Thin wafer edge removing manipulator

Abstract

The utility model discloses a thin wafer edge removing manipulator, which belongs to the technical field of wafer polishing equipment and comprises a handle, a connecting seat arranged on the upper side of the handle, a connecting column arranged between the handle and the connecting seat, a fixing head arranged at the upper end of the connecting seat, a fixing groove arranged at the upper end of the fixing head, and an air cavity arranged in the connecting seat. The left end and the right end of the connecting base are provided with an air outlet and an air inlet connector respectively, the air inlet connector is connected with an air pump through an air guide hose, the connecting base is provided with an opening and closing device in the air cavity, the connecting column is connected with the opening and closing device, and air guide channels communicated with the fixing groove and the air cavity are formed in the fixing head and the connecting base. Through the arrangement of the air pump, the air cavity, the air guide channel, the air outlet hole and the air inlet connector, the air cavity and the fixing groove can form a negative pressure state, so that the wafer is adsorbed and clamped in the fixing groove, an original tweezers clamping mode is replaced, the clamping effect of the wafer is improved, and meanwhile the machining efficiency and the machining stability are improved.

Description

Technical Field

[0001] The utility model discloses a thin round wafer edge-removing robot, belonging to the technical field of round wafer grinding equipment. Background Art

[0002] Semiconductor chip production has always been an industry based on cutting-edge technology. After more than 40 years of development, it has gone through the development from early electronic circuits to today's very large-scale integrated circuits, from only military and laboratories to each of our homes. With its continued development, it will bring us more convenience. In chip production, whether now or based on future development trends, chip de-edging and chamfering are extremely important and indispensable processes.

[0003] At present, the existing equipment often uses a grinding disc to chamfer the round wafer. During the processing, the round wafer needs to be manually clamped with tweezers. However, the round wafer is small in size and is not only difficult to clamp but also easy to slip during the processing, which affects the processing efficiency and processing accuracy of the round wafer.

[0004] Therefore, a new solution needs to be proposed to solve this problem. Utility Model Content

[0005] The utility model aims to solve the above-mentioned problem and provides a thin wafer edge-removing robot, which has the effect of stably clamping the wafer.

[0006] The utility model achieves the above-mentioned purpose through the following technical scheme, including a handle, a connecting seat is provided on the upper side of the handle, a rotatable connecting column is provided between the handle and the connecting seat, the upper and lower ends of the connecting column respectively extend into the connecting seat and the interior of the handle, a fixing head is provided on the upper end of the connecting seat, a fixing groove is provided on the upper end of the fixing head, an air cavity is provided in the connecting seat, an air outlet and an air inlet joint connected to the air cavity are provided on the left and right ends of the connecting seat respectively, the air inlet joint is connected to an air guide hose, the air inlet joint is connected to an air pump through the air guide hose, an opening and closing device is provided in the air cavity of the connecting seat, the connecting column is connected to the opening and closing device, and an air guide channel connecting the fixing groove and the air cavity is provided in the fixing head and the connecting seat.

[0007] By adopting the above technical scheme, the fixed groove is used to clamp and fix the circular wafer, and the gas pumped out by the air pump is blown into the air cavity from the air inlet joint through the air guide hose, and then blown out from the air outlet. At the same time, the fixed groove is connected with the air cavity through the air guide channel. When the gas in the air cavity flows out through the air outlet under the action of the air pump, the gas flow rate in the air cavity is greater than the flow rate of the gas in the fixed groove, so that the pressure in the air cavity is less than the pressure in the fixed groove, forming a negative pressure state, so that the fixed groove has an adsorption force in the direction of the air guide channel, so that the circular wafer can be adsorbed in the fixed groove, and when the gas in the air cavity stops flowing, the air pressure in the air cavity and the fixed groove return to the same, and the adsorption force on the circular wafer is lost, and the circular wafer can be put down, avoiding the instability of processing caused by clamping with tweezers. At the same time, it is achieved that the picking and placing of the circular wafer can be conveniently controlled by the opening and closing device, thereby improving the convenience of using the manipulator.

[0008] Preferably, the opening and closing device includes a rotatable opening and closing plate, and the upper end of the connecting column extends into the air cavity to be connected to the opening and closing plate.

[0009] By adopting the above technical solution, through the setting of the opening and closing plate, the connectivity state of the air cavity can be controlled by rotating the opening and closing plate, thereby controlling the taking and placing of the circular wafer, and the structure in which the upper end of the connecting column is connected to the opening and closing plate makes it possible to control the rotation of the opening and closing plate by rotating the connecting column, making the control of the opening and closing plate more convenient.

[0010] Preferably, an arc-shaped limiting cavity is provided in the handle, and a limiting block is provided at the lower end of the connecting column in the limiting cavity.

[0011] By adopting the above technical solution, through the setting of the limit block and the limit cavity, the rotation angle of the connecting column can be limited, so that the two end points of the rotation of the connecting column correspond to the angles of opening and closing the air cavity of the opening and closing plate, thereby improving the convenience and accuracy of the use of the device.

[0012] Preferably, a positioning block is vertically arranged on the outer side of the connecting column.

[0013] By adopting the above technical solution, the positioning block is provided to facilitate users to determine the rotation position of the connecting column, so as to intuitively know the opening state of the air cavity at this time.

[0014] Preferably, both upper and lower ends of the handle are provided with annular buckles for fixing the air guide hose.

[0015] By adopting the above technical solution, the gas guide hose can be effectively fixed by the arrangement of two annular buckles, so that the gas guide hose can be fixed on the handle, thereby preventing the gas guide hose from being entangled and affecting the processing operation.

[0016] Preferably, a plurality of protrusions are provided at the bottom of the fixing groove.

[0017] By adopting the above technical solution and arranging a plurality of protrusions, a gap can be left between the wafer and the bottom of the fixing groove when the wafer is adsorbed in the fixing groove, so that the air pressure on both sides can be quickly balanced when the wafer is to be taken out, thereby improving its taking and placing efficiency.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] Firstly, by setting the air pump, the air cavity, the air guide channel, the air outlet and the air inlet joint, the air cavity and the fixed groove can form a negative pressure state, so that the wafer can be adsorbed and clamped in the fixed groove, replacing the original tweezers clamping method, thereby improving the clamping effect of the wafer and improving the processing efficiency and stability;

[0020] Secondly, by setting the limit block and the limit cavity, the rotation angle of the connecting column can be limited, so that the rotation angle of the opening and closing plate can be accurately controlled, and the control effect of the air cavity flow state can be improved;

[0021] Thirdly, by setting the positioning block, the operator can intuitively know the rotation angle of the connecting column, and then know the opening state of the air cavity, which effectively improves the convenience of using the device;

[0022] Fourthly, by providing two annular buckles, the air guide hose used to connect the air inlet connector and the air pump can be stored and fixed, making the overall device more concise and improving the use effect of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a thin wafer de-edging robot Figure 1 ;

[0024] Figure 2 A schematic diagram of the structure of a thin wafer de-edging robot Figure 2 ;

[0025] Figure 3 A cross-sectional view of a thin wafer de-edging robot.

[0026] Figure numerals: 1. handle; 2. connecting seat; 3. connecting column; 4. fixing head; 5. fixing groove; 6. air cavity; 7. air outlet; 8. air inlet joint; 9. air guide channel; 10. opening and closing plate; 11. limit block; 12. positioning block; 13. ring buckle; 14. protrusion. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. In the description of the utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0028] A thin wafer edge removal robot, such as Figure 1-Figure 3 As shown, it includes a handle 1, a connecting seat 2 is arranged on the upper side of the handle 1, a rotatable connecting column 3 is arranged between the handle 1 and the connecting seat 2, the upper and lower ends of the connecting column 3 extend into the connecting seat 2 and the handle 1 respectively, a fixing head 4 is arranged on the upper end of the connecting seat 2, a fixing groove 5 is opened on the upper end of the fixing head 4, and the fixing groove 5 can be clamped and fixed to the round wafer, an air cavity 6 is arranged in the connecting seat 2, and an air outlet 7 and an air inlet joint 8 connected to the air cavity 6 are respectively arranged at the left and right ends of the connecting seat 2, the air inlet joint 8 is connected to an air guide hose, and the air inlet joint 8 is connected to an air pump through the air guide hose, the connecting seat 2 is provided with an opening and closing device in the air cavity 6, the connecting column 3 is connected to the opening and closing device, an air guide channel 9 connecting the fixing groove 5 and the air cavity 6 is opened in the fixing head 4 and the connecting seat 2, and the gas pumped out of the air pump is discharged from the air inlet joint through the air guide hose The head 8 blows into the air cavity 6 and then blows it out from the air outlet 7, and the fixed groove 5 is connected with the air cavity 6 through the air guide channel 9. When the gas in the air cavity 6 flows out through the air outlet 7 under the action of the air pump, the gas flow rate in the air cavity 6 is greater than the gas flow rate in the fixed groove 5, so that the pressure in the air cavity 6 is less than the pressure in the fixed groove 5, forming a negative pressure state, so that the fixed groove 5 has an adsorption force in the direction of the air guide channel 9, so that the circular wafer can be adsorbed in the fixed groove 5, and when the gas in the air cavity 6 stops flowing, the air pressure in the air cavity 6 and the fixed groove 5 are restored to the same, and the adsorption force on the circular wafer is lost, and the circular wafer can be put down, avoiding the instability of processing caused by clamping with tweezers. At the same time, it is achieved that the picking and placing of the circular wafer can be conveniently controlled by the opening and closing device, thereby improving the convenience of using the manipulator.

[0029] The opening and closing device includes a rotatable opening and closing plate 10, and the upper end of the connecting column 3 extends into the air cavity 6 and is connected to the opening and closing plate 10. Through the setting of the opening and closing plate 10, the connection state of the air cavity 6 can be controlled by rotating the opening and closing plate 10, thereby controlling the taking and placing of the wafer. The structure in which the upper end of the connecting column 3 is connected to the opening and closing plate 10 makes it possible to control the rotation of the opening and closing plate 10 by rotating the connecting column 3, making the control of the opening and closing plate 10 more convenient. An arc-shaped limiting cavity is provided in the handle 1, and a limiting block 11 is provided in the limiting cavity at the lower end of the connecting column 3. Through the setting of the limiting block 11 and the limiting cavity, the rotation angle of the connecting column 3 can be limited, so that the two end points of the rotation of the connecting column 3 correspond to the angles of opening and closing the air cavity 6 of the opening and closing plate 10, respectively, thereby improving the convenience and accuracy of the use of the device. A positioning block 12 is vertically provided on the outer side of the connecting column 3. The setting of the positioning block 12 is convenient for the user to determine the rotation position of the connecting column 3, thereby intuitively knowing the opening state of the air cavity 6 at this time.

[0030] Both upper and lower ends of the handle 1 are provided with annular buckles 13 for fixing the gas hose. The two annular buckles 13 can effectively fix the gas hose so that the gas hose can be fixed on the handle 1 to prevent the gas hose from being entangled and affecting the processing operation. A plurality of protrusions 14 are provided at the bottom of the fixing groove 5. Through the provision of the plurality of protrusions 14, a gap can be left between the wafer and the bottom of the fixing groove 5 when the wafer is adsorbed in the fixing groove 5, so that the air pressure on both sides can be quickly balanced when the wafer is to be taken out, thereby improving its taking and placing efficiency.

[0031] When the round wafer is to be chamfered, the air pump is started, and the operator holds the handle 1 to move the fixed head 4 to the round wafer to be processed, and then rotates the connecting column 3 to control the opening and closing plate 10 to rotate so that the gas in the air cavity 6 can flow, so that the air cavity 6 and the fixed groove 5 form a negative pressure state, and the round wafer is adsorbed in the fixed groove 5. Then the operator can hold the handle 1 to place the round wafer in the processing device for processing, providing a stable clamping effect for the round wafer during the processing process, ensuring the stability of the round wafer chamfering processing and the yield rate of the processing production. After the processing is completed, the round wafer is removed from the processing device through the handle 1, and the connecting column 3 is rotated in the opposite direction so that the opening and closing plate 10 closes the air cavity 6 to block the gas circulation, and the round wafer can be released from the fixed groove 5, thereby improving the convenience of taking and placing the round wafer.

[0032] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0033] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A thin wafer edge removal robot, characterized in that: The invention comprises a handle (1), wherein a connecting seat (2) is arranged on the upper side of the handle (1), a rotatable connecting column (3) is arranged between the handle (1) and the connecting seat (2), the upper and lower ends of the connecting column (3) respectively extend into the connecting seat (2) and the handle (1), the upper end of the connecting seat (2) is provided with a fixing head (4), the upper end of the fixing head (4) is provided with a fixing groove (5), an air cavity (6) is arranged in the connecting seat (2), the left and right ends of the connecting seat (2) are respectively provided with an air outlet (7) and an air inlet joint (8) connected to the air cavity (6), the air inlet joint (8) is connected to an air guide hose, the air inlet joint (8) is connected to an air pump via the air guide hose, the connecting seat (2) is provided with an opening and closing device in the air cavity (6), the connecting column (3) is connected to the opening and closing device, and an air guide channel (9) connecting the fixing groove (5) and the air cavity (6) is provided in the fixing head (4) and the connecting seat (2).

2. A thin wafer edge removal robot according to claim 1, characterized in that: The opening and closing device comprises a rotatable opening and closing plate (10), and the upper end of the connecting column (3) extends into the air cavity (6) and is connected to the opening and closing plate (10).

3. A thin wafer edge removal robot according to claim 2, characterized in that: A circular arc-shaped limiting cavity is arranged in the handle (1), and a limiting block (11) is arranged in the limiting cavity at the lower end of the connecting column (3).

4. A thin wafer edge removal robot according to claim 3, characterized in that: A positioning block (12) is vertically arranged on the outside of the connecting column (3).

5. A thin wafer edge removal robot according to claim 1, characterized in that: The upper and lower ends of the handle (1) are both provided with annular buckles (13) for fixing the air guide hose.

6. A thin wafer edge removal robot according to claim 1, characterized in that: A plurality of protrusions (14) are provided at the bottom of the fixing groove (5).

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