Ceramic copper-clad plate

Abstract

The utility model discloses a ceramic copper-clad plate, which comprises a ceramic metal substrate, a copper plate and a bonding layer between the ceramic metal substrate and the copper plate, the bonding layer comprises a tin coating and a silver coating, and the tin coating is welded with the silver coating; and the combination surface between the tin coating and the silver coating comprises a tin-silver embedded structure with the height of more than 0.5 mu m. According to the ceramic copper-clad plate disclosed by the utility model, the tin-silver embedded structure is arranged on the combined surface between the tin-plated layer and the silver-plated layer, so that the combined area between the tin-plated layer and the silver-plated layer is increased, and the combined strength between the tin-plated layer and the silver-plated layer is high.

Description

[Technical field]

[0001] The utility model relates to a printed circuit board material, in particular to a ceramic copper clad board. [Background Technology]

[0002] Thick copper ceramic circuit boards (ceramic PCB boards) have excellent thermal conductivity, thermal expansion and sealing properties, making them widely used in power devices and high-power electronic products.

[0003] Traditional thick copper ceramic circuit boards include a ceramic metal substrate, a copper plate, and a bonding layer between the ceramic metal substrate and the copper plate. The bonding layer includes a tin-plated layer and a silver-plated layer. The tin-plated layer and the silver-plated layer are hot-pressed and welded together. Since the bonding surfaces of the tin-plated layer and the silver-plated layer are relatively smooth, the bonding strength between the tin-plated layer and the silver-plated layer after hot-pressing and welding is not high. [Summary of the invention]

[0004] The technical problem to be solved by the utility model is to provide a ceramic copper-clad plate with high bonding strength between a tin-plated layer and a silver-plated layer.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is a ceramic copper-clad laminate, comprising a ceramic metal substrate, a copper plate and a bonding layer between the ceramic metal substrate and the copper plate, the bonding layer comprising a tin-plated layer and a silver-plated layer, the tin-plated layer and the silver-plated layer being welded; the bonding surface between the tin-plated layer and the silver-plated layer comprises a tin-silver mosaic structure with a height greater than 0.5 μm.

[0006] In the above-mentioned ceramic copper-clad laminate, the height of the tin-silver interlocking structure is 1 μm to 10 μm.

[0007] The ceramic copper clad laminate and the ceramic metal substrate mentioned above include a ceramic substrate and a metallized layer bonded to the welding surface of the ceramic substrate.

[0008] In the ceramic copper-clad laminate described above, the tin plating layer is plated on the welding surface of the metallized layer of the ceramic metal substrate, and the silver plating layer is plated on the welding surface of the copper plate.

[0009] In the ceramic copper-clad laminate described above, the welding surface of the metallized layer and / or the welding surface of the copper plate is a sandblasted rough surface, the silver-plated layer is plated on the sandblasted rough surface of the metallized layer or the sandblasted rough surface of the copper plate, and the welding surface of the silver-plated layer is a concave-convex surface shaped by the sandblasted rough surface.

[0010] The thickness of the silver-plated layer of the above-mentioned ceramic copper-clad laminate is equal to or less than the Ra value of the sandblasted rough surface.

[0011] The thickness of the silver-plated layer of the above-mentioned ceramic copper-clad plate is 0.1 μm to 2 μm, and the thickness of the tin-plated layer is 1 μm to 15 μm.

[0012] In the ceramic copper-clad laminate described above, the welding surface of the metallized layer and the welding surface of the copper plate are both sandblasted rough surfaces, the tinned layer is plated on the sandblasted rough surface of the metallized layer, and the welding surface of the tinned layer is a concave-convex surface shaped by the sandblasted rough surface of the metallized layer; or the tinned layer is plated on the sandblasted rough surface of the copper plate, and the welding surface of the tinned layer is a concave-convex surface shaped by the sandblasted rough surface of the copper plate.

[0013] The ceramic copper-clad plate mentioned above includes a nickel-plated layer between the tin-plated layer and the metallized layer, or includes a nickel-plated layer between the tin-plated layer and the copper plate.

[0014] In the above-mentioned ceramic copper-clad laminate, the tin-silver interlocking structure is on the sandblasted concave-convex surface of the welding surface of the silver-plated layer, and the thickness of the silver-plated layer is 2μm to 5μm.

[0015] In the ceramic copper-clad laminate described above, the metallization layer includes a titanium nitride layer, a titanium layer and a copper layer. The titanium nitride layer is the innermost layer of the metallization layer and is attached to the surface of the ceramic substrate; the copper layer is the outermost layer of the metallization layer, and the titanium layer is located between the copper layer and the titanium nitride layer.

[0016] The bonding surface between the tin-plated layer and the silver-plated layer of the ceramic copper-clad plate of the utility model has a tin-silver interlocking structure with a height greater than 0.5 μm, the bonding area between the tin-plated layer and the silver-plated layer is increased, and the bonding strength between the tin-plated layer and the silver-plated layer is improved. [Brief Description of the Drawings]

[0017] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0018] Figure 1 It is a structural schematic diagram of the ceramic copper clad plate of Example 1 of the present utility model.

[0019] Figure 2 yes Figure 1 A partial enlarged view of part I in the middle.

[0020] Figure 3 It is a structural schematic diagram of a ceramic metal substrate according to an embodiment of the present utility model. [Specific implementation method]

[0021] The structure of the ceramic copper clad plate in Example 1 of the utility model is as follows Figure 1 and Figure 2As shown, the ceramic metal substrate 10 includes a ceramic metal substrate 10, a copper plate 20, and a bonding layer 30 between the ceramic metal substrate 10 and the copper plate 20. The bonding layer 30 includes a tin plating layer 31 and a silver plating layer 32, and the tin plating layer 31 and the silver plating layer 32 are welded. The ceramic metal substrate 10 includes a ceramic substrate 11 and a metallized layer 12 bonded to the welding surface of the ceramic substrate 11. The tin-plated layer 31 is plated on the soldering surface of the metallized layer 12 of the ceramic-metal substrate 10. The soldering surface of the copper plate 20 is sandblasted. The silver-plated layer 32 is plated on the sandblasted roughened surface of the copper plate 20. The sandblasted roughened surface of the copper plate 20 has an Ra value of 0.5 μm to 2 μm. The thickness of the silver-plated layer 32 is 0.1 μm to 2 μm. The welding surface of the silver-plated layer is a concave-convex surface shaped by the sandblasted roughened surface of the copper plate 20. The Ra value of the welding surface of the silver-plated layer is 0.5 μm to 2 μm. The thickness of the tin-plated layer is 1 μm to 15 μm. The bonding surface between the tin-plated layer 31 and the silver-plated layer 32 forms a tin-silver interlocking structure 33 based on the concave-convex surface of the silver-plated layer 32. The height Δ of the tin-silver interlocking structure 33 is 0.5 μm to 2 μm.

[0022] The bonding surface between the tin-plated layer and the silver-plated layer of the ceramic copper-clad plate in Example 1 of the present invention has a tin-silver interlocking structure based on the concave and convex surface of the silver-plated layer shaped by the sandblasted rough surface of the copper plate. The bonding area between the tin-plated layer and the silver-plated layer is increased, and the bonding strength between the tin-plated layer and the silver-plated layer is improved.

[0023] The structure of the ceramic copper-clad laminate in Example 2 of the present invention is based on that of Example 1. The welding surface of the metallization layer 12 is also a sandblasted rough surface. The tin-plated layer 31 is plated on the sandblasted rough surface of the metallization layer 12. The welding surface of the tin-plated layer 31 forms a concave-convex surface shaped by the sandblasted rough surface of the metallization layer 12. The bonding surface between the tin-plated layer 31 and the silver-plated layer 32 forms a tin-silver interlocking structure 33 based on the concave-convex surface of the silver-plated layer 32 and the concave-convex surface of the tin-plated layer 31, thereby further improving the bonding strength between the tin-plated layer and the silver-plated layer.

[0024] The structure of the ceramic copper-clad plate of Example 3 of the present invention differs from that of Example 1 in that the tin-plated layer 31 is plated on the sandblasted rough surface of the copper plate 20, and the silver-plated layer 32 is plated on the welding surface of the metallized layer 12 of the ceramic metal substrate 10. The outer surface (welding surface) of the metallized layer 12 is sandblasted, and the silver-plated layer 32 is plated on the sandblasted rough surface of the metallized layer 12. The Ra value of the sandblasted rough surface of the metallized layer 12 is 0.5 μm to 2 μm, and the thickness of the silver-plated layer 32 is 0. The thickness of the silver-plated layer 31 is 1 μm to 2 μm, and the welding surface of the silver-plated layer is a concave-convex surface formed by the sandblasted rough surface of the metallized layer 12. The Ra value of the welding surface of the silver-plated layer is 0.5 μm to 2 μm. The welding surface of the tin-plated layer 31 is a concave-convex surface formed by the sandblasted rough surface of the copper plate 20. The thickness of the tin-plated layer is 1 μm to 15 μm. The bonding surface between the tin-plated layer 31 and the silver-plated layer 32 is a tin-silver interlocking structure 33 based on the concave-convex surface of the silver-plated layer 32 and the concave-convex surface of the tin-plated layer 31. The height Δ of the tin-silver interlocking structure 33 is 0.5 μm to 2 μm.

[0025] The structure of the ceramic copper-clad laminate in Example 4 of the present invention differs from that in Example 1 in that a silver-plated layer 32 is plated on the welding surface of the metallized layer 12 of the gold ceramic metal substrate 10, and a tin-plated layer 31 is plated on the welding surface of the copper plate 20, or alternatively, a tin-plated layer 31 is plated on the welding surface of the metallized layer 12 of the gold ceramic metal substrate 10, and a silver-plated layer 32 is plated on the welding surface of the copper plate 20. The thickness of the silver-plated layer 32 is 2 μm to 5 μm. The fusion bonding surface of the silver-plated layer 32 is sandblasted to form a concave-convex surface. The tin-plated layer 31 and the silver-plated layer 32 form a tin-silver interlocking structure based on the sandblasted concave-convex surface of the silver-plated layer 32.

[0026] In the above embodiments, when the tin plating layer 31 is plated on the metallized layer 12, a nickel plating layer is included between the tin plating layer 31 and the metallized layer 12; when the tin plating layer 31 is plated on the copper plate 20, a nickel plating layer is included between the tin plating layer 31 and the copper plate 20.

[0027] like Figure 3 As shown, in the above embodiments, the metallization layer 12 includes a titanium nitride layer 121, a titanium layer 122 and a copper layer 123. The titanium nitride layer 121 is the innermost layer of the metallization layer and is vacuum-plated on the surface of the ceramic substrate 11; the copper layer 123 is the outermost layer of the metallization layer, and the titanium layer 122 is located between the copper layer 123 and the titanium nitride layer 121. The titanium layer 122 is bonded to the welding surface of the ceramic substrate 11 through the titanium nitride layer 121, which can effectively improve the bonding strength between the metallization layer 12 and the ceramic substrate 11.

Claims

1. A ceramic copper-clad laminate comprising a ceramic metal substrate, a copper plate, and a bonding layer between the ceramic metal substrate and the copper plate, wherein the bonding layer comprises a tin-plated layer and a silver-plated layer, and the tin-plated layer and the silver-plated layer are welded; characterized in that: The bonding surface between the tin-plated layer and the silver-plated layer includes a tin-silver mosaic structure with a height greater than 0.5 μm.

2. The ceramic copper clad laminate according to claim 1, wherein: The height of the Sn-Ag mosaic structure is 1 μm to 2 μm.

3. The ceramic copper clad laminate according to claim 1, wherein: The ceramic metal substrate includes a ceramic substrate and a metallization layer bonded to the welding surface of the ceramic substrate.

4. The ceramic copper clad plate according to claim 3, characterized in that: The welding surface of the metallized layer and / or the welding surface of the copper plate is a sandblasted rough surface, the silver-plated layer is plated on the sandblasted rough surface of the metallized layer or the sandblasted rough surface of the copper plate, and the welding surface of the silver-plated layer is a concave-convex surface shaped by the sandblasted rough surface.

5. The ceramic copper clad plate according to claim 4, characterized in that: The thickness of the silver plating layer is equal to or less than the Ra value of the sandblasted rough surface.

6. The ceramic copper clad laminate according to claim 4, characterized in that: The thickness of the silver plating layer is 0.1 μm to 2 μm, and the thickness of the tin plating layer is 1 μm to 15 μm.

7. The ceramic copper clad laminate according to claim 4, characterized in that: The welding surface of the metallized layer and the welding surface of the copper plate are both sandblasted rough surfaces, the tinned layer is plated on the sandblasted rough surface of the metallized layer, and the welding surface of the tinned layer is a concave-convex surface shaped by the sandblasted rough surface of the metallized layer; or the tinned layer is plated on the sandblasted rough surface of the copper plate, and the welding surface of the tinned layer is a concave-convex surface shaped by the sandblasted rough surface of the copper plate.

8. The ceramic copper clad laminate according to claim 7, characterized in that: A nickel plating layer is included between the tin plating layer and the metallized layer, or a nickel plating layer is included between the tin plating layer and the copper plate.

9. The ceramic copper clad laminate according to claim 1, characterized in that: The tin-silver interlocking structure is formed on the sandblasted concave-convex surface of the welding surface of the silver-plated layer, and the thickness of the silver-plated layer is 2 μm to 5 μm.

10. The ceramic copper clad laminate according to claim 3, characterized in that: The metallization layer includes a titanium nitride layer, a titanium layer and a copper layer. The titanium nitride layer is the innermost layer of the metallization layer and is attached to the surface of the ceramic substrate. The copper layer is the outermost layer of the metallization layer, and the titanium layer is located between the copper layer and the titanium nitride layer.

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