Improved electroplating bath structure based on ultrathin carrier copper foil production

Abstract

The utility model discloses an electroplating bath improved structure based on ultrathin carrier copper foil production, which is characterized in that two anode plates are arranged in an electroplating bath, a submerged roller is arranged between the two anode plates, a conductive roller and an upper guide roller are respectively arranged at the upstream and the downstream of the electroplating bath, one side of the carrier copper foil close to the anode plates is a treatment surface, and the other side of the carrier copper foil is a non-treatment surface; the improved structure of the electroplating bath comprises an outlet spraying pipe which is arranged on one side, close to an upper guide roller, of the electroplating bath, and the outlet spraying pipe is used for spraying a copper sulfate solution on a treatment surface. The outlet spraying pipe continuously sprays a copper sulfate solution with the temperature consistent with that of the copper sulfate electrolyte on the treatment surface, so that the phenomenon that crystals are separated out on the surface of the carrier copper foil due to the fact that the temperature of the surface of the raw foil is too fast and the copper ion concentration in the copper sulfate electrolyte is relatively high can be effectively prevented; the surface of the ultrathin carrier copper foil does not have the defects of pits, pressure points and the like, the production yield is high, and the practicability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of ultra-thin carrier copper foil electroplating, in particular to an improved electroplating tank structure based on the production of ultra-thin carrier copper foil. Background Art

[0002] In recent years, the development trend of electronic products such as mobile phones and computers has shown a trend of becoming lighter, thinner and more highly integrated. Printed circuit boards, an important component of electronic products, have also developed in the direction of being lighter, thinner, shorter, smaller, more multifunctional and with higher added value. Among them, electrolytic copper foil is the basic material of PCB boards, so the development and research of electrolytic copper foil tends to be thinner and have higher performance.

[0003] As we all know, the thinner the copper foil is, the more likely it is to curl and bend during production and application. It is also not easy to transport over long distances and store for a long time, which brings great trouble to the back-end application. In the prior art, the emergence of ultra-thin carrier copper foil can effectively solve this series of problems, making it a focus of industry development and a hot spot in market demand. Ultra-thin carrier copper foil can be used to make high-precision printed circuit boards, global fine HDI substrates and IC substrates, and in recent years, with the development of the modified semi-additive process (mSAP) manufacturing process, the demand for it has also increased year by year.

[0004] In the production process of ultra-thin carrier copper foil, it is necessary to electroplate the carrier copper foil to form a 3-5μm raw foil, and then undergo rough curing, anti-oxidation and silane treatment in the later stage. This requires that the processing machine line speed of the ultra-thin carrier cannot be too high. If the line speed is too fast, a coating of sufficient thickness cannot be formed on the surface of the carrier copper foil within the specified time. However, due to the high copper ion concentration of the copper sulfate electrolyte in the electroplating tank, when the processing machine line speed is low, the copper sulfate crystals in the copper sulfate electrolyte retained on the surface of the ultra-thin carrier copper foil leaving the electroplating tank will precipitate due to cooling (the solubility of copper sulfate in the solvent is closely related to temperature. Generally, the solubility increases with increasing temperature. When cooling, the solubility decreases, and the solution becomes supersaturated and crystals precipitate.). Once copper sulfate crystals are precipitated, pits, pressure points and other defects will appear on the surface of the ultra-thin carrier copper foil, affecting the yield rate of production. Utility Model Content

[0005] In order to solve the above problems, the utility model proposes an improved structure of an electroplating tank based on the production of ultra-thin carrier copper foil.

[0006] The technical scheme adopted by the utility model is: an improved structure of an electroplating tank based on the production of ultra-thin carrier copper foil, wherein two mutually spaced anode plates are arranged in the electroplating tank, a submerged roller is arranged between the two anode plates, a conductive roller and an upper guide roller are arranged upstream and downstream of the electroplating tank respectively, the conductive roller, the submerged roller and the upper guide roller are used to cooperate with each other to complete the material guiding of the carrier copper foil, the side of the carrier copper foil close to the anode plate is set as the treated surface, and the side of the carrier copper foil away from the anode plate is set as the non-treated surface, the side of the electroplating tank close to the conductive roller is provided with an inlet spray pipe, and the inlet spray pipe is used to spray copper sulfate solution on the non-treated surface, and the improved structure of the electroplating tank comprises:

[0007] An outlet spray pipe is arranged on one side of the electroplating tank close to the upper guide roller, and the outlet spray pipe is used to spray copper sulfate solution onto the treatment surface.

[0008] Several optional methods are also provided below, but they are not intended to be additional limitations on the above-mentioned overall solution, but are merely further supplements or preferences. Under the premise that there are no technical or logical contradictions, each optional method can be combined with the above-mentioned overall solution separately, and multiple optional methods can also be combined.

[0009] Preferably, the temperature of the copper sulfate solution in the outlet spray pipe is consistent with the temperature of the copper sulfate electrolyte in the electroplating tank.

[0010] Preferably, the outlet spray pipe is provided with a plurality of spray holes spaced apart from each other along its length.

[0011] Preferably, the plurality of liquid spray holes are evenly spaced and arranged.

[0012] Preferably, the spray pipe is arranged along the width direction of the carrier copper foil.

[0013] More preferably, a plurality of the liquid spray holes are arranged in a straight line and together form a spray area, and the spray area completely covers the width of the carrier copper foil.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] The utility model arranges an outlet spray pipe at one side of the outlet of the electroplating tank. After the electroplating of the raw foil of the carrier copper foil is completed and the copper sulfate electrolyte in the electroplating tank is left, the outlet spray pipe continuously sprays the copper sulfate solution having the same temperature as the copper sulfate electrolyte on the processing surface. This can effectively prevent the phenomenon that the copper ion concentration in the copper sulfate electrolyte is high due to the excessively rapid cooling of the raw foil surface, which in turn causes the precipitation of copper sulfate crystals on the surface of the carrier copper foil. This solves the problem of defects such as pits and pressure points on the surface of the ultra-thin carrier copper foil caused by crystallization to a certain extent, improves the yield rate of production, and has strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 The overall structure diagram of the electroplating tank with an improved structure of the electroplating tank in one embodiment of the present application;

[0018] Figure 2 It is an overall structural diagram of an electroplating tank without an improved structure of the electroplating tank installed in the prior art;

[0019] Figure 3 This is a schematic diagram of the distribution structure of the outlet spray pipe and the carrier copper foil after electroplating in one embodiment of the present application;

[0020] Figure 4 It is a plan view of an outlet spray pipe and a carrier copper foil after electroplating in one embodiment of the present application.

[0021] Marked in the attached drawing: 1-electroplating tank, 2-anode plate, 3-conductive roller, 4-submerged roller, 5-upper guide roller, 6-carrier copper foil, 7-inlet spray pipe, 8-outlet spray pipe, 801-spray hole.

[0022] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0025] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0026] Specific implementation plan: see Figure 1-Figure 4 The utility model is an improved structure of an electroplating tank based on the production of ultra-thin carrier copper foil. Two mutually spaced anode plates 2 are arranged in the electroplating tank 1, and a submerged roller 4 is arranged between the two anode plates 2. A conductive roller 3 and an upper guide roller 5 are respectively arranged upstream and downstream of the electroplating tank 1. The conductive roller 3, the submerged roller 4 and the upper guide roller 5 are used to cooperate with each other to complete the material guiding of the carrier copper foil 6. The side of the carrier copper foil 6 close to the anode plate 2 is set as the treated surface, and the side of the carrier copper foil 6 away from the anode plate 2 is set as the non-treated surface. An inlet spray pipe 7 is arranged on the side of the electroplating tank 1 close to the conductive roller 3. The inlet spray pipe 7 is used to spray copper sulfate solution on the non-treated surface. The improved structure of the electroplating tank 1 includes:

[0027] The outlet spray pipe 8 is arranged on one side of the electroplating tank 1 close to the upper guide roller 5, and the outlet spray pipe 8 is used to spray the copper sulfate solution onto the treatment surface.

[0028] The working principle of electroplating the surface of the carrier copper foil 6 to form raw foil is as follows: both the anode plate 2 and the carrier copper foil 6 are energized, the anode plate is connected to the positive pole of the power supply, and the carrier copper foil is connected to the negative pole of the power supply, and anode and cathode are formed between the anode plate 2 and the carrier copper foil 6. Through electrolysis, the copper ions in the copper sulfate electrolyte will be deposited on the treated surface of the carrier copper foil 6, and the raw foil can be formed by electroplating.

[0029] As a preferred implementation of this embodiment, the temperature of the copper sulfate solution in the outlet spray pipe 8 is consistent with the temperature of the copper sulfate electrolyte in the electroplating tank 1.

[0030] As we all know, the solubility of copper sulfate in a solvent is closely related to temperature. Generally, as the temperature rises, the solubility increases. Once the temperature drops, the solubility of copper sulfate also decreases, the solution becomes supersaturated and crystals precipitate.

[0031] In the production process of the ultra-thin carrier copper foil 6, after the electroplating work on the surface of the carrier copper foil 6 is completed through the electroplating tank 1, the carrier copper foil 6 with the electroplated raw foil needs to be further transported to the water washing process for water washing. Therefore, after the carrier copper foil 6 leaves the copper sulfate electrolyte in the electroplating tank 1, due to the low conveying line speed of the carrier copper foil 6 and the high copper ion concentration in the copper sulfate electrolyte, when the temperature of the carrier copper foil 6 decreases, the copper sulfate crystals remaining in the copper sulfate solution on the surface of the carrier copper foil 6 are easily precipitated due to the oversaturation of the solution.

[0032] In this example, see Figure 1 It can be seen that by setting an outlet spray pipe 8 on the side of the electroplating tank 1 close to the upper guide roller 5 (note that the outlet spray pipe 8 is located above the copper sulfate electrolyte in the electroplating tank 1 and between the electroplating tank 1 and the subsequent washing tank), the outlet spray pipe 8 continuously sprays the copper sulfate solution with the same temperature as the copper sulfate electrolyte in the electroplating tank 1 on the raw foil surface (treated surface) of the carrier copper foil 6 to prevent its temperature from dropping too fast. In this way, the copper sulfate crystals in the copper sulfate solution on the surface of the raw foil will not precipitate, which can effectively prevent defects such as pits and pressure points on the surface of the raw foil.

[0033] See also Figure 3 and Figure 4 It can be seen that in this embodiment, the outlet spray pipe 8 is provided with a plurality of spray holes 801 evenly spaced from each other along its length.

[0034] Then, in this embodiment, the spray pipes are arranged along the width direction of the carrier copper foil 6 .

[0035] In addition, a plurality of liquid spray holes 801 are arranged in a straight line and together form a spray area, and the spray area covers the entire width of the carrier copper foil 6 .

[0036] Here, the spray holes 801 are arranged evenly spaced along the extension direction of the spray pipe. When the carrier copper foil 6 is continuously transported forward, the spray liquid can be evenly sprayed on all positions of the raw foil-plated side (processed surface) of the carrier copper foil 6, ensuring that no crystals are precipitated at all positions.

[0037] The above description of an improved structure of an electroplating tank based on the production of ultra-thin carrier copper foil of the utility model is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the inventive concept of the utility model, or direct / indirect application in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. An improved structure of an electroplating tank based on the production of ultra-thin carrier copper foil, wherein two anode plates spaced apart from each other are arranged in the electroplating tank, a submerged roller is arranged between the two anode plates, a conductive roller and an upper guide roller are arranged upstream and downstream of the electroplating tank respectively, the conductive roller, the submerged roller and the upper guide roller are used to cooperate with each other to complete the material guiding of the carrier copper foil, the side of the carrier copper foil close to the anode plate is set as the treated surface, and the side of the carrier copper foil away from the anode plate is set as the non-treated surface, the side of the electroplating tank close to the conductive roller is provided with an inlet spray pipe, and the inlet spray pipe is used to spray copper sulfate solution on the non-treated surface, characterized in that The improved structure of the electroplating tank comprises: An outlet spray pipe is arranged on one side of the electroplating tank close to the upper guide roller, and the outlet spray pipe is used to spray copper sulfate solution onto the treatment surface.

2. The improved structure of the electroplating tank based on the production of ultra-thin carrier copper foil according to claim 1, characterized in that: The temperature of the copper sulfate solution in the outlet spray pipe is consistent with the temperature of the copper sulfate electrolyte in the electroplating tank.

3. An improved electroplating tank structure based on ultra-thin carrier copper foil production according to any one of claims 1-2, characterized in that: The outlet spray pipe is provided with a plurality of spray holes spaced apart from each other along its length.

4. The improved structure of the electroplating tank based on the production of ultra-thin carrier copper foil according to claim 3, characterized in that: The plurality of liquid spray holes are evenly spaced and arranged.

5. The improved structure of the electroplating tank based on the production of ultra-thin carrier copper foil according to claim 3, characterized in that: The spray pipe is arranged along the width direction of the carrier copper foil.

6. The improved structure of the electroplating tank based on the production of ultra-thin carrier copper foil according to claim 5, characterized in that: A plurality of the liquid spray holes are arranged in a straight line and together form a spray area, and the spray area completely covers the width direction of the carrier copper foil.

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