Multi-chip light-emitting devices and lighting fixtures

Abstract

This application relates to a multi-chip light-emitting device and an illumination apparatus. The multi-chip light-emitting device includes a substrate, multiple light-emitting chips, a reflective structure, and an outer lens. The multiple light-emitting chips are disposed on the substrate and include a central chip and multiple peripheral chips, with the peripheral chips surrounding the central chip. The size of the central chip is larger than that of the peripheral chips. The reflective structure is disposed on the substrate and has multiple reflective cavities, each corresponding to one of the multiple light-emitting chips, and is used to reflect the lateral light emitted by the light-emitting chips in a direction away from the substrate. The light-emitting ports of adjacent reflective cavities share a common edge. The outer lens is disposed on the substrate and corresponds to the multiple reflective cavities. This multi-chip light-emitting device designs the reflective structure based on the light-emitting chips and the outer lens based on the reflective structure. Due to the small size of the light-emitting chips, the volume of the outer lens is significantly reduced, resulting in a significant reduction in the overall size of the device and a smaller footprint.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a multi-chip light-emitting device and lighting apparatus. Background Technology

[0002] Traditional zoned lighting devices typically integrate multiple LED light sources and a large lens, with the lens covering the emission angle range of all LEDs. Multiple LEDs are arranged in a rectangular array, and zoned lighting is achieved by independently controlling the on / off state and brightness of each LED. When applied to intelligent vehicle lights, the lights automatically turn off or reduce the high beam in the corresponding area when encountering oncoming vehicles to avoid glare. Because each LED is a fully packaged device, such as an SMD device, its size is relatively large, and its emission angle range is no less than 120°, resulting in a thicker and larger lens. This leads to a large size and space-consuming zoned lighting device based on this design. Summary of the Invention

[0003] Therefore, it is necessary to provide a multi-chip light-emitting device and lighting apparatus to address the problem of large size and space occupation of zone control lighting devices based on LED light sources.

[0004] A multi-chip light-emitting device, comprising:

[0005] substrate;

[0006] Multiple light-emitting chips are disposed on the substrate, and include a central chip and multiple peripheral chips. The multiple peripheral chips are arranged around the central chip, and the size of the central chip is larger than the size of the peripheral chips.

[0007] A reflective structure is disposed on the substrate and has multiple reflective cavities. Each reflective cavity corresponds to one of the multiple light-emitting chips and is used to reflect the lateral light emission of the light-emitting chips in a direction away from the substrate. The light-emitting ports of adjacent reflective cavities share a common edge.

[0008] An outer lens is disposed on the substrate and is arranged corresponding to the plurality of reflective cavities.

[0009] In one embodiment, each of the reflective cavities is a reflective groove; the multi-chip light-emitting device further includes a light-transmitting structure, the light-transmitting structure including a plurality of interconnected light-transmitting parts, the bottom surface of each light-transmitting part being located in one of the reflective cavities and bonded to the top surface of the light-emitting chip.

[0010] In one embodiment, each of the reflective cavities is a reflective aperture; the multi-chip light-emitting device further includes an inner lens, which includes a plurality of connected lens portions, each of which is disposed on the light outlet of one of the reflective cavities and is a condensing lens.

[0011] In one embodiment, the multi-chip light-emitting device further includes: a plurality of light-transmitting adhesive layers, each of the light-transmitting adhesive layers being disposed on the top surface of a light-emitting chip within the reflective cavity.

[0012] In one embodiment, the reflective structure is directly molded onto the substrate using a mold and covers the sides of all the light-emitting chips.

[0013] In one embodiment, the reflective structure is made of white resin filled with heat dissipation particles.

[0014] In one embodiment, the plurality of light-emitting chips are arranged in a rectangular array.

[0015] In one embodiment, the outer lens is an integral structure and includes a support portion and an optical portion. The support portion is supported between the substrate and the optical portion, and the optical portion is located above the plurality of reflective cavities.

[0016] A multi-chip light-emitting device, comprising:

[0017] substrate;

[0018] Multiple light-emitting chips are disposed on the substrate, and include a central chip and multiple peripheral chips. The multiple peripheral chips are arranged around the central chip, and the size of the central chip is larger than the size of the peripheral chips.

[0019] A light guide component, comprising a connecting portion and multiple light guide portions, wherein the connecting portion is connected to the top surface of all the light guide portions, and the bottom surfaces of the multiple light guide portions are bonded one-to-one to the top surface of the multiple light-emitting chips using a light-transmitting adhesive; and

[0020] An outer lens is disposed on the substrate and is positioned corresponding to the light guide.

[0021] A lighting device, comprising:

[0022] matrix; and

[0023] A multi-chip light-emitting device, wherein the multi-chip light-emitting device is disposed on the substrate, and the multi-chip light-emitting device is the multi-chip light-emitting device as described in any of the above embodiments.

[0024] The aforementioned multi-chip light-emitting device and lighting apparatus, by setting a reflective structure on the substrate or a light guide on the light-emitting chip, guides the light emitted by the chip. An outer lens is positioned corresponding to the emitted light. Because the light-emitting chip is small, and the reflective structure or light guide is designed based on the chip, while the outer lens is designed based on the emitted light, the volume of the outer lens is significantly reduced compared to lenses designed based on LED light sources, resulting in a significant reduction in the overall device size and space occupation. Furthermore, the light emitted by the chip can be fully mixed, improving the uniformity of the projected light spot and enabling the projection of an array of light spots. Additionally, the brightness of the central chip is higher than that of the peripheral chips; at the same illumination distance, the brightness of the central region of the projected light spot is higher than other regions, thus improving the lighting effect. Attached Figure Description

[0025] Figure 1 This is a cross-sectional view of a multi-chip light-emitting device in one embodiment of this application.

[0026] Figure 2 for Figure 1 A top view of the reflective structure of a multi-chip light-emitting device and the light-emitting chips inside.

[0027] Figure 3 This is a cross-sectional view of a multi-chip light-emitting device in another embodiment of this application.

[0028] Figure 4 This is a cross-sectional view of a multi-chip light-emitting device in another embodiment of this application.

[0029] Figure 5 This is a cross-sectional view of a lighting device in one embodiment of this application.

[0030] Explanation of reference numerals in the attached figures:

[0031] 100 - Multi-chip light-emitting device; 110 - Substrate; 120 - Light-emitting chip; 122 - Central chip; 124 - Peripheral chip; 130 - Reflective structure; 132 - Reflective cavity; 140 - Outer lens; 142 - Support part; 144 - Optical part; 150 - Light-transmitting adhesive layer; 160 - Inner lens; 162 - Lens part; 170 - Light guide; 172 - Connecting part; 174 - Light guide part; 176 - Light-transmitting adhesive; 180 - Light-transmitting structure; 182 - Light-transmitting part;

[0032] 200 - Lighting device; 210 - Substrate. Detailed Implementation

[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0039] Please see Figure 1 and Figure 2 , Figure 1 A cross-sectional view of a multi-chip light-emitting device according to an embodiment of this application is shown. Figure 2 It shows Figure 1 A top view of the reflective structure and the light-emitting chips within a multi-chip light-emitting device. An embodiment of this application provides a multi-chip light-emitting device 100, including a substrate 110, multiple light-emitting chips 120, a reflective structure 130, and an outer lens 140. The multiple light-emitting chips 120 are disposed on the substrate 110 and include a central chip 122 and multiple peripheral chips 124. The peripheral chips 124 are arranged around the central chip 122, and the size of the central chip 122 is larger than the size of the peripheral chips 124. The reflective structure 130 is disposed on the substrate 110 and has multiple reflective cavities 132. The multiple reflective cavities 132 are arranged one-to-one with the multiple light-emitting chips 120 and are used to reflect the lateral light emission of the light-emitting chips 120 in a direction away from the substrate 110. The light-emitting ports of adjacent reflective cavities 132 share a common edge. The outer lens 140 is disposed on the substrate 110 and is arranged corresponding to the multiple reflective cavities 132.

[0040] By setting a reflective structure 130 on the substrate 110, the reflective cavity 132 of the reflective structure 130 can reflect the lateral light emission of the light-emitting chip 120 in a direction away from the substrate 110, and thus guide the light emission of the light-emitting chip 120. The outer lens 140 is set corresponding to the light outlet of the reflective cavity 132. Since the size of the light-emitting chip 120 is small, and the reflective structure 130 is designed based on the light-emitting chip 120, and the outer lens 140 is designed based on the light outlet of the reflective cavity 132, compared with the lens designed based on the LED light source, the volume of the outer lens 140 is significantly reduced, resulting in a significant reduction in the overall size of the device and a smaller footprint. Moreover, the reflective cavity 132 can reflect lateral light emission at a large angle, reducing the light emission angle of the light outlet of the reflective cavity 132, which is beneficial for focusing the light emission, improving the uniformity and brightness of the light spot projected by the device, and enabling the projection of an array of light spots. In addition, the light emission brightness of the central chip 122 is higher than that of the peripheral chip 124. At the same illumination distance, the brightness of the central area of ​​its projected light spot is higher than that of other areas, thereby improving the illumination effect.

[0041] The substrate 110 can be a plate with circuitry (not shown), which not only serves to support the light-emitting chip 120, but also allows the light-emitting chip 120 to be electrically connected to external devices through the circuitry. The material of the plate can be, but is not limited to, glass, resin, or ceramic.

[0042] The light-emitting chip 120 can be, but is not limited to, an LED chip or a semiconductor laser chip, and can be a conventional chip or a flip chip. In this embodiment, the light-emitting chip 120 can be, but is not limited to, a red LED chip. The size of the central chip 122 can be, but is not limited to, 20~24 mil, and the size of the peripheral chip 124 can be, but is not limited to, 16~18 mil. Both are square chips, which results in higher light emission brightness of the central chip 122. Under the same illuminance, its illumination distance can be farther, and the illumination effect is better.

[0043] Multiple light-emitting chips 120 are regularly arranged on a substrate 110, forming multiple divided regions on the substrate 110. These divided regions can be arranged in an array. In this embodiment, the multiple divided regions are arranged in a 3x3 grid, i.e., three rows and three columns. However, the arrangement is not limited to this. The number of light-emitting chips 120 in each divided region can be, but is not limited to, one. The light-emitting chip 120 in the central region is the central chip 122, while the light-emitting chips 120 in other regions are the peripheral chips 124. Thus, the multiple light-emitting chips 120 are arranged in a rectangular array.

[0044] It should be noted that in other embodiments, the multiple division regions can be arranged in a diamond shape, that is, a peripheral region is provided around the central region; or, the multiple division regions can be arranged in a ring array, with multiple peripheral regions surrounding the central region; wherein, multiple light-emitting chips 120 can be set in any division region according to actual needs, for example, two central chips 122 arranged side by side or four central chips 122 arranged closely side by side can be set in the central region, so that the light-emitting brightness of the central region is significantly higher than that of other regions.

[0045] In the multiple reflective cavities 132 of the reflective structure 130, the central reflective cavity 132 is larger than the peripheral reflective cavities 132, respectively adapting to the central chip 122 and the peripheral chip 124. In this embodiment, each reflective cavity 132 is gradually widened in the light-emitting direction of the optical axis, thus better reflecting light. The cross-sectional line of the reflective cavity 132 can be a straight line or a concave curve. In an alternative embodiment, each reflective cavity 132 is cupped in the light-emitting direction of the optical axis, allowing light irradiated onto the curved reflective surface to be directly reflected onto the outer lens 140, further improving the light reflection effect.

[0046] In this embodiment, each of the reflective cavities 132 is a reflective groove. The multi-chip light-emitting device 100 also includes a light-transmitting structure 180, which includes a plurality of interconnected light-transmitting portions 182. The bottom surface of each light-transmitting portion 182 is located in a reflective cavity 132 and is bonded to the top surface of the light-emitting chip 120. By bonding the light-transmitting structure 180 to the light-emitting chip 120, the Fresnel loss of light emitted by the light-emitting chip 120 is reduced, and the light extraction efficiency is improved. Moreover, the light-transmitting structure 180 is easy to install and fix, eliminating the need to install each light-transmitting portion 182 separately.

[0047] Furthermore, the material of the light-transmitting structure 180 can be resin filled with phosphor, thereby enabling the conversion of the light-emitting color of the light-emitting chip 120.

[0048] In this embodiment, the hole wall of each reflective cavity 132 covers the side of the corresponding light-emitting chip 120, that is, the hole wall of the reflective cavity 132 is completely fitted with the side of the light-emitting chip 120. The reflective cavity 132 is perfectly adapted to the size setting of the light-emitting chip 120, so that the size of the reflective structure 130 can be set to be smaller, thereby further reducing the volume of the device.

[0049] The reflective structure 130 is disposed on the substrate 110. It can be directly formed on the substrate 110 by a mold, or it can be formed first and then fixed on the substrate 110. In this embodiment, the reflective structure 130 is directly formed on the substrate 110 by a mold, covering the sides of all the light-emitting chips 120.

[0050] Specifically, a mold is placed on the top surface of the light-transmitting structure 180, and then molten white resin (high reflective material) is injected from the side into the cavity formed between the substrate 110, the light-emitting chip 120 and the mold. After the white resin is cured, the mold is removed, and the reflective structure 130 can be directly formed on the substrate 110.

[0051] To improve the heat dissipation effect of the reflective structure 130, the reflective structure 130 is made of white resin filled with heat dissipation particles.

[0052] In this embodiment, the outer lens 140 is an integral structure, including a support portion 142 and an optical portion 144. The support portion 142 is supported on the substrate 110, and the optical portion 144 is located at the top of the support portion 142 and above the plurality of reflective cavities 132. The optical portion 144 can shape light to meet the user's needs for different light patterns. The bottom surface of the support portion 142 is sealed to the substrate 110. Without the light-transmitting structure 180, the outer lens 140 can protect the light-emitting chip 120 from external environmental interference, thus improving its service life.

[0053] In this embodiment, the optical unit 144 can be, but is not limited to, a convex lens, which acts as a light-focusing element, improving the brightness and uniformity of the light spot projected through the outer lens 140. It can project an array of light spots, wherein the brightness of the light spot in the central region is higher than that in the surrounding region, and the illumination distance is significantly increased under the same illumination. Specifically, the optical unit 144 is a plano-convex lens, with its convex surface located on the top surface. In other embodiments, the optical unit 144 can be a Fresnel lens or a biconvex lens.

[0054] In this embodiment, the side surface of the support portion 142 and the side surface of the substrate 110 are coplanar, which facilitates the splicing of multi-chip light-emitting devices 100. When manufacturing devices, modules with multiple device units can be processed first, and then multi-chip light-emitting devices 100 can be batch-cut through a cutting process, which facilitates the mass production of multi-chip light-emitting devices 100 and improves production efficiency.

[0055] Please see Figure 3 , Figure 3 A cross-sectional view of a multi-chip light-emitting device according to another embodiment of this application is shown. Compared with the multi-chip light-emitting device 100 in the above embodiment, each reflective cavity 132 of the multi-chip light-emitting device 100 in this embodiment is a reflective aperture. The multi-chip light-emitting device 100 also includes an inner lens 160, which includes a plurality of connected lens portions 162. Each lens portion 162 is disposed on the light outlet of a reflective cavity 132 and is a condensing lens. The light emitted by the light-emitting chip 120 is first focused by the condensing lens and then processed by the outer lens, thereby improving the overall brightness of the device and giving the device strong light control capability.

[0056] In this embodiment, each lens portion 162 is a biconvex lens; in other embodiments, it may be a monoconvex lens or a Fresnel lens.

[0057] In this embodiment, the multi-chip light-emitting device 100 further includes multiple light-transmitting adhesive layers 150, each of which is disposed on the top surface of the light-emitting chip 120 within a reflective cavity 132. The light-transmitting adhesive layer 150 can reduce the Fresnel loss of the light-emitting chip 120, and can also change the emission color of the light-emitting chip 120 by filling it with phosphor, so as to meet the requirements of different emission colors of the device.

[0058] When molding the light-transmitting adhesive layer 150 and the reflective structure 130, the light-transmitting adhesive layer 150 can first be molded on the top surface of the light-emitting chip 120 using a mold. Then, molten white resin is injected from the side into the cavity formed between the substrate 110, the light-emitting chip 120, and the mold. After the white resin cures, the mold is removed, and the reflective structure 130 can be directly molded on the substrate 110. Obviously, the above process uses the same mold to mold two structures, requiring only one demolding, eliminating the need for multiple demoldings, simplifying the production process, and improving production efficiency.

[0059] In this embodiment, the light-emitting chip 120 can be, but is not limited to, a blue LED chip. The size of the central chip 122 can be, but is not limited to, 30 mil, and the size of the peripheral chip 124 can be, but is not limited to, 20 mil, and both are square chips. Correspondingly, the light-transmitting adhesive layer 150 is filled with phosphor to convert blue light into white light.

[0060] As for the other aspects of the multi-chip light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the multi-chip light-emitting device 100 in the above embodiments. The specific content can be referred to the description of the above embodiments, and will not be repeated here.

[0061] Please see Figure 4 , Figure 4 This diagram shows a cross-sectional view of a multi-chip light-emitting device according to another embodiment of this application. Compared to the multi-chip light-emitting device 100 in the above embodiment, the multi-chip light-emitting device 100 in this embodiment uses a light guide 170 instead of a reflective structure 130. The light guide 170 includes a connecting portion 172 and a plurality of light guide portions 174. The connecting portion 172 is connected to the top surface of the plurality of light guide portions 174, and the bottom surfaces of the plurality of light guide portions 174 are bonded to the top surface of the plurality of light-emitting chips 120 one-to-one by a light-transmitting adhesive 176. An external lens 140 is disposed on the substrate 110 and is disposed corresponding to the light guide 170.

[0062] A light guide portion 174 is provided on the top surface of the light-emitting chip 120 using a light-transmitting adhesive 176. The light guide portion 174 can guide the light emitted by the light-emitting chip 120 upwards. An outer lens 140 is provided corresponding to the light-emitting surface of the light guide portion 170. Because the light-emitting chip 120 is small in size, and the light guide portion 174 is designed based on the light-emitting chip 120, while the outer lens 140 is designed based on the light-emitting surface of the light guide portion 170, the volume of the outer lens 140 is significantly reduced compared to lenses designed based on LED light sources, resulting in a significant reduction in the overall size of the device and a smaller footprint. Moreover, the light guide portion 174 can fully mix the light emitted by the light-emitting chip 120, improving the uniformity of the light spot projected by the device and enabling the projection of an array of light spots. In addition, the light emission brightness of the central chip 122 is higher than that of the peripheral chips 124. At the same illumination distance, the brightness of the central area of ​​its projected light spot is higher than that of other areas, thus improving the illumination effect.

[0063] In the multiple light guide sections 174 of the light guide component 170, the central light guide section 174 is larger than the peripheral light guide sections 174, and is adapted to the central chip 122 and the peripheral chip 124 respectively. The multiple light guide sections 174 are connected by the connecting section 172, and can be integrally molded. When assembling the light guide component 170, a light-transmitting adhesive 176 can be applied to the bottom surface of each light guide section 174, and then it can be simultaneously bonded to the top surface of the multiple light-emitting chips 120.

[0064] As for the other aspects of the multi-chip light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the multi-chip light-emitting device 100 in the above embodiments. The specific content can be referred to the description of the above embodiments, and will not be repeated here.

[0065] Please see Figure 5 , Figure 5 A cross-sectional view of a lighting device according to an embodiment of this application is shown. The lighting device 200 provided in this embodiment includes a substrate 210 and a multi-chip light-emitting device 100. The specific structure of the multi-chip light-emitting device 100 is as described in the above embodiments. Since the lighting device 200 in this embodiment adopts all the technical solutions of all the above embodiments, it also has all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0066] It should be noted that the application scenarios of the multi-chip light-emitting device 100 in this application are not limited to lighting; it can also be applied to displays, projections, or other scenarios. The specific application scenario of the lighting device 200 can be, but is not limited to, automotive headlights. The substrate 210 can be part of the housing of the lighting device 200 or a circuit board, but is not limited to these.

[0067] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0068] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A multi-chip light emitting device, comprising: include: substrate(110); Multiple light-emitting chips (120) are disposed on the substrate (110) and include a central chip (122) and multiple peripheral chips (124). The multiple peripheral chips (124) are arranged around the central chip (122), and the size of the central chip (122) is larger than the size of the peripheral chips (124). A reflective structure (130) is disposed on the substrate (110) and has a plurality of reflective cavities (132). The plurality of reflective cavities (132) are arranged one-to-one with the plurality of light-emitting chips (120) and are used to reflect the lateral light emission of the light-emitting chips (120) in a direction away from the substrate (110). The light outlets of adjacent reflective cavities (132) share a common edge. as well as An outer lens (140) is disposed on the substrate (110) and is disposed corresponding to the plurality of reflective cavities (132).

2. The multi-chip light-emitting device according to claim 1, characterized in that, Each of the aforementioned reflective cavities (132) is a reflective groove; The multi-chip light-emitting device (100) further includes a light-transmitting structure (180), which includes a plurality of interconnected light-transmitting parts (182). The bottom surface of each light-transmitting part (182) is located in a reflection cavity (132) and is bonded to the top surface of the light-emitting chip (120).

3. The multi-chip light-emitting device according to claim 1, characterized in that, Each of the aforementioned reflective cavities (132) is a reflective aperture; The multi-chip light-emitting device (100) further includes an inner lens (160), which includes a plurality of lens portions (162) connected together. Each lens portion (162) is disposed on the light outlet of a reflection cavity (132) and is a condensing lens.

4. The multi-chip light emitting device of claim 3, wherein, Also includes: Multiple light-transmitting adhesive layers (150) are provided on the top surface of a light-emitting chip (120) within a reflective cavity (132).

5. The multi-chip light emitting device of claim 2 or 4, wherein, The reflective structure (130) is directly formed on the substrate (110) by a mold and covers the sides of all the light-emitting chips (120).

6. The multi-chip light emitting device of claim 5, wherein, The reflective structure (130) is made of white resin filled with heat dissipation particles.

7. The multi-chip light emitting device of claim 1, wherein, The multiple light-emitting chips (120) are arranged in a rectangular array.

8. The multi-chip light emitting device of claim 1, wherein, The outer lens (140) is an integral structure and includes a support (142) and an optical part (144). The support (142) is supported between the substrate (110) and the optical part (144), and the optical part (144) is located above the plurality of reflective cavities (132).

9. A multi-chip light-emitting device, characterized in that, include: substrate(110); Multiple light-emitting chips (120) are disposed on the substrate (110) and include a central chip (122) and multiple peripheral chips (124). The multiple peripheral chips (124) are arranged around the central chip (122), and the size of the central chip (122) is larger than the size of the peripheral chips (124). A light guide (170) includes a connecting portion (172) and a plurality of light guide portions (174). The connecting portion (172) is connected to the top surface of all the light guide portions (174). The bottom surfaces of the plurality of light guide portions (174) are bonded one-to-one to the top surface of the plurality of light-emitting chips (120) using a light-transmitting adhesive (176). An outer lens (140) is disposed on the substrate (110) and is disposed corresponding to the light guide (170).

10. A lighting device, characterized in that, include: Matrix (210); and A multi-chip light-emitting device (100) is disposed on the substrate (210), and the multi-chip light-emitting device (100) is the multi-chip light-emitting device (100) according to any one of claims 1 to 9.

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