IEPE type vibration sensor

Abstract

The utility model relates to an IEPE type vibration sensor, and specifically relates to an IEPE type vibration sensor comprising a pedestal; the shell pipe is fixedly connected to the outer side of the top end of the base; the core body assembly is arranged on the inner side of the shell tube, is connected with the base through an insulation pad, and is used for converting the vibration signal into a charge signal; the charge amplification assembly is connected with the output end of the core body assembly; the connector is connected with the other end of the shell tube; according to the utility model, the manufacturing is simple and fast, the design is realized by adopting a pressing ring mode, the yield is high, the cost is low, the applicable working environment temperature range is wide, the design of a double-layer shielding structure is realized, the anti-interference capability is strong, and the insulation and voltage endurance capability is strong.

Description

Technical Field

[0001] The utility model relates to, in particular to an IEPE type vibration sensor. Background Technique

[0002] The piezoelectric IEPE vibration sensor is a vibration measuring component made by using the positive piezoelectric effect of piezoelectric ceramics. Compared with other types of acceleration sensors, it has the characteristics of good stability, high repeatability, simple structure, not easy to age, and high sensitivity, and is widely used in industrial fields such as industry, aviation, and navigation.

[0003] The existing IEPE vibration sensors generally have a small operating temperature range, poor frequency response, and low sensitivity. Therefore, in view of the above situation, there is an urgent need to develop an IEPE type vibration sensor to overcome the deficiencies in current practical applications. Content of the Utility Model

[0004] The purpose of the utility model is to provide an IEPE type vibration sensor to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solutions:

[0006] An IEPE type vibration sensor, comprising: a base; an outer shell tube, the outer shell tube is fixedly connected and arranged on the outer side of the top end of the base; a core component, the core component is arranged inside the outer shell tube and is connected to the base through an insulating pad, and is used for converting a vibration signal into a charge signal; a charge amplification component, the charge amplification component is connected to the output end of the core component; a connector, the connector is connected to the other end of the outer shell tube; a protection component, the protection component is arranged between the charge amplification component and the connector.

[0007] As a further scheme of the utility model: the core component comprises: a crystal bracket, a mass block, a piezoelectric ceramic, a pressing ring, a shielding ring and a shielding cover, the crystal bracket is arranged inside the outer shell tube and abuts against the insulating pad, the pressing ring, the piezoelectric ceramic and the mass block are pressed on the outer side of the crystal bracket, a shielding ring is also arranged around the outer side of the crystal bracket, the bottom end of the shielding ring is welded to the crystal bracket, and the other end is welded with a shielding cover on the outer side, and the crystal bracket is also connected to the charge amplification component through a connecting wire.

[0008] As a further scheme of the utility model: the charge amplification component comprises: a charge amplification circuit board and a second wire, the charge amplification circuit board is arranged inside the shielding ring, is connected to the connecting wire, is adhered to the mass block through epoxy glue, and the charge amplification circuit board is connected to the protection component through the second wire.

[0009] As a further solution of the present utility model: the protection component includes: a protection circuit board, a first insulating tube and a second insulating tube. The protection circuit board is arranged on the outer side of the top end of the shielding cover and is adhered to the shielding cover through epoxy glue. The protection circuit board is connected to the second wire and is connected to the connector through the first wire. The second insulating tube is arranged around the outer side of the first wire. The first insulating tube is also arranged around the outer side of the shielding ring outside the protection circuit board.

[0010] As a further solution of the present utility model: the connector adopts a glass sintering process.

[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0012] When the device is running, the core component converts the vibration signal into a charge signal, the charge amplification component converts the charge signal into a voltage signal, and conveys it to the connector along the protection component. This application is applicable to a wide range of working environment temperatures and can be used in an environment of -55 to 150 °C. Moreover, the amplification circuit part adopts a circuit designed with discrete components, and the circuit board is easy to achieve high-temperature resistance design and has a wider frequency response. Since this application adopts a more ingenious amplification circuit design, it can be used in different occasions from low frequency to 0.1 Hz and high frequency to 50 kHz. By setting the shielding ring and the shielding cover, environmental signal interference can be avoided, which is beneficial to improving the applicable range of the sensor. In addition, the core is simple and fast to manufacture, designed by the method of pressing rings, with a high yield and low cost. Description of the Drawings

[0013] Figure 1 It is the front view of the IEPE type vibration sensor.

[0014] Figure 2 It is the cross-sectional view of the IEPE type vibration sensor.

[0015] Figure 3 It is the structural schematic diagram of the core component in the IEPE type vibration sensor.

[0016] In the figure: 1 - base, 2 - outer shell tube, 3 - insulating pad, 4 - core component, 5 - protection circuit board, 6 - connector, 7 - first wire, 8 - first insulating tube, 9 - second insulating tube, 10 - connecting wire, 11 - shielding cover, 12 - epoxy glue, 13 - charge amplification circuit board, 14 - shielding ring, 15 - pressing ring, 16 - piezoelectric ceramic, 17 - mass block, 18 - crystal bracket, 19 - second wire. Detailed Description of the Invention

[0017] The technical solutions of this patent will be further described in detail below in combination with the specific implementation manners.

[0018] Embodiments of the present patent will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present patent and should not be construed as a limitation of the present patent.

[0019] Please refer to Figure 1 and Figure 2 In an embodiment of the present utility model, an IEPE type vibration sensor includes: a base 1; an outer shell tube 2, which is fixedly connected to the outer side of the top end of the base 1; a core component 4, which is arranged inside the outer shell tube 2 and is connected to the base 1 through an insulating pad 3 for converting a vibration signal into a charge signal; a charge amplification component, which is connected to the output end of the core component 4; a connector 6, which is connected to the other end of the outer shell tube 2; and a protection component, which is arranged between the charge amplification component and the connector 6.

[0020] In this embodiment, the outer shell tube 2 is laser welded to both the base 1 and the connector 6. When the device is running, the core component 4 converts the vibration signal into a charge signal, and the charge amplification component converts the charge signal into a voltage signal and transports it to the connector 6 along the protection component. This application is applicable to a wide range of working environment temperatures and can be used in an environment of -55 to 150 °C. Moreover, the amplification circuit part is designed with discrete components, and it is easy to implement a high-temperature-resistant design for the circuit board, and it has a wider frequency response. Since this application adopts a relatively ingenious amplification circuit design, it can be used in different occasions from low frequency to 0.1 Hz and high frequency to 50 kHz.

[0021] In an embodiment of the present utility model, please refer to Figure 3 The core component 4 includes: a crystal bracket 18, a mass block 17, a piezoelectric ceramic 16, a pressure ring 15, a shielding ring 14, and a shielding cover 11. The crystal bracket 18 is arranged inside the outer shell tube 2 and abuts against the insulating pad 3. The pressure ring 15, the piezoelectric ceramic 16, and the mass block 17 are pressed on the outer side of the crystal bracket 18. A shielding ring 14 is also arranged around the outer side of the crystal bracket 18. The bottom end of the shielding ring 14 is welded to the crystal bracket 18, and a shielding cover 11 is welded to the outer side of the other end. The crystal bracket 18 is also connected to the charge amplification component through a connecting wire 10.

[0022] In this embodiment, the pressure ring 15, piezoelectric ceramic 16 and mass block 17 are pressed together by a special tool. By appropriately selecting the size of the pressure ring 15, the D33 value of the piezoelectric ceramic 16, and the weight of the mass block 17, the required charge sensitivity can be obtained. By setting the shielding ring 14 and shielding cover 11, interference from environmental signals can be avoided, which is beneficial to expanding the applicable range of the sensor. Moreover, the core body is simple and quick to manufacture, designed in the form of a pressure ring, with a high yield rate and low cost.

[0023] In one embodiment of the present utility model, the charge amplification assembly includes: a charge amplification circuit board 13 and a second wire 19. The charge amplification circuit board 13 is disposed inside the shielding ring 14, connected to the connection wire 10, adhered to the mass block through epoxy glue 12, and the charge amplification circuit board 13 is connected to the protection assembly through the second wire 19.

[0024] In this embodiment, the amplification circuit part is designed as a circuit using discrete components. The circuit board can easily achieve a high-temperature-resistant design and can also be used in different scenarios from low frequency to 0.1 Hz and high frequency to 50 kHz. At the same time, covering the shielding cover 11 on the sensitive element and the charge amplification circuit board 13 can avoid interference from environmental signals and further expand the applicable range of the sensor.

[0025] In one embodiment of the present utility model, the protection assembly includes: a protection circuit board 5, a first insulating tube 8 and a second insulating tube 9. The protection circuit board 5 is disposed outside the top of the shielding cover 11, adhered to the shielding cover 11 through epoxy glue 12. The protection circuit board 5 is connected to the second wire 19 and is also connected to the connector 6 through the first wire 7. The second insulating tube 9 is disposed around the outside of the first wire 7, and the first insulating tube 8 disposed around the outside of the shielding ring 14 is also provided outside the protection circuit board 5.

[0026] In this embodiment, connecting the electrical signal of the core body assembly 4 to the protection circuit board 5 can improve the protection ability of the sensor, protect against surges, electrical fast transient bursts, and ESD impacts, thereby enhancing the safety of the sensor during use. At the same time, the double-layer shielding structure design has strong anti-interference ability.

[0027] In one embodiment of the present utility model, the connector 6 adopts a glass sintering process. The connector 6 and the outer shell tube 2 can withstand a high voltage of more than 4000 V, enabling the sensor to be applicable in complex environments.

[0028] This IEPE vibration sensor is applicable in a wide range of working environmental temperatures and can be used in an environment of -55 to 150 °C. Moreover, the amplifier circuit part adopts a circuit designed in a discrete component manner, and the circuit board is easy to achieve high-temperature resistance design and has a wider frequency response. Since this application adopts a relatively ingenious amplifier circuit design, it can be used in different occasions from low frequency to 0.1 Hz and high frequency to 50 kHz. By setting the shielding ring 14 and the shielding cover 11, the interference of environmental signals can be avoided, which is beneficial to improving the applicable range of the sensor. In addition, the core body is simple and fast to manufacture, designed in a pressing ring manner, with a high yield and low cost. Covering the shielding cover 11 on the sensitive element and the charge amplifier circuit board 13 can avoid the interference of environmental signals and further improve the applicable range of the sensor. Connecting the electrical signal of the core body assembly 4 to the protection circuit board 5 can improve the protection ability of the sensor, protect against surges, electrical fast transient bursts, and ESD impacts, thereby enhancing the safety of the sensor during use. At the same time, the double-layer shielding structure design has strong anti-interference ability. The core body assembly 4 is insulated from the outer shell tube 2, and the insulation withstand voltage ability is strong, which can withstand a high voltage of 4000 V, enabling the sensor to be applicable in a complex environment.

[0029] The above are only the preferred embodiments of the present invention. It should be noted that for those skilled in the art, without departing from the concept of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the implementation effect of the present invention and the practicality of the patent.

Claims

1. An IEPE type vibration sensor, characterized in that, Comprising: Base; Outer shell tube, the outer shell tube is fixedly connected and arranged on the outer side of the top end of the base; a core component, the core component is arranged inside the outer shell tube, and is connected to the base through an insulating pad, and is used for converting a vibration signal into a charge signal; a charge amplification component, the charge amplification component is connected to the output end of the core component; a connector, the connector is connected to the other end of the outer shell tube; a protection component, the protection component is arranged between the charge amplification component and the connector.

2. The IEPE type vibration sensor according to claim 1, characterized in that, The core component includes: a crystal bracket, a mass block, a piezoelectric ceramic, a pressure ring, a shielding ring and a shielding cover. The crystal bracket is arranged inside the outer shell tube and abuts against the insulating pad. The pressure ring, the piezoelectric ceramic and the mass block are pressed on the outer side of the crystal bracket. A shielding ring is also arranged around the outer side of the crystal bracket. The bottom end of the shielding ring is welded to the crystal bracket, and the other end is welded with a shielding cover on the outer side. The crystal bracket is also connected to the charge amplification component through a connecting wire.

3. The IEPE type vibration sensor according to claim 2, wherein, The charge amplification component includes: a charge amplification circuit board and a second wire. The charge amplification circuit board is arranged inside the shielding ring, is connected to the connecting wire, and is adhered to the mass block through epoxy glue. The charge amplification circuit board is connected to the protection component through the second wire.

4. The IEPE type vibration sensor according to claim 3, characterized in that, The protection component includes: a protection circuit board, a first insulating tube and a second insulating tube. The protection circuit board is arranged on the outer side of the top end of the shielding cover and is adhered to the shielding cover through epoxy glue. The protection circuit board is connected to the second wire and is connected to the connector through a first wire. The second insulating tube is arranged around the outer side of the first wire. The first insulating tube is also arranged around the outer side of the shielding ring on the outer side of the protection circuit board.

5. The IEPE type vibration sensor according to claim 4, characterized in that, The connector adopts a glass sintering process.

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