Welding wire copper plating device

Abstract

The utility model discloses a welding wire copper plating device which comprises a copper plating tank, guide wheels, a lifting plate, a mixing tank, a solute tank, a solvent tank and a sulfuric acid tank, an air cylinder is arranged on the lower portion of the copper plating tank, and the bottom of the copper plating tank is further connected with the mixing tank through a return pipe. And a copper sulfate content detector, a ferrous ion detector and a sulfuric acid concentration meter are respectively arranged on the return pipe and are used for detecting the copper ion concentration, the ferrous ion concentration and the hydrogen ion concentration in the plating solution. A copper sulfate solution and a sulfuric acid solution are added into the mixing pool in time to balance the ion change condition in the solution, it is guaranteed that the ion concentration in the plating solution is in the optimal copper plating state, and the copper plating stability during copper plating can be effectively improved; when the concentration of ferrous ions exceeds the standard, the lifting plate is lifted to divide the copper plating tank into two chambers, and then a new plating solution is added, so that the solution can be replaced without shutdown, and the working efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding wire processing, in particular to a welding wire copper plating device. Background Art

[0002] The main purpose of copper plating welding wire is corrosion resistance, because the main component of welding wire is steel, which is easy to rust and corrode when exposed to the atmosphere. A layer of copper plating on the surface can effectively extend the shelf life. In addition, it can enhance the conductivity.

[0003] Welding wire is a metal wire welding material used as filler metal or as a conductive material. In gas welding and tungsten arc welding, welding wire is used as filler metal; in submerged arc welding, electroslag welding and other metal arc welding, welding wire is both filler metal and conductive electrode. The surface of welding wire is not coated with anti-oxidation flux.

[0004] Generally, welding wires are plated with copper by chemical copper plating. First, a plating solution of a certain concentration is prepared. The welding wire passes through a copper sulfate solution to form a copper plating layer on the surface of the welding wire through a chemical reaction. During the process, the copper ion content in the plating solution continues to decrease, and the ferrous ion concentration will gradually increase. At the same time, in order to ensure the copper plating effect, the hydrogen ions in the solution also need to be controlled. The concentration of copper ions can be adjusted by adding additional high-concentration copper sulfate solution. If the ferrous ions reach a certain concentration in the plating solution, the copper plating results will directly deteriorate. Therefore, during the copper plating process, after working for a period of time, it is necessary to stop the machine to completely drain the liquid in the copper plating tank, and then add new plating solution to restart. This has a certain impact on the work and reduces work efficiency. Utility Model Content

[0005] (I) Technical solution

[0006] In order to solve the above technical problems, the utility model provides a welding wire copper plating device.

[0007] The specific technical solutions are:

[0008] A welding wire copper plating device, comprising

[0009] The copper plating tank is used to store the plating solution. Both ends of the copper plating tank are provided with perforations, and the welding wire passes through the perforations;

[0010] A guide wheel is fixed inside the copper plating tank, and is used to control the direction in which the welding wire passes through the copper plating tank and to fix the welding wire; a lifting plate is located inside the copper plating tank, and a cylinder is provided at the lower part of the copper plating tank, and the lifting plate is driven up or down by the cylinder to separate the inside of the copper plating tank;

[0011] A mixing tank, connected to the copper plating tank through a liquid adding pipe, and a solenoid valve is provided at the connection position between the liquid adding pipe and the copper plating tank; a solute tank, a solvent tank and a sulfuric acid tank, wherein the mixing tank is connected to the solute tank, the sulfuric acid tank and the solvent tank respectively, and the solvent tank is also connected to the solute tank;

[0012] The bottom of the copper plating tank is also connected to the mixing tank through a reflux pipe, and a copper sulfate content detector, a ferrous ion detector and a sulfuric acid concentration meter are respectively provided on the reflux pipe to detect the copper ion concentration, the ferrous ion concentration and the hydrogen ion concentration in the plating solution. Further, the reflux pipe is also connected to an evaporator and a freezing crystallizer in sequence through a first three-way valve, the evaporator concentrates the plating solution, and the concentration multiple is 1 times, and the freezing crystallizer is used to precipitate the solute in the plating solution, specifically ferrous sulfate and a small amount of copper sulfate.

[0013] Furthermore, a laser diffraction diameter gauge is provided at the outlet of the copper plating tank, and the laser diffraction diameter gauge is used to detect the diameter of the welding wire after copper plating.

[0014] Furthermore, there are multiple copper plating tanks which are connected in series in sequence, and the bottom of each copper plating tank is connected to the mixing tank through a reflux pipe, and the top is connected to the mixing tank through a liquid adding pipe.

[0015] Furthermore, guide wheels are provided on both sides of the upper part of the lifting plate, and the welding wire passes through the upper part of the guide wheels.

[0016] Furthermore, there are multiple perforations on both sides of the copper plating tank, and the positions of the perforations correspond to the positions of the grooves on the guide wheel.

[0017] Furthermore, a heating wire is provided inside the copper plating tank, and the heating wire is arranged in an S shape.

[0018] (II) Beneficial effects

[0019] Compared with the prior art, the technical solution proposed by the utility model has the following advantages:

[0020] (1) The mixing pool and the copper plating tank form a loop, and the concentrations of copper ions, ferrous ions and hydrogen ions in the plating solution are monitored in real time, and copper sulfate solution and sulfuric acid solution are added to the mixing pool in time to balance the ion changes in the solution, ensuring that the ion concentration in the plating solution is in the optimal copper plating state, which can effectively improve the stability of copper plating during copper plating;

[0021] (2) When the concentration of ferrous ions in the solution exceeds the standard, the lifting plate rises to separate the copper plating tank into two chambers. The solution in one of the chambers is discharged into the evaporator and cooling crystallizer for crystallization, and then new plating solution is added. In this way, the solution can be replaced without stopping the machine, effectively improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0023] Figure 1 It is a schematic diagram of the copper plating tank structure;

[0024] Figure 2 It is a top view of the copper plating tank;

[0025] Figure 3 This is a cross-sectional view of a copper plating tank;

[0026] Figure 4 It is a schematic diagram of the structure of the copper plating device;

[0027] In the figure: 1-copper plating tank, 2-guide wheel, 3-lifting plate, 4-cylinder, 5-mixing tank, 6-liquid adding pipe, 7-solvent valve, 8-solute tank, 9-solvent tank, 10-sulfuric acid tank, 11-reflux pipe, 12-copper sulfate content detector, 13-ferrous ion detector, 14-sulfuric acid concentration meter, 15-first three-way valve, 16-evaporator, 17-freezing crystallizer, 18-laser diffraction diameter measuring instrument, 19-electric heating wire. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. The described embodiments are only part of the utility model embodiments, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the related prior art, generally, the welding wire is copper-plated by chemical copper plating. First, a plating solution of a certain concentration is prepared. The conventional copper plating solution is prepared with copper sulfate pentahydrate with a purity of 98.5%, and the concentration is controlled at 80-120 g / L. The welding wire passes through the copper sulfate solution to form a copper plating layer on the surface of the welding wire through a chemical reaction. During the process, the copper ion content in the plating solution continues to decrease, and the ferrous ion concentration will gradually increase. When the concentration is too high, it will directly lead to a poor copper plating effect. Generally, the ferrous sulfate concentration is controlled to be lower than 80 g / L. At the same time, in order to ensure the copper plating effect, the hydrogen ions in the solution also need to be controlled. Generally, a 60%-65% sulfuric acid solution is used to control the plating solution concentration to 60-100 g / L. The concentration of copper ions can be adjusted by additionally adding a high-concentration copper sulfate solution. If the ferrous ions reach a certain concentration in the plating solution, it is necessary to stop the machine to completely discharge the liquid in the copper plating tank, and then add a new plating solution to restart, which has a certain impact on the work and reduces the work efficiency.

[0030] In order to solve the problems existing in the related prior art, the utility model proposes a welding wire copper plating device. The principle and structure of the utility model are described in detail below in conjunction with the drawings and embodiments.

[0031] Embodiment 1

[0032] See also Figure 1-Figure 4 The utility model proposes a welding wire copper plating device, comprising a copper plating tank 1 for storing plating solution, with through holes at both ends of the copper plating tank 1, through which the welding wire passes; a guide wheel 2 fixed inside the copper plating tank 1, for controlling the direction in which the welding wire passes through the copper plating tank 1 and fixing the welding wire; a lifting plate 3, located inside the copper plating tank 1, and provided with a cylinder 4 at the lower part of the copper plating, which drives the lifting plate 3 to rise or fall under the action of the cylinder 4, for dividing the inside of the copper plating tank 1; a mixing tank 5, connected to the copper plating tank 1 through a liquid adding pipe 6, and a solenoid valve 7 is provided at the connection position between the liquid adding pipe 6 and the copper plating tank 1; a solute tank 8, a solvent tank 9 and a sulfuric acid tank 10, and the mixing tank 5 is respectively It is connected to the solute pool 8, the sulfuric acid pool 10 and the solvent pool 9, and the solvent pool 9 and the solute pool 8 are also connected to each other; the bottom of the copper plating tank 1 is also connected to the mixing pool 5 through a reflux pipe 11, and the reflux pipe 11 is respectively provided with a copper sulfate content detector 12, a ferrous ion detector 13 and a sulfuric acid concentration meter 14, which are used to detect the copper ion concentration, ferrous ion concentration and hydrogen ion concentration in the plating solution. At the same time, the reflux pipe 11 is also connected to an evaporator 16 and a freezing crystallizer 17 in sequence through a first three-way valve 15. The evaporator 16 concentrates the plating solution, and the concentration multiple is 1 times. The freezing crystallizer 17 is used to precipitate the solute in the plating solution, specifically ferrous sulfate and a small amount of copper sulfate.

[0033] A laser diffraction diameter gauge 18 is provided at the outlet of the copper plating tank 1. The laser diffraction diameter gauge 18 is used to detect the diameter of the welding wire after copper plating. There are multiple copper plating tanks 1 which are connected in series in sequence. The bottom of each copper plating tank 1 is connected to the mixing tank 5 through a reflux pipe 11, and the upper part is connected to the mixing tank 5 through a liquid adding pipe 6.

[0034] Guide wheels 2 are provided on both sides of the upper part of the lifting plate, and the welding wire passes through the upper part of the guide wheels.

[0035] There are multiple perforations on both sides of the copper plating tank 1, and the positions of the perforations correspond to the positions of the grooves on the guide wheel 2.

[0036] A heating wire 19 is arranged inside the copper plating tank 1 and is arranged in an S shape.

[0037] The specific working principle is as follows: First, pass the welding wire to be copper-plated through the through hole at the front end of the copper-plating tank 1, and then pass through several guide wheels. For details, please refer to Figure 3 , first pass through the upper part of the guide wheel 2 at the corresponding height of the through hole, then pass downward through a group of corresponding upper and lower guide wheels, and then pass horizontally through the inside of the copper plating tank 1. When the copper plating tank 1 works normally, the cylinder 4 drives the lifting plate 3 to the lowest point. At this time, the welding wire passes through the upper part of the guide wheel 2 on the upper part of the lifting plate 3. When it reaches the other end of the copper plating tank 1, it is vertically upward under the action of the guide wheel 2 and then bent to the horizontal to enter the next copper plating tank 1. According to the specific process requirements, multiple copper plating tanks 1 can be set in series for use. At the same time, in order to improve efficiency, multiple welding wires can be inserted at the same time for copper plating. Therefore, in order to ensure that the welding wires will not be entangled with each other, multiple guide wheels 2 can be set on the same guide roller and a groove of a certain depth can be opened on the guide wheel to ensure that the welding wire will not fall off the guide wheel.

[0038] When the welding wire passes through the copper plating tank filled with plating solution, the welding wire reacts chemically with the plating solution to form a copper plating layer on the surface of the welding wire. The time it takes to pass through the copper plating tank can affect the thickness of the coating. The passing speed of the welding wire is determined by the traction mechanism at the rear end. The faster the traction speed, the shorter the reaction time. Conversely, the slower the traction speed, the longer the reaction time and the thicker the coating. Therefore, a diameter gauge, specifically a laser diffraction diameter gauge 18, can be set at the end of the copper plating tank 1. The thickness of the welding wire coating is confirmed by measuring the diameter of the welding wire after copper plating. The data measured by the laser diffraction diameter gauge 18 is transmitted to the control system. When the diameter is greater than the preset value, it indicates that the coating thickness is too large. At this time, the traction speed can be increased. When the coating thickness is less than the preset value, the traction speed can be reduced.

[0039] During the copper plating process, the sulfuric acid concentration, copper sulfate concentration and ferrous ion concentration are generally controlled within a standard range. At this time, the plating solution in the copper plating tank 1 flows into the mixing tank 5 through the bottom reflux pipe 11, and then the plating solution in the mixing tank 5 is pumped into the copper plating tank 1 through the liquid adding pipe 6 to form a circulating flow. During the process, the copper ion concentration, ferrous ion concentration and hydrogen ion concentration changes in the plating solution are monitored in real time by the copper sulfate content detector 12, ferrous ion detector 13 and sulfuric acid concentration meter 14 on the reflux pipe 11. The above three detectors are all equipment that can be directly purchased on the market and are not limited too much here. For example, the copper sulfate content detector can adopt the triple measurement and control MS-HD-300 online copper sulfate concentration detector, as well as the online detection equipment for determining ferrous sulfate by colorimetry and the conventional sulfuric acid concentration meter 14.

[0040] The data measured by the copper sulfate content detector 12, the ferrous ion detector 13 and the sulfuric acid concentration meter 14 are connected to the control unit. After copper plating for a period of time, when the copper sulfate content is too low, the solvent pool 9 is started by the control unit to pump the solvent into the solute pool 8, and the solute pool 8 is filled with a saturated copper sulfate solution. Then the diluted copper sulfate solution in the solute pool 8 is pumped into the mixing pool 5, and a circulating water flow is formed by the mixing pool 5 and the copper plating tank 1 to add copper sulfate to the plating solution. Similarly, when the sulfuric acid content is too low, the control unit controls the pump body on the sulfuric acid pool 10 to pump the solution in the sulfuric acid pool 10 into the mixing pool 5, and a circulating water flow is formed by the mixing pool 5 and the copper plating tank 1 to add the sulfuric acid solution to the plating solution. The above pump body is a conventional setting in the field and is not limited too much here.

[0041] During the copper plating process, the ferrous ion content will only increase. When the ferrous ion content is too high, the copper plating cannot be completed. Therefore, the plating solution in the copper plating tank can be replaced when the ferrous ion content is lower than the limit value. The specific operation is as follows:

[0042] Conventionally, the concentration of ferrous sulfate is required to be lower than 80g / L. It can be set that when the concentration of ferrous sulfate reaches 75g / L or 70g / L, the control system controls the cylinder 4 to lift the lifting plate 3, and the solenoid valve 7 is closed. At this time, the copper plating tank 1 is divided into two chambers. At the same time, the first three-way valve 15 controls the flow direction of the reflux pipe 11 to first pump the plating solution in one chamber into the evaporator, and at the same time add solvent, copper sulfate solution and sulfuric acid to the mixing tank 5, that is, automatically complete the purpose of configuring a new electroplating solution. After the drainage is completed, the solenoid valve 7 is opened, and the copper plating tank 1 is filled with liquid on the side where the drainage is completed. After the filling is completed, the lifting plate 3 The plating solution on the other side is replaced by the same operation. At this time, both sides of the corresponding lifting plate 3 at the lower part of the copper plating tank 1 need to be connected to the reflux pipe, and the solenoid valve 7 on the corresponding upper liquid adding pipe can be opened and closed respectively. The plating solutions on both sides can also be directly mixed for use, that is, after completing the liquid replacement on one side, the control cylinder 4 drives the lifting plate 3 to descend, and the plating solutions on both sides are mixed, and copper plating can also be performed normally. During the process, copper plating cannot be performed normally in half of the stroke in the plating tank. At this time, the diameter change measured by the laser diffraction diameter gauge 18 will be less than the set value, and the traction speed is controlled to decrease accordingly to increase the residence time of the welding wire in the copper plating tank 1 to ensure normal copper plating.

[0043] The plating solution entering the evaporator 16 will be evaporated and concentrated, and the concentration multiple is 1. The concentrated plating solution enters the freezing crystallizer 17 to precipitate the solute. The specific principle is that the solubility of copper sulfate changes less with temperature than that of ferrous sulfate. After the plating solution is frozen and cooled, a large amount of ferrous sulfate and a small amount of copper sulfate are precipitated, and then collected separately. The copper sulfate can be reused.

[0044] A loop is formed by the mixing pool and the copper plating tank, and the concentrations of copper ions, ferrous ions and hydrogen ions in the plating solution are monitored in real time. Copper sulfate solution and sulfuric acid solution are added to the mixing pool in time to balance the changes in ions in the solution, ensuring that the ion concentration in the plating solution is in the optimal copper plating state, which can effectively improve the stability of copper plating during copper plating;

[0045] When the concentration of ferrous ions in the solution exceeds the standard, the lifting plate rises to separate the copper plating tank into two chambers. The solution in one of the chambers is discharged into the evaporator and cooling crystallizer for crystallization, and then new plating solution is added. In this way, the solution can be replaced without stopping the machine, effectively improving work efficiency.

[0046] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A welding wire copper plating device, characterized in that: include The copper plating tank (1) is used to store plating solution, and both ends of the copper plating tank (1) are provided with through holes, through which the welding wire passes; A guide wheel (2) is fixed inside the copper plating tank (1) and is used to control the direction in which the welding wire passes through the copper plating tank (1) and to fix the welding wire; A lifting plate (3) is located inside the copper plating tank (1), and a cylinder (4) is provided at the bottom of the copper plating tank (1). The lifting plate (3) is driven to rise or fall under the action of the cylinder (4) to separate the inside of the copper plating tank (1); A mixing tank (5) is connected to the copper plating tank (1) via a liquid adding pipe (6), and a solenoid valve (7) is provided at the connection position between the liquid adding pipe (6) and the copper plating tank (1); A solute pool (8), a solvent pool (9) and a sulfuric acid pool (10), wherein the mixing pool (5) is connected to the solute pool (8), the sulfuric acid pool (10) and the solvent pool (9) respectively, and the solvent pool (9) and the solute pool (8) are also connected to each other; The bottom of the copper plating tank (1) is also connected to the mixing tank (5) via a reflux pipe (11), and the reflux pipe (11) is respectively provided with a copper sulfate content detector (12), a ferrous ion detector (13) and a sulfuric acid concentration meter (14) for detecting the copper ion concentration, the ferrous ion concentration and the hydrogen ion concentration in the plating solution.

2. A welding wire copper plating device according to claim 1, characterized in that: The reflux pipe (11) is also connected in sequence to an evaporator (16) and a freezing crystallizer (17) via a first three-way valve (15); the evaporator (16) concentrates the plating solution, and the concentration multiple is 1; the freezing crystallizer (17) is used to precipitate solutes in the plating solution, specifically ferrous sulfate and a small amount of copper sulfate.

3. A welding wire copper plating device according to claim 1, characterized in that: A laser diffraction diameter gauge (18) is provided at the outlet of the copper plating tank (1), and the laser diffraction diameter gauge (18) is used to detect the diameter of the welding wire after copper plating.

4. A welding wire copper plating device according to claim 1, characterized in that: There are multiple copper plating tanks (1) which are connected in series in sequence. The bottom of each copper plating tank (1) is connected to the mixing tank (5) via a reflux pipe (11), and the top is connected to the mixing tank (5) via a liquid adding pipe (6).

5. A welding wire copper plating device according to claim 1, characterized in that: Guide wheels (2) are provided on both sides of the upper part of the lifting plate, and the welding wire passes through the upper part of the guide wheels.

6. A welding wire copper plating device according to claim 1, characterized in that: The copper plating tank (1) has a plurality of perforations on both sides, and the positions of the perforations correspond to the positions of the grooves on the guide wheel (2).

7. A welding wire copper plating device according to claim 1, characterized in that: A heating wire (19) is arranged inside the copper plating tank (1), and the heating wire (19) is arranged in an S shape.

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