A new central processing unit heat sink

Abstract

The utility model relates to a computer heat dissipation equipment technical field especially, it relates to a novel central processing unit heat dissipation device, the utility model contents include: heat dissipation device main part, the heat dissipation device main part includes fin, heat dissipation seat, first heat pipe group, second heat pipe group, the heat dissipation seat includes heat dissipation upper seat, heat dissipation lower seat, first heat pipe group with second heat pipe group is assembled respectively on heat dissipation upper seat and the both ends of first heat pipe group and the both ends of second heat pipe group assemble on fin, heat dissipation lower seat is assembled below second heat pipe group, the utility model's advantage lies in: the structure of the application makes first heat pipe group be able to directly contact the charge coupled device of AMD processor, provides better diaphoresis for main heating element, can reduce the contact thermal resistance of charge coupled device in AMD processor.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation equipment technology, and more particularly to a novel central processing unit heat dissipation device. Background Technology

[0002] The central processing unit (CPU) is the core of a computer system for computation and control. It is the final execution unit for information processing and program execution. Commonly used computer processors are Intel processors and AMD processors. The main heat-generating component of the CPU is the charge-coupled device (CCD). The CCD of Intel processors is located in the center of the processor, while the CCD of AMD processors is located slightly below the center.

[0003] Common cooling devices on the market transfer heat to heat pipes after the heatsink contacts the CPU. However, this method is not very efficient for AMD processors, so further improvements to the existing technology are needed. Utility Model Content

[0004] The purpose of this invention is to provide a novel central processing unit heat dissipation device designed to solve at least one technical problem in the background art.

[0005] To achieve the above objectives, the present invention adopts the following solution: a novel central processing unit heat dissipation device, comprising a heat dissipation device body, the heat dissipation device body comprising a heat sink, a heat sink base, a first heat pipe group, and a second heat pipe group, the heat sink base comprising an upper heat sink base and a lower heat sink base, the first heat pipe group and the second heat pipe group being respectively mounted on the upper heat sink base, and the two ends of the first heat pipe group and the two ends of the second heat pipe group being mounted on the heat sink, the lower heat sink base being mounted below the second heat pipe group.

[0006] The first heat pipe assembly is in contact with the heat dissipation base.

[0007] The bottom of the first heat pipe assembly is flush with the bottom of the upper heat sink and / or the bottom of the lower heat sink.

[0008] The bottom surface of the first heat pipe assembly and / or the side wall of the first heat pipe assembly are planar.

[0009] The heat dissipation upper seat is provided with a first mounting cavity and a second mounting cavity corresponding to the first heat pipe group and the second heat pipe group;

[0010] and / or

[0011] The heat dissipation base is provided with a third mounting cavity corresponding to the second heat pipe assembly.

[0012] The recessed depth of the second mounting cavity is greater than the recessed depth of the first mounting cavity.

[0013] The upper heat sink is provided with a mounting groove corresponding to the lower heat sink, and the lower heat sink is assembled below the second heat pipe assembly and is at least partially placed in the mounting groove.

[0014] The first mounting cavity is recessed from the bottom of the heat dissipation upper seat to the top of the heat dissipation upper seat.

[0015] Wherein, the second mounting cavity is recessed from the bottom of the heat dissipation upper seat to the top of the heat dissipation upper seat; or the second mounting cavity is recessed from the bottom of the mounting groove to the top of the mounting groove.

[0016] The device includes a central processing unit (CPU), the heat dissipation device body is mounted above the CPU, the heat sink contacts the CPU, and the first heat pipe assembly contacts the charge-coupled device (CCD) of the CPU.

[0017] The advantages of this utility model are: the structure of this application allows the first heat pipe group to directly contact the charge coupler of the AMD processor, providing better heat dissipation for the main heat-generating components and reducing the contact thermal resistance of the charge coupler in the AMD processor. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a new type of central processing unit heat dissipation device. Figure 1 ;

[0019] Figure 2 This is a schematic diagram of the structure of a new type of central processing unit heat dissipation device. Figure 2 ;

[0020] Figure 3 This is a schematic diagram of the structure of a new type of central processing unit heat dissipation device. Figure 3 ;

[0021] Figure 4 This is a schematic diagram of the structure of a new type of central processing unit heat dissipation device. Figure 4 ;

[0022] Figure 5 This is a schematic diagram of the structure of a new type of central processing unit heat dissipation device. Figure 5 ;

[0023] Figure 6 This is a schematic diagram of the structure of a new type of central processing unit heat dissipation device. Figure 6 . Detailed Implementation

[0024] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so as to intuitively and vividly understand each technical feature and overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0025] In the description of this utility model, if directional descriptions are involved, such as "up," "down," "front," "back," "left," "right," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, it is only for the convenience of describing this utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. When a feature is referred to as "set," "fixed," or "connected" to another feature, it can be directly set, fixed, or connected to the other feature, or it can be indirectly set, fixed, or connected to the other feature.

[0026] In the description of this utility model, the term "several" means one or more, and "multiple" means two or more. The terms "greater than," "less than," and "exceeding" should be understood as excluding the stated number. The terms "above," "below," and "within" should be understood as including the stated number. The terms "first" and "second" should be understood as distinguishing technical features and not as indicating or implying relative importance, the quantity of indicated technical features, or the sequential relationship between indicated technical features.

[0027] Furthermore, unless otherwise defined, the technical and scientific terms used in this invention have the same meanings as commonly understood by one of ordinary skill in the art. The terminology used in this invention is for the purpose of describing particular embodiments only and not for limiting the invention. It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof.

[0028] Example: Figure 1-6As shown, a novel central processing unit (CPU) cooling device includes a main body comprising a heat sink 3, a heat sink base 4, a first heat pipe assembly 1, and a second heat pipe assembly 2. The heat sink base 4 includes an upper heat sink base 41 and a lower heat sink base 42. The first heat pipe assembly 1 and the second heat pipe assembly 2 are respectively mounted on the upper heat sink base 41, with both ends of the first heat pipe assembly 1 and the second heat pipe assembly 2 mounted on the heat sink 3. The lower heat sink base 41 is mounted below the second heat pipe assembly 2. The first heat pipe assembly 1 is inclined from the center of the heat sink base 4 to one side of the heat sink base 4, and the second heat pipe assembly 2 is inclined from the center of the heat sink base 4 to the other side of the heat sink base 4. The inclination directions of the first heat pipe assembly 1 and the second heat pipe assembly 2 are opposite. The structure of this application allows the first heat pipe assembly to directly contact the charge-coupled device (CCD) of the AMD processor, providing better heat dissipation for the main heat-generating components and reducing the contact thermal resistance of the CCD in the AMD processor.

[0029] The first heat pipe assembly 1 is in contact with the heat dissipation base 42, and the first heat pipe assembly conducts heat to the second heat pipe assembly through the heat dissipation base as a medium.

[0030] The bottom of the first heat pipe assembly 1 is flush with the bottom of the upper heat sink 41 and / or the bottom of the lower heat sink 42, and the contact surface of the heat sink body is flat, so that the heat sink body can make better contact with the central processing unit, thereby improving its heat dissipation efficiency.

[0031] The bottom surface and / or sidewall of the first heat pipe group 1 are planar, and the first heat pipe group can make better contact with the charge-coupled devices and / or heat sink in the AMD processor, thereby improving its heat dissipation efficiency.

[0032] The heat dissipation upper seat 41 is provided with a first mounting cavity 411 and a second mounting cavity 412 corresponding to the first heat pipe group 1 and the second heat pipe group 2. The recessed depth of the second mounting cavity 412 is greater than the recessed depth of the first mounting cavity 411. The first mounting cavity and the second mounting cavity are provided so that the first heat pipe group and the second heat pipe group can better contact the heat dissipation upper seat, thereby improving their heat dissipation efficiency.

[0033] and / or

[0034] The heat sink base 42 is provided with a third mounting cavity 421 corresponding to the second heat pipe group 2. The third mounting cavity allows the second heat pipe group to make better contact with the heat sink base, thereby improving its heat dissipation efficiency.

[0035] The upper heat sink 41 is provided with a mounting groove 410 corresponding to the lower heat sink 42. The lower heat sink 42 is assembled below the second heat pipe assembly 2 and is at least partially placed in the mounting groove 410. The mounting groove is provided so that the lower heat sink can be assembled on the upper heat sink.

[0036] The first mounting cavity 411 is recessed from the bottom of the heat dissipation upper seat 41 to the top of the heat dissipation upper seat 41.

[0037] Wherein, the second mounting cavity 412 is recessed from the bottom of the heat dissipation upper seat 41 toward the top of the heat dissipation upper seat 41; or the second mounting cavity 412 is recessed from the bottom of the mounting groove 410 toward the top of the mounting groove 410.

[0038] The device includes a central processing unit 5, with the heat dissipation device body mounted above the central processing unit 5. The heat sink 4 contacts the central processing unit 5, and the first heat pipe group 1 contacts the charge-coupled device 51 of the central processing unit 5. The structure of this application allows the first heat pipe group to directly contact the charge-coupled device of the AMD processor, providing better heat dissipation for the main heat-generating components and reducing the contact thermal resistance of the charge-coupled device in the AMD processor.

[0039] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A novel central processing unit heat dissipation device, comprising a heat dissipation device body, characterized in that: The main body of the heat dissipation device includes a heat sink, a heat sink base, a first heat pipe group, and a second heat pipe group. The heat sink base includes an upper heat sink base and a lower heat sink base. The first heat pipe group and the second heat pipe group are respectively mounted on the upper heat sink base, and the two ends of the first heat pipe group and the two ends of the second heat pipe group are mounted on the heat sink. The lower heat sink base is mounted below the second heat pipe group.

2. The novel central processing unit heat dissipation device according to claim 1, characterized in that: The bottom of the first heat pipe assembly is flush with the bottom of the upper heat sink and / or the bottom of the lower heat sink.

3. The novel central processing unit heat dissipation device according to claim 1, characterized in that: The first heat pipe assembly is in contact with the heat sink base.

4. The novel central processing unit heat dissipation device according to claim 1, characterized in that: The bottom surface of the first heat pipe assembly and / or the sidewall of the first heat pipe assembly are planar.

5. The novel central processing unit heat dissipation device according to claim 1, characterized in that: The heat dissipation upper seat is provided with a first mounting cavity and a second mounting cavity corresponding to the first heat pipe group and the second heat pipe group. and / or The heat dissipation base is provided with a third mounting cavity corresponding to the second heat pipe assembly.

6. The novel central processing unit heat dissipation device according to claim 5, characterized in that: The recessed depth of the second mounting cavity is greater than the recessed depth of the first mounting cavity.

7. The novel central processing unit heat dissipation device according to claim 5, characterized in that: The upper heat sink is provided with a mounting groove corresponding to the lower heat sink, and the lower heat sink is assembled below the second heat pipe assembly and is at least partially placed in the mounting groove.

8. The novel central processing unit heat dissipation device according to claim 5, characterized in that: The first mounting cavity is recessed from the bottom of the heat dissipation upper seat to the top of the heat dissipation upper seat.

9. The novel central processing unit heat dissipation device according to claim 7, characterized in that: The second mounting cavity is recessed from the bottom of the heat dissipation upper seat to the top of the heat dissipation upper seat; or the second mounting cavity is recessed from the bottom of the mounting groove to the top of the mounting groove.

10. The novel central processing unit heat dissipation device according to any one of claims 1-9, characterized in that: The device includes a central processing unit (CPU), the heat dissipation device body is mounted above the CPU, the heat sink contacts the CPU, and the first heat pipe assembly contacts the charge-coupled device (CCD) of the CPU.

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