Copper plating equipment for circuit board with high aspect ratio

The copper plating device addresses manual loading issues by implementing automated handling and integrated cleaning processes, enhancing efficiency and safety in circuit board electroplating.

CN222182524UActive Publication Date: 2024-12-17YUFO ELECTRONICS HUIZHOU CO LTD
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Patent Information

Application Number
CN202420931318.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-30
Publication Date
2024-12-17
Estimated Expiration
2034-04-30

AI Technical Summary

Technical Problem

Existing circuit board electroplating equipment requires manual loading and unloading, leading to low efficiency and safety risks for operators, and lacks effective cleaning measures, affecting electroplating quality.

Method used

A copper plating device with a grabbing component for automated loading and unloading, an assembly line design, and integrated cleaning processes, including pickling, washing, electroplating, and drying stages, utilizing mechanical claws, conveyor belts, and telescopic rods for efficient and safe operation.

Benefits of technology

Enables automated circuit board handling, improves plating quality through assembly line integration, and ensures safe, efficient processing with reduced manual intervention and enhanced safety for operators.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model discloses copper plating equipment for a high aspect ratio circuit board, which relates to the technical field of circuit board processing, and comprises a box body, the top of the box body is fixedly connected with a top cover, five tanks are arranged in the box body and are respectively a pickling tank, a first rinsing tank, a sewage collecting tank, an electroplating tank and a second rinsing tank from front to back, a grabbing assembly is arranged over the electroplating bath and comprises a first top base, the top of the first top base is fixedly connected to the bottom of the top cover, a first sliding groove is longitudinally formed in the middle of the bottom of the first top base, two longitudinal first sliding channels are formed in the top of the first top base, and tooth grooves are formed in the left inner side wall and the right inner side wall of the first sliding groove. And motors III are connected into the two sliding channels I in a sliding manner. The circuit board is grabbed, electroplated and the like through the mechanical arm in the grabbing assembly, manual feeding and discharging are not needed, efficiency is improved, and safety of operators is further protected.
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Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board processing, and in particular relates to a copper plating device for a circuit board with a high aspect ratio. Background Art

[0002] Circuit boards are also called printed circuit boards. In the manufacturing process of circuit boards, copper plating not only ensures the normal operation of the circuit boards, but also greatly improves the life of the circuit boards. However, some circuit board electroplating equipment still requires manual loading and unloading, and the process is not perfect.

[0003] The Chinese patent with announcement number CN215713475U discloses a horizontal high aspect ratio circuit board microporous copper plating device, which includes a plating box, connecting blocks are arranged on both sides of the filter frame, a sliding rod is arranged on the upper end of the connecting block, and a fastening bolt is arranged on one side of the sliding rod. Before the copper plating process, the operator pulls the sliding rod upward to drive the connecting block and the filter frame to move upward. When the upper surface of the connecting block moves to contact the inner wall of the side groove, the fastening bolt is rotated at this time to fix the sliding rod, that is, the filter frame is fixed. During the rising process of the filter frame, the suspended matter in the electroplating solution will stay above the filter frame, and the electroplating solution before filtration is below the filter frame and can be discharged through the liquid outlet pipe. At this time, the scraper is on the same horizontal line with the side groove and the filter frame. The operator uses the switch to make the cylinder push the scraper to move, so that the suspended matter on the surface of the filter frame can be removed. The operation is relatively simple and practical.

[0004] Although the above-mentioned horizontal high aspect ratio circuit board micro-hole copper plating device is simple to operate and can filter floating materials produced by electroplating, it requires manual loading and unloading, has low efficiency, and has no cleaning measures before and after electroplating, which affects the electroplating quality and the safety of the operator. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a copper plating device for high aspect ratio circuit boards, which can achieve manual loading and unloading without the need for manual loading and unloading, improve the copper plating quality, and further protect the safety of the operator.

[0006] In order to solve the above technical problems, the utility model provides a copper plating device for high aspect ratio circuit boards, including a box body, a top cover is fixedly connected to the top of the box body, five slots are arranged inside the box body, which are respectively a pickling tank, a first water washing tank, a sewage collection tank, an electroplating tank, and a second water washing tank from front to back, and a grabbing component is arranged directly above the electroplating tank, and the grabbing component includes a top seat 1, the top of the top seat 1 is fixedly connected to the bottom of the top cover, a slide groove 1 is longitudinally opened in the middle position of the bottom of the top seat 1, and two longitudinal sliding channels 1 are opened on the top of the top seat 1, and the left and right inner walls of the slide groove 1 are provided with tooth grooves, and the two sliding channels 1 are both slidable It is connected to a motor three, the bottom of which is rotatably connected to a rotating shaft, the bottom end of which passes through and is fixedly connected to a gear, the gear and the tooth groove are located on the same horizontal line and are meshed with each other, the grabbing assembly includes a mechanical claw, the mechanical claw includes a top seat two, the top of the top seat two is provided with a rotating groove, the bottom of the rotating shaft is rotatably connected to the rotating groove, an electric telescopic rod three is fixedly connected to the bottom center of the top seat two, the telescopic end of the electric telescopic rod three is fixedly connected to a base two, the left and right sides of the base two are provided with a groove one, the inner wall of the groove one is fixedly connected to an electric telescopic rod four, and the telescopic end of the electric telescopic rod four is fixedly connected to a fixed plate two.

[0007] Furthermore, the top seat 2 is bowl-shaped, and a C-shaped support plate is provided at the bottom of the top seat 2. The C-shaped support plate is opened upward and is fixedly connected to the bottom of the top seat 1. A sliding channel 2 is opened at the center of the bottom of the C-shaped support plate, and the bottom of the top seat 2 is located below the sliding channel 2.

[0008] Furthermore, five water outlets are provided on the left side of the box body, and a valve is rotatably connected to the top of the water outlet, each water outlet corresponds to each groove one by one, and a water inlet is provided on the right side of the box body, and the structure and number of the water inlet are consistent with the structure and number of the water outlet. A loading assembly is provided at the front end of the box body, and the loading assembly includes a conveyor belt 1, a baffle 1 is respectively provided on the left and right sides of the conveyor belt 1, and pillars 2 are respectively provided at the four corners of the conveyor belt 1, and a motor 1 is fixedly connected to one side of the pillar 2 on the left front of the conveyor belt 1.

[0009] Furthermore, a roller limiting assembly is arranged at the rear of the feeding assembly, and the number of the roller limiting assemblies is four, which are respectively located on the left and right sides of the inside of the box body, and the roller limiting assembly includes a base 1, one end of the base 1 is fixedly connected to the inner wall of the box body, the other end of the base 1 is fixedly connected to a spring telescopic rod 1, the end of the spring telescopic rod 1 away from the base 1 is fixedly connected to a motor 2, the end of the motor 2 away from the spring telescopic rod 1 is fixedly connected to a C-shaped rod, the end of the C-shaped rod away from the motor 2 is rotatably connected to a roller, and the motor 2 drives the roller to rotate.

[0010] Furthermore, a lifting component is provided at the rear of the roller limiting component. There are two lifting components, which are respectively arranged on the left and right sides of the pickling tank. The lifting component includes a fixed rod, one side of the fixed rod is fixedly connected to the inner wall of the box body, the top of the fixed rod is fixedly connected to a fixed plate, the bottom of the fixed plate away from the fixed rod is fixedly connected to an electric telescopic rod, the pickling tank is directly below the electric telescopic rod, and a pickling filter is provided in the pickling tank, and the telescopic end of the electric telescopic rod is fixedly connected to one side of the top of the pickling filter.

[0011] Furthermore, the inner walls on the left and right sides of the box body are provided with groove 2 between the pickling tank and the first water washing tank, a lifting component 2 is provided on the rear side of the lifting component 1, two moving components 1 are provided between the lifting component 1 and the lifting component 2, the moving component 1 includes a slider, an electric guide rail is provided on the inner wall of the groove 2, the slider is slidably connected to the electric guide rail, the end of the slider away from the inner wall of the box body is fixedly connected to an electric telescopic rod 2, and the telescopic end of the electric telescopic rod 2 is fixedly connected to a limiting plate.

[0012] Furthermore, the rear side of the pickling tank is a first water washing tank, and a first water washing filter is arranged in the first water washing tank. The lifting component 2 is located at the top opening of the first water washing tank. The first water washing filter has the same structure as the pickling filter. The lifting component 1 has the same structure as the lifting component 2. An electric telescopic plate is arranged on the rear side of the lifting component 2. The top of the electric telescopic plate is fixedly connected to the bottom of the top cover. The rear side of the electric telescopic plate is a water absorption component. The water absorption component includes two spring telescopic rods. There are four spring telescopic rods, which are respectively located on the left and right sides of the opening of the sewage collecting tank. A sewage filter is fixedly connected in the sewage collecting tank. The bottom of the spring telescopic rod 2 is fixedly connected to the top of the sewage filter, and an upper and lower water-absorbing rollers are rotatably connected between each pair of spring telescopic rods 2. The axis of the water-absorbing roller passes through the spring telescopic rod 2 at one end, and a pulley is fixedly connected to the axis of one end of the water-absorbing roller. Each water-absorbing roller is provided with a scraper, and the top of the upper scraper is fixedly connected to the top of the spring telescopic rod 2, and the bottom of the lower scraper is fixedly connected to the top of the sewage filter. Two pulleys located on the same horizontal line are detachably connected with belts, and the end of the pulley located on the front side away from the water-absorbing roller is rotatably connected to a motor 5, and the motor 5 is embedded in the inner wall of the box.

[0013] Furthermore, a movable platform is provided on the rear side of the water absorption component, a storage platform is provided on the rear side of the movable platform, the rear side of the sewage collection tank is an electroplating tank, the bottom of the movable platform and the bottom of the storage platform are fixedly connected to the top of the electroplating tank, a channel is opened on the right side of the electroplating tank, a reaction box is fixedly connected to the right side of the electroplating tank, the reaction box is located on the right outer side of the box body, an electroplating pool filter is fixedly connected to the bottom end of the electroplating tank, a second water washing tank is provided on the rear side of the electroplating tank, a second water washing filter is fixedly connected in the second water washing tank, a lifting component three is provided at the top opening of the second water washing tank, the structure of the lifting component three is the same as that of the lifting component one, the second water washing filter is the same as the structure of the first water washing filter, a movable component two is provided on the rear side of the lifting component three, and the structure of the movable component two is the same as that of the movable component one.

[0014] Furthermore, a partition curtain is provided on the rear side of the movable component 2, the top of the partition curtain is fixedly connected to the bottom of the top cover, the rear side of the partition curtain is an air-drying box, the bottom of the air-drying box is provided with four pillars 1 respectively located at the four corners, the bottom of the air-drying box is fixedly connected with an air-drying filter, the top of the air-drying box is provided with a fan, four transmission rollers are provided directly below the fan, the four transmission rollers are parallel to each other and are on the same horizontal line, the left and right sides of the transmission rollers are fixedly connected with pillars 3, the bottom of the pillars 3 is fixedly connected to the top of the air-drying filter, the outer side of the transmission roller is sleeved with a conveyor belt 2, and the surface of the conveyor belt 2 has mesh holes.

[0015] Before adopting the above technical solution, the utility model has the following beneficial effects compared with the prior art.

[0016] 1. In the utility model, the circuit board is grasped and electroplated by the mechanical arm in the grasping assembly, without manual loading and unloading, which improves efficiency and further protects the safety of the operator.

[0017] 2. In the utility model, an assembly line production method is adopted, and each step is interrelated, thereby improving the copper plating quality.

[0018] 3. In the utility model, the circuit board can be directly taken out for other processing after being cleaned and dried before copper plating, thus saving time. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The figure is a schematic diagram of the overall structure of a copper plating device for a high aspect ratio circuit board;

[0020] Figure 2 A schematic diagram of the internal structure of a copper plating device for a high aspect ratio circuit board;

[0021] Figure 3 for Figure 1 A magnified view of the structure at center A;

[0022] Figure 4 for Figure 2 A magnified view of the structure at B in the middle;

[0023] Figure 5 The present invention is a schematic structural diagram of a water absorption component in a copper plating device for a high aspect ratio circuit board;

[0024] Figure 6 A schematic diagram of the structure of a moving component in a copper plating device for a high aspect ratio circuit board;

[0025] Figure 7 The figure is a schematic diagram of the structure of a mechanical claw used in a copper plating device for high aspect ratio circuit boards.

[0026] Numbers in the figure:

[0027] 100, box body; 101, reaction box; 102, air drying box; 103, pillar 1; 104, water outlet; 105, valve; 106, top cover; 200, feeding assembly; 201, pillar 2; 202, baffle 1; 203, motor 1; 204, conveyor belt 1; 300, roller limit assembly; 301, roller; 302, C-shaped rod; 303, motor 2; 304, spring telescopic rod 1; 305, base 1; 400, lifting assembly 1; 401, fixed plate 1; 402, electric telescopic rod 1; 403, fixed rod; 410, lifting assembly 2; 420, lifting assembly 3; 500, moving assembly 1; 501, slider; 502, electric telescopic rod 2; 503, limit plate; 510, moving assembly 2; 600, pickling filter; 601, the first A water-washing filter; 602, a sewage filter; 603, a second water-washing filter; 604, an air-drying filter; 605, an electroplating pool filter; 606, a second conveyor belt; 607, a transmission roller; 608, a third pillar; 609, a fan; 610, an electric telescopic plate; 611, a partition curtain; 700, a water-absorbing component; 701, a belt; 702, a pulley; 703, a water-absorbing roller; 704, a scraper; 705, a second spring telescopic rod; 800, a grabbing component; 801, a top seat; 802, a third motor; 803, a gear; 804, a tooth groove; 805, a C-type support plate; 810, a mechanical claw; 811, a second top seat; 812, a third electric telescopic rod; 813, a second fixed plate; 814, a fourth electric telescopic rod; 815, a second base; 900, a mobile platform; 901, a storage platform. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. The following embodiments are used to illustrate the utility model but are not used to limit the scope of the utility model.

[0029] The utility model realizes automatic copper plating by means of the grabbing component 800, does not need manual loading and unloading, adopts an assembly line design, and improves the copper plating quality.

[0030] like Figures 1 to 7 As shown, the utility model provides a copper plating device for a circuit board with a high aspect ratio.

[0031] Specifically, by Figure 1 , Figure 2 , Figure 6 and Figure 7 The present invention comprises a box body 100, the top of the box body 100 is fixedly connected with a top cover 106, five slots are arranged inside the box body 100, which are a pickling slot, a first water washing slot, a sewage collecting slot, an electroplating slot, and a second water washing slot from front to back, a grab assembly 800 is arranged just above the electroplating slot, the grab assembly 800 comprises a top seat 801, the top of the top seat 801 is fixedly connected to the bottom of the top cover 106, a slide groove 1 is longitudinally opened in the middle position of the bottom of the top seat 801, two longitudinal sliding channels 1 are opened on the top of the top seat 801, the left and right inner walls of the slide groove 1 are both provided with tooth grooves 804, motors 3 802 are slidably connected in the two sliding channels 1, and the bottom of the motor 3 802 is rotated to A rotating shaft is connected, and a gear 803 passes through and is fixedly connected to the bottom end of the rotating shaft. The gear 803 and the tooth groove 804 are located on the same horizontal line and are meshed with each other. The grabbing component 800 includes a mechanical claw 810, and the mechanical claw 810 includes a top seat 2 811. The top of the top seat 2 811 is provided with a rotating groove, and the bottom of the rotating shaft is rotatably connected to the rotating groove. An electric telescopic rod 3 812 is fixedly connected to the bottom center of the top seat 2 811, and the telescopic end of the electric telescopic rod 3 812 is fixedly connected to a base 2 815. The left and right sides of the base 2 815 are provided with grooves 1, and the inner wall of the groove 1 is fixedly connected to an electric telescopic rod 4 814, and the telescopic end of the electric telescopic rod 4 814 is fixedly connected to a fixed plate 2 813.

[0032] In the present invention, the electric telescopic rod three 812 controls the up and down movement of the mechanical claw 810, and the electric telescopic rod four 814 controls the fixed plate two 813 to adapt to circuit boards of different sizes.

[0033] As a specific implementation of the utility model, the utility model provides a copper plating device for a circuit board with a high aspect ratio.

[0034] Specifically, Figure 6 As shown, the top seat 2 811 is bowl-shaped, and a C-shaped support plate 805 is provided at the bottom of the top seat 2 811. The C-shaped support plate 805 opens upward and is fixedly connected to the bottom of the top seat 1 801. A sliding channel 2 is opened at the center of the bottom of the C-shaped support plate 805, and the bottom of the top seat 2 811 is located below the sliding channel 2.

[0035] In the present invention, the C-shaped support plate 805 is used to support the mechanical claw 810 .

[0036] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0037] Specifically, Figure 1 As shown, five water outlets 104 are provided on the left side of the box body 100, and the top of the water outlet 104 is rotatably connected to a valve 105, each water outlet 104 corresponds to each slot one by one, and a water inlet is provided on the right side of the box body 100, and the structure and number of the water inlet are consistent with the structure and number of the water outlet 104, and a loading component 200 is provided at the front end of the box body 100, and the loading component 200 includes a conveyor belt 204, and baffles 202 are respectively provided on the left and right sides of the conveyor belt 204, and pillars 201 are respectively provided at the four corners of the conveyor belt 204, and a motor 203 is fixedly connected to one side of the pillar 201 on the left front of the conveyor belt 204.

[0038] In the present invention, the loading assembly 200 brings the circuit board into the box body 100, and the water outlet 104 and the water inlet facilitate replacement and replenishment of the liquid in the tank.

[0039] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0040] Specifically, Figure 1 and Figure 3 As shown, a roller limiting assembly 300 is arranged at the rear of the feeding assembly 200, and the number of the roller limiting assemblies 300 is four, which are respectively located on the left and right sides of the inside of the box body 100, and the roller limiting assembly 300 includes a base 305, one end of the base 305 is fixedly connected to the inner wall of the box body 100, and the other end of the base 305 is fixedly connected to a spring telescopic rod 304, and the end of the spring telescopic rod 304 away from the base 305 is fixedly connected to a motor 2 303, and the end of the motor 2 303 away from the spring telescopic rod 304 is fixedly connected to a C-shaped rod 302, and the end of the C-shaped rod 302 away from the motor 2 303 is rotatably connected to a roller 301, and the motor 2 303 drives the roller 301 to rotate.

[0041] In the present invention, the roller limiting assembly 300 is used to fix the circuit board to prevent it from being bumped, and the spring telescopic rod 304 can prevent the circuit board from being damaged.

[0042] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0043] Specifically, Figure 1 , Figure 2 and Figure 4 As shown, a lifting assembly 400 is provided at the rear of the roller limiting assembly 300, and there are two lifting assemblies 400, which are respectively arranged on the left and right sides of the pickling tank. The lifting assembly 400 includes a fixed rod 403, one side of the fixed rod 403 is fixedly connected to the inner wall of the box body 100, the top of the fixed rod 403 is fixedly connected to a fixed plate 401, and the bottom of the fixed plate 401 away from the fixed rod 403 is fixedly connected to an electric telescopic rod 402, and the pickling tank is directly below the electric telescopic rod 402, and a pickling filter 600 is provided in the pickling tank, and the telescopic end of the electric telescopic rod 402 is fixedly connected to one side of the top of the pickling filter 600.

[0044] In the utility model, the electric telescopic rod 402 is extended and retracted to drive the pickling filter 600 to move up and down, so as to realize the pickling of the circuit board.

[0045] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0046] Specifically, Figure 1 , Figure 2 and Figure 4 As shown, groove 2 is formed on the inner wall of the left and right sides of the box body 100 between the pickling tank and the first water washing tank, a lifting component 2 410 is provided on the rear side of the lifting component 1 400, two moving components 1 500 are provided between the lifting component 1 400 and the lifting component 2 410, and the moving component 1 500 includes a slider 501, an electric guide rail is provided on the inner wall of groove 2, the slider 501 is slidably connected to the electric guide rail, and one end of the slider 501 away from the inner wall of the box body 100 is fixedly connected to an electric telescopic rod 2 502, and the telescopic end of the electric telescopic rod 2 502 is fixedly connected to a limiting plate 503.

[0047] In the present invention, the second electric telescopic rod 502 is extended to drive the limit plate 503 to fix the circuit board, and the electric guide rail is used to drive the slider 501 to slide, so as to drive the circuit board to move.

[0048] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0049] Specifically, Figure 2 and Figure 5As shown, the rear side of the pickling tank is the first water washing tank, and the first water washing tank is provided with a first water washing filter 601, the lifting component 2 410 is located at the top opening of the first water washing tank, the first water washing filter 601 has the same structure as the pickling filter 600, the lifting component 1 400 has the same structure as the lifting component 2 410, an electric telescopic plate 610 is provided on the rear side of the lifting component 2 410, the top of the electric telescopic plate 610 is fixedly connected to the bottom of the top cover 106, the rear side of the electric telescopic plate 610 is a water absorption component 700, the water absorption component 700 includes a spring telescopic rod 2 705, the number of the spring telescopic rod 2 705 is four, which are respectively located on the left and right sides of the opening of the sewage collecting tank, the sewage collecting tank is fixedly connected with a sewage filter 602, the bottom of the spring telescopic rod 2 705 is fixedly connected to the sewage collecting tank, and the bottom of the spring telescopic rod 2 705 is fixedly connected to the sewage collecting tank. The top of the water filter 602 is fixedly connected, and an upper and a lower water absorption roller 703 are rotatably connected between each pair of spring telescopic rods 705. The axis of the water absorption roller 703 passes through the spring telescopic rod 705 at one end, and a pulley 702 is fixedly connected to the axis of one end of the water absorption roller 703. Each water absorption roller 703 is provided with a scraper 704. The top of the upper scraper 704 is fixedly connected to the top of the spring telescopic rod 705, and the bottom of the lower scraper 704 is fixedly connected to the top of the sewage filter 602. The two pulleys 702 located on the same horizontal line are detachably connected to the belt 701, and the end of the pulley 702 located on the front side away from the water absorption roller 703 is rotatably connected to the motor five, and the motor five is embedded in the inner wall of the box body 100.

[0050] In the utility model, the first water washing process is consistent with the acid washing process. After the circuit board completes the first water washing, the moving component 500 sends the circuit board to the water absorption component 700, the motor five drives the pulley 702 to rotate, the pulley 702 drives the water absorption roller 703 to rotate, the front pulley 702 drives the rear pulley 702 to rotate through the belt 701, and at the same time the spring telescopic rod 2 705 prevents excessive force from being applied to the circuit board to cause damage.

[0051] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0052] Specifically, Figure 1 and Figure 2As shown, a movable platform 900 is provided on the rear side of the water absorption component 700, and a storage platform 901 is provided on the rear side of the movable platform 900. The rear side of the sewage collection tank is an electroplating tank. The bottom of the movable platform 900 and the bottom of the storage platform 901 are fixedly connected to the top of the electroplating tank. A channel is opened on the right side of the electroplating tank, and a reaction box 101 is fixedly connected to the right side of the electroplating tank. The reaction box 101 is located on the right outer side of the box body 100, and an electroplating pool filter 605 is fixedly connected to the bottom end of the electroplating tank. A second water washing tank is provided on the rear side of the electroplating tank, and a second water washing filter 603 is fixedly connected in the second water washing tank. A lifting component three 420 is provided at the top opening of the second water washing tank. The structure of the lifting component three 420 is the same as that of the lifting component one 400, and the structure of the second water washing filter 603 is the same as that of the first water washing filter 601. A movable component two 510 is provided on the rear side of the lifting component three 420, and the structure of the movable component two 510 is the same as that of the movable component one 500.

[0053] In the utility model, the movable table 900 and the storage table 901 are used to support the circuit board coming out of the water absorption component 700. At this time, the mechanical claw 810 is on standby, and then grabs and electroplates. After the electroplating is completed, the mechanical claw 810 sends the circuit board to the top of the second water washing filter 603, and then the mechanical claw 810 is reset.

[0054] As another specific implementation of the present invention, the present invention provides a copper plating device for a circuit board with a high aspect ratio.

[0055] Specifically, Figure 1 and Figure 2 As shown, a partition curtain 611 is provided on the rear side of the movable component 2 510, and the top of the partition curtain 611 is fixedly connected to the bottom of the top cover 106, and the rear side of the partition curtain 611 is an air-drying box 102, and the bottom of the air-drying box 102 is provided with four pillars 103 respectively located at four corners, and the bottom of the air-drying box 102 is fixedly connected with an air-drying filter 604, and the top of the air-drying box 102 is provided with a fan 609, and four transmission rollers 607 are provided directly below the fan 609, and the four transmission rollers 607 are parallel to each other and are on the same horizontal line, and the left and right sides of the transmission roller 607 are fixedly connected with pillars three 608, and the bottom of the pillars three 608 is fixedly connected to the top of the air-drying filter 604, and the outer side of the transmission roller 607 is sleeved with a conveyor belt 2 606, and the surface of the conveyor belt 2 606 has mesh holes.

[0056] In the utility model, the moving component 510 sends the circuit board to the top of the conveyor belt 606, and then the transmission roller 607 drives the conveyor belt 606 to rotate, and the circuit board is driven accordingly, and the fan 609 on the top performs air-drying operation on the circuit board. The mesh on the surface of the conveyor belt 606 and the air-drying filter 604 at the bottom of the air-drying box 102 ensure that moisture on the surface of the circuit board will not remain in the air-drying box 102.

[0057] Working principle: After the power is turned on, the operator first places the circuit board to be processed horizontally and longitudinally on the conveyor belt 204, and the motor 203 drives the conveyor belt 204 to drive the circuit board into the box 100. When the rear end of the circuit board hits the roller 301 in the roller limit assembly 300, the spring telescopic rod 304 will adaptively shrink to both sides and the roller 301 will roll the circuit board into the box 100. When the circuit board reaches the pickling filter 600, the lifting assembly 400 operates, and the electric telescopic rod 402 drives the pickling filter 600 to descend, and the circuit board is immersed in the pickling tank for pickling. After the pickling is completed, the electric telescopic rod 402 drives the pickling filter 600 to rise and reset, and the moving assembly 500 operates, and the electric telescopic rod 2 502 extends out, driving the limit plate 503 to limit the circuit board, and then the slider 501 is driven by the electric guide rail in the groove two to the first water washing filter 601 on the rear side. The working process of the first water washing is consistent with the working process of the pickling. After the first water washing is completed, the moving component 1 500 operates, and the electric telescopic rod 2 502 extends out to drive the limit plate 503 to fix the circuit board. At this time, the electric telescopic plate 610 is lifted, and the slider 501 moves to send the circuit board into the water absorption component 700. The motor five drives the pulley 702 to rotate, and the pulley 702 drives the rear pulley 702 to rotate synchronously through the belt 701. The pulley 702 drives the water absorption roller 703 to operate. When the water absorption roller 703 clamps the circuit board, the spring telescopic rod two 705 will adaptively extend and retract to ensure that the circuit board is not crushed. The water-absorbing roller 703 drives the circuit board to the storage table 901 via the moving table 900. At this time, the grabbing component 800 is running, the electric telescopic rod three 812 descends, and the electric telescopic rod four 814 extends to drive the fixed plate two 813. After it descends to a suitable height, the electric telescopic rod four 814 contracts and drives the fixed plate two 813 to limit the circuit board. Then the electric telescopic rod three 812 rises, and the motor three 802 drives the gear 803 to move and bring the circuit board to the top of the electroplating tank. Then the electric telescopic rod three 812 descends to put the circuit board into the electroplating tank for electroplating. After the electroplating is completed, the electric telescopic rod three 812 rises, and the motor three 802 drives the gear 803 to move in the tooth groove 8 04 moves to drive the mechanical claw 810 to bring the circuit board to the top of the second water washing tank, the electric telescopic rod three 812 descends, and after it reaches a suitable height, the electric telescopic rod four 814 extends to release the circuit board, and the circuit board falls steadily on the second water washing filter 603, and then the grabbing component 800 is reset. The second water washing process is consistent with the first water washing process. After the second water washing is completed, the moving component two 510 is operated to send the circuit board through the partition curtain 611 to the conveyor belt two 606 inside the air drying box 102, the transmission roller 607 and the fan 609 operate synchronously, the transmission roller 607 drives the conveyor belt two 606 to rotate, and the conveyor belt two 606 drives the circuit board to move backward, during which the fan 609 performs an air-drying operation on the circuit board.

[0058] It should be noted here that:

[0059] First, the pickling process, the first water washing process and the second water washing process are consistent, and the filter screen, lifting component and moving component structures and working principles of the three are the same;

[0060] Second, the reaction box 101 is used to store copper blocks. The left side of the reaction box 101 is connected to the right side of the electroplating tank, and a protective cover is provided on the top of the reaction box 101 to prevent air from affecting the copper plating and facilitate copper replacement. A water inlet is provided on the right outer wall of the box body 100. The structure of the water inlet is the same as that of the water outlet 104, and both are provided with a valve 105. In addition, the bottoms of all tanks are inclined.

[0061] Third, the horizontal line of the first water-washing filter 601 is located between the upper and lower water-absorbing rollers 703, that is, after the circuit board has been washed with the first water, it can be sent to the middle of the upper and lower water-absorbing rollers 703;

[0062] Fourth, the motor 4 for driving the transmission roller 607 is located on one side of the pillar 3 608 at the left rear of the air drying box 102;

[0063] Fifth, the height of the roller limiting assembly 300 is just enough to place the circuit board in the middle, and the roller limiting assembly 300 shown in the figure is the maximum extendable length, that is, the minimum width of the circuit board that can be accommodated.

[0064] The above is only a preferred embodiment of the present invention, and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technician familiar with this patent can make some changes or modifications to equivalent embodiments of equivalent changes using the technical content suggested above without departing from the scope of the technical solution of the present invention. The implementation schemes in the above embodiments can also be further combined or replaced. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the present invention.

Claims

1. A copper plating device for a high aspect ratio circuit board, comprising a box (100), the top of the box (100) being fixedly connected to a top cover (106), the box (100) being provided with five slots inside, which are, from front to back, a pickling slot, a first water washing slot, a sewage collection slot, a plating slot, and a second water washing slot, It is characterized in that A grab assembly (800) is provided directly above the electroplating tank, and the grab assembly (800) includes a top seat (801), the top of the top seat (801) is fixedly connected to the bottom of the top cover (106), a slide groove (801) is longitudinally opened in the middle position of the bottom of the top seat (801), and two longitudinal sliding channels (801) are opened on the top of the top seat (801), and the left and right inner walls of the slide groove (804) are both provided with tooth grooves, and the two sliding channels (802) are slidably connected to the motor (802), and the bottom of the motor (802) is rotatably connected to a rotating shaft, and the bottom end of the rotating shaft passes through and is fixedly connected to a gear (803), and the gear (803) and the tooth groove (804) are located at the same The gripping assembly (800) is arranged on a horizontal line and meshed with each other, the gripping assembly (800) includes a mechanical claw (810), the mechanical claw (810) includes a top seat 2 (811), a rotating groove is provided on the top of the top seat 2 (811), the bottom of the rotating shaft is rotatably connected to the rotating groove, an electric telescopic rod 3 (812) is fixedly connected to the center of the bottom of the top seat 2 (811), the telescopic end of the electric telescopic rod 3 (812) is fixedly connected to the base 2 (815), the left and right sides of the base 2 (815) are provided with a groove 1, the inner wall of the groove 1 is fixedly connected to the electric telescopic rod 4 (814), and the telescopic end of the electric telescopic rod 4 (814) is fixedly connected to the fixed plate 2 (813).

2. A copper plating device for a high aspect ratio circuit board according to claim 1, It is characterized in that The second top seat (811) is bowl-shaped, and a C-shaped support plate (805) is provided at the bottom of the second top seat (811). The C-shaped support plate (805) is opened upward and is fixedly connected to the bottom of the first top seat (801). A sliding channel 2 is opened at the center of the bottom of the C-shaped support plate (805), and the bottom of the second top seat (811) is located below the sliding channel 2.

3. A copper plating device for a high aspect ratio circuit board according to claim 2, It is characterized in that The left side of the box body (100) is provided with five water outlets (104), the top of each water outlet (104) is rotatably connected to a valve (105), each water outlet (104) corresponds to each slot one by one, the right side of the box body (100) is provided with a water inlet, the structure and number of the water inlet are consistent with the structure and number of the water outlet (104), the front end of the box body (100) is provided with a loading assembly (200), the loading assembly (200) comprises a conveyor belt 1 (204), the left and right sides of the conveyor belt 1 (204) are respectively provided with a baffle 1 (202), the four corners of the conveyor belt 1 (204) are respectively provided with pillars 2 (201), and one side of the pillar 2 (201) at the left front of the conveyor belt 1 (204) is fixedly connected to a motor 1 (203).

4. A copper plating device for a high aspect ratio circuit board according to claim 3, It is characterized in that A roller limiting assembly (300) is arranged at the rear of the feeding assembly (200). The number of the roller limiting assemblies (300) is four and they are respectively located on the left and right sides of the interior of the box (100). The roller limiting assembly (300) comprises a base 1 (305). One end of the base 1 (305) is fixedly connected to the inner wall of the box (100). The other end of the base 1 (305) is fixedly connected to a spring telescopic rod 1 (304). An end of the spring telescopic rod 1 (304) away from the base 1 (305) is fixedly connected to a motor 2 (303). An end of the motor 2 (303) away from the spring telescopic rod 1 (304) is fixedly connected to a C-shaped rod (302). An end of the C-shaped rod (302) away from the motor 2 (303) is rotatably connected to a roller (301). The motor 2 (303) drives the roller (301) to rotate.

5. A copper plating device for a high aspect ratio circuit board according to claim 4, It is characterized in that A lifting assembly (400) is provided at the rear of the roller limiting assembly (300). There are two lifting assemblies (400), which are respectively arranged on the left and right sides of the pickling tank. The lifting assembly (400) comprises a fixed rod (403). One side of the fixed rod (403) is fixedly connected to the inner wall of the box body (100). The top of the fixed rod (403) is fixedly connected to a fixed plate (401). The bottom of the fixed plate (401) away from the fixed rod (403) is fixedly connected to an electric telescopic rod (402). The pickling tank is directly below the electric telescopic rod (402). A pickling filter (600) is provided in the pickling tank. The telescopic end of the electric telescopic rod (402) is fixedly connected to one side of the top of the pickling filter (600).

6. A copper plating device for a high aspect ratio circuit board according to claim 5, It is characterized in that The inner walls on the left and right sides of the box body (100) are provided with groove 2 between the pickling tank and the first water washing tank, and the rear side of the lifting component 1 (400) is provided with a lifting component 2 (410), and two moving components 1 (500) are provided between the lifting component 1 (400) and the lifting component 2 (410), and the moving component 1 (500) includes a slider (501), and an electric guide rail is provided on the inner wall of the groove 2, and the slider (501) is slidably connected to the electric guide rail, and one end of the slider (501) away from the inner wall of the box body (100) is fixedly connected to the electric telescopic rod 2 (502), and the telescopic end of the electric telescopic rod 2 (502) is fixedly connected to the limiting plate (503).

7. A copper plating device for a high aspect ratio circuit board according to claim 6, It is characterized in that The first water washing tank is disposed at the rear side of the pickling tank. A first water washing filter (601) is disposed in the first water washing tank. The lifting assembly (410) is located at the top opening of the first water washing tank. The first water washing filter (601) has the same structure as the pickling filter (600). The lifting assembly (400) has the same structure as the lifting assembly (410). An electric telescopic plate (610) is disposed at the rear side of the lifting assembly (410). The top of the electric telescopic plate (610) is fixedly connected to the bottom of the top cover (106). The rear side of the electric telescopic plate (610) is a water absorption assembly (700). The water absorption assembly (700) includes two spring telescopic rods (705). The number of the two spring telescopic rods (705) is four and they are located at the left and right sides of the opening of the sewage collection tank, respectively. A sewage filter (602) is fixedly connected in the sewage collection tank. The two spring telescopic rods (705) are The bottom of the water absorbing roller (703) is fixedly connected to the top of the sewage filter (602); an upper and a lower water absorbing roller (703) are rotatably connected between each pair of spring telescopic rods (705); the axis of the water absorbing roller (703) passes through the spring telescopic rod (705) at one end; a pulley (702) is fixedly connected to the axis of one end of the water absorbing roller (703); each water absorbing roller (703) is provided with a scraper (704); the top of the upper scraper (704) is fixedly connected to the top of the spring telescopic rod (705); the bottom of the lower scraper (704) is fixedly connected to the top of the sewage filter (602); two pulleys (702) located on the same horizontal line are detachably connected to a belt (701); the end of the pulley (702) located on the front side away from the water absorbing roller (703) is rotatably connected to a motor (5); the motor (5) is embedded in the inner wall of the box body (100).

8. A copper plating device for a high aspect ratio circuit board according to claim 7, It is characterized in that A movable platform (900) is provided at the rear side of the water absorption component (700), a storage platform (901) is provided at the rear side of the movable platform (900), an electroplating tank is provided at the rear side of the sewage collection tank, the bottom of the movable platform (900) and the bottom of the storage platform (901) are both fixedly connected to the top of the electroplating tank, a channel is provided at the right side of the electroplating tank, a reaction box (101) is fixedly connected to the right side of the electroplating tank, the reaction box (101) is located at the right outer side of the box body (100), and an electroplating tank filter (605) is fixedly connected to the bottom end of the electroplating tank. ), a second water washing tank is provided at the rear side of the electroplating tank, a second water washing filter (603) is fixedly connected in the second water washing tank, a lifting component three (420) is provided at the top opening of the second water washing tank, the structure of the lifting component three (420) is the same as that of the lifting component one (400), the second water washing filter (603) is the same as the first water washing filter (601), a moving component two (510) is provided at the rear side of the lifting component three (420), the structure of the moving component two (510) is the same as that of the moving component one (500).

9. A copper plating device for a high aspect ratio circuit board according to claim 8, It is characterized in that A partition curtain (611) is provided at the rear side of the movable component 2 (510), the top of the partition curtain (611) is fixedly connected to the bottom of the top cover (106), the rear side of the partition curtain (611) is an air drying box (102), the bottom of the air drying box (102) is provided with four support pillars (103) respectively located at the four corners, the bottom of the air drying box (102) is fixedly connected with an air drying filter (604), and the top of the air drying box (102) is provided with a fan (609). Four transmission rollers (607) are arranged directly below the fan (609), and the four transmission rollers (607) are parallel to each other and are located on the same horizontal line. The left and right sides of the transmission rollers (607) are fixedly connected with pillars three (608), and the bottom of the pillars three (608) is fixedly connected to the top of the air-drying filter (604). The outer side of the transmission roller (607) is sleeved with a conveyor belt two (606), and the surface of the conveyor belt two (606) is provided with mesh holes.

Citation Information

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