Wafer photoresist film pasting press-fitting device

Abstract

A wafer photoresist film pasting press-fitting device comprises a lower shell, an electric negative pressure vacuum pump, an air compressor, an upper cover, a table disc, an electric push rod, an air bag and an exhaust valve. A connecting pipe is installed at the side end of the lower shell, the outer side end of the connecting pipe is connected with the air inlet end of the electric negative-pressure vacuum pump, a fixing pressing ring is installed at the lower end in the upper cover, and the outer side of the air bag is installed on the inner side of the fixing pressing ring. An air inlet pipe is installed on one side of the air bag and connected with an air compressor exhaust pipe. The multiple sets of electric push rods are installed at the lower end in the lower shell, and the outer sides of the lower end of the table plate are installed at the upper ends of the multiple sets of electric push rods correspondingly. According to the utility model, the photoresist film can be uniformly adhered to the surface of the wafer, so that the photoresist has better fluidity when being melted, and can be better pressed into a groove in the surface of the wafer; and through water cooling of the film-pasted wafer, the photoresist can be cured within the time as short as possible, and the cooling time is shortened. According to the utility model, the production efficiency is correspondingly improved on the basis of ensuring the product quality.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer pressing equipment, in particular to a wafer photoresist film pressing device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. During production, high-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form a cylindrical single silicon crystal rod. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. During the production of wafers, it is necessary to press and fit the photoresist film on its surface. The photoresist at the lower side of the photoresist film (the upper side is a release film) (the lowermost side also has a release protective film, which is torn off in advance) is a compound composed of a soluble polymer and a photosensitive material. After pressing, in the subsequent production process and the photolithography process of the wafer, the photoresist on the surface of the wafer can be used to create circuit patterns. It can also be used to form a barrier layer by electroplating metal wires in the subsequent electroplating process, etc., which meets the needs of the subsequent processing procedures of the wafer.

[0003] When the current wafer photoresist film is pressed, the staff will tear off the release film on the lower side of the photoresist film and manually adhere it to the surface of the wafer, and then use a roller to roll the film. In order to ensure that the photoresist film is pressed into the groove on the surface of the wafer, the roller usually has a heating function, so that the photoresist of the photoresist film is melted by heat and has fluidity, and is pressed into the groove on the surface of the wafer. Although the above method meets the production needs to a certain extent, it is limited by the structure and there are still some problems that need to be improved. First, the roller rolls the upper end surface of the film one by one, and it cannot ensure that the photoresist film and each position on the wafer surface maintain a constant pressure (uneven pressure), and the depths of the many grooves on the wafer surface are not consistent. There is a probability of air entering between the two, which will have an adverse effect on the production of the subsequent stage. Second: after pressing, it needs to cool naturally (so that the photoresist can effectively adhere to the wafer) before it can be used in the next production process. Since cooling takes a certain amount of time, the production efficiency will be relatively low (although it can be cooled by electric blowing, it requires additional electric blowing equipment, the overall structure of the equipment is not compact, and the air cooling effect is inferior to water cooling, so there is still a problem of long cooling time). Utility Model Content

[0004] In order to overcome the drawbacks of the existing wafer photoresist film pressing equipment due to structural limitations as described in the background, the utility model provides a wafer photoresist film pressing device which extracts the air between the wafer and the photoresist film through vacuum negative pressure to reduce the probability of bubbles appearing on the bonding surface between the two, uniformly applies force through pressurization by flexible air bags, etc., so that the photoresist film can be evenly adhered to the surface of the wafer, and heats the photoresist by electric heating and cools the wafer after filming by water, thereby ensuring product quality and correspondingly improving production efficiency.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A wafer photoresist film pressing device comprises a lower shell, an electric negative pressure vacuum pump, an air compressor, an upper cover, a table, an electric push rod, and an air bag; the characteristic is that the upper end of the lower shell is an open structure, a connecting pipe is installed at the side end of the lower shell, the outer end of the connecting pipe is connected to the air inlet end of the electric negative pressure vacuum pump, a fixed pressure ring is installed at the inner lower end of the upper cover, and the outer side of the air bag is installed on the inner side of the fixed pressure ring; an air inlet pipe is installed at the upper end of one side of the air bag, and the upper end of the air inlet pipe is connected to the exhaust pipe of the air compressor; there are multiple sets of electric push rods, and the multiple sets of electric push rods are installed at the lower end of the lower shell, and the outer sides of the lower end of the table are respectively installed at the upper ends of the multiple sets of electric push rods.

[0007] Furthermore, the outer diameters of the upper end of the lower shell and the lower end of the upper cover are consistent, the upper end of the lower shell and the lower end of the upper cover are respectively installed with a lower magnet ring and an upper magnet ring, and a sealing gasket is installed at the upper end of the lower magnet ring.

[0008] Furthermore, the table is a hollow structure, and is equipped with an electric heating plate, a cooling water pipe, and a valve. The cooling water pipe is installed inside the table, and a water inlet pipe is installed at the outer end of the lower shell. The inner side of the water inlet pipe is connected to the water inlet end of the cooling water pipe, and the outer side of the water inlet pipe is connected in parallel to the water pipe and the water inlet end of the valve. There are multiple ventilation pipes distributed on the table, and the electric heater is installed on the inner side of the table.

[0009] Furthermore, the outer diameter of the table is consistent with the outer diameter of the airbag and is larger than the outer diameter of the wafer.

[0010] The beneficial effects of the utility model are as follows: the utility model can extract the air between the wafer and the photoresist film, and the whole process of film pasting is carried out in a vacuum environment, which reduces the probability of bubbles appearing on the bonding surface between the two; by controlling the height of the console, the airbag swells, and the flexible airbag and other pressures are uniformly applied to apply force, so that the photoresist film can be evenly bonded to the surface of the wafer; the photoresist is heated by electric heating, so that the melted photoresist has better fluidity and can be better pressed into the groove on the surface of the wafer; by water cooling the wafer after film pasting, the photoresist can be solidified in the shortest possible time and the cooling time is accelerated. The utility model not only ensures product quality, but also correspondingly improves production efficiency. Based on the above, the utility model has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0012] Figure 1 It is a schematic diagram of the structure of the utility model.

[0013] Figure 2 , 3 4 is a schematic diagram of the local structure of the utility model.

[0014] Figure 5 This is a circuit diagram of the utility model. DETAILED DESCRIPTION

[0015] Figure 1 , 2As shown in , 3, 4, and 5, a wafer photoresist film pressing device comprises a lower shell 1, an electric negative pressure vacuum pump (not shown in the figure, with a power of 3KW and a working voltage of DC 220V), an air compressor (not shown in the figure, with a power of 1KW and a working voltage of DC 220V), an upper cover 3, a table 4, an electric push rod M, and an air bag 5; the upper end of the hollow lower shell 1 is an open structure, and a connecting pipe 6 that is interconnected with the interior of the lower shell is welded to the middle part of the left outer end of the lower shell, and the outer end of the connecting pipe 6 and the air inlet end of the electric negative pressure vacuum pump are connected through a pipeline, and a hollow annular fixed pressure ring 31 is welded to the inner lower end of the upper cover, and the outer side of the circular air bag 5 is tightly sleeved on the inner side of the fixed pressure ring 31; an air inlet pipe 51 is sealed and installed on the upper right end of the air bag 5, and the air inlet pipe 51 is opened to the upper right end of the upper cover 3 through the opening at the upper right end of the upper cover 3. The opening and the outside of the air inlet pipe 51 are sealed and welded, and the upper end of the air inlet pipe 51 is connected to the exhaust pipe of the air tank of the air compressor through a hose; there are three sets of electric push rods M, and the lower ends of the cylinders of the three sets of electric push rods M (reciprocating electric telescopic rods with a working voltage of DC 24V) are respectively installed in an annular manner at the lower end of the lower shell 1 through bolts, and the lower end of the table 4 is respectively installed on the upper ends of the push columns of the three sets of electric push rods M; the positive and negative and negative and positive and negative power input terminals of the three sets of electric push rods M are respectively connected to the two-way power output terminals 3, 4 and 5, 6 of a power switch S1 through wires, the power input terminals 1 and 2 of the power switch S1 and the power output terminals 3 and 4 of the DC power module A1 are respectively connected through wires, and the power switch S1 and the power module A1 are installed in the component box 2 at the lower part of the front outer side of the lower shell. The power input terminals 1 and 2 of the power module A1 (finished product of the AC 220V to DC 24V power module) are connected to the two poles of the AC 220V power supply via wires.

[0016] Figure 1 , 2As shown in , 3, 4, and 5, the outer diameters of the upper end of the lower shell 1 and the lower end of the upper cover 3 are consistent. The upper end of the lower shell 1 and the lower end of the upper cover 3 are respectively sealed with a lower magnet ring 8 and an upper magnet ring 9 by glue. The upper end of the lower magnet ring 8 is glued with a sealing rubber pad 10. The upper end of the lower magnet ring 8 and the lower end of the upper magnet ring 9 have opposite polarities. The material of the airbag 5 is heat-resistant silicone. The table 4 is a hollow structure. The table is equipped with an electric heating plate RT (a 100W constant temperature PTC stainless steel armored electric heating plate finished product with a heating temperature of 60°C) and a disc cooling water pipe 41 and a manual valve (not shown in the figure). The cooling water pipe 41 is welded and installed on the upper inner side of the table 4. One end of the cooling water pipe 41 is a closed structure, and the other end of the cooling water pipe 41 is an open structure and is located outside the left end of the table 4. A water inlet pipe (not shown in the figure) is welded to the lower part of the rear outer end of the lower shell. The inner side of the water inlet pipe and the cooling water pipe 41 have A hose with excess length (not shown) is connected, the outer side of the water inlet pipe is threadedly connected to one end of a three-way joint (not shown), the other two ends of the three-way joint are respectively connected to the faucet of the tap (not shown) and the water inlet end of the manual valve through pipes, five ventilation pipes 42 are welded on the plate 4 in a circular distribution, the ventilation pipes 42 and the inner side of the plate are sealed to isolate it from the upper and lower ends of the plate 4, there are six electric heating plates RT, and the six electric heating plates RT are installed in the middle of the upper inner end of the plate 4 at a certain distance. The six electric heating plates RT are located between the two sections of the disc cooling water pipe 41 and are spaced apart from the two sections of the pipe. The wires connected to the six electric heating plates RT are led downward through the opening at the lower left end of the table 4 (the opening is sealed with heat-resistant sealant). The power input ends of the six electric heating plates RT are connected in series with the power output ends 3 and 4 of the DC power module A1 through a power switch AS2 (installed in the component box) and are connected through wires respectively; the wires connected to the electric heating plates RT and the electric push rod M (with a length margin) are led outward through the opening at the lower middle part of the rear end of the lower shell 1, and the opening is sealed with heat-resistant sealant. The outer diameter of the table 4 is consistent with the outer diameter of the airbag 5 and is larger than the outer diameter of the wafer 12.

[0017] Figure 1 , 2As shown in Figures 3, 4, and 5, the present invention includes the following steps when attaching a film to a wafer 12. (1) The staff places the wafer 12 on the table 4 (the outer diameter of the wafer is larger than the outer diameter of the five vents), and then tears off the release film at the lower end of the photoresist film 13, and manually adheres the lower end of the photoresist film to the wafer 12. (2) The lower end of the upper cover 3 is sealed (with a sealing rubber ring) by the upper magnet 9 and the lower magnet 8 and is sucked onto the upper end of the lower shell 1. (3) Turn on the main power switch of the power module A1, and its 3rd and 4 pins output a stable DC 24V power supply. After turning on the power switch of the electric negative pressure vacuum pump (and turning on the power switch AS2 of the electric heating plate RT, the electric heating plate RT is powered to heat the table 4), the electric negative pressure vacuum pump is powered to extract the air between the lower shell and the upper cover, and the air between the upper end of the table and the lower end of the wafer, and between the upper end of the wafer and the lower end of the photoresist film 13. The vacuum environment is conducive to extracting bubbles when film pasting. Since the subsequent film pasting process is carried out in a vacuum environment, the probability of bubbles appearing on the bonding surface between the upper end of the wafer and the photoresist film 13 is reduced. (4) Turn the handle of the power switch S1 to the left for about 6 seconds. After the positive and negative power input terminals of the three sets of electric push rods M are energized, their push rods push the table 4 and the wafers to rise, and the lower end of the airbag 5 contacts the upper end of the photoresist film 13 (after turning off the power switch, the electric push rods lose power and no longer work); the staff opens the valve of the exhaust pipe of the air tank of the air compressor for about 5 seconds (after closing the valve, the airbag stops inflating), the airbag swells and the volume of the airbag increases (when another wafer is subsequently filmed, as long as the pressure in the airbag is appropriate, no air is added), and the lower end simultaneously squeezes the upper end of the photoresist film 13; through the above, by controlling the height of the table, the airbag swells, and the flexible airbag and the table pressurize to evenly apply force, so that the photoresist film 13 can be evenly adhered to the surface of the wafer 12, and the table 4 is heated by electric heating, and the heat of the table 4 will heat the photoresist, so that the photoresist melts and has better fluidity, and is better pressed into the groove on the surface of the wafer 12. (5) After about 8 seconds, turn off the power switch of the electric heating plate RT and turn on the tap of the water pipe. Then, the cold water output from the tap enters the disc cooling water pipe 41. After the cooling water pipe 41 absorbs the heat, the wafer after film bonding can solidify the photoresist in the shortest possible time and accelerate the cooling time. This new type not only ensures product quality, but also improves production efficiency accordingly. (6) The staff turns off the tap and opens the manual valve (located below the height of the cooling water pipe). In this way, the water in the cooling water pipe is discharged (the discharged water enters the wastewater tank). After turning off the power switch of the electric vacuum pump, turn the handle of the power switch S1 to the right for about 6 seconds. After the negative and positive power input ends of the three sets of electric push rods M are energized, their push rods push the table 4 and the wafers to descend. The lower end of the airbag 5 no longer contacts the upper end of the photoresist film 13 (after turning off the power switch, the electric push rod loses power and no longer works). After removing the upper cover, the film bonding work can be carried out again.It should be noted that the above-mentioned structural composition and the introduction of the workflow based on the structure of the present application are only for the convenience of description, and do not limit the specific structure of the present application to any other modifications. For example, a solenoid valve can be connected in series at the lower end of the new faucet, and a solenoid valve can also be used for the drain valve. In this way, the staff can control the solenoid valve to be energized or de-energized by the power switch, thereby increasing the operating speed. In actual applications, the lower part of the rear side end of the upper cover can be hingedly installed with the outer side of the rear upper end of the lower shell, which makes it more convenient to open the upper cover and take and place wafers.

[0018] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the utility model.

[0019] In addition, it should be understood that although the present specification is described according to the implementation mode, the implementation mode does not only include an independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer photoresist film pressing device, comprising a lower shell, an electric negative pressure vacuum pump, an air compressor, an upper cover, a table, an electric push rod, and an air bag; characterized in that: The upper end of the lower shell body is an open structure, and a connecting pipe is installed at the side end of the lower shell body. The outer end of the connecting pipe is connected to the air inlet end of the electric negative pressure vacuum pump. A fixed pressure ring is installed at the inner lower end of the upper cover, and the outer side of the airbag is installed on the inner side of the fixed pressure ring; an air inlet pipe is installed at the upper end of one side of the airbag, and the upper end of the air inlet pipe is connected to the exhaust pipe of the air compressor; there are multiple sets of electric push rods, and the multiple sets of electric push rods are installed at the lower end of the lower shell body, and the outer sides of the lower end of the table are respectively installed at the upper ends of the multiple sets of electric push rods.

2. A wafer photoresist film pressing device according to claim 1, characterized in that: The outer diameters of the upper end of the lower shell and the lower end of the upper cover are consistent. The upper end of the lower shell and the lower end of the upper cover are respectively equipped with a lower magnet ring and an upper magnet ring, and a sealing gasket is installed on the upper end of the lower magnet ring.

3. The wafer photoresist film pressing device according to claim 1, characterized in that: The table is a hollow structure, and is equipped with an electric heating plate, a cooling water pipe and a valve. The cooling water pipe is installed inside the table, and a water inlet pipe is installed at the outer end of the lower shell. The inner side of the water inlet pipe is connected to the water inlet end of the cooling water pipe, and the outer side of the water inlet pipe is connected in parallel to the tap water pipe and the water inlet end of the valve. There are multiple ventilation pipes distributed on the table, and the electric heater is installed on the inner side of the table.

4. The wafer photoresist film pressing device according to claim 1, characterized in that: The outer diameter of the table is consistent with the outer diameter of the air bag and is larger than the outer diameter of the wafer.

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