High-temperature-resistant PCB (Printed Circuit Board)

Abstract

The utility model relates to a high-temperature-resistant PCB circuit board comprising a heat dissipation core layer, an insulating layer and a surface metal layer which are sequentially stacked from inside to outside. The surface metal layer comprises a surface metal layer and an insulating layer, the edge of the insulating layer is provided with a board edge copper layer, the surface metal layer comprises a circuit layer and a heat dissipation copper layer, at least part of the heat dissipation copper layer extends to the edge of the insulating layer, and the board edge copper layer is respectively connected with the heat dissipation core layer and the heat dissipation copper layer. The high-temperature-resistant PCB circuit board can prevent heat from being accumulated on the circuit layer of the high-temperature-resistant PCB circuit board, so that the influence on the work of other electronic components is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-temperature resistant PCB circuit board. Background Art

[0002] PCB, Chinese name for printed circuit board, also known as printed circuit board, is a carrier used to support and connect electronic components. It is an important component of electronic equipment. It consists of an insulating layer and a circuit layer printed on it. The circuit layer on the circuit board is used to connect various electronic components to realize the function of the circuit.

[0003] Some electronic components generate extremely high heat when working, which causes the circuit board to heat up, thus affecting the operation of other electronic components. Utility Model Content

[0004] Based on this, it is necessary to provide a high temperature resistant PCB circuit board.

[0005] A high temperature resistant PCB circuit board comprises a heat dissipation core layer, an insulating layer and a surface metal layer which are stacked in sequence from the inside to the outside; a board edge copper layer is arranged at the edge of the insulating layer, the surface metal layer comprises a circuit layer and a heat dissipation copper layer, at least part of the heat dissipation copper layer extends to the edge of the insulating layer, and the board edge copper layer is respectively connected to the heat dissipation core layer and the heat dissipation copper layer.

[0006] In one embodiment, the heat dissipation core layer includes a copper core layer or an aluminum core layer.

[0007] In one of the embodiments, an ink layer is further included, and the ink layer covers at least a portion of the circuit layer.

[0008] In one of the embodiments, the board edge copper layer and the heat dissipation copper layer are provided with a silver plating layer.

[0009] In one embodiment, the heat dissipation copper layer is disposed around the insulating layer.

[0010] In one of the embodiments, the heat dissipation copper layer is provided with an exhaust fan.

[0011] In one embodiment, the heat dissipation copper layer and at least a portion of the circuit layer are arranged alternately.

[0012] In one of the embodiments, a through hole is opened through the heat dissipation copper layer.

[0013] In one of the embodiments, a thermal via copper is disposed in the through hole.

[0014] In one of the embodiments, a heat-conducting column is provided in the through hole.

[0015] When the heat generated by the electronic components is transferred to the above-mentioned high-temperature resistant PCB circuit board, the heat dissipation core layer conducts the heat inside the circuit board to the edge of the circuit board, and then conducts it to the heat dissipation copper layer through the board edge copper layer. The heat dissipation copper layer and the board edge copper layer are both exposed to the outside, which can better dissipate the heat derived from the inside of the circuit board to the outside, improve the heat dissipation efficiency of the high-temperature resistant PCB circuit board, and reduce the temperature of the high-temperature resistant PCB circuit board. In this way, it is possible to avoid heat accumulation in the circuit layer of the high-temperature resistant PCB circuit board and avoid affecting the work of other electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic cross-sectional structure diagram of a high temperature resistant PCB circuit board in one direction according to an embodiment;

[0017] Figure 2 A schematic cross-sectional structure diagram of a high temperature resistant PCB circuit board in one direction according to another embodiment;

[0018] Figure 3 A schematic cross-sectional structure diagram of a high temperature resistant PCB circuit board in one direction according to another embodiment;

[0019] Figure 4 A schematic cross-sectional structure diagram of a high temperature resistant PCB circuit board in one direction according to another embodiment;

[0020] Figure 5 The figure is a schematic cross-sectional structure diagram of a high temperature resistant PCB circuit board in one direction according to another embodiment. DETAILED DESCRIPTION

[0021] For ease of understanding of the application, the application will be described more fully below. The application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the application more thorough and comprehensive.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the description of the present application, the meaning of "several" is at least one, such as one, two, etc., unless otherwise clearly and specifically defined.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present application belongs. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0024] In the present application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0025] For example, electronic components such as LED lamp beads and chips generate a lot of heat. After these electronic components generate heat, the heat is transferred to the circuit board. If the heat is not effectively dissipated, the heat will continue to accumulate on the circuit board and affect other electronic components. In one embodiment, Figure 1As shown, a circuit board is provided, more specifically a high temperature resistant PCB circuit board 10, comprising a heat dissipation core layer, an insulation layer and a surface metal layer stacked in sequence from the inside to the outside; a board edge copper layer is provided at the edge of the insulation layer, the surface metal layer comprises a circuit layer and a heat dissipation copper layer, at least part of the heat dissipation copper layer extends to the edge of the insulation layer, and the board edge copper layer is respectively connected to the heat dissipation core layer and the heat dissipation copper layer. Specifically, the high temperature resistant PCB circuit board 10 comprises a first surface metal layer 100, a first insulating layer 210, a heat dissipation core layer 500, a second insulating layer 220 and a second surface metal layer stacked in sequence, wherein the first surface metal layer 100 comprises a first circuit layer 110 and a first heat dissipation copper layer 130, the second surface metal layer comprises a second circuit layer 320 and a second heat dissipation copper layer 340, a channel 401 is provided through the first insulating layer 210 and the second insulating layer 220, a conductive via copper 420 is provided in the channel 401, the first circuit layer 110 and the second circuit layer 320 are electrically connected through the conductive via copper 420, wherein the heat dissipation core layer 500 is provided with a window 211 to allow the first insulating layer 210 to fill the position of the window 211, thereby facilitating the subsequent conductive via copper 420 to pass through. Specifically, the core layer raw material is first pressed onto the second insulating layer 220, and then the core layer raw material forms the heat dissipation core layer 500 on the second insulating layer 220 through the steps of lamination, development, etching and film removal. Then, the first insulating layer 210 and the first copper foil layer can be sequentially stacked on the heat dissipation core layer 500, and the second copper foil layer can be stacked under the second insulating layer 220, and a multilayer board can be obtained after hot pressing, and then through the steps of lamination, development, etching and film stripping, the first copper foil layer forms the first circuit layer 110 and the first heat dissipation copper layer 130, and the second copper foil layer forms the second circuit layer 320 and the second heat dissipation copper layer 340. Specifically, part of the first heat dissipation copper layer 130 extends to the edge of the first insulating layer 210, part of the second heat dissipation copper layer 340 extends to the edge of the second insulating layer 220, and the board edge copper layer 510 is connected to the heat dissipation core layer 500, the first heat dissipation copper layer 130 and the second heat dissipation copper layer 340 respectively.

[0026] When the heat generated by the electronic components is transferred to the above-mentioned high-temperature resistant PCB circuit board, the heat dissipation core layer conducts the heat inside the circuit board to the edge of the circuit board, and then conducts it to the first heat dissipation copper layer and the second heat dissipation copper layer through the board edge copper layer. The first heat dissipation copper layer, the second heat dissipation copper layer and the board edge copper layer are all exposed to the outside, which can better dissipate the heat derived from the inside of the circuit board to the outside, improve the heat dissipation efficiency of the high-temperature resistant PCB circuit board, and reduce the temperature of the high-temperature resistant PCB circuit board. In this way, it is possible to avoid heat accumulation in the circuit layer of the high-temperature resistant PCB circuit board and avoid affecting the work of other electronic components.

[0027] In one embodiment, the heat dissipation core layer 500 includes a copper core layer or an aluminum core layer. Both copper and aluminum can effectively realize the heat dissipation function of the heat dissipation core layer 500 .

[0028] In one of the embodiments, the high temperature resistant PCB circuit board 10 further includes an ink layer 430, and the ink layer 430 covers at least a portion of the circuit layer. The ink layer 430 of this embodiment plays a role in protecting the circuit layer and resisting soldering.

[0029] like Figure 2 As shown, in order to improve the heat dissipation efficiency, in one embodiment, the board edge copper layer 510 and the heat dissipation copper layer are provided with a silver-plated layer 550. The silver in the silver-plated layer 550 has a better thermal conductivity than copper, and improves the heat dissipation efficiency of the high temperature resistant PCB circuit board 10. The silver-plated layer 550 can also protect the board edge copper layer 510 and the heat dissipation copper layer, and prevent the board edge copper layer 510 and the heat dissipation copper layer from being scratched and damaged.

[0030] In one embodiment, the heat dissipation copper layer is arranged around the insulating layer. In this embodiment, the heat dissipation copper layer is arranged around the insulating layer to better dissipate heat in all directions, so that the temperature of the circuit board is more uniform. Specifically, the area of ​​the heat dissipation copper layer is larger than that of the circuit layer, thereby obtaining a better heat dissipation effect.

[0031] In one embodiment, the heat dissipation copper layer is provided with an exhaust fan. The exhaust fan can extract air from the heat dissipation copper layer, thereby avoiding hot air accumulation and improving heat dissipation efficiency. Specifically, the exhaust fan contacts the heat dissipation copper layer through thermal conductive silicone grease, and the specific connection method of the exhaust fan of a computer chip can be referred to.

[0032] In one embodiment, the heat dissipation copper layer is staggered with at least part of the circuit layer. In this embodiment, the heat dissipation copper layer is staggered with at least part of the circuit layer, so that the heat dissipation copper layer can absorb heat from the adjacent circuit layer to avoid excessive temperature in the circuit layer.

[0033] like Figure 3 As shown, in one of the embodiments, a through hole 541 is opened through the heat dissipation copper layer. In this embodiment, a through hole 541 is opened through the first heat dissipation copper layer 130. The through hole 541 can be used to fix screws, so as to fix the high temperature resistant PCB circuit board 10 on the support structure; and can also be used to set the heat conductive column 600, so as to better dissipate heat outward. In this embodiment, a thermal conductive hole copper 540 is set in the through hole 541. In this embodiment, the thermal conductive hole copper 540 in the through hole 541 can achieve heat conduction, so as to conduct the heat of the heat dissipation core layer 500 to the first heat dissipation copper layer 130 and the second heat dissipation copper layer 340 more quickly, thereby improving the heat dissipation effect. As shown in FIG. Figure 4As shown, in another embodiment, a blind hole 530 is opened from the heat dissipation copper layer to the heat dissipation core layer 500, and the blind hole 530 is made by laser drilling. The blind hole 530 is filled with thermal via copper 530, which can also achieve the function of heat conduction from the heat dissipation core layer 500 to the heat dissipation copper layer. Figure 5 As shown, in one embodiment, a heat-conducting column 600 is provided in the through hole 541. The heat-conducting column 600 can transfer heat from the heat-dissipating core layer 500 to the heat-dissipating copper layer more quickly, and the heat-conducting column 600 itself can also dissipate heat outwards to improve the heat dissipation efficiency. Specifically, the material of the heat-conducting column is at least one of a copper column, an aluminum column and a carbon fiber column.

[0034] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A high temperature resistant PCB circuit board, characterized in that: It includes a heat dissipation core layer, an insulating layer and a surface metal layer stacked in sequence from the inside to the outside; a board edge copper layer is arranged at the edge of the insulating layer, the surface metal layer includes a circuit layer and a heat dissipation copper layer, at least part of the heat dissipation copper layer extends to the edge of the insulating layer, and the board edge copper layer is respectively connected to the heat dissipation core layer and the heat dissipation copper layer.

2. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The heat dissipation core layer includes a copper core layer or an aluminum core layer.

3. The high temperature resistant PCB circuit board according to claim 1, characterized in that: Also included is an ink layer, wherein the ink layer covers at least a portion of the circuit layer.

4. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The board edge copper layer and the heat dissipation copper layer are provided with a silver-plated layer.

5. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The heat dissipation copper layer is arranged around the insulating layer.

6. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The heat dissipation copper layer is provided with an exhaust fan.

7. The high temperature resistant PCB circuit board according to claim 1, characterized in that: The heat dissipation copper layer and at least a portion of the circuit layer are arranged alternately.

8. The high temperature resistant PCB circuit board according to claim 1, characterized in that: A through hole is formed through the heat dissipation copper layer.

9. The high temperature resistant PCB circuit board according to claim 8, characterized in that: The through hole is provided with heat conducting copper.

10. The high temperature resistant PCB circuit board according to claim 8, characterized in that: A heat-conducting column is arranged in the through hole.

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