Integrated circuit chip processing and packaging device and packaging method thereof

Abstract

The invention relates to the technical field of integrated circuit chip packaging, in particular to an integrated circuit chip processing and packaging device and a packaging method thereof. Comprising a workbench, two sets of sliding grooves are symmetrically formed in the workbench, a first threaded rod is rotationally connected into one set of sliding grooves, and the first threaded rod is in transmission connection with a glue sealing assembly; the workbench is fixedly connected with a glue guide mechanism; the glue sealing assembly comprises two sets of movable supports, a second threaded rod is rotationally connected between the two sets of movable supports, and the second threaded rod is in threaded connection with a glue outlet mechanism. A plurality of integrated circuit chips are placed on a slide holder, clamping of the slide holder and a glue guide mechanism is completed, the integrated circuit chips are fixed in a glue injection space, and a first threaded rod and a second threaded rod drive a glue outlet mechanism to perform transverse and longitudinal intermittent movable glue injection until glue injection operation on all the integrated circuit chips is completed.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit chip packaging, and in particular relates to an integrated circuit chip processing and packaging device and a packaging method thereof. Background Art

[0002] As a type of chip packaging, glue sealing generally involves coating the integrated circuit chip with glue. When the glue solidifies, a hard protective layer will be formed on the periphery of the integrated circuit chip, thereby protecting the integrated circuit chip from damage.

[0003] After searching, in the prior art, the patent application publication number: CN118335676A, publication date: 2024.07.12, discloses a packaging device based on integrated circuit chips, which relates to the field of chip packaging, including: a chip packaging component and a chip adsorption component; the chip packaging component includes a packaging frame, a packaging support plate, a connecting tube, a push plate, and a vertical guide rod; the connecting tube slides and inserts in the middle of the groove of the packaging frame, and the two ends of the connecting tube are respectively screwed into the threaded slots of the packaging support plate and the push plate through threads, and the chip adsorption component includes a mounting frame, a lower pressure rod frame, a negative pressure cylinder, a hose, a grip, and a suction cup; the negative pressure cylinder is installed in the middle of the top of the mounting frame, and the middle of the top of the negative pressure cylinder is connected to the hose through a vertical pipe, the other end of the hose is connected to the grip, and the lower end of the grip is connected to the suction cup. The chip is sucked up by the negative pressure suction cup and placed on the packaging support plate, and the packaged chip can be pushed out from the middle of the clamp. The problem of short-circuit damage to the chip caused by hand contact and difficulty in removing the chip after packaging is solved.

[0004] However, the device still has the following defects: it solves the problem that the chip is easily damaged by short circuit caused by touching the chip with hands and the problem that the chip is difficult to remove after packaging. However, the device can only package one group of chips at a time, which makes the processing efficiency low and inconvenient to control the shape and size of the finished product after packaging, which leads to uneven finished products after packaging and affects the yield rate. Summary of the invention

[0005] In view of the above problems, the present invention provides an integrated circuit chip processing and packaging device and a packaging method thereof, comprising a workbench, wherein two groups of slide grooves are symmetrically provided on the workbench, a first threaded rod is rotatably connected in one group of the slide grooves, and a glue sealing component is transmission-connected to the first threaded rod; The workbench is provided with a lifting platform, a wafer carrier is placed in the lifting platform, a plurality of integrated circuit chips are placed in the wafer carrier, and a glue guide mechanism is fixedly connected to the workbench; The glue sealing assembly comprises two groups of movable brackets, a second threaded rod is rotatably connected between the two groups of movable brackets, and a glue discharging mechanism is threadedly connected to the second threaded rod; By placing multiple integrated circuit chips on the carrier stage and completing the clamping connection between the carrier stage and the glue guiding mechanism, the integrated circuit chips are fixed in the glue injection space, and the glue outlet mechanism is driven by the first threaded rod and the second threaded rod to perform intermittent movement in the horizontal and vertical directions to inject glue until the glue injection operation is completed for all the integrated circuit chips.

[0006] Furthermore, a glue storage barrel is provided on one side of the workbench, a first suction pump is provided on the glue storage barrel, a liquid outlet end of the first suction pump is connected to a spiral telescopic tube, and the other end of the spiral telescopic tube is connected to the glue sealing assembly.

[0007] Furthermore, a clearance groove is opened on the workbench, and a plurality of electric push rods are fixedly connected to the bottom end of the inner wall of the clearance groove. The output end of the electric push rod is transmission-connected to the lifting platform. The glue guiding mechanism is arranged directly above the clearance groove, and the glue guiding mechanism is movably connected to the carrier stage.

[0008] Furthermore, the glue guiding mechanism includes a support plate and a mounting block, the support plate is fixedly connected to a glue guiding mold, the mounting block is fixedly connected to a glue collecting pipe, a plurality of connecting plates are arranged between the glue collecting pipe and the glue guiding mold, a plurality of overflow pipes are connected between the glue collecting pipe and the glue guiding mold, and one end of the glue collecting pipe is connected to a second suction pump.

[0009] Furthermore, the glue guiding mold is provided with a plurality of glue loading grooves, and an overflow hole is provided between each two adjacent groups of the glue loading grooves. The wafer carrier is provided with a plurality of limit grooves, and shelves are provided at both ends of each group of limit grooves. The pins on both sides of the integrated circuit chip are respectively placed on a corresponding group of shelves. The bottom end of the glue guiding mold is provided with a plurality of sealing blocks, and the pins on both sides of the integrated circuit chip are clamped between the sealing blocks and the shelves.

[0010] Furthermore, the workbench is fixedly connected to a vertical plate, an L-shaped plate is installed on the vertical plate, a reduction motor is installed on the L-shaped plate, a first incomplete gear is rotatably connected to the vertical plate, the center of the first incomplete gear is transmission connected to the output end of the reduction motor, a first transmission gear is meshed with the first incomplete gear, and one end of a first threaded rod is fixedly connected to the center of the first transmission gear.

[0011] Furthermore, a linkage frame is fixedly connected between the top ends of the two groups of movable brackets, a limiting shaft is fixedly connected between the two groups of movable brackets, the limiting shaft is movably fitted with the glue discharge mechanism, and a toothed plate is also fixedly connected between the two groups of movable brackets. A servo motor is installed on the outer wall of the linkage frame, and a second incomplete gear is rotatably connected to the inner wall of the linkage frame. The center of the second incomplete gear is transmission-connected to the output end of the servo motor, and a second transmission gear is meshed with the second incomplete gear. The second transmission gear is rotatably connected to a group of movable brackets, and the center of the second transmission gear is fixedly connected to one end of the second threaded rod.

[0012] Furthermore, the glue discharging mechanism includes a slider, a threaded hole is provided on the slider, the threaded hole is threadedly connected to the second threaded rod, a linkage gear is installed at the bottom end of the slider, the central axis of the linkage gear is perpendicular to the moving direction of the slider, the linkage gear is meshingly connected to the tooth plate, a rotating shaft is fixedly connected at the center of the linkage gear, a cam is fixedly connected to the other end of the rotating shaft, and a transmission groove is provided on the outer wall of the cam.

[0013] Furthermore, a glue injection rack is fixedly connected to the sliding block, a glue injection barrel is installed on the glue injection rack, the top of the glue injection barrel is connected to one end of the spiral telescopic tube, a loading hole is opened on the glue injection rack, the loading hole is movably fitted with the glue injection barrel, a solenoid valve is arranged on the glue injection barrel, a vibration sensor is installed on the side wall of the glue injection barrel, the bottom end of the glue injection barrel is connected to the glue injection nozzle, the side wall of the glue injection barrel is rotatably connected to a linkage wheel, and the linkage wheel is movably fitted with the inner wall of the transmission groove.

[0014] A packaging method for an integrated circuit chip processing and packaging device, the packaging method comprising: placing a batch of integrated circuit chips to be packaged on a wafer carrier, pushing the wafer carrier into a lifting platform, and the lifting platform drives the wafer carrier to engage with a glue guide mechanism; The glue discharging mechanism performs glue injection operation on the integrated circuit chip to complete the packaging of the group of chips; After the glue injection operation of a group of chips is completed, the second threaded rod drives the glue discharging mechanism to move horizontally at equal intervals intermittently, so as to perform glue injection operations on the laterally distributed chips in turn; After completing the glue injection operation for several groups of chips in a row, the first threaded rod drives the glue discharging mechanism to perform intermittent equidistant movement longitudinally, so that after completing the glue injection operation for several groups of chips in a row, the glue discharging mechanism automatically moves to the top of the next row of integrated circuit chips, and continues to perform intermittent horizontal glue injection operations in sequence until all the integrated circuit chips have completed the packaging operation.

[0015] The beneficial effects of the present invention are: 1. By placing multiple integrated circuit chips in the limiting grooves provided on the wafer carrier, the wafer carrier and the glue guide mechanism are clamped together, so that the integrated circuit chips are fixed in the glue injection space. After the glue discharging mechanism is driven by the servo motor and the reduction motor to complete the glue injection operation of several groups of glue slots in a row in sequence, it automatically moves to the top of the glue slots in the next row, and continues to perform intermittent horizontal glue injection operations in sequence until the glue injection operation is completed in all the glue slots. This device greatly improves the glue sealing efficiency, and can keep the shape and size of the finished products of each group of chip packages uniform, effectively improving the chip packaging yield.

[0016] 2. The movement or stationary state of the glue injection cylinder is monitored by the vibration sensor. When the glue injection cylinder moves, the solenoid valve is controlled to close to stop the glue injection nozzle from injecting glue. When the glue injection cylinder is stationary, the solenoid valve is controlled to open to allow the glue injection nozzle to inject glue. By automatically controlling the opening and closing of the solenoid valve, the uniformity of the glue injection amount of each group of chips can be effectively improved while avoiding the glue outflow during the movement of the glue injection nozzle, which causes the adhesion of two adjacent groups of chips and waste of resources.

[0017] 3. While the slider is driven to move by the second threaded rod, the meshing action of the linkage gear and the toothed plate causes the linkage gear to drive the cam to rotate, so that the linkage wheel drives the glue injection cylinder to move up and down reciprocatingly, vibrating the glue in the glue injection cylinder to avoid the generation of bubbles that affect the glue injection, effectively improving the smoothness of the glue outflow while avoiding the existence of bubbles that affect the effect of the glue sealing.

[0018] 4. By opening an overflow hole between two adjacent groups of glue tanks, when the amount of glue in the glue tank is too large, the glue will flow into the adjacent group of glue tanks through the overflow hole, and finally enter the glue collecting pipe through the overflow pipe. The glue in the glue collecting pipe is sucked into the glue storage barrel for recycling through the second suction pump, which effectively saves energy and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the main structure of an embodiment of the present invention is shown; Figure 2 It shows a partial structural exploded schematic diagram of a workbench according to an embodiment of the present invention; Figure 3 A schematic diagram of the structure of a glue guiding mechanism according to an embodiment of the present invention is shown; Figure 4A cross-sectional view showing a state where a glue guiding mechanism and a wafer stage are engaged with each other according to an embodiment of the present invention is shown; Figure 5 A schematic diagram of the back view structure of the main structure according to an embodiment of the present invention is shown; Figure 6 A schematic structural diagram of a glue sealing assembly according to an embodiment of the present invention is shown; Figure 7 The embodiment of the present invention is shown Figure 6 The enlarged schematic diagram at A in the middle; Figure 8 A schematic structural diagram of a glue discharging mechanism according to an embodiment of the present invention is shown.

[0021] In the figure: 1, workbench; 101, slide; 102, give way groove; 2, first threaded rod; 3, glue sealing assembly; 301, movable bracket; 302, internal thread block; 303, roller; 304, second threaded rod; 305, glue discharging mechanism; 3051, slider; 3052, threaded hole; 3053, through hole; 3054, linkage gear; 3055, rotating shaft; 3056, cam; 30561, transmission groove; 3057, glue injection rack; 30571, loading hole; 3058, glue injection cylinder; 3059, solenoid valve; 30510, vibration sensor; 30511, glue injection nozzle; 30512, linkage wheel; 306, limit shaft; 307, tooth plate; 308, linkage rack; 309, servo Servo motor; 3010, second incomplete gear; 3011, second transmission gear; 4, glue storage barrel; 5, first suction pump; 6, spiral telescopic tube; 7, electric push rod; 8, lifting platform; 9, wedge-shaped limit strip; 10, carrier table; 1001, limit groove; 1002, shelf; 11, glue guiding mechanism; 1101, support plate; 1102, mounting block; 1103, glue guiding mold; 11031, glue carrier groove; 11032, overflow hole; 11033, sealing block; 1104, glue collecting pipe; 1105, connecting plate; 1106, overflow pipe; 1107, second suction pump; 12, vertical plate; 13, L-shaped plate; 14, reduction motor; 15, first incomplete gear; 16, first transmission gear. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] The embodiment of the present invention provides an integrated circuit chip processing and packaging device, including a workbench 1; illustratively, as Figure 1 and Figure 2 shown.

[0024] Two groups of slide grooves 101 are symmetrically provided on the workbench 1, a first threaded rod 2 is rotatably connected in one group of the slide grooves 101, a glue sealing assembly 3 is transmission-connected to the first threaded rod 2, a glue storage barrel 4 is provided on one side of the workbench 1, a first suction pump 5 is provided on the glue storage barrel 4, a liquid inlet end of the first suction pump 5 extends into the glue storage barrel 4, a spiral telescopic tube 6 is connected to the liquid outlet end of the first suction pump 5, and the other end of the spiral telescopic tube 6 is mutually connected to the glue sealing assembly 3; The workbench 1 is provided with a clearance groove 102, and the bottom end of the inner wall of the clearance groove 102 is fixedly connected with a plurality of electric push rods 7, and the output ends of the plurality of electric push rods 7 are transmission-connected with a lifting platform 8, and the lifting platform 8 is provided with a wedge-shaped limit strip 9, and a wafer carrier 10 is placed in the lifting platform 8, and a handle is provided on one side wall of the wafer carrier 10, and a plurality of integrated circuit chips are placed in the wafer carrier 10, and a plurality of pins are provided on both sides of the integrated circuit chip, and a glue guide mechanism 11 is fixedly connected to the workbench 1, and the glue guide mechanism 11 is arranged just above the clearance groove 102, and the glue guide mechanism 11 is movably engaged with the wafer carrier 10; Specifically, a batch of integrated circuit chips to be packaged are placed on the wafer carrier 10, the wafer carrier 10 is pushed into the lifting platform 8, and is limited by the wedge-shaped limit strip 9 to ensure stability during the packaging process of the integrated circuit chips. The lifting platform 8 is driven upward by a number of electric push rods 7 to move the wafer carrier 10 loaded with the integrated circuit chips upward until the wafer carrier 10 is engaged with the glue guiding mechanism 11, and the integrated circuit chips are packaged by the glue guiding mechanism 11. After the packaging operation is completed, the lifting platform 8 is driven downward by the electric push rod 7 to disengage the wafer carrier 10 from the glue guiding mechanism 11, so that the packaged integrated circuit chips are demolded, and the wafer carrier 10 is pulled away from the lifting platform 8 by pulling the handle on the wafer carrier 10 to complete the unloading of the packaged integrated circuit chips.

[0025] For example, Figure 3 and Figure 4 shown.

[0026] The glue guiding mechanism 11 includes a support plate 1101 and a mounting block 1102, a glue guiding mold 1103 is fixedly connected to the support plate 1101, a glue collecting pipe 1104 is fixedly connected to the mounting block 1102, a plurality of connecting plates 1105 are arranged between the glue collecting pipe 1104 and the glue guiding mold 1103, a plurality of overflow pipes 1106 are connected between the glue collecting pipe 1104 and the glue guiding mold 1103, one end of the glue collecting pipe 1104 is connected to a second suction pump 1107, an input end of the second suction pump 1107 extends to the interior of the glue collecting pipe 1104, and an output end of the second suction pump 1107 is connected to the interior of the glue storage barrel 4; The glue guide mold 1103 is provided with a plurality of glue loading grooves 11031, and an overflow hole 11032 is provided between each two adjacent groups of the glue loading grooves 11031. The overflow hole 11032 is inclined, and the plurality of glue loading grooves 11031 close to one side of the glue collecting tube 1104 are respectively connected to the corresponding group of overflow pipes 1106. The wafer carrier 10 is provided with a plurality of limiting grooves 1001, and the plurality of integrated circuit chips are respectively placed in the corresponding group of limiting grooves 1001. Both ends are provided with shelves 1002, and the pins on both sides of the integrated circuit chip are respectively placed on a corresponding set of shelves 1002. The bottom end of the glue-conducting mold 1103 is provided with a plurality of sealing blocks 11033, and the pins on both sides of the integrated circuit chip are clamped between the sealing blocks 11033 and the shelves 1002 to prevent the pins from being injected with glue and affecting the conductive connection effect. A glue injection space is formed between the limiting groove 1001 and a corresponding set of glue-carrying grooves 11031, and the integrated circuit chip is fixed in the glue injection space for glue injection packaging operation; Specifically, glue is injected into the glue injection space formed between the limiting groove 1001 and the corresponding group of glue-carrying grooves 11031, so that the integrated circuit chip located in the glue injection space is completed with glue injection packaging, and at the same time, the pins on both sides of the integrated circuit chip are clamped between the sealing block 11033 and the shelf 1002, so as to prevent the glue from getting on the pins during the glue injection, thereby affecting the subsequent electrical connection performance of the pins; Furthermore, by opening an overflow hole 11032 between two adjacent groups of glue tanks 11031, when the amount of glue in a glue tank 11031 is too large, the glue will flow into the adjacent group of glue tanks 11031 through the overflow hole 11032, and finally enter the glue collecting pipe 1104 through the overflow pipe 1106. The glue in the glue collecting pipe 1104 is sucked into the glue storage barrel 4 for recycling by the second suction pump 1107, thereby avoiding excessive glue overflow and causing waste of resources.

[0027] For example, Figure 5 shown.

[0028] A vertical plate 12 is fixedly connected to the workbench 1, an L-shaped plate 13 is installed on the vertical plate 12, a reduction motor 14 is installed on the L-shaped plate 13, a first incomplete gear 15 is rotatably connected to the vertical plate 12, the center of the first incomplete gear 15 is transmission-connected to the output end of the reduction motor 14, a first transmission gear 16 is meshedly connected to the first incomplete gear 15, and one end of the first threaded rod 2 is fixedly connected to the center of the first transmission gear 16.

[0029] The sealing assembly 3 includes two sets of movable brackets 301; illustratively, Figure 6 and Figure 7 shown.

[0030] The bottom end of one group of the mobile brackets 301 is fixedly connected with an internal thread block 302, and the internal thread block 302 is threadedly connected with the first threaded rod 2. The bottom end of another group of the mobile brackets 301 is provided with a roller 303, and the roller 303 and the internal thread block 302 are movably fitted with a corresponding group of slide grooves 101, and a linkage frame 308 is fixedly connected between the top ends of the two groups of the mobile brackets 301; Specifically, the first incomplete gear 15 is driven to rotate by the reduction motor 14, so that it drives the first transmission gear 16 to rotate intermittently at a fixed angle value, so that the first threaded rod 2 drives the internal thread block 302 to perform intermittent equidistant movement in the longitudinal direction. By setting a linkage frame 308 between the two groups of mobile brackets 301, the two groups of mobile brackets 301 can synchronously perform intermittent equidistant movement in the longitudinal direction. By setting a roller 303 at the bottom end of one group of mobile brackets 301, the two groups of mobile brackets 301 can be more stable and smooth during movement.

[0031] A second threaded rod 304 is rotatably connected between the two groups of mobile brackets 301, and a glue discharging mechanism 305 is threadedly connected to the second threaded rod 304. A limiting shaft 306 is fixedly connected between the two groups of mobile brackets 301, and the limiting shaft 306 is movably fitted with the glue discharging mechanism 305. A toothed plate 307 is also fixedly connected between the two groups of mobile brackets 301. A servo motor 309 is installed on the outer wall of the linkage frame 308, and a second incomplete gear 3010 is rotatably connected to the inner wall of the linkage frame 308. The center of the second incomplete gear 3010 is transmission-connected to the output end of the servo motor 309, and the second incomplete gear 3010 is meshed with a second transmission gear 3011. The second transmission gear 3011 is rotatably connected to a group of mobile brackets 301, and the center of the second transmission gear 3011 is fixedly connected to one end of the second threaded rod 304; Specifically, the servo motor 309 drives the second incomplete gear 3010 to rotate, so that it drives the second transmission gear 3011 to rotate intermittently and at equal angles, and the second threaded rod 304 drives the glue discharge mechanism 305 to move laterally at equal intervals, thereby performing glue injection operations in several groups of glue slots 11031 distributed laterally.

[0032] The glue discharging mechanism 305 includes a slider 3051; illustratively, as Figure 8 shown.

[0033] The slider 3051 is provided with a threaded hole 3052, the threaded hole 3052 is threadedly connected with the second threaded rod 304, the slider 3051 is provided with a through hole 3053, the through hole 3053 is movably fitted with the limit shaft 306, a linkage gear 3054 is installed at the bottom end of the slider 3051, the linkage gear 3054 is meshed and connected with the tooth plate 307, a rotating shaft 3055 is fixedly connected at the center of the linkage gear 3054, the other end of the rotating shaft 3055 is fixedly connected with a cam 3056, and a transmission groove 30561 is provided on the outer wall of the cam 3056; The slider 3051 is fixedly connected with a glue injection frame 3057, and a glue injection cylinder 3058 is installed on the glue injection frame 3057. The top of the glue injection cylinder 3058 is connected with one end of the spiral telescopic tube 6. A loading hole 30571 is opened on the glue injection frame 3057, and the loading hole 30571 is movably fitted with the glue injection cylinder 3058. The glue injection cylinder 3058 is provided with a solenoid valve 3059. A vibration sensor 30510 is installed on the side wall of the glue injection cylinder 3058. The bottom end of the glue injection cylinder 3058 is connected with a glue injection nozzle 30511. The side wall of the glue injection cylinder 3058 is rotatably connected with a linkage wheel 30512, and the linkage wheel 30512 is movably fitted with the inner wall of the transmission groove 30561. Specifically, the glue is allowed to enter the glue injection cylinder 3058 through the spiral telescopic tube 6 through the first suction pump 5, and the glue injection operation is performed through the glue injection nozzle 30511. The second threaded rod 304 is rotated to make the slider 3051 move laterally along the length direction of the limit axis 306, so that the glue injection nozzle 30511 injects glue into different laterally distributed glue loading grooves 11031. The movement or static state of the glue injection cylinder 3058 is monitored by the vibration sensor 30510. When the glue injection cylinder 3058 moves, the solenoid valve 3059 is controlled to be closed. When the glue injection cylinder 3058 is stationary, the solenoid valve 3059 is controlled to be opened for glue injection. When the slider 3051 moves, the meshing action of the linkage gear 3054 and the tooth plate 307 causes the linkage gear 3054 to drive the cam 3056 to rotate, so that the linkage wheel 30512 drives the glue injection cylinder 3058 to move up and down, and vibrates the glue in the glue injection cylinder 3058 to avoid the generation of bubbles that affect the glue injection.

[0034] The working principle of the integrated circuit chip processing and packaging device proposed by the present invention is as follows: A batch of integrated circuit chips to be packaged are placed in the limit groove 1001 provided on the wafer carrier 10, the wafer carrier 10 is pushed into the lifting platform 8, and is limited by the wedge-shaped limit strip 9 to ensure stability during the packaging process of the integrated circuit chips. The lifting platform 8 is driven upward by a plurality of electric push rods 7, so that the wafer carrier 10 loaded with the integrated circuit chips moves upward until the wafer carrier 10 is engaged with the glue guiding mechanism 11, so that the pins on both sides of the integrated circuit chip are engaged between the sealing block 11033 and the shelf 1002, and at the same time, a glue injection space is formed between the limit groove 1001 and the corresponding group of glue grooves 11031, so that the integrated circuit chip is fixed in the glue injection space.

[0035] The glue is allowed to enter the glue injection cylinder 3058 through the spiral telescopic tube 6 through the first suction pump 5, and the glue is injected into the glue injection space formed between the limiting groove 1001 and the corresponding group of glue loading grooves 11031 through the glue injection nozzle 30511. The integrated circuit chip placed in the glue injection space is injected with glue. Since the pins on both sides of the integrated circuit chip are clamped between the sealing block 11033 and the shelf 1002, the glue is effectively prevented from adhering to the pins.

[0036] After completing the glue injection operation of a group of glue slots 11031, the servo motor 309 drives the second incomplete gear 3010 to rotate, so that it drives the second transmission gear 3011 to rotate intermittently and at equal angles, and the second threaded rod 304 drives the glue discharge mechanism 305 to move intermittently and evenly spaced horizontally, thereby performing glue injection operations in several groups of glue slots 11031 distributed laterally.

[0037] The movement or stationary state of the glue injection cylinder 3058 is monitored by the vibration sensor 30510. When the glue injection cylinder 3058 moves, the solenoid valve 3059 is controlled to be closed, so that the glue injection nozzle 30511 stops injecting glue. When the glue injection cylinder 3058 is stationary, the solenoid valve 3059 is controlled to be opened, so that the glue injection nozzle 30511 injects glue. While the slider 3051 moves, the meshing action of the linkage gear 3054 and the tooth plate 307 causes the linkage gear 3054 to drive the cam 3056 to rotate, so that the linkage wheel 30512 drives the glue injection cylinder 3058 to move up and down, thereby vibrating the glue in the glue injection cylinder 3058 to avoid the generation of bubbles that affect the glue injection.

[0038] After completing the glue injection operation of several groups of glue slots 11031 in a row, the first incomplete gear 15 is driven to rotate by the reduction motor 14, so that it drives the first transmission gear 16 to rotate intermittently at a fixed angle value, so that the first threaded rod 2 drives the internal thread block 302 to perform intermittent equidistant movement in the longitudinal direction, and a linkage frame 308 is set between the two groups of movable brackets 301, so that the two groups of movable brackets 301 can synchronously perform intermittent equidistant movement in the longitudinal direction, so that after the glue discharge mechanism 305 completes the glue injection operation of several groups of glue slots 11031 in a row, it is driven by the two groups of movable brackets 301 to move to the top of the glue slots 11031 in the next row, and continue to perform intermittent horizontal glue injection operations in sequence until the glue injection operation is completed in all the glue slots 11031.

[0039] By opening an overflow hole 11032 between two adjacent groups of glue tanks 11031, when the amount of glue in the glue tank 11031 is too large, the glue will flow into the adjacent group of glue tanks 11031 through the overflow hole 11032, and finally enter the glue collecting pipe 1104 through the overflow pipe 1106. The glue in the glue collecting pipe 1104 is sucked into the glue storage barrel 4 for recycling through the second suction pump 1107, thereby avoiding excessive glue overflow and causing waste of resources.

[0040] After completing the packaging operation of all the integrated circuit chips in the glue slots 11031, the lifting platform 8 is driven downward by the electric push rod 7 to disengage the wafer carrier 10 from the glue guiding mechanism 11, so that the packaged integrated circuit chips are demolded, and the wafer carrier 10 is pulled away from the lifting platform 8 by pulling the handle on the wafer carrier 10 to unload the finished integrated circuit chip packaging products.

[0041] Based on the above integrated circuit chip processing and packaging device, an embodiment of the present invention further proposes a packaging method for the packaging device. Exemplarily, the packaging method includes: A batch of integrated circuit chips to be packaged are placed in the limiting grooves provided on the wafer carrier, the wafer carrier is pushed into the lifting platform, and the wafer carrier is limited by the wedge-shaped limiting strips; Turn on several sets of electric push rods, and the lifting platform drives the wafer carrier loaded with integrated circuit chips to move upward until the wafer carrier is engaged with the glue guide mechanism; At this time, the pins on both sides of the integrated circuit chip are clamped between the sealing block and the shelf for protection, and a glue injection space is formed between the limiting groove and the corresponding group of glue-carrying grooves, so that the integrated circuit chip is fixed in the glue injection space; Turn on the first suction pump to allow the glue to enter the glue injection cylinder through the spiral expansion and contraction, and inject the glue into the glue injection space formed between the limiting groove and the corresponding group of glue loading grooves through the glue injection nozzle to complete the packaging operation of the integrated circuit chip in the glue injection space; After the glue injection operation of a group of glue carrier grooves is completed, the servo motor is turned on to drive the second incomplete gear to rotate, so that it drives the second transmission gear to rotate intermittently at equal angles, and the second threaded rod drives the glue discharge mechanism to move intermittently at equal intervals in the horizontal direction, so as to perform glue injection operations in several groups of glue carrier grooves distributed in the horizontal direction in turn; During the glue injection process, the vibration sensor monitors the movement or stationary state of the glue injection cylinder. When the glue injection cylinder moves, the solenoid valve is controlled to close, so that the glue injection nozzle stops injecting glue. When the glue injection cylinder is stationary, the solenoid valve is controlled to open, so that the glue injection nozzle can inject glue. When the glue discharging mechanism moves, the meshing action of the linkage gear and the tooth plate causes the linkage gear to drive the cam to rotate, so that the linkage wheel drives the glue injection cylinder to move up and down, vibrating the glue in the glue injection cylinder to avoid the generation of bubbles that affect the glue injection effect; After completing the glue injection operation of several groups of glue slots in a horizontal row, start the reduction motor to drive the first incomplete gear to rotate, so that it drives the first transmission gear to rotate intermittently at a fixed angle value, so that the first threaded rod drives the internal thread block to perform intermittent equidistant movement in the longitudinal direction, and the two groups of movable brackets drive the glue discharge mechanism to synchronously perform intermittent equidistant movement in the longitudinal direction, so that after the glue discharge mechanism completes the glue injection operation of several groups of glue slots in a horizontal row, it automatically moves to the top of the glue slots in the next horizontal row, and continues to perform intermittent horizontal glue injection operations in sequence until the glue injection operation is completed in all the glue slots.

[0042] After completing the packaging operation of the integrated circuit chips in all the glue carrier slots, turn on the electric push rod to drive the lifting platform to move downward, so that the carrier platform is separated from the glue guiding mechanism, and the packaged integrated circuit chips are demolded. Pull the handle on the carrier platform to pull the carrier platform away from the lifting platform to unload the finished integrated circuit chip packaging products.

[0043] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein; and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An integrated circuit chip processing and packaging device, comprising a workbench (1), characterized in that: The workbench (1) is symmetrically provided with two groups of slide grooves (101), one group of the slide grooves (101) is rotatably connected to a first threaded rod (2), and the first threaded rod (2) is drivingly connected to a glue sealing assembly (3); The workbench (1) is provided with a lifting platform (8), a wafer carrier (10) is placed in the lifting platform (8), a plurality of integrated circuit chips are placed in the wafer carrier (10), and a glue guide mechanism (11) is fixedly connected to the workbench (1); The glue sealing assembly (3) comprises two groups of movable brackets (301), a second threaded rod (304) is rotatably connected between the two groups of movable brackets (301), and a glue discharging mechanism (305) is threadedly connected to the second threaded rod (304); By placing a plurality of chips on a wafer carrier (10), the wafer carrier (10) and the glue guide mechanism (11) are clamped together, so that the chips are fixed in the glue injection space, and the glue discharge mechanism (305) is driven by the first threaded rod (2) and the second threaded rod (304) to perform intermittent movement and glue injection in the horizontal and vertical directions, respectively, until the glue injection operation is completed for all chips.

2. The integrated circuit chip processing and packaging device according to claim 1, characterized in that: A glue storage barrel (4) is provided on one side of the workbench (1), and a first suction pump (5) is provided on the glue storage barrel (4); a liquid outlet end of the first suction pump (5) is connected to a spiral telescopic tube (6), and the other end of the spiral telescopic tube (6) is connected to the glue sealing component (3).

3. The integrated circuit chip processing and packaging device according to claim 2, characterized in that: The workbench (1) is provided with a clearance groove (102), and a plurality of groups of electric push rods (7) are fixedly connected to the bottom end of the inner wall of the clearance groove (102), and the output end of the electric push rod (7) is transmission-connected to the lifting platform (8), and the glue guiding mechanism (11) is arranged directly above the clearance groove (102), and the glue guiding mechanism (11) is movably connected to the carrier platform (10).

4. The integrated circuit chip processing and packaging device according to claim 3, characterized in that: The glue guiding mechanism (11) comprises a support plate (1101) and a mounting block (1102); a glue guiding mould (1103) is fixedly connected to the support plate (1101); a glue collecting pipe (1104) is fixedly connected to the mounting block (1102); a plurality of groups of connecting plates (1105) are arranged between the glue collecting pipe (1104) and the glue guiding mould (1103); a plurality of groups of overflow pipes (1106) are connected between the glue collecting pipe (1104) and the glue guiding mould (1103); and one end of the glue collecting pipe (1104) is connected to a second suction pump (1107).

5. The integrated circuit chip processing and packaging device according to claim 4, characterized in that The glue-conducting mold (1103) is provided with a plurality of glue-carrying grooves (11031), and an overflow hole (11032) is provided between each two adjacent groups of the glue-carrying grooves (11031). The wafer carrier (10) is provided with a plurality of limit grooves (1001), and shelves (1002) are provided at both ends of each group of limit grooves (1001). The pins on both sides of the integrated circuit chip are respectively placed on a corresponding group of shelves (1002). The bottom end of the glue-conducting mold (1103) is provided with a plurality of sealing blocks (11033), and the pins on both sides of the integrated circuit chip are clamped between the sealing blocks (11033) and the shelves (1002).

6. The integrated circuit chip processing and packaging device according to claim 1, characterized in that: The workbench (1) is fixedly connected to a vertical plate (12), an L-shaped plate (13) is mounted on the vertical plate (12), a reduction motor (14) is mounted on the L-shaped plate (13), a first incomplete gear (15) is rotatably connected to the vertical plate (12), the center of the first incomplete gear (15) is transmission-connected to an output end of the reduction motor (14), the first incomplete gear (15) is meshingly connected to a first transmission gear (16), and one end of a first threaded rod (2) is fixedly connected to the center of the first transmission gear (16).

7. The integrated circuit chip processing and packaging device according to claim 1, characterized in that: A linkage frame (308) is fixedly connected between the top ends of the two groups of movable brackets (301), a limit shaft (306) is fixedly connected between the two groups of movable brackets (301), the limit shaft (306) is movably fitted with the glue discharging mechanism (305), and a toothed plate (307) is also fixedly connected between the two groups of movable brackets (301). A servo motor (309) is installed on the outer side wall of the linkage frame (308), and a second incomplete gear (3010) is rotatably connected to the inner side wall of the linkage frame (308), the center of the second incomplete gear (3010) is transmission-connected to the output end of the servo motor (309), the second incomplete gear (3010) is meshedly connected to the second transmission gear (3011), the second transmission gear (3011) is rotatably connected to one group of movable brackets (301), and the center of the second transmission gear (3011) is fixedly connected to one end of the second threaded rod (304).

8. The integrated circuit chip processing and packaging device according to claim 7, characterized in that: The glue discharging mechanism (305) comprises a slider (3051), a threaded hole (3052) is formed on the slider (3051), the threaded hole (3052) is threadedly connected to the second threaded rod (304), a linkage gear (3054) is installed at the bottom end of the slider (3051), the central axis of the linkage gear (3054) is perpendicular to the moving direction of the slider (3051), the linkage gear (3054) is meshedly connected to the toothed plate (307), a rotating shaft (3055) is fixedly connected at the center of the linkage gear (3054), a cam (3056) is fixedly connected to the other end of the rotating shaft (3055), and a transmission groove (30561) is formed on the outer wall of the cam (3056).

9. The integrated circuit chip processing and packaging device according to claim 8, characterized in that: The slider (3051) is fixedly connected to a glue injection frame (3057), a glue injection cylinder (3058) is installed on the glue injection frame (3057), a loading hole (30571) is opened on the glue injection frame (3057), the loading hole (30571) and the glue injection cylinder (3058) are movably fitted, a solenoid valve (3059) is arranged on the glue injection cylinder (3058), a vibration sensor (30510) is installed on the side wall of the glue injection cylinder (3058), the bottom end of the glue injection cylinder (3058) is connected to a glue injection nozzle (30511), and the side wall of the glue injection cylinder (3058) is rotatably connected to a linkage wheel (30512), and the linkage wheel (30512) is movably fitted with the inner wall of the transmission groove (30561).

10. A packaging method applied to the integrated circuit chip processing and packaging device according to any one of claims 1 to 9, characterized in that: The packaging method comprises: A batch of integrated circuit chips to be packaged are placed on the wafer carrier, and the wafer carrier is pushed into the lifting platform, and the lifting platform drives the wafer carrier to engage with the glue guide mechanism; The glue discharging mechanism performs glue injection operation on the integrated circuit chip to complete the packaging of the group of chips; After the glue injection operation of a group of chips is completed, the second threaded rod drives the glue discharging mechanism to move horizontally at equal intervals intermittently, so as to perform glue injection operation on the laterally distributed chips in turn; After completing the glue injection operation for several groups of chips in a horizontal row, the first threaded rod drives the glue discharging mechanism to perform intermittent equidistant movement longitudinally, so that after the glue discharging mechanism completes the glue injection operation for several groups of chips in a horizontal row, it automatically moves longitudinally to the top of the integrated circuit chips in the next horizontal row, and continues to perform intermittent horizontal glue injection operations in sequence until all the integrated circuit chips have completed the packaging operation.

Images