthermore, the screw rod is rotatably connected to the inner bottom of the electroplating box, and the support rod is fixedly connected to the inner bottom of the electroplating box.

[0012] Furthermore, the heating tube is fixed on the guide tube through a short rod.

[0013] Furthermore, a through slot is provided through the middle of the filter screen, and the rotating rod is provided through the through slot.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The rotation of the spiral blades of the utility model can transport the electroplating liquid upward through the guide tube, so that the electroplating liquid can circulate in the electroplating box to achieve uniform mixing, and the impurities in the electrolyte can be filtered through the filter screen to avoid affecting the electroplating products. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of an electroplating tank structure for manufacturing an integrated circuit described in an embodiment of the utility model.

[0017] Figure 2 It is a bottom view of an electroplating tank structure for manufacturing an integrated circuit described in an embodiment of the utility model.

[0018] Figure 3 It is a schematic diagram of a slot in an electroplating tank structure for manufacturing an integrated circuit described in an embodiment of the utility model.

[0019] Figure 4 It is a schematic diagram of a flow guide tube in an electroplating tank structure for manufacturing an integrated circuit described in an embodiment of the utility model.

[0020] In the above drawings: 1 electroplating box, 2 guide tube, 3 motor, 4 slot, 5 thread groove, 6 filter, 7 rotating rod, 8 screw rod, 9 support rod, 10 short rod, 11 heating tube, 12 mounting block, 13 spiral blade. DETAILED DESCRIPTION

[0021] The technical solution of the present utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] like Figure 1-Figure 4 As shown, the embodiment of the utility model provides an electroplating tank structure for integrated circuit manufacturing, including:

[0023] An electroplating box 1 for containing electroplating liquid, the electroplating box 1 being installed on a bracket for supporting the electroplating box 1;

[0024] A multifunctional circulation component capable of realizing circulating flow and mixing of electroplating liquid in an electroplating box 1; the multifunctional circulation component comprises a guide tube 2 which can be detachably installed in the electroplating box 1, two screw rods 8 and two support rods 9 distributed in an annular manner are installed at the bottom of the electroplating box 1, the screw rods 8 are rotatably connected to the inner bottom of the electroplating box 1, the support rods 9 are fixedly connected to the inner bottom of the electroplating box 1, two slots 4 and two thread grooves 5 are arranged at the bottom of the guide tube 2, the screw rods 8 are meshedly connected to the thread grooves 5, the support rods 9 are slidably connected in the slots 4, the thread grooves 5, the slots 4, the screw rods 8 and the support rods 9 are located on the same circumference, rotating the screw 8 can mesh with the thread grooves 5 to realize the fixation of the guide tube 2, and the slots 4 are inserted into the support rods 9 to realize the support of the guide tube 2; the guide tube 2 can be disassembled by reversing the screw 8;

[0025] A coaxial rotating rod 7 driven to rotate is provided in the guide tube 2. A motor 3 is installed at the bottom of the electroplating box 1. The rotating rod 7 penetrates the electroplating box 1 and is rotatably connected thereto. The rotating rod 7 is fixedly connected to the output end of the motor 3, and the rotating rod 7 can be driven to rotate by the motor 3.

[0026] A mounting block 12 is fixed to the upper end of the rotating rod 7, and a spiral blade 13 for circulating the electroplating solution is fixed to the mounting block 12. A heating tube 11 located above the spiral blade 13 is installed in the guide tube 2, and the heating tube 11 is fixed to the guide tube 2 through a short rod 10. A filter screen 6 located below the spiral blade 13 is installed in the guide tube 2, and a through groove is penetrated in the middle of the filter screen 6, and the rotating rod 7 is set through the through groove;

[0027] Specifically, when electroplating treatment is required, the staff energizes the motor 3 and the heating tube 11, and the motor 3 drives the rotating rod 7, the mounting block 12 and the spiral blade 13 to rotate. The rotation of the spiral blade 13 can transport the electroplating solution upward through the guide tube 2, so that the electroplating solution can circulate in the electroplating box 1 and achieve uniform mixing;

[0028] Since the electroplating solution flows upward through the filter screen 6 through the guide tube 2, impurities in the electrolyte can be filtered through the filter screen to avoid affecting the electroplating product;

[0029] In addition, the plating liquid flows upward through the guide tube 2. The plating liquid needs to maintain a certain temperature range during use, and some heat will be dissipated during electroplating. The heating tube 11 installed in the guide tube 2 can heat the circulating plating liquid to meet the electroplating needs.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. An electroplating tank structure for integrated circuit manufacturing, characterized in that: include: An electroplating box (1) for containing electroplating solution; A multifunctional circulation component capable of realizing circulating flow and mixing of the electroplating solution in the electroplating box (1); The multifunctional circulation component comprises a guide tube (2) which can be detachably installed in an electroplating box (1); a coaxial rotating rod (7) which is driven to rotate is provided in the guide tube (2); a mounting block (12) is fixed to the upper end of the rotating rod (7); a spiral blade (13) for circulating the electroplating solution is fixed to the mounting block (12); a heating tube (11) located above the spiral blade (13) is installed in the guide tube (2); and a filter screen (6) located below the spiral blade (13) is installed in the guide tube (2).

2. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: in: A motor (3) is installed at the bottom of the electroplating box (1), the rotating rod (7) passes through the electroplating box (1) and is rotatably connected thereto, and the rotating rod (7) is fixedly connected to the output end of the motor (3).

3. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: in: The bottom of the electroplating box (1) is provided with two screw rods (8) and two support rods (9) distributed in a ring shape, and the bottom of the guide tube (2) is provided with two slots (4) and two thread grooves (5), the screw rods (8) are meshingly connected with the thread grooves (5), and the support rods (9) are slidably connected in the slots (4).

4. The electroplating tank structure for integrated circuit manufacturing according to claim 3, characterized in that: in: The screw rod (8) is rotatably connected to the inner bottom of the electroplating box (1), and the support rod (9) is fixedly connected to the inner bottom of the electroplating box (1).

5. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: in: The heating tube (11) is fixed on the guide tube (2) via a short rod (10).

6. The electroplating tank structure for integrated circuit manufacturing according to claim 1, characterized in that: in: A through slot is provided in the middle of the filter screen (6), and the rotating rod (7) is provided through the through slot.

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