Radiator

Abstract

The utility model discloses a radiator, which relates to the field of heat dissipation and comprises a first heat dissipation main body, a second heat dissipation main body and a thermoelectric refrigerating unit, the first heat dissipation main body and the second heat dissipation main body are oppositely arranged, and the thermoelectric refrigerating unit is provided with a first heat conduction end and a second heat conduction end. One of the first heat conduction end and the second heat conduction end is a hot end, the other one of the first heat conduction end and the second heat conduction end is a cold end, the thermoelectric refrigerating unit is arranged between the first heat dissipation body and the second heat dissipation body, the first heat conduction end is in heat conduction fit with the first heat dissipation body, and the second heat conduction end is in heat conduction fit with the second heat dissipation body. According to the radiator, the first heat dissipation body, the second heat dissipation body and the thermoelectric refrigerating unit are arranged, the thermoelectric refrigerating unit has the refrigerating and heating functions, the radiator has the two working modes of the heating mode and the cooling mode, and the radiator using the thermoelectric refrigerating unit is simple in structure and high in heat dissipation efficiency.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation, in particular to a radiator. Background Art

[0002] In the related art, the heat dissipation methods of the radiator mainly include conduction heat dissipation and convection heat dissipation. For chips and small communication equipment with high power consumption, due to the limitation of volume, small communication equipment can often only use conduction heat dissipation. The purpose of cooling is achieved by placing a radiator inside the small communication equipment. However, a larger radiator is generally required for heat dissipation, which will cause the small communication equipment to be too heavy and complex in structure. In addition, the conduction cooling effect is often not ideal and the heat dissipation efficiency is low. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a radiator having two working modes, a heating mode and a cooling mode, with a simple structure and high heat dissipation efficiency.

[0004] According to the embodiment of the utility model, the heat sink includes: a first heat sink body, a second heat sink body and a thermoelectric cooler, the first heat sink body and the second heat sink body are arranged opposite to each other, the thermoelectric cooler has a first heat conducting end and a second heat conducting end, one of the first heat conducting end and the second heat conducting end is configured as a hot end, and the other of the first heat conducting end and the second heat conducting end is configured as a cold end, the thermoelectric cooler is arranged between the first heat sink body and the second heat sink body, and the first heat conducting end is thermally matched with the first heat sink body, and the second heat conducting end is thermally matched with the second heat sink body.

[0005] According to the heat sink of the embodiment of the present application, a first heat dissipation body, a second heat dissipation body and a thermoelectric refrigerator are provided. The thermoelectric refrigerator is formed with a first heat conducting end and a second heat conducting end. The first heat conducting end is thermally coordinated with the first heat dissipation body, and the second heat conducting end is thermally coordinated with the second heat dissipation body. One of the first heat conducting end and the second heat conducting end is constructed as a hot end, and the other of the first heat conducting end and the second heat conducting end is constructed as a cold end. The hot end of the thermoelectric refrigerator can discharge heat to achieve a heating effect, and the cold end of the thermoelectric refrigerator can absorb heat to achieve a cooling effect, thereby realizing the cooling and heating functions of the thermoelectric refrigerator, so that the radiator can have two working modes: a heating mode and a cooling mode. The radiator using the thermoelectric refrigerator has a simple structure and high heat dissipation efficiency.

[0006] According to some embodiments of the present invention, the heat sink further includes: a heat conducting layer, which is disposed between the first heat dissipation body and the first heat conducting end; and / or the heat conducting layer is disposed between the second heat dissipation body and the second heat conducting end.

[0007] According to some embodiments of the present invention, the heat-conducting layer is configured as a heat-conducting adhesive layer.

[0008] According to some embodiments of the present invention, the heat sink further includes: a heat insulation layer, wherein the heat insulation layer is disposed between the first heat dissipation body and the second heat dissipation body.

[0009] According to some embodiments of the present utility model, the thermal insulation layer is formed with an assembly hole, the assembly hole penetrates the thermal insulation layer along the thickness direction of the thermal insulation layer, and the thermoelectric cooler is assembled in the assembly hole.

[0010] According to some embodiments of the utility model, the thermal insulation layer further forms a wiring space connected to the assembly hole, the thermoelectric cooler is connected to a power line, and at least a part of the power line is assembled in the wiring space.

[0011] According to some embodiments of the present invention, the power cord is connected to an electric plug connector.

[0012] According to some embodiments of the present invention, the heat sink also includes: a control circuit, which is connected to the thermoelectric cooler, and is used to control the flow of current in the thermoelectric cooler so that one of the first heat conductive end and the second heat conductive end is constructed as a hot end, and the other of the first heat conductive end and the second heat conductive end is constructed as a cold end.

[0013] According to some embodiments of the utility model, the control circuit includes: a double-pole double-throw switch and a switch control subcircuit, the first moving contact of the double-pole double-throw switch is connected to the positive pole of the DC power supply, the second moving contact of the double-pole double-throw switch is connected to the negative pole of the DC power supply, the second static contact and the third static contact of the double-pole double-throw switch are respectively connected to one end of the thermoelectric cooler, and the fourth static contact of the double-pole double-throw switch is connected to the other end of the thermoelectric cooler; the first input end of the switch control subcircuit is connected to the first static contact of the double-pole double-throw switch, the second input end of the switch control subcircuit is a control signal input end for receiving the control signal of the switch control subcircuit, and the output end of the switch control subcircuit is connected to the other end of the thermoelectric cooler.

[0014] According to some embodiments of the present utility model, the switch control subcircuit includes: a first resistor, a transistor, a second resistor, a third resistor and a MOS tube, one end of the first resistor serves as the second input end of the switch control subcircuit, the base of the transistor is connected to the other end of the first resistor, the emitter of the transistor is grounded, one end of the second resistor is connected to the base of the transistor, the other end of the second resistor is connected to the emitter of the transistor, one end of the third resistor serves as the first input end of the switch control subcircuit, the other end of the third resistor is connected to the collector of the transistor, the source of the MOS tube is connected to one end of the third resistor, the gate of the MOS tube is connected to the other end of the third resistor, and the drain of the MOS tube serves as the output end of the switch control subcircuit.

[0015] According to some embodiments of the present invention, the first heat dissipation body and the second heat dissipation body are fixedly connected.

[0016] According to some embodiments of the utility model, the first heat dissipation body is connected with a screw, and the second heat dissipation body is formed with a mounting hole. The screw is passed through the mounting hole and is connected with a nut to fix the first heat dissipation body and the second heat dissipation body.

[0017] According to some embodiments of the present invention, the first heat dissipation body includes: a heat dissipation body and heat dissipation fins, the heat dissipation body is thermally coordinated with the first heat conduction end, and the heat dissipation fins are arranged on the heat dissipation body and located on a side of the heat dissipation body away from the second heat dissipation body.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0020] Figure 1 is a top view of a radiator according to an embodiment of the present application;

[0021] Figure 2 yes Figure 1 Sectional view at AA in the figure;

[0022] Figure 3 is a side view of a radiator according to an embodiment of the present application;

[0023] Figure 4 is a bottom view of a radiator according to an embodiment of the present application;

[0024] Figure 5 is an exploded view of a heat sink according to an embodiment of the present application;

[0025] Figure 6 It is a schematic diagram of the connection between the control circuit of the radiator and the thermoelectric cooler according to an embodiment of the present application.

[0026] Reference numerals:

[0027] Radiator 1, power cord 2, electrical plug connector 3,

[0028] The first heat dissipation body 10, the screw 11, the heat dissipation body 12, the heat dissipation fins 13,

[0029] The second heat dissipation body 20, the nut 21,

[0030] Thermoelectric cooler 30, first heat conducting end 31, second heat conducting end 32,

[0031] Heat conducting layer 40, heat insulating layer 50, assembly hole 51,

[0032] Control circuit 60,

[0033] Double-pole double-throw switch 61, first moving contact 611, second moving contact 612, first stationary contact 613, second stationary contact 614, third stationary contact 615, fourth stationary contact 616,

[0034] The switch control sub-circuit 62 includes a first resistor 621 , a transistor 622 , a second resistor 623 , a third resistor 624 , and a MOS transistor 625 . DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] Reference below Figure 1-Figure 6 A heat sink 1 according to an embodiment of the present invention is described.

[0037] According to the radiator 1 of the utility model, Figure 1 and Figure 2As shown, the heat sink 1 may include: a first heat sink body 10, a second heat sink body 20 and a thermoelectric cooler 30. The first heat sink body 10 and the second heat sink body 20 are arranged opposite to each other. The thermoelectric cooler 30 has a first heat conducting end 31 and a second heat conducting end 32. One of the first heat conducting end 31 and the second heat conducting end 32 is configured as a hot end, and the other of the first heat conducting end 31 and the second heat conducting end 32 is configured as a cold end. The thermoelectric cooler 30 is arranged between the first heat sink body 10 and the second heat sink body 20, and the first heat conducting end 31 is thermally matched with the first heat sink body 10, and the second heat conducting end 32 is thermally matched with the second heat sink body 20.

[0038] It should be noted that in the relevant technology, due to the size limitation of chips and small communication devices with high power consumption, only conduction heat dissipation can be used. The cooling purpose can be achieved by placing a radiator inside the small communication device, but a larger radiator is generally required for heat dissipation, which causes the small communication device to be too heavy and complex in structure. In addition, the cooling effect of conduction heat dissipation is often not ideal and the heat dissipation efficiency is low.

[0039] Based on this, an embodiment of the present application proposes a radiator 1, which may include a first heat dissipation body 10, a second heat dissipation body 20 and a thermoelectric cooler 30. The first heat dissipation body 10 and the second heat dissipation body 20 are arranged opposite to each other and spaced apart. The first heat dissipation body 10 may be one of the radiator cover and the radiator base, and the second heat dissipation body 20 may be the other of the radiator cover and the radiator base. The thermoelectric cooler 30 is arranged between the first heat dissipation body 10 and the second heat dissipation body 20. The thermoelectric cooler 30 can be connected to the first heat dissipation body 10. The thermoelectric cooler 30 can be connected to the first heat dissipation body 10 by bonding, bolting, etc. The thermoelectric cooler 30 can also be connected to the second heat dissipation body 20. The thermoelectric cooler 30 can be connected to the second heat dissipation body 20 by bonding, bolting, etc.

[0040] It should be noted that the thermoelectric cooler 30 is a TEC (Thermoelectric Cooler), and semiconductor materials are the core components of the thermoelectric cooler 30. By using semiconductor materials, the thermoelectric cooler 30 can simultaneously realize the two functions of cooling and heating. When the thermoelectric cooler 30 is connected to a power source, heat can be transferred between the first heat-conducting end 31 and the second heat-conducting end 32, so that one of the first heat-conducting end 31 and the second heat-conducting end 32 is a hot end, and the other of the first heat-conducting end 31 and the second heat-conducting end 32 is a cold end. The temperature of one end of the thermoelectric cooler 30 decreases, and the temperature of the other end increases. By changing the flow direction of the power supply current, the flow direction of heat can be changed, thereby changing the cold end and the hot end of the thermoelectric cooler 30, so that the cold end and the hot end are interchanged, thereby realizing the cooling or heating function of the thermoelectric cooler 30. The thermoelectric cooler 30 uses semiconductor materials, and has high cooling efficiency and heating efficiency.

[0041] In the embodiment of the present application, the thermoelectric cooler 30 uses an N-type semiconductor and a P-type semiconductor. The thermoelectric cooler 30 is formed with a first heat-conducting end 31 and a second heat-conducting end 32. The first heat-conducting end 31 and the second heat-conducting end 32 can be made of insulating materials such as quartz and ceramic sheets, which can play an insulating role to prevent the current in the thermoelectric cooler 30 from being conducted to the first heat dissipation body 10 or the second heat dissipation body 20, thereby improving the safety of the heat sink 1. A metal conductor is provided between the first heat-conducting end 31 and the semiconductor material, and a metal conductor is also provided between the second heat-conducting end 32 and the semiconductor material. The metal conductor can play an electrically conductive and thermally conductive role, so that heat can flow to the first heat-conducting end 31 and the second heat-conducting end 32. The first heat-conducting end 31 cooperates with the first heat-dissipating body 10 for thermal conduction, and the second heat-conducting end 32 cooperates with the second heat-dissipating body 20 for thermal conduction. One of the first heat-conducting end 31 and the second heat-conducting end 32 is configured as a hot end. When the thermoelectric cooler 30 is working, the temperature of the hot end increases and the temperature of the cold end decreases. The hot end can cooperate with the first heat dissipation body 10 to achieve heat discharge through the first heat dissipation body 10, thereby realizing the heating function of the thermoelectric cooler 30, or the hot end can cooperate with the second heat dissipation body 20 to achieve heat discharge through the second heat dissipation body 20, thereby realizing the heating function of the thermoelectric cooler 30. The other of the first heat-conducting end 31 and the second heat-conducting end 32 is configured as a cold end. The temperature of the cold end is reduced, and the cold end can absorb heat to play a cooling role on the first heat dissipation body 10 or the second heat dissipation body 20. The thermoelectric cooler 30 has the characteristics of small size, light weight, and high heat transfer efficiency. The radiator 1 using the thermoelectric cooler 30 can have two working modes: heating mode and cooling mode. The radiator 1 has a simple structure and high heat dissipation efficiency.

[0042] In some embodiments of the present invention, Figure 5 As shown, the heat sink 1 may further include: a heat conducting layer 40 , the heat conducting layer 40 is disposed between the first heat dissipating body 10 and the first heat conducting end 31 ; and / or a heat conducting layer 40 is disposed between the second heat dissipating body 20 and the second heat conducting end 32 .

[0043] The heat sink 1 may further include a heat-conducting layer 40. A heat-conducting layer 40 may be provided between the first heat-dissipating body 10 and the first heat-conducting end 31, or a heat-conducting layer 40 may be provided between the second heat-dissipating body 20 and the second heat-conducting end 32, or a heat-conducting layer 40 may be provided between the first heat-dissipating body 10 and the first heat-conducting end 31 and between the second heat-dissipating body 20 and the second heat-conducting end 32. The heat-conducting layer 40 may conduct heat, and the heat-conducting layer 40 may improve the heat transfer efficiency between the first heat-dissipating body 10 and the first heat-conducting end 31. The heat-conducting layer 40 may also improve the heat transfer efficiency between the second heat-dissipating body 20 and the second heat-conducting end 32, thereby reducing heat loss and improving heat dissipation efficiency.

[0044] In some embodiments of the present invention, the heat-conducting layer 40 may be constructed as a heat-conducting adhesive layer.

[0045] The thermally conductive layer 40 can be constructed as a thermally conductive adhesive layer, and the thermally conductive adhesive can be a material with good thermal conductivity and adhesion, such as thermally conductive silicone, thermally conductive epoxy resin, etc. The thermally conductive adhesive layer can have a bonding effect while conducting heat. The thermally conductive adhesive layer can be arranged between the first heat dissipation body 10 and the first thermally conductive end 31, and the thermally conductive adhesive layer can be connected to the first heat dissipation body 10 by bonding, and the thermally conductive adhesive layer can be connected to the first thermally conductive end 31 by bonding. The thermally conductive adhesive layer can also be arranged between the second heat dissipation body 20 and the second thermally conductive end 32, and the thermally conductive adhesive layer can be connected to the second heat dissipation body 20 by bonding, and the thermally conductive adhesive layer can be connected to the second thermally conductive end 32 by bonding, so as to realize a fixed connection between the thermally conductive layer 40 and the first heat dissipation body 10, the second heat dissipation body 20 and the thermoelectric cooler 30, thereby improving the stability of the structure of the radiator 1.

[0046] The thermally conductive adhesive layer can be arranged between the first heat dissipation body 10 and the first heat-conducting end 31. The thermally conductive adhesive layer can make the first heat dissipation body 10 and the first heat-conducting end 31 connected more closely. The thermally conductive adhesive layer can also conduct heat and improve the heat transfer efficiency between the first heat dissipation body 10 and the first heat-conducting end 31. The thermally conductive adhesive layer can be arranged between the second heat dissipation body 20 and the second heat-conducting end 32. The thermally conductive adhesive layer can make the second heat dissipation body 20 and the second heat-conducting end 32 connected more closely. The thermally conductive adhesive layer can improve the heat transfer efficiency between the second heat dissipation body 20 and the second heat-conducting end 32, reduce heat loss, and improve heat dissipation efficiency.

[0047] In some embodiments of the present invention, Figure 3 As shown, the heat sink 1 may further include: a heat insulating layer 50 , and the heat insulating layer 50 is disposed between the first heat dissipation body 10 and the second heat dissipation body 20 .

[0048] The thermal insulation layer 50 is arranged between the first heat dissipation body 10 and the second heat dissipation body 20. The thermal insulation layer 50 can be connected to the first heat dissipation body 10 by bonding, bolting, etc. The thermal insulation layer 50 can also be connected to the second heat dissipation body 20 by bonding, bolting, etc. The thermal insulation layer 50 is used to separate the first heat dissipation body 10 and the second heat dissipation body 20. The thermoelectric cooler 30 can be arranged on the thermal insulation layer 50. The thermal insulation layer 50 can separate the cold end and the hot end of the thermoelectric cooler 30 to avoid heat exchange between the cold end and the hot end of the thermoelectric cooler 30, reduce heat loss, and improve heat transfer efficiency.

[0049] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the heat insulation layer 50 is formed with an assembly hole 51, and the assembly hole 51 penetrates the heat insulation layer 50 along the thickness direction of the heat insulation layer 50, and the thermoelectric cooler 30 is assembled in the assembly hole 51. It should be noted that when the heat sink 1 is as shown in FIG. Figure 2 When placed in the direction, the thickness direction of the thermal insulation layer 50 is Figure 2 The assembly hole 51 can be constructed as a hole with the same cross-sectional size as the cross-sectional size of the thermoelectric cooler 30, so that the thermoelectric cooler 30 can be snap-fitted with the assembly hole 51 to achieve the assembly of the thermoelectric cooler 30, making the heat sink 1 structure more compact and improving the stability of the heat sink 1 structure.

[0050] In some embodiments of the present invention, the heat insulating layer 50 is further formed with a wiring space communicating with the assembly hole 51 , the thermoelectric cooler 30 is connected with the power line 2 , and at least a portion of the power line 2 is assembled in the wiring space.

[0051] The thermoelectric cooler 30 is connected to a DC power supply, and when the thermoelectric cooler 30 is working, the temperature of one end of the thermoelectric cooler 30 increases, and the temperature of the other end decreases, thereby constructing a hot end and a cold end of the thermoelectric cooler 30. Therefore, the thermoelectric cooler 30 is connected to a power line 2, and a DC voltage is provided to the thermoelectric cooler 30 through the power line 2, so that current is generated inside the thermoelectric cooler 30, and heat moves between the first heat conductive end 31 and the second heat conductive end 32. The insulation layer 50 also forms a wiring space connected to the assembly hole 51. At least part of the power cord 2 is assembled in the wiring space. The power cord 2 can be partially assembled in the wiring space, or the power cord 2 can be fully assembled in the wiring space. The power cord 2 is connected to the thermoelectric cooler 30 to enable the thermoelectric cooler 30 to work. The wiring space limits the assembly direction of the thermoelectric cooler 30. The thermoelectric cooler 30 is connected to the power cord 2, and the power cord 2 is arranged in the wiring space to prevent the thermoelectric cooler 30 from rotating in the assembly hole 51, thereby fixing the thermoelectric cooler 30 and improving the stability of the radiator 1 structure.

[0052] In some embodiments of the present invention, Figure 1 As shown, the power cord 2 is connected to an electrical plug connector 3 .

[0053] The thermoelectric cooler 30 is connected to a DC power supply to work. The thermoelectric cooler 30 is connected to a power cord 2, and the power cord 2 is connected to an electrical plug 3. When the power plug is connected to the DC power supply, the thermoelectric cooler 30 is powered on and starts working. Heat can move between the first heat conducting end 31 and the second heat conducting end 32, so that one of the first heat conducting end 31 and the second heat conducting end 32 is a hot end, and the other of the first heat conducting end 31 and the second heat conducting end 32 is a cold end. The cold end absorbs heat and the hot end releases heat, thereby realizing the cooling or heating function of the thermoelectric cooler 30, so that the radiator 1 has two working modes: a cooling mode and a heating mode.

[0054] As an example, the first heat dissipation body 10 can be one of the upper cover and the base of the radiator, the second heat dissipation body 20 can be the other of the upper cover and the base of the radiator, one of the first heat conducting end 31 and the second heat conducting end 32 is configured as a hot end, and the other of the first heat conducting end 31 and the second heat conducting end 32 is configured as a cold end. In the embodiment of the present application, the first heat dissipation body 10 is the upper cover of the radiator, and the second heat dissipation body 20 is the base of the radiator. The first heat dissipation body 10 is the upper cover of the radiator, the second heat dissipation body 20 is the base of the radiator, and the second heat dissipation body 20 is close to the communication device, so that the radiator 1 can perform two operations of cooling or heating the communication device.

[0055] When the thermoelectric cooler 30 is connected to a DC power supply, the current flows along the first current flow direction, and the heat flows from the second heat-conducting end 32 to the first heat-conducting end 31. The temperature of the first heat-conducting end 31 increases, and the temperature of the second heat-conducting end 32 decreases. The first heat-conducting end 31 is configured as a hot end, and the second heat-conducting end 32 is configured as a cold end. The second heat-conducting end 32 is thermally connected to the second heat-dissipating body 20. The second heat-conducting end 32 can absorb heat through the second heat-dissipating body 20. The second heat-dissipating body 20 is close to the communication device. The second heat-conducting end 32 can absorb the heat of the communication device and play a cooling role on the communication device. The radiator 1 is in a cooling mode. The first heat-conducting end 31 is thermally connected to the first heat-dissipating body 10. The first heat-conducting end 31 can discharge heat through the first heat-dissipating body 10. The first heat-conducting end 31 discharges the heat absorbed by the radiator 1 through the first heat-dissipating body 10 to achieve a heat dissipation effect.

[0056] When the current flow direction of the DC power supply is changed, the current flows along the second current flow direction, and heat flows from the first heat conducting end 31 to the second heat conducting end 32. The temperature of the first heat conducting end 31 drops, and the temperature of the second heat conducting end 32 increases. The first heat conducting end 31 is configured as a cold end, and the second heat conducting end 32 is configured as a hot end. The second heat conducting end 32 can be thermally connected to the second heat dissipation body 20, and the second heat conducting end 32 can release heat through the second heat dissipation body 20. The second heat dissipation body 20 is close to the communication equipment, and the second heat conducting end 32 can release heat to the communication equipment, thereby realizing the heating function of the communication equipment. The radiator 1 is in the heating mode.

[0057] It should be noted that the first current flow direction is opposite to the second current flow direction, the first current flow direction may be one of the forward current flow direction and the reverse current flow direction, and the second current flow direction may be the other of the forward current flow direction and the reverse current flow direction. By changing the current flow direction, the heat flow direction may be changed, thereby changing the cold end and the hot end of the thermoelectric cooler 30, so that the cold end and the hot end are interchanged, thereby realizing different functions of cooling and heating of the thermoelectric cooler 30. Thus, the two working modes of the radiator 1, the heating mode and the cooling mode, are realized.

[0058] In some embodiments of the present invention, Figure 6 As shown, the heat sink 1 may further include: a control circuit 60, the control circuit 60 is connected to the thermoelectric cooler 30, and the control circuit 60 is used to control the current flow direction in the thermoelectric cooler 30, so that one of the first heat conducting end 31 and the second heat conducting end 32 is configured as a hot end, and the other of the first heat conducting end 31 and the second heat conducting end 32 is configured as a cold end.

[0059] The heat sink 1 may further include a control circuit 60, the control circuit 60 is connected to the thermoelectric cooler 30, the control circuit 60 is disposed between the DC power supply and the thermoelectric cooler 30, the control circuit 60 is connected to the DC power supply, and the control circuit 60 is used to control the current flow direction in the thermoelectric cooler 30, so that the current flow direction in the thermoelectric cooler 30 can be a first current flow direction or a second current flow direction, so that one of the first heat conductive end 31 and the second heat conductive end 32 is configured as a hot end, and the other of the first heat conductive end 31 and the second heat conductive end 32 is configured as a cold end. In the embodiment of the present application, when the current flow direction is the first current flow direction, the first heat conductive end 31 can be configured as a hot end, and the second heat conductive end 32 can be configured as a cold end, and when the current flow direction is the second current flow direction, the first heat conductive end 31 can be configured as a cold end, and the second heat conductive end 32 can be configured as a hot end. The control circuit 60 can control the current flow direction in the thermoelectric cooler 30. By changing the current flow direction, the cold end and the hot end of the thermoelectric cooler 30 can be changed, so that the cold end and the hot end are interchanged, thereby realizing the switching of the heat sink 1 between the heating mode and the cooling mode.

[0060] In some embodiments of the present invention, Figure 6 As shown, the control circuit 60 may include: a double-pole double-throw switch 61 and a switch control subcircuit 62, wherein the first moving contact 611 of the double-pole double-throw switch 61 is connected to the positive electrode of the DC power supply, the second moving contact 612 of the double-pole double-throw switch 61 is connected to the negative electrode of the DC power supply, the second static contact 614 and the third static contact 615 of the double-pole double-throw switch 61 are respectively connected to one end of the thermoelectric cooler 30, and the fourth static contact 616 of the double-pole double-throw switch 61 is connected to the other end of the thermoelectric cooler 30; the first input end of the switch control subcircuit 62 is connected to the first static contact 613 of the double-pole double-throw switch 61, the second input end of the switch control subcircuit 62 is a control signal input end for receiving a control signal of the switch control subcircuit 62, and the output end of the switch control subcircuit 62 is connected to the other end of the thermoelectric cooler 30.

[0061] The control circuit 60 may include a double-pole double-throw switch 61 and a switch control subcircuit 62. The double-pole double-throw switch 61 includes two moving contacts and four static contacts. The double-pole double-throw switch 61 includes a first moving contact 611, a second moving contact 612, a first static contact 613, a second static contact 614, a third static contact 615 and a fourth static contact 616. The first moving contact 611 of the double-pole double-throw switch 61 is connected to the positive electrode of the DC power supply, and the second moving contact 612 of the double-pole double-throw switch 61 is connected to the negative electrode of the DC power supply, so as to realize the connection between the control circuit 60 and the DC power supply. The second static contact 614 and the third static contact 615 of the double-pole double-throw switch 61 are respectively connected to one end of the thermoelectric cooler 30, and the fourth static contact 616 of the double-pole double-throw switch 61 is connected to the other end of the thermoelectric cooler 30. The switch control subcircuit 62 includes a first input terminal, a second input terminal and an output terminal. The first input terminal of the switch control subcircuit 62 is connected to the first static contact 613 of the double-pole double-throw switch 61. The first static contact 613 of the double-pole double-throw switch 61 is connected to the other end of the thermoelectric cooler 30 through the switch control subcircuit 62. The second input terminal of the switch control subcircuit 62 is a control signal input terminal. The second input terminal of the switch control subcircuit 62 is connected to the output port of the communication device. The output port of the communication device transmits a control signal to the switch control subcircuit 62. The second input terminal of the switch control subcircuit 62 is used to receive the control signal of the switch control subcircuit 62. The output terminal of the switch control subcircuit 62 is connected to the other end of the thermoelectric cooler 30.

[0062] The control signal can control the electrical components in the switch control subcircuit 62, thereby realizing the on and off of the control circuit 60, and realizing the operation of the radiator 1 in different modes. The double-pole double-throw switch 61 is connected to the DC power supply, the double-pole double-throw switch 61 is connected to the switch control subcircuit 62, the double-pole double-throw switch 61 is connected to the thermoelectric cooler 30, and the switch control subcircuit 62 is also connected to the thermoelectric cooler 30. By changing the internal connection of the control circuit 60, the control circuit 60 can control the current flow direction in the thermoelectric cooler 30. By changing the current flow direction in the thermoelectric cooler 30, the radiator 1 can switch between the heating mode and the cooling mode.

[0063] In some embodiments of the present invention, Figure 6As shown, the switch control subcircuit 62 may include: a first resistor 621, a transistor 622, a second resistor 623, a third resistor 624 and a MOS transistor 625, one end of the first resistor 621 serves as the second input end of the switch control subcircuit 62, the base of the transistor 622 is connected to the other end of the first resistor 621, the emitter of the transistor 622 is grounded, one end of the second resistor 623 is connected to the base of the transistor 622, the other end of the second resistor 623 is connected to the emitter of the transistor 622, one end of the third resistor 624 serves as the first input end of the switch control subcircuit 62, the other end of the third resistor 624 is connected to the collector of the transistor 622, the source of the MOS transistor 625 is connected to one end of the third resistor 624, the gate of the MOS transistor 625 is connected to the other end of the third resistor 624, and the drain of the MOS transistor 625 serves as the output end of the switch control subcircuit 62.

[0064] The switch control subcircuit 62 may include a first resistor 621, a transistor 622, a second resistor 623, a third resistor 624 and a MOS transistor 625. One end of the first resistor 621 may be used as a second input end of the switch control subcircuit 62. The second input end of the switch control subcircuit 62 is used to receive a control signal of the switch control subcircuit 62. One end of the first resistor 621 is connected to an output port of a communication device, and the output port of the communication device transmits a control signal to the switch control subcircuit 62. The other end of the first resistor 621 is connected to the base of the transistor 622. The transistor 622 may be an NPN transistor 622. The transistor 622 includes a base, an emitter and a collector. The base of the transistor 622 is connected to the control signal, and the emitter of the transistor 622 is grounded. The transistor 622 can be used as a contactless switch. When the control signal is at a high level, the transistor 622 is in a saturated conduction state, and the collector and the emitter are equivalent to the on-state of the switch, and the current flows from the collector to the emitter. When the control signal is at a low level, the transistor 622 is in a cut-off state, and the collector and the emitter are equivalent to the off-state of the switch. The first resistor 621 is connected in series with the base of the transistor 622. The first resistor 621 can be used as a current limiting resistor to limit the current and protect the transistor 622 to prevent the base current of the transistor 622 from being too large or even burning out the transistor 622.

[0065] One end of the second resistor 623 is connected to the base of the transistor 622, and the other end of the second resistor 623 is connected to the emitter of the transistor 622. The second resistor 623 is connected in parallel between the base and the emitter of the transistor 622. The second resistor 623 can be used as a pull-down resistor to reduce the base voltage and reduce interference, so that the transistor 622 is not mistakenly turned on when it should not be turned on (when there is no turn-on signal at the base).

[0066] One end of the third resistor 624 can be used as the first input end of the switch control subcircuit 62. The first input end of the switch control subcircuit 62 is connected to the first static contact 613 of the double-pole double-throw switch 61. One end of the third resistor 624 is connected to the source of the MOS tube 625. The other end of the third resistor 624 is connected to the collector of the triode 622. The MOS tube 625 is a metal-oxide-semiconductor field-effect transistor (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), MOS tube 625 is a device that controls current by changing voltage. MOS tube 625 includes a gate, a source and a drain. MOS tube 625 can be used as a contactless switch. When the input signal transmitted to MOS tube 625 is low level, the gate applies a negative voltage, and the source and drain of MOS tube 625 are connected, thereby realizing the function of MOS tube 625 similar to that of a switch on. When the input signal transmitted to MOS tube 625 is high level, the gate applies a positive voltage, and the source and drain of MOS tube 625 are disconnected, thereby realizing the function of MOS tube 625 similar to that of a switch off. MOS tube 625 is an ESD sensitive element. The input resistance of MOS tube 625 itself is very high, and the capacitance between the gate and the source is very small. Therefore, it is easy to be charged by the outside world or static electricity, which can easily cause static electricity breakdown. A third resistor 624 is connected in parallel between the source and gate of the MOS tube 625. The third resistor 624 can play a protective role to prevent the MOS tube 625 from being broken down and burned when the power is turned on. The drain of the MOS tube 625 serves as the output end of the switch control subcircuit 62. The drain of the MOS tube 625 is connected to the other end of the thermoelectric cooler 30.

[0067] The switch control subcircuit 62 is provided with a first resistor 621, a triode 622, a second resistor 623, a third resistor 624 and a MOS tube 625. The triode 622 and the MOS tube 625 are used as contactless switches to realize the on and off states of the circuit. The first resistor 621 and the second resistor 623 play a role in protecting the triode 622 in the switch control subcircuit 62. The third resistor 624 plays a role in protecting the MOS tube 625 in the switch control subcircuit 62, so that the control circuit 60 can work normally.

[0068] In some embodiments of the present invention, the MOS transistor 625 is a P-type MOS transistor.

[0069] MOS tube 625 is a device that controls current by changing voltage. MOS tube 625 includes a gate, a source and a drain. In the embodiment of the present application, MOS tube 625 can be a P-type MOS tube. MOS tube 625 can be used as a contactless switch. When the input signal to MOS tube 625 is at a low level, a negative voltage is applied to the gate, and MOS tube 625 is turned on. The source and drain of MOS tube 625 are equivalent to the on state of the switch, and current flows from the source of MOS tube 625 to the drain. When the input signal to MOS tube 625 is at a high level, a positive voltage is applied to the gate, and the source and drain of MOS tube 625 are equivalent to the off state of the switch, and current cannot pass.

[0070] This application is mainly used to solve the heat dissipation problem of chips and small communication devices with high power consumption. In the embodiment of this application, the cooling or heating of the 5G cellular module is used as an example for explanation. A temperature sensor and an ADC (Analog-to-digital converter) are provided in the 5G cellular module. The ADC is used for temperature reading. The temperature sensor can detect the ambient temperature of the module. The temperature sensor is connected to the ADC for communication. The ADC is connected to the central processing unit of the module for communication. The temperature sensor transmits detection information to the ADC. The ADC converts the detection information into a digital signal. The ADC transmits the digital signal to the central processing unit. The central processing unit outputs a control signal to the control circuit 60 through the output port of the 5G cellular module. The control signal is a high level or a low level.

[0071] When the radiator 1 is in the cooling mode, the radiator 1 can be used to dissipate heat for the normal operation of the 5G cellular module. It is suitable for situations where the internal ambient temperature of the 5G cellular module is ≥75°C. The radiator 1 can also be used to replace the incubator to perform low-temperature tests on the 5G cellular module. The ambient temperature of the 5G cellular module can be reduced to -25°C to -35°C, so that the radiator 1 can be used for low-temperature tests on the 5G cellular module.

[0072] When the radiator 1 is in the cooling mode, when the internal ambient temperature of the 5G cellular module is ≥75°C, the radiator 1 is used to dissipate heat for the normal operation of the 5G cellular module. The internal temperature sensor of the 5G cellular module detects the internal ambient temperature of the module. When the ADC reads that the internal ambient temperature of the module is ≥75°C, the output port of the 5G cellular module outputs a high level to the control circuit 60, and the base of the transistor 622 is connected to the control signal. When the control signal is high, the transistor 622 is in a saturated conduction state, and the collector and the emitter are equivalent to the conduction state of the switch. The current flows from the collector to the emitter. When the transistor 622 is turned on, the collector The voltage is 0V, the other end of the third resistor 624 is connected to the collector of the triode 622, and the gate of the MOS tube 625 is connected to the other end of the third resistor 624, that is, the gate of the MOS tube 625 is connected to the collector of the triode 622. When the triode 622 is turned on, the collector voltage is 0V, and the voltage of the gate of the MOS tube 625 is also 0V. When the input signal transmitted to the MOS tube 625 is a low level (0V), a negative voltage is applied to the gate, and the MOS tube 625 is turned on. The source and drain of the MOS tube 625 are equivalent to the on state of the switch, and the current flows from the source to the drain of the MOS tube 625. At this time, the first moving contact 611 of the double-pole double-throw switch 61 is connected to the first static contact 613, the second moving contact 612 of the double-pole double-throw switch 61 is connected to the third static contact 615, and the switch control subcircuit 62 is turned on.

[0073] The first static contact 613 of the double-pole double-throw switch 61 is connected to the other end of the thermoelectric cooler 30 through the switch control subcircuit 62, the third static contact 615 of the double-pole double-throw switch 61 is connected to one end of the thermoelectric cooler 30, the first moving contact 611 of the double-pole double-throw switch 61 is connected to the positive electrode of the DC power supply, and the second moving contact 612 of the double-pole double-throw switch 61 is connected to the negative electrode of the DC power supply, so that one end of the thermoelectric cooler 30 is connected to the negative electrode of the DC power supply, and the other end of the thermoelectric cooler 30 is connected to the DC power supply. The positive pole of the electric power source is connected. At this time, the internal current of the thermoelectric cooler 30 is the first current flow direction, and the current flows from the second heat-conducting end 32 to the first heat-conducting end 31. The first heat-conducting end 31 is configured as a hot end, and the second heat-conducting end 32 is configured as a cold end. The second heat-conducting end 32 is thermally connected to the second heat dissipation body 20. The second heat-conducting body 20 is close to the 5G cellular module. The second heat-conducting end 32 can absorb the heat of the module through the second heat-conducting body 20. The thermoelectric cooler 30 realizes the refrigeration function to cool the module, thereby achieving the cooling effect of the radiator 1.

[0074] When the ADC reads that the internal ambient temperature of the module is less than 25°C, the output port of the 5G cellular module outputs a low level to the control circuit 60, and the base of the transistor 622 is connected to the control signal. When the control signal is at a low level, the transistor 622 is in a cut-off state, and the collector and the emitter are equivalent to the disconnected state of the switch. The gate of the MOS tube 625 cannot be grounded to obtain a low level due to the shutdown of the transistor 622, so that the gate of the MOS tube 625 is at a high level, resulting in the source and the drain of the MOS tube 625 being equivalent to the disconnected state of the switch, thereby disconnecting the switch control subcircuit 62, and the thermoelectric cooler 30 stops working, and the radiator 1 no longer cools the 5G cellular module.

[0075] When the radiator 1 is used for low-temperature testing of the 5G cellular module, the ambient temperature of the 5G cellular module needs to be reduced to -25°C to -35°C. When the ADC reads that the internal ambient temperature of the module is higher than -25°C, the output port of the 5G cellular module outputs a high level to the control circuit 60, the switch control subcircuit 62 is turned on, and the cold end of the thermoelectric cooler 30 is cooled to reduce the ambient temperature of the 5G cellular module to the low temperature environment required for the test. The ADC reads the relevant temperature. When the ambient temperature is lower than -35°C, the output port of the 5G cellular module outputs a low level to the control circuit 60, the switch control subcircuit 62 is disconnected, the thermoelectric cooler 30 stops working, and the radiator 1 stops working.

[0076] When the 5G cellular module works in an extreme low temperature environment, for example, when the ambient temperature is lower than -35°C, the module cannot start and work normally due to the low temperature, and the radiator 1 turns on the heating mode. At this time, the double-pole double-throw switch 61 is switched to connect the first moving contact 611 of the double-pole double-throw switch 61 with the second static contact 614, the second moving contact 612 of the double-pole double-throw switch 61 with the fourth static contact 616, the second static contact 614 of the double-pole double-throw switch 61 with one end of the thermoelectric cooler 30, the fourth static contact 616 of the double-pole double-throw switch 61 with the other end of the thermoelectric cooler 30, and the first moving contact 611 of the double-pole double-throw switch 61 with the positive pole of the DC power supply. The second moving contact 612 of the double-pole double-throw switch 61 is connected to the negative pole of the DC power supply, so that one end of the thermoelectric cooler 30 is connected to the positive pole of the DC power supply, and the other end of the thermoelectric cooler 30 is connected to the negative pole of the DC power supply. At this time, the internal current of the thermoelectric cooler 30 is the second current flow direction, the first heat conducting end 31 is constructed as a cold end, and the second heat conducting end 32 is constructed as a hot end. The second heat conducting end 32 is thermally connected to the second heat dissipation body 20. The second heat dissipation body 20 is close to the 5G cellular module. The second heat conducting end 32 can dissipate heat through the second heat dissipation body 20. The thermoelectric cooler 30 realizes a heating function to heat up the module, thereby realizing the heating effect of the radiator 1.

[0077] By setting up the control circuit 60, the current in the thermoelectric cooler 30 can flow in different directions, the radiator 1 can switch between the cooling mode and the heating mode, and the radiator 1 can realize the functions of cooling the module, replacing the temperature box to perform low-temperature testing on the module, and heating the module.

[0078] In some embodiments of the present invention, the first heat dissipation body 10 and the second heat dissipation body 20 are fixedly connected.

[0079] The first heat dissipation body 10 can be one of the radiator upper cover and the radiator base, and the second heat dissipation body 20 can be the other of the radiator upper cover and the radiator base. The radiator upper cover and the radiator base are fixedly connected to construct the external structure of the radiator 1. The first heat dissipation body 10 and the second heat dissipation body 20 are fixedly connected. The first heat dissipation body 10 and the second heat dissipation body 20 can be fixedly connected by bolt connection, clamping, etc., and the first heat dissipation body 10 is fixedly connected to the second heat dissipation body 20, so that the thermoelectric cooler 30 can be firmly arranged inside the radiator 1, thereby improving the stability of the structure of the radiator 1.

[0080] In some embodiments of the present invention, Figure 1 and Figure 5 As shown, the first heat dissipation body 10 is connected with a screw 11, and the second heat dissipation body 20 is formed with a mounting hole. The screw 11 is passed through the mounting hole and is connected with a nut 21 to fix the first heat dissipation body 10 and the second heat dissipation body 20.

[0081] In the embodiment of the present application, the first heat dissipation body 10 and the second heat dissipation body 20 are fixedly connected by bolt connection. The first heat dissipation body 10 is connected with a screw 11, and the second heat dissipation body 20 is formed with a mounting hole. The screw 11 can be multiple, and the mounting hole can also be multiple. The multiple screws 11 are spaced apart along the circumference of the first heat dissipation body 10. The screws 11 and the mounting holes are arranged correspondingly along the Z direction, so as to realize the one-to-one corresponding assembly of the screws 11 and the mounting holes. The screws 11 are inserted into the mounting holes, and the screws 11 are connected with the nuts 21 to realize the fixed connection between the first heat dissipation body 10 and the second heat dissipation body 20, so that the structure of the radiator 1 is more solid. The first heat dissipation body 10 and the second heat dissipation body 20 are provided with screws 11 and mounting holes to realize the fixed connection between the first heat dissipation body 10 and the second heat dissipation body 20, so that the disassembly and installation of the first heat dissipation body 10 and the second heat dissipation body 20 are convenient, and the work efficiency is improved.

[0082] In some embodiments of the present invention, Figure 1 and Figure 2As shown, the first heat dissipation body 10 may include: a heat dissipation body 12 and heat dissipation fins 13. The heat dissipation body 12 cooperates with the first heat conduction end 31 for thermal conductivity. The heat dissipation fins 13 are arranged on the heat dissipation body 12 and are located on the side of the heat dissipation body 12 away from the second heat dissipation body 20.

[0083] The first heat dissipation body 10 is one of the radiator upper cover and the radiator base, and the second heat dissipation body 20 can be the other of the radiator upper cover and the radiator base. In the embodiment of the present application, the first heat dissipation body 10 is the radiator upper cover, and the second heat dissipation body 20 is the radiator base. Figure 1 and Figure 2 As shown, the first heat dissipation body 10 may include a heat dissipation body 12 and heat dissipation fins 13. The heat dissipation body 12 cooperates with the first heat-conducting end 31 for thermal conductivity. When the first heat-conducting end 31 is configured as a hot end, the heat dissipation body 12 can discharge the heat on the first heat-conducting end 31, thereby achieving a heat dissipation effect. The heat dissipation fins 13 may be metal sheets. The heat dissipation fins 13 are arranged on the heat dissipation body 12 and are located on the side of the heat dissipation body 12 away from the second heat dissipation body 20. There may be multiple heat dissipation fins 13, and the multiple heat dissipation fins 13 are spaced apart. Each heat dissipation fin 13 extends in a direction away from the heat dissipation body. The heat dissipation fins 13 are evenly distributed on the heat dissipation body 12. The heat dissipation body 12 can be integrally formed with the heat dissipation fins 13. The heat dissipation fins 13 can increase the heat dissipation area and improve the heat dissipation efficiency.

[0084] Other structures and operations of the radiator 1 according to the embodiment of the utility model are known to those skilled in the art and will not be described in detail here.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0086] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A radiator (1), characterized in that: include: A first heat dissipation body (10), a second heat dissipation body (20) and a thermoelectric cooler (30), wherein the first heat dissipation body (10) and the second heat dissipation body (20) are arranged opposite to each other, and the thermoelectric cooler (30) has a first heat conducting end (31) and a second heat conducting end (32), wherein one of the first heat conducting end (31) and the second heat conducting end (32) is configured as a hot end, and the other of the first heat conducting end (31) and the second heat conducting end (32) is configured as a cold end, and the thermoelectric cooler (30) is arranged between the first heat dissipation body (10) and the second heat dissipation body (20), and the first heat conducting end (31) is thermally matched with the first heat dissipation body (10), and the second heat conducting end (32) is thermally matched with the second heat dissipation body (20).

2. The heat sink (1) according to claim 1, characterized in that: Also includes: a heat-conducting layer (40), the heat-conducting layer (40) being provided between the first heat-dissipating body (10) and the first heat-conducting end (31); and / or The heat-conducting layer (40) is provided between the second heat-dissipating body (20) and the second heat-conducting end (32).

3. The radiator (1) according to claim 2, characterized in that: The heat-conducting layer (40) is configured as a heat-conducting adhesive layer.

4. The heat sink (1) according to claim 1, characterized in that: Also includes: A heat insulation layer (50), wherein the heat insulation layer (50) is provided between the first heat dissipation body (10) and the second heat dissipation body (20).

5. The radiator (1) according to claim 4, characterized in that: The heat insulation layer (50) is formed with an assembly hole (51), the assembly hole (51) penetrates the heat insulation layer (50) along the thickness direction of the heat insulation layer (50), and the thermoelectric cooler (30) is assembled in the assembly hole (51).

6. The heat sink (1) according to claim 5, characterized in that: The heat insulating layer (50) is also formed with a wiring space that is in communication with the assembly hole (51); the thermoelectric cooler (30) is connected to a power line (2); and at least a portion of the power line (2) is assembled in the wiring space.

7. The heat sink (1) according to claim 6, characterized in that: The power line (2) is connected to an electric plug connector (3).

8. The radiator (1) according to any one of claims 1 to 7, characterized in that: Also includes: A control circuit (60) is connected to the thermoelectric cooler (30), and is used to control the flow direction of current in the thermoelectric cooler (30) so that one of the first heat conducting end (31) and the second heat conducting end (32) is configured as a hot end, and the other of the first heat conducting end (31) and the second heat conducting end (32) is configured as a cold end.

9. The heat sink (1) according to claim 8, characterized in that: The control circuit (60) comprises: A double-pole double-throw switch (61), wherein a first moving contact (611) of the double-pole double-throw switch (61) is connected to the positive electrode of a DC power supply, a second moving contact (612) of the double-pole double-throw switch (61) is connected to the negative electrode of the DC power supply, a second stationary contact (614) and a third stationary contact (615) of the double-pole double-throw switch (61) are respectively connected to one end of the thermoelectric cooler (30), and a fourth stationary contact (616) of the double-pole double-throw switch (61) is connected to the other end of the thermoelectric cooler (30); A switch control subcircuit (62), wherein a first input end of the switch control subcircuit (62) is connected to a first static contact (613) of the double-pole double-throw switch (61), a second input end of the switch control subcircuit (62) is a control signal input end for receiving a control signal of the switch control subcircuit (62), and an output end of the switch control subcircuit (62) is connected to the other end of the thermoelectric cooler (30).

10. The heat sink (1) according to claim 9, characterized in that: The switch control subcircuit (62) comprises: a first resistor (621), one end of the first resistor (621) serving as a second input end of the switch control subcircuit (62); A triode (622), wherein the base of the triode (622) is connected to the other end of the first resistor (621), and the emitter of the triode (622) is grounded; a second resistor (623), one end of the second resistor (623) being connected to the base of the transistor (622), and the other end of the second resistor (623) being connected to the emitter of the transistor (622); a third resistor (624), one end of the third resistor (624) serving as a first input end of the switch control subcircuit (62), and the other end of the third resistor (624) being connected to the collector of the transistor (622); A MOS tube (625), wherein the source of the MOS tube (625) is connected to one end of the third resistor (624), the gate of the MOS tube (625) is connected to the other end of the third resistor (624), and the drain of the MOS tube (625) serves as the output end of the switch control subcircuit (62).

11. The radiator (1) according to any one of claims 1 to 7, characterized in that: The first heat dissipation body (10) and the second heat dissipation body (20) are fixedly connected.

12. The heat sink (1) according to claim 11, characterized in that The first heat dissipation body (10) is connected with a screw rod (11), and the second heat dissipation body (20) is formed with a mounting hole. The screw rod (11) is passed through the mounting hole and is matched with a nut (21) to be connected so that the first heat dissipation body (10) and the second heat dissipation body (20) are fixed.

13. The radiator (1) according to any one of claims 1 to 7, characterized in that: The first heat dissipation body (10) comprises: a heat dissipation body (12) and heat dissipation fins (13); the heat dissipation body (12) and the first heat conduction end (31) are heat-conductingly matched; the heat dissipation fins (13) are arranged on the heat dissipation body (12) and are located on a side of the heat dissipation body (12) away from the second heat dissipation body (20).

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