Low-cost to package high-power semiconductor laser aging tooling
Patent Information
- Application Number
- CN202521602048.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-30
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2035-07-30
AI Technical Summary
[0005]本实用新型的目的在于提供一种低成本TO封装大功率半导体激光器老化工装，解决了现有技术中（1）大功率半导体激光器光电参数随温度变化较大；（2）解决多路、多功能数显恒流恒压驱动器的模块化设计的难题；（3）设计出具有结构简单、手动锁紧功能、高工作效率的TO-09封装激光器老化夹持工装结构；（4）由于大功率蓝光激光器发出的蓝光具有较高的能量，会造成近距离测试光功率探头的温度升高；（5）目前老化工装系统的能耗高的问题
[0011]本实用新型的一种低成本TO封装大功率半导体激光器老化工装，本装置具有结构更加简单，紧凑，体积小的优点；具有成本低、操作方便和工作效率高等优点；在一定的应用场景下，可以替代价格昂贵的自动化分选设备；本装置采用“风冷水排温控+半导体制冷器控温系统”的组合水冷散热系统，具有结构简单、体积较小及能耗低的优点；解决多路、多功能数显恒流恒压驱动器的模块化设计的难题；解决老化过程中的低成本、带控温功能、能进行多点定位的手动光功率测试模块设计难题，提高了老化工作的效率；并且具有多重激光二极管保护电路，防止在老化过程中造成激光器静电损坏。
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Figure CN224744532U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optoelectronic packaging and testing technology, and in particular to a low-cost TO-packaged high-power semiconductor laser aging package. Background Technology
[0002] In recent years, with the significant advancements in chip technology for high-power blue and green visible light semiconductor lasers, they are gradually being adopted in military and civilian fields such as laser welding, laser engraving, laser marking, blue-to-white laser headlights, underwater communication, RGB laser projection, and laser television. Among the various packaging forms, the TO-09 coaxial packaged laser with an optical window is a typical example. The application of these high-power packaged devices places high demands on device reliability.
[0003] However, semiconductor lasers are semiconductor products. Due to the characteristics of their materials, device structure, manufacturing processes, and defects, their reliability bathtub curves indicate the possibility of early failure in their packaged products. This affects product usability. To eliminate products with early failure, a short-term environmental stress accelerated aging test with a certain amount of stress is generally performed after the packaging process is completed. Currently, the industry mainly uses automated aging screening equipment with high temperature control precision and high cost. This has disadvantages such as high cost, complex equipment structure, and large size. In the early stages of product development and some civilian applications, users prioritize the lowest possible price, so material and manufacturing costs must be considered. In certain specific stages (such as the early stages of project development) and application scenarios (civilian applications), low-cost visible light laser aging screening fixtures with temperature control precision that meet user requirements can be developed to replace expensive automated aging equipment.
[0004] Current problems: (1) The photoelectric parameters of high-power semiconductor lasers change significantly with temperature; (2) Solve the problem of modular design of multi-channel, multi-functional digital display constant current and constant voltage drivers; (3) Design a TO-09 packaged laser aging clamping fixture structure with simple structure, manual locking function and high working efficiency; (4) Since the blue light emitted by high-power blue lasers has high energy, it will cause the temperature of the optical power probe to rise at close range; (5) The energy consumption of the current aging fixture system is high. Utility Model Content
[0005] The purpose of this utility model is to provide a low-cost TO-packaged high-power semiconductor laser aging fixture, which solves the problems in the prior art: (1) the photoelectric parameters of high-power semiconductor lasers change greatly with temperature; (2) the modular design of multi-channel, multi-functional digital display constant current and constant voltage drivers is solved; (3) a TO-09 packaged laser aging clamping fixture structure with simple structure, manual locking function and high working efficiency is designed; (4) the high energy of blue light emitted by high-power blue lasers will cause the temperature of the optical power probe to rise at close range; and (5) the high energy consumption of current aging fixture systems.
[0006] To achieve the above objectives, this utility model provides a low-cost TO-packaged high-power semiconductor laser aging assembly, including a chassis, an air-cooled water-cooled temperature control assembly, and a semiconductor cooler temperature control assembly. The air-cooled water-cooled temperature control assembly includes multiple digitally controlled adjustable constant current and constant voltage DC modules, a dual-cooler water-cooling head, an insulated TEC water-cooling head clamping plate, and a polyurethane foam heat insulation cover. The semiconductor cooler temperature control assembly includes a semiconductor cooler, a TEC hot-side aluminum profile heat sink, and a TEC temperature control fan. Multiple CNC adjustable constant current and constant voltage DC modules are respectively disposed at the front end of the chassis. The dual-cooler water-cooling head is disposed on the inner wall of the chassis. The thermal insulation TEC water-cooling head clamping plate is disposed on the dual-cooler water-cooling head. The polyurethane foam heat insulation cover is fixedly connected to the outer wall of the chassis and is sleeved on the outside of the dual-cooler water-cooling head. The semiconductor cooler is disposed on the TEC hot-side aluminum profile heat sink. The TEC hot-side aluminum profile heat sink is disposed on the outer wall of the chassis. The TEC temperature-controlled fan is disposed on the TEC hot-side aluminum profile heat sink.
[0007] The air-cooled water-cooled temperature control assembly further includes a water pump, a first copper heat sink water pipe, a second copper heat sink water pipe, a coaxially packaged blue laser, and a copper water-cooled heat sink. The water pump is located inside the chassis. The two ends of the first copper heat sink water pipe are fixedly connected to the water pump and the coaxially packaged blue laser, respectively. The coaxially packaged blue laser is mounted on the copper water-cooled heat sink. The two ends of the second copper heat sink water pipe are fixedly connected to the dual-cooler water-cooling head and the coaxially packaged blue laser, respectively. The copper water-cooled heat sink is located inside the chassis.
[0008] The air-cooled water-cooled temperature control assembly also includes a laser tube socket clamping and fixing plate and a laser driver connection socket. The laser tube socket clamping and fixing plate is disposed on the copper water-cooled heat sink, and the laser driver connection socket is fixedly connected to the side of the copper water-cooled heat sink.
[0009] The air-cooled water-cooled temperature control assembly further includes a barrier observation plate, an optical power meter probe, a top cover plate, a first switching power supply, a second switching power supply, a fan, and a cooling water radiator. The barrier observation plate is fixedly connected to the top cover plate, the optical power meter probe is disposed on the barrier observation plate, the first switching power supply and the second switching power supply are respectively disposed inside the chassis, the fan is fixedly connected to the rear inner wall of the chassis, and the cooling water radiator is fixedly connected to the rear end of the chassis.
[0010] The coaxially packaged blue laser is located to the left of the water pump, and the water pump is located to the left of the dual-cooler water-cooling head.
[0011] This invention relates to a low-cost TO-packaged high-power semiconductor laser aging apparatus. This apparatus features a simpler, more compact structure and smaller size; it is also low-cost, easy to operate, and highly efficient. In certain application scenarios, it can replace expensive automated sorting equipment. The apparatus employs a combined water-cooling system of "air-cooled water-cooled temperature control + semiconductor cooler temperature control system," which is simple in structure, small in size, and low in energy consumption. It solves the modular design problem of multi-channel, multi-functional digital display constant current and constant voltage drivers; it also solves the design problem of a low-cost, temperature-controlled, multi-point positioning manual optical power testing module during the aging process, improving the efficiency of the aging work; and it has multiple laser diode protection circuits to prevent electrostatic damage to the laser during the aging process. Attached Figure Description
[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.
[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.
[0014] Figure 2 This is the system circuit diagram of this utility model.
[0015] 1-Chassis, 2-CNC adjustable constant current and constant voltage DC module, 3-Dual cooler water cooling head, 4-Insulated TEC water cooling head clamping plate, 5-Polyurethane foam heat insulation cover, 6-Semiconductor cooler, 7-TEC hot-side aluminum profile heat sink, 8-TEC temperature-controlled fan, 9-Water pump, 10-First copper heat sink water pipe, 11-Second copper heat sink water pipe, 12-Coaxial packaged blue laser, 13-Copper water-cooled heat sink, 14-Laser tube socket clamping and fixing plate, 15-Laser driver connection socket, 16-Barrier observation plate, 17-Optical power meter probe, 18-Top cover plate, 19-First switching power supply, 20-Second switching power supply, 21-Fan, 22-Cooling water duct. Detailed Implementation
[0016] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.
[0017] Please see Figure 1 and Figure 2 ,in, Figure 1 This is a schematic diagram of the overall structure of this utility model. Figure 2 This is the system circuit diagram of this utility model.
[0018] This utility model provides a low-cost TO-packaged high-power semiconductor laser aging assembly, including a chassis 1, an air-cooled water-cooled temperature control component and a semiconductor cooler temperature control component; The air-cooled water-cooled temperature control assembly includes multiple digitally controlled adjustable constant current and constant voltage DC modules 2, a cooler water-cooling head 3, an insulated TEC water-cooling head clamping plate 4, and a polyurethane foam heat insulation cover 5. The temperature control assembly of the semiconductor cooler includes a semiconductor cooler 6, a TEC hot-side aluminum profile heat sink 7, and a TEC temperature control fan 8. Multiple numerically controlled adjustable constant current and constant voltage DC modules 2 are respectively disposed at the front end of the chassis 1. The cooler water cooling head 3 is disposed on the inner wall of the chassis 1. The thermal insulation TEC water cooling head clamping plate 4 is disposed on the cooler water cooling head 3. The polyurethane foam heat insulation cover 5 is fixedly connected to the outer wall of the chassis 1 and is sleeved on the outside of the cooler water cooling head 3. The semiconductor cooler 6 is disposed on the TEC hot-side aluminum profile heat sink 7. The TEC hot-side aluminum profile heat sink 7 is disposed on the outer wall of the chassis 1. The TEC temperature-controlled fan 8 is disposed on the TEC hot-side aluminum profile heat sink 7.
[0019] In this embodiment, the device has the advantages of simpler, more compact, and smaller size; it also has the advantages of low cost, convenient operation, and high work efficiency; in certain application scenarios, it can replace expensive automated sorting equipment; the device adopts a combined water cooling system of "air-cooled water-cooled temperature control + semiconductor cooler 6-temperature control system", which has the advantages of simple structure, small size, and low energy consumption; it solves the problem of modular design of multi-channel, multi-functional digital display constant current and constant voltage drivers; it solves the design problem of a low-cost, temperature-controlled, multi-point positioning manual optical power test module in the aging process, thus improving the efficiency of aging work; and it has multiple laser diode protection circuits to prevent electrostatic damage to the laser during the aging process.
[0020] Furthermore, the air-cooled water-cooled heat sink temperature control assembly also includes a water pump 9, a first copper heat sink water pipe 10, a second copper heat sink water pipe 11, a coaxially packaged blue laser 12, and a copper water-cooled heat sink 13. The water pump 9 is disposed inside the chassis 1. The two ends of the first copper heat sink water pipe 10 are fixedly connected to the water pump 9 and the coaxially packaged blue laser 12, respectively. The coaxially packaged blue laser 12 is disposed on the copper water-cooled heat sink 13. The two ends of the second copper heat sink water pipe 11 are fixedly connected to the cooler water-cooling head 3 and the coaxially packaged blue laser 12, respectively. The copper water-cooled heat sink 13 is disposed inside the chassis 1. The air-cooled water-cooled heat sink temperature control assembly also includes a laser tube socket clamping and fixing plate 14 and a laser driver connection socket 15. The laser tube socket clamping and fixing plate 14 is disposed on the copper water-cooled heat sink 13, and the laser driver connection socket 15 is fixedly connected to the side of the copper water-cooled heat sink 13. The air-cooled water-cooled temperature control assembly also includes an observation plate 16, an optical power meter probe 17, an upper cover plate 18, a first switching power supply 19, a second switching power supply 20, a fan 21, and a cooling water radiator 22. The observation plate 16 is fixedly connected to the upper cover plate 18. The optical power meter probe 17 is disposed on the observation plate 16. The first switching power supply 19 and the second switching power supply 20 are respectively disposed inside the chassis 1. The fan 21 is fixedly connected to the rear inner wall of the chassis 1. The cooling water radiator 22 is fixedly connected to the rear end of the chassis 1. The coaxially packaged blue laser 12 is located to the left of the water pump 9, and the water pump 9 is located to the left of the cooler water-cooling head 3.
[0021] In this embodiment, by incorporating a thermoelectric cooler 6 (TEC) cooling and heating system into the water-cooled heat dissipation system, utilizing the TEC's forward current cooling and reverse current heating characteristics, and combining it with a temperature control circuit that can provide forward and reverse control currents, it becomes possible to rapidly and accurately maintain the water temperature of the water-cooling system, thereby stabilizing the temperature of the laser's heat sink at the required process temperature. This improves the reliability of the old chemical equipment. Multiple multi-channel digitally controlled adjustable constant current and constant voltage DC modules 2 are used to independently drive the coaxial packaged blue laser 12. This module features functions such as setting and digitally displaying voltage, current, and power, slow start-up upon power-on, and power-down protection, eliminating the need for designing and fabricating the laser drive circuit. This solves the shortcomings of low tooling compactness, large space occupation, and inconvenient operation. Furthermore, a simple screw-locking mechanism is used to tighten the coaxially packaged blue laser 12 in groups, ensuring close contact between the bottom of the TO-09 socket and the surface of the copper water-cooled heat sink 13. This reduces the thermal resistance of the heat transfer path and prevents accidental damage to the laser. This solution has advantages such as simple and compact structure, convenient and controllable force application, and high working efficiency. It also provides sufficient space for close-range testing of the optical power meter; and it is a high-efficiency coaxially packaged blue laser 12 aging clamping fixture structure. By integrating a miniature semiconductor cooler 6 and a small heat sink within the optical power meter probe 17, and precisely controlling them through an external bidirectional current temperature control circuit, the impact of blue light irradiation on the probe's temperature rise is reduced, improving the accuracy of optical power measurement during the aging process. Simultaneously, to address the mutual interference problem between the light emitted by multiple coaxially packaged blue lasers 12 with a small spacing arrangement during optical power testing under power-on conditions, a blue light-blocking observation plate 16 of a certain thickness is installed on the top cover of the chassis 1. A circular hole, directly opposite the laser tube's emission window, is cut into the observation plate 16, allowing the optical power meter probe 17 to slide in, serving as a positioning test standard for the optical power meter to approach the laser emission point. This enables fixed-point and fixed-time optical power testing of multiple coaxially packaged blue lasers 12 during the aging process, improving the efficiency of the aging work. Furthermore, since the blue light emitted by high-power blue lasers is harmful to the human eye, the blue light-blocking observation plate 16 also facilitates safe observation of the aged devices.
[0022] Finally, since laser diodes are electrostatic sensitive devices, multiple laser diode protection circuits are installed and connected to the drive circuit to prevent damage to the laser from electrostatic discharge and surge current during the aging process.
[0023] Through the miniaturized integrated design described above, the entire aging equipment is made smaller in size and the water passage is shorter. This allows for the rapid removal of heat emitted by the laser and minimizes energy loss during TEC reverse heating, thereby reducing the energy consumption of the aging equipment system and achieving energy saving.
[0024] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that implementing all or part of the above embodiments and making equivalent changes in accordance with the claims of this application still fall within the scope of this application.
Claims
1. A low-cost TO-packaged high-power semiconductor laser aging package, characterized in that, This includes the chassis, air-cooled water radiator temperature control components, and semiconductor cooler temperature control components; The air-cooled water-cooled temperature control assembly includes multiple digitally controlled adjustable constant current and constant voltage DC modules, a dual-cooler water-cooling head, an insulated TEC water-cooling head clamping plate, and a polyurethane foam heat insulation cover. The semiconductor cooler temperature control assembly includes a semiconductor cooler, a TEC hot-side aluminum profile heat sink, and a TEC temperature control fan. Multiple CNC adjustable constant current and constant voltage DC modules are respectively disposed at the front end of the chassis. The dual-cooler water-cooling head is disposed on the inner wall of the chassis. The thermal insulation TEC water-cooling head clamping plate is disposed on the dual-cooler water-cooling head. The polyurethane foam heat insulation cover is fixedly connected to the outer wall of the chassis and is sleeved on the outside of the dual-cooler water-cooling head. The semiconductor cooler is disposed on the TEC hot-side aluminum profile heat sink. The TEC hot-side aluminum profile heat sink is disposed on the outer wall of the chassis. The TEC temperature-controlled fan is disposed on the TEC hot-side aluminum profile heat sink.
2. The aging equipment for a low-cost TO-packaged high-power semiconductor laser as described in claim 1, characterized in that, The air-cooled water-cooled temperature control assembly also includes a water pump, a first copper heat sink water pipe, a second copper heat sink water pipe, a coaxially packaged blue laser, and a copper water-cooled heat sink. The water pump is located inside the chassis. The two ends of the first copper heat sink water pipe are fixedly connected to the water pump and the coaxially packaged blue laser, respectively. The coaxially packaged blue laser is mounted on the copper water-cooled heat sink. The two ends of the second copper heat sink water pipe are fixedly connected to the dual-cooler water block and the coaxially packaged blue laser, respectively. The copper water-cooled heat sink is located inside the chassis.
3. The low-cost TO-packaged high-power semiconductor laser aging equipment as described in claim 2, characterized in that, The air-cooled water-cooled temperature control assembly also includes a laser tube socket clamping and fixing plate and a laser driver connection socket. The laser tube socket clamping and fixing plate is disposed on the copper water-cooled heat sink, and the laser driver connection socket is fixedly connected to the side of the copper water-cooled heat sink.
4. The aging equipment for a low-cost TO-packaged high-power semiconductor laser as described in claim 3, characterized in that, The air-cooled water-cooled temperature control assembly also includes a barrier observation plate, an optical power meter probe, a top cover plate, a first switching power supply, a second switching power supply, a fan, and a cooling water radiator. The barrier observation plate is fixedly connected to the top cover plate, the optical power meter probe is disposed on the barrier observation plate, the first switching power supply and the second switching power supply are respectively disposed inside the chassis, the fan is fixedly connected to the rear inner wall of the chassis, and the cooling water radiator is fixedly connected to the rear end of the chassis.
5. The low-cost TO-packaged high-power semiconductor laser aging equipment as described in claim 4, characterized in that, The coaxially packaged blue laser is located to the left of the water pump, and the water pump is located to the left of the dual-cooler water-cooling head.