Upper-layer multi-extension type communication system

Abstract

The utility model discloses an upper-layer multi-expansion type communication system, which comprises a main board, an adapter card and expansion cards, when the two third high-speed connectors of the adapter card are respectively connected with the first high-speed connectors of the two main boards, the first sea light processor is connected with the adapter card; when the two third high-speed connectors are respectively connected with the two second high-speed connectors, the second sea light processor is connected with the adapter card; at least one of the three first PCIEx16 slots is connected with a first upper layer module card in a pluggable manner; at least one of the three second PCIEx16 slots is connected with a second upper layer module card in a pluggable manner; whether the upper module card is connected or not can be flexibly selected according to actual use requirements, at least four upper module cards with different functions can be used at the same time, and convenience is brought to use.

Description

Technical Field

[0001] The utility model relates to the technical field of communication systems, in particular to an upper layer multi-expansion type communication system. Background Art

[0002] With the continuous development and progress of network equipment, there are more and more communication management machines. The existing communication management systems are designed for various places, various applicable needs and performance enhancements.

[0003] In the existing communication switching systems, most of them use a single Intel Cascadelake processor for switching, which has low switching efficiency and affects the performance of the motherboard.

[0004] Later, the motherboard adopted the Hygon processor, which has great development space in the field of network security equipment, and can expand the product diversification of domestic processor products and provide users with more choices of network security products.

[0005] However, it is difficult for a motherboard with a dual-channel Hygon processor to expand its functions through a high-speed connector, which affects the maximum utilization of the motherboard's performance.

[0006] In addition, the layout of the existing communication system is not rational enough and the motherboard space utilization rate is low.

[0007] Therefore, it is necessary to develop a new technical solution to solve the above problems. Utility Model Content

[0008] In view of this, the utility model aims to solve the deficiencies in the prior art, and its main purpose is to provide an upper-layer multi-expansion communication system, which can flexibly choose whether to connect an upper-layer module card according to actual usage requirements, and can at least realize the simultaneous use of 4 upper-layer module cards with different functions, bringing convenience to use.

[0009] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0010] An upper layer multi-expansion type communication system includes a mainboard, a transfer card and an expansion card;

[0011] The mainboard is provided with two first high-speed connectors, two second high-speed connectors, and a first Haiguang processor and a second Haiguang processor which can be selectively connected to the adapter card, the first Haiguang processor is respectively connected to the two first high-speed connectors, and the second Haiguang processor is respectively connected to the two second high-speed connectors;

[0012] The adapter card is provided with two third high-speed connectors for simultaneously adapting two first high-speed connectors or two second high-speed connectors, a first expansion slot for outputting a PCIEx16 signal, and a second expansion slot for outputting another PCIEx16 signal;

[0013] One of the two third high-speed connectors is connected to the first expansion slot, and the other is connected to the second expansion slot;

[0014] When the two third high-speed connectors are connected to the two first high-speed connectors respectively, the first Haiguang processor is connected to the adapter card;

[0015] When the two third high-speed connectors are connected to the two second high-speed connectors respectively, the second Haiguang processor is connected to the adapter card;

[0016] The expansion card is provided with a first PCI E switch chip, a second PCI E switch chip, three first PCI Ex 16 slots, three second PCI Ex 16 slots, a first gold finger for adapting to the first expansion slot, and a second gold finger for adapting to the second expansion slot;

[0017] The first gold finger is connected to the first expansion slot and the second gold finger is connected to the second expansion slot, and the adapter card is connected to the expansion card;

[0018] The first PCI E Switch chip is respectively connected to a first gold finger and three first PCI Ex 16 slots, and at least one of the three first PCI Ex 16 slots is pluggably connected to a first upper layer module card;

[0019] The second PCI E switch chip is respectively connected to a second gold finger and three second PCI Ex 16 slots, at least one of the three second PCI Ex 16 slots is pluggably connected to a second upper module card; the first upper module card and the second upper module card both include at least one of a raid card, an acceleration card, a graphics card and an encryption card.

[0020] As a preferred solution, the adapter card stands on the rear side of the mainboard, and the expansion card and the mainboard are parallel to each other.

[0021] As a preferred solution, the first Haiguang processor and the second Haiguang processor are arranged side by side on the upper end surface of the mainboard with a left-right spacing, two first high-speed connectors are arranged on the upper end surface of the mainboard and located on the rear side of the first Haiguang processor, and two second high-speed connectors are arranged on the upper end surface of the mainboard and located on the rear side of the second Haiguang processor.

[0022] As a preferred solution, the two first high-speed connectors and the two second high-speed connectors are arranged side by side with spacing in the left-right direction.

[0023] As a preferred solution, the two third high-speed connectors are arranged on the front end surface of the adapter card, and the first expansion slot and the second expansion slot are both arranged on the rear end surface of the adapter card.

[0024] As a preferred solution, the two third high-speed connectors are arranged side by side with spacing in the left-right direction.

[0025] As a preferred solution, the first expansion slot and the second expansion slot are arranged side by side in a left-right direction.

[0026] As a preferred solution, the first PCI Ex16 chip and the second PCI Ex16 chip are both located on the rear side of the first gold finger and are arranged side by side in the left-right direction. The three first PCI Ex16 slots and the three second PCI Ex16 slots are respectively located on the left and right sides of the first PCI Ex16 chip. The three first PCI Ex16 slots and the three second PCI Ex16 slots are both located on the rear side of the first gold finger and are arranged along the left-right direction. The first gold finger and the second gold finger are both located on the front side of the expansion card and are arranged side by side in the left-right direction.

[0027] As a preferred solution, among the three second PCIEx16 slots, two are located between the first PCI Eswitch chip and the second PCI Eswitch chip, and the other is located on the right side of the second PCI Eswitch chip.

[0028] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that any Haiguang processor on the motherboard directly leads out 2 PCIEx16 signals through the adapter card, and then leads out 6 PCIEx16 slots through the expansion card. The PCIEx16 slot can flexibly choose whether to connect to the upper module card according to actual use requirements, and at least 4 upper module cards with different functions can be used at the same time, which brings convenience to use;

[0029] In addition, the overall structure is ingenious and reasonable, the layout is compact, the motherboard space utilization rate is high, the installation space is saved, and it is easy to plug and unplug.

[0030] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments: BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a structural schematic diagram of a preferred embodiment of the utility model;

[0032] Figure 2 This is a schematic diagram of the application state of a preferred embodiment of the utility model (mainly showing that two third high-speed connectors are respectively connected to two first high-speed connectors);

[0033] Figure 3 It is a rear view of the adapter card of the preferred embodiment of the utility model.

[0034] Figure 4 It is an expanded top view of a preferred embodiment of the utility model.

[0035] Figure 5 This is a general control block diagram of a preferred embodiment of the utility model (mainly showing that two third high-speed connectors are respectively connected to two first high-speed connectors).

[0036] Description of the accompanying drawings:

[0037] 10. Motherboard

[0038] 11. First high-speed connector 12. Second high-speed connector

[0039] 13. First Haiguang processor 14. Second Haiguang processor

[0040] 20. Adapter Card

[0041] 21. Third high-speed connector 22. First expansion slot

[0042] 23. Second expansion slot

[0043] 30. Expansion Card

[0044] 31. First PCIE Switch chip 32. Second PCIE Switch chip

[0045] 33. First PCIEx16 slot 34. Second PCIEx16 slot

[0046] 35. First Gold Finger 36. Second Gold Finger

[0047] 41. A first upper layer module card 42. A second upper layer module card. DETAILED DESCRIPTION

[0048] Please refer to Figures 1 to 5 As shown, it shows the specific structure of an embodiment of the utility model, an upper multi-expansion type communication system, including a mainboard 10, a riser card 20 and an expansion card 30.

[0049] The mainboard 10 is provided with two first high-speed connectors 11, two second high-speed connectors 12, and a first Haiguang processor 13 and a second Haiguang processor 14 which can be selectively connected to the adapter card 20. The first Haiguang processor 13 is respectively connected to the two first high-speed connectors 11, and the second Haiguang processor 14 is respectively connected to the two second high-speed connectors 12.

[0050] The first Haiguang processor 13 and the second Haiguang processor 14 are arranged side by side at a left-right interval on the upper end surface of the mainboard 10, two first high-speed connectors 11 are arranged on the upper end surface of the mainboard 10 and are located at the rear side of the first Haiguang processor 13, and two second high-speed connectors 12 are arranged on the upper end surface of the mainboard 10 and are located at the rear side of the second Haiguang processor 14. The two first high-speed connectors 11 and the two second high-speed connectors 12 are arranged side by side at a left-right interval.

[0051] In this embodiment, the adapter card 20 is disposed on the rear side of the mainboard 10. The adapter card 20 is provided with two third high-speed connectors 21 for simultaneously adapting to two first high-speed connectors 11 or two second high-speed connectors 12, a first expansion slot 22 for outputting a PCIEx16 signal, and a second expansion slot 23 for outputting another PCIEx16 signal; preferably, the model of the adapter card 20 is ZR-87102V.

[0052] One of the two third high-speed connectors 21 is connected to the first expansion slot, and the other is connected to the second expansion slot. In this embodiment, the two third high-speed connectors 21 are arranged at the front end of the adapter card 20, and the two third high-speed connectors 21 are arranged side by side in the left-right direction; the first expansion slot 22 and the second expansion slot 23 are both arranged at the rear end of the adapter card 20. The two third high-speed connectors 21 are arranged side by side in the left-right direction. Preferably, the first expansion slot 22 and the second expansion slot 23 are arranged side by side in the left-right direction.

[0053] When the two third high-speed connectors 21 are connected to the two first high-speed connectors 11 respectively, the first Haiguang processor 13 is connected to the adapter card 20 .

[0054] When the two third high-speed connectors 21 are connected to the two second high-speed connectors 12 respectively, the second Haiguang processor 14 is connected to the adapter card 20 .

[0055] In this embodiment, the expansion card 30 is provided with a first PCI E switch chip 31, a second PCI E switch chip 32, three first PCI Ex 16 slots 33, three second PCI Ex 16 slots 34, a first gold finger 35 for adapting to the first expansion slot 22, and a second gold finger 36 for adapting to the second expansion slot 23. Preferably, the model of the expansion card 30 is ZR-87106Z.

[0056] The first PCI E switch chip 31 and the second PCI E switch chip 32 are both located at the rear side of the first gold finger 35 and are arranged side by side in the left-right direction. The three first PCI Ex 16 slots 33 and the three second PCI Ex 16 slots 34 are respectively located at the left and right sides of the first PCI E switch chip 31. The three first PCI Ex 16 slots 33 and the three second PCI Ex 16 slots 34 are both located at the rear side of the first gold finger 35 and are arranged in the left-right direction.

[0057] Among the three second PCIEx 16 slots 34 , two are located between the first PCI E switch chip 31 and the second PCI E switch chip 32 , and the other is located on the right side of the second PCI E switch chip 32 .

[0058] The first gold finger 35 and the second gold finger 36 are both located at the front side of the expansion card 30 and are arranged side by side. The first gold finger 35 is connected to the first expansion slot and the second gold finger 36 is connected to the second expansion slot, and the adapter card 20 is connected to the expansion card 30;

[0059] The first PCI Express switch chip 31 is respectively connected to a first golden finger 35 and three first PCI Ex 16 slots 33, and at least one of the three first PCI Ex 16 slots 33 is pluggably connected to a first upper layer module card 41;

[0060] The second PCI E switch chip 32 is respectively connected to a second gold finger 36 and three second PCI Ex 16 slots 34, at least one of the three second PCI Ex 16 slots 34 is pluggably connected to a second upper module card 42; the first upper module card 41 and the second upper module card 42 both include at least one of a raid card, an acceleration card, a graphics card and an encryption card.

[0061] The design focus of the utility model is that any Haiguang processor on the motherboard directly leads to 2 PCIEx16 signals through the adapter card, and then leads to 6 PCIEx16 slots through the expansion card. The PCIEx16 slot can flexibly choose whether to connect to the upper module card according to actual use needs, and at least 4 upper module cards with different functions can be used at the same time, which brings convenience to use;

[0062] In addition, the overall structure is ingenious and reasonable, the layout is compact, the motherboard space utilization rate is high, the installation space is saved, and it is easy to plug and unplug.

[0063] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. An upper layer multi-expansion communication system, characterized in that: Including motherboard, adapter card and expansion card; The mainboard is provided with two first high-speed connectors, two second high-speed connectors, and a first Haiguang processor and a second Haiguang processor which can be selectively connected to the adapter card, the first Haiguang processor is respectively connected to the two first high-speed connectors, and the second Haiguang processor is respectively connected to the two second high-speed connectors; The adapter card is provided with two third high-speed connectors for simultaneously adapting two first high-speed connectors or two second high-speed connectors, a first expansion slot for outputting a PCIEx16 signal, and a second expansion slot for outputting another PCIEx16 signal; One of the two third high-speed connectors is connected to the first expansion slot, and the other is connected to the second expansion slot; When the two third high-speed connectors are connected to the two first high-speed connectors respectively, the first Haiguang processor is connected to the adapter card; When the two third high-speed connectors are connected to the two second high-speed connectors respectively, the second Haiguang processor is connected to the adapter card; The expansion card is provided with a first PCI E switch chip, a second PCI E switch chip, three first PCI Ex 16 slots, three second PCI Ex 16 slots, a first gold finger for adapting to the first expansion slot, and a second gold finger for adapting to the second expansion slot; The first gold finger is connected to the first expansion slot and the second gold finger is connected to the second expansion slot, and the adapter card is connected to the expansion card; The first PCI E Switch chip is respectively connected to a first gold finger and three first PCI Ex 16 slots, and at least one of the three first PCI Ex 16 slots is pluggably connected to a first upper layer module card; The second PCI E switch chip is respectively connected to a second gold finger and three second PCI Ex 16 slots, at least one of the three second PCI Ex 16 slots is pluggably connected to a second upper module card; the first upper module card and the second upper module card both include at least one of a raid card, an acceleration card, a graphics card and an encryption card.

2. The upper layer multi-expansion communication system according to claim 1, characterized in that: The adapter card stands on the rear side of the mainboard, and the expansion card and the mainboard are parallel to each other.

3. The upper layer multi-expansion communication system according to claim 1, characterized in that: The first Haiguang processor and the second Haiguang processor are arranged side by side on the upper end surface of the mainboard with a left-right spacing, two first high-speed connectors are arranged on the upper end surface of the mainboard and are located on the rear side of the first Haiguang processor, and two second high-speed connectors are arranged on the upper end surface of the mainboard and are located on the rear side of the second Haiguang processor.

4. The upper layer multi-expansion communication system according to claim 3, characterized in that: The two first high-speed connectors and the two second high-speed connectors are arranged side by side with spacing in the left-right direction.

5. The upper layer multi-expansion communication system according to claim 2, characterized in that: The two third high-speed connectors are arranged on the front end surface of the adapter card, and the first expansion slot and the second expansion slot are both arranged on the rear end surface of the adapter card.

6. The upper layer multi-expansion communication system according to claim 5, characterized in that: The two third high-speed connectors are arranged side by side with a spacing in the left-right direction.

7. The upper layer multi-expansion communication system according to claim 5, characterized in that: The first expansion slot and the second expansion slot are arranged side by side in a left-right direction.

8. The upper layer multi-expansion communication system according to claim 1, characterized in that: The first PCI Ex16 chip and the second PCI Ex16 chip are both located on the rear side of the first gold finger and are arranged side by side in the left and right directions. The three first PCI Ex16 slots and the three second PCI Ex16 slots are respectively located on the left and right sides of the first PCI Ex16 chip. The three first PCI Ex16 slots and the three second PCI Ex16 slots are both located on the rear side of the first gold finger and are arranged along the left and right directions. The first gold finger and the second gold finger are both located on the front side of the expansion card and are arranged side by side in the left and right directions.

9. The upper layer multi-expansion communication system according to claim 3, characterized in that: Among the three second PCIEx16 slots, two are located between the first PCI Eswitch chip and the second PCI Eswitch chip, and the other is located on the right side of the second PCI Eswitch chip.

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