Socket and electrical equipment

Abstract

The embodiment of the utility model relates to a socket and electrical equipment. The socket comprises a shell, a cover plate, a contact pin, a circuit board, a heat conduction wire and a heat conduction piece, the shell is provided with an accommodating cavity and an opening communicated with the accommodating cavity, and the cover plate covers the opening; the circuit board is arranged in the accommodating cavity; the heat conduction piece is attached to the shell; the contact pin is provided with a first end and a second end which are oppositely arranged, the first end of the contact pin is electrically connected with the circuit board, and the second end of the contact pin penetrates through the cover plate; the heat conduction wire is connected with the first end of the contact pin and the heat conduction piece. Heat generated by the socket and the contact pins and heat generated by the circuit board during working can be transmitted to the heat conduction piece through the heat conduction wire and then transmitted to the shell for heat exchange with the outside, so that the internal temperature of the contact pins and the socket can be effectively reduced, the service life of the socket is prolonged, and the reliability of the socket is improved.

Description

Technical Field

[0001] This application relates to the field of socket technology, and more particularly to a socket and electrical equipment. Background Technology

[0002] As a key component of the smart home ecosystem, smart sockets meet people's needs for a convenient, efficient, and comfortable living environment with their intelligent control, security protection, and energy-saving features.

[0003] Traditional sockets generate heat in the pins during operation due to the conversion of electrical energy into heat energy, but this temperature rise usually remains within safety standards. Smart sockets, in performing their functions, also require electrical energy conversion and transfer, which leads to a certain degree of electrothermal effect, making socket heating a normal phenomenon. In addition, the electronic components and chips inside smart sockets also generate heat during operation, further increasing the temperature of the socket surface and pins. The combination of these two heat sources can cause the pin temperature to exceed the standard range of safety regulations. Overheating of smart sockets not only affects their temperature rise performance but may also lead to shortened lifespan and reduced reliability; therefore, solving the heat dissipation problem of smart sockets is crucial.

[0004] However, according to safety regulations, a 1mm test probe cannot be inserted into the smart socket casing, which limits the possibility of creating ventilation holes in the casing to utilize air convection for heat dissipation. Therefore, how to achieve effective heat dissipation without compromising safety remains a pressing issue in smart socket design. Utility Model Content

[0005] In view of the above problems, embodiments of this application provide a socket and electrical equipment that overcome or at least partially solve the above problems.

[0006] According to one aspect of the embodiments of this application, a socket is provided, including a housing, a cover plate, pins, a circuit board, a heat-conducting wire, and a heat-conducting element; the housing has a receiving cavity and an opening communicating with the receiving cavity, and the cover plate seals the opening; the circuit board is disposed in the receiving cavity; the heat-conducting element is attached to the housing; the pin has a first end and a second end disposed opposite to each other, the first end of the pin is electrically connected to the circuit board, and the second end of the pin is disposed through the cover plate; the heat-conducting wire is connected to the first end of the pin and the heat-conducting element respectively.

[0007] In one alternative embodiment, the heat-conducting element includes a heat-conducting sheet disposed in the receiving cavity, and the heat-conducting wire is connected to the heat-conducting sheet.

[0008] In an alternative embodiment, the heat-conducting element further includes a heat dissipation film disposed on the outer surface of the housing.

[0009] In one alternative embodiment, the housing is recessed toward the receiving cavity to form a receiving groove, and the heat dissipation film is attached to the bottom of the receiving groove.

[0010] In one alternative embodiment, the heat-conducting sheet and the heat dissipation film are disposed opposite to each other on the inner and outer surfaces of the housing.

[0011] In one alternative embodiment, the heat dissipation film comprises a bonding surface, an ice-cooling heat dissipation layer, and a dustproof and breathable surface stacked sequentially, wherein the bonding surface is attached to the bottom of the receiving groove, and the material of the bonding surface includes any one of thermally conductive silicone, polyethylene terephthalate, and polyurethane.

[0012] In one alternative approach, the material of the dustproof and breathable surface includes rubber or woven fabric.

[0013] In one alternative embodiment, the circuit board has a first surface and a second surface disposed opposite to each other; the first end of the pin has a lead and a connection portion, the lead passing through the circuit board and protruding from the first surface of the circuit board, the connection portion being located on the second surface of the circuit board, and the heat-conducting wire being connected to the lead.

[0014] In an alternative embodiment, the socket further includes thermally conductive adhesive disposed around the connection portion.

[0015] According to one aspect of the embodiments of this application, an electrical device is provided, including the aforementioned socket.

[0016] The beneficial effects of this application's embodiments are as follows: A socket is provided, including a housing, a cover plate, pins, a circuit board, a heat-conducting wire, and a heat-conducting component. The housing has a receiving cavity and an opening communicating with the receiving cavity, and the cover plate seals the opening. The circuit board is disposed in the receiving cavity. The heat-conducting component is attached to the housing. The pins have a first end and a second end disposed opposite to each other. The first end of the pin is electrically connected to the circuit board, and the second end of the pin passes through the cover plate. The heat-conducting wire is connected to the first end of the pin and the heat-conducting component, respectively. Through this socket design, the heat generated by the pins and the heat generated by the circuit board during operation can be transferred to the heat-conducting component through the heat-conducting wire, exchanging heat with the external environment to reduce the temperature inside the pins and the socket, thereby extending the service life of the socket and improving its reliability. Attached Figure Description

[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0018] Figure 1 This is a schematic diagram of the socket provided in an embodiment of this application;

[0019] Figure 2 This is an exploded view of the socket provided in an embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the heat-conducting wire connected to the heat-conducting component according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the heat-conducting component provided in an embodiment of this application disposed in the housing;

[0022] Figure 5 This is a cross-sectional view of the heat dissipation film provided in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the pins, circuit board, and housing provided in the embodiments of this application;

[0024] Figure 7 This is a thermal simulation analysis diagram of a socket in existing technology;

[0025] Figure 8 This is a thermal simulation analysis diagram of the socket provided in the embodiment of this application;

[0026] Figure 9 This is a schematic diagram of the temperature field of a socket in the prior art;

[0027] Figure 10 This is a schematic diagram of the temperature field of the socket provided in the embodiment of this application;

[0028] Figure 11 This is a schematic diagram of the temperature field of a circuit board in the prior art;

[0029] Figure 12 This is a schematic diagram of the temperature field of a circuit board connected to pins and heat-conducting wires according to an embodiment of this application.

[0030] The attached figures are labeled as follows:

[0031] 100. Socket;

[0032] 10. Housing; 20. Cover plate; 30. Pin; 40. Circuit board; 50. Heat-conducting wire; 60. Heat-conducting component; 70. Thermal adhesive; 80. Grounding terminal;

[0033] 101. Receiving cavity; 102. Opening; 103. Receiving slot; 104. Third connection port; 105. Fifth connection port;

[0034] 201, First connection port; 202, Pin hole;

[0035] 301, First terminal; 302, Second terminal; 3011, Pin; 3012, Connecting part;

[0036] 31. L pin; 32. N pin;

[0037] 401, First surface; 402, Second surface; 403, Output section; 4031, Output hole; 404, Second connection port; 405, Fourth connection port; 406, Pin port;

[0038] 601. Thermal conductive sheet; 602. Heat dissipation film;

[0039] 6021, bonding surface; 6022, cooling and heat dissipation layer; 6023, dustproof and breathable surface;

[0040] 801, First grounding part; 802, Second grounding part; 803, Third grounding part. Detailed Implementation

[0041] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly attached to the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only.

[0042] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0043] Please see Figures 1-3This application provides a socket 100, which includes a housing 10, a cover plate 20, pins 30, a circuit board 40, a heat-conducting wire 50, and a heat-conducting element 60. The housing 10 has a receiving cavity 101 and an opening 102 communicating with the receiving cavity 101, and the cover plate 20 covers the opening 102. The circuit board 40 is disposed in the receiving cavity 101. The heat-conducting element 60 is attached to the housing 10. The pins 30 have a first end 301 and a second end 302 disposed opposite to each other. The first end 301 of the pins 30 is electrically connected to the circuit board 40, and the second end 302 of the pins 30 passes through the cover plate 20. The heat-conducting wire 50 is connected to the first end 301 of the pins 30 and the heat-conducting element 60 respectively. Through this arrangement, the heat generated by the pins 30 and the heat generated by the circuit board 40 can be effectively transferred to the heat-conducting element 60 through the heat-conducting wire 50, and then transferred to the housing 10 by the heat-conducting element 60, ultimately exchanging heat with the external environment. This design not only significantly reduces the internal temperature of the pins 30 and the socket 100, but also greatly extends the service life of the socket 100 and improves its overall reliability.

[0044] It is worth noting that in some embodiments, the number of pins 30 is two, and the structure of the two pins 30 and the connection relationship between the two pins 30 and other components in the socket 100 are the same. Therefore, this application will use any one of the pins 30 as an example for illustration.

[0045] It is worth noting that in some embodiments, the two pins 30 are the L pin and the N pin, respectively.

[0046] It is worth noting that in some embodiments, the heat-conducting wire 50 is a copper wire, which has good thermal conductivity and can quickly transfer heat from the pin 30 and the circuit board 40 to the heat-conducting component 60.

[0047] Furthermore, in practical applications, the selection and design of the heat-conducting wire 50 will fully consider its thermal resistance characteristics and durability to ensure stable and reliable operation during long-term use. For example, the first end 301 of the pin 30 is positioned close to the housing 10 so that when the heat-conducting wire 50 connects the first end 301 of the pin 30 to the heat-conducting element 60, the length of the heat-conducting wire 50 can be shortened as much as possible, reducing the impact of the thermal resistance of the heat-conducting wire 50.

[0048] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 2 and Figure 4The heat-conducting component 60 includes a heat-conducting sheet 601, which is disposed in the receiving cavity 101. The heat-conducting wire 50 is connected to the heat-conducting sheet 601, that is, the heat-conducting sheet 601 is located inside the housing 10 and is attached to the inner surface of the housing 10. Thus, when the heat-conducting wire 50 is connected to the heat-conducting sheet 601, the heat generated by the operation of the pin 30 and the heat generated by the operation of the circuit board 40 can be quickly transferred to the housing 10, thereby exchanging heat with the outside.

[0049] It is worth noting that the specific size and number of the heat-conducting sheet 601 can be set according to the size of the inner surface of the actual housing 10. For example, there are two heat-conducting sheets 601, which are respectively attached to two opposite inner surfaces of the housing 10.

[0050] It is worth noting that in some embodiments, the heat-conducting plate 601 has a wiring portion (not shown), which is located in the middle of the heat-conducting plate 601, and the heat-conducting wire 50 is connected to the wiring portion. This arrangement ensures uniform heat dissipation and improves the overall heat dissipation effect of the socket 100.

[0051] It is worth noting that in some embodiments, the heat-conducting component 60 further includes a heat dissipation film 602. The heat dissipation film 602 is disposed on the outer surface of the housing 10. Through the arrangement of the heat-conducting sheet 601 and the heat dissipation film 602, the heat-conducting wire 50 transfers the heat from the pin 30 and the circuit board 40 to the heat-conducting sheet 601, then to the housing 10, and finally to the heat dissipation film 602. This further improves the heat dissipation speed and allows for faster heat exchange between the inside of the socket 100 and the outside environment. In addition, the heat dissipation film 602 not only increases the heat dissipation area but also allows the heat to be distributed more evenly and dissipated to the outside environment more quickly.

[0052] It is worth noting that the size and number of heat dissipation films 602 can be set according to the actual housing 10. For example, there are four heat dissipation films 602, which are respectively attached to the outer surface of the housing 10.

[0053] It is worth noting that in some embodiments, the housing 10 is recessed toward the receiving cavity 101 to form a receiving groove 103, and the heat dissipation film 602 is attached to the bottom of the receiving groove 103. By setting the receiving groove 103, it can be ensured that the heat dissipation film 602 is tightly attached to the housing 10, avoiding the gap between the heat dissipation film 602 and the housing 10, thereby further improving the heat dissipation effect.

[0054] It is understood that when there are four heat dissipation films 602, there are four receiving slots 103, one receiving slot 103 is disposed on the side of one of the housings 10, and one heat dissipation film 602 is disposed on the bottom of one of the receiving slots 103.

[0055] It is worth noting that in some embodiments, the heat-conducting sheet 601 and the heat dissipation film 602 are disposed opposite to each other on the inner and outer surfaces of the housing 10. That is, the heat-conducting sheet 601 and the heat dissipation film 602 are respectively disposed on the inner and outer surfaces of the housing 10, and the heat-conducting sheet 601 and the heat dissipation film 602 transfer heat through the housing 10. This design allows the heat generated by the pins 30 and the circuit board 40 to be quickly transferred to the heat-conducting sheet 601, and then transferred through the housing 10 to the heat dissipation film 602, and finally exchanged with the external environment. This arrangement not only improves the heat dissipation efficiency, but also ensures the uniform distribution of heat, further enhancing the heat dissipation performance of the socket 100.

[0056] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 4 and Figure 5 The heat dissipation film 602 includes a bonding surface 6021, an ice-cooling heat dissipation layer 6022, and a dustproof and breathable surface 6023 stacked sequentially. The bonding surface 6021 is attached to the bottom of the receiving groove 103. The material of the bonding surface 6021 includes any one of thermally conductive silicone, polyethylene terephthalate, and polyurethane. Through this heat dissipation film 602, the bonding surface 6021 allows for a tighter fit between the heat dissipation film 602 and the bottom of the receiving groove 103, while improving heat transfer efficiency. In addition, the ice-cooling heat dissipation layer 6022 has a high heat transfer coefficient, which can quickly transfer heat from the heat-conducting sheet 601 to the heat dissipation film 602, and exchange heat with the external environment through the dustproof and breathable surface 6023. The dustproof and breathable surface 6023 not only has good breathability but also effectively prevents dust and other impurities from entering the receiving groove 103, ensuring heat dissipation effect.

[0057] It is worth noting that in some embodiments, the material of the dustproof and breathable surface 6023 includes rubber or woven fabric, so that the outer surface of the socket 100 has a good tactile feel and improves the user experience.

[0058] It is worth noting that in some embodiments, please refer to 3 and Figure 6 The circuit board 40 has a first surface 401 and a second surface 402 disposed opposite to each other; the first end 301 of the pin 30 has a pin 3011 and a connecting portion 3012, the pin 3011 passes through the circuit board 40 and protrudes from the first surface 401 of the circuit board 40, the connecting portion 3012 is located on the second surface 402 of the circuit board 40, and the heat-conducting wire 50 is connected to the pin 3011. The setting of the pin 3011 facilitates the connection between the heat-conducting wire 50 and the pin 30, improves the connection stability between the heat-conducting wire 50 and the pin 30, and ensures the heat dissipation effect of the heat-conducting wire 50 on the pin 30.

[0059] It is understood that in some embodiments, the first surface 401 of the circuit board 40 is disposed facing the bottom of the receiving cavity 101, and the second surface 402 of the circuit board 40 is disposed facing the cover plate 20.

[0060] It is worth noting that in some embodiments, the socket 100 further includes thermally conductive adhesive 70, which surrounds the connecting portion 3012. The inclusion of thermally conductive adhesive 70 further improves the heat transfer efficiency between the pin 30 and the circuit board 40, ensuring that the heat generated by the pin 30 is promptly transferred to the thermally conductive adhesive 70, and then exchanged with the external environment through the housing 10. In other words, the use of thermally conductive adhesive 70 not only enhances the connection stability between the pin 30 and the circuit board 40, but also improves the heat transfer efficiency, further enhancing the heat dissipation performance of the socket 100.

[0061] It is worth noting that the side of the thermally conductive adhesive 70 facing away from the circuit board 40 can contact the side of the cover plate 20 facing the receiving cavity 101. Therefore, the heat generated by the operation of the pins 30 and the circuit board 40 can also be transferred to the cover plate 20 through the thermally conductive adhesive 70 for heat exchange with the outside environment. In other words, the heat generated by the operation of the pins 30 and the circuit board 40 can be exchanged with the outside environment not only through the housing 10 but also through the cover plate 20.

[0062] In practice, the thermally conductive adhesive 70 can be thermally conductive silicone or other adhesives with thermal conductivity.

[0063] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 3 The circuit board 40 also has two output sections 403, each with an output hole 4031. When the plug of an electrical device is connected to the socket 100, the plug's pins 30 are inserted into the output hole 4031 to electrically connect with the output section 403, thereby allowing the device to obtain electrical energy output from the output section 403. Additionally, the housing 10 has two insertion holes (not shown), one of which is coaxial with one of the output holes 4031, and the other is coaxial with the other output hole 4031, allowing the plug's pins 30 to be inserted into the output hole 4031 through the insertion hole.

[0064] It is worth noting that in some embodiments, please refer to [link / reference]. Figure 2The socket 100 further includes a grounding terminal 80, which includes a first grounding part 801, a second grounding part 802, and a third grounding part 803. The first grounding part 801 is disposed through the cover plate 20. The second grounding part 802 and the third grounding part 803 are respectively connected to the two ends of the first grounding part 801. The second grounding part 802 passes through the circuit board 40 and the housing 10 in sequence. The third grounding part 803 passes through the circuit board 40 and the housing 10 in sequence. By setting the grounding terminal 80, grounding can be achieved, improving the safety of the socket 100.

[0065] It is worth noting that, in order to facilitate the setting of the first grounding part 801, the cover plate 20 is provided with a first connection port 201; in order to facilitate the setting of the second grounding part 802, the circuit board 40 is provided with a second connection port 404, and the housing 10 is provided with a third connection port 104; in order to facilitate the setting of the third grounding part 803, the circuit board 40 is provided with a fourth connection port 405, and the housing 10 is provided with a fifth connection port 105.

[0066] The applicant conducted thermal simulation analysis on the socket in the prior art (comparative example) and the socket 100 provided in the embodiment of this application (example), respectively. The ambient temperature was set to 25°C, and the two pins 30 in the socket 100 were L pin 31 and N pin 32, respectively. The simulation results are as follows: Figure 7 , Figure 8 and Table 1 below:

[0067] Table 1. Temperature of the pins in comparative examples and embodiments.

[0068]

[0069] In the embodiment shown in Table 1, the socket 100 is provided with a heat-conducting wire 50, a heat-conducting component 60, and a heat-conducting adhesive 70; the heat-conducting component 60 includes a heat-conducting sheet 601 and a heat dissipation film 602.

[0070] As shown in Table 1, in the comparative examples, the minimum temperature of the L pin is 75.85℃, and the maximum temperature is 81.41℃. Its minimum temperature rise is 50.85℃ (75.85℃ - 25℃), and its maximum temperature rise is 56.41℃ (81.41℃ - 25℃), both exceeding the specified temperature rise of 45℃. Similarly, the minimum temperature of the N pin is 74.60℃, and the maximum temperature is 76.58℃. Its minimum temperature rise is 49.60℃ (74.60℃ - 25℃), and its maximum temperature rise is 51.58℃ (76.58℃ - 25℃), both exceeding the specified temperature rise of 45℃. In conclusion, in the prior art, the temperatures of both the L and N pins exceed the specified temperature rise, failing to meet certification requirements.

[0071] In the embodiment, the minimum temperature of pin L is 59.33℃, and the maximum temperature is 61.42℃. Its minimum temperature rise is 34.33℃ (59.33℃ - 25℃), and its maximum temperature rise is 36.42℃ (61.42℃ - 25℃), both of which do not exceed the specified temperature rise of 45℃. Similarly, the minimum temperature of pin N is 58.93℃, and the maximum temperature is 62.28℃. Its minimum temperature rise is 33.93℃ (58.93℃ - 25℃), and its maximum temperature rise is 37.28℃ (62.28℃ - 25℃), both of which do not exceed the specified temperature rise. In summary, in this embodiment, the temperature rise of both pins L and N does not exceed the specified temperature rise, meeting the certification requirements. Furthermore, the temperature of the pins in this embodiment is approximately 16.6℃ lower than that of the prior art, and its temperature rise also meets the requirements, proving that the heat dissipation solution of the socket provided in this embodiment can achieve good heat dissipation.

[0072] In addition, the applicant compared the temperature fields of the cover plate 20 and the housing 10 of the socket 100 (embodiment) provided in the prior art (comparative example) and the present application embodiment, such as... Figure 9 and Figure 10 As shown. By Figure 9 and Figure 10 Compared to the prior art, the socket 100 provided in this embodiment reduces the maximum temperature on the cover plate 20 and housing 10 from 78.08°C to 62.26°C, and increases the minimum temperature from 32.44°C to 35.83°C. This is because the heat-conducting sheet 601 covering the inside of the housing 10 distributes the temperature of the housing 10 more evenly and reduces the temperature of the high-heat-source pin hole 202 (the hole on the cover plate 20 for the pin 30 to be inserted). This demonstrates that the heat dissipation scheme of the socket provided in this embodiment can effectively transfer the temperature inside the housing 10 to the outside of the housing 10, reducing the overall temperature of the socket 100.

[0073] In addition, the applicant compared the temperature field of the circuit board 40 of the socket in the prior art (comparative example) and the socket 100 (embodiment) provided in the embodiments of this application, such as... Figure 11 and Figure 12 As shown. By Figure 11 and Figure 12 Compared to the prior art, the socket 100 provided in this application embodiment reduces the temperature of the circuit board 40, the output section 403 on the circuit board 40, the pin 30 (or the pin port 406 for the pin 30 to pass through), and the heat-conducting wire 50 by approximately 14°C. In summary, it can be concluded that because this application embodiment conducts the high heat source at the pin 30 to the heat-conducting plates 601 on both sides of the housing 20 through the heat-conducting wire 50, the temperature of the circuit board 40 and the pin 30 is reduced. This helps to improve the service life of the socket 100 and further enhances the user experience.

[0074] According to one aspect of the embodiments of this application, an electrical device is provided, including the aforementioned socket 100. The specific structure and function of the socket 100 can be found in the above embodiments, and will not be repeated here.

[0075] It should be noted that while preferred embodiments of this application are provided in the specification and accompanying drawings, this application can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this application; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this application. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this application's specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A socket, characterized in that, include: Housing, cover, pins, circuit board, heat-conducting wire and heat-conducting components; The housing is provided with a receiving cavity and an opening communicating with the receiving cavity, and the cover plate seals the opening; The circuit board is disposed in the receiving cavity; The heat-conducting component is attached to the housing; The pin has a first end and a second end that are disposed opposite to each other. The first end of the pin is electrically connected to the circuit board, and the second end of the pin is disposed through the cover plate. The heat-conducting wire is connected to the first end of the pin and the heat-conducting element, respectively.

2. The socket according to claim 1, characterized in that, The heat-conducting component includes a heat-conducting sheet disposed in the receiving cavity, and the heat-conducting wire is connected to the heat-conducting sheet.

3. The socket according to claim 1 or 2, characterized in that, The heat-conducting component also includes a heat dissipation film, which is disposed on the outer surface of the housing.

4. The socket according to claim 3, characterized in that, The housing is recessed toward the receiving cavity to form a receiving groove, and the heat dissipation film is attached to the bottom of the receiving groove.

5. The socket according to claim 4, characterized in that, The heat-conducting sheet and the heat dissipation film are disposed opposite to each other on the inner and outer surfaces of the housing.

6. The socket according to claim 4, characterized in that, The heat dissipation film includes a bonding surface, an ice-cooling heat dissipation layer, and a dustproof and breathable surface stacked in sequence. The bonding surface is attached to the bottom of the receiving groove. The material of the bonding surface includes any one of thermally conductive silicone, polyethylene terephthalate, and polyurethane.

7. The socket according to claim 6, characterized in that, The dustproof and breathable surface is made of materials including rubber or woven fabric.

8. The socket according to claim 1, characterized in that, The circuit board has a first surface and a second surface that are disposed opposite to each other; The first end of the pin has a lead and a connection portion. The lead passes through the circuit board and protrudes from the first surface of the circuit board. The connection portion is located on the second surface of the circuit board, and the heat-conducting wire is connected to the lead.

9. The socket according to claim 8, characterized in that, The socket also includes thermally conductive adhesive, which is disposed around the connection portion.

10. An electrical device, characterized in that, Including the socket as described in any one of claims 1-9.

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