Function integrated satellite sandwich structural panel with electronics and thermal management elements

Abstract

The utility model provides a function integration satellite sandwich structure plate with electronic equipment and a thermal management element, which comprises an upper layer plate, a lower layer plate and a support structure positioned between the upper layer plate and the lower layer plate, and the upper layer plate, the lower layer plate and the support structure are fixedly connected; the supporting structure further comprises an electronic component, a heat management element and a wire cable, the electronic component and the heat management element are arranged in the structural plate, the upper surface and the lower surface of the electronic component and the upper surface and the lower surface of the heat management element are flush with the heat management element, and the wire cable is buried in the supporting structure. The satellite sandwich structure plate can reduce the wiring and fixing procedures of wires and cables, optimize the technological process and reduce the production cost.

Description

Technical Field

[0001] The utility model relates to the technical field of sandwich structure plates, in particular to a functionally integrated satellite sandwich structure plate with electronic equipment and thermal management elements. Background Art

[0002] Currently, many companies around the world are working to build constellations consisting of 600 to 4,000 low earth orbit (LEO) satellites or up to 7,500 very low earth orbit (VLEO) satellites, which can be used as data transmission networks to achieve fast Internet access worldwide. The cost structure and usage scenarios of the small satellites that make up the constellation have changed compared to traditional satellites. The service life of small satellites is significantly shortened, and a higher probability of failure can be accepted, which has led to huge changes in the architecture and production of satellites.

[0003] In the future mass production of satellites for giant constellations, reducing the size and weight of satellites will greatly reduce production and launch costs. In traditional satellite structures, wires and cables may be vibrated during launch and impacted during separation, causing entanglement, abrasions or damage to the cables. To avoid this, wires and cables need to be properly routed and fixed outside the structural plate, which increases production cycles and costs. At the same time, in order to dissipate the heat generated during the operation of electronic components and prevent components from failing due to excessive temperature, thermal management components such as heat sinks and heat dissipation holes need to be added.

[0004] Figure 1 The satellite structural plate assembled with electronic components in the prior art, the structural plate is composed of upper and lower skin layers 1, 2 and a honeycomb core 3 in the middle to form a sandwich structure, the thermal management element 6 is embedded in the middle of the honeycomb core, the electronic components 4 are placed on the outside of the structural plate and connected to the structural plate by screw connection, and the wiring and fixing scheme of the wires and cables 5 need to be designed. The traditional assembly method has a complex process flow and increases the volume and mass of the satellite, which is not conducive to the mass production and launch of small satellites. Utility Model Content

[0005] In view of the defects in the prior art, the purpose of the utility model is to provide a satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements.

[0006] According to the utility model, a functional integrated satellite sandwich structure board with electronic equipment and thermal management elements includes: an upper plate, a lower plate, and a support structure located between the upper plate and the lower plate, wherein the upper plate, the lower plate and the support structure are fixedly connected;

[0007] It also includes electronic components, thermal management elements and wires and cables. The electronic components and thermal management elements are arranged in the structural plate, and the upper and lower surfaces of the electronic components and thermal management elements are flush with the thermal management elements. The wires and cables are buried in the supporting structure.

[0008] Preferably, foam glue is provided around the structural plate, and the upper plate, the lower plate and the supporting structure are fixedly connected by the foam glue.

[0009] Preferably, the foamed adhesive is integrally formed by vacuum hot pressing.

[0010] Preferably, foam glue is provided around the electronic components and the thermal management element, and is fixed by the foam glue.

[0011] Preferably, positioning screws are provided on the structural plate, and the upper plate, the lower plate and the supporting mechanism are fixedly connected by the positioning screws.

[0012] Preferably, adhesive films are provided on the inner sides of the upper plate and the lower plate.

[0013] Preferably, the upper surface of the wire and cable is bonded to the upper plate by adhesive film.

[0014] Preferably, the supporting structure is made of honeycomb core material or foam sandwich panel.

[0015] Preferably, the upper plate and the lower plate are made of fiber composite plates or metal skins.

[0016] A satellite provided by the utility model adopts the above-mentioned functionally integrated satellite sandwich structure panel with embedded electronic equipment and thermal management elements.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] 1. The satellite sandwich structure plate disclosed in the utility model can reduce the wiring and fixing process of wires and cables, optimize the process flow, and reduce production costs;

[0019] 2. The satellite sandwich structure plate disclosed by the utility model can integrate electronic components into the interior of the structure plate, reduce the volume of the satellite, optimize the structural design, and facilitate the batch launch of small satellites;

[0020] 3. After the electronic components of the utility model are buried inside the sandwich board, they are closer to the thermal management components, which is conducive to heat dissipation and makes thermal control simpler;

[0021] 4. The electronic components in the satellite sandwich structure plate disclosed by the utility model are integrated into the structure plate without occupying the space of the satellite body, and technical functions such as embedded optical fiber can be added to realize functions such as health detection and self-repair. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0023] Figure 1 It is a structural schematic diagram of a satellite sandwich structure plate in the prior art;

[0024] Figure 2 The utility model is a schematic diagram of the structure of the satellite sandwich structure plate disclosed in the present invention.

[0025] Description of reference numerals:

[0026] Upper board 1 Wire and cable 5

[0027] Adhesive film 2 Thermal management element 6

[0028] Support structure 3 Foam 7

[0029] Electronic components 4 Lower layer board 8 DETAILED DESCRIPTION

[0030] The utility model is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the utility model, but do not limit the utility model in any form. It should be pointed out that for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the utility model. These all belong to the protection scope of the utility model.

[0031] The utility model discloses a functional integrated satellite sandwich structure board with electronic equipment and thermal management elements, including: an upper plate 1, a lower plate 8, and a support structure 3 located between the upper plate 1 and the lower plate 8, wherein the upper plate 1, the lower plate 8 and the support structure are fixedly connected. It also includes electronic components 4, thermal management elements 6 and wires and cables 5, wherein the electronic components 4 and the thermal management elements 6 are arranged in the structure board, and the upper and lower surfaces of the electronic components 4 and the thermal management elements 6 are flush with the thermal management elements 6, and the wires and cables 5 are buried in the support structure 3. The assembly position of the embedded electronic components 4 and the thermal management elements 6 is inside the structure board, and the assembly and positioning are completed before the integrated molding.

[0032] Foam glue 7 is arranged around the structural plate, and the upper plate 1, the lower plate 8 and the supporting structure are fixedly connected by the foam glue 7. After the assembly of the components is completed, the foam glue 7 is integrated by vacuum hot pressing.

[0033] In order to enhance the structural stability of the electronic components 4 and the thermal management element 6 , a foam glue 7 is provided around the electronic components 4 and the thermal management element 6 , and the electronic components 4 and the thermal management element 6 are fixed by the foam glue 7 .

[0034] During the assembly process, positioning screws are used on the structural plate to ensure the position accuracy of the components. The upper plate 1, the lower plate 8 and the supporting structure 3 are fixedly connected by the positioning screws to prevent the components from being offset during hot pressing.

[0035] The inner side surfaces of the upper plate 1 and the lower plate 8 are provided with adhesive films 2, and the support structure 3 is machined to ensure that the upper surface of the wires and cables 5 is glued to the upper plate 1 through the adhesive film 2 to prevent the wires and cables 5 from being deflected or damaged due to vibration and impact during the launch process.

[0036] In a preferred embodiment, the support structure 3 is made of honeycomb core material or foam sandwich panel. The upper plate 1 and the lower plate 8 are made of fiber composite plate or metal skin (such as aluminum skin). Fiber composite plate is a light, high-strength material with high dimensional stability, which can ensure the stable operation of the functional integrated structural plate on track.

[0037] The structural design of the functional integrated satellite sandwich structure panel requires the completion of model simulation and optimization, and the product needs to complete the identification tests of thermal vacuum cycle, resonant frequency, sine, quasi-static load and impact load.

[0038] The utility model also discloses a satellite, which adopts the functionally integrated satellite sandwich structure plate with embedded electronic equipment and thermal management element 6.

[0039] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other at will.

Claims

1. A satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements, characterized in that: include: An upper plate, a lower plate, and a supporting structure located between the upper plate and the lower plate, wherein the upper plate, the lower plate and the supporting structure are fixedly connected; It also includes electronic components, thermal management elements and wires and cables. The electronic components and thermal management elements are arranged in the structural plate, and the upper and lower surfaces of the electronic components and thermal management elements are flush with the thermal management elements. The wires and cables are buried in the supporting structure.

2. The satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements according to claim 1, characterized in that: Foam glue is arranged around the structural plate, and the upper plate, the lower plate and the supporting structure are fixedly connected by the foam glue.

3. The functionally integrated satellite sandwich structure panel with electronic equipment and thermal management elements according to claim 2, characterized in that: The foaming adhesive is integrally formed by vacuum hot pressing.

4. The satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements according to claim 1, characterized in that: The electronic components and the thermal management element are surrounded by foam glue and fixed by the foam glue.

5. The functionally integrated satellite sandwich structure panel with electronic equipment and thermal management elements according to claim 1, characterized in that: The structural plate is provided with positioning screws, and the upper plate, the lower plate and the supporting mechanism are fixedly connected by the positioning screws.

6. The satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements according to claim 1, characterized in that: The inner sides of the upper plate and the lower plate are provided with adhesive films.

7. The satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements according to claim 6, characterized in that: The upper surface of the electric wire and cable is bonded to the upper plate through an adhesive film.

8. The satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements according to claim 1, characterized in that: The supporting structure adopts honeycomb core material or foam sandwich panel.

9. The satellite sandwich structure panel with integrated functions of electronic equipment and thermal management elements according to claim 1, characterized in that: The upper plate and the lower plate are made of fiber composite plates or metal skins.

10. A satellite, characterized in that: A functionally integrated satellite sandwich structure panel having electronic equipment and thermal management elements as described in any one of claims 1 to 9 is used.

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