Wafer gold tearing machine

Abstract

A wafer gold tearing machine comprises a supporting platform; the carrying table is fixed on the surface of the supporting platform, the surface of the carrying table comprises at least one wafer fixing area, and the wafer fixing area is used for fixing a wafer; the film pressing mechanism comprises a roller shaft arranged in parallel to a first direction, the roller shaft can rotate around the axial direction and reciprocate in a second direction, the first direction and the second direction are both parallel to the surface of the carrying table, and a preset included angle is formed between the first direction and the second direction; and the roll shaft is used for rolling an adhesive film laid on the surface of the wafer, so that the adhesive film is adhered to the surface of the wafer, and the gold tearing quality is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing equipment, in particular to a wafer gold tearing machine. Background Art

[0002] During the wafer manufacturing process, metal is evaporated on the surface. Since the evaporation is performed on the entire surface of the wafer, there will be excess metal that is not needed.

[0003] Currently, the process of stripping metal from wafers is mostly done manually. Manual metal stripping is inefficient, time-consuming, labor-intensive, and increases costs. In addition, in the process of manual metal stripping, due to the limitations of the operator's skills and the characteristics of the wafer itself, it is easy to cause problems such as incomplete metal stripping, wafer contamination, and even wafer damage. Utility Model Content

[0004] The technical problem solved by the utility model is to provide a wafer gold tearing machine in order to improve the efficiency and quality of gold tearing.

[0005] In order to solve the above technical problems, the technical solution of the utility model provides a wafer gold tearing machine, including: a supporting platform; a carrier, the carrier is fixed to the surface of the supporting platform, the carrier surface includes at least one wafer fixing area, and the wafer fixing area is used to fix the wafer; a film pressing mechanism, the film pressing mechanism includes a roller shaft arranged parallel to a first direction, the roller shaft can rotate around the axis and reciprocate along a second direction, the first direction and the second direction are both parallel to the carrier surface, and the first direction and the second direction have a preset angle, the roller shaft is used to roll the sticky film laid on the surface of the wafer, so that the sticky film adheres to the surface of the wafer.

[0006] Compared with the prior art, the technical solution of the embodiment of the utility model has the following beneficial effects:

[0007] In the wafer gold tearing machine provided by the technical solution of the utility model, after the sticky film is laid on the wafer surface, the roller of the film pressing mechanism is used to roll the sticky film on the wafer surface, so that the sticky film adheres to the wafer surface more firmly, which is beneficial to improving the quality of gold tearing and avoiding the problems of incomplete gold tearing that are easy to occur during manual gold tearing. At the same time, the contact between manual labor and wafer is reduced, which can reduce the probability of wafer contamination and wafer damage caused by manual operation.

[0008] Furthermore, the method of fixing the wafer on the carrier includes an adsorption method, which reduces the contact probability between the wafer fixing device and the wafer, thereby helping to reduce wafer contamination and mechanical damage to the wafer.

[0009] Furthermore, a plurality of the vacuum suction holes are evenly arranged in the wafer fixing area, which is beneficial to improving the uniformity of the force applied to the wafer.

[0010] Furthermore, the surface of the carrier is also provided with a film taking hole, which connects the carrier sealed cavity to the outside of the carrier, and the film taking hole is partially located in the wafer fixing area. After the gold stripping is completed, air can enter the carrier sealed cavity from the film taking hole. The setting of the film taking hole is conducive to increasing the speed at which the negative pressure in the carrier sealed cavity disappears, increasing the speed at which the operator takes away the wafer, thereby improving the gold stripping efficiency.

[0011] Furthermore, the film pulling mechanism also includes a speed adjustment structure. Rotating the rotating handle can push the rotating wheel on the first clamping part to move toward the shaft fixing block, and apply pressure to the shaft fixing block to generate friction between the rotating wheel and the shaft fixing block. The friction force will increase the rotational resistance of the first connecting shaft, thereby controlling the speed of pulling the sticky film, which is beneficial to improving the quality of gold tearing.

[0012] Furthermore, the film pulling mechanism also includes: a second connecting shaft fixed to the film pulling support structure, relative to the first connecting shaft, in the direction perpendicular to the surface of the support platform and in the direction parallel to the surface of the support platform, the second connecting shaft is close to the carrier, when pulling the adhesive film, the active end of the adhesive film is passed through the gap between the second connecting shaft and the support platform, and then laid on the wafer surface on the wafer fixing area, which can reduce the height difference between the adhesive film and the wafer, reduce the bubbles between the wafer and the adhesive film laid on the wafer surface, which is beneficial to the uniformity of metal peeling on the wafer surface and improves the gold peeling quality.

[0013] Furthermore, the end surface of the carrier close to the film-pulling mechanism has a knife groove parallel to the first direction, and the knife groove matches the tool. The knife groove helps to cut the adhesive film more neatly and improve the utilization rate of the adhesive film. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of a wafer gold tearing machine according to an embodiment of the utility model;

[0015] Figure 2 This is an embodiment of the utility model Figure 1 A schematic diagram of a top view of the film pressing mechanism shown in FIG. 1 sliding to another position;

[0016] Figure 3 This is an embodiment of the utility model Figure 1 A schematic diagram of the three-dimensional structure of the carrier shown in FIG.

[0017] Figure 4 This is an embodiment of the utility model Figure 1 A schematic diagram of the three-dimensional structure of the film pressing mechanism shown in FIG.

[0018] Figure 5 This is an embodiment of the utility model Figure 1 A schematic diagram of the three-dimensional structure of the film pulling mechanism shown in ;

[0019] Figure 6 This is an embodiment of the utility model Figure 1 Schematic diagram of the explosion structure of the film pulling mechanism shown in;

[0020] Figure 7 This is an embodiment of the utility model Figure 1 A schematic diagram of the three-dimensional structure of the cutter mechanism shown in FIG.

[0021] Figure 8 This is an embodiment of the utility model Figure 1 A schematic diagram of the top view of the tool holder shown in ;

[0022] Fig. 9 This is an embodiment of the utility model Figure 8 The enlarged cross-sectional structural diagram of the tool holder along the AA1 direction shown in FIG.

[0023] Fig.10 It is a schematic diagram of the top structure of a tool holder according to another embodiment of the utility model. DETAILED DESCRIPTION

[0024] As described in the background art, the existing manual gold stripping method is inefficient and affects wafer performance, and the existing gold stripping method needs to be improved.

[0025] In order to solve the above problems, the utility model provides a wafer gold tearing machine. After the sticky film is laid on the wafer surface, the roller of the film pressing mechanism is used to roll the sticky film on the wafer surface so that the sticky film adheres to the wafer surface, thereby avoiding the problem of incomplete gold tearing that is easily caused during manual gold tearing, thereby improving the quality of gold tearing and reducing the contact between manual labor and wafer, thereby reducing the probability of wafer contamination and wafer damage caused by manual operation.

[0026] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] Figure 1 It is a three-dimensional structural schematic diagram of a wafer gold tearing machine according to an embodiment of the utility model;

[0028] Figure 2 This is an embodiment of the utility model Figure 1 A schematic diagram of the structure of the film pressing mechanism shown in FIG. 1 sliding to another position from above.

[0029] Please refer to Figure 1 and Figure 2The wafer gold tearing machine includes: a supporting platform 10; a carrier 20, the carrier 20 is fixed to the surface of the supporting platform 10, the surface of the carrier 20 includes at least one wafer fixing area 201, and the wafer fixing area 201 is used to fix the wafer (not shown in the figure); a film pressing mechanism 30, the film pressing mechanism 30 includes a roller 300 arranged parallel to a first direction X, the roller 300 can rotate around the axis and reciprocate along a second direction Y, the first direction X and the second direction Y are both parallel to the surface of the carrier 20, and the first direction X and the second direction Y have a preset angle, the roller 300 is used to roll the sticky film laid on the surface of the wafer, so that the sticky film adheres to the surface of the wafer.

[0030] When the wafer tearing machine is in use, after the wafer is fixed on the wafer fixing area 201, the adhesive film is laid on the surface of the wafer, and then the roller 300 is driven to roll the adhesive film laid on the surface of the wafer so that the adhesive film adheres to the surface of the wafer, and then the adhesive film is removed from the surface of the wafer, and finally the wafer is removed from the wafer fixing area 201.

[0031] Here, after the sticky film is laid on the surface of the wafer, the roller 300 of the film pressing mechanism 30 is used to roll the sticky film on the surface of the wafer so that the sticky film adheres to the surface of the wafer, thereby avoiding the problem of incomplete gold tearing that is easy to occur during manual gold tearing, thereby improving the quality of gold tearing and reducing the contact between manual labor and the wafer, thereby reducing the probability of wafer contamination and wafer damage caused by manual operation.

[0032] In this embodiment, the preset angle is 90 degrees, that is, the first direction X and the second direction Y are perpendicular to each other.

[0033] In this embodiment, the method of fixing the wafer by the carrier 20 includes an adsorption method, which can reduce the contact probability between the wafer fixing device and the wafer, thereby helping to reduce wafer contamination and mechanical damage to the wafer.

[0034] Figure 3 This is an embodiment of the utility model Figure 1 Schematic diagram of the three-dimensional structure of the carrier shown in FIG.

[0035] Please refer to Figure 3 , and continue to refer to Figure 1 and Figure 2 The carrier 20 has a carrier sealing cavity (not shown in the figure), the wafer fixing area 201 of the carrier 20 has at least one vacuum suction hole 202, and the carrier 20 also has an exhaust port 203 located outside the wafer fixing area 201, and the vacuum suction hole 202 and the exhaust port 203 both connect the carrier sealing cavity to the outside of the carrier 20.

[0036] In this embodiment, the plurality of vacuum suction holes 202 are evenly arranged in the wafer fixing area 201. The plurality of vacuum suction holes 202 are evenly arranged in the wafer fixing area 201, which is beneficial to improving the uniformity of the force applied to the wafer.

[0037] In this embodiment, the surface of the carrier 20 has six wafer fixing areas 201. It should be noted that the more the number of wafer fixing areas is, the larger the number of wafers processed at a time is, which is conducive to improving production efficiency, but at the same time it will affect the uniformity of the quality of the gold tearing of each wafer. Therefore, an appropriate number of wafer fixing areas can be set on the surface of the carrier according to actual conditions.

[0038] In this embodiment, the wafer gold tearing machine further includes: a vacuum control structure, which is used to form a negative pressure in the sealed cavity of the carrier to absorb the wafer placed in the wafer fixing area 201. The wafer is adsorbed on the wafer fixing area 201, thereby fixing the wafer to avoid the wafer being pulled along with the sticky film on the surface of the wafer during the gold tearing process, thereby damaging the wafer.

[0039] The vacuum control structure includes: a vacuum generating device (not shown in the figure) connected to the exhaust port 203; the vacuum generating device includes a vacuum pump device or a vacuum generator.

[0040] In this embodiment, the vacuum generating device is a vacuum pump device, that is, the vacuum pump device is used to form a negative pressure in the sealed cavity of the carrier.

[0041] In another embodiment, the vacuum generating device may also be a vacuum generator. The vacuum generator fills the stage sealing cavity with compressed gas, and may also generate negative pressure in the stage sealing cavity.

[0042] In this embodiment, please continue to refer to Figures 1 to 3The vacuum control structure further includes: a control switch 40, the control switch including a switch housing 401, a switch sealed cavity (not shown in the figure) located in the switch housing 401, and a baffle (not shown in the figure) located in the switch sealed cavity, the switch housing 401 having a first through hole 402 and a second through hole (not shown in the figure), the first through hole 402 and the second through hole both connecting the switch sealed cavity to the outside of the switch housing 401, the baffle being rotatably installed between the first through hole 402 and the second through hole, and connecting or isolating the first through hole 401 and the second through hole; a suction pipe (not shown in the figure), one end of the suction pipe being connected to the first through hole 402, the other end of which is connected to the vacuum generating device; a transfer tube (not shown in the figure), one end of which is connected to the exhaust port 203, and the other end of which is connected to the second through hole; opening the vacuum generating device and driving the baffle plate to connect the first through hole 402 with the second through hole to form a negative pressure in the carrier sealing cavity, thereby adsorbing the wafer placed on the wafer fixing position 201 and covered by the vacuum suction hole 202; driving the baffle plate to isolate the first through hole 402 from the second through hole, so that the negative pressure in the carrier sealing cavity disappears, thereby eliminating the adsorption force of the vacuum suction hole 202 on the wafer, so as to remove the wafer from the wafer fixing position 201.

[0043] The control switch 40 can be used to conveniently control whether the wafer is fixed in the wafer fixing area 201, so as to facilitate the gold peeling operation or remove the wafer from the surface of the carrier 20. In other embodiments, a vacuum pump device can be directly connected to the exhaust port, and the vacuum degree in the carrier sealed cavity can be controlled by a switch of the vacuum pump device, or other methods of opening / cutting off the connection between the vacuum pump device and the carrier sealed cavity can be used to control the vacuum degree in the carrier sealed cavity.

[0044] In this embodiment, the surface of the carrier 20 is further provided with a film taking hole 204, the film taking hole 204 connects the carrier sealed cavity to the outside of the carrier 20, and the film taking hole 204 is partially located in the wafer fixing area 201. After the gold stripping is completed, air can enter the carrier sealed cavity from the film taking hole 204. The provision of the film taking hole is conducive to increasing the speed at which the negative pressure of the carrier sealed cavity disappears, increasing the speed at which the operator takes away the wafer, thereby improving the gold stripping efficiency.

[0045] It should be noted that the number of the film taking holes 204 can be set to more than two to avoid the situation where the film taking hole 204 is easily blocked by the wafer when only a single film taking hole 204 is set, resulting in the air being unable to enter the carrier sealed cavity from the film taking hole 204, thereby increasing the speed at which the negative pressure in the carrier sealed cavity disappears, and thereby increasing the speed at which the operator takes away the wafer.

[0046] In this embodiment, the diameter of the film taking hole 204 is larger than the diameter of each vacuum suction hole 201. The purpose of making the diameter of the film taking hole 204 larger than the diameter of each vacuum suction hole 201 is to further increase the speed of the negative pressure disappearing in the stage sealing cavity.

[0047] Figure 4 This is an embodiment of the utility model Figure 1 Schematic diagram of the three-dimensional structure of the film pressing mechanism shown in FIG.

[0048] In this embodiment, please continue to refer to Figure 1 and Figure 2 , and please refer to Figure 4 The film pressing mechanism 30 also includes: a sliding structure, which can reciprocate along the second direction Y, and the roller 300 can be rotatably installed on the sliding structure; the sliding structure can drive the roller 300 to move relative to the carrier 20, and when the roller 300 moves to above the wafer fixing area 201, it can roll the adhesive film laid on the surface of the wafer.

[0049] In this embodiment, the sliding structure includes a first slider 303 and a second slider 304 that are relatively arranged; the film pressing mechanism 30 also includes: a first supporting rotating element 305 fixed to the surface of the first slider 303, and a second supporting rotating element 306 fixed to the surface of the second slider 304, one end of the roller shaft 300 cooperates with the first supporting rotating element 305, and the other end of the roller shaft 300 cooperates with the second supporting rotating element 305.

[0050] In this embodiment, the film pressing mechanism 30 also includes: a first sliding bar 301 and a second sliding bar 302 fixed on the surface of the supporting platform 10, the first sliding bar 303 is located on the first sliding bar 301 and can slide along the first sliding bar 301, the second sliding bar 304 is located on the second sliding bar 302 and can slide along the second sliding bar 302; the first sliding bar 301 and the second sliding bar 302 are both parallel to the second direction Y and arranged along the first direction X.

[0051] The material of the outer surface of the roller 300 may be rubber or other flexible materials to reduce the damage rate of the roller 300 to the wafer.

[0052] In this embodiment, both the first supporting rotating element 303 and the second supporting rotating element 306 are seated bearings.

[0053] In this embodiment, the first supporting rotating element 303 is located on the surface of the first sliding block 304 away from the supporting platform 10 , and the second supporting rotating element 306 is located on the surface of the second sliding block 304 away from the supporting platform 10 .

[0054] In this embodiment, the first slider 303 and the second slider 304 are arranged on both sides of the carrier 200 in the first direction X, and the height of the upper surface of the first slider 303 from the support platform 10 is less than the height of the wafer fixing position 211 from the support platform 10, the first supporting rotating element 303 is arranged on the surface of the first slider 303 away from the carrier 200, and the second supporting rotating element 306 is arranged on the surface of the second slider 304 away from the carrier 200, so that the distance between the roller 300 and the wafer fixing position 211 is appropriate, so that the roller 300 can roll the adhesive film on the surface of the wafer.

[0055] It should be noted that, in other embodiments, in order to achieve the purpose of enabling the roller to roll the adhesive film on the surface of the wafer, other arrangements may be adopted, for example, the first supporting rotating element is arranged on the first end surface of the first slider, the second supporting rotating element is arranged on the second end surface of the second slider, and the first end surface and the second end surface are opposite. The first slide bar and the second slide bar may also be arranged above part of the stage, etc.

[0056] In this embodiment, the film pressing mechanism 30 further includes a pushing component 307 , one end of which is fixed to the first slider 303 , and the other end of which is fixed to the second slider 304 , and can drive the sliding structure to reciprocate along the second direction Y.

[0057] Specifically, the pushing assembly 307 includes: a handle (not shown in the figure), one end of the handle is fixedly connected to the first slider 303, and the other end of the handle is fixedly connected to the second slider 304; pulling the handle can drive the first slider 303 and the second slider 304 to reciprocate along the second direction Y.

[0058] More specifically, in this embodiment, the pushing assembly 307 also includes: a first connecting structure 3071 fixed to the surface of the first slider 303, and a second connecting structure 3072 fixed to the surface of the second slider 304, one end of the handle is fixedly connected to the first slider 303 through the first connecting structure 3071, and the other end of the handle is fixedly connected to the second slider 304 through the second connecting structure 3072.

[0059] In this embodiment, the first connecting structure 3071 includes: a first connecting plate (not shown in the figure) and a second connecting plate (not shown in the figure), and the first connecting plate and the second connecting plate are located on both sides of the first supporting rotating element 305 in the second direction Y; the second connecting structure 3072 includes: a third connecting plate (not shown in the figure) and a fourth connecting plate (not shown in the figure), and the third connecting plate and the fourth connecting plate are located on both sides of the second supporting rotating element 306 in the second direction Y.

[0060] In this embodiment, the pushing assembly also includes: a fifth connecting plate 3073, which is located above the roller 300, the first connecting structure 3071 and the second connecting structure 3072, and its two ends are respectively fixedly connected to the first connecting structure 3071 and the second connecting structure 3072; one end of the handle is fixedly connected to the fifth connecting plate 3073 on the first slider 303, and the other end of the handle is fixedly connected to the fifth connecting plate 3073 on the second slider 304.

[0061] In this embodiment, the lamination mechanism further includes: a roller height adjustment structure (not shown in the figure) for adjusting the distance between the roller 300 and the wafer fixing area 201. In another embodiment, the roller height adjustment structure may not be included.

[0062] In this embodiment, the roller height adjustment structure includes two adjustment parts, one of which can adjust the distance between one end of the roller 300 and the wafer fixing area 201, and the other adjustment part can adjust the distance between the other end of the roller 300 and the wafer fixing area 201, thereby adjusting the distance between the roller 300 and the wafer fixing area 201.

[0063] In this embodiment, each of the adjusting parts includes: at least one first fastener, the first fastener includes a fastening rod and a fastening cap, the fifth connecting plate 3073 has a third through hole corresponding to the first fastener, suitable for the first fastener to pass through and match the fastening cap, the fastening rod is threadedly connected with the first supporting rotating element 305 or the second supporting rotating element 306; a third spring, the third spring is sleeved on the fastening rod, one end of the third spring abuts against the first supporting rotating element 305 or the second supporting rotating element 306, and the other end abuts against the fifth connecting plate 3073; when adjusting the height of the roller 300 During the process, the first fastener is driven to move in a direction away from the support platform 10, thereby reducing the force of the third spring on the first support rotating element 305 or the second support rotating element 306, and increasing the distance between one end of the roller 300 and the wafer fixing area 201; in the process of adjusting the height of the roller 300, the first fastener is driven to move in a direction close to the support platform 10, thereby increasing the force of the third spring on the first support rotating element 305 or the second support rotating element 306, and reducing the distance between one end of the roller 300 and the wafer fixing area 201.

[0064] In this embodiment, each of the adjustment parts also includes: at least one second fastener, the fifth connecting plate 3073 has a fourth through hole corresponding to the second fastener, the second fastener is threadedly connected to the fourth through hole, the second fastener passes through the fourth through hole, and abuts against the first supporting rotating element 305 or the second supporting rotating element 306; in the process of adjusting the height of the roller 300, the first fastener and the second fastener are driven to move in a direction away from the supporting platform 10, thereby reducing the force of the third spring on the first supporting rotating element 305 or the second supporting rotating element 306, and increasing the distance between the roller 300 and the wafer fixing area 201; in the process of adjusting the height of the roller 300, the first fastener and the second fastener are driven to move in a direction close to the supporting platform 10, thereby increasing the force of the third spring on the first supporting rotating element 305 or the second supporting rotating element 306, and reducing the distance between the roller 300 and the wafer fixing area 201.

[0065] Figure 5 This is an embodiment of the utility model Figure 1 A schematic diagram of the three-dimensional structure of the film pulling mechanism shown in ;

[0066] Figure 6 This is an embodiment of the utility model Figure 1 Schematic diagram of the explosion structure of the membrane pulling mechanism shown in.

[0067] In this embodiment, please continue to refer to Figure 1 and Figure 2 , and refer to Figure 5 and Figure 6 The wafer gold tearing machine also includes: a film pulling mechanism 50, which is used to fix the adhesive film that can be laid on the surface of the wafer; the film pulling mechanism 50 is located on one side of the carrier 20.

[0068] In this embodiment, the film pulling mechanism 50 includes: a film pulling support structure 500 fixed to the supporting platform 10 and a first connecting shaft 501, the first connecting shaft 501 is installed on the film pulling support structure 500, the first connecting shaft 501 is suitable for installing an adhesive film roll (not shown in the figure) for providing the adhesive film, and the first connecting shaft 501 is arranged parallel to the first direction X or the second direction Y; the movable end of the adhesive film on the adhesive film roll is pulled, and the adhesive film roll rotates to lay the adhesive film on the wafer surface on the wafer fixing area 201.

[0069] In this embodiment, the adhesive film roll rotates synchronously with the first connecting shaft, and the first connecting shaft is rotatably installed at both ends of the film-pulling support structure; in another embodiment, the adhesive film roll can rotate around the first connecting shaft, and the first connecting shaft is fixed to both ends of the film-pulling support structure.

[0070] In this embodiment, the adhesive film roll has a roll through hole (not shown in the figure), which is suitable for the first connecting shaft 501 to pass through. Specifically, the adhesive film roll also includes a roll shell (not shown in the figure), the adhesive film is wound on the surface of the roll shell, and the roll shell has the roll through hole, which is suitable for the first connecting shaft 501 to pass through.

[0071] The film pulling mechanism 50 further includes: a roll limiting structure 502, which is fixed to the first connecting shaft 501 and can abut against the inner wall of the roll through hole to limit the adhesive film roll.

[0072] In this embodiment, the reel limiting structure 502 includes: a cam 5020 and an elastic baffle 5021, the elastic baffle 5021 includes a baffle mounting end (not shown in the figure), and an abutment end opposite to the baffle mounting end (not shown in the figure), the cam 5020 is fixed on the first connecting shaft 501, and the first connecting shaft 501 penetrates the cam 5020 axially along the cam 5020, the cam 5020 has a cut surface 5020a on the side wall away from the first connecting shaft 501, the baffle mounting end is fixed on the cut surface 5020a of the cam 5020, and the abutment end can abut against the inner wall of the reel through hole.

[0073] In another embodiment, the reel limiting structure includes: an elastic blocking piece fixed to the first connecting shaft, and the elastic blocking piece can abut against the inner wall of the reel through hole at one end away from the first connecting shaft.

[0074] In another embodiment, the reel limiting structure includes: a cam, the first connecting shaft penetrates the cam along the cam axis, and the cam can abut against the inner wall of the reel through hole at one end away from the first connecting shaft.

[0075] The first connecting shaft 501 includes a roll portion 5010 and a first clamping portion 5011, wherein the first clamping portion 5011 is located at one end or both ends of the roll portion 5010, and the diameter of the first clamping portion 5011 is smaller than the diameter of the roll portion 5010; the adhesive film roll is installed on the roll portion 5010, and the first clamping portion 5011 is rotatably installed on the film pulling support structure 500.

[0076] The film-drawing mechanism 50 also includes: at least one rotating wheel 503, which is detachably mounted on the film-drawing support structure 500, and has a rotating hole 5031 adapted to the first clamping portion 5011; the first clamping portion 5011 can be mounted on the film-drawing support structure 500 through the rotating wheel 503.

[0077] In this embodiment, the first clamping portion 5011 is located at one end of the reel portion 5010. The first clamping portion 5011 is also used to install a positioning block and a speed adjustment structure.

[0078] In another embodiment, the first clamping portions are located at two ends of the winding drum portion.

[0079] The film pulling mechanism 50 also includes: a positioning block 504 fixed to one end or both ends of the roll portion 5010, the positioning block 504 having a positioning through hole 5042, a mounting portion 5043 and a contact portion 5041, the positioning through hole 5042 passes through the contact portion 5041 and the mounting portion 5043, and matches the first clamping portion 5011, the mounting portion 5043 is away from the adhesive film roll mounted on the first connecting shaft 501, and the contact portion 5041 is close to the adhesive film roll mounted on the first connecting shaft 501; the diameter of the contact portion 5041 is larger than the inner diameter of the adhesive film roll; the positioning block 504 is used to locate the installation position of the adhesive film roll.

[0080] In this embodiment, the mounting portion 5043 has a plurality of first top holes 5044 that cooperate with first top screws (not shown in the figure), and the extension direction of the first top holes 5044 is perpendicular to the extension direction of the positioning through holes 5042.

[0081] In this embodiment, the positioning structure is provided at one end of the reel portion 5010. Specifically, the shaft fixing block 505 is installed at the end region of the reel portion 5010 adjacent to the first clamping portion 5011. In another embodiment, the positioning structure may be provided at both ends of the reel portion.

[0082] In this embodiment, the film pulling mechanism 50 also includes a speed regulating structure installed on the first clamping part 5011, and the speed regulating structure includes: an axis fixing block 505, the diameter of the axis fixing block 505 is larger than the diameter of the positioning through hole 5042, the axis fixing block 505 has a fixing block through hole 5051 that penetrates along its own axis, the fixing block through hole 5051 is adapted to the clamping part 5011, the reel part 5010 has a groove (not shown in the figure) at one end adjacent to the first clamping part 5011, the axis fixing block 505 has a protrusion 5052 that matches the groove, and after the protrusion 5052 is inserted into the groove, the axis fixing block 50 5 and the positioning block 504; rotating handle 506, the first clamping part 5011 has an external thread to be threadedly connected with the rotating handle 506; a first spring (not shown in the figure), the first spring can be slidably sleeved on the first clamping part 5011, one end of the first spring can abut against the rotating handle 506, and the other end can abut against the rotating wheel 503 on the first clamping part 5011, rotating the rotating handle 506 can push the rotating wheel 503 on the first clamping part 5011 to move toward the axis fixing block 505, and apply pressure to the axis fixing block 505, so that friction is generated between the rotating wheel 503 and the axis fixing block 505. The friction will increase the rotation resistance of the first connecting shaft 501, thereby controlling the pulling speed of the adhesive film, which is conducive to improving the gold tearing quality.

[0083] In this embodiment, the speed regulating structure is installed on the first clamping portion 5011 at one end of the reel portion 5010. In another embodiment, the speed regulating structure may be provided at both ends of the reel portion.

[0084] In this embodiment, the film-pulling support structure 500 includes a first support 5001 and a second support 5002 that are relatively arranged; the first connecting shaft 501 also includes a second clamping portion 5012, the first clamping portion 5011 and the second clamping portion 5012 are located at opposite ends of the winding drum portion 5010, and the rotating hole 5031 is also adapted to the second clamping portion 5012.

[0085] In this embodiment, the film pulling mechanism 50 includes two rotating wheels 503, one of the rotating wheels 503 is detachably mounted on the first bracket 5001, and the other rotating wheel 503 is detachably mounted on the second bracket 5002; the first clamping portion 5011 can be mounted on the first bracket through one of the rotating wheels 503, and the second clamping portion 5012 can be mounted on the second bracket 5002 through the other rotating wheel 503, so that the first connecting shaft 501 rotates relative to the two rotating wheels 503.

[0086] In this embodiment, the rotating wheel 503 includes a rotating body 5030, and a first rotating end 5032 and a second rotating end 5033 respectively connected to the two ends of the rotating body 5030, and the rotating hole 5031 passes through the first rotating end 5032, the rotating body 5030 and the second rotating end 5033; the first bracket 5001 is arranged perpendicular to the surface of the supporting platform 10, and the first bracket 5001 has a first groove 5001a that matches the rotating wheel 503, and the first groove 5001a passes through the first direction X. The first bracket 5001 extends from the end surface of the first bracket 5001 away from the support platform 10 to a preset depth in the direction of the support platform 10; the second bracket 5002 is arranged perpendicular to the surface of the support platform 10, and the second bracket 5002 has a second groove 5002a that cooperates with the rotating wheel 503, the second groove 5002a penetrates the second bracket 5002 along the first direction X, and extends from the end surface of the second bracket 5002 away from the support platform 10 in the direction of the support platform 10 to a preset depth.

[0087] In this embodiment, the rotating wheel 503 also includes a rotating connecting rod (not shown in the figure), the rotating connecting rod has an external thread, the first rotating end 5032 also has a first end hole (not shown in the figure) that matches with one end of the rotating connecting rod, and the second rotating end 5033 also has a second end hole (not shown in the figure) that matches with the rotating connecting rod; the rotating connecting rod is fixed to the rotating wheel and contacts with the first groove or the second groove to fix the rotating wheel 503 in the first groove 5001a or the second groove 5002a.

[0088] After one of the rotating wheels 503 is placed in the first groove 5001a, the rotating wheel 503 is fixed by using a rotating connecting rod, and the rotating connecting rod is in contact with the first groove 5001a; after the other rotating wheel 503 is placed in the second groove 5002a, the rotating wheel 503 is fixed by using another rotating connecting rod, and the rotating connecting rod of the other rotating wheel 503 is in contact with the second groove 5002a.

[0089] In this embodiment, the first clamping portion 5011 also includes a first clamping area 5011a and a second clamping area 5011b, the first clamping area 5011a is located between the reel portion 5010 and the second clamping area 5010b, the diameter of the first clamping area 5011a is greater than the diameter of the second clamping area 5010b, the rotating handle 506 is threadedly connected to the second clamping area 5011b, and the fixed block through hole 5051 and the rotating hole 5031 cooperate with the first clamping area 5011a.

[0090] In this embodiment, the film-drawing mechanism 50 further includes: a second connecting shaft 507 fixed to the film-drawing support structure 500, and relative to the first connecting shaft 501, the second connecting shaft 507 is close to the carrier 20 in a direction perpendicular to the surface of the support platform 10 and in a direction parallel to the surface of the support platform 10. Specifically, one end of the second connecting shaft 507 is fixed to the first support 5001, and the other end is fixed to the second support 5002.

[0091] When pulling the adhesive film, the movable end of the adhesive film is passed through the gap between the second connecting shaft 507 and the supporting platform 10, and then laid on the wafer surface on the wafer fixing area 201. This can reduce the height difference between the adhesive film and the wafer, and reduce the bubbles between the wafer and the adhesive film laid on the wafer surface, which is beneficial to the uniformity of metal peeling on the wafer surface and improves the quality of gold peeling.

[0092] In this embodiment, the film pulling mechanism 50 further includes: a first bracket seat 508 and a second bracket seat 509 , the first bracket 5001 is fixed on the first bracket seat 508 , and the second bracket 5002 is fixed on the second bracket seat 509 .

[0093] In this embodiment, the film pulling mechanism 50 also includes: an axis fastening block 510, and the axis fastening block 510 has a fastening hole 5101 matching the second clamping part 5012; during installation, after the installation of the rotating wheel 503 of the second clamping part 5012 is completed, the end of the first connecting shaft 501 where the second clamping part 5012 is located is fastened by the axis fastening block 510.

[0094] In this embodiment, the film pulling mechanism 50 is located at one side of the carrier 20 in the second direction Y, and the first connecting axis 501 is arranged parallel to the first direction X.

[0095] In another embodiment, the film pulling mechanism is located on one side of the carrier in the first direction, and the first connecting axis is arranged parallel to the second direction.

[0096] Figure 7 This is an embodiment of the utility model Figure 1 Schematic diagram of the three-dimensional structure of the cutter mechanism shown in FIG.

[0097] In this embodiment, please continue to refer to Figure 1 and Figure 2 , and refer to Figure 7 The wafer tearing machine also includes: a cutter mechanism 60, which follows the roller 300 to reciprocate along the second direction Y; the cutter mechanism 60 includes a pushing component and a cutter 603, the pushing component includes a cutter guide rail 601 and a cutter slider 602, the cutter slider 602 can slide along the cutter guide rail 601, the cutter guide rail 601 is parallel to the first direction X, the cutter 603 is fixed to the cutter slider 602, and the cutter 603 is used to cut the sticky film to separate the sticky film adhered to the wafer surface from the sticky film roll.

[0098] When the wafer tearing machine is in use, after the adhesive film is laid on the wafer surface and before the roller 300 is used to roll the adhesive film laid on the wafer surface, the tool 603 is used to cut the adhesive film to separate the adhesive film adhered to the wafer surface from the adhesive film roll.

[0099] In this embodiment, the pushing assembly 307 is also used to drive the cutter mechanism 60 to reciprocate along the second direction Y.

[0100] Specifically, one end of the cutter guide rail 601 is fixed to the first connection structure 3071 , and the other end is fixed to the second connection structure 3072 .

[0101] More specifically, one end of the cutter guide rail 601 is fixed to the first connecting plate, and the other end is fixed to the third connecting plate.

[0102] The end surface of the carrier 20 close to the film pulling mechanism 50 has a knife groove 205 parallel to the first direction X. The knife groove 205 matches the tool 603. The knife groove 205 helps to cut the adhesive film more neatly and improve the utilization rate of the adhesive film.

[0103] In this embodiment, the tool 603 is a blade.

[0104] Figure 8 This is an embodiment of the utility model Figure 1 A schematic diagram of the top view of the tool holder shown in ;

[0105] Fig. 9 This is an embodiment of the utility model Figure 8The enlarged cross-sectional structure diagram of the tool holder along the AA1 direction shown in

[0106] In this embodiment, please continue to refer to Figure 1 and Figure 2 , and refer to Figure 8 and Fig. 9 The cutter mechanism 60 also includes a knife holder 604 for fixing the knife 603, and the knife holder 604 includes: a cutter housing 6041, the cutter housing 6041 is fixed to the cutter slider 602, and has a pressing opening 604a and a knife opening 604b; a fixing frame, the fixing frame is arranged in the cutter housing 6041, the fixing frame includes a fixing plate structure 60A, the fixing plate structure 60A has a first end face (not shown in the figure) adjacent to the pressing opening 604a, and a second end face (not shown in the figure) adjacent to the knife opening 604b, the knife 603 is fixed to the second end face of part of the fixing plate structure 60A, and can enter and exit the cutter housing 6041 from the knife opening 604b; a pressing block 6044, the pressing block 6044 is from the outside of the cutter housing 6041, through the The pressing opening 604a extends into the cutter housing 6041 and is fixed to the first end surface of the fixed plate structure 60A; the second spring 6045, the second spring 6045 is installed between the second end surface of the fixed plate structure 60A and the inner wall of the cutter housing 6041; a limiting member (not shown in the figure) is connected to the fixed plate structure 60A; pressing the pressing block 6044 can drive the tool 603 to extend from the cutter housing 6041 and compress the second spring 6045, and the fixed plate structure 60A is fixed in position by the limiting member to cut the adhesive film; pressing the pressing block 6044 can make the limiting member move away from the fixed plate structure 60A and reset the second spring 6045 to allow the tool 603 to enter the cutter housing 6041.

[0107] In this embodiment, one end of the second spring 6045 is fixed to the inner wall of the cutter housing 6041, and the other end of the second spring 6045 is suspended. In another embodiment, one end of the second spring is fixed to the inner wall of the cutter housing, and the other end of the second spring is fixed to the pressing and fixing plate.

[0108] In this embodiment, the fixing plate structure 60A includes a pressing fixing plate 6042 and a tool fixing plate 6043 located on a partial surface of the pressing fixing plate 6042 , the tool 603 is fixed to the tool fixing plate 6043 , and the pressing block 6044 is fixed to the pressing fixing plate 6042 .

[0109] In another embodiment, the cutting mechanism also includes a tool holder for fixing the cutting tool, and the tool holder includes: a first clamping plate and a second clamping plate, the first clamping plate is fixed to the cutting tool slider, the second clamping plate is fixed to the first clamping plate, and the cutting tool is fixed between the first clamping plate and the second clamping plate, and protrudes toward the side close to the carrier.

[0110] In this embodiment, please continue to refer to Figure 2 The end surface of the carrier 20 close to the film pulling mechanism 50 has a knife groove 205 parallel to the first direction X, and the knife groove 205 matches the knife 603.

[0111] In this embodiment, the support platform 10 is fixedly connected with a movable wheel (not shown in the figure) on a surface away from the carrier 20. The movable wheel can conveniently move the wafer tearing machine to a desired position for operation.

[0112] Fig.10 It is a schematic diagram of the top structure of a tool holder according to another embodiment of the utility model.

[0113] The main difference between this embodiment and the previous embodiment is that the tool holder structure is different.

[0114] Please Figures 1 to 6 Based on this, continue to refer to Fig.10 The wafer tearing machine also includes: a cutter mechanism 70, the cutter mechanism 70 moves with the roller 300, the cutter mechanism 70 includes a pushing assembly and a cutter (not shown in the figure), the pushing assembly includes a cutter guide rail 701 and a cutter slider 702, the cutter slider 702 can slide along the cutter guide rail 701, the cutter guide rail 701 is parallel to the first direction X, the cutter is fixed to the cutter slider 702, and the cutter is used to separate the adhesive film adhered to the surface of the wafer from the adhesive film roll.

[0115] In this embodiment, the cutting mechanism 70 further includes a tool holder 703 for fixing the cutting tool, and the tool holder 703 includes: a first clamping plate 703a and a second clamping plate 703b, the first clamping plate 703a is fixed to the cutting tool slider 702, the second clamping plate 703b is fixed to the first clamping plate 703a, the cutting tool is fixed between the first clamping plate 703a and the second clamping plate 703b, and is moved toward the carrier 20 (such as Figure 2 One side of the housing (as shown) is convex.

[0116] The wafer gold tearing machine of the utility model can be applied in the manufacturing process of micro display panels.

[0117] The micro display panel described above has a very small volume, and the length and width dimensions are between 500μm and 50000μm. The area of ​​the light-emitting area of ​​the above-mentioned micro display panel is very small, such as 1mm×1mm, 2.64mm×2.02mm, 3mm×5mm, etc. The light-emitting area of ​​the above-mentioned micro display panel includes a plurality of micro LED pixels arranged in an array, and the specific pixel arrangement can be one of 320×240, 640×480, 1600×1200, 1920×1080, and 2560×1440. The size of a single micro LED pixel is between 100nm and 100μm. In some embodiments, the size of a single micro LED pixel is between 150nm and 15μm. In some embodiments, the size of a single micro LED pixel can also be less than 10μm.

[0118] A driving backplane is arranged on the back of the micro LED pixel array. The driving backplane is electrically connected to the micro LEDs in the micro LED pixel array. The driving backplane can obtain signals such as image data from the outside world and can control the corresponding micro LEDs to emit light or not. The driving backplane is a TFT (Thin Film Transistor) board or an IC (Integrated Circuit) board.

[0119] For example, the driving backplane of the above-mentioned micro display panel integrates a frame buffer, a column driving circuit, and a row driving circuit. The frame buffer includes a first pixel storage area, and the micro LED pixel array includes a second pixel storage area. A complete frame of pixel grayscale data from the outside world can first enter the first pixel storage area of ​​the frame buffer, and the column driving circuit can load the pixel grayscale data in the first pixel storage area of ​​the frame buffer to the second pixel storage area of ​​the micro LED pixel array. The row driving circuit can scan the pixel grayscale data in the second pixel storage area and generate a pulse modulation signal to achieve the purpose of displaying different grayscales. When driving multiple micro LED pixels in the micro LED pixel array, either a single pixel can be driven independently or multiple pixel units can be driven independently. The specific driving method should not constitute a limitation to the present utility model.

[0120] It should be noted that the application of the wafer gold tearing machine of the present invention in the process of manufacturing micro display panels should not constitute a limitation on the application of the present invention.

[0121] Although the utility model is disclosed as above, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the scope defined by the claims.

Claims

1. A wafer gold tearing machine, characterized in that: include: Support platform; A carrier, the carrier is fixed to the surface of the support platform, the carrier surface includes at least one wafer fixing area, and the wafer fixing area is used to fix the wafer; The film pressing mechanism includes a roller shaft arranged parallel to a first direction, the roller shaft can rotate around an axial direction and reciprocate along a second direction, the first direction and the second direction are both parallel to the surface of the carrier, and the first direction and the second direction have a preset angle, the roller shaft is used to roll the adhesive film laid on the surface of the wafer so that the adhesive film adheres to the surface of the wafer.

2. The wafer gold tearing machine according to claim 1, characterized in that: The method of fixing the wafer on the carrier includes an adsorption method.

3. The wafer gold tearing machine as claimed in claim 2, characterized in that: The carrier has a carrier sealing cavity inside, the wafer fixing area of ​​the carrier has at least one vacuum suction hole, and the carrier also has an exhaust port located outside the wafer fixing area, and the vacuum suction hole and the exhaust port both connect the carrier sealing cavity to the outside of the carrier; The wafer tearing machine also includes a vacuum control structure, which is used to form a negative pressure in the sealed cavity of the carrier to absorb the wafer placed in the wafer fixing area.

4. The wafer gold tearing machine as claimed in claim 3, characterized in that: The vacuum control structure further includes: a control switch, the control switch including a switch housing, a switch sealed cavity located in the switch housing, and a baffle located in the switch sealed cavity, the switch housing having a first through hole and a second through hole, the first through hole and the second through hole both connecting the switch sealed cavity to the outside of the switch housing, the baffle being rotatably installed between the first through hole and the second through hole, and connecting or isolating the first through hole and the second through hole; Vacuum generating device; A suction pipe, one end of which is connected to the first through hole, and the other end of which is connected to the vacuum generating device; A transfer tube, one end of which is connected to the exhaust port, and the other end of which is connected to the second through hole; The vacuum generating device is turned on and the baffle is driven to make the first through hole communicate with the second through hole, so as to form a negative pressure in the stage sealing cavity, thereby adsorbing the wafer placed in the wafer fixing position and covering the vacuum suction hole; The baffle is driven to isolate the first through hole from the second through hole, so that the negative pressure in the carrier sealing cavity disappears, thereby eliminating the adsorption force of the vacuum suction hole on the wafer, so as to remove the wafer from the wafer fixing position.

5. The wafer gold tearing machine as claimed in claim 3, characterized in that: The surface of the carrier also has a film taking hole, which connects the carrier sealing cavity to the outside of the carrier, and the film taking hole is partially located in the wafer fixing area.

6. The wafer gold tearing machine as claimed in claim 5, characterized in that: The diameter of the film taking hole is larger than the diameter of each of the vacuum suction holes.

7. The wafer gold tearing machine according to claim 1, characterized in that: The film pressing mechanism also includes: a sliding structure, which can reciprocate along the second direction, and the roller can be rotatably installed on the sliding structure; the sliding structure can drive the roller to move relative to the carrier, and when the roller moves to above the wafer fixing area, it can roll the adhesive film laid on the surface of the wafer.

8. The wafer gold tearing machine as claimed in claim 7, characterized in that: The sliding structure includes a first slider and a second slider arranged opposite to each other; the film pressing mechanism also includes: a first supporting rotating element fixed to the surface of the first slider, and a second supporting rotating element fixed to the surface of the second slider, one end of the roller shaft cooperates with the first supporting rotating element, and the other end of the roller shaft cooperates with the second supporting rotating element.

9. The wafer gold tearing machine as claimed in claim 8, characterized in that: The film pressing mechanism also includes: a first sliding bar and a second sliding bar fixed to the surface of the supporting platform, the first sliding bar is located on the first sliding bar and can slide along the first sliding bar, the second sliding bar is located on the second sliding bar and can slide along the second sliding bar; the first sliding bar and the second sliding bar are both parallel to the second direction and arranged along the first direction.

10. The wafer gold tearing machine according to claim 8, characterized in that: The film pressing mechanism also includes a pushing component, one end of which is fixed to the first slider, and the other end of which is fixed to the second slider, and can drive the sliding structure to reciprocate along the second direction; the pushing component includes: a handle, one end of which is fixedly connected to the first slider, and the other end of which is fixedly connected to the second slider; pulling the handle can drive the first slider and the second slider to reciprocate along the second direction.

11. The wafer gold tearing machine according to claim 10, characterized in that: The pushing assembly also includes: a first connecting structure fixed to the surface of the first slider, and a second connecting structure fixed to the surface of the second slider, one end of the handle is fixedly connected to the first slider via the first connecting structure, and the other end of the handle is fixedly connected to the second slider via the second connecting structure.

12. The wafer gold tearing machine according to claim 11, characterized in that: The first connection structure includes: a first connection plate and a second connection plate, and the first connection plate and the second connection plate are located on both sides of the first supporting rotating element in the second direction; the second connection structure includes: a third connection plate and a fourth connection plate, and the third connection plate and the fourth connection plate are located on both sides of the second supporting rotating element in the second direction.

13. The wafer gold tearing machine according to claim 11, characterized in that: The pushing assembly also includes: a fifth connecting plate, which is located on the side of the roller shaft, the first connecting structure and the second connecting structure away from the supporting platform, and the two ends of the fifth connecting plate are respectively fixedly connected to the first connecting structure and the second connecting structure; one end of the handle is fixedly connected to the fifth connecting plate on the first slider, and the other end of the handle is fixedly connected to the fifth connecting plate on the second slider.

14. The wafer gold tearing machine according to claim 13, characterized in that: The lamination mechanism further comprises: a roller height adjustment structure for adjusting the distance between the roller and the wafer fixing area.

15. The wafer gold tearing machine according to claim 14, characterized in that: The first supporting rotating element is located on the surface of the first slider on the side away from the supporting platform, and the second supporting rotating element is located on the surface of the second slider on the side away from the supporting platform; the roller height adjustment structure includes two adjusting parts, one of which can adjust the distance between one end of the roller and the wafer fixing area, and the other adjusting part can adjust the distance between the other end of the roller and the wafer fixing area, thereby adjusting the distance between the roller and the wafer fixing area.

16. The wafer gold tearing machine according to claim 15, characterized in that: Each of the adjustment units comprises: at least one first fastener, the first fastener comprising a fastening rod and a fastening cap, the fifth connecting plate having a third through hole corresponding to the first fastener, suitable for the first fastener to pass through and match the fastening cap, the fastening rod being threadedly connected to the first supporting rotating element or the second supporting rotating element; a third spring, wherein the third spring is sleeved on the fastening rod, one end of the third spring abuts against the first supporting rotating element or the second supporting rotating element, and the other end of the third spring abuts against the fifth connecting plate; In the process of adjusting the height of the roller shaft, the first fastener is driven to move in a direction away from the support platform, so as to reduce the force of the third spring on the first supporting rotating element or the second supporting rotating element, and increase the distance between one end of the roller shaft and the wafer fixing area; During the process of adjusting the height of the roller, the first fastener is driven to move toward the support platform, thereby increasing the force of the third spring on the first support rotating element or the second support rotating element and reducing the distance between one end of the roller and the wafer fixing area.

17. The wafer gold tearing machine according to claim 16, characterized in that: Each of the adjustment units further comprises: at least one second fastener, the fifth connecting plate has a fourth through hole corresponding to the second fastener, the second fastener is threadedly connected to the fourth through hole, the second fastener passes through the fourth through hole, and abuts against the first supporting rotating element or the second supporting rotating element; in the process of adjusting the height of the roller shaft, the first fastener and the second fastener are driven to move in a direction away from the supporting platform, so as to reduce the force of the third spring on the first supporting rotating element or the second supporting rotating element, and increase the distance between the roller shaft and the wafer fixing area; During the process of adjusting the height of the roller, the first fastener and the second fastener are driven to move toward the support platform, thereby increasing the force of the third spring on the first supporting rotating element or the second supporting rotating element and reducing the distance between the roller and the wafer fixing area.

18. The wafer gold tearing machine according to claim 1, characterized in that: The wafer gold tearing machine also includes: a film pulling mechanism, which is used to fix the adhesive film that can be laid on the surface of the wafer; the film pulling mechanism is located on one side of the carrier.

19. The wafer gold tearing machine according to claim 18, characterized in that: The film pulling mechanism includes: a film pulling support structure fixed to the supporting platform and a first connecting shaft, the first connecting shaft is installed on the film pulling support structure, the first connecting shaft is suitable for installing a sticky film roll for providing the sticky film, and the first connecting shaft is arranged parallel to the first direction or the second direction; the movable end of the sticky film on the sticky film roll is pulled, and the sticky film roll rotates to lay the sticky film on the wafer surface on the wafer fixing area.

20. The wafer gold tearing machine according to claim 19, characterized in that: The adhesive film roll has a roll through hole suitable for the first connecting shaft to pass through; the film pulling mechanism also includes: a roll limiting structure, which is fixed to the first connecting shaft and can abut against the inner wall of the roll through hole to limit the adhesive film roll.

21. The wafer gold tearing machine according to claim 20, characterized in that: The reel limiting structure comprises: an elastic blocking piece fixed to the first connecting shaft, wherein the elastic blocking piece can abut against the inner wall of the reel through hole at one end away from the first connecting shaft; Alternatively, a cam, wherein the first connecting shaft penetrates the cam along the cam axis, and the cam can abut against the inner wall of the reel through hole at one end away from the first connecting shaft; Alternatively, a cam and an elastic baffle, the elastic baffle comprising a baffle mounting end and an abutment end opposite to the baffle mounting end, the cam being fixed on the first connecting shaft, and the first connecting shaft passing through the cam axially along the cam shaft, the cam having a section on the side wall away from the first connecting shaft, the baffle mounting end being fixed to the section of the cam, and the abutment end being abuttable against the inner wall of the reel through hole.

22. The wafer gold tearing machine according to claim 21, characterized in that: The first connecting shaft includes a roll portion and a first clamping portion, wherein the first clamping portion is located at one end or both ends of the roll portion, and the diameter of the first clamping portion is smaller than the diameter of the roll portion; the adhesive film roll is installed on the roll portion, and the first clamping portion is rotatably installed on the film pulling support structure.

23. The wafer gold tearing machine according to claim 22, characterized in that: The film-drawing mechanism further includes: at least one rotating wheel, which is detachably mounted on the film-drawing support structure and has a rotating hole adapted to the first clamping portion; the first clamping portion can be mounted on the film-drawing support structure through the rotating wheel.

24. The wafer gold tearing machine according to claim 23, characterized in that: The film pulling mechanism also includes: a positioning block fixed to one end or both ends of the roll portion, the positioning block having a positioning through hole, a mounting portion and a contact portion, the positioning through hole passes through the contact portion and the mounting portion, and matches the first clamping portion; the mounting portion is away from the adhesive film roll mounted on the first connecting shaft, and the contact portion is close to the adhesive film roll mounted on the first connecting shaft; the diameter of the contact portion is larger than the inner diameter of the adhesive film roll; the positioning block is used to position the installation position of the adhesive film roll.

25. The wafer gold tearing machine according to claim 24, characterized in that: The film pulling mechanism further includes a speed regulating structure installed on the first clamping portion, and the speed regulating structure includes: A shaft fixing block, wherein the diameter of the shaft fixing block is larger than the diameter of the positioning through hole, the shaft fixing block has a fixing block through hole penetrating along its own axial direction, the fixing block through hole is adapted to the first clamping portion, the reel portion has a groove at one end adjacent to the first clamping portion, the shaft fixing block has a protrusion matching the groove, and after the protrusion is inserted into the groove, the shaft fixing block and the positioning block can be clamped; A rotating handle, wherein the end of the first clamping portion has an external thread to be threadedly connected with the rotating handle; a first spring, wherein the first spring is slidably sleeved on the first clamping portion, one end of the first spring can abut against the rotating handle, and the other end can abut against the rotating wheel on the first clamping portion, and rotating the rotating handle can push the rotating wheel on the first clamping portion to move toward the shaft fixing block and apply pressure to the shaft fixing block; By rotating the rotating handle, the rotating wheel on the first clamping part can be pushed to move toward the shaft fixing block and press the shaft fixing block to generate friction between the rotating wheel and the shaft fixing block.

26. The wafer gold tearing machine according to claim 25, characterized in that: The film-drawing support structure includes a first support and a second support that are relatively arranged; the first connecting shaft also includes a second clamping portion, the first clamping portion and the second clamping portion are located at opposite ends of the winding drum portion, and the rotating hole is also adapted to the second clamping portion; the film-drawing mechanism includes two rotating wheels, one of which is detachably mounted on the first support, and the other is detachably mounted on the second support; the first clamping portion can be mounted on the first support via one of the rotating wheels, and the second clamping portion can be mounted on the second support via the other rotating wheel, so that the first connecting shaft can rotate relative to the two rotating wheels.

27. The wafer gold tearing machine according to claim 26, characterized in that: The rotating wheel includes a rotating body, and a first rotating end and a second rotating end respectively connected to two ends of the rotating body, and the rotating hole passes through the first rotating end, the rotating body and the second rotating end; the first bracket is arranged perpendicular to the surface of the supporting platform, and the first bracket has a first groove matched with the rotating wheel, the first groove passes through the first bracket along the first direction, and extends from the end surface of the first bracket away from the supporting platform to the direction of the supporting platform to a preset depth; the second bracket is arranged perpendicular to the surface of the supporting platform, and the second bracket has a second groove matched with the rotating wheel, the second groove passes through the second bracket along the first direction, and extends from the end surface of the second bracket away from the supporting platform to the direction of the supporting platform to the preset depth.

28. The wafer gold tearing machine according to claim 27, characterized in that: The rotating wheel also includes: A rotating connecting rod, wherein the rotating connecting rod has an external thread, the first rotating end also has a first end hole matched with one end of the rotating connecting rod, and the second rotating end also has a second end hole matched with the rotating connecting rod; The rotating connecting rod is fixed to the rotating wheel and contacts the first groove or the second groove to fix the rotating wheel in the first groove or the second groove.

29. The wafer gold tearing machine according to claim 19, characterized in that: The film pulling mechanism also includes: A second connecting shaft fixed to the film-drawing support structure, the first connecting shaft and the second connecting shaft are parallel to each other, and relative to the first connecting shaft, the second connecting shaft is close to the carrier in a direction perpendicular to the surface of the supporting platform and in a direction parallel to the surface of the supporting platform; The adhesive film can be pulled out from the first connecting shaft and then pass through the gap between the second connecting shaft and the supporting platform to be laid on the wafer surface.

30. The wafer gold tearing machine according to claim 19, characterized in that: The film pulling mechanism is located on one side of the carrier in the second direction, and the first connecting axis is arranged parallel to the first direction.

31. The wafer gold tearing machine as claimed in claim 30, characterized in that: The wafer tearing machine also includes: a cutter mechanism, which follows the roller to reciprocate along the second direction; the cutter mechanism includes a pushing component and a cutter, and the pushing component includes a cutter guide rail and a cutter slider. The cutter slider can slide along the cutter guide rail, and the cutter guide rail is parallel to the first direction. The cutter is fixed to the cutter slider, and the cutter is used to cut the sticky film to separate the sticky film adhered to the wafer surface from the sticky film roll.

32. The wafer gold tearing machine as claimed in claim 31, characterized in that: The cutting mechanism also includes a tool holder for fixing the cutting tool, and the tool holder includes: a first clamping plate and a second clamping plate, the first clamping plate is fixed to the cutting tool slider, the second clamping plate is fixed to the first clamping plate, and the cutting tool is fixed between the first clamping plate and the second clamping plate and protrudes toward the side close to the carrier.

33. The wafer gold tearing machine as claimed in claim 31, characterized in that: The cutting mechanism further comprises a knife holder for fixing the knife, and the knife holder comprises: A cutter housing, the cutter housing is fixed to the cutter slider and has a pressing opening and a knife opening opposite to each other; A fixing frame, the fixing frame is arranged in the cutter housing, the fixing frame comprises a fixing plate structure, the fixing plate structure has a first end surface adjacent to the pressing opening, and a second end surface adjacent to the cutter opening, the cutter is fixed to a part of the second end surface of the fixing plate structure, and can enter and exit the cutter housing from the cutter opening; A pressing block, the pressing block extends from outside the cutter housing through the pressing opening into the cutter housing and is fixed to a portion of the first end surface of the fixing plate structure; a second spring, the second spring being installed between the second end surface of a portion of the fixing plate structure and an inner wall of the cutter housing; A limiting member connected to the fixed plate structure; Pressing the pressing block can drive the cutter to extend from the cutter housing and compress the second spring, and fix the position of the fixing plate structure through the limiting member to cut the adhesive film; By pressing the pressing block, the limiting member can be moved away from the fixing plate structure and the second spring can be reset, so that the cutter can enter the cutter housing.

34. The wafer gold tearing machine as claimed in claim 33, characterized in that: The end surface of the carrier close to the film-drawing mechanism has a knife groove parallel to the first direction, and the knife groove matches the knife.

35. The wafer gold tearing machine as claimed in claim 1, characterized in that: The support platform is fixedly connected with movable wheels on a surface away from the carrier.

36. The wafer gold tearing machine as claimed in claim 1, characterized in that: The first direction and the second direction are perpendicular to each other.

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