Semiconductor temperature control device

By setting up a liquid storage separator in the semiconductor temperature control device, the existing equipment is large in size and poorly designed for refrigeration systems are solved, and equipment simplification, volume reduction and condenser heat exchange effects are maximized, while ensuring the safety of the compressor.

CN222617228UActive Publication Date: 2025-03-14SHANGHAI SHENGJIAN SEMICONDUCTOR TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421256794.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-03
Publication Date
2025-03-14
Estimated Expiration
2034-06-03

AI Technical Summary

Technical Problem

The existing semiconductor temperature control equipment is huge in size and takes up a large space. The design of the refrigeration system is difficult to maximize the condenser heat exchange effect and compressor safety, while simplifying the equipment system and reducing the equipment volume.

Method used

A semiconductor temperature control device is designed. By setting up a liquid storage separator, the hot end outlet of the condenser is connected to the liquid storage inlet to prevent excessive condensation and the cold end outlet of the evaporator is connected to the separation inlet to prevent liquid from entering the compressor.

Benefits of technology

It realizes the use of simplifying the equipment system and reducing the equipment volume while maximizing the heat exchange effect of the condenser and ensuring the safety of the compressor, and improving the economy and efficiency of the equipment.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222617228U_ABST
    Figure CN222617228U_ABST
Patent Text Reader

Abstract

The utility model discloses a semiconductor temperature control device, and relates to the technical field of semiconductor temperature control. The semiconductor temperature control device comprises a refrigerating system and a circulating system. The refrigerating system comprises a compressor, a condenser, a liquid storage separator and an evaporator. The liquid storage separator comprises a liquid storage inlet, a liquid storage outlet, a separation inlet and a gas outlet. The liquid storage separator is used for liquid storage and gas-liquid separation. An outlet of the compressor is connected with a hot end inlet of the condenser. And a hot end outlet of the condenser is connected with the liquid storage inlet. The liquid storage outlet is connected with a cold end inlet of the evaporator. A cold end outlet of the evaporator is connected with the separation inlet. The gas outlet is connected with the compressor. The circulation system includes a circulation loop. Two ends of the circulation loop are respectively connected with a hot end inlet and a hot end outlet of the evaporator. And a load is arranged on the circulation loop. The circulation system is used for controlling the temperature of the load. According to the semiconductor temperature control device, the heat exchange effect of the condenser can be maximized, the safety of the compressor is guaranteed, meanwhile, an equipment system is simplified, and the equipment size is reduced.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor temperature control, in particular to a semiconductor temperature control device. Background Art

[0002] Semiconductor temperature control equipment is an important equipment in the manufacturing process of semiconductor integrated circuits (ICs). In the etching process of integrated circuit IC manufacturing, it is required to maintain a constant temperature output to control the process chamber of the etching equipment, and rapid and precise temperature control is required.

[0003] The inventors have found that the refrigeration system of the temperature control device for controlling the process chamber of the etching equipment mainly adopts the method of combining an evaporator with an electric heater to achieve temperature control by adjusting PID parameters. The existing semiconductor temperature control equipment is bulky and occupies a large space. Utility Model Content

[0004] The utility model aims to provide a semiconductor temperature control device, which can simplify the equipment system and reduce the size of the equipment while maximizing the heat exchange effect of the condenser and ensuring the safety of the compressor.

[0005] The embodiment of the utility model is achieved as follows:

[0006] The semiconductor temperature control device of the utility model comprises a refrigeration system and a circulation system. The refrigeration system comprises a compressor, a condenser, a liquid storage separator and an evaporator. The liquid storage separator comprises a liquid storage inlet, a liquid storage outlet, a separation inlet and a gas outlet. The liquid storage separator is used for liquid storage and gas-liquid separation. The outlet of the compressor is connected to the hot end inlet of the condenser, the hot end outlet of the condenser is connected to the liquid storage inlet, the liquid storage outlet is connected to the cold end inlet of the evaporator, the cold end outlet of the evaporator is connected to the separation inlet, and the gas outlet is connected to the compressor; the circulation system comprises a circulation loop, the two ends of the circulation loop are respectively connected to the hot end inlet and the hot end outlet of the evaporator, a load is arranged on the circulation loop, and the circulation system is used to control the temperature of the load. The utility model integrates the liquid storage and the gas-liquid separator by setting a liquid storage separator; connecting the hot end outlet of the condenser to the liquid storage inlet can prevent the condensate from accumulating too much in the condenser; connecting the cold end outlet of the evaporator to the separation inlet can prevent the liquid from entering the compressor and affecting the performance and effect of the compressor.

[0007] In an optional embodiment, the liquid storage separator includes a liquid storage and a gas-liquid separator, the gas-liquid separator is located in the liquid storage, the liquid storage includes the liquid storage inlet and the liquid storage outlet, and the gas-liquid separator includes the separation inlet and the gas outlet. The liquid storage separator is integrally arranged to reduce the overall volume of the temperature control device and improve the economy of the device.

[0008] In an optional embodiment, the gas-liquid separator further comprises a liquid outlet, and the liquid outlet is connected to the liquid reservoir, so that the liquid reservoir can store the liquid separated by the gas-liquid separator.

[0009] In an optional embodiment, a first valve body is provided between the liquid storage outlet and the evaporator, and the first valve body is used to control the condensate to flow toward the evaporator.

[0010] In an optional embodiment, the circulation system further includes a circulating water tank, a circulating water pump and a heater, and the circulating water tank, the circulating water pump, the heater and the load are sequentially connected to the circulation loop. The circulating water tank is used to store the coolant, the circulating water pump is used to provide power to the coolant, and the heater is used to heat the coolant to adjust the coolant temperature and then adjust the load temperature.

[0011] In an optional embodiment, the circulation system further comprises a first temperature sensor, which is disposed on the circulation loop and between the heater and the load. The first temperature sensor is used to detect the temperature of the coolant before it flows to the load.

[0012] In an optional embodiment, a second valve body is further provided between the first temperature sensor and the load. The second valve body is used to control the flow of the coolant to the load, and can realize automatic control according to the temperature signal of the first temperature sensor and the set parameter value.

[0013] In an optional embodiment, the circulation system further includes a second temperature sensor, which is disposed on the circulation loop and between the load and the evaporator. The second temperature sensor is used to detect the temperature of the coolant flowing out of the load.

[0014] In an optional embodiment, a third valve body is further provided between the second temperature sensor and the load, and the third valve body is used to control the coolant to flow from the load to the second temperature sensor.

[0015] In an optional embodiment, the condenser further comprises a cold end inlet and a cold end outlet, which are used to release the heat dissipated by the condenser, and transfer the heat dissipated by the condenser to the external environment.

[0016] The beneficial effects of the embodiments of the utility model are:

[0017] The semiconductor temperature control device includes a refrigeration system and a circulation system. The refrigeration system includes a compressor, a condenser, a liquid storage separator and an evaporator. The liquid storage separator includes a liquid storage inlet, a liquid storage outlet, a separation inlet and a gas outlet. The outlet of the compressor is connected to the hot end inlet of the condenser. The hot end outlet of the condenser is connected to the liquid storage inlet. The liquid storage outlet is connected to the cold end inlet of the evaporator. The cold end outlet of the evaporator is connected to the separation inlet. The gas outlet is connected to the compressor. The circulation system includes a circulation loop. The two ends of the circulation loop are respectively connected to the hot end inlet and the hot end outlet of the evaporator. A load is provided on the circulation loop. The circulation system is used to control the temperature of the load. By setting a liquid storage separator, the liquid storage and the gas-liquid separator are integrated; connecting the hot end outlet of the condenser to the liquid storage inlet can prevent the condensate from accumulating too much in the condenser; connecting the cold end outlet of the evaporator to the separation inlet can prevent the liquid from entering the compressor and affecting the performance and effect of the compressor. The semiconductor temperature control device can simplify the equipment system and reduce the equipment volume while maximizing the heat exchange effect of the condenser and ensuring the safety of the compressor. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 Schematic diagram of the structure of a semiconductor temperature control device according to an embodiment of the utility model.

[0020] Icons: 100-semiconductor temperature control device; 10-refrigeration system; 11-compressor; 12-condenser; 13-liquid storage separator; 131-liquid storage; 1311-liquid storage inlet; 1312-liquid storage outlet; 132-gas-liquid separator; 1321-separation inlet; 1322-gas outlet; 14-first valve body; 15-evaporator; 20-circulation system; 21-circulating water tank; 22-circulating water pump; 23-heater; 25-first temperature sensor; 26-second valve body; 27-load; 28-third valve body; 29-second temperature sensor. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Please refer to Figure 1The semiconductor temperature control device 100 of this embodiment includes a refrigeration system 10 and a circulation system 20. The refrigeration system 10 includes a compressor 11, a condenser 12, a liquid storage separator 13 and an evaporator 15. The liquid storage separator 13 includes a liquid storage inlet 1311, a liquid storage outlet 1312, a separation inlet 1321 and a gas outlet 1322. The liquid storage separator 13 is used for liquid storage and gas-liquid separation. The outlet of the compressor 11 is connected to the hot end inlet of the condenser 12, the hot end outlet of the condenser 12 is connected to the liquid storage inlet 1311, the liquid storage outlet 1312 is connected to the cold end inlet of the evaporator 15, the cold end outlet of the evaporator 15 is connected to the separation inlet 1321, and the gas outlet 1322 is connected to the compressor 11. The circulation system 20 includes a circulation loop, the two ends of the circulation loop are respectively connected to the hot end inlet and the hot end outlet of the evaporator 15, and a load 27 is provided on the circulation loop. The circulation system 20 is used to control the temperature of the load 27.

[0028] Specifically, the compressor 11 is used to compress and drive the refrigerant, and the low-temperature and low-pressure refrigerant gas is passed into the compressor 11 to output the high-temperature and high-pressure refrigerant gas. The condenser 12 is used to condense the high-temperature and high-pressure gas flowing out of the compressor 11 to form a condensate. The outlet of the condenser 12 is connected to the liquid storage inlet 1311 of the liquid storage separator 13, so that the condensate condensed by the condenser 12 can be stored in the liquid storage separator 13, which can prevent the condensate from accumulating too much in the condenser 12, thereby reducing the heat transfer area of ​​the condenser 12 and affecting the condensation effect of the condenser 12, so that the refrigerant flowing through the condenser 12 can be condensed more fully. The evaporator 15 is used to evaporate the condensate to form a gas, and then transport it to the compressor 11 for compression. The gas output by the evaporator 15 is a gas-liquid mixture, that is, it contains liquid. The separation inlet 1321 and the gas outlet 1322 of the liquid storage separator 13 are respectively connected to the evaporator 15 and the compressor 11. The liquid storage separator 13 can separate the gas output by the evaporator 15 into gas and liquid, thereby preventing the gas containing liquid from entering the compressor 11 and affecting the performance and effect of the compressor 11.

[0029] According to the semiconductor temperature control device 100 of the embodiment of the present application, a liquid storage separator 13 is arranged between the evaporator 15 and the condenser 12. The liquid storage separator 13 has the functions of storing liquid and separating gas and liquid. The condensed liquid after condensation by the condenser 12 can be stored in the liquid storage separator 13, so that it is possible to avoid storing excess condensed liquid in the condenser 12 and affecting the condensation effect of the condenser 12, thereby making the refrigerant condense more fully, improving the use efficiency of the condenser 12 and the refrigeration effect of the refrigerant; the gas passing through the evaporator 15 can be separated into gas and liquid by the liquid storage separator 13, and the gas contained in the gas can be separated into gas and liquid. The liquid is separated, so that the separated liquid can be stored in the liquid storage separator 13, and the separated gas can flow to the compressor 11, thereby preventing the liquid from flowing to the compressor 11 and causing liquid hammer, thereby avoiding affecting the performance and effect of the compressor 11; at the same time, the high-temperature and high-pressure condensate stored in the liquid storage separator 13 can also exchange heat with the low-temperature and low-pressure gas-liquid mixture, so that the low-temperature and low-pressure gas-liquid mixture can be heated to increase the gas volume, thereby increasing the circulation volume of the refrigerant in the refrigeration cycle system 20, and can also cool the stored condensate to a small extent, increase supercooling and thus increase the refrigeration capacity.

[0030] It can be understood that the condenser 12 and the evaporator 15 in this embodiment are both heat exchangers. The two ends of the condenser 12 are the cold end and the hot end, respectively. The high-temperature gas is introduced from the compressor 11 into the hot end inlet of the condenser 12, condensed by the condenser 12 to form condensate, and then flows out from the cold end outlet of the condenser 12. The two ends of the evaporator 15 are the cold end and the hot end, respectively. The condensate is introduced from the cold end inlet of the evaporator 15, evaporated by the heating of the evaporator 15, forms high-temperature gas, and then flows out from the cold end outlet of the evaporator 15.

[0031] Furthermore, the condenser 12 also includes a cold end inlet and a cold end outlet, which are used to release the heat emitted by the condenser 12 during condensation. In this embodiment, the cold end inlet and the cold end outlet of the condenser 12 are also connected to a cooling water system (not shown) through a pipeline, which is used to transfer the heat emitted by the condenser 12 during condensation to the pipeline and perform heat exchange with the cooling water of the cooling water system. In other embodiments, the condenser 12 can also perform heat exchange with the air through the pipeline, as long as the high-temperature gas can be condensed to form condensate, the utility model is not limited thereto.

[0032] In the present embodiment, the liquid storage separator 13 includes a liquid storage 131 and a gas-liquid separator 132. The gas-liquid separator 132 is located in the liquid storage 131. The liquid storage 131 includes a liquid storage inlet 1311 and a liquid storage outlet 1312. The gas-liquid separator 132 includes a separation inlet 1321 and a gas outlet 1322. It can be understood that in the present embodiment, the gas-liquid separator 132 is arranged inside the liquid storage 131 to realize the integrated arrangement of the liquid storage separator 13, which can reduce the overall volume of the temperature control device and improve the economy of the device.

[0033] Furthermore, the gas-liquid separator 132 also includes a liquid outlet. The liquid outlet is connected to the liquid reservoir 131. It can be understood that after the high-temperature gas heated and evaporated by the evaporator 15 is separated into gas and liquid by the gas-liquid separator 132, the gas is passed into the compressor 11 for cyclic compression and utilization, and the liquid can be stored in the liquid reservoir 131 or can be continuously utilized.

[0034] Optionally, in this embodiment, a first valve body 14 is provided between the liquid storage outlet 1312 and the evaporator 15 for controlling the flow of condensate to the evaporator 15. For example, the cooling capacity of the refrigeration system 10 can be adjusted by the first valve body 14 to ensure stable operation of the refrigeration system 10.

[0035] The circulation system 20 of this embodiment includes a circulating water tank 21, a circulating water pump 22 and a heater 23. The circulating water tank 21, the circulating water pump 22, the heater 23 and the load 27 are connected to the circulation loop in sequence. Specifically, a refrigerant is installed in the circulation loop. The hot end outlet of the evaporator 15 is connected to the inlet of the circulating water tank 21. The outlet of the circulating water tank 21 is connected to the inlet of the circulating water pump 22. The outlet of the circulating water pump 22 is connected to the inlet of the heater 23. The heater 23 heats the refrigerant to control the temperature of the refrigerant and achieve precise temperature control of the load 27. The outlet of the heater 23 is connected to the inlet of the load 27. The outflow end of the load 27 is connected to the hot end inlet of the evaporator 15. Thereby, a circulation loop is formed to achieve continuous circulation temperature control of the load 27.

[0036] It can be understood that the two ends of the evaporator 15 are a cold end and a hot end, respectively, wherein the cold end of the evaporator 15 is connected to the refrigeration system 10, and the hot end of the evaporator 15 is connected to the circulation system 20. The condensate flowing out of the condenser 12 evaporates and heats up through the evaporator 15 to form a high-temperature gas, and evaporates and absorbs the heat of the refrigerant in the circulation system 20, thereby realizing heat exchange between the condensate in the refrigeration system 10 and the refrigerant in the circulation system 20.

[0037] In order to detect the temperature of the refrigerant before it flows to the load 27, the circulation system 20 also includes a first temperature sensor 25. The first temperature sensor 25 is arranged on the circulation loop and between the heater 23 and the load 27. The first temperature sensor 25 is connected to the first valve body 14, and the opening is automatically controlled by setting the PID parameter value, so as to achieve real-time adjustment of the cooling capacity. The heater 23 is used to heat the refrigerant after being cooled by the evaporator 15, so as to achieve high-precision temperature adjustment.

[0038] Furthermore, a second valve body 26 is provided between the first temperature sensor 25 and the load 27. The second valve body 26 is used to control the flow of the coolant to the load 27, and can realize automatic control according to the temperature signal of the first temperature sensor 25 and the set parameter value.

[0039] In order to detect the temperature of the brine flowing out of the load 27 , the circulation system 20 further includes a second temperature sensor 29 . The second temperature sensor 29 is disposed on the circulation loop and between the load 27 and the evaporator 15 .

[0040] Furthermore, a third valve body 28 is provided between the second temperature sensor 29 and the load 27 . The third valve body 28 is used to control the coolant to flow from the load 27 to the second temperature sensor 29 .

[0041] The working principle and process of the semiconductor temperature control device 100 are:

[0042] In the refrigeration system 10, low-pressure gas is passed into the compressor 11, and high-pressure gas is output and passed into the condenser 12. The condenser 12 condenses the high-temperature gas to form condensate. The outlet of the condenser 12 is connected to the liquid storage inlet 1311 of the liquid storage separator 13, and the condensate is passed into the evaporator 15 from the liquid storage outlet 1312. The evaporator 15 evaporates the condensate to form gas, which is then transported to the liquid storage separator 13 for gas-liquid separation. The separated gas is passed into the compressor 11 from the gas outlet 1322 for reuse.

[0043] In the circulation system 20, the refrigerant after absorbing heat in the evaporator 15 is passed into the circulating water tank 21, and is passed into the heater 23 through the action of the circulating water pump 22. The refrigerant is heated according to the temperature signals of the first temperature sensor 25 and the second temperature sensor 29 and the set parameter values, and is passed into the load 27 for temperature control, thereby achieving high-precision temperature regulation. The refrigerant flows out of the load 27 and is passed into the evaporator 15 for heat exchange and cooling, thereby forming a circulation loop.

[0044] The beneficial effects of the semiconductor temperature control device 100 are:

[0045] The semiconductor temperature control device 100 includes a refrigeration system 10 and a circulation system 20. The refrigeration system 10 includes a compressor 11, a condenser 12, a liquid storage separator 13 and an evaporator 15. The liquid storage separator 13 includes a liquid storage inlet 1311, a liquid storage outlet 1312, a separation inlet 1321 and a gas outlet 1322. The outlet of the compressor 11 is connected to the hot end inlet of the condenser 12, the hot end outlet of the condenser 12 is connected to the liquid storage inlet 1311, the liquid storage outlet 1312 is connected to the cold end inlet of the evaporator 15, the cold end outlet of the evaporator 15 is connected to the separation inlet 1321, and the gas outlet 1322 is connected to the compressor 11. The circulation system 20 includes a circulation loop, the two ends of the circulation loop are respectively connected to the hot end inlet and the hot end outlet of the evaporator 15, and a load 27 is provided on the circulation loop for controlling the temperature of the load 27. By providing a liquid storage separator 13, the liquid storage 131 and the gas-liquid separator 132 are integrated; the hot end outlet of the condenser 12 is connected to the liquid storage inlet 1311 to prevent excessive accumulation of condensate in the condenser 12; the cold end outlet of the evaporator 15 is connected to the separation inlet 1321 to prevent liquid from entering the compressor 11 and affecting the performance and effect of the compressor 11. The semiconductor temperature control device 100 can simplify the equipment system and reduce the equipment volume while maximizing the heat exchange effect of the condenser 12 and ensuring the safety of the compressor 11.

[0046] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor temperature control device (100), characterized in that: The invention comprises a refrigeration system (10) and a circulation system (20), wherein the refrigeration system (10) comprises a compressor (11), a condenser (12), a liquid storage separator (13) and an evaporator (15), wherein the liquid storage separator (13) comprises a liquid storage inlet (1311), a liquid storage outlet (1312), a separation inlet (1321) and a gas outlet (1322), wherein the liquid storage separator (13) is used for storing liquid and separating gas and liquid, wherein the outlet of the compressor (11) is connected to the hot end inlet of the condenser (12), and the hot end outlet of the condenser (12) is connected to the hot end outlet of the evaporator (15). The liquid storage inlet (1311) is connected to the liquid storage outlet (1312) and the cold end inlet of the evaporator (15); the cold end outlet of the evaporator (15) is connected to the separation inlet (1321); and the gas outlet (1322) is connected to the inlet of the compressor (11); the circulation system (20) comprises a circulation loop, the two ends of the circulation loop are respectively connected to the hot end inlet and the hot end outlet of the evaporator (15); a load (27) is provided on the circulation loop, and the circulation system is used to control the temperature of the load (27).

2. The semiconductor temperature control device (100) according to claim 1, characterized in that: The liquid storage separator (13) comprises a liquid storage (131) and a gas-liquid separator (132); the gas-liquid separator (132) is located in the liquid storage (131); the liquid storage (131) comprises the liquid storage inlet (1311) and the liquid storage outlet (1312); the gas-liquid separator (132) comprises the separation inlet (1321) and the gas outlet (1322).

3. The semiconductor temperature control device (100) according to claim 2, characterized in that: The gas-liquid separator (132) further comprises a liquid outlet, wherein the liquid outlet is connected to the liquid reservoir (131) so as to store the separated liquid in the liquid reservoir (131).

4. The semiconductor temperature control device (100) according to claim 1, characterized in that: A first valve body (14) is provided between the liquid storage outlet (1312) and the evaporator (15).

5. The semiconductor temperature control device (100) according to claim 1, characterized in that: The circulation system (20) further comprises a circulation water tank (21), a circulation water pump (22) and a heater (23); the circulation water tank (21), the circulation water pump (22), the heater (23) and the load (27) are sequentially connected to the circulation loop.

6. The semiconductor temperature control device (100) according to claim 5, characterized in that: The circulation system (20) further comprises a first temperature sensor (25), wherein the first temperature sensor (25) is arranged on the circulation loop and between the heater (23) and the load (27).

7. The semiconductor temperature control device (100) according to claim 6, characterized in that: A second valve body (26) is provided between the first temperature sensor (25) and the load (27).

8. The semiconductor temperature control device (100) according to claim 5, characterized in that: The circulation system (20) further comprises a second temperature sensor (29), wherein the second temperature sensor (29) is arranged on the circulation loop and between the load (27) and the evaporator (15).

9. The semiconductor temperature control device (100) according to claim 8, characterized in that: A third valve body (28) is also provided between the second temperature sensor (29) and the load (27).

10. The semiconductor temperature control device (100) according to claim 1, characterized in that: The condenser (12) further comprises a cold end inlet and a cold end outlet, which are used to release heat generated by condensation in the condenser (12).